KR102021428B1 - A nickel electroforming method for producing a micro-mesh sheet and a nickel micro-mesh sheet produced by the method - Google Patents

Abstract

According to the present invention, the conductive substrate imprinted with the micro mesh is mounted on the cathode rotating drum while the cathode rotating drum rotates at a constant speed and is repeatedly moved within a predetermined interval in the horizontal direction while being immersed in the electrolyte. The present invention relates to a nickel electroplating method and a nickel electroplating micromesh sheet produced by the method, comprising: producing a nickel mesh sheet having a precise micro structure; (開口) and the line width is uniformly plated, and can be manufactured by a simple method, low defect rate and has the effect of improving productivity.

Description

A nickel electroforming method for producing a micro-mesh sheet and a nickel micro-mesh sheet produced by the method}

The present invention is equipped with a micro-mesh-engraved conductive substrate mounted on a cathode rotating drum while immersed in the electrolyte, while the cathode rotating drum rotates at a constant speed and operates to move repeatedly within a predetermined interval in the left and right directions. By producing the nickel micro mesh sheet of the precise micro structure, the uniform plating thickness and micro size opening and line width of the nickel micro mesh sheet are finely plated, and it can be manufactured by a simple method, and the defect rate is low. The present invention relates to a nickel electroplating method for producing a micromesh sheet characterized by improved productivity, and a nickel electroplating micromesh sheet produced by the method.

In general, mesh sheets that are photovoltaic components or mesh sheets that require precise micro-sized openings and uniform mesh structures such as printing screens have limitations in manufacturing mechanical processing. Therefore, they are mainly manufactured by electroplating. .

Electroforming is one of the metal forming processes in which a plate is formed on a substrate using the principle of electroplating, and then a plated layer is separated from the conductive substrate to manufacture and duplicate the component. Photo-lithography process on the substrate to form the opposite shape of the shape to be formed by Photo Resist (Photo Resist), and then plated here, removing the photoresist and peeling off the plating layer to precision parts How to make. The electroplating technology can be spotlighted as a technology that can be combined with photo-lithography technology to create high added value in various industrial fields that can be applied in various fields.

Therefore, recently, various technologies for electroforming, which is a popular technology, have been developed and patented.

Patent document 1 relates to a metal mask fabrication method using a nickel electroplating method and a metal mask using the same. As shown in FIG. 1, liquid photoresist coating (S510), exposure and development (S520), baking (S530), Ni By manufacturing the metal mask through the process of forming the electroplating layer (S540), forming the Ni alloy layer (S550), and removing the metal mask and removing the photoresist film (S560), high precision of 0.33 mm pitch or less, which is difficult to realize by the conventional method, is achieved. At the same time, the surface is strengthened to improve reliability and extend product life.

In addition, Patent Document 2 relates to a substrate for electroplating and an electroplating method using the same, as shown in FIG. 2, by using a vapor phase chemical vapor deposition method or a liquid phase method on a surface of a conductive substrate 1 having a planar shape or a fine pattern. The pin layer 2 is formed, and the metal film 3 to be manufactured on the graphene layer 2 is formed on the substrate using an electrochemical method, and the formed metal film is easily separated from the substrate by graphene on the substrate surface. There is a possible effect.

In addition, Patent Document 3 relates to a method for manufacturing an electromagnetic wave shielding material using electroplating and an electromagnetic wave shielding material according to the present invention. As shown in FIG. 3, the electroplating mold manufacturing (S10), mesh layer formation (S20), and a polymer film The electromagnetic wave shielding material by applying the adhesive (S30), attaching the polymer film to the mesh layer and curing (S40), electroplating mold separation (S50), and blackening layer formation (S60), thereby eliminating the etching process. The process can be shortened to secure production economy, and the thickness of the mesh layer can be easily adjusted by limiting the conductivity of the mesh layer by adjusting the shape of the electroplating mold.

However, the electroplating method according to the Patent Documents 1 to 3 has a high productivity because the manufacturing process is simple, but the above methods are used when the electrolytic solution is formed on the electroplating substrate formed of the micro size mesh when the micro size mesh sheet is required for precision. There is a possibility that a problem arises that the thickness of the micro sheet is not uniform because the thickness of the micro sheet is not uniform and the size of the micro openings in the mesh sheet is unevenly plated.

Patent Document 1: Korean Unexamined Patent Publication No. 10-2005-0120170 (published Dec. 22, 2005) Method of manufacturing metal mask using nickel electroplating method and metal mask using the same Patent Document 2: Korean Unexamined Patent Publication No. 10-2016-0055604 (published May 18, 2016) Jeonju plating substrate and Jeonju plating method using the same Patent Document 3: Korean Laid-Open Patent Publication No. 10-2006-0104532 (October 09, 2006) Manufacturing Method of Electromagnetic Wave Shielding Material Using Electroplating and Electromagnetic Wave Shielding Material

The present invention is to solve the problems as described above, by mounting a conductive substrate in which the micro-mesh is imprinted on the cathode rotary drum immersed in the electrolyte to produce a nickel mesh sheet of a precise microstructure, a nickel electroplating by a simple method An object of the present invention is to provide a nickel electroplating method for producing a micromesh sheet, and a nickel electroplating micromesh sheet produced by the method, which is capable of producing a plated micromesh sheet.

In particular, the present invention is precisely micro structure while immersing the negative electrode rotating drum equipped with the electroplated substrate in which the micro mesh is imprinted in the electrolyte so as to be repeatedly moved within a certain interval in the horizontal direction at the same time as the rotation of the negative electrode rotating drum By manufacturing the nickel electroplating mesh sheet of the nickel, the uniform plating thickness of the nickel micro mesh sheet and the micro-sized openings and line widths are uniformly plated, so that the defect rate is low and the productivity for the micro mesh sheet is improved. Another object is to provide a electroplating method and a nickel electroplating micromesh sheet produced by the method.

Accordingly, the present invention is a conventional nickel electroplating method by immersing the rotating drum in the electrolyte solution only by the rotational movement, the electrolytic solution plated on the electroplating substrate mounted on the rotating drum is formed of fine flow grains along the rotational direction of the rotating drum As a result, it was possible to solve the problem of uneven nickel electroplating.

The present invention for achieving the above object is a micro-mesh stamping step (S100) to intaglio or embossed micromesh on the electroplating substrate; A substrate fabrication step (S200) of applying a photoresist to the electroplating mold in which the micromesh is imprinted and then exposing the photomask to produce an electroplating substrate imprinted with the micromesh; A substrate mounting step (S300) of mounting the electroplated substrate on which the micro mesh is imprinted on the cathode rotating drum; A nickel electroplating step (S400) of forming a nickel electroplating micromesh sheet by immersing a negative electrode rotating drum in an electrolytic solution and electroplating nickel on the micromesh stamped electroplating substrate; A stripping step (S500) of removing the cathode rotating drum from the electrolyte solution; A substrate separation step of separating the electroplating substrate on which the electroplating micromesh sheet is formed from the cathode rotating drum (S600) and a micromesh sheet separating step (S700) of separating the nickel electroplating micromesh sheet from the electroplating substrate. It is a solution to the problem to provide a nickel electroplating method for producing a micro mesh sheet.

And the nickel electroplating step (S400), the immersion step (S410) to immerse the negative electrode rotating drum in the electrolyte and the negative electrode rotating drum immersed in the electrolyte rotates at a constant speed and at the same time in the range of the predetermined interval in the left and right directions It is characterized by repeating the nickel electroplating step (S420) to form a nickel electroplating micro mesh sheet by electroplating nickel on the micro-mesh sheet imprinting electroplating substrate while operating to move repeatedly.

In the present invention, the micro-mesh sheet stamped electroplating substrate is selected from phenol resins, melamine resins, epoxy resins, urea resins as a conductive polymer mixed with conductive particles, the electrolyte composition of the electrolytic cell per 1L of distilled water, nickel sulfamate (Ni (SO ₃ NH ₂ ) ₂ , 4H ₂ O) 300 to 500 g / L, nickel chloride (NiCl ₂ , 6H ₂ O) 10 to 25 g / L, boric acid (H ₃ BO ₃ ) 10 to 40 g / L and 1 The composition of the primary gloss 1-20 g / L, the secondary gloss 1-15 g / L, the antipitcher 1-5 g / L, and the degreasing bath of a degreasing tank is characterized by being 100 g / L.

In particular, since the degreasing after plating, the existing sodium dichromate is damaged when degreasing the product in the present invention was used to select a degreasing solution.

The conditions for electroplating include PH 3.0 to 5.0, plating bath temperature of 50 to 60 ° C, cathode current density of 1 to 5 (A / dm ² ), voltage of 2 to 6V, and stirring for air stirring and cathode rotating drum speed. Is 10 to 100 rpm, and the plating time is 30 to 80 minutes.

On the other hand, the present invention is to provide a nickel electroplated micro mesh sheet produced by the above method as another means to solve the problem.

According to the nickel electroplating method for manufacturing a micro mesh sheet according to the present invention, when a conductive substrate imprinted with a micro mesh is mounted on a negative electrode rotating drum, the negative electrode rotating drum rotates at a constant speed while being immersed in an electrolyte solution. By producing a nickel micro mesh sheet with a precise micro structure while operating to move repeatedly within a certain distance in the horizontal direction, the uniform plating thickness of the nickel micro mesh sheet and the micro-sized openings and line widths are uniformly plated. In addition, it is possible to manufacture by a simple method, the defect rate is low and there is an effect of improving the productivity.

1 is a flow chart showing a metal mask manufacturing method using a conventional Ni electroplating method according to the present invention.
Figure 2 is a side view showing a process of manufacturing a conventional electroplating substrate.
3 is a flowchart showing a method of manufacturing an electromagnetic wave shielding material by a conventional electroplating method.
4 is a view showing an apparatus for manufacturing a nickel electroplated micro mesh sheet according to the present invention;
Figure 5 is a process block diagram showing a nickel electroplating method for producing a nickel electroplating micro mesh sheet according to the present invention.
Figure 6 is a process block diagram specifically showing the nickel electroplating step (S500) of FIG.
Figure 7 is a photograph taken of a nickel electroplating micro mesh sheet forming electroplating substrate used in the nickel electroplating method according to the present invention.
FIG. 8 is a photograph of a state in which nickel electroplating is performed on the micromesh sheet-forming electroplating substrate of FIG. 7. FIG.
FIG. 9 is a photograph showing a state in which a nickel electroplating micromesh sheet is separated from a micromesh sheet forming electroplating substrate. FIG.
10 and 11 are enlarged photographs of the nickel electroplating micro mesh sheet prepared in Examples 1 and 2 according to the present invention.
12 and 13 are enlarged photographs of the nickel electroplated micromesh sheet prepared by Comparative Examples 1 and 2 as compared with Examples 1 and 2 according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the detailed description, illustrations and references to structures and operations easily understood by those skilled in the art of nickel electroplating may be omitted or omitted. .

Nickel electroplating apparatus 10 for manufacturing a nickel electroplating micro mesh sheet according to a preferred embodiment of the present invention, as shown in Figure 4, to mount the electrolytic bath 20, the stamping electroplating substrate with a micro mesh sheet The cathode rotating drum 30 is provided with a pair of mounting for the structure, and the shaft 50 for rotating the cathode rotating drum 30 and at the same time in the direction of the left and right in a constant interval range structure .

The cathode rotating drum 30 is transferred to a pair of teeth provided on both sides of the cathode rotating drum 30 by a rotational movement of the shaft 50 provided with a pair of teeth. 30 rotates, and the cathode rotary drum 30 is immersed in the electrolyte of the electrolytic cell 20 by vertical movement of the lift 40 provided on both sides of the nickel electroplating apparatus 10. The operation is removed from the electrolyte.

Nickel electroplating method according to a preferred embodiment of the present invention, as shown in Figure 5, the micro-mesh stamping step (S100) for engraving the micro mesh in the intaglio or embossed on the electroplating mold; A substrate manufacturing step (S200) of applying a photoresist to the electroplating mold in which the micromesh is imprinted and then exposing the photomask to produce an electroplating substrate in which the micromesh is imprinted; The electroplated substrate is stamped with a micro mesh sheet.

In the present invention, the step of stamping the micro mesh sheet (S100) is a step of engraving intaglio or embossing with the same line width and opening size as the nickel electroplating micromesh sheet to be manufactured in the electroplating mold.

In this step, by forming a micro-opening size pattern in the range of 1 to 100㎛ using a method such as imprint or lithography on the conductive substrate of the electroplating substrate, it is possible to manufacture a nickel electroplating micro mesh sheet.

Substrate fabrication step (S200) is a step of fabricating the electroplating substrate 100 as shown in Figure 7 after the exposure to the photomask by applying a conductive polymer on the upper surface of the micro-mesh sheet of the electroplating substrate imprinted.

The conductive polymer used in this step is a conductive polymer mixed with conductive particles is selected from a phenol resin, melamine resin, epoxy resin, urea resin, the polymer resin is a conductive particle among copper, silver, aluminum, carbon microtube, carbon One or more types selected and mixed are used.

The conductive polymer is preferably mixed 80 ~ 100g conductive particles with respect to 100g of synthetic resin. If the mixed amount of the conductive particles is less than the range defined above, the polymer may not express the conductivity of the resin properly. If the mixed amount of the conductive particles exceeds the range defined above, the synthetic resin and the conductive particles are uniform. It may not be mixed.

On the other hand, the substrate mounting step (S300) for mounting the electro-plated substrate in which the micro-mesh is produced through the above process to the cathode rotary drum; A nickel electroplating step (S400) of forming a nickel electroplating micromesh sheet by immersing a negative electrode rotating drum in an electrolytic solution and electroplating nickel on the micromesh sheet imprinting electroplating substrate; A stripping step (S500) of removing the cathode rotating drum from the electrolyte solution; A substrate separation step (S600) of separating the electroplating substrate on which the electroplated micro mesh sheet is formed from the cathode rotating drum; The nickel electroplating micromesh sheet is manufactured through the micromesh sheet separating step (S700) of separating the nickel preplating micromesh sheet from the electroplating substrate.

Substrate mounting step (S300) is a step of mounting the micro-mesh sheet imprinted electroplating substrate on the cathode rotating drum, gently bent in an arc shape so that the micro-mesh sheet imprinted electroplating substrate can be adhered to the circle around the cathode rotating drum It is mounted using a pair of mounts provided in the cathode rotating drum.

Nickel electroplating step (S400) is a step of forming a nickel electroplating micro mesh sheet by pre-plating nickel on the micro-mesh sheet imprinting electroplating substrate 100 as shown in Figure 8 by immersing the cathode rotating drum in the electrolyte to be.

The nickel electroplating step (S400) is specifically, as shown in Figure 6, the immersion step (S410) for immersing the cathode rotary drum in the electrolyte; Nickel electroplating micromesh sheet by electroplating nickel on the micromesh sheet imprinting electroplating substrate while operating so that the cathode rotating drum immersed in electrolyte solution rotates at a constant speed and is repeatedly moved within a certain interval in the horizontal direction. Nickel electroplating step (S420) to form a; including, but immersed step (S410) and nickel electroplating step (S420) it characterized in that it is carried out repeatedly.

Immersion step (S410) is a step of immersing the cathode rotary drum in the electrolyte, 1/4 to 1/3 of the diameter of the cathode rotary drum is immersed in the electrolyte. If the depth of the negative electrode rotating drum immersed in the electrolytic cell is less than the above-defined range, the efficiency of nickel electroplating formed on the micro-mesh sheet imprinted electroplating substrate may be lowered, and the negative electrode rotating drum is immersed in the electrolytic cell. When the depth to be exceeded the range defined above, there exists a possibility that the thickness of the nickel electroplating metal formed in the micromesh sheet engraving electroplating board | substrate may become non-uniform.

The nickel electroplating step (S420) is performed by oscillating in the vertical and horizontal directions with the rotation of the cathode-type rotating drum immersed in the electrolytic solution, and electroplating nickel on the electroplating substrate to imprint the micromesh sheet to form a nickel electroplating micromesh sheet. In this step, according to the operation of the rotating drum as described above, the thickness of the mesh sheet of the micro structure can be uniform by a simple method, and the micro micro openings and line widths of the mesh sheet can be plated finely.

At this time, the rotational speed of the cathode rotating drum is 5 ~ 100 rpm, the movement speed in the left and right direction is preferably 10 ~ 50 cm / s, nickel when the electroplating work on the electroplating substrate within the above range The uniform plating thickness of the micro mesh sheet, the micro-sized openings and the line widths are uniformly plated, and if the micro mesh sheet is out of the above-mentioned range, the thickness of the micro mesh sheet is uneven or the micro-sized openings and The line width may be plated unevenly.

In this step, nickel contained in the anode basket in the electrolytic cell is ionized in the electrolytic solution, and nickel is pre-plated on the stamped electro-plating substrate mounted on the micro-mesh sheet mounted on the cathode rotating drum to form a nickel electro-plating micro mesh sheet.

On the other hand, in the conventional nickel electroplating method, the rotating drum is immersed in the electrolytic solution and rotated only, so that the electrolytic solution to be plated on the electroplating substrate mounted on the rotating drum is formed with fine flow grains along the rotational direction of the rotating drum. There is a fear that a nickel electroplating will be formed.

The electrolytic solution composition of the electrolytic cell used in the present invention is 300 to 500 g / L of nickel sulfate (Ni (SO ₃ NH ₂ ) ₂ , 4H ₂ O), 10 to 25 g of nickel chloride (NiCl ₂ , 6H ₂ O) per 1 L of distilled water. / L, boric acid (H ₃ BO ₃ ) 10-40g / L and primary varnish 1-20g / L, secondary varnish 1-15g / L, anti-pitcher 1-5g / L, degreasing solution composition of the degreasing bath is 100g It is characterized by being / L.

In particular, since the degreasing after plating, the existing sodium dichromate is damaged when degreasing the product is characterized by selecting a degreasing solution in the present invention.

The conditions for electroplating include PH 3.0 to 5.0, plating bath temperature of 50 to 60 ° C, cathode current density of 1 to 5 (A / dm ² ), voltage of 2 to 6V, and stirring for air stirring and cathode rotating drum speed. Is characterized by being 10 to 100 rpm and a plating time of 30 to 80 minutes.

Nickel sulfamate is an electroplating bath that promotes dissolution of nickel at the anode by using nickel chloride or bromide ions for the prevention of passivation and high current operation. When the mixing amount of nickel sulfamate per 1 L of distilled water is out of the range of the mixing amount defined above, there is a concern that the dissolution of nickel in the positive electrode may decrease.

Nickel chloride improves the electrical conductivity of the electrolyte to promote the dissolution of nickel in the positive electrode, and improves the adhesion and smoothness, thereby increasing the current density. If the mixing amount of nickel chloride per 1 L of distilled water is less than the range of the above-defined mixing amount, the gloss of the nickel electroplating micromesh sheet may be lowered. If the mixing amount of the above-mentioned mixing amount exceeds the above-mentioned range, the nickel electroplating micromesh There exists a possibility of hardening the film of a sheet | seat.

Boric acid acts as a buffer for pH, and extends gloss range, smoothness, decreases internal stress, improves uniform electrodeposition, and reduces black burning. If the mixed amount of boric acid per 1 liter of distilled water is less than the range of the above-mentioned mixing amount, there is a fear that the plating color will be cloudy and the pH fluctuation may be severe. There is a fear.

The primary varnish acts to protect the secondary varnish and maintain the gloss of the base and to make the plating more flexible due to the internal stress. If the primary varnish is less than the range of the mixing amount defined above, there is a fear that the plating is weak and the internal stress is increased, and if the primary varnish exceeds the range of the mixing amount defined above, there is no problem.

The secondary varnish acts to impart good gloss to the nickel electroplated micromesh sheet. If the mixing amount of the secondary varnish is less than the range of the mixing amount defined above, the gloss effect may be lowered. If the mixing amount of the secondary varnish exceeds the range of the above-mentioned mixing amount, the coating power of the low current density portion is lowered, and there is a fear of fitting. There is.

The primary varnish is preferably selected from 1.3.6-naphthalene, saccharin, sodium sulfonate or sulfonamide, and the secondary varnish is preferably one or more selected from gelatin, butenediol, coumarin or formalin. .

In the present invention, the nickel electroplating conditions are preferably the conditions defined above. According to the specification of the nickel electroplating micro mesh sheet to be manufactured, the conditions of the nickel electroplating may be appropriately adjusted.

The nickel electroplating is a nickel electroplating with a uniform plating thickness and micro sized opening and line width of the nickel micro mesh sheet by a simple method when the nickel electroplating work is performed within the above conditions. Plated micro mesh sheets are made.

For reference, the nickel electroplating conditions are preferred to perform nickel electroplating work within the above-defined range, but may be outside the range defined above according to the specifications of the nickel electroplating micro mesh sheet to be manufactured.

The stripping step (S500) is a step of removing the cathode rotary drum from the electrolyte solution, and the dipping step (S410) and nickel until the desired micro mesh sheet is formed by nickel electroplating in the nickel electroplating step (S420). The electroplating step (S420) is carried out repeatedly for 45 to 55 minutes.

Substrate separation step (S600) is a step of separating the electroplating substrate on which the electroplated micro mesh sheet is formed from the cathode rotary drum, the same process as the conventional nickel electroplating method.

The micro mesh sheet separation step (S700) is a step of separating the nickel electroplating micromesh sheet from the electroplating substrate, and as shown in FIG. 8, the nickel electroplating micromesh sheet on the micromesh sheet imprinting electroplating substrate 100. 9 is a step of separating the nickel electroplating micro mesh sheet P from the micro mesh sheet imprinting electroplating substrate 100 as shown in FIG. 9, which is the same process as a conventional nickel electroplating method.

Nickel electroplating micro mesh sheet produced by the method as described above is a uniform plating thickness and micro size of the nickel micro mesh sheet by a simple method by the nickel electroplating method for producing a micro mesh sheet according to the present invention There is an effect that the opening and the line width of the plated are uniformly plated.

Hereinafter, the present invention will be described in detail with reference to the following examples. However, the scope of the present invention is not limited only to these Examples.

(Example 1)

The electrolytic solution composition of the electrolytic cell was nickel nickel (sulfate) (Ni (SO ₃ NH ₂₎ to produce a nickel micro mesh sheet having a thickness of 55 ± 10 μm and a width of 16 ± 1 μm having a line width of 15 ± 5 μm. ) ₂ , 4H ₂ O) 500 g / L, nickel chloride (NiCl ₂ , 6H ₂ O) 10 g / L, boric acid (H ₃ BO ₃ ) 40 g / L and primary polisher (GL-5000, Shin Poong Metal) 1 g / L , 1 g / L of secondary polish (NI-BASIC, Shin Poong Metal), 1 g / L of anti-pitcher (WA-1, Shin Poong Metal), and 100 g / L of degreasing solution (NIKKA NONTAK, Japan).

The conditions of electroplating were PH 3.0, plating bath temperature 50 ℃, cathode current density 1 (A / dm ² ), voltage 2V, stirring for air agitation, cathode rotating drum speed of 10rpm, plating time of 30 minutes It carried out on condition.

Bending the electroplating substrate in an arc shape so as to be in close contact with the cathode rotating drum, and then mounting the electroplating substrate by using a pair of mounting bases provided in the cathode rotating drum, and then measuring the diameter of the cathode rotating drum. Rotate the cathode rotating drum at a speed of 10 rpm while immersing / 3 soaked in the electrolytic cell, and operate it for 30 minutes so that the moving speed in the vertical and horizontal directions is 10 cm / s, then remove the electroplating substrate from the cathode rotating drum. After the separation, the nickel pre-plated micro mesh sheet was separated from the pre-plated substrate to prepare a nickel pre-plated micro mesh sheet (see FIG. 10).

(Example 2)

The electrolytic solution composition of the electrolytic cell was nickel nickel (sulfate) (Ni (SO ₃ NH ₂₎ to produce a nickel micro mesh sheet having a thickness of 55 ± 10 μm and a width of 16 ± 1 μm having a line width of 15 ± 5 μm. ) ₂ , 4H ₂ O) 300 g / L, nickel chloride (NiCl ₂ , 6H ₂ O) 25 g / L, boric acid (H ₃ BO ₃ ) 10 g / L and primary polisher (GL-5000, Shin Poong Metal) 20 g / L 15 g / L of secondary polish (NI-BASIC, Shin Poong Metal), 5 g / L of anti-pitcher (WA-1, Shin Poong Metal), and 100 g / L of degreasing solution (NIKKA NONTAK, Japan).

The conditions of electroplating were PH 5, plating bath temperature 60 ℃, cathode current density 5 (A / dm ² ), voltage 6V, stirring for air agitation, cathode rotating drum speed of 100rpm, plating time of 80 minutes It carried out on condition.

Bending the electroplating substrate in an arc shape so as to be in close contact with the cathode rotating drum, and then mounting the electroplating substrate by using a pair of mounting bases provided in the cathode rotating drum, and then measuring the diameter of the cathode rotating drum. While rotating the cathode rotating drum at a speed of 100rpm while immersing / 4 soaking in the electrolyzer, operate for 80 minutes so that the movement speed in the vertical and horizontal directions is 50 cm / s, and then the electroplating substrate from the cathode rotating drum. After the separation, the nickel pre-plated micro mesh sheet was separated on the pre-plated substrate to prepare a nickel pre-plated micro mesh sheet (see FIG. 11).

(Comparative Example 1)

Using a pre-plated substrate prepared in the same manner as in Example 1, the cathode-type rotary drum was immersed at a speed of 10 rpm while immersing 1/3 of the diameter of the cathode-type rotary drum to be immersed in the electrolytic cell by the same method as in Example 1. After rotating for a minute, the electroplating substrate was separated from the cathode rotating drum, and the nickel electroplating micromesh sheet was separated from the electroplating substrate to prepare a nickel electroplating micromesh sheet (see FIG. 12).

The electrolytic solution used in this Comparative Example 1 was subjected to nickel electroplating under the same conditions as in Example 1 using the same electrolyte as that used in Example 1 above.

(Comparative Example 2)

Using a pre-plated substrate prepared in the same manner as in Example 2, the cathode-type rotary drum was immersed at a speed of 100 rpm while immersing 1/4 of the diameter of the cathode-type rotary drum in the electrolytic cell so as to be immersed in the electrolytic cell. After rotating for a minute, the electroplating substrate was separated from the cathode rotating drum, and the nickel electroplating micromesh sheet was separated from the electroplating substrate to prepare a nickel electroplating micromesh sheet (see FIG. 13).

The electrolytic solution used in Comparative Example 2 was subjected to nickel electroplating under the same conditions as in Example 2 using the same electrolyte as that used in Example 2 above.

Nickel pre-plated micro according to the preferred embodiments 1 and 2 of the present invention as a result of photographing the nickel pre-plated micro mesh sheet prepared by the method of Examples 1, 2 and Comparative Examples 1, 2 using TEM The mesh sheet is a honeycomb structure having a uniform micro neck structure as shown in FIGS. 10 and 11 (a photo magnification: 100 times, b photo magnification: 500 times), and nickel electroplating according to Comparative Examples 1 and 2. As shown in FIGS. 12 and 13 (a photo magnification: 200 times, b photo magnification: 500 times), it was confirmed that the micro neck structure had a non-uniform honeycomb structure.

This is because the nickel electroplated micro mesh sheet according to Examples 1 and 2 is operated while the nickel-type electroplated platen is rotated at a constant speed and repeatedly moved within a predetermined interval in the vertical direction and the left and right directions at the same time. By producing a nickel mesh sheet with a precise micro structure, it is estimated that a uniform plating thickness, micro-sized openings and line widths of the nickel micro mesh sheet are uniformly plated by a simple method. According to the nickel electroplated micro mesh sheet according to the present invention, as the cathode rotating drum only rotates, fine flow grains are formed along the rotating direction of the rotating drum, thereby forming an opening and a line width having a non-uniform size.

As described above, the nickel electroplating method for producing a micromesh sheet according to a preferred embodiment of the present invention and the nickel electroplating micromesh sheet produced by the method have been described, but this is merely described by way of example and the present invention. Those skilled in the art will appreciate that various changes and modifications can be made without departing from the spirit of the invention.

P: Nickel Electroplated Micro Mesh Sheet
100: stamping electroplating substrate of the micro mesh sheet
10: nickel electroplating apparatus 20: electrolytic cell
30: cathode rotary drum 40: lift
50: shaft

Claims (5)

A micro mesh engraving step (S100) of engraving the micro mesh in an engraved or embossed electroplating mold;
A substrate manufacturing step (S200) of manufacturing a pre-plated substrate in which a micro-mesh is imprinted by applying a conductive polymer selected from a phenol resin, melamine resin or epoxy resin, or urea resin to the pre-plating mold in which the micro-mesh is imprinted;
A substrate mounting step (S300) of mounting the electroplated substrate on which the micro mesh is imprinted on the cathode rotating drum;
Immersion step (S410) for immersing the cathode rotary drum in the electrolyte; The nickel electroplating micromesh by electroplating nickel on the electroplating substrate imprinted with the micromesh while the cathode rotating drum immersed in the electrolyte rotates at a constant speed and is repeatedly moved within a certain interval in the horizontal direction. Nickel pre-plating step (S420) to form a sheet; including, repeating the immersion step (S410) and nickel pre-plating step (S420),
For 1 L of distilled water, 300-500 g / L nickel sulfamate (Ni (SO ₃ NH ₂ ) ₂ , 4H ₂ O), 10-25 g / L nickel chloride (NiCl ₂ , 6H ₂ O), boric acid ( H ₃ BO ₃ ) 1 to 20 g / L of primary varnish selected from 10 to 40 g / L and 1.3.6-naphthalene, saccharin, sodium sulfonate or sulfonamide, one or more of gelatin, butenediol, coumarin or formalin The composition of the degreasing solution of 1 ~ 15g / L of secondary polishing agent, 1 ~ 5g / L of degreasing bath and degreasing bath was immersed in electrolytic solution of 100g / L, and nickel was electroplated on electroplated substrate with micro mesh stamped. Nickel electroplating step (S400) to form a plated micro mesh sheet;
A stripping step (S500) of removing the cathode rotating drum from the electrolyte solution;
A substrate separation step (S600) of separating the electroplating substrate on which the electroplated micro mesh sheet is formed from the cathode rotating drum;
Micro mesh sheet separation step of separating the nickel electroplating micro mesh sheet from the electroplating substrate (S700);
Nickel electroplating method for producing a micro-mesh sheet comprising a.
delete delete delete Nickel electroplating micro mesh sheet produced by the method of claim 1.

Images