KR102325770B1 - Apparatus for discharging chemical liquid - Google Patents

Apparatus for discharging chemical liquid Download PDF

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KR102325770B1
KR102325770B1 KR1020190146123A KR20190146123A KR102325770B1 KR 102325770 B1 KR102325770 B1 KR 102325770B1 KR 1020190146123 A KR1020190146123 A KR 1020190146123A KR 20190146123 A KR20190146123 A KR 20190146123A KR 102325770 B1 KR102325770 B1 KR 102325770B1
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head
chemical
chemical solution
supply
reservoir
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KR1020190146123A
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KR20210059150A (en
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정영훈
최기훈
김명진
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • H01L21/02288—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating printing, e.g. ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ink Jet (AREA)

Abstract

본 발명은 공급리저버로부터 공급되는 약액을 잉크젯 헤드로 토출하는 약액 토출장치에 관한 것으로서, 본 발명의 약액토출장치는, 약액을 공급하는 버퍼리저버; 상기 버퍼리저버로부터 약액을 공급받아 일시적으로 저장하는 공급리저버; 상기 공급리저버의 내부압력을 조정하는 압력조정부; 헤드지지부에 의해 지지되며, 상기 공급리저버로부터의 약액을 공급받아 토출하는 헤드; 상기 공급리저버의 약액을 상기 헤드에 공급하는 공급라인; 상기 공급라인 상에 구비되어, 상기 약액의 공급을 제어하는 제어밸브; 상기 제어밸브의 하류측에 구비되며, 상기 약액을 가열하는 제1 가열부; 및 상기 헤드에 구비되며, 상기 가열된 약액을 설정온도로 가열하는 제2 가열부를 포함한다.The present invention relates to a chemical liquid discharging apparatus for discharging a chemical solution supplied from a supply reservoir to an inkjet head, and the chemical liquid discharging apparatus of the present invention comprises: a buffer reservoir for supplying the chemical liquid; a supply reservoir for temporarily storing the chemical solution supplied from the buffer reservoir; a pressure adjusting unit for adjusting the internal pressure of the supply reservoir; a head supported by a head support unit, the head receiving and discharging the chemical solution from the supply reservoir; a supply line for supplying the chemical solution of the supply reservoir to the head; a control valve provided on the supply line to control the supply of the chemical; a first heating unit provided on a downstream side of the control valve to heat the chemical; and a second heating unit provided in the head and configured to heat the heated chemical to a set temperature.

Description

약액토출장치{APPARATUS FOR DISCHARGING CHEMICAL LIQUID}Chemical discharging device {APPARATUS FOR DISCHARGING CHEMICAL LIQUID}

본 발명은 약액토출장치에 관한 것으로서, 보다 상세하게는 약액의 토출안정성을 갖는 약액토출장치에 관한 것이다. The present invention relates to a chemical liquid discharging device, and more particularly, to a chemical liquid discharging device having discharge stability of a chemical.

기판 상에 배향막의 형성, 기판 상에 UV 잉크의 도포, 또는 기판 상에 컬러 필터의 도포 시, 잉크젯 헤드를 구비하는 약액 토출 장치가 사용된다. When forming an alignment layer on a substrate, applying UV ink on a substrate, or applying a color filter on a substrate, a chemical liquid discharging device having an inkjet head is used.

일반적으로 약액 토출 장치에서의 약액은, 버퍼 리저버, 공급 리저버, 제어밸브를 거쳐 잉크젯 헤드를 통해 토출된다. 공급 리저버에는 연결라인을 통해 압력조절부와 연결된다. 압력조절부는 공급 리저버에 양압 또는 음압을 제공한다. 압력조절부는 연결라인 상에 양압 또는 음압을 제공함으로써, 공급 리저버로부터 제공되는 약액이 잉크젯 헤드의 노즐단부에서 메니스커스(meniscus)를 유지할 수 있게 한다.In general, a chemical liquid in a chemical liquid discharging device is discharged through an inkjet head through a buffer reservoir, a supply reservoir, and a control valve. The supply reservoir is connected to the pressure regulator through a connection line. The pressure regulator provides positive or negative pressure to the supply reservoir. The pressure control unit provides positive or negative pressure on the connection line, so that the chemical liquid supplied from the supply reservoir can maintain a meniscus at the nozzle end of the inkjet head.

잉크젯 헤드의 노즐 단부에서 약액이 메니스커스를 유지하지 못할 경우에는 미토출이 발생하거나 약액이 토출되어도 주변에 얼룩지는 현상 등이 발생할 수 있다. 리저버로 압력을 제공하는 연결 라인에 압력 조정부 및 센서를 배치하여 압력을 관리하고 있다.If the chemical liquid does not maintain the meniscus at the nozzle end of the inkjet head, non-ejection may occur or a phenomenon in which the chemical liquid is discharged may cause spots around it. The pressure is managed by placing a pressure regulator and a sensor on the connection line that provides pressure to the reservoir.

한편, 약액은 상온에서 비교적 점도가 높기 때문에, 약액 토출을 위해 약액의 점도를 낮추어 유동성을 갖도록 할 필요가 있다. 따라서 공급 리저버에 가열수단이 설치되어 약액을 가열하여 약액의 점도를 낮추는 수단이 개시되고 있다.On the other hand, since the chemical solution has a relatively high viscosity at room temperature, it is necessary to lower the viscosity of the chemical solution to have fluidity for discharging the chemical solution. Therefore, a heating means is installed in the supply reservoir to heat the chemical solution to lower the viscosity of the chemical solution is disclosed.

공급 리저버에 가열수단이 구비되는 경우, 공급 리저버 내부의 약액이 가열되면, 약액의 일부가 기화되어 공급 리저버 내부 압력이 증가하게 된다. 공급 리저버 내부 압력이 증가되면, 공급 리저버의 내부 압력을 감소시키기 위해, 압력조절부에 의한 불필요한 약액 흡입에 의한 약액 낭비가 발생한다. When a heating means is provided in the supply reservoir, when the chemical solution inside the supply reservoir is heated, a part of the chemical solution is vaporized to increase the internal pressure of the supply reservoir. When the internal pressure of the supply reservoir is increased, in order to reduce the internal pressure of the supply reservoir, the chemical solution is wasted due to unnecessary suction of the chemical solution by the pressure adjusting unit.

상기와 같은 문제를 해결하기 위해, 본 발명은 약액의 연속토출 시 약액의 온도변화를 최소화하여 토출 안정성을 향상시킬 수 있는 약액토출장치를 제공함에 그 목적이 있다. In order to solve the above problems, an object of the present invention is to provide a chemical solution discharging device capable of improving discharge stability by minimizing the temperature change of the chemical solution during continuous discharge of the chemical solution.

본 발명에 따른 공급리저버로부터 공급되는 약액을 잉크젯 헤드로 토출하는 약액 토출장치는, 약액을 공급하는 버퍼리저버; 상기 버퍼리저버로부터 약액을 공급받아 일시적으로 저장하는 공급리저버; 상기 공급리저버의 내부압력을 조정하는 압력조정부; 헤드지지부에 의해 지지되며, 상기 공급리저버로부터의 약액을 공급받아 토출하는 헤드; 상기 공급리저버의 약액을 상기 헤드에 공급하는 공급라인; 상기 공급라인 상에 구비되어, 상기 약액의 공급을 제어하는 제어밸브; 상기 제어밸브의 하류측에 구비되며, 상기 약액을 가열하는 제1 가열부; 및 상기 헤드에 구비되며, 상기 가열된 약액을 설정온도로 가열하는 제2 가열부를 포함한다. According to the present invention, there is provided a chemical liquid discharging apparatus for discharging a chemical solution supplied from a supply reservoir to an inkjet head, comprising: a buffer reservoir for supplying a chemical solution; a supply reservoir for temporarily storing the chemical solution supplied from the buffer reservoir; a pressure adjusting unit for adjusting the internal pressure of the supply reservoir; a head supported by a head support unit, the head receiving and discharging the chemical solution from the supply reservoir; a supply line for supplying the chemical solution of the supply reservoir to the head; a control valve provided on the supply line to control the supply of the chemical; a first heating unit provided on a downstream side of the control valve to heat the chemical; and a second heating unit provided in the head and configured to heat the heated chemical to a set temperature.

또한 실시예에 있어서, 상기 헤드지지부는, 상기 제2 가열수단으로부터 전달되는 열에 의해 변형되는 것을 방지하기 위해 내부에 냉각수단이 구비된다.In addition, in the embodiment, the head support portion is provided with a cooling means therein to prevent deformation by the heat transferred from the second heating means.

또한 실시예에 있어서, 상기 헤드지지부에는, 상기 헤드와 접촉되는 부분에 열차단부재가 구비된다.In addition, in the embodiment, the head support portion is provided with a heat-blocking member at a portion in contact with the head.

또한 실시예에 있어서, 상기 헤드에는, 상기 헤드의 하단부를 제외한 상기 헤드의 외측면 전체를 감싸는 형태의 열차단부재가 구비된다.In addition, in the embodiment, the head is provided with a heat-blocking member in the form of surrounding the entire outer surface of the head except for the lower end of the head.

본 발명에 따르면, 제1 가열수단을 이용하여 약액을 사전 가열하고, 사전가열된 약액을 다시 제2 가열수단을 이용하여 가열함으로써, 약액의 연속 토출시 약액의 온도변화를 최소화하여 토출안정성을 향상시킬 수 있다. According to the present invention, the chemical solution is pre-heated using the first heating means, and the pre-heated chemical solution is heated again using the second heating means, thereby minimizing the temperature change of the chemical solution during continuous discharge of the chemical solution to improve the discharge stability. can do it

본 발명에 따르면, 열차단부재를 이용하여, 헤드지지부의 열변형을 방지하고, 헤드 내의 약액이 냉각되는 것을 방지할 수 있다. According to the present invention, by using the heat blocking member, it is possible to prevent thermal deformation of the head support portion and to prevent the chemical liquid in the head from being cooled.

도 1은 본 발명의 실시예에 따른 약액토출장치를 설명하기 위한 도면이다.
도 2는 도 1에 도시된 열차단부재의 다른 예를 설명하기 위한 도면이다.1 is a view for explaining a chemical liquid discharging device according to an embodiment of the present invention.
FIG. 2 is a view for explaining another example of the heat blocking member shown in FIG. 1 .

도 1은 본 발명의 실시예에 따른 약액토출장치를 설명하기 위한 도면이다.1 is a view for explaining a chemical liquid discharging device according to an embodiment of the present invention.

도 1을 참조하면, 약액토출장치(100)은 버퍼리저버(110), 공급리저버(120), 압력조절부(130), 제어밸브(140), 제1 가열수단(150), 헤드(160), 제2 가열수단(161), 헤드지지부(180), 냉각수단(181)을 포함한다. Referring to FIG. 1 , the chemical liquid discharging device 100 includes a buffer reservoir 110 , a supply reservoir 120 , a pressure regulator 130 , a control valve 140 , a first heating means 150 , and a head 160 . , a second heating means 161 , a head support unit 180 , and a cooling means 181 .

버퍼리저버(110)는 캐니스터와 같은 약액공급원(미도시)으로부터 약액을 공급받아 저장하고, 공급리저버(120)에 저장된 약액을 공급한다. The buffer reservoir 110 receives and stores the chemical solution from a chemical solution supply source (not shown) such as a canister, and supplies the chemical solution stored in the supply reservoir 120 .

이때 약액은 액적, 잉크, 컬러필터 등의 디스플레이 소자 또는 반도체 소자 제조에 이용되는 물질 중 하나일 수 있다.In this case, the chemical may be one of the materials used for manufacturing a display device such as a droplet, an ink, a color filter, or a semiconductor device.

약액공급원(미도시)은 내부를 가압하여 약액을 공급하기 때문에, 압력조절부(130)가 구비된 공급리저버(120)는 약액을 약액공급원(미도시)로부터 직접 공급받을 수 없다. 버퍼리저버(110)는 공급리저버(120)와 약액공급원(미도시) 사이에 구비되어 버퍼역할을 한다. 즉 버퍼리저버(110)는 약액공급원(미도시)으로부터 가압된 약액을 공급받아 저장하고, 중력을 이용하여 약액을 공급리저버(120)에 공급한다. Since the chemical solution supply source (not shown) supplies the chemical solution by pressing the inside, the supply reservoir 120 provided with the pressure adjusting unit 130 cannot receive the chemical solution directly from the chemical solution supply source (not shown). The buffer reservoir 110 is provided between the supply reservoir 120 and the chemical solution supply source (not shown) to serve as a buffer. That is, the buffer reservoir 110 receives and stores the pressurized chemical solution from a chemical solution supply source (not shown), and supplies the chemical solution to the supply reservoir 120 using gravity.

공급리저버(120)는 헤드(160)와 버퍼리저버(110) 사이에 위치한다. 구체적으로 공급리저버(120)는 헤드(160)의 상부에 구비되며, 버퍼리저버(110)의 하부에 구비된다. 공급리저버(120)는 헤드로 공급하기 위한 약액을 일시적으로 저장한다. The supply reservoir 120 is positioned between the head 160 and the buffer reservoir 110 . Specifically, the supply reservoir 120 is provided above the head 160 , and is provided below the buffer reservoir 110 . The supply reservoir 120 temporarily stores the chemical solution to be supplied to the head.

공급리저버(120)는 상부에 배치된 버퍼리저버(110)로부터 약액을 공급받아 일시적으로 저장한다. 그리고 공급리저버(120)는 하부에 배치된 헤드(160)에 공급라인(L1)을 통해 약액을 공급한다. 공급리저버(120)는 중력을 이용하여 약액을 버퍼리저버(110)로부터 공급받거나, 공급리저버(120)는 중력을 이용하여 약액을 헤드(160)에 공급한다. The supply reservoir 120 receives the chemical solution from the buffer reservoir 110 disposed thereon and temporarily stores it. And the supply reservoir 120 supplies the chemical solution through the supply line (L1) to the head 160 disposed below. The supply reservoir 120 receives the chemical solution from the buffer reservoir 110 using gravity, or the supply reservoir 120 supplies the chemical solution to the head 160 using gravity.

공급리저버(120)에는 압력조절부(130)가 구비된다. 압력조절부(130)는 별도의 압력조절라인를 통해 공급리저버(120)와 연결될 수도 있다.The supply reservoir 120 is provided with a pressure adjusting unit 130 . The pressure control unit 130 may be connected to the supply reservoir 120 through a separate pressure control line.

압력조절부(130)는 공급리저버(120)에서 헤드(160)로 공급된 약액이, 헤드(160)의 노즐단부에서 메니스커스 상태가 되도록 공급리저버(120)의 내부압력을 조절한다. The pressure adjusting unit 130 adjusts the internal pressure of the supply reservoir 120 so that the chemical liquid supplied from the supply reservoir 120 to the head 160 is in a meniscus state at the nozzle end of the head 160 .

메니스커스 상태란, 헤드(160)의 노즐 단부의 둘레에 약액이 정확히 위치하되, 노즐 단부 중앙 부분의 약액이 내부로 오목하게 들어간 상태를 의미한다. 헤드 노즐단부에서 메니스커스 상태가 유지하면, 약액이 흘러내리지 않고, 약액이 토출되는 시점이 의도한 시점과 달라지지 않게 된다. The meniscus state means a state in which the chemical solution is accurately positioned around the nozzle end of the head 160, but the chemical solution at the center of the nozzle end is concavely entered. If the meniscus state is maintained at the end of the head nozzle, the chemical liquid does not flow down, and the time at which the chemical liquid is discharged does not differ from the intended time point.

공급라인(L1)은 공급리저버(120)와 헤드(160)를 연결한다. 공급리저버(120)의 약액은 공급라인(L1)을 통해 헤드(160)로 제공된다. The supply line L1 connects the supply reservoir 120 and the head 160 . The chemical solution of the supply reservoir 120 is provided to the head 160 through the supply line L1.

공급라인(L1) 상에는 약액의 흐름을 제어할 수 있는 제어밸브(140)이 구비된다.A control valve 140 capable of controlling the flow of the chemical is provided on the supply line L1.

제어밸브(140)는 공급라인(L1) 상에 구비되어, 공급리저버(120)로부터 헤드(160)로의 약액의 공급을 제어한다. 제어밸브(140)가 닫히면 약액의 공급이 중단되고, 제어밸브(140)가 열리면 약액이 공급된다. The control valve 140 is provided on the supply line L1 to control the supply of the chemical from the supply reservoir 120 to the head 160 . When the control valve 140 is closed, the supply of the chemical is stopped, and when the control valve 140 is opened, the chemical is supplied.

헤드(160)는 공급리저버(120)로부터 약액을 공급받아 기판(W) 상에 토출한다. 헤드(160)는 복수로 구비될 수 있으며, 헤드(160) 각각은 약액을 토출하는 복수의 노즐을 포함한다. 헤드(160)의 노즐 단부에서의 약액은 압력조절부(130)에 의해 메니스커스 상태가 유지된다. The head 160 receives the chemical solution from the supply reservoir 120 and discharges it onto the substrate W. A plurality of heads 160 may be provided, and each of the heads 160 includes a plurality of nozzles for discharging a chemical solution. The chemical liquid at the nozzle end of the head 160 is maintained in a meniscus state by the pressure adjusting unit 130 .

헤드(160)에서 토출되지 못한 약액은 펌프를 이용하여 다시 공급리저버(120)로 되돌린다. 이를 위해 헤드(160)와 공급리저버(120) 사이에는 공급라인(L1)과는 별도로 회귀라인(L2)이 구비된다. 회귀라인(L2) 상에는 약액을 공급리저버(120)로 되돌리기 위한 펌프(170)가 구비된다.The chemical solution that has not been discharged from the head 160 is returned to the supply reservoir 120 again by using a pump. To this end, a return line L2 is provided between the head 160 and the supply reservoir 120 separately from the supply line L1. A pump 170 is provided on the return line L2 to return the chemical to the supply reservoir 120 .

헤드(160)는 헤드지지부(180)에 의해 지지된다. 헤드지지부(180)는 복수의 헤드(160)를 지지할 수 있다. The head 160 is supported by the head support unit 180 . The head support unit 180 may support the plurality of heads 160 .

이하 제1 가열수단, 제2 가열수단, 냉각수단에 대해 상세히 설명한다.Hereinafter, the first heating means, the second heating means, and the cooling means will be described in detail.

제1 가열수단(150)이 공급라인(L1) 상에서 제어밸브(140)의 하류측에 구비된다. 제1 가열수단(150)은 히터를 포함한다. 복수의 헤드(160)와 연결된 복수의 공급라인(L1)들을 동시에 가열할 수 있도록, 제1 가열수단(150)은 복수의 공급라인(L1)을 감싸도록 구비될 수도 있다.The first heating means 150 is provided on the downstream side of the control valve 140 on the supply line (L1). The first heating means 150 includes a heater. In order to simultaneously heat the plurality of supply lines L1 connected to the plurality of heads 160 , the first heating means 150 may be provided to surround the plurality of supply lines L1 .

제1 가열수단(150)은 공급리저버(120)로부터 제공되는 공급라인(L1) 내부의 약액을 사전적으로 가열한다. 제1 가열수단(150)에서 사전적으로 가열되는 약액의 온도는, 헤드(160)에서 토출 되는 약액의 온도보다 낮은 온도일 수 있다.The first heating means 150 pre-heats the chemical solution inside the supply line L1 provided from the supply reservoir 120 . The temperature of the chemical liquid heated in advance by the first heating means 150 may be lower than the temperature of the chemical liquid discharged from the head 160 .

제1 가열수단(150)은 제어밸브(140)의 하류측에 구비된다. 제1 가열수단(150)은 제어밸브(140)에 의해 공급리저버(120)와 단절되므로, 사전 가열된 약액이 공급리저버(120)의 내부압력을 변화시키지 못한다. 따라서 제1 가열수단에 의한 약액의 사전가열 시 압력조절부(130)의 약액흡입에 따른 약액낭비를 방지할 수 있다.The first heating means 150 is provided on the downstream side of the control valve 140 . Since the first heating means 150 is disconnected from the supply reservoir 120 by the control valve 140 , the preheated chemical does not change the internal pressure of the supply reservoir 120 . Accordingly, it is possible to prevent wastage of the chemical solution due to the suction of the chemical solution by the pressure adjusting unit 130 when the chemical solution is pre-heated by the first heating means.

제1 가열수단(150)에 대응되도록 헤드(160)의 내부에는 제2 가열수단(161)이 구비된다. 어느 하나의 가열수단만으로는 연속토출 시 약액의 온도변화를 방지할 수 없기 때문에, 본 발명의 약액토출장치는 2개의 가열수단을 구비한다.A second heating means 161 is provided inside the head 160 to correspond to the first heating means 150 . Since only one heating means cannot prevent the temperature change of the chemical solution during continuous discharge, the chemical solution discharging device of the present invention includes two heating means.

제2 가열수단(161)은 노즐부의 약액을 가열수 있는 히터를 포함한다. 제2 가열수단(161)은 제1 가열수단(150)에 의해 사전 가열된 약액을 설정온도로 가열한다. 제2 가열수단(161)도 제1 가열수단(150)과 마찬가지로 제어밸브(140)에 의해 공급리저버(1200와 단절된다. 따라서 제2 가열수단(161)에 의해 가열된 약액이 공급리저버(120)의 내부압력을 변화시키지 못한다. 따라서 압력조절부(130)의 약액흡입에 따른 약액낭비가 방지된다.The second heating means 161 includes a heater capable of heating the chemical solution of the nozzle unit. The second heating means 161 heats the chemical solution pre-heated by the first heating means 150 to a set temperature. The second heating means 161 is also disconnected from the supply reservoir 1200 by the control valve 140 like the first heating means 150. Therefore, the chemical liquid heated by the second heating means 161 is transferred to the supply reservoir 120. ) does not change the internal pressure, thus preventing wastage of the chemical solution due to the suction of the chemical solution by the pressure control unit 130 .

한편 헤드(160)를 지지하고 있는 헤드지지부(180)는 헤드(160)에 구비되는 제2 가열수단(161)에 의한 열을 전달받는다. 제2 가열수단(161)로부터 전달되는 열은 헤드지지부(180)의 열변형을 일으킬 수 있다. 헤드지지부(180)가 열변형되는 경우, 헤드지지부(180)에 의해 지지되는 복수의 헤드(160)의 위치가 틀어지게 된다. 따라서 헤드지지부(180)는 자체 열변형을 방지하기 위한 냉각수단(181)을 내부에 구비한다.Meanwhile, the head support unit 180 supporting the head 160 receives heat by the second heating means 161 provided in the head 160 . The heat transferred from the second heating means 161 may cause thermal deformation of the head support unit 180 . When the head support unit 180 is thermally deformed, the positions of the plurality of heads 160 supported by the head support unit 180 are shifted. Accordingly, the head support unit 180 has a cooling means 181 therein for preventing its own thermal deformation.

냉각수단(181)은 헤드지지부(180)를 냉각한다. 따라서 제2 가열수단(161)로 인한 헤드지지부(180)의 열변형이 냉각수단(181)에 의해 방지된다. 냉각수단(181)은 헤드지지부(180)의 전면적에 대해 구비될 수 있다. 예를 들어, 냉각수단(181)은 헤드지지부(180)의 전면적을 관통하는 쿨링라인으로 구성될 수 있다. 쿨링라인에는 PCW나 냉각수 등이 공급될 수 있다. 또는 헤드지지부(180)의 전면적에 펠티어 소자와 같은 냉각용 열전소자가 구비될 수도 있다.The cooling means 181 cools the head support unit 180 . Accordingly, thermal deformation of the head support unit 180 due to the second heating unit 161 is prevented by the cooling unit 181 . The cooling means 181 may be provided for the entire area of the head support unit 180 . For example, the cooling means 181 may be configured as a cooling line penetrating the entire area of the head support unit 180 . PCW or coolant may be supplied to the cooling line. Alternatively, a thermoelectric element for cooling, such as a Peltier element, may be provided on the entire area of the head support unit 180 .

헤드지지부(180)에는, 헤드(160)와 접촉되는 부분에 열차단부재(181)가 구비될 수 있다. 열차단부재(181)는 헤드(160) 내부에 구비되는 제2 가열수단(161)으로부터 전달되는 열을 차단한다. 따라서 제2 가열수단(161)의 헤드지지부(180)에 대한 열전달을 최소화할 수 있다. The head support unit 180 may be provided with a heat blocking member 181 at a portion in contact with the head 160 . The heat blocking member 181 blocks the heat transferred from the second heating means 161 provided in the head 160 . Therefore, heat transfer to the head support unit 180 of the second heating means 161 can be minimized.

도 2는 도 1에 도시된 열차단부재(181)의 다른 예를 설명하기 위한 도면이다.FIG. 2 is a view for explaining another example of the heat blocking member 181 shown in FIG. 1 .

도 2를 참조하면, 헤드 주위에 열차단부재(162)가 구비된다. 구체적으로 열차단부재(162)는 헤드(160)의 하단부를 제외한 헤드(160) 외측면 전체를 감싸는 형태로 구비된다.Referring to FIG. 2 , a heat blocking member 162 is provided around the head. Specifically, the heat blocking member 162 is provided in a form that surrounds the entire outer surface of the head 160 except for the lower end of the head 160 .

열차단부재(162)는 제2 가열수단(161)에 의해 가열된 약액이 다시 냉각되는 것을 방지하는 보온효과와, 제2 가열수단(161)에 의해 생성되는 열이 헤드지지부(180)로 전달되는 것을 방지하는 열차단효과를 갖는다. The heat-blocking member 162 has a warming effect that prevents the chemical liquid heated by the second heating means 161 from being cooled again, and the heat generated by the second heating means 161 is transferred to the head support unit 180 . It has a heat-blocking effect that prevents it from happening.

본 발명은 열차단부재를 이용하여 가열된 약액의 온도변화를 최소화하고, 헤드지지부의 열변형을 최소화할 수 있다. The present invention can minimize the temperature change of the heated chemical solution by using a heat-blocking member, and minimize the thermal deformation of the head support part.

한편, 헤드지지부(180)에는 도 1의 열차단부재(182)가 구비되고, 헤드(160)에는 도 2의 열차단부재(162)가 동시에 구비될 수도 있다.Meanwhile, the heat blocking member 182 of FIG. 1 may be provided on the head support unit 180 , and the heat blocking member 162 of FIG. 2 may be simultaneously provided on the head 160 .

본 발명에 따르면, 제1 가열수단을 이용하여 약액을 사전 가열하고, 사전가열된 약액을 다시 제2 가열수단을 이용하여 가열함으로써, 약액의 연속 토출시 약액의 온도변화를 최소화하여 토출안정성을 향상시킬 수 있다. According to the present invention, the chemical solution is pre-heated using the first heating means, and the pre-heated chemical solution is heated again using the second heating means, thereby minimizing the temperature change of the chemical solution during continuous discharge of the chemical solution to improve the discharge stability. can do it

본 발명에 따르면, 열차단부재를 이용하여, 헤드지지부의 열변형을 방지하고, 헤드 내의 약액이 냉각되는 것을 방지할 수 있다. According to the present invention, by using the heat blocking member, it is possible to prevent thermal deformation of the head support portion and to prevent the chemical liquid in the head from being cooled.

100: 약액토출장치 110: 버퍼리저버
120: 공급리저버 130: 압력조절부
140: 제어밸브 150: 제1 가열수단
160: 헤드 161: 제1 가열수단
170: 펌프 180: 헤드지지부
181: 냉각수단100: chemical liquid discharge device 110: buffer reservoir
120: supply reservoir 130: pressure control unit
140: control valve 150: first heating means
160: head 161: first heating means
170: pump 180: head support
181: cooling means

Claims (4)

공급리저버로부터 공급되는 약액을 잉크젯 헤드로 토출하는 약액토출장치에 있어서,
약액을 공급하는 버퍼리저버;
상기 버퍼리저버로부터 약액을 공급받아 일시적으로 저장하는 공급리저버;
상기 공급리저버의 내부압력을 조정하는 압력조정부;
헤드지지부에 의해 지지되며, 상기 공급리저버로부터의 약액을 공급받아 토출하는 헤드;
상기 공급리저버의 약액을 상기 헤드에 공급하는 공급라인;
상기 공급라인 상에 구비되어, 상기 약액의 공급을 제어하는 제어밸브;
상기 제어밸브의 하류측에 구비되며, 상기 약액을 가열하는 제1 가열수단; 및
상기 헤드에 구비되며, 상기 가열된 약액을 설정온도로 가열하는 제2 가열수단을 포함하고,
상기 제어밸브는, 상기 제1 가열수단에서 가열된 약액 및 상기 제2 가열수단에 가열된 약액으로 인하여 상기 공급리저버의 내부압력이 변화되는 것을 방지하는 것을 특징으로 하는 약액토출장치.
A chemical liquid discharging device for discharging a chemical liquid supplied from a supply reservoir to an inkjet head, comprising:
a buffer reservoir for supplying a chemical solution;
a supply reservoir for temporarily storing the chemical solution supplied from the buffer reservoir;
a pressure adjusting unit for adjusting the internal pressure of the supply reservoir;
a head supported by a head support unit, the head receiving and discharging the chemical solution from the supply reservoir;
a supply line for supplying the chemical solution of the supply reservoir to the head;
a control valve provided on the supply line to control the supply of the chemical;
a first heating means provided on a downstream side of the control valve for heating the chemical; and
It is provided in the head and includes a second heating means for heating the heated chemical to a set temperature,
and the control valve prevents the internal pressure of the supply reservoir from being changed due to the chemical liquid heated by the first heating means and the chemical liquid heated by the second heating means.
 제1항에 있어서,
상기 헤드지지부는, 상기 제2 가열수단으로부터 전달되는 열에 의해 변형되는 것을 방지하기 위해 내부에 냉각수단이 구비되는 것을 특징으로 하는 약액토출장치.
According to claim 1,
The chemical liquid dispensing device, characterized in that the head support portion is provided with a cooling means therein to prevent deformation by the heat transferred from the second heating means.
 제2항에 있어서,
상기 헤드지지부에는, 상기 헤드와 접촉되는 부분에 열차단부재가 구비되는 것을 특징으로 하는 약액토출장치.
3. The method of claim 2,
The head support unit, the chemical liquid dispensing device, characterized in that provided with a heat-blocking member in contact with the head.
 제2항에 있어서,
상기 헤드에는, 상기 헤드의 하단부를 제외한 상기 헤드의 외측면 전체를 감싸는 형태의 열차단부재가 구비되는 것을 특징으로 하는 약액토출장치.

3. The method of claim 2,
The chemical liquid dispensing device, characterized in that the head is provided with a heat-blocking member covering the entire outer surface of the head except for the lower end of the head.
KR1020190146123A 2019-11-14 2019-11-14 Apparatus for discharging chemical liquid KR102325770B1 (en)

Priority Applications (1)

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