KR102290611B1 - Contact origin detection device of cleaning brush for wafer and its origin detection method - Google Patents

Abstract

The present invention relates to an apparatus for detecting the origin of a contact point of a cleaning brush with respect to a wafer and a method for detecting the origin thereof, and more particularly, to a contact of a cleaning brush with a wafer for improving cleaning efficiency without damaging the surface of the wafer. It relates to an origin detecting apparatus and an origin detecting method thereof. The configuration of the present invention is provided on the upper portion of the wafer, the upper brush portion provided to clean the upper surface of the wafer; a lower brush unit provided under the wafer to clean a lower surface of the wafer; a sensor unit provided to measure the vibration value of the wafer; and a calculator provided to determine whether the wafer is in contact with the upper brush unit and the lower brush unit using the vibration value measured by the sensor unit. provide the device.

Description

Contact origin detection device for cleaning brush on wafer and origin detection method thereof

The present invention relates to an apparatus for detecting the origin of a contact point of a cleaning brush with respect to a wafer and a method for detecting the origin thereof, and more particularly, to a contact of a cleaning brush with a wafer for improving cleaning efficiency without damaging the surface of the wafer. It relates to an origin detecting apparatus and an origin detecting method thereof.

The main contaminants generated on the silicon substrate in the current semiconductor manufacturing process are particles, organic, metal contaminants, and natural oxide films, which have a great influence on the yield and quality of chips. It can be removed by washing.

The cleaning process uses a large amount of chemical solution, which causes damage to the wafer and raises environmental pollution issues. PVA Brush that minimizes chemical elements and strengthens physical and mechanical elements to easily remove contaminants without damaging the surface -Scrubbing and Megasonic processes stand out.

In particular, the CMP process technology is a core technology that performs 15 to 20 times during the semiconductor device manufacturing process, and as a process for removing abrasive particles after CMP, a Post-CMP cleaning process using the principle of mechanical removal must be performed.

This Post-CMP cleaning technology has a wide range of applications such as LCD glass, LED substrates, and compound semiconductors as well as in the semiconductor field, and it is a process technology with a large ripple effect as its application range is wide in various electrical, electronic and optical fields to secure reliability. .

Specifically, the post-CMP cleaning technique is a process of minimizing contaminants on the wafer surface during a semiconductor process in order to obtain a high level of yield, and occupies more than 30% of the process of the semiconductor process.

In particular, the CMP process using nanometer-sized abrasive particles must be followed by a perfect cleaning process (Post-CMP Cleaning). it is very difficult

Therefore, it is necessary to apply a continuous step-by-step cleaning method that removes strongly adsorbed particles and organic matter by a chemical mechanical brush cleaning method in a multi-step station after the CMP process and maximizes cleaning efficiency using a Megasonic device.

However, in the conventional brush cleaning method, there is a problem in that the brush is too deeply attached to damage the wafer, or the cleaning efficiency is lowered because the contact is not made properly.

Therefore, in order to maximize cleaning efficiency while not damaging the surface of the wafer, there is a need for a contact origin detection and contact depth detection technology of a cleaning brush.

Korea Patent Publication No. 10-2015-0084247

An object of the present invention to solve the above problems is to provide an apparatus for detecting the origin of a contact point of a cleaning brush on a wafer and a method for detecting the origin thereof for improving cleaning efficiency without damaging the surface of the wafer.

The technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

The configuration of the present invention for achieving the above object is provided on the upper portion of the upper brush provided to clean the upper surface of the wafer; a lower brush unit provided under the wafer to clean a lower surface of the wafer; a sensor unit provided to measure the vibration value of the wafer; and a calculator provided to determine whether the wafer is in contact with the upper brush unit and the lower brush unit using the vibration value measured by the sensor unit. provide the device.

In an embodiment of the present invention, the calculator may include: an amplitude module provided to detect an amplitude according to a vibration frequency using the vibration value measured by the sensor unit; and when a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper brush part and the lower brush part come into contact with the wafer, the positions of the upper brush part and the lower brush part are calculated as the contact origin. It may be characterized in that it includes a calculation module.

(여기서, fc는 브러쉬 접촉 주파수, B는 브러쉬 회전수(rpm), N은 브러쉬 반경방향의 돌기 수) 상기 수학식에 의해 산출된 것을 특징으로 할 수 있다.In an embodiment of the present invention, the brush contact frequency is

(here, fc is the brush contact frequency, B is the brush rotation speed (rpm), N is the number of projections in the radial direction of the brush) It may be characterized in that it is calculated by the above equation.

In an embodiment of the present invention, the upper brush portion, the upper brush provided in the form of a roller; an upper protrusion formed on an outer peripheral surface of the upper brush; and an upper brush holder provided to support and rotate the upper brush, wherein the upper projections are arranged at equal intervals.

In an embodiment of the present invention, the lower brush unit, a lower brush provided in the form of a roller; a lower protrusion formed on an outer circumferential surface of the lower brush; and a lower brush holder provided to support and rotate the lower brush, wherein the lower protrusions are arranged at equal intervals.

In an embodiment of the present invention, a holder portion provided on both sides of the wafer and provided to rotate the wafer; and a holder support part provided under the holder part to support and rotate the holder part.

In an embodiment of the present invention, the holder support portion is formed to extend toward the lower portion of the holder portion, the rotation rod provided to rotate the holder portion; a holder cover provided to accommodate the rotating rod therein; a vibration transmission body provided between the rotating rod and the holder cover; and a motor for providing power to the rotating rod to rotate the rotating rod.

In an embodiment of the present invention, the sensor unit is provided on the vibration transmitting body, and the vibration transmitting body is provided to transmit the vibration transmitted through the wafer, the holder unit, and the rotating rod to the sensor unit. have.

The configuration of the present invention for achieving the above object is a contact origin detection method using a contact origin detection apparatus of a cleaning brush for a wafer, the step of a) bringing the upper brush part and the lower brush part closer to the wafer ; b) measuring a vibration value transmitted from the wafer by the sensor unit while the upper brush unit and the lower brush unit come close to the wafer; c) providing the measured vibration value to the calculator; and d) calculating the origin of contact by using the provided vibration value.

In an embodiment of the present invention, the step d) includes: d1) calculating an amplitude according to a vibration frequency from the provided vibration value; and d2) when a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper brush unit and the lower brush unit come into contact with the wafer, the positions of the upper and lower brush units are calculated as the contact origin. It may be characterized in that it comprises the step of

According to the effect of the present invention according to the above configuration, it is possible to have the optimum cleaning efficiency without damaging the wafer by accurately detecting the position and depth where the upper brush part and the lower brush part contact the wafer in real time.

It should be understood that the effects of the present invention are not limited to the above-described effects, and include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

1 is an exemplary view of an apparatus for detecting a contact origin of a cleaning brush for a wafer according to an embodiment of the present invention.
Figure 2 is an exemplary view showing the inside of the holder support according to an embodiment of the present invention.
3 is an exemplary view showing a contact depth according to an embodiment of the present invention.
4 is a graph showing frictional force and cleaning efficiency according to a contact depth according to an embodiment of the present invention.
5 is a flowchart of a method of detecting an origin of contact of an apparatus for detecting an origin of contact of a cleaning brush for a wafer according to an embodiment of the present invention.
6 is a flowchart of a step of calculating a contact origin using a provided vibration value according to an embodiment of the present invention.
7 is a graph showing the amplitude according to whether the upper brush part and the lower brush part contact the wafer according to an embodiment of the present invention.
8 is a flowchart of a contact depth detection method of an apparatus for detecting a contact depth of a cleaning brush for a wafer according to an embodiment of the present invention.
9 is a flowchart of a step of calculating a contact origin using a provided vibration value according to an embodiment of the present invention.
10 is a graph showing the amplitude change according to the position of the upper brush part and the lower brush part according to an embodiment of the present invention.
11 is a graph showing the amplitude according to the contact depth of the upper brush part and the lower brush part with respect to the wafer according to an embodiment of the present invention.

Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be embodied in several different forms, and thus is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part is said to be “connected (connected, contacted, coupled)” with another part, it is not only “directly connected” but also “indirectly connected” with another member interposed therebetween. "Including cases where In addition, when a part "includes" a certain component, this means that other components may be further provided without excluding other components unless otherwise stated.

The terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In this specification, terms such as "comprises" or "have" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exemplary view of an apparatus for detecting a contact origin of a cleaning brush for a wafer according to an embodiment of the present invention, and FIG. 2 is an exemplary view showing the inside of a holder support according to an embodiment of the present invention.

1 and 2, the contact origin detection apparatus 100 of the cleaning brush for the wafer includes a wafer 110, an upper brush unit 120, a lower brush unit 130, a holder unit 140, It includes a holder support unit 150 , a sensor unit 160 , and a calculation unit 170 .

The upper brush part 120 is provided on the upper portion of the wafer 110 to clean the upper surface of the wafer 110, and includes an upper brush 121, an upper protrusion 122, and an upper brush holder 123. do.

The upper brush 121 is provided on the wafer 110 and may be provided in the form of a roller. In addition, the upper brush 121 may be provided to perform cleaning of the wafer 110 while rotating.

The upper protrusions 122 may be formed on the outer peripheral surface of the upper brush 121, and a plurality of upper protrusions 122 may be arranged on the outer peripheral surface of the upper brush 121 at equal intervals.

As such, since the upper protrusions 122 are formed to have symmetry at equal intervals, a brush contact frequency, which will be described later, may be uniformly generated.

The upper brush holder 123 may be coupled to the upper brush 121 to support and rotate the upper brush 121 .

The lower brush unit 130 is provided under the wafer 110 to clean the lower surface of the wafer 110 , and includes a lower brush 131 , a lower protrusion 132 and a lower brush holder 133 . do.

The lower brush 131 is provided under the wafer 110 and may be provided in the form of a roller. In addition, the lower brush 131 may be provided to perform cleaning on the wafer 110 while rotating.

The lower protrusions 132 may be formed on the outer circumferential surface of the lower brush 131 , and a plurality of the lower protrusions 132 may be arranged at equal intervals on the outer circumferential surface of the lower brush 131 .

As such, since the lower protrusions 132 are formed to have symmetry at equal intervals, a brush contact frequency, which will be described later, may be uniformly generated.

The lower brush holder 133 may be coupled to the lower brush 131 to support and rotate the lower brush 131 .

The holder unit 140 is provided on both sides of the wafer 110 , and may be provided to rotate the wafer 110 .

The holder support unit 150 is provided under the holder unit 140 to support and rotate the holder unit 140 , and includes a rotating rod 151 , a holder cover 152 , a vibration transmission body 153 and A motor 154 may be included.

The rotating rod 151 may be coupled to a lower portion of the holder unit 140 to extend toward the lower portion of the holder unit 140 . In addition, the central axis of the holder unit 140 may be connected to the central axis of the rotating rod 151 so that the holder unit 140 rotates as the rotating rod 151 rotates.

The holder cover 152 is provided to accommodate the rotation rod 151 therein, and may be provided to protect the structure accommodated therein.

The vibration transmitting body 153 is provided between the rotating rod 151 and the holder cover 152, and may be provided in the form of a bearing, but is not limited thereto.

The vibration transmitting body 153 may be provided as far as possible from the motor 154 , and the sensor unit 160 may be provided in the vibration transmitting body 153 .

The vibration transmitting body 153 provided in this way may be provided to transmit the vibration transmitted through the wafer 110 , the holder unit 140 , and the rotating rod 151 to the sensor unit 160 .

When the sensor unit 160 is directly attached to the rotation rod 151 , it is difficult to accurately measure the vibration transmitted from the wafer 110 while rotating together with the rotation rod 151 . In addition, when the sensor unit 160 is installed adjacent to the motor 154 , it is difficult to measure the vibration transmitted from the wafer 110 by the vibration of the motor 154 .

Accordingly, the sensor unit 160 is preferably provided at a position adjacent to the vibration transmitting body 153 or the vibration transmitting body 153 .

However, the position of the sensor unit 160 is not limited thereto, and it can be changed as long as it is a position that can well receive the vibration transmitted from the wafer 110 .

The motor 154 may provide power to the rotating rod 151 to rotate the rotating rod 151 .

As described above, the sensor unit 160 may be provided on the vibration transmission member 153 to measure the vibration value of the wafer 110 .

In addition, the sensor unit 160 may provide the measured vibration value to the calculator 170 in real time.

The calculation unit 170 uses the vibration value measured by the sensor unit 160 to determine whether the wafer 110 and the upper brush unit 120 and the lower brush unit 130 are in contact with each other and the contact depth. may be provided to detect

3 is an exemplary view showing a contact depth according to an embodiment of the present invention.

Referring to FIG. 3 , the contact origin of the upper brush unit 120 and the lower brush unit 130 is the moment the wafer 110 comes into contact with each other. Then, as the upper brush part 120 and the lower brush part 130 are gradually press-fitted while in contact with the wafer 110 , the upper protrusion 122 and the lower protrusion 132 are deformed, respectively, the contact origin. The depth at which the upper brush part 120 and the lower brush part 130 are further pushed into the wafer 110 is the contact depth.

4 is a graph showing frictional force and cleaning efficiency according to a contact depth according to an embodiment of the present invention.

As shown in FIG. 4 , the cleaning efficiency increases as the contact depth increases, but defects such as scratches may occur in the wafer 110 .

In order not to damage the wafer 110 and to increase cleaning efficiency, it is necessary to control the upper brush part 120 and the lower brush part 130 to have an optimal contact depth.

Therefore, in order to have an optimal contact depth, it is necessary to accurately find out the contact origin and contact depth where the upper brush part 120 and the lower brush part 130 come into contact with the wafer 110 .

More specifically, the calculation unit 170 includes an amplitude module 171 and a calculation module 172 .

The amplitude module 171 may be provided to detect an amplitude according to a vibration frequency using the vibration value measured by the sensor unit 160 .

When a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper brush unit 120 and the lower brush unit 130 come into contact with the wafer 110 , the calculation module 172 generates the peak. It may be provided to calculate the positions of the upper brush part 120 and the lower brush part 130 as the contact origin.

The brush contact frequency may be a value calculated by Equation 1 below.

(here, fc is the brush contact frequency, B is the brush rotation speed (rpm), N is the number of projections in the radial direction of the brush) It may be characterized in that it is calculated by the above equation.

As an example, the rotation speed of the upper brush part 120 and the lower brush part 130 is 400 rpm, and the radial upper protrusions 122 of the upper brush part 120 and the lower brush part 130 and When the number of the lower protrusions 132 is 16, the brush contact frequency may be 106.6667.

Accordingly, when a peak occurs in the amplitude at the point where the brush contact frequency detected by the amplitude module 171 is 106.6667, the calculation module 172 determines that the upper brush unit 120 and the lower brush unit 130 are It may be determined that the commercial wafer 110 is in contact and the corresponding position may be used as the contact origin.

In addition, the calculation module 172 is configured to include the upper brush unit 120 and the upper brush unit 120 for the wafer 110 according to a change in the amplitude of the brush contact frequency based on the amplitude of the brush contact frequency at the contact origin. It may be provided to derive the contact depth of the lower brush unit 130 .

For example, the calculation module 172 measures the amplitude value of the brush contact frequency according to the contact depth between the upper brush unit 120 and the lower brush unit 130 in contact with the wafer in advance and makes a table, It may be provided to derive the contact depth according to the actually measured amplitude of the brush contact frequency.

Hereinafter, a method of detecting an origin of contact of a contact origin detecting apparatus of a cleaning brush for a wafer will be described in detail with reference to the following drawings.

5 is a flowchart of a method of detecting an origin of contact of an apparatus for detecting an origin of contact of a cleaning brush for a wafer according to an embodiment of the present invention.

As shown in FIG. 5 , in the method of detecting the origin of contact using the apparatus for detecting the origin of contact of a cleaning brush for a wafer, first, the step ( S210 ) of bringing the upper and lower brushes closer to the wafer may be performed.

In the step (S210) of bringing the upper brush part and the lower brush part close to the wafer, the upper brush part 120 and the lower brush part 130 are separated from the wafer 110 by the same distance from the wafer 110. ) may be provided to gradually approach toward.

After the step (S210) of bringing the upper brush part and the lower brush part close to the wafer, the sensor part measuring the vibration value transmitted from the wafer while the upper brush part and the lower brush part come close to the wafer (S220) can be performed. .

In the step (S220) of measuring the vibration value transmitted from the wafer by the sensor unit while the upper brush unit and the lower brush unit are close to the wafer (S220), the sensor unit 160 continuously measures the vibration transmitted from the wafer 110. can be provided.

After the sensor unit measures the vibration value transmitted from the wafer while the upper brush unit and the lower brush unit come close to the wafer (S220), a step (S230) of providing the measured vibration value to the calculator may be performed.

After providing the measured vibration value to the calculator ( S230 ), calculating the contact origin using the provided vibration value ( S240 ) may be performed.

6 is a flowchart of a step of calculating a contact origin using a provided vibration value according to an embodiment of the present invention.

Referring to FIG. 6 , in the step of calculating the contact origin by using the provided vibration value ( S240 ), first, calculating the amplitude according to the vibration frequency from the provided vibration value ( S241 ) may be performed.

In the step of calculating the amplitude according to the vibration frequency from the provided vibration value (S241), the amplitude module 171 is provided to calculate the vibration frequency from the vibration value measured by the sensor unit 160 and calculate the amplitude thereof can be

In this case, the amplitude module 171 may be provided to detect a vibration frequency through FFT analysis, and may be provided to calculate its amplitude in real time.

After calculating the amplitude according to the vibration frequency from the provided vibration value (S241), when a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper and lower brush units come into contact with the wafer, the upper brush A step (S242) of calculating the positions of the part and the lower brush part as the contact origin may be performed.

When a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper and lower brush units come into contact with the wafer, calculating the positions of the upper and lower brush units as contact origins (S242), the When a peak occurs in the amplitude at the point of the brush contact frequency detected by the amplitude module 171 , it is determined that the upper brush unit 120 and the lower brush unit 130 are in contact with the wafer 110 , and the corresponding The position can be calculated as the contact origin.

7 is a graph showing the amplitude according to whether the upper brush part and the lower brush part contact the wafer according to an embodiment of the present invention.

For example, as shown in FIG. 7, when the brush contact frequency is 106.66667, in FIG. 7 (a), since a peak has not occurred at the brush contact frequency point, the upper brush part 120 and the lower brush part ( It may be determined that the wafer 130 is not in contact with the wafer 110 .

On the other hand, in (b) of FIG. 7 , since the peak occurs at the brush contact frequency point, it can be determined that the upper brush unit 120 and the lower brush unit 130 are in contact with the wafer 110 . In this case, the positions of the upper brush part 120 and the lower brush part 130 may be calculated as a contact origin.

Hereinafter, a method of detecting a contact depth of the apparatus for detecting a contact depth of a cleaning brush with respect to a wafer will be described.

8 is a flowchart of a contact depth detection method of an apparatus for detecting a contact depth of a cleaning brush for a wafer according to an embodiment of the present invention.

As shown in FIG. 8 , in the method of detecting the origin of contact using the apparatus for detecting the origin of contact of a cleaning brush for a wafer, first, a step S310 of bringing the upper and lower brushes closer to the wafer may be performed.

In the step (S310) of bringing the upper brush part and the lower brush part close to the wafer, the upper brush part 120 and the lower brush part 130 are separated from the wafer 110 by the same distance from the wafer 110. ) may be provided to gradually approach toward.

After the step (S310) of bringing the upper brush part and the lower brush part close to the wafer, the sensor part measures the vibration value transmitted from the wafer while the upper brush part and the lower brush part come close to the wafer (S320) can be performed. .

In the step (S320) of measuring the vibration value transmitted from the wafer by the sensor unit while the upper brush unit and the lower brush unit are close to the wafer (S320), the sensor unit 160 continuously measures the vibration transmitted from the wafer 110. can be provided.

After the sensor unit measures the vibration value transmitted from the wafer while the upper brush unit and the lower brush unit come close to the wafer ( S320 ), a step ( S330 ) of providing the measured vibration value to the calculator may be performed.

After providing the measured vibration value to the calculator ( S330 ), calculating the contact origin using the provided vibration value ( S340 ) may be performed.

9 is a flowchart of a step of calculating a contact origin using a provided vibration value according to an embodiment of the present invention.

Referring to FIG. 9 , in the step of calculating the contact origin using the provided vibration value ( S340 ), first, calculating the amplitude according to the vibration frequency from the provided vibration value ( S341 ) may be performed.

In the step of calculating the amplitude according to the vibration frequency from the provided vibration value (S341), the amplitude module 171 is provided to calculate the vibration frequency from the vibration value measured by the sensor unit 160 and calculate the amplitude thereof can be

In this case, the amplitude module 171 may be provided to detect a vibration frequency through FFT analysis, and may be provided to calculate its amplitude in real time.

After calculating the amplitude according to the vibration frequency from the provided vibration value (S341), when a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper brush part and the lower brush part come into contact with the wafer, the upper brush A step (S342) of calculating the positions of the part and the lower brush part as the contact origin may be performed.

When a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper and lower brush units come into contact with the wafer, calculating the positions of the upper and lower brush units as contact origins (S342), the When a peak occurs in the amplitude at the point of the brush contact frequency detected by the amplitude module 171 , it is determined that the upper brush unit 120 and the lower brush unit 130 are in contact with the wafer 110 , and the corresponding The position can be calculated as the contact origin.

After calculating the contact origin using the provided vibration value ( S340 ), a step ( S350 ) of deriving the contact depths of the upper and lower brush units with respect to the wafer based on the contact origin may be performed.

In the step (S350) of deriving the contact depth of the upper brush part and the lower brush part with respect to the wafer based on the contact origin, the calculation module 172 determines the brush contact frequency at the contact origin based on the amplitude of the brush. A contact depth of the upper brush unit 120 and the lower brush unit 130 with respect to the wafer 110 may be derived according to a change in the amplitude of the contact frequency.

For example, the calculation module 172 measures the amplitude value of the brush contact frequency according to the contact depth between the upper brush unit 120 and the lower brush unit 130 in contact with the wafer in advance and makes a table, It may be provided to derive the contact depth according to the actually measured amplitude of the brush contact frequency.

10 is a graph showing the amplitude change according to the position of the upper brush part and the lower brush part according to an embodiment of the present invention.

Referring to FIG. 10 , it can be seen that as the contact depth between the upper brush part 120 and the lower brush part 130 increases, the amplitude of the brush contact frequency increases in proportion to this.

11 is a graph showing the amplitude according to the contact depth of the upper brush part and the lower brush part with respect to the wafer according to an embodiment of the present invention.

Referring further to FIG. 11, when the brush contact frequency is 106.66667, in (a) of FIG. 11, a peak has not occurred at the brush contact frequency point, so the upper brush part 120 and the lower brush part 130 are It may be determined that the wafer 110 is not in contact.

And, since the amplitude peak occurs at the brush contact frequency point in (b) of FIG. 11 , it can be determined that the upper brush unit 120 and the lower brush unit 130 are in contact with the wafer 110 . In this case, the positions of the upper brush part 120 and the lower brush part 130 may be calculated as a contact origin.

And, as shown in (c) of FIG. 11 , it can be seen that the amplitude peak at the brush contact frequency point increased more significantly.

Therefore, the contact depth can be calculated according to the increase in the amplitude of the brush contact frequency.

As described above, according to the present invention, the contact origin and contact depth of the upper brush unit 120 and the lower brush unit 130 with respect to the wafer 110 can be accurately calculated. And as a result, it is possible to maximize the cleaning efficiency of the wafer 110 and prevent damage to the wafer 110 from being applied.

The above description of the present invention is for illustration, and those of ordinary skill in the art to which the present invention pertains can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive. For example, each component described as a single type may be implemented in a dispersed form, and likewise components described as distributed may be implemented in a combined form.

The scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

100: A contact origin detection device of a cleaning brush with respect to a wafer.
110: wafer
120: upper brush part
121: upper brush
122: upper projection
123: upper brush holder
130: lower brush part
131: lower brush
132: lower projection
133: lower brush holder
140: holder part
150: holder support
151: rotating rod
152: holder cover
153: vibration transmission body
154: motor
160: sensor unit
170: output unit
171: amplitude module
172: calculation module

Claims (11)

an upper brush provided on the wafer to clean the upper surface of the wafer;
a lower brush unit provided under the wafer to clean a lower surface of the wafer;
a sensor unit provided to measure the vibration value of the wafer; and
Comprising a calculator provided to calculate the amplitude according to the vibration frequency from the vibration value measured by the sensor unit to calculate the contact origin of the wafer, the upper brush part and the lower brush part,
The calculation unit is provided to further derive contact depths of the upper and lower brush units with respect to the wafer according to a change in the amplitude of the brush contact frequency based on the amplitude of the brush contact frequency at the contact origin. A contact origin detection device of a cleaning brush with respect to the wafer.
The method of claim 1,
The calculation unit,
an amplitude module provided to detect an amplitude according to a vibration frequency using the vibration value measured by the sensor unit; and
When a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper brush part and the lower brush part come into contact with the wafer, the positions of the upper brush part and the lower brush part are calculated as the contact origin. A contact origin detection device of a cleaning brush for a wafer, comprising a module.
3. The method of claim 2,
The brush contact frequency is

(where fc is the brush contact frequency, B is the brush rotation speed (rpm), and N is the number of projections in the radial direction of the brush)
The contact origin detection apparatus of the cleaning brush for the wafer, characterized in that calculated by the above equation.
The method of claim 1,
The upper brush part,
an upper brush provided in the form of a roller;
an upper protrusion formed on an outer peripheral surface of the upper brush; and
and an upper brush holder provided to support and rotate the upper brush,
The contact origin detection device of the cleaning brush for the wafer, characterized in that the upper projections are arranged at equal intervals.
The method of claim 1,
The lower brush part,
A lower brush provided in the form of a roller;
a lower protrusion formed on an outer circumferential surface of the lower brush; and
and a lower brush holder provided to support and rotate the lower brush,
The contact origin detection device of the cleaning brush for the wafer, characterized in that the lower projections are arranged at equal intervals.
The method of claim 1,
a holder portion provided on both sides of the wafer and provided to rotate the wafer; and
The contact origin detection apparatus of the cleaning brush for the wafer, characterized in that it further comprises a holder support provided under the holder portion to support and rotate the holder portion.
7. The method of claim 6,
The holder support portion,
a rotating rod extending toward a lower portion of the holder and provided to rotate the holder;
a holder cover provided to accommodate the rotating rod therein;
a vibration transmission body provided between the rotating rod and the holder cover; and
and a motor for providing power to the rotating rod to rotate the rotating rod.
8. The method of claim 7,
The sensor unit is provided on the vibration transmission body,
The vibration transmitting member is a contact origin detecting device for a cleaning brush for a wafer, characterized in that it is provided to transmit the vibration transmitted through the wafer, the holder unit, and the rotating rod to the sensor unit.
In the contact origin detection method using the contact origin detection apparatus of the cleaning brush for the wafer according to claim 1,
a) bringing the upper brush part and the lower brush part closer to the wafer;
b) measuring a vibration value transmitted from the wafer by the sensor unit while the upper brush unit and the lower brush unit come close to the wafer;
c) providing the measured vibration value to the calculator; and
d) calculating the origin of contact by using the provided vibration value.
10. The method of claim 9,
Step d) is,
d1) calculating an amplitude according to a vibration frequency from the provided vibration value; and
d2) When a peak occurs in the amplitude of the brush contact frequency, which is a preset value generated when the upper brush part and the lower brush part come into contact with the wafer, the positions of the upper brush part and the lower brush part are calculated as the contact origin A contact origin detection method using a contact origin detection apparatus of a cleaning brush for a wafer, comprising the steps of.
11. The method of claim 10,
The brush contact frequency is

(where fc is the brush contact frequency, B is the brush rotation speed (rpm), and N is the number of projections in the radial direction of the brush)
A contact origin detection method using a contact origin detection device of a cleaning brush for a wafer, characterized in that calculated by the above equation.

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