KR102271392B1 - Rotary solder paste coating apparatus and micro led module manufacturing method using the apparatus - Google Patents

Abstract

The present invention relates to a solder application device for binding between a substrate and a micro light emitting diode, the first application unit comprising a plurality of needles having a tip portion formed on one side in the longitudinal direction and a vertical actuator for linearly reciprocating the needles Transfer including a casing including a plurality of holes for communicating inside and outside in a shape corresponding to the tip and formed outside the tip to communicate inside and outside in a shape corresponding to the tip of the needle A solder paste injection unit comprising a second applicator for applying a solder paste to one surface of the casing in which the plurality of holes are formed, and a horizontal actuator for linearly moving the second applicator, the solder paste is applied by the first applicator A substrate placing unit for placing the transferred substrate on the upper side and a three-axis moving unit coupled to the transfer unit and reciprocating between the solder paste injection unit and the substrate mounting unit, wherein the transfer unit is located below the solder paste injection unit Interposed therebetween, including a rotation shaft disposed in the center of the coupling portion of the first application unit and the casing, the rotation type solder paste application device characterized in that it further comprises a rotation unit for rotating the first application unit and the casing assembly and This is a method for manufacturing a micro LED module using

Description

Rotary solder paste coating apparatus and module manufacturing method using the same

The present invention relates to a solder paste application apparatus employed in a system for manufacturing a module used in a number of fields, and more particularly, to a rotary solder paste application apparatus that can efficiently realize bonding of a substrate of a module and an object to be bound. it's about

In general, a printed circuit board (PCB), which is embedded as a major component of an electrical and electronic device such as a computer or home appliance, is coupled to a binding material such as a semiconductor chip or a resistance chip in a predetermined pattern. Such a solder paste application process is usually performed by a solder paste application device called a 'screen printer', which presses the solder paste supplied on a metal mask having openings of a specific pattern with a squeegee to a printed circuit board. It is applied to the part mounting part of
A micro LED module is a representative example of a plurality of modules manufactured by combining a plurality of binders on a printed circuit board. LED (Light Emitting Diode) refers to a semiconductor device that emits light by passing an electric current through a compound such as gallium arsenide. In other words, when a current passes through a conductive material with electrodes attached to the bottom and top, electrons and holes combine at the center of the electrode to emit photons of light. After the development of red LEDs in the United States, yellow, green, blue and white LEDs were commercialized, and high-brightness LEDs are being used in lighting for mobile communication terminals and automotive decoration lighting.
Before the commercialization of LED, the LCD used in the above field displayed information by placing a panel in which numerous liquid crystals were regularly arranged on the front side and then applying light to the back side of the LCD. In other words, the light emitted from the backlight is refracted in different patterns while passing through the liquid crystal, and information is displayed according to the refraction pattern that passes through the color filter and the polarizing filter disposed in front of the liquid crystal. There is a disadvantage in that it is structurally complicated as it is combined and is not suitable for flexibility due to the rigidity of the backlight. The LED is evaluated as an optimal model to solve the above problems, and the micro LED module means a module that emits RGB (Red Green Blue) by adopting pixels in units of 10 to 100 micrometers (㎛). That is, more pixels can be inserted per unit area than a general LED module, and thus information can be output with high resolution.
Korean Patent Application Laid-Open No. 10-2019-0060525 describes a method for manufacturing the micro LED module. In the above document, in a method of manufacturing a micro LED module by bonding a matrix-type LED cell to a submount substrate, solder in a semi-molten state is injected between the LED cell and the submount substrate to bond the plurality of components to each other. However, there is a problem in that it is not easy to inject the semi-molten solder into the micro-holes formed on the sub-mount substrate and into which each micro LED module is inserted.
In addition to the micro LED module, various types of modules can be produced using a screen printer that applies solder paste, and Domestic Utility Model No. 20-0236121 describes a solder paste application device combined with a configuration that performs vision inspection. became It is a method of applying the solder paste according to the data after calculating the area to apply the solder paste based on the image information photographed by the image recognition means. However, the invention described in the above document also has a limitation in applying the solder paste to a fine application area.

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Domestic Patent Publication No. 10-2019-0060525 "Manufacturing method of high-efficiency micro LED module" (2019. 06. 03)

The present invention has been devised to solve the above problems, and it is ultimately an object of the present invention to provide an apparatus for easily applying a predetermined amount of solder paste to a substrate on which a binder is to be bound.

The present invention relates to a solder application device for binding between a substrate and an object to be bound, a first application unit comprising a plurality of needles having a tip portion formed on one side in the longitudinal direction, and a vertical actuator for linearly reciprocating the needles and the needles. A transfer comprising a casing comprising a plurality of holes communicating inside and outside in a shape corresponding to the tip and formed outside the tip to communicate inside and outside in a shape corresponding to the tip of the needle A solder paste injection unit comprising a second applicator for applying a solder paste to one surface of the casing in which the plurality of holes are formed, and a horizontal actuator for linearly moving the second applicator, the solder paste is applied by the first applicator A substrate placing unit for placing the transferred substrate on the upper side and a three-axis moving unit coupled to the transfer unit and reciprocating between the solder paste injection unit and the substrate mounting unit, wherein the transfer unit is located below the solder paste injection unit Interposed, including a rotation shaft disposed in the center of the coupling portion of the first application unit and the casing, characterized in that it further comprises a rotating unit for rotating the first application unit and the casing assembly.
In addition, the second applicator is characterized in that a surface in contact with one surface of the casing in which the plurality of holes are formed is parallel to each other, and a predetermined amount of solder paste is injected into the plurality of holes.
In addition, the solder paste injection unit is disposed below the second application unit and the horizontal actuator, further comprising a guide for limiting the movement path of the horizontal actuator, the guide is formed with a guide hole communicating with the outside, the casing of The width is made smaller than the distance between the plurality of partition walls constituting the guide hole, and the casing is inserted into the guide hole.
In addition, the transfer unit is opposite to the upper surface of the substrate mounting unit, characterized in that it further comprises an inspection unit for photographing the transfer position of the first application unit.
In the method of manufacturing a module using the present invention, placing a substrate on the substrate mounting unit, applying a solder paste to the second application unit, the three-axis moving unit the transfer unit below the solder paste injection unit transferring the rotating unit to the first application unit and the casing by 180 degrees, the three-axis moving unit raising the transfer unit toward the solder paste injection unit, and the second application unit being formed on one surface of the casing injecting solder paste into the plurality of holes, transferring the transfer unit to an upper side of the substrate mounting unit after the three-axis moving unit lowers the transfer unit to a predetermined height, and the rotating unit rotates the first application unit and the casing by 180 degrees and transferring the solder paste to the substrate disposed on the upper side of the substrate placing unit by the transfer unit.

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Due to the present invention, as it is easy to apply the solder paste for binding the binding material to the PCB substrate, the efficiency of the process of finally manufacturing the module can be increased, and ultimately, the mass production of the module can be realized. .

1 is an exemplary view showing a solder paste applying apparatus according to an embodiment of the present invention.
2 is an exemplary view illustrating a state in which a solder paste according to an embodiment of the present invention is applied to a first application part.
3 is an exemplary view illustrating a state in which a transfer unit descends to a substrate mounting unit according to an embodiment of the present invention.
4 is an exemplary view illustrating a state in which a plurality of needles transfer a solder paste to a substrate according to an embodiment of the present invention.
5 is an exemplary view illustrating a state in which the casing is rotated by the rotating part according to an embodiment of the present invention.
6 is an exemplary view illustrating a module manufacturing method according to the present invention.

The terms or words used in the present specification and claims should not be construed as being limited to their ordinary or dictionary meanings, and the inventor may properly define the concepts of the terms to best describe his invention. Based on the principle, it should be interpreted as meaning and concept consistent with the technical idea of the present invention.

Accordingly, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferred embodiments of the present invention and do not represent all the technical spirit of the present invention, so various equivalents that can be substituted for them at the time of the present application It should be understood that there may be variations and examples.

Hereinafter, prior to the description with reference to the drawings, it is not shown or specifically described for matters not necessary to reveal the gist of the present invention, that is, known configurations that can be added obviously by those skilled in the art. make it clear that you didn't

1 is an exemplary view showing a rotary solder paste applying apparatus according to an embodiment of the present invention. As shown in FIG. 1 , an embodiment of the present invention may include a transfer unit 100 , a solder paste injection unit 200 , a substrate placing unit 300 , and a three-axis moving unit 400 .

The three-axis moving unit 400 is configured to transfer the transfer unit 100 on three axes. The x-axis moving unit 410 and the y-axis moving unit 420 shown in FIG. 1 vary the position of the transfer unit 100 on a plane having the same phase, and the z-axis moving unit 430 is the x-axis moving unit 430 . The height is varied within a position determined by the moving unit 410 and the y-axis moving unit 420 .

The substrate placing unit 300 has a configuration in which the substrate onto which the solder paste is transferred is disposed on the upper side, and the transfer unit 100 can be transferred by the x-axis moving unit 410 and the y-axis moving unit 420 . formed within the range. In addition, the substrate interposed above the substrate placing unit 300 has a phase value equal to or higher than the lowest point at which the transfer unit 100 descends by the z-axis moving unit 430 .

The solder paste injection unit 200 is configured to inject solder paste into the transfer unit 100 , and includes a second application unit 210 and a second application unit ( ) for applying solder paste to the transfer unit 100 . A horizontal actuator 220 for linearly reciprocating 210 may be included. In addition, it has a structure communicating along the height direction, and further includes a guide 230 for limiting the transport path of the second applicator 210 and the horizontal actuator 220 by the plurality of partition walls. The guide 230 further includes a guide hole 231 communicating in a height direction, and the transfer part 100 is selectively disposed in the guide hole 231 , so that the second applicator 210 is Solder paste is applied to the transfer part 100 .

The transfer unit 100 may further include a separate inspection unit 140 in a direction opposite to the upper surface of the substrate mounting unit 300 . The inspection unit 140 has a configuration in which the transfer unit 100 scans an area of the substrate to which the solder paste is to be applied, and the second application unit 210 is connected to the transfer unit 100 according to the solder paste application area in the substrate. ) determines the amount of solder paste to be applied.

2 is an exemplary view illustrating a state in which a solder paste according to an embodiment of the present invention is applied to the transfer unit 100 . As shown in FIG. 2 , the transfer unit 100 further includes a casing 120 to which a solder paste is applied on one surface by the second application unit 210 and a rotating unit 130 for inverting the casing 120 by 180 degrees. can be included.

When the casing 120 is disposed between the plurality of partition walls 231 as it is inverted by the rotating part 130 , the second applicator 210 is moved to the casing 120 by the horizontal actuator 220 . linear reciprocating motion on the upper surface of At this time, the second applicator 210 has a structure in which a surface in contact with the upper surface of the casing 120 is parallel to each other, and a predetermined amount of solder paste is injected into the casing 120 .

3 is an exemplary view illustrating a state in which the transfer unit 100 descends to the substrate mounting unit 300 according to an embodiment of the present invention. As shown in FIG. 3 , the casing 120 may be raised or lowered by the z-axis moving part 430 .

A substrate to which the solder paste is to be transferred is placed on the upper side of the substrate placing unit 300 , and the position of the transfer region is determined by the x-axis moving unit 410 and the y-axis moving unit 420 . in the z-axis moving part 430 lowers the casing 120 .

At this time, as shown in FIG. 2 , in a state in which the casing 120 is disposed toward the upper side, re-inversion is performed by the rotating unit 130 so that the casing 120 is disposed toward the lower substrate.

4 is an exemplary view illustrating a state in which a plurality of needles 111 transfer a solder paste to a substrate according to an embodiment of the present invention. As shown in FIG. 4 , a first applicator 110 for applying a solder paste to a substrate is disposed inside the casing 120 . The first application unit 110 further includes a plurality of needles 111 in physical contact with the upper side of the substrate and a vertical actuator 112 for transferring the plurality of needles 111 in a height direction.

At this time, a plurality of holes 121 communicating along the height direction are formed on one surface of the casing 120 to which the solder paste is applied by the solder paste injection unit 200 . The plurality of holes 121 may have a structure in which front ends of the plurality of needles 111 are selectively penetrated. That is, depending on whether the vertical actuator 112 moves, the plurality of needles 111 may have a structure penetrating through one surface of the casing 120 .

The vertical actuator 112 is a state in which the transfer unit 100 is lowered by the z-axis transfer unit 430 after the solder paste application on one surface of the casing 120 is completed by the solder paste injection unit 200 . to lower the plurality of needles 111 in the Accordingly, the solder paste is transferred to the upper side of the substrate to complete the preparation process for manufacturing the module.

5 is an exemplary view illustrating a state in which the casing 120 is rotated by the rotating part 130 according to an embodiment of the present invention. As shown in FIG. 5 , the transfer unit 100 is configured to vertically invert the casing 120 and the casing 120 in which the plurality of needles 111 that are in physical contact with the substrate are accommodated therein. It may include a rotating part 130 .

The rotating part 130 is disposed on both sides in the longitudinal direction of the rotating shaft 131 and the casing 120 having a structure penetrating the longitudinal direction of the casing 120 and a plurality of rotating shaft fixing bodies for fixing the rotating shaft 131 ( 132) may be included.

When the casing 120 is disposed in the state shown by the solid line in FIG. 5 , the solder paste is applied to the upper side of the casing 120 by the solder paste injection unit 200 . In order to transfer the solder paste to the substrate, the front ends of the plurality of needles 111 should be disposed downward as shown in FIGS. 3 and 4 . The casing 120 rotates about the rotation shaft 131 so that the casing 120 can be vertically inverted through the state shown by the dotted line in FIG. 5 .

6 is an exemplary view illustrating a module manufacturing method according to the present invention. First, a preparation step (S100) of placing a substrate on the substrate placing unit 300 and applying a solder paste to the second applying unit 210 is performed. In this case, the inspection unit 140 may scan the area to which the solder paste is to be applied in the substrate.

Thereafter, the first transfer unit plane transfer step (S200) in which the transfer unit 100 moves in a plane toward the solder paste injection unit 200 by the x-axis moving unit 410 and the y-axis moving unit 420 is performed. carry out This step is performed in a state in which the front ends of the plurality of needles 111 disposed inside the casing 120 face downward.

When the transfer of the transfer unit 100 toward the solder paste injection unit 200 is completed, the casing 120 is rotated 180 degrees by the rotating unit 130 and the first casing inversion step (S300) is inverted. is carried out As this step is carried out, the tip portion of the plurality of needles 111 disposed in the casing 120 is switched to a state toward the upper side.

Thereafter, a step (S400) of raising the casing 120 to a predetermined height by the z-axis moving unit 430 is performed. The casing 120 rises to a height at which the second applicator 210 can inject solder paste into the plurality of holes 121 by the horizontal actuator 220, and the casing 120 is Immediately after completion, the second application unit 210 injects the solder paste into the plurality of holes 121 ( S500 ) successively.

When the injection of the solder paste into the casing 120 is completed, a step (S600) of moving the transfer unit 100 to the upper side of the substrate placing unit 300 by the three-axis moving unit 400 is performed. . At this time, after the transfer unit 100 is lowered to a predetermined height by the z-axis moving unit 430 , the plane movement is sequentially performed by the x-axis moving unit 410 and the y-axis moving unit 420 . .

Thereafter, as the second casing inversion step (S700) in which the casing 120 is once again rotated by 180 degrees by the rotating part 130 is performed, the plurality of needles 111 disposed in the casing 120 are distal ends is switched to facing the substrate below.

If the one surface of the casing 120 into which the solder paste is injected is disposed toward the substrate, the z-axis moving part 430 and the vertical actuator 112 are sequentially descended to apply the solder paste to the substrate (S800) is carried out Thereafter, after the transfer unit 100 is separated from the substrate mounting unit 300 by the three-axis moving unit 400 , the process is finished at the end of the step ( S900 ) in which the object to be bound is transferred to the substrate.

Up to now, the present invention has been focused on the preferred embodiment thereof.

The embodiments described in this specification and the configurations shown in the drawings relate to one most preferred embodiment of the present invention, and do not represent all of the technical spirit of the present invention, so various equivalents and modifications that can be substituted for them are It should be understood that there may be examples.

Therefore, the present invention is not limited to the presented embodiments, and within the equivalent scope of the technical spirit of the present invention and the technical spirit described in the claims to be described below by those of ordinary skill in the technical field to which the present invention pertains. There may be embodiments in which various modifications and changes are possible.

100: warrior
110: first applicator
111: needle 112: vertical actuator
120: casing 121: hole
130: rotating part 131: rotating shaft
140: inspection unit
200: solder paste injection unit
210: second applicator 220: horizontal actuator
230: guide 231: guide hole
300: substrate mounting unit
400: 3-axis moving part
410: x-axis moving unit 420: y-axis moving unit
430: z-axis moving part

Claims (5)

In the solder coating device for binding between the substrate and the to-be-bound,
The casing 120, a plurality of holes 121 penetrating the lower surface of the casing 120, and a plurality of needles 111 formed in a shape corresponding to the holes 121 and the needles 111 are linearly reciprocated. a transfer unit 100 including a vertical actuator 112 for moving and including a first application unit 110 provided in the casing 120;
A second applicator 210 provided on the outside of the casing 120 to apply a solder paste to the outer side of the lower surface of the casing 120 and a horizontal actuator 220 for linearly moving the second applicator 210 Solder paste injection unit 200 that includes;
a substrate placing unit 300 for placing the substrate onto which the solder paste is transferred by the first applying unit 110 on the upper side;
a 3-axis moving unit 400 coupled to the transfer unit 100 and reciprocating between the solder paste injection unit 200 and the substrate mounting unit 300 ;
including,
The transfer unit 100 is
Interposed below the solder paste injection part 200,
Including a rotation shaft 131 disposed in the center of the coupling portion of the first application unit 110 and the casing 120, the rotation unit 130 for rotating the first application unit 110 and the casing 120 combined body Rotational solder paste application device, characterized in that it further comprises.
According to claim 1,
The second applicator 210 is
A rotation type solder paste application device, characterized in that a surface in contact with one surface of the casing 120 on which the plurality of holes 121 are formed and a surface in contact with each other are parallel, and a predetermined amount of solder paste is injected into the plurality of holes 121 . .
According to claim 1,
The solder paste injection unit 200 is
It is disposed below the second applicator 210 and the horizontal actuator 220, further comprising a guide 230 for limiting the movement path of the actuator 220,
The guide 230 is
A guide hole 231 communicating with the outside is formed,
The width of the casing 120 is
A rotation type solder paste application device, characterized in that the casing 120 is inserted into the guide hole 231 because the value is smaller than the distance between the plurality of partition walls forming the guide hole 231 .
According to claim 1,
The transfer unit 100 is
The rotational solder paste applying apparatus, facing the upper surface of the substrate mounting unit (300), further comprising an inspection unit (140) for photographing the transfer position of the first application unit (110).
In the method of manufacturing a module using the solder paste application device of any one of claims 1 to 4,
disposing a substrate on the substrate mounting unit 300 and applying a solder paste to the second application unit 210 (S100);
transferring the transfer unit 100 to the lower side of the solder paste injection unit 200 by the three-axis moving unit 400 (S200);
The rotating part 130 rotating the first application part 110 and the casing 120 180 degrees (S300);
step (S400) of the three-axis moving unit 400 raising the transfer unit 100 toward the solder paste injection unit 200;
injecting a solder paste into the plurality of holes 121 formed on one surface of the casing 120 by the second applicator 210 (S500);
After the three-axis moving unit 400 lowers the transfer unit 100 to a predetermined height, transferring the substrate mounting unit 300 upward (S600);
The rotating part 130 rotating the first application part 110 and the casing 120 180 degrees (S700);
applying a solder paste to the substrate disposed on the upper side of the substrate placing unit 300 by the transfer unit 100 (S800); and
transferring the binder to the upper side of the substrate to which the solder paste is applied (S900);
A module manufacturing method comprising a.

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