KR102276500B1 - 스위치 소자, 스위치 회로, 및 경보 회로 - Google Patents
스위치 소자, 스위치 회로, 및 경보 회로 Download PDFInfo
- Publication number
- KR102276500B1 KR102276500B1 KR1020167019051A KR20167019051A KR102276500B1 KR 102276500 B1 KR102276500 B1 KR 102276500B1 KR 1020167019051 A KR1020167019051 A KR 1020167019051A KR 20167019051 A KR20167019051 A KR 20167019051A KR 102276500 B1 KR102276500 B1 KR 102276500B1
- Authority
- KR
- South Korea
- Prior art keywords
- melting
- point metal
- electrode
- switch element
- soluble conductor
- Prior art date
Links
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/12—Two or more separate fusible members in parallel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/044—General constructions or structure of low voltage fuses, i.e. below 1000 V, or of fuses where the applicable voltage is not specified
Landscapes
- Fuses (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014008133A JP6266355B2 (ja) | 2014-01-20 | 2014-01-20 | スイッチ素子、スイッチ回路、及び警報回路 |
JPJP-P-2014-008133 | 2014-01-20 | ||
PCT/JP2015/051253 WO2015108187A1 (ja) | 2014-01-20 | 2015-01-19 | スイッチ素子、スイッチ回路、及び警報回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160111381A KR20160111381A (ko) | 2016-09-26 |
KR102276500B1 true KR102276500B1 (ko) | 2021-07-12 |
Family
ID=53543069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020167019051A KR102276500B1 (ko) | 2014-01-20 | 2015-01-19 | 스위치 소자, 스위치 회로, 및 경보 회로 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6266355B2 (zh) |
KR (1) | KR102276500B1 (zh) |
CN (1) | CN105900207B (zh) |
TW (2) | TWI677002B (zh) |
WO (1) | WO2015108187A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017214909A1 (de) * | 2017-08-25 | 2019-02-28 | Siemens Aktiengesellschaft | Fertigungsverfahren zur Herstellung eines Sicherungskörpers, Sicherungskörper und Schmelzsicherung |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012038638A (ja) * | 2010-08-10 | 2012-02-23 | Kyocera Corp | セラミックヒューズおよびセラミックヒューズパッケージ |
JP2013229293A (ja) * | 2012-03-29 | 2013-11-07 | Dexerials Corp | 保護素子 |
JP2013239405A (ja) * | 2012-05-17 | 2013-11-28 | Nec Schott Components Corp | 保護素子用ヒューズ素子およびそれを利用した回路保護素子 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4036933B2 (ja) * | 1997-09-22 | 2008-01-23 | 内橋エステック株式会社 | 抵抗・温度ヒュ−ズ及びその製作方法 |
JP4203190B2 (ja) * | 1999-08-31 | 2008-12-24 | 大東通信機株式会社 | ヒューズ装置 |
JP2006108568A (ja) * | 2004-10-08 | 2006-04-20 | Sanyo Electric Co Ltd | スイッチング素子およびそれを用いた保護回路 |
CN102290301B (zh) * | 2010-06-18 | 2014-04-02 | 厦门赛尔特电子有限公司 | 一种大电流熔断器 |
JP5546406B2 (ja) * | 2010-09-28 | 2014-07-09 | 京セラ株式会社 | セラミックヒューズおよびセラミックヒューズ用基体 |
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2014
- 2014-01-20 JP JP2014008133A patent/JP6266355B2/ja active Active
-
2015
- 2015-01-19 KR KR1020167019051A patent/KR102276500B1/ko active IP Right Grant
- 2015-01-19 CN CN201580003876.4A patent/CN105900207B/zh active Active
- 2015-01-19 WO PCT/JP2015/051253 patent/WO2015108187A1/ja active Application Filing
- 2015-01-20 TW TW108105582A patent/TWI677002B/zh active
- 2015-01-20 TW TW104101761A patent/TWI655662B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012038638A (ja) * | 2010-08-10 | 2012-02-23 | Kyocera Corp | セラミックヒューズおよびセラミックヒューズパッケージ |
JP2013229293A (ja) * | 2012-03-29 | 2013-11-07 | Dexerials Corp | 保護素子 |
JP2013239405A (ja) * | 2012-05-17 | 2013-11-28 | Nec Schott Components Corp | 保護素子用ヒューズ素子およびそれを利用した回路保護素子 |
Also Published As
Publication number | Publication date |
---|---|
JP2015138596A (ja) | 2015-07-30 |
TW201921399A (zh) | 2019-06-01 |
TW201530591A (zh) | 2015-08-01 |
JP6266355B2 (ja) | 2018-01-24 |
CN105900207A (zh) | 2016-08-24 |
CN105900207B (zh) | 2019-09-06 |
KR20160111381A (ko) | 2016-09-26 |
TWI655662B (zh) | 2019-04-01 |
WO2015108187A1 (ja) | 2015-07-23 |
TWI677002B (zh) | 2019-11-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |