KR20210019372A - Rotary solder paste coating apparatus and micro led module manufacturing method using the apparatus - Google Patents

Abstract

The present invention relates to a rotary solder paste application apparatus and a micro light-emitting diode (LED) module manufacturing method using the same. The rotary solder paste application apparatus comprises: a transfer part including a first applicator which includes a plurality of needles having the tips formed on longitudinal sides thereof and a vertical actuator for making the needles linearly reciprocating, and a casing which is formed on the outside of the tips and includes a plurality of holes having a shape corresponding to the tips of the needles, and communicating with the inside and the outside; a solder paste injection part including a second applicator for applying solder paste to a surface of the casing in which the plurality of holes are formed, and a horizontal actuator for making the second applicator linearly reciprocating; a substrate placing part for placing, on an upper side, a substrate to which the solder paste is transferred by the first applicator; and a three-axis moving part coupled to the transfer part to reciprocate between the solder paste injection part and the substrate placing part. The transfer part is interposed below the solder paste injection part and further includes a rotating part which includes a rotating shaft disposed in the center of a coupling part between the first applicator and the casing and rotates the first applicator and the casing. Therefore, the rotary solder paste application apparatus can easily apply a predetermined amount of solder paste to the substrate to which a micro LED is connected.

Description

Rotary solder paste coating apparatus and micro LED module manufacturing method using the same

The present invention relates to a solder paste application device employed in a system for manufacturing a module used in a number of fields, and more particularly, to a rotational solder paste application device capable of efficiently combining an inorganic light emitting layer and a substrate. .

Light Emitting Diode refers to a semiconductor device that emits light by passing an electric current through a compound such as gallium arsenide. In other words, when a current passes through a conductive material with an electrode attached to the bottom, electrons and holes combine at the center of the electrode to emit photons of light. After the red LED was developed in the United States, yellow, green, blue, and white LEDs have been commercialized, and high-brightness LEDs are used in lighting for mobile communication terminals and automotive decoration lighting.

Before the commercialization of LEDs, LCDs used in the above field have a panel in which numerous liquid crystals are regularly arranged on the front side, and then information is displayed in a way that a backlight applies light to the rear side. In other words, the light emitted from the backlight passes through the liquid crystal and refracts in different patterns, and information is displayed according to the color filter and the refraction pattern that passes through the polarization filter. As it is combined, there is a disadvantage that it is structurally complex and is not suitable for flexible due to the rigidity of the backlight. LED is evaluated as an optimal model for solving the above problems, and a micro LED module refers to a module that emits RGB (Red Green Blue) by adopting pixels in units of 10 to 100 micrometers (㎛). That is, more pixels can be inserted per unit area than a general LED module, and thus, information can be output with high resolution.

Korean Patent Publication No. 10-2019-0060525 discloses a method for manufacturing the micro LED module. In the above document, a method of manufacturing a micro LED module by bonding a matrix-type LED cell to a submount substrate, in which semi-melted solder is injected between the LED cell and the submount substrate to bond the plurality of components to each other. However, there is a problem that it is not easy to inject semi-melted solder into the minute holes formed on the submount substrate and into which each micro LED module is inserted.

Korean Patent Publication No. 10-2019-0060525 "Method of manufacturing high-efficiency micro LED module" (2019. 06. 03)

The present invention was conceived to solve the above problems, and ultimately, an object of the present invention is to provide a device in which a solder paste is easily applied in a predetermined amount to a substrate to which a micro LED is attached.

The present invention is a solder coating apparatus for bonding between a substrate and a micro light-emitting diode, in which a first coating unit including a plurality of needles having a tip portion formed at one side in a length direction and a vertical actuator for linearly reciprocating the needle, and the needle Transfer including a casing including a plurality of holes communicating inside and outside in a shape corresponding to the distal end, and including a plurality of holes communicating inside and outside in a shape corresponding to the distal end of the needle and formed outside the distal end A solder paste injection unit including a second coating unit for applying solder paste to one surface of the casing in which the plurality of holes are formed, and a horizontal actuator for linearly moving the second coating unit, and a solder paste by the first coating unit A substrate mounting unit for placing the transferred substrate on the upper side and a three-axis moving unit coupled to the transfer unit and reciprocating between the solder paste injection unit and the substrate mounting unit, wherein the transfer unit is located under the solder paste injection unit. It is interposed, and including a rotation shaft disposed in the center of the coupling portion of the first coating portion and the casing, characterized in that it further comprises a rotating portion for rotating the first coating portion and the casing assembly.

In addition, the second coating unit is characterized in that a surface in contact with one surface of the casing in which the plurality of holes are formed is parallel to each other, and injects a predetermined amount of solder paste into the plurality of holes.

In addition, the solder paste injection unit further includes a guide disposed below the second application unit and the horizontal actuator to limit the movement path of the horizontal actuator, wherein the guide has a guide hole communicating with the outside, and the casing The width is made of a value smaller than the distance between the plurality of partition walls forming the guide hole, and the casing is inserted into the guide hole.

In addition, the transfer unit may further include an inspection unit facing an upper surface of the substrate mounting unit and photographing a transfer position of the first coating unit.

In the method of manufacturing a micro LED module using the present invention, the step of placing a substrate on the substrate mounting portion and applying a solder paste to the second coating portion, the three-axis moving portion injecting the solder paste to the transfer portion Transferring the load to the lower side, rotating the first coating unit and the casing 180 degrees by the rotation unit, raising the transfer unit toward the solder paste injection unit by the three-axis moving unit, and the second coating unit on one surface of the casing Injecting solder paste into the plurality of holes formed in, the three-axis moving part lowering the transfer part to a predetermined height and transferring it to the upper side of the substrate mounting part, and the rotating part moves the first coating part and the casing 180 And rotating the transfer unit and transferring the solder paste to a substrate disposed above the substrate mounting unit.

Due to the present invention, it is possible to increase the efficiency of the process of finally manufacturing the micro LED module as it is easy to apply the solder paste that binds the micro LED cell to the PCB substrate, and ultimately, mass production of the micro LED module Can be realized.

1 is an exemplary view showing a solder paste application apparatus according to an embodiment of the present invention.
2 is an exemplary view showing a state in which a solder paste according to an embodiment of the present invention is applied to a first application portion.
3 is an exemplary view showing a state in which a transfer unit is lowered to a substrate mounting unit according to an embodiment of the present invention.
4 is an exemplary view showing a state in which a plurality of needles transfer solder paste to a substrate according to an embodiment of the present invention.
5 is an exemplary view showing a state in which a casing is rotated by a rotating part according to an embodiment of the present invention.
6 is an exemplary view showing a method of manufacturing a micro LED module according to the present invention.

Terms and words used in this specification and claims should not be construed as being limited to their usual or dictionary meanings, and that the inventor can appropriately define the concept of terms in order to describe his own invention in the best way. Based on the principle, it should be interpreted as a meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all the technical spirit of the present invention, and various equivalents that can replace them at the time of application And it should be understood that there may be variations.

Hereinafter, prior to the description with reference to the drawings, matters that are not necessary to reveal the gist of the present invention, that is, known configurations that can be obviously added by those skilled in the art are not shown or described in detail. Make sure you didn't.

1 is an exemplary view showing a rotational solder paste application apparatus according to an embodiment of the present invention. As shown in FIG. 1, an embodiment of the present invention may include a transfer unit 100, a solder paste injection unit 200, a substrate mounting unit 300, and a three-axis moving unit 400.

The three-axis moving unit 400 is configured to transfer the transfer unit 100 on three axes. The x-axis moving part 410 and the y-axis moving part 420 shown in FIG. 1 change the position of the transfer part 100 on a plane having the same phase, and the z-axis moving part 430 is The height is varied within a position determined by the moving part 410 and the y-axis moving part 420.

The substrate mounting unit 300 has a configuration in which the substrate to which the solder paste is transferred is disposed on the upper side, and the transfer unit 100 can be transferred by the x-axis moving unit 410 and the y-axis moving unit 420. Is formed within the range. In addition, the substrate interposed above the substrate mounting unit 300 has a phase value equal to or higher than the lowest point at which the transfer unit 100 falls by the z-axis moving unit 430.

The solder paste injection unit 200 is configured to inject solder paste into the transfer unit 100, and a second application unit 210 and the second application unit ( It may include a horizontal actuator 220 for linearly reciprocating the 210. In addition, it is made of a structure communicating along the height direction, further includes a guide 230 for limiting the transport path of the second coating unit 210 and the horizontal actuator 220 by a plurality of partition walls. The guide 230 further includes a guide hole 231 communicating in the height direction, and the transfer part 100 is selectively disposed in the guide hole 231, so that the second application part 210 Solder paste is applied to the transfer unit 100.

The transfer unit 100 may further include a separate inspection unit 140 in a direction opposite to the upper surface of the substrate mounting unit 300. The inspection unit 140 has a configuration in which the transfer unit 100 scans an area of a substrate to which a solder paste is to be applied, and the second application unit 210 is applied to the transfer unit 100 according to a solder paste application area in the substrate. ) To determine the amount of solder paste applied.

2 is an exemplary view showing a state in which a solder paste according to an embodiment of the present invention is applied to the transfer unit 100. As shown in FIG. 2, the transfer unit 100 further includes a casing 120 to which a solder paste is applied by the second application unit 210 and a rotating unit 130 for inverting the casing 120 by 180 degrees. It can be made including.

When the casing 120 is disposed between the plurality of partition walls 231 as it is inverted by the rotation unit 130, the second application unit 210 is disposed in the casing 120 by the horizontal actuator 220. Linearly reciprocate the upper surface of In this case, the second application part 210 has a structure in which a surface in contact with the upper surface of the casing 120 is parallel, and a certain amount of solder paste is injected into the casing 120.

3 is an exemplary view showing a state in which the transfer unit 100 is lowered to the substrate mounting unit 300 according to an embodiment of the present invention. As shown in FIG. 3, the casing 120 may be raised or lowered by the z-axis moving part 430.

The substrate to which the casing 120 is to transfer the solder paste is placed on the upper side of the substrate placing unit 300, and the position of the transfer area is determined by the x-axis moving unit 410 and the y-axis moving unit 420 In the z-axis moving part 430 lowers the casing 120.

In this case, as shown in FIG. 2, in a state in which the casing 120 is disposed toward the upper side, re-inversion is performed by the rotation unit 130 so that the casing 120 is disposed toward the lower substrate.

4 is an exemplary view showing a state in which a plurality of needles 111 transfer solder paste to a substrate according to an embodiment of the present invention. As shown in FIG. 4, a first coating unit 110 for applying a solder paste to a substrate is disposed inside the casing 120. The first coating unit 110 further includes a plurality of needles 111 in physical contact with the upper side of the substrate, and a vertical actuator 112 for transferring the plurality of needles 111 in the height direction.

At this time, a plurality of holes 121 communicating along a height direction are formed on one surface of the casing 120 to which the solder paste is applied by the solder paste injection unit 200. The plurality of holes 121 may have a structure in which the distal ends of the plurality of needles 111 selectively penetrate. That is, depending on whether the vertical actuator 112 moves, the plurality of needles 111 may be configured to penetrate one surface of the casing 120.

The vertical actuator 112 is in a state in which the transfer unit 100 is lowered by the z-axis transfer unit 430 after the solder paste is applied to one surface of the casing 120 by the solder paste injection unit 200 The plurality of needles 111 are lowered at. Accordingly, the solder paste is transferred to the upper side of the substrate to perform solder paste transfer for manufacturing the micro LED module.

5 is an exemplary view showing a state in which the casing 120 is rotated by the rotating part 130 according to an embodiment of the present invention. As shown in FIG. 5, the transfer unit 100 is configured to vertically reverse the casing 120 and the casing 120 in which the plurality of needles 111 physically in contact with the substrate are accommodated therein. It may be formed by including the rotating unit 130.

The rotating part 130 is a rotating shaft 131 having a structure penetrating through the longitudinal direction of the casing 120 and a plurality of rotating shaft fixtures disposed on both sides of the casing 120 in the longitudinal direction to fix the rotating shaft 131 ( 132) may be included.

When the casing 120 is disposed in a state shown by the solid line in FIG. 5, the solder paste is applied to the upper side of the casing 120 by the solder paste injection unit 200. In order to transfer the solder paste to the substrate, the distal ends of the plurality of needles 111 must be disposed downward as shown in FIGS. 3 and 4. The casing 120 may be rotated about the rotation shaft 131, and the casing 120 may be vertically reversed through a state shown by a dotted line in FIG. 5.

6 is an exemplary view showing a method of manufacturing a micro LED module according to the present invention. First, a preparation step (S100) in which a substrate is placed on the substrate placing unit 300 and a solder paste is applied to the second coating unit 210 is performed. In this case, the inspection unit 140 may perform scanning of a region to which the solder paste is to be applied in the substrate.

Thereafter, a first transfer part plane transfer step (S200) in which the transfer part 100 moves in a plane toward the solder paste injection part 200 by the x-axis moving part 410 and the y-axis moving part 420. Perform. This step is performed while the tip ends of the plurality of needles 111 disposed inside the casing 120 face downward.

When the movement of the transfer unit 100 toward the solder paste injection unit 200 is completed, the casing 120 is rotated 180 degrees by the rotation unit 130 to reverse the first casing (S300). Implemented. As this step is performed, the distal ends of the plurality of needles 111 disposed in the casing 120 are converted to a state facing upward.

Thereafter, the step (S400) of raising the casing 120 to a predetermined height by the z-axis moving part 430 is performed. The casing 120 rises to a height at which the second application part 210 can inject solder paste into the plurality of holes 121 by the horizontal actuator 220, and the casing 120 Immediately after completion, the step (S500) of injecting the solder paste into the plurality of holes 121 by the second coating unit 210 is continuously performed.

When the injection of the solder paste into the casing 120 is completed, a step (S600) of moving the transfer unit 100 to the upper side of the substrate mounting unit 300 by the three-axis moving unit 400 is performed. . At this time, the transfer unit 100 is lowered by a predetermined height by the z-axis moving unit 430, and then the x-axis moving unit 410 and the y-axis moving unit 420 move in a plane sequentially. .

Thereafter, as the second casing reversal step (S700) in which the casing 120 is rotated 180 degrees once again by the rotation unit 130 is carried out, the distal end of the plurality of needles 111 disposed in the casing 120 Is converted to a state facing the lower substrate.

When one surface of the casing 120 into which the solder paste is injected is disposed toward the substrate, the z-axis moving part 430 and the vertical actuator 112 are sequentially lowered to apply the solder paste to the substrate (S800). Performed. Then, after the transfer unit 100 is separated from the substrate mounting unit 300 by the three-axis moving unit 400, the micro LED module is transferred to the substrate (S900), and the process is finished.

So far, the present invention has been looked at around its preferred embodiment.

The embodiments described in the present specification and the configurations shown in the drawings are related to one of the most preferred embodiments of the present invention, and do not represent all the technical spirit of the present invention, and thus various equivalents and modified It should be understood that there may be examples.

Therefore, the present invention is not limited to the examples presented, and is within the equivalent scope of the technical idea of the present invention and the technical idea described in the claims to be described below by a person of ordinary skill in the technical field to which the present invention belongs. There may be embodiments in which various modifications and changes are possible.

100: transfer part
110: first application unit
111: needle 112: vertical actuator
120: casing 121: hole
130: rotating part 131: rotating shaft
140: inspection unit
200: solder paste injection part
210: second application unit 220: horizontal actuator
230: guide 231: guide hole
300: substrate mounting unit
400: 3-axis moving part
410: x-axis moving part 420: y-axis moving part
430: z-axis moving part

Claims (5)

In the solder coating apparatus for bonding between a substrate and a micro light emitting diode,
Corresponds to the first applicator 110 including a plurality of needles 111 having a tip portion formed at one side in the longitudinal direction and a vertical actuator 112 for linearly reciprocating the needle 111 and the tip of the needle 111 Includes a plurality of holes 121 communicating inside and outside in a shape corresponding to the tip end of the needle 111 including a plurality of holes 121 communicating inside and outside in a shape The transfer unit 100 including a casing 120 to be;
Solder including a second coating unit 210 for applying solder paste to one surface of the casing 120 on which the plurality of holes 121 is formed, and a horizontal actuator 220 for linearly moving the second coating unit 210 A paste injection unit 200;
A substrate placing unit 300 for placing a substrate onto which the solder paste is transferred by the first application unit 110;
A three-axis moving unit 400 coupled to the transfer unit 100 to reciprocate between the solder paste injection unit 200 and the substrate mounting unit 300;
Including,
The transfer part 100 is
It is interposed under the solder paste injection part 200,
Including a rotation shaft 131 disposed in the center of the coupling portion of the first application portion 110 and the casing 120, the rotation portion 130 for rotating the first application portion 110 and the casing 120 Rotatable solder paste application device, characterized in that it further comprises.
The method of claim 1,
The second applicator 210 is
A rotational solder paste application device, characterized in that a surface of the casing 120 in which the plurality of holes 121 are formed and a surface in contact with each other are parallel and inject a certain amount of solder paste into the plurality of holes 121 .
The method of claim 1,
The solder paste injection part 200 is
It further comprises a guide 230 disposed under the second applicator 210 and the horizontal actuator 220 to limit the movement path of the actuator 220,
The guide 230 is
A guide hole 231 communicating with the outside is formed,
The width of the casing 120 is
A rotary solder paste coating apparatus, characterized in that the casing (120) is inserted into the guide hole (231) with a value smaller than the distance between the plurality of partition walls forming the guide hole (231).
The method of claim 1,
The transfer part 100 is
Rotatable solder paste coating apparatus, characterized in that it further comprises an inspection unit 140 facing the upper surface of the substrate mounting unit 300, photographing the transfer position of the first coating unit 110.
In the method of manufacturing a micro LED module using the solder paste application device of any one of claims 1 to 4,
Disposing a substrate on the substrate mounting unit 300 and applying a solder paste to the second application unit 210 (S100);
Transferring the transfer part 100 to the lower side of the solder paste injection part 200 by the three-axis moving part 400 (S200);
The rotating part 130 rotating the first application part 110 and the casing 120 180 degrees (S300);
The step of raising the transfer part 100 toward the solder paste injection part 200 by the three-axis moving part 400 (S400);
Injecting solder paste into the plurality of holes 121 formed on one surface of the casing 120 by the second application part 210 (S500);
After the three-axis moving part 400 lowers the transfer part 100 to a predetermined height, transferring it to the upper side of the substrate mounting part 300 (S600);
Rotating the first application unit 110 and the casing 120 by 180 degrees by the rotation unit 130 (S700);
Applying a solder paste to a substrate in which the transfer unit 100 is disposed above the substrate mounting unit 300 (S800); And
Transferring the micro LED to the upper side of the substrate on which the solder paste is applied (S900);
Micro LED module manufacturing method comprising a.

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