KR102325273B1 - Method for manufacturing spacer in lens for camera and spacer manufacturing therefrom - Google Patents

Abstract

The present invention provides a manufacturing method of a spacer for a camera lens, for manufacturing the space through electroforming process, comprising: a pattern forming step of exposing a substrate surface in a shape corresponding to the space on a conductive substrate surface and forming a pattern constituting an insulation layer in the remaining area; an electroforming step of forming the spacer by electrodepositing metal on the conductive substrate according to the pattern; a separation step of separating the spacer electrodeposited on the conductive substrate; and a film forming step of forming an oxide film on the separated spacer surface. According to the manufacturing method of a spacer, the manufacturing processes can be simplified, precision can be increased, and thickness and manufacturing cost can be decreased.

Description

A method for manufacturing a spacer for a camera lens and a spacer manufactured therefrom

The present disclosure relates to a method of manufacturing a spacer for a camera lens and a spacer for a camera lens made from the manufacturing method.

In general, a camera is provided with a plurality of lenses, and a spacer is installed between the lenses and the lenses. The spacer is sandwiched between the lens and the lens to maintain a distance between the lenses, absorbs light incident on the lens and blocks the light from being reflected to the photosensitive unit, thereby preventing a flare phenomenon.

The spacer is made of a thin copper material, and an oxide film is formed on the surface to block light.

The spacer has a hole formed in the center to form a donut-like annular structure, and is manufactured through a sheet metal or etching method.

For example, an annular spacer was manufactured by punching a thin copper foil with a mold, or an annular spacer was manufactured by etching the copper foil.

However, in the case of the above-described conventional structure, there is a problem in that the cut surface or the etching surface is not smooth, so that the precision is lowered. Moreover, when the spacer is manufactured by the etching method, there is a problem in that the manufacturing cost is increased and the defect rate is increased because the process is complicated.

In addition, since it is necessary to prepare an expensive copper foil sheet processed into a thin film for manufacturing the spacer, it is difficult to lower the cost, and it is difficult to reduce the thickness of the spacer.

In recent years, lenses used in cameras such as mobile phones are getting smaller and smaller, and spacers used in lenses also require thinner thickness and higher precision. Therefore, improving and providing the conventional spacer manufacturing method provides many advantages to the user.

An object of the present invention is to provide a method for manufacturing a spacer for a camera lens, which can be easily manufactured by simplifying the manufacturing process, and a spacer manufactured therefrom.

An object of the present invention is to provide a method for manufacturing a spacer for a camera lens that can be manufactured through an electroforming process, and a spacer manufactured therefrom.

An object of the present invention is to provide a method for manufacturing a spacer for a camera lens capable of increasing precision and reducing thickness, and a spacer manufactured therefrom.

An object of the present invention is to provide a method for manufacturing a spacer for a camera lens capable of lowering manufacturing cost, and a spacer manufactured therefrom.

The manufacturing method of the present embodiment may be a manufacturing method for manufacturing a spacer for a camera lens that is formed of a metal material, an oxide film is formed on the surface, and is inserted between the lens and the lens.

The manufacturing method includes a pattern forming step of exposing the surface of the substrate in a form corresponding to the spacer on the surface of the conductive substrate and forming a pattern constituting an insulating layer in the remaining area, electrodepositing a metal according to the pattern on the conductive substrate to form a spacer It may include an electroforming step, a separation step of separating the electrodeposited spacer from the conductive substrate, and a film forming step of forming an oxide film on the surface of the separated spacer.

The pattern forming step includes applying and drying a photoresist on the prepared conductive substrate, preparing a mask film on which the pattern is formed, masking and exposing the photoresist on the conductive substrate, and developing and heat-treating the exposed photoresist to form a pattern may include the step of forming

The pattern forming step may further include a surface treatment step of the conductive substrate before applying the photoresist.

The electroforming step may include a first electrodeposition step of disposing a patterned conductive substrate in an electrolytic cell and electrodepositing a metal according to the pattern on the surface of the conductive substrate by applying a voltage to form a slip prevention layer.

The electroforming step may further include a second electrodeposition step of forming a body layer by electrodepositing a metal on the anti-slip layer formed on the conductive substrate.

The conductive substrate may be selected from a metal plate made of stainless steel, a brass plate (phosphor bronze plate), a copper plate, or a PCB plate.

In the first electrodeposition step, the slip prevention layer may be a copper pyrophosphate plating layer.

The anti-slip layer may be formed to a thickness of 0.001 to 0.010 mm.

The second electrodeposition step may be performed for 5 minutes to 70 minutes depending on the thickness of the spacer to be manufactured.

In the second electrodeposition step, the body layer may be a copper sulfate plating layer.

Through the second electrodeposition step, the spacer may be formed to a thickness of 0.003 to 0.035 mm. Preferably, the spacer may be formed to a thickness of 0.005 to 0.010 mm.

The spacer of the present embodiment may have a structure including a copper pyrophosphate plating layer formed by electroforming and a copper sulfate plating layer laminated on the copper pyrophosphate plating layer, and an oxide film is formed on the surface.

The spacer may be formed to a thickness of 0.003 to 0.035 mm. Preferably, the spacer may be formed to a thickness of 0.005 to 0.010 mm.

The oxide film may be formed to a thickness of 0.001 to 0.002 mm.

As described above, according to the present embodiment, by applying the electroforming process to further simplify the manufacturing process, manufacturing is easy, manufacturing defects are minimized, and manufacturing cost can be lowered.

It is possible to manufacture the spacer with a thinner thickness, and it is possible to more easily manufacture spacers of various thicknesses.

The tip surface is processed more smoothly and the precision of the spacer can be increased by preventing the micro-slip phenomenon during electrodeposition.

By directly forming the thin spacer through the electroforming process, the cost associated with the use of an expensive copper foil sheet can be reduced, thereby lowering the cost and enhancing price competitiveness.

1 is a schematic process flowchart illustrating a spacer manufacturing process according to the present embodiment.
2 is a schematic diagram illustrating a spacer according to the present embodiment.

Hereinafter, embodiments of the present invention will be described in detail. However, this is presented as an example, and the present invention is not limited thereto, and the present invention is only defined by the scope of the claims to be described later. The embodiments to be described below may be modified in various forms without departing from the concept and scope of the present invention. Wherever possible, identical or similar parts are denoted by the same reference numerals in the drawings.

The terminology used below is for the purpose of referring to specific embodiments only, and is not intended to limit the present invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite. The meaning of "comprising," as used herein, specifies a particular characteristic, region, integer, step, operation, element and/or component, and other specific characteristic, region, integer, step, operation, element, component, and/or group. It does not exclude the existence or addition of

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. However, the following examples are only preferred examples of the present invention, and the present invention is not limited thereto.

1 schematically shows a spacer manufacturing process according to the present embodiment.

As shown in Fig. 1, the manufacturing method of this embodiment includes the steps of forming a pattern on a conductive substrate, electrodepositing the spacers according to the pattern through an electroforming process, separating the spacers, and forming a film on the spacers. may include the step of

Accordingly, it is possible to easily manufacture the spacer with a significantly thinner thickness than in the related art through the electroforming process according to the present embodiment without using an expensive thin copper sheet.

The pattern is an empty region formed in the form of a spacer on the conductive substrate. For example, the pattern has a structure in which the surface of the conductive substrate is exposed in a shape corresponding to the spacer, and the remaining region forms an insulating layer. Accordingly, in the electroforming process, metal may be electrodeposited on the conductive substrate exposed in the blank region of the pattern to form a spacer.

In the pattern forming step, a plurality of spacers are formed to be electrodeposited on the surface of the conductive substrate.

In this embodiment, the pattern forming step is a step of applying and drying a photoresist on the prepared conductive substrate, preparing a mask film on which the pattern is formed, masking and exposing on the photoresist of the conductive substrate, developing the exposed photoresist and It may include the step of forming a pattern by heat treatment.

When the conductive substrate is prepared, a photoresist is applied to the surface of the substrate in a uniform thickness. The conductive substrate may be selected from, for example, a metal plate made of stainless steel, a brass plate (phosphor bronze plate), a copper plate, or a PCB plate.

In this embodiment, prior to application of the photoresist, a surface treatment may be performed to more easily peel the electrodeposited spacer from the surface of the conductive substrate.

The surface treatment may be performed by, for example, polishing the substrate surface using diatomaceous earth such as calcium carbonate, and washing and drying with water. The surface of the substrate is degreased through the pretreatment process so that the spacer can be more easily separated after electrodeposition by electroforming.

After the surface treatment is completed, a photoresist is applied to the surface of the substrate. In this embodiment, the photoresist is preferably applied with PVA solution,

When the photoresist applied to the surface of the conductive substrate is dried, the prepared mask film is masked. The mask film may be prepared by printing in advance according to the shape of a plurality of spacers to be electrodeposited on the surface of the metal plate.

After masking the mask film on the photoresist of the conductive substrate, exposure is performed. After exposure and development, only the photoresist film of the pattern set on the conductive substrate is left, and all the rest are removed. A pattern for electrodeposition is made on the surface of the substrate through the development and cleaning process. Accordingly, the photoresist in the region to be electrodeposited is removed, so that the surface of the conductive substrate is exposed in the form of a spacer, and a pattern forming an insulating layer by the photoresist is formed in the remaining region. When the development is completed, the photoresist film of the pattern set through the heat treatment step is heat-treated.

When a pattern is formed on the surface of the conductive substrate, metal is electrodeposited on the surface of the conductive substrate according to the pattern through electroforming to cast a spacer.

The electroforming step of this embodiment includes a first electrodeposition step of disposing a patterned conductive substrate in an electrolytic cell and applying a voltage to electrodeposit a first metal in a pattern on the surface of the conductive substrate to form a slip prevention layer, a slip prevention layer formed on the conductive substrate A second electrodeposition step of forming a body layer thereon may be included.

In addition to the above structure, the electroforming step is performed only in the first electrodeposition step, so that the spacer can be manufactured using only the slip prevention layer.

Electroforming may be performed by, for example, disposing a conductive substrate in an electrolytic bath filled with an electrolyte and flowing an electric current, so that metal ions in the electrolyte are electrodeposited on the surface of the conductive substrate. Metal ions are formed in the form of spacers while being electrodeposited on the surface of the conductive substrate and deposited as a metal layer. That is, when the cathode and the anode are energized in the electrolyte solution opposite to each other, electrolytic elution occurs at the anode side, but metal ions are discharged at the cathode to cause electrodeposition. Electroforming may form an electrodeposition plating layer using such an electrodeposition phenomenon.

Since the exposed surface is formed on the surface of the conductive substrate in the form of a spacer by the pattern, a plating layer by electrodeposition may be formed on the surface of the conductive substrate according to the shape of the pattern. Since the other regions of the pattern form an insulating layer to block current, the insulating layer region of the pattern is not electrodeposited with metal. Accordingly, the metal is plated to a predetermined thickness by electrodeposition only on the exposed surface of the conductive substrate by the pattern and grown to form the slip prevention layer of this embodiment.

In the first electrodeposition step, the anti-slip layer may be a copper pyrophosphate plating layer. That is, by performing electroforming using a solution containing copper pyrophosphate as an electrolyte, an anti-slip layer by the copper pyrophosphate plating layer can be formed on the surface of the conductive substrate.

In this way, by forming the slip prevention layer with copper pyrophosphate, it is possible to prevent the plating layer from slipping finely on the surface of the polished substrate in the subsequent electrodeposition process. Accordingly, it is possible to prevent the plating layer from being accurately electrodeposited on the surface of the conductive substrate and from being out of shape due to flow. Accordingly, the size and shape of the spacer can be formed more precisely. In addition, by improving the flatness and roughness of the surface of the conductive substrate and increasing the precision of the spacer, it is possible to manufacture a spacer of higher quality.

The thickness of the anti-slip layer can be increased step by step from the start of energization with the elapsed time. Accordingly, in the first electrodeposition step, the anti-slip layer can be formed to an appropriate thickness by controlling the energization time.

In this embodiment, the anti-slip layer may be formed to a thickness of 0.001 to 0.010 mm. When the thickness of the anti-slip layer is less than 0.001 mm, the anti-slip layer is too thin to have an anti-slip effect, and then the electro-deposited plating layer flows down from the surface of the substrate. Even when the thickness of the anti-slip layer exceeds 0.010 mm, a phenomenon in which the plating layer to be electrodeposited thereafter flows down also occurs, so that the shape of the spacer is misaligned and it cannot be precisely manufactured.

Unlike the structure described above, in the case of a structure in which the spacer is manufactured using only the anti-slip layer through the first electrodeposition step, the anti-slip layer directly forms the spacer. For example, the spacer may be manufactured to a thickness of 0.010 mm by forming the anti-slip layer to be 0.010 mm.

The second electrodeposition step may also be performed through the above-described electroforming process. Since the second electrodeposition process is performed the same as the first electrodeposition process with a different electrolyte solution, a detailed process of electroforming will be omitted below.

In the second electrodeposition step, the body layer may be a copper sulfate plating layer. That is, by performing electroforming using a solution containing copper sulfate as an electrolyte, a body layer made of a copper sulfate plating layer can be formed on the surface of the conductive substrate.

By forming the body layer with copper sulfate, a spacer can be finally formed to a desired thickness on the copper pyrophosphate plating layer formed in the first electrodeposition step.

In this way, by forming the body layer with copper sulfate, it is possible to reduce the time required for electrodeposition and lower the manufacturing cost, thereby increasing the price competitiveness of the spacer.

The thickness of the body layer may be increased in stages from the start of energization according to the elapsed time. Accordingly, in the second electrodeposition step, the body layer can be formed to an appropriate thickness by controlling the energization time. Accordingly, spacers can be manufactured with various thicknesses.

In this embodiment, the second electrodeposition step may be performed for 5 to 70 minutes depending on the thickness of the spacer. Accordingly, the overall thickness of the spacer may be formed in a range of 0.003 to 0.035 mm, more preferably in a thickness of 0.005 to 0.01 mm.

When the electroforming time through the second electrodeposition step is less than 5 minutes, a problem that causes defects due to insufficient thickness of the spacer may occur. If the electroforming time through the second electrodeposition step exceeds 70 minutes, the thickness of the spacer changes and causes defects.

As such, it is possible to more precisely manufacture a spacer having a thickness of less than 0.01 mm through the electroforming process of the present embodiment.

When the electroforming process is completed, the spacer is separated from the conductive substrate.

Then, an oxide film is formed on the surface of each spacer separated through the film forming step.

In this embodiment, the oxide film may be formed to a thickness of 0.001 to 0.002 mm.

When the thickness of the oxide film is less than 0.001mm, the light from the spacer is reflected and flare of the lens occurs. If the thickness of the oxide film exceeds 0.002mm, the oxide film oxide grows too much and is easily broken and smeared to the outside occurs.

2 shows a spacer for a camera lens manufactured according to the above-described electroforming process.

As shown in FIG. 2 , the spacer 10 of this embodiment may include a copper pyrophosphate plating layer 12 formed by electroforming and a copper sulfate plating layer 14 laminated on the copper pyrophosphate plating layer. An oxide film 16 may be formed on the outer surface of the spacer 10 .

The copper sulfate plating layer 14 is laminated on the copper pyrophosphate plating layer 12 to determine the overall thickness of the spacer 10 .

The copper pyrophosphate plating layer 12 prevents a fine slip from occurring between the plating layer and the conductive substrate on which electrodeposition is performed in the casting process. Accordingly, the copper sulfate plating layer 14 may be formed in an accurate shape without slipping on the conductive substrate during the thick formation process.

As described above, the spacer 10 of this embodiment is formed to have a very thin thickness, and the copper sulfate plating layer 14 does not flow out finely from the surface of the conductive substrate during the electroforming process by the copper pyrophosphate plating layer 12, so the shape is precise. .

In addition, unlike the front end of the spacer manufactured through the conventional etching or punching process, the spacer of this embodiment is manufactured by electroforming, thereby achieving a smoother and more sophisticated tip.

The spacer 10 of this embodiment may be formed to a thickness of 0.05 mm or less through an electroforming method. More preferably, the spacer of this embodiment may be formed to be smaller than 0.01 mm, and may be formed to a thickness of 0.005 mm.

As such, the spacer of the present embodiment may be formed to a thinner thickness that cannot be implemented through a thin copper foil sheet. Accordingly, it is possible to reduce the manufacturing cost, thereby lowering the cost and increasing the price competitiveness.

Although exemplary embodiments of the present invention have been illustrated and described as described above, various modifications and other embodiments may be made by those skilled in the art. All such modifications and other embodiments are intended to be contemplated and included in the appended claims without departing from the true spirit and scope of the present invention.

10: spacer 12: copper pyrophosphate plating layer
14: copper sulfate plating layer 16: oxide film

Claims (7)

A method for manufacturing a spacer for a camera lens that is formed of a metal material and an oxide film is formed on the surface and is inserted between the lens and the lens,
A pattern forming step of exposing the surface of the substrate in a shape corresponding to the spacer on the surface of the conductive substrate and forming a pattern constituting an insulating layer in the remaining area;
an electroforming step of forming a spacer by electrodepositing a metal on the conductive substrate according to a pattern;
a separation step of separating the electrodeposited spacers from the conductive substrate; and
A film forming step of forming an oxide film on the separated spacer surface
A method of manufacturing a spacer for a camera lens comprising a. The method of claim 1,
The pattern forming step includes applying a photoresist to the prepared conductive substrate and drying, preparing a mask film on which the pattern is formed, masking and exposing the photoresist on the conductive substrate, and developing and heat treating the exposed photoresist to pattern the pattern. A method of manufacturing a spacer for a camera lens comprising forming a. 3. The method according to claim 1 or 2,
In the electroforming step, a first electrodeposition step of disposing a patterned conductive substrate in an electrolytic cell and applying a voltage to electrodeposit a metal according to a pattern on the surface of the conductive substrate to form a slip prevention layer, a metal on the slip prevention layer formed on the conductive substrate A method of manufacturing a spacer for a camera lens comprising a second electrodeposition step of forming a body layer by electrodeposition. 4. The method of claim 3,
In the first electrodeposition step, the slip prevention layer is a copper pyrophosphate plating layer. 4. The method of claim 3,
The method of manufacturing a spacer for a camera lens, wherein the slip prevention layer has a thickness of 0.001 to 0.010 mm. delete delete

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