KR102325225B1 - Photo sensor shrinkage package module - Google Patents

Abstract

The present invention relates to a substrate, a light emitting device bonded to one surface of the substrate and transmitting an optical signal, a photosensor chip that converts an optical signal into an electrical signal, and is bonded to the other surface opposite to one surface of the substrate, in order to reflect the optical signal As a photosensor shrinkage package module including a holder bonded around one surface of a substrate to cover a light emitting device, a photosensor shrinkage package module capable of reducing a structure and size to a compact size is provided.

Description

Photo sensor shrinkage package module {PHOTO SENSOR SHRINKAGE PACKAGE MODULE}

The present invention relates to a photosensor shrinkage package module, and more particularly, to a photosensor shrinkage package module capable of compactly reducing the structure and size.

The photosensor chip is a semiconductor device having a function of capturing an image of a target, manufactured in the form of a package module, and mounted on various mobile devices including digital cameras and smart phones. Such a photosensor chip can generate image data with little or no noise in electronic reading as sensor technology has improved significantly. Accordingly, the use of the photosensor chip tends to be extended to the security field. For example, the use of photosensor chips for image sensors for generating quantum random numbers used for encryption of communication contents and generation of encryption keys is expanding. In addition to this, the photosensor chip is being used in a variety of fields in which it is required to receive an optical signal.

Meanwhile, additional hardware such as a light source and an optical device may be required to input an optical signal for various purposes such as image capturing and quantum random number generation to the photosensor chip. However, in order to additionally mount these hardware in a mobile device, a lot of space is required and a complex circuit is required. Accordingly, it is difficult to apply the photosensor chip and hardware such as a light source and an optical device required therefor to a mobile device.

The technology underlying the present invention is disclosed in the following patent documents.

US 10-2014-0045235 A US 10-2018-0034242 A

The present invention provides a photo sensor shrinkage package module capable of reducing the structure and size of the compact.

The present invention provides a photo sensor shrinkage package module that can block different light signals from the outside.

Photo sensor shrinkage package module according to an embodiment of the present invention, a substrate; a light emitting device bonded to one surface of the substrate and transmitting an optical signal; a photosensor chip that converts an optical signal into an electrical signal and is bonded to the other surface opposite to one surface of the substrate; and a holder bonded to one surface of the substrate so as to cover the light emitting device in order to reflect an optical signal.

The substrate has an opening to allow an optical signal to pass therethrough, the light emitting device is bonded to a periphery of the substrate surrounding the opening, the photosensor chip is bonded so that at least a portion is exposed to the opening, and the holder may be bonded to the periphery to cover the opening.

and an optical filter bonded to the peripheral portion to cover the opening between the peripheral portion and the holder and disposed to face the photosensor chip.

The photosensor chip may include a QRNG photosensor chip, and the substrate may include a printed circuit board.

The coefficient of thermal expansion of the printed circuit board may be in the range ^{of 1.2×10 -6} to 3.2×10 ^{-6 /°C.}

The thickness of the printed circuit board may be in the range of 0.04 to 0.15 mm.

The holder may have a metal coating layer formed on at least a lower surface thereof.

The metal material may include any one of a palladium material and a nickel material.

The optical filter may include an absorption type filter that absorbs light in the infrared wavelength band and transmits the rest.

It may include; is formed to pass through the peripheral portion and communicates with the internal space between the substrate and the holder.

The air outlet may have an inlet positioned on one surface of the substrate, and an outlet positioned on a side surface or the other surface of the substrate.

a sealing ring and a bump bonding the substrate and the photosensor chip to each other; and a molding part covering the other surface of the substrate and the photosensor chip.

The sealing ring includes a metal material, is patterned in a closed loop shape along the periphery of the opening, and is bonded to the substrate and the photosensor chip by a transients liquid phase bonding method, and the bumps are It is arranged to be spaced apart from the outside of the sealing ring along the circumference of the sealing ring, and the substrate may be bonded to the photosensor chip by a flip chip bonding method.

According to an embodiment of the present invention, the light emitting element and the photosensor chip can be modularized by bonding the light emitting element and the photosensor chip to one surface and the other surface of the substrate and bonding the holder to cover one surface of the substrate. Accordingly, the overall structure and size of the substrate, the light emitting device, the photosensor chip, and the holder can be reduced compactly.

Further, according to the embodiment of the present invention, the light emitting element can transmit an optical signal to the photosensor chip in the inner space surrounded by the holder and the substrate. Accordingly, it is possible to block transmission of different light signals from the outside to the photosensor chip.

1 is a cross-sectional view illustrating a photosensor shrinkage package module according to an embodiment of the present invention by cutting it in a first direction.
2 is a cross-sectional view illustrating a photosensor shrinkage package module according to an embodiment of the present invention by cutting it in a second direction.
3 is a plan view of a photo sensor shrinkage package module according to an embodiment of the present invention.
4 is an operation diagram of a photo sensor shrinkage package module according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, an embodiment of the present invention will be described in detail. However, the present invention is not limited to the embodiments disclosed below, and will be implemented in various different forms. Only the embodiments of the present invention are provided to complete the disclosure of the present invention, and to completely inform those of ordinary skill in the art the scope of the invention. The drawings may be exaggerated in order to explain the embodiment of the present invention, and the same reference numerals in the drawings refer to the same elements.

The photo sensor shrinkage package module according to an embodiment of the present invention may be used to generate quantum random numbers in various technical fields such as security and quantum cryptography communication. For example, the photo sensor shrinkage package module according to an embodiment of the present invention may be a QRNG sensor shrinkage package module.

Quantum random numbers (also referred to as 'pure random numbers') are used in various fields requiring randomness, such as quantum cryptography communication, numerical simulation, and statistical analysis. As a semiconductor device for generating such quantum random numbers, there is a quantum random number generator (QRNG) photosensor chip. The QRNG photosensor chip generates quantum random numbers based on quantum optics.

The QRNG photosensor chip can generate high-quality quantum random numbers only when it receives an optical signal stably from a light source. Otherwise, the algorithm of the post-processing step after receiving the optical signal may be complicated, and the quality of the randomness of the generated quantum random number may be deteriorated. In an embodiment of the present invention, for example, since the QRNG photosensor chip and the light emitting device can be manufactured as a package module, the light signal of the light emitting device can be stably transmitted to the QRNG photosensor chip.

Of course, the photo sensor shrinkage package module according to an embodiment of the present invention may be used as various package modules capable of converting an optical signal into an electrical signal.

The photo sensor shrinkage package module according to an embodiment of the present invention can reduce the structure and size to be compact, and present technical features that can block different light signals from the outside.

1 is a cross-sectional view illustrating a photosensor shrinkage package module according to an embodiment of the present invention cut in a first direction, and FIG. 2 is a photosensor shrinkage package module according to an embodiment of the present invention cut in a second direction. 3 is a plan view of a photo sensor shrinkage package module according to an embodiment of the present invention.

1 to 3 , a photo sensor shrinkage package module, for example, a QRNG sensor package module according to an embodiment of the present invention, is bonded to a substrate 100 and one surface of the substrate 100, and emits light to transmit an optical signal. The device 200, a photosensor chip 300 that converts an optical signal into an electrical signal, is bonded to the other surface opposite to one surface of the substrate 100, and a substrate to cover the light emitting device 200 to reflect the optical signal It includes a holder 400 that is joined to the circumference of one side of 100).

In addition, the photosensor shrinkage package module according to an embodiment of the present invention is formed to penetrate the peripheral portion of the substrate 100 and communicates with the separation space between the substrate 100 and the holder 400 , the air exhaust unit H2 ), bonded to the periphery of the substrate 100 so as to cover an opening H1 to be described later of the substrate 100 between the periphery of the substrate 100 and the holder 400 , and an optical filter facing the photosensor chip 300 . (500) may be further included.

In addition, the photosensor shrinkage package module according to an embodiment of the present invention includes sealing rings 600 and bumps 700 for bonding them between the substrate 100 and the photosensor chip 300 , and the substrate 100 . A molding part 900 covering the other surface and the photosensor chip 300 may be further included.

The substrate 100 may include a printed circuit board. The substrate 100 may supply an electric signal from the outside to the light emitting device 200 . Also, the substrate 100 may receive an electrical signal generated by the photosensor chip 200 and transmit it to the outside.

The substrate 100 may include, for example, an insulating plate layer, a thin film pattern layer providing an electrical circuit to the insulating plate layer, and a solder resist layer formed to protect the thin film pattern layer. Of course, the configuration of the substrate 100 may vary.

The substrate 100 may be a plate-shaped substrate 100 having one surface and the other surface opposite to the one surface. One surface may be an upper surface, and the other surface may be a lower surface. Of course, one surface may be the lower surface depending on the arrangement of the substrate 100 . An opening H1 may be formed to vertically penetrate one surface and the other surface of the substrate 100 . In this case, the remaining portion except for the opening H1 of the substrate 100 may be defined as a peripheral portion. The opening H1 and the peripheral portion of the substrate 100 may be parallel to each other in a horizontal direction. The peripheral portion of the substrate 100 may mean an edge of the substrate 100 . That is, one surface and the other surface of the substrate 100 may be formed of an opening H1 and a peripheral portion, respectively.

As such, the substrate 100 may include an opening H1 to allow the optical signal to pass therethrough. Also, the substrate 100 may include a peripheral portion surrounding the opening H1 . A position at which the opening H1 is formed may be varied. The opening H1 may be formed to be biased in a predetermined direction from the center of the substrate 100 . Of course, the opening H1 may be located at the center of the substrate 100 . Meanwhile, the overall shape of the substrate 100 may be a rectangular plate shape. Of course, the shape of the substrate 100 may vary.

The size of the substrate 100 may be larger than the size of the photosensor chip 300 . In this case, the size means a size in the horizontal direction. The horizontal direction may include a left-right direction (X) and a front-rear direction (Y). Accordingly, a portion of the peripheral portion of the substrate 100 may protrude to the outside of the photosensor chip 300 . A solder ball 800 , which will be described later, may be mounted at a protruding position of the periphery of the substrate 100 .

The size of the opening H1 may be smaller than the size of the photosensor chip 300 . Accordingly, the periphery of the photosensor chip 300 may overlap the periphery of the substrate 100 . In this case, the peripheral portion of the substrate 100 may have a structure surrounding the pixel area of the photosensor chip 300 .

That is, the pixel region of the photosensor chip 300 may be exposed to the upper side of the substrate 100 through the opening H1 . In this case, the photosensor chip 300 and the optical filter 500 to be described later may face each other through the opening H1 . The pixel region may be positioned to be biased in a predetermined direction from the center of the photosensor chip 200 . Of course, the positions of the pixel regions may vary.

The periphery of the substrate 100 may be bonded to the periphery of the photosensor chip 300 by a flip-chip bonding method. The number and arrangement of bumps 700 for the above-described flip chip bonding may be variously determined according to a desired bonding strength. Here, a plurality of bumps 700 may be arranged along the circumference of the photosensor chip 300 from the outside of the sealing ring 600 .

The thickness of the substrate 100 may be in the range of 0.04 to 0.15 mm. If the thickness of the substrate 100 is less than 0.04 mm, warpage may occur in the substrate 100 . When the thickness of the substrate 100 exceeds 0.15 mm, the distance between the photosensor chip 300 and the optical filter 500 may become larger than necessary due to the thickness of the substrate 100 . As the thickness of the substrate 100 is in the range of 0.04 to 0.15 mm, the substrate 100 may satisfy the desired bonding strength, and the distance between the photosensor chip 300 and the optical filter 500 may also be spaced at a desired interval. can

The thermal expansion coefficient of the substrate 100 may be similar to or the same as that of the photosensor chip 300 so that the substrate 100 and the photosensor chip 300 are structurally stable. The thermal expansion coefficient of the substrate 100 may be in the range ^{of 1.2×10 −6} to 3.2×10 ^{−6 /°C.} When the coefficient of thermal expansion of the substrate 100 is out of the above-described numerical range, damage to the bonding portion between the substrate 100 and the photosensor chip 300 is caused due to the difference in the coefficient of thermal expansion between the substrate 100 and the photosensor chip 300 . can occur

The light emitting device 200 may be bonded to one surface of the peripheral portion of the substrate 100 . In this case, one surface may be an upper surface. The light emitting device 200 may be connected to the thin film pattern layer of the substrate 100 to receive a predetermined power for generating an optical signal. In this case, a capacitor (not shown) for supplying power to the light emitting device 200 may be provided on one surface of the peripheral portion of the substrate 100 . The capacitor may be connected to the thin film pattern layer of the substrate 100 .

The light emitting device 200 may include a light emitting diode (LED) device. Of course, the type of the light emitting device 200 may vary according to the type of light used to generate the random quantum number. The number of the light emitting devices 200 may be one or more.

An optical signal transmitted from the light emitting device 200 may be reflected from the holder 400 to be incident on a pixel region of the photosensor chip 300 , and may be used to generate an electrical signal in the photosensor chip 300 . That is, the optical signal is transmitted from the inside of the photo sensor shrinkage package module, and may be received by the photosensor chip 300 by moving from the upper surface side to the lower surface side of the substrate 100 .

The photosensor chip 300 may include a QRNG photosensor chip. The photosensor chip 300 may be formed to receive an optical signal reflected from the holder 400 and passed through the optical filter 500 to convert it into an electrical signal for generating quantum random numbers. A pixel area for receiving an optical signal may be formed on one surface, for example, an upper surface of the photosensor chip 300 , and terminals (not shown) for transmitting/receiving electrical signals and supplying power may be formed around the pixel area. The photosensor chip 300 may be electrically connected to the substrate 100 and transmit an electrical signal to the outside through the substrate 100 . Meanwhile, the photosensor chip 300 may be bonded to the periphery of the substrate 100 so that at least a part thereof is exposed to the opening H1 .

The holder 400 serves to reflect the optical signal transmitted from the light emitting device 200 toward the photosensor chip 300 . The holder 400 may include, for example, a SUS material. Of course, the material of the holder 400 may vary.

The holder 400 may be formed such that a surface facing the light emitting device 200 and the optical filter 500, for example, a lower surface thereof is concave upward. The holder 400 may have a metal coating layer formed on at least a lower surface thereof. The coating layer may be formed by plating. In this case, the metal material forming the coating layer may include any one of a palladium material and a nickel material, which are materials for smooth reflection of an optical signal.

In the holder 400, the edge portion of the lower surface protrudes downward, and the protruding portion of the holder 400 may be bonded to the periphery of the periphery of the substrate 100 so as to cover the opening H1. At this time, the epoxy resin can be used for bonding.

Since one surface of the substrate 100 is covered by the holder 400 including the opening H1 , the optical signal can move in the internal space between the holder 400 and the substrate 100 , and thus, different light from the outside The signal can be prevented from interfering with the optical signal.

The air outlet H2 may be formed to penetrate the peripheral portion of the substrate 100 in the vertical direction. The air outlet H2 may have an inlet located on one surface of the peripheral portion of the substrate 100 , and an outlet located on an outer surface or the other surface of the peripheral portion of the substrate 100 . The outer surface of the periphery of the substrate 100 refers to the side surface of the substrate 100 . The inlet of the air outlet H2 may be spaced downward from the lower surface of the holder 400 .

The air discharge unit H2 serves to discharge air from the space between the holder 400 and the substrate 100 to the other side of the substrate 100, for example, to the lower side when the holder 400 and the substrate 100 are bonded. do

For example, a baking process for curing the epoxy resin is performed when the substrate 100 and the holder 400 are bonded. At this time, the air in the space between the substrate 100 and the holder 400 may expand by heat. . Failure to vent this air may damage the epoxy resin. Therefore, by discharging the expanded air to the outside of the separation space through the air discharge unit H2, it is possible to stably manufacture the photo sensor shrinkage package module.

That is, the photosensor shrinkage package module forms an air outlet H2 on the substrate 100 , so that during a baking process for bonding the holder 400 and the substrate 100 , the holder 400 and the substrate 100 . The air present in between can be exhausted to the outside. On the other hand, the air discharge unit H2 is formed by a bump 700 bonded to the other surface of the substrate 100, for example, the lower surface after the baking process, or the molding unit 900 covering the lower surface of the substrate 100 after the baking process, The outlet may be closed. Of course, the outlet of the air outlet (H2) may be located on the side of the substrate 100, and in this case, an opening/closing member (not shown) may be detachably inserted and mounted at the outlet of the air outlet (H2). have.

The optical filter 500 serves to cover the opening H1 of the substrate 100 to protect the photosensor chip 100 from external foreign substances. The optical filter 500 may be positioned on the substrate 100 and firmly coupled to the periphery of the substrate 100 in an attach method using, for example, epoxy. The optical filter 500 may be formed to be at least larger than the opening H1 so as to smoothly cover the opening H1 .

The optical filter 500 may be a substrate made of a light-transmitting material, such as a glass material, to transmit an optical signal. In particular, it blocks light in an infrared wavelength band, for example, light in a wavelength range of 700 to 1200 nm, and the rest, for example, 400 It may include an absorption filter that absorbs light in the infrared wavelength band to transmit visible light in the to 650 nm wavelength band.

The optical filter 500 may include at least one of a substrate-integrated type having an IR cut-off function and a composite type in which a filter layer is formed on a transmissive substrate. For example, the substrate-integrated optical filter 500 may include a transmissive substrate formed so as to have an infrared absorbing function itself, and the composite optical filter 500 may include an infrared ray on a transmissive substrate made of a material such as glass or plastic. It may be an optical filter formed by attaching a film having an absorption function or the like, or by depositing and coating a sol gel type filter having an infrared absorption function.

Meanwhile, the optical filter 500 is not limited to the above-described absorption type filter, and any optical filter having a necessary function according to the purpose may be used. For example, a general reflection type IR filter, an IR pass filter, and an anti-reflection coating (ARC) may be used as the optical filter.

Between the substrate 100 and the photosensor chip 300 to prevent foreign substances from entering the pixel region of the photosensor chip 300 and to firmly bond the substrate 100 and the photosensor chip 300 to each other. A sealing ring 600 is provided.

The sealing ring 600 is formed to extend along the periphery of the opening H1 of the substrate 200 on the other surface, for example, the lower surface, of the periphery of the substrate 100 in a closed loop shape, for example, a square ring shape, for example, a transition liquid bonding (Transients Liquid). It is bonded to the substrate 100 and the photosensor chip 300 by the method of phase bonding), and thus the bonding structure of the substrate 100 and the photosensor chip 300 is strong against thermal and mechanical stress and has excellent adhesive properties. have.

The bumps 700 may bond the substrate 100 and the photosensor chip 300 to the outside of the sealing ring 600 . The number and arrangement of the bumps 700 may vary. The periphery of the substrate 100 may be bonded to the periphery of the photosensor chip 300 by the bumps 700 in a flip-chip bonding method.

The above-described bumps 700 and sealing ring 600 may contain a metal material including copper (Cu), tin (Sn) and silver (Ag) as a material, for example, using sputtering or electroplating. Thus, the metal material layer may be patterned or formed on the lower surface of the peripheral portion of the substrate 100 in a patterning manner.

The solder ball 800 is a component that electrically connects the photosensor chip 300 and an external, for example, a mobile device to which a photosensor shrinkage package module is applied. A plurality of the other surfaces, that is, the lower surface of the peripheral portion, may be bonded and connected to the thin film pattern layer of the substrate 100 .

The solder ball 800 may be a solder ball formed of an alloy of tin, silver, and copper (Sn-Ag-Cu), or a core ball for an optimal pitch and high profile. ball) can be Here, the core ball refers to a solder ball having a relatively high melting point metal as a core at the center. In this case, the core may include a metal having a higher melting point than an alloy of tin, silver, and copper, and may include, for example, copper.

The molding part 900 includes a first molding part formed in an upper region of the photosensor chip 300 on the lower side of the substrate 100 and the photosensor chip 300 and the lower part of the substrate 100 on the lower side of the substrate 100 . A second molding part covering the entire surface may be included. The first and second molding parts are made of epoxy, for example, underfill resin, and the substrate 100 and the photosensor chip 300 are formed by a vacuum lamination method and an EMC (Epoxy Modling Compund) molding method. ) and may be formed to surround the entire lower portion of the substrate 100 and the photosensor chip 300 .

The manufacturing process of the photo sensor shrinkage package module according to an embodiment of the present invention is as follows. First, the substrate 100 is prepared, and the light emitting device 200 is mounted on one surface of the peripheral portion of the substrate 100 . Thereafter, the optical filter 500 is attached to cover the opening H1 of the substrate 100 . Thereafter, the protruding portion of the edge of the holder 400 is attached to the periphery of the substrate 100 . In this case, an epoxy resin is used. Thereafter, the substrate 100 to which the holder 400 is attached is baked to cure the epoxy resin. At this time, the heated air may be discharged to the outside using the air discharge unit H2. Thereafter, the solder ball 800 is mounted on the other surface of the peripheral portion of the substrate 100 , the photosensor chip 300 is bonded to each other, and the molding part 900 is formed.

Thereafter, the connector 1000 is connected to the solder ball 800 for electrical connection with the mobile device to which the photo sensor shrinkage package module is applied.

4 is an operation diagram of a photo sensor shrinkage package module according to an embodiment of the present invention.

An operation of the photo sensor shrinkage package module according to an embodiment of the present invention will be described with reference to FIG. 4 .

First, when an electrical signal for generating an optical signal is input to the photo sensor shrinkage package module through a connector and transmitted to the light emitting device 200 through the substrate 100 , the light emitting device 200 generates an optical signal.

The optical signal generated by the light emitting device 200 is irradiated to the inner space between the substrate 100 and the holder 400 , is reflected by the holder 400 , and proceeds to the photosensor chip 300 . At this time, the holder 400 blocks various different light signals from proceeding from the outside of the photo sensor shrinkage package module to the photosensor chip 300 , and the light signals from the light emitting device 200 to the photosensor chip 300 are guide you through the process

At this time, since the light emitting device 200 is located on one surface of the substrate 100 and the photosensor chip 300 is located on the other surface of the substrate 100, the structure of the photosensor shrinkage package module can be formed compactly, , by passing the optical signal through the opening H1 of the substrate 100, the distance the optical signal travels can be reduced, and the path itself the optical signal travels can be safely protected inside the photo sensor shrinkage package module. .

In particular, when the photo sensor shrinkage package module is applied to a quantum random number generator that generates a quantum random number using an optical signal, by reducing the movement distance of the optical signal and protecting the movement path of the optical signal from the outside, It is possible to prevent noise during movement or to prevent optical signals from being interfered with by different external light signals, thereby generating high-quality quantum random numbers.

The photosensor chip 300 receives an optical signal to generate an electrical signal, and the generated electrical signal is transmitted to a converter and a post-processing module of a mobile device (not shown) through the connector 40, and is used for generating quantum random numbers. can be used

As described above, the photosensor shrinkage package module according to an embodiment of the present invention can reduce the overall structure and size of the light emitting device and the photosensor chip by modularizing the light emitting device and the photosensor chip, and within the internal space surrounded by the holder and the substrate. When the light emitting element transmits a light signal to the photosensor chip, it is possible to block different light signals from being transmitted to the photosensor chip. Accordingly, a high-quality quantum random number may be generated in a mobile device having a photo sensor shrinkage package module.

In addition, the photo sensor shrinkage package module according to an embodiment of the present invention can prevent damage to the joint between the holder and the substrate during manufacturing by discharging the heated air between the holder and the substrate by using the air exhaust unit during the manufacturing process. can

The above embodiments of the present invention are intended to illustrate the present invention, not to limit the present invention. It should be noted that the configurations and methods disclosed in the above embodiments of the present invention may be combined and modified in various forms by combining or intersecting with each other, and modifications thereof may also be considered as the scope of the present invention. That is, the present invention will be embodied in a variety of different forms within the scope of the claims and equivalents thereof, and those skilled in the art to which the present invention pertains can implement various embodiments within the scope of the technical spirit of the present invention. will be able to understand

100: substrate
200: light emitting element
300: photosensor chip
400: holder
500: optical filter
600: sealing ring
700: bump
800: solder ball
900: molding unit
1000: connector
H1: opening
H2: air outlet

Claims (13)

a substrate having one surface, the other surface opposite to the one surface, and an opening penetrating from the one surface to the other surface;
a light emitting device bonded to one surface of the substrate and transmitting an optical signal;
a photosensor chip that converts an optical signal into an electrical signal, has a size larger than the opening, and is bonded to the other surface of the substrate so that a periphery thereof overlaps with a periphery of the substrate surrounding the opening;
and a holder bonded to one surface of the substrate so as to cover the light emitting element and the opening in order to reflect an optical signal toward the photosensor chip,
forming a movement path of an optical signal in an internal space surrounded by the photosensor chip, the opening, one surface of the substrate, and the holder, and blocked from the outside;
A photo sensor shrinkage package module in which the movement path connects the light emitting device and a pixel region of the photosensor chip. delete The method according to claim 1,
The photosensor shrinkage package module comprising a; an optical filter bonded to the periphery to cover the opening between the periphery and the holder and disposed to face the photosensor chip. The method according to claim 1,
The photosensor chip includes a QRNG photosensor chip,
The substrate is a photo sensor shrinkage package module including a printed circuit board. 5. The method according to claim 4,
The thermal expansion coefficient of the printed circuit board is in ^{the range of 1.2 × 10 -6} to 3.2 × 10 ^-6 / ℃ photo sensor shrinkage package module. 5. The method according to claim 4,
The thickness of the printed circuit board is a photo sensor shrinkage package module in the range of 0.04 to 0.15 mm. The method according to claim 1,
The holder is a photo sensor shrinkage package module in which a coating layer of a metal material is formed on at least a lower surface. 8. The method of claim 7,
The metal material is a photo sensor shrinkage package module including any one of a palladium material and a nickel material. 4. The method according to claim 3,
The optical filter is a photo sensor shrinkage package module including an absorption filter that absorbs light in the infrared wavelength band and transmits the rest. The method according to claim 1,
The photosensor shrinkage package module including a; formed to pass through the peripheral portion and communicating with an internal space between the substrate and the holder. 11. The method of claim 10,
The air discharge unit has an inlet located on one surface of the substrate, and an outlet located on a side surface or the other surface of the substrate. The method according to claim 1,
a sealing ring and a bump bonding the substrate and the photosensor chip to each other;
A photo sensor shrinkage package module comprising a; a molding part covering the other surface of the substrate and the photosensor chip. 13. The method of claim 12,
The sealing ring includes a metal material, is patterned in a closed loop shape along the periphery of the opening, and is bonded to the substrate and the photosensor chip by a transients liquid phase bonding method,
The bumps are arranged to be spaced apart from the outside of the sealing ring along the circumference of the sealing ring, and a photo sensor shrinkage package module for bonding the substrate to the photosensor chip by a flip chip bonding method.

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