KR102309511B1 - Liquid crystal display device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a liquid crystal display device having high luminance, light weight and thin shape.
A feature of the present invention is that the FPCB of the LED assembly is formed so that some regions have a double-layer structure through the jumping FPCB, so that a plurality of LEDs are mounted at regular intervals without increasing the area of the FPCB or forming the FPCB as a multi-layer metal layer. can do.
Accordingly, it is possible to realize a liquid crystal display device having a high luminance and a light weight and thin liquid crystal display device, and also, it is possible to reduce the process cost, thereby improving the efficiency of the process.

Description

Liquid crystal display device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a liquid crystal display device having high luminance, light weight and thin shape.

A liquid crystal display device (LCD), which is advantageous for displaying moving images and has a large contrast ratio, is actively used in TVs and monitors, etc. shows the principle of image realization by

Such a liquid crystal display device consists of a liquid crystal panel bonded together with a liquid crystal layer interposed between two parallel substrates as an essential component, and a difference in transmittance is realized by changing the arrangement direction of liquid crystal molecules with an electric field in the liquid crystal panel. do.

However, since the liquid crystal panel does not have a self-luminous element, a separate light source is required to display the difference in transmittance as an image.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.

As shown, a general liquid crystal display device 1 includes a liquid crystal panel 10 , a backlight unit 20 , a guide panel 30 , a cover bottom 50 , and a top cover 40 .

The liquid crystal panel 10 is a part that plays a key role in image expression and is composed of first and second substrates 12 and 14 bonded face to face with a liquid crystal layer interposed therebetween.

A backlight unit 20 is provided behind the liquid crystal panel 10 .

The backlight unit 20 includes a light source arranged along the longitudinal direction of at least one edge of the guide panel 30 , a white or silver reflecting plate 25 seated on the cover bottom 50 , and on the reflecting plate 25 . It includes a light guide plate 23 to be seated and an optical sheet 21 interposed thereon.

The liquid crystal panel 10 and the backlight unit 20 have a top cover 40 surrounding the upper edge of the liquid crystal panel 10 and the backlight unit 20 in a state in which the edge is surrounded by a guide panel 30 having a rectangular frame shape. The cover bottom 50 covering the rear surface is combined in front and rear, respectively, and is integrated.

In addition, unexplained reference numerals 19a and 19b denote polarizing plates attached to both surfaces of the liquid crystal panel 10 to control the polarization direction of light, respectively.

At this time, the light sources of the backlight unit 20 include a Cold Cathode Fluorescent Lamp (CCFL), an External Electrode Fluorescentt Lamp, and a Light Emitting Diode (LED, hereinafter referred to as LED). use etc.

In particular, the LED 29a has features such as small size, low power consumption, and high reliability, and is widely used as a light source for display.

The LED 29a is mounted on an LED FPCB (flexible printed circuit board: 29b, hereinafter referred to as FPCB) to form an LED assembly 29, and the LED assembly 29 is fixed in position by means of adhesion, and a plurality of LEDs. The light emitted from the 29a is made to face the light incident surface of the light guide plate 23 .

Accordingly, the light emitted from each of the LEDs 29a enters the light incident surface of the light guide plate 23 and is then refracted toward the liquid crystal panel 10 inside the optical sheet ( 21), it is processed into a more uniform high-quality surface light source and supplied to the liquid crystal panel 10 .

On the other hand, a plurality of wires (not shown) for applying a driving voltage to the plurality of LEDs 29a are formed on the FPCB 29b of the LED assembly 29, and a high-brightness liquid crystal display device 1 that is recently required A plurality of LEDs 29a are required to provide the FPCB 29b, and thus a plurality of wires (not shown) to be connected to the plurality of LEDs 29a are required on the FPCB 29b.

In order to configure a plurality of wirings (not shown) on the FPCB 29b, the area of the FPCB 29b must be enlarged or a metal layer on which wirings (not shown) are formed must be formed in a multi-layered structure, which is recently required with high brightness. It is difficult to implement the light and thin liquid crystal display device (1).

SUMMARY OF THE INVENTION The present invention is to solve the above problems, and a first object of the present invention is to provide a light-weight and thin liquid crystal display device that implements high luminance.

In addition, a second object of the present invention is to provide a liquid crystal display device with reduced process costs.

In order to achieve the object as described above, the present invention provides a liquid crystal panel and a first liquid crystal panel positioned under the liquid crystal panel, a plurality of LEDs are mounted, and a first base film divided into a first base film and an upper portion of the first base film and an LED assembly having an LED FPCB provided with a first metal layer including a second metal wire and positioned on the LED FPCB, a second base film, and the first and second metal wires on the second base film A liquid crystal display device comprising a jumping FPCB having a second metal layer connecting the FPCBs, wherein the same first signal is applied to the first and second metal wires.

Here, the second metal layer includes first and second dummy pads, and a connection wire connecting the first and second dummy pads, and one end of each of the first and second metal wires has the first and second dummy pads. First and second split pads respectively connected to the second dummy pad by soldering are provided, and a first cover layer exposing the first and second split pads is provided on the first metal layer. , a second cover layer exposing the first and second dummy pads is provided on the second metal layer.

In addition, a third metal wire to which a second signal different from the first signal is applied is positioned between the first and second metal wires, and the jumping FPCB has a multi-layered second metal layer.

In addition, an insulating tape is positioned above the jumping FPCB, the liquid crystal panel and the LED assembly are modularized through a cover bottom, and the jumping FPCB is positioned to correspond to a pull-out groove provided in the cover bottom.

As described above, according to the present invention, by forming the FPCB of the LED assembly so that some regions have a double-layer structure through the jumping FPCB, the area of the FPCB is widened, or a plurality of LEDs are uniformly formed even if the FPCB is not formed as a multi-layer metal layer. There is an effect that can be mounted spaced apart.

Accordingly, there is an effect of realizing a liquid crystal display of high luminance while being able to implement a light-weight and thin liquid crystal display, and also, it is possible to reduce the process cost, thereby improving the efficiency of the process.

1 is a cross-sectional view of a liquid crystal display device using a general LED as a light source.
2 is an exploded perspective view schematically illustrating a liquid crystal display according to an embodiment of the present invention;
Figure 3a is a perspective view schematically showing an LED assembly according to an embodiment of the present invention.
Fig. 3B is a plan view of Fig. 3A;
Fig. 3c is a cross-sectional view of region A of Fig. 3b;
Figures 4 and 5 are schematic cross-sectional views of a modularized part of Figure 2;

Hereinafter, an embodiment according to the present invention will be described in detail with reference to the drawings.

2 is an exploded perspective view schematically illustrating a liquid crystal display according to an exemplary embodiment of the present invention.

As shown, the liquid crystal display device 100 includes a liquid crystal panel 110 and a backlight unit 120 , and a guide panel 130 and a cover bottom 150 for modularizing the liquid crystal panel 110 and the backlight unit 120 . , and a top cover 140 .

Looking at each of these in more detail, the liquid crystal panel 110 is a part that plays a key role in image expression, and includes the first substrate 112 and the second substrate 114 bonded to each other with the liquid crystal layer interposed therebetween. include

At this time, although not shown in the drawing under the premise of the active matrix method, a plurality of gate lines and data lines intersect to define a pixel on the inner surface of the first substrate 112, which is usually called a lower substrate or an array substrate, A thin film transistor (TFT) is provided at each intersection and is connected to the transparent pixel electrode formed in each pixel in a one-to-one correspondence.

And on the inner surface of the second substrate 114 called an upper substrate or a color filter substrate, red (R), green (G), and blue (B) color filters as an example corresponding to each pixel, and these A black matrix is provided around each of the gate lines, data lines, and non-display elements such as thin film transistors. In addition, a transparent common electrode covering them is provided.

In addition, polarizing plates 119a and 119b (refer to FIG. 4 ) for selectively transmitting only specific light are attached to the outer surfaces of the first and second substrates 112 and 114 , respectively.

At least along one edge of the liquid crystal panel 110, the printed circuit board 117 is connected via a connecting member 116 such as a flexible circuit board or a tape carrier package (TCP), so that in the module process, the guide panel ( 130), or the cover bottom 150 is in close contact with the back side.

In the liquid crystal panel 110, when the thin film transistor selected for each gate line is turned on by the on/off signal of the gate driving circuit, the signal voltage of the data driving circuit is transmitted to the corresponding pixel electrode through the data line, The arrangement direction of liquid crystal molecules is changed by the electric field between the pixel electrode and the common electrode, indicating a difference in transmittance.

In addition, the liquid crystal display device 100 according to the present invention is provided with a backlight unit 120 that supplies light from the rear surface of the liquid crystal panel 110 so that the difference in transmittance is expressed to the outside.

The backlight unit 120 includes an LED assembly 200, a white or silver reflective plate 125, a light guide plate 123 seated on the reflective plate 125, and an optical sheet 121 interposed thereon. .

The LED assembly 200 is positioned on one side of the light guide plate 123 to face the light incident surface of the light guide plate 123 , and the LED assembly 200 includes a plurality of LEDs 210 and a plurality of LEDs 210 at regular intervals. It includes an FPCB 220 that is mounted to be spaced apart.

And although not shown in the drawing, the liquid crystal display 100 of the present invention is equipped with an LED driving circuit 160 (refer to FIG. 4 ) for controlling on/off of the LED assembly 200, and the LED driving circuit The furnace 160 (refer to FIG. 4 ) is usually in close contact with the back surface of the cover bottom 150 to minimize the overall size of the liquid crystal display device 100 .

Accordingly, a part of the FPCB 220 is on one side of the FPCB 220 so that the plurality of LEDs 210 can be electrically connected to the LED driving circuit 160 (see FIG. 4 ) that is in close contact with the back surface of the cover bottom 150 . An extended FPCB for cable (230, see Fig. 3a) is provided, the LED assembly 200 uses the bending characteristic of the FPCB for cable (230, see Fig. 3a), the LED in close contact with the back surface of the cover bottom (150) It is connected to the driving circuit 160 (refer to FIG. 4).

Here, the FPCB 220 of the LED assembly 200 according to the embodiment of the present invention is characterized in that a portion of the region is formed of a double layer structure through the jumping FPCB 240 (see FIG. 3A ). Although the LED assembly 200 according to the example is mounted on the FPCB 220 with a plurality of LEDs 210 spaced apart from each other by a predetermined interval, the area of the FPCB 220 is not widened as a whole and a single metal layer 223, see FIG. 3c ) As a result, it is possible to implement the liquid crystal display device 100 of high luminance while also implementing the liquid crystal display device 100 having a light weight and a thin shape.

In addition, it is possible to reduce the process cost, so that the efficiency of the process can be improved, which will be described in more detail later.

The light guide plate 123 to which the light emitted from the plurality of LEDs 210 is incident is spread evenly over a wide area of the light guide plate 123 while the light incident from the LEDs 210 travels through the light guide plate 123 by total reflection several times. A surface light source is provided to the liquid crystal panel 110 .

The light guide plate 123 may include a pattern having a specific shape on the rear surface to supply a uniform surface light source.

Here, the pattern may be variously configured such as an elliptical pattern, a polygonal pattern, a hologram pattern, etc. in order to guide the light incident into the light guide plate 123 . The pattern is formed on the lower surface of the light guide plate 123 by a printing method or an injection method.

The reflection plate 125 is located on the rear surface of the light guide plate 123 , and reflects the light passing through the rear surface of the light guide plate 123 toward the liquid crystal panel 110 to improve the luminance of the light.

The optical sheet 121 on the light guide plate 123 includes a diffusion sheet and at least one light collecting sheet, and by diffusing or condensing the light passing through the light guide plate 123 , a more uniform surface light source is provided to the liquid crystal panel 110 . to get hired

The liquid crystal panel 110 and the backlight unit 120 are modularized through a top cover 140 , a guide panel 130 , and a cover bottom 150 , and the top cover 140 is an upper surface and a side surface of the liquid crystal panel 110 . It has a rectangular frame shape in which the cross section is bent in a “L” shape to cover the edge, and the front of the top cover 140 is opened to display an image implemented in the liquid crystal panel 110 .

In addition, the cover bottom 150, on which the liquid crystal panel 110 and the backlight unit 120 are seated, which is the basis for assembling the entire liquid crystal display device, is formed in a rectangular plate shape having an edge portion bent vertically.

In addition, the guide panel 130 in the shape of a square frame that is seated on the cover bottom 150 and surrounds the edges of the liquid crystal panel 110 and the backlight unit 120 includes the top cover 140 and the cover bottom 150 and the top cover 140 . are combined

At this time, the top cover 140 is also referred to as a case top or top case, the guide panel 130 is also referred to as a support main or main support, or a mold frame, and the cover bottom 150 is also referred to as a bottom cover or a lower cover. also lose

Meanwhile, in the liquid crystal display device 100 having the above-described structure, the top cover 140 and/or the cover bottom 150 may be deleted in order to realize a light and thin liquid crystal display device that has been recently requested. By removing the top cover 140 and/or the cover bottom 150, the liquid crystal display device 100 can be made lightweight and thin, and has the effect of simplifying the process.

In addition, due to the deletion of the top cover 140 and/or the cover bottom 150 made of a metal material, it is possible to reduce the process cost.

The liquid crystal display device 100 according to the above-described embodiment of the present invention forms the FPCB 220 of the LED assembly 200 so that a portion of the FPCB 220 has a double-layer structure through the jumping FPCB 240. Even if the area is not increased or the FPCB 220 is not formed with the multi-layered metal layer 223 (refer to FIG. 3C ), the plurality of LEDs 210 can be mounted at a predetermined interval.

Therefore, it is possible to implement the liquid crystal display device 100 of high luminance while realizing the liquid crystal display device 100 having a light weight and a thin shape, and also, it is possible to reduce the process cost, thereby improving the efficiency of the process.

3A is a perspective view schematically illustrating an LED assembly according to an embodiment of the present invention, and FIG. 3B is a plan view of FIG. 3A .

And, FIG. 3C is a cross-sectional view of area A of FIG. 3B.

As shown, the LED assembly 200 includes a plurality of LEDs 210 and an FPCB 220 in which a plurality of LEDs 210 are spaced apart from each other by a surface mount technology (SMT). do.

A plurality of LEDs 210 emit light having colors of red (R), green (G), and blue (B), respectively, and by turning on these plurality of RGB LEDs 210 at once, white light by color mixing can be realized. have.

Alternatively, by using the LED 210 configured with an LED chip (not shown) that emits all RGB colors, white light may be implemented in each LED 210, or the LED 210 including a chip emitting white. It is also possible to implement each of the complete white light.

In this case, the plurality of LEDs 210 use a blue LED 210 including a blue LED chip having excellent luminous efficiency and luminance to improve luminous efficiency and luminance, and 'cerium-doped yttrium aluminum garnet (YAG) as a phosphor. :Ce)', that is, a blue LED 210 made of a yellow phosphor may be used.

The blue light emitted from the blue LED 210 passes through the phosphor and is mixed with the yellow light emitted by the phosphor to realize white light.

In addition, the FPCB 220 includes a first base film 221 having a flexible characteristic and a plurality of metal wires 223a, 223b, and 223c formed by patterning a conductive material on the first base film 221 . The first metal layer 223 and the first cover layer 225 are formed.

The first base film 221 serves to support the first metal layer 223 and the plurality of LEDs 210 by mounting as an upper layer thereof.

The first base film 221 is formed in the form of a film by accommodating a resin-based material including polyimide or polyester.

In addition, a first metal layer 223 including a plurality of metal wires 223a , 223b and 223c formed by patterning a conductive material is formed on the first base film 221 , and the first metal layer 223 is formed. A first cover layer 225 as an organic or inorganic insulating material for protecting the first metal layer 223 is formed on the upper portion except for a region where the LED 210 is mounted.

The plurality of LEDs 210 mounted on the FPCB 220 are respectively connected in series or parallel through the plurality of metal wires 223a, 223b, and 223c of the first metal layer 223 to receive power.

On the other hand, in the LED assembly 200 according to the embodiment of the present invention, a plurality of LEDs 210 are mounted on the FPCB 220 to provide a high-brightness liquid crystal display (100 in FIG. 2 ), in which case the FPCB 220 ) is a single-sided FPCB in which the first metal layer 223 on which a plurality of metal wirings 223a, 223b, and 223c are formed is formed as a single layer, and has a thinner thickness than the FPCB in which the first metal layer 223 is formed in multiple layers. , and also has low cost characteristics.

In addition, the width of the FPCB 220 is also not widened, so that a light and thin liquid crystal display device ( 100 in FIG. 2 ) can be implemented.

This is because the jumping FPCB 240 is positioned in a partial area of the FPCB 220 to form a double layer structure.

Looking at this in more detail, in order to implement a high-brightness liquid crystal display device ( 100 in FIG. 2 ), a plurality of LEDs 210 must be mounted on the FPCB 220 . At this time, the plurality of LEDs mounted on the FPCB 220 . In order to connect the 210 in series or in parallel, the plurality of metal wires 223a, 223b, and 223c must be formed so as not to overlap each other.

That is, the FPCB 220 requires a region where the plurality of metal wires 223a , 223b , and 223c do not overlap with each other together with the region where the plurality of LEDs 210 are to be mounted, so the FPCB 220 has a large area. The first metal layer 223 on which a plurality of metal wires 223a, 223b, and 223c are formed should be formed to have 2 of 100) is difficult to implement.

Here, the LED assembly 200 according to the embodiment of the present invention corresponds to a partial region of the FPCB 220, more precisely, a region where a plurality of metal wirings 223a, 223b, 223c are to be formed to overlap each other. By further providing the FPCB 240 to form the FPCB 220 in a double-layer structure, a plurality of metal wires 223a, 223b, 223c can be formed so as not to overlap each other, and thus a light-weight and thin liquid crystal display device (FIG. 2 of 100) can be implemented.

Here, the jumping FPCB 240 includes a second base film 241 having a flexible characteristic, a plurality of dummy pads 243a and 243b formed by patterning a conductive material on the second base film 241, and a plurality of and a second metal layer 243 including connection wirings 243c connecting the dummy pads 243a and 243b.

A second cover layer 245 exposing only the plurality of dummy pads 243a and 243b may be positioned on the second metal layer 243 .

The jumping FPCB 240 serves to energize the separated metal wires 223a and 223b.

That is, as shown in FIG. 3b , when a plurality of LEDs 210 are mounted on the FPCB 220 spaced apart from each other in a two-chain structure, at least four first and second anode pads on the FPCB 230 for cables. 227a and 227b and the first and second negative electrode pads 227c and 227d, the first and second positive electrode pads 227a and 227b, and the first positive electrode extending from the first and second negative electrode pads 227c and 227d Metal wires 223a and 223b and second anode metal wires 223c and first and second cathode metal wires 223d and 223e should be provided, in which case the first anode metal wires 223a and 223b and the second anode metal wires 223a and 223b A region A to be formed in which the metal wirings 223c overlap each other is generated.

Here, the LED assembly 220 according to the embodiment of the present invention corresponds to the region A to be formed overlapping each other, and corresponds to the first anode metal wiring 223a, 223b and the second anode metal wiring 223c. The first anode metal wires 223a and 223b are separated into a 1-1 anode metal wire 223a and a 1-2 anode metal wire 223b, and the separated 1-1 anode metal wire 223a and the first anode metal wire 223b are separated. -2 First and second dividing pads 228a and 228b are formed on each end of the anode metal wiring 223b.

Then, as shown in FIG. 3c , the jumping FPCB 240 provided with the first and second dummy pads 243a and 243b electrically connected to each other through the connection wiring 243c is connected to the first anode of the FPCB 220 . The metal wirings 223a and 223b and the second anode metal wiring 223c overlap each other and are positioned on the region A to be formed. In this case, the first cover layer 225 of the FPCB 220 includes the first and second A cover hole 225a exposing the split pads 228a and 228b is provided, so that the first and second dummy pads 243a and 243b and the first and second split pads 228a and 228b are subjected to soldering. electrically connected to each other by

Accordingly, the separated 1-1 anode metal wiring 223a and 1-2 anode metal wiring 223b are connected to the first and second dummy pads 243a and 243b of the jumping FPCB 240 and the connection wiring 243c. A signal transmitted from the first anode pad 227a by being energized with each other through ) and the signal transmitted to the first dummy pad 243a through the second dummy pad 243b and the second division pad 228b through the connection wiring 243c, the first and second anode metal wirings 223b ), and is transmitted to the plurality of LEDs 210 connected to the first anode metal wires 223a and 223b.

Through this, the LED assembly 200 according to the embodiment of the present invention implements a high-brightness liquid crystal display device ( 100 in FIG. 2 ) by mounting a plurality of LEDs 210 on the FPCB 220 , while the FPCB 220 . Since it is not necessary to increase the area of the FPCB 220 or to form the first metal layer 223 of the FPCB 220 in multiple layers, a light-weight and thin liquid crystal display device ( 100 in FIG. 2 ) can be implemented.

In addition, compared to the FPCB 220 in which the first metal layer 223 is formed in multiple layers, the process cost can be reduced, and thus the efficiency of the process can be improved.

Here, in the present invention, the first anode metal wires 223a and 223b provided in the FPCB 240 for cables are separated, and the separated first anode metal wires 223a and 223b are energized through the jumping FPCB 240 . Although the configuration has been described and illustrated, the jumping FPCB 240 is applicable to any region where a plurality of metal wires 223a , 223b , and 223c provided on the FPCB 220 to be formed overlapping each other are formed.

In addition, the jumping FPCB 240 may be provided with a plurality of connection wirings 243c and a plurality of dummy patterns 243a and 243b. have.

In addition, this jumping FPCB 240 can be formed together with the FPCB 220 on a part of the ledger FPCB in the process of forming the FPCB 220, so a separate process for forming the jumping FPCB 240 is required. It can reduce material cost and improve process efficiency.

4 and 5 are cross-sectional views schematically illustrating a modularized part of FIG. 2 .

As shown, an optical sheet ( 121) are stacked to form a backlight unit ( 120 in FIG. 2 ).

In addition, the first and second substrates 112 and 114 and the liquid crystal panel 110 having a liquid crystal layer (not shown) interposed therebetween are positioned on the backlight unit (120 in FIG. 2 ), and the first and second Polarizing plates 119a and 119b that selectively transmit only specific light are attached to the outer surfaces of the substrates 112 and 114 .

The backlight unit (120 in FIG. 2 ) and the liquid crystal panel 110 are surrounded by an edge by the guide panel 130 , and the cover bottom 150 is coupled to the rear surface thereof, and the upper edge and side surfaces of the liquid crystal panel 110 . The top cover 140 surrounding the , is coupled to the guide panel 130 and the cover bottom 150 .

Here, the LED driving circuit 160 for controlling the on/off of the LED assembly 200 is located in close contact with the back surface of the cover bottom 150, and the FPCB 220 of the LED assembly 200 has The FPCB 230 for the cable is extended, and the LED assembly 200 is connected to the LED driving circuit 160 in close contact with the rear surface of the cover bottom 150 by using the bending characteristic of the FPCB 230 for the cable.

At this time, in order to connect the FPCB 230 for cables extending from the FPCB 220 of the LED assembly 200 and the LED driving circuit 160 in close contact with the back surface of the cover bottom 150, the cover bottom 150 has A lead-out groove 151 for exposing the FPCB 230 for a cable to the rear surface of the cover bottom 150 is provided.

On the other hand, in the liquid crystal display device 100 according to the embodiment of the present invention, a plurality of metal wires (223a, 223b, 223c in FIG. 3C ) of the FPCB 220 of the LED assembly 200 are formed by overlapping each other ( FIG. 3C ). By placing the jumping FPCB 240 in A) of 3b by soldering, the first and second split pads (228a, 228b in FIG. 3c) and the jumping FPCB of a plurality of metal wires (223a, 223b, 223c in FIG. 3c) Soldering portions of the first and second dummy pads ( 243a and 243b in FIG. 3C ) of 240 may contact the back surface of the cover bottom 150 , thereby causing a short circuit.

In order to prevent this, as shown in FIG. 4, the insulating tape 250 is further positioned above the jumping FPCB 240, or the lead-out groove 151 of the cover bottom 150 is enlarged as shown in FIG. Forming so that the soldering portions of the first and second split pads (228a and 228b in FIG. 3C) and the first and second dummy pads (243a, 243b in FIG. 3C) do not come into contact with the back surface of the cover bottom 150 by forming desirable.

The insulating tape 250 may be made of polyolefin-based plastics such as polyethylene (PE) and polypropylene (PP), polyester-based plastics such as PET, and polyvinyl-based plastics such as polyvinyl chloride (PVC).

As described above, the liquid crystal display 100 according to the embodiment of the present invention forms the FPCB 220 of the LED assembly 200 so that some regions have a double layer structure through the jumping FPCB 240, so that the FPCB ( 220) or the FPCB 220 may be mounted with a predetermined distance apart from each other even if the multilayer metal layer 223 is not formed.

Therefore, it is possible to implement the liquid crystal display device 100 of high luminance while realizing the liquid crystal display device 100 having a light weight and a thin shape, and furthermore, it is possible to reduce the process cost, thereby improving the efficiency of the process.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

221: first base film
223: first metal layer (223a, 223b: first anode metal wiring, 223c: second anode metal wiring)
225: first cover layer
228a, 228b: first and second split pads
241: second base film
243: second metal layer (243a, 243b: first and second dummy pads, 243c: connection wiring)
245: second cover layer

Claims (7)

a liquid crystal panel;
An LED FPCB positioned under the liquid crystal panel, on which a plurality of LEDs are mounted, and provided with a first base film and a first metal layer including first and second metal wirings divided from each other on the first base film. an LED assembly having a;
A jumping FPCB positioned on the LED FPCB and having a second base film and a second metal layer connecting the first and second metal wires on the second base film.
Including, the same first signal is applied to the first and second metal wires,
The liquid crystal panel and the LED assembly are modularized through a cover bottom,
The jumping FPCB is positioned to correspond to a pull-out groove provided in the cover bottom.
The method of claim 1,
The second metal layer includes first and second dummy pads, and a connection wire connecting the first and second dummy pads, and one end of each of the first and second metal wires has the first and second dummy pads. A liquid crystal display device comprising first and second split pads respectively connected to the dummy pad by soldering.
3. The method of claim 2,
A first cover layer exposing the first and second split pads is provided on the first metal layer, and a second cover layer exposing the first and second dummy pads is provided on the second metal layer. liquid crystal display device.
The method of claim 1,
A third metal wiring to which a second signal different from the first signal is applied is positioned between the first and second metal wirings.
The method of claim 1,
The jumping FPCB is a liquid crystal display device comprising a multi-layered second metal layer.
The method of claim 1,
An insulating tape is positioned above the jumping FPCB.
The method of claim 1,
The LED FPCB and the jumping FPCB have the same layer structure as each other,
The first and second base films are made of the same material as each other,
The first and second metal layers are made of the same material as each other.

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