JPH05275844A - Apparatus for applying cream solder - Google Patents

Abstract

PURPOSE:To obtain an apparatus for applying cream solder in which coating can be inexpensively executed in a mass production manner without using a screen by lifting a transfer pin to bring it into contact with a member to which cream solder is to be transferred and which is supported by supporting means. CONSTITUTION:A cylinder 6 is so controlled that the upper end of a transfer pin 4 is slightly recessed from the surface of a stage 2. Then, when a squeegee 8 is moved in the direction indicated by the arrow, cream solder 7 is put in a space defined by a bush 8 and the upper end of the pin 4 while the squeezee 8 is moving. Thereafter, a circuit board A attracted by a suction pad 9 is moved down to a predetermined position, the pin 4 is lifted by the operation of the cylinder, and pressed to the terminal part of the board A, Thus, the solder 7 of the upper end of the pin 4 is transferred to the terminal part. The pins 4 are provided in accordance with the necessary number of terminals.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for depositing cream solder, and more particularly to a device for transferring cream solder to a terminal portion of a flexible printed wiring board.

[0002]

2. Description of the Related Art A conventional cream solder deposition device of this type has, for example, a steel screen having a frame and a predetermined print pattern arranged on a stage, and a squeegee movably arranged at the end of the screen. Is configured.

The application of cream solder to the terminal portion of the printed wiring board by this device is performed as follows. First,
The printed wiring board is placed at a predetermined position on the stage.
Next, the screen is brought into close contact with the surface of the printed wiring board. In this state, the squeegee moves the cream solder supplied to the end of the screen toward the other end. By this movement, a part of the cream solder adheres to the surface of the printed wiring board via the print pattern portion of the screen, thereby completing the attaching work.

[0004]

However, according to this structure, although the cream solder can be applied to the surface of the printed wiring board very efficiently, the squeegee is moved to press the screen. However, the screen is quickly worn away, and the accuracy of the printed pattern is reduced. For this reason, a new screen must be replaced, and since the replacement frequency is high, not only the attachment cost, but also the troublesome print pattern matching of the replacement screen must be performed many times. There is.

Further, when the cream solder at the corners of the screen or the like cannot be completely utilized during printing and remains, the amount thereof increases with the lapse of time and the amount of cream solder necessary for soldering cannot be supplied. For this reason, the steel screen needs to be cleaned every predetermined number of times of use, and the apparatus must be stopped each time, which causes a problem that the operating rate of the apparatus is reduced.

Therefore, an object of the present invention is to provide a cream solder deposition apparatus capable of mass-produced deposition work at low cost without using a screen.

[0007]

Therefore, in order to achieve the above-mentioned object, the present invention comprises a stage having a plurality of holes, and a transfer pin which is vertically inserted into the holes of the stage.
A squeegee for moving the cream solder arranged on the stage in a certain direction, and a supporting means positioned on the stage are provided. With the upper end of the transfer pin slightly retracted from the stage surface, the squeegee moves the cream solder to move the stage. The transfer pin is housed in a hole and is raised so that the transfer pin is brought into contact with the transfer target member supported by the supporting unit. The supporting unit is a vacuum suction pad and the transfer target member is a printed wiring board. It is characterized by being.

Further, according to the present invention, a base, a cream solder accommodating portion movably arranged on a base portion of the base, and a transfer unit arranged so that a peripheral surface thereof contacts the cream solder in the accommodating portion, The transfer unit is provided with a scraper for removing cream solder attached to the peripheral surface of the transfer unit, and a holder unit for supporting a transfer target member that moves while contacting the peripheral surface of the transfer unit. The transfer unit includes a rotary drum having a plurality of holes opening on the peripheral surface, a fixed drum having a hole opening on the peripheral surface and opening on the peripheral surface, a rotary shaft located in the fixed drum, and one end rotating. It is rotatably connected to the shaft portion and includes a crankshaft having the other end inserted into the hole of the fixed drum, and is configured to operate the transfer pin by the crankshaft. The shooting pin, in which it at the other end was placed a spring so as to elastically contact with the peripheral surface of the fixed drum.

Further, according to the present invention, a stage having a block on its upper portion, a scraping floc which moves up and down on the block and has comb-shaped scraping portions on its side surface at a predetermined pitch interval, and is mounted on the stage. The squeegee that moves so that the cream solder that is pressed against the side surface of the block and the adherend are supported, and the end of the adherend is brought into contact with the cream solder on the side surface of the block and also contacts the scraping part of the scraping block. And a coating and scraping unit that rotates as much as possible.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, one embodiment of the present invention will be described with reference to FIGS.
Will be described.

In the figure, A is a member to be transferred,
The illustrated example is a printed wiring board. This printed wiring board A
Are formed by forming wirings, lands, etc. on a flexible substrate B in a predetermined pattern, and forming terminal portions C for connection with a connector or the like at the ends. A transfer unit 1 has, for example, a plurality of holes (through holes) 2a at a constant pitch interval, and a stage 2 having a bush 3 made of resin, metal, or the like mounted on the holes 2a for smoothing the sliding property. The transfer pin 4 is inserted into the bush 3 of the stage 2, a holder 5 that supports the base 4a of the transfer pin 4, and a cylinder 6 that moves the transfer pin 4 up and down together with the holder 5. A cream solder 7 is placed on the upper surface of the stage 2.

On the other hand, a squeegee 8 is arranged above the transfer unit 1 so as to be movable along the upper surface of the stage 2 in the direction of the arrow in the figure. Further, a so-called vacuum suction pad 9 utilizing a supporting means, for example, a negative pressure, is arranged above it so as to be vertically movable. The suction pad 9 sucks the printed wiring board A.

FIG. 3 is a schematic overall structural view of the embodiment shown in FIGS. 1 and 2, in which the squeegee 8 is a guide shaft 8.
The cylinder 8b is configured to move in the X direction along a and 8a. The support member of the suction pad 9 moves in the Y direction along the guide axis by the cylinder 8c, and moves up and down by the cylinder 8d.

In this structure, the cream solder 7 is attached to the printed wiring board A in the following manner. First, the cylinder 6 is controlled so that the upper end of the transfer pin 4 is slightly retracted from the surface of the stage 2. Next, when the squeegee 8 is moved in the arrow direction shown in FIG. 1,
The cream solder 7 is filled in the space formed by the bush 3 and the upper end of the transfer pin 4 during its movement. Next, the printed wiring board A in a sucked state on the suction pad 9 is lowered to a predetermined position, and the transfer pin 4 is raised by the operation of the cylinder 6 and pressed against the terminal portion C of the printed wiring board A. As a result, the cream solder 7 on the upper end of the transfer pin 4 is transferred to the terminal portion C. The transfer pin 4 is
It may be provided according to the number of terminals that need to be transferred.

4 to 6 show another embodiment of the present invention. In the figure, 10 is a base, which is, for example, L-shaped and has a base portion 10a and a rising portion 10b. A long hole 10c that is long in the lateral direction is formed in the rising portion. An accommodating portion 11 for the cream solder 7 is arranged in the base portion 10a by a cylinder 12 so as to be movable in the direction of the arrow in the figure. A substantially U-shaped scraper 13 for removing the cream solder 7 attached to a transfer unit, which will be described later, is fixed to the opposite side of the housing portion 11. The tongue pieces 13 located on both sides of the scraper 13
a is for removing the cream solder 7 attached to the side surface of the transfer unit.

On the other hand, the transfer unit 14 is supported on the rising portion 10b of the base 10. The transfer unit 14 has, for example, a plurality of holes (through holes) opened on the peripheral surface.
15a and a rotary drum 15 having a hollow shaft 15b, and a hole (through hole) 17a is concentrically arranged inside the rotary drum 15 and corresponds to the hole 15a of the rotary drum 15. A hollow fixed drum 17 having
A rotary shaft 18 arranged concentrically inside the fixed drum 17, a drive system including a servo motor 19 and a gear 20 for appropriately rotating the rotary drum 15, a motor 21 for rotating the rotary shaft 18, and a rotary shaft. Crank shaft 22 eccentrically supported by 18 and rotatably supported, the end of which is inserted into hole 17a of fixed drum 17, one end of which is inserted into hole 15a of rotating drum 15, and the other end of which is fixed drum 1
A transfer pin 23 arranged so as to contact the peripheral surface of 7,
The other end of the transfer pin 23 is composed of a spring 24 arranged so as to elastically contact the peripheral surface of the fixed drum 17. The shaft 15b of the rotary drum 15 is rotatably supported by the rising portion 10b.

Further, the long hole 10c of the rising portion 10b
A holder unit 25 that moves in synchronization with the rotation of the rotary drum 15 is arranged in the. The holder unit 25 includes, for example, a rotating portion 25 having a suction function on the lower surface side.
a, a base portion 25b that moves along the long hole 10c,
It is fixed to the base part 25b, and the rotating part 25a
It is composed of a cylinder 26 that rotates 0 degrees.
It should be noted that the holder unit 25 is preferably driven by using the drive system of the rotary drum 15, but the movement may be appropriately controlled without using the drive system.

In this structure, the cream solder 7 is attached to the printed wiring board A in the following manner. First, the cylinder 26 of the holder unit 25 is operated to rotate the rotating portion 25a by 90 degrees in the direction of the arrow in the figure.
In this state, the printed wiring board A is sucked onto the lower surface side (vacuum suction portion) of the rotating portion 25a, and the rotating portion 25a is returned to the illustrated state based on the operation of the cylinder 26. Next, when the rotating drum 15 of the transfer unit 14 is rotated at a constant speed (either continuous rotation or intermittent rotation is possible), the cream solder 7 adheres to the peripheral surface portion thereof. At this time, the transfer pin 2
3 is positioned such that one end (peripheral surface side) thereof is slightly retracted from the peripheral surface of the rotary drum 15, and the other end is fixed drum 1.
It slides along the peripheral surface of 7. Therefore, the cream solder 7 is also filled in the space formed by the hole 15 a and the transfer pin 23. When the rotating drum 15 rotates further, the scraper 13 removes the cream solder 7 attached to the periphery of the drum. When the rotary drum 15 is further rotated and the hole 15a of the rotary drum 15 is located at the upper portion, the rotary drum 15 is rotated.
The holder unit 25 also starts to move in synchronization with the rotation of. Then, as shown in FIG. 4, when the position of the transfer pin 23 and the position of the terminal portion C of the printed wiring board A match, the tip end of the crankshaft 22 is made into a hole 17 by the rotary shaft 18.
It is pushed out from a and pushes up the transfer pin 23 against the elasticity of the spring 24. Therefore, the end of the transfer pin 23 projects from the hole 15a, and the cream solder 7 attached to the end is transferred to the terminal C of the printed wiring board A. The rotary shaft 18 makes one rotation while the next transfer pin 23 moves onto the hole 17a. Thereafter, the cream solder 7 is similarly transferred to each terminal portion C.

7 to 8 show a further different embodiment of the present invention. In the figure, 27 is a stage,
A block 28 having a prismatic shape is fixed to the central portion thereof. A squeegee 29 for moving the cream solder 7 toward the block 28 is arranged above the stage 27. Further, above the block 28, a scraping block 30 having comb-shaped scraping portions 30a on both side surfaces is arranged so as to be vertically movable. Further, a coating scraping unit 31 is arranged above the stage 27. The scraping unit 31 includes a chuck 32 for supporting (holding) and rotating the printed wiring board A, a cylinder 33 for horizontally moving the entire chuck mechanism, and a cylinder for vertically moving the entire chuck mechanism. It consists of The squeegee portion of the squeegee 29 is configured to be able to absorb and displace the force when a load (pressing force) above a certain level is applied.

In this structure, the cream solder 7 is attached to the printed wiring board A in the following manner. First, the scraping block 30 and the coating scraping unit 31 are retracted upward. Next, when the squeegee 29 is moved to the left, the cream solder 7 is pressed against the block 28. The squeegee portion gets over the block 28 while being displaced rearward by the pressing force from the block 28. Then, the squeegee 29 is returned to the original position on the right side. In this state, the scraping block 30 and the coating scraping unit 31 are lowered to the positions shown in the figure. Then, the tip portion of the printed wiring board A supported by the chuck 32 is rotated so as to be pressed against the scraping block 30 while being in contact with the cream solder 7. As a result, the printed wiring board A is attached to the tip portion (for example, the terminal portion). Of the cream solder 7 adhered to the entire tip portion, the cream solder 7 adhered between the terminal portions is the scraping portion 30 that matches the pitch interval of the terminal portions.
removed by a. In particular, when it is necessary to apply the cream solder 7 to both surfaces of the printed wiring board A, after the cream solder 7 is attached to the terminal portion on one surface, the entire chuck mechanism is moved to the left by the cylinder 33. Then, by performing the same operation as described above, the cream solder can be adhered to the other surface.

[0021]

As described above, according to the present invention, it is possible to surely transfer to a desired position by using the transfer pin of the transfer unit without using a screen, and it is possible to improve mass productivity. ..

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention.

FIG. 2 is a schematic perspective view of FIG.

FIG. 3 is a perspective view showing a schematic overall configuration of FIG.

FIG. 4 is a perspective view showing another embodiment of the present invention.

5 is an enlarged cross-sectional view of a main part of a transfer unit portion shown in FIG.

FIG. 6 is a side sectional view of a transfer unit portion shown in FIG.

FIG. 7 is a side view showing still another embodiment of the present invention.

8 is a perspective view of the scraping block shown in FIG. 7. FIG.

[Explanation of symbols]

 A Transferred member (printed wiring board) C Terminal part 1,14 Transfer unit 2,27 Stage 4,23 Transfer pin 7 Cream solder 8,29 Squeegee 9 Supporting means (vacuum suction pad) 10 Base 10a Base 11 Housing 13 Scraper 15 Rotating Drum 15a Hole 17 Fixed Drum 17a Hole 18 Rotating Shaft 22 Crankshaft 24 Spring 25 Holder Unit 25a Rotating Part (Suction Part) 28 Block 30 Scraping Block 30a Scraping Part 32 Chuck

Claims (6)

[Claims] 1. A stage having a plurality of holes, a transfer pin which is inserted into the hole of the stage and moves up and down, a squeegee which moves the cream solder arranged on the stage in a certain direction, and a supporting means which is located on the stage. With the upper end of the transfer pin slightly retracted from the stage surface,
An apparatus for depositing cream solder, characterized in that the cream solder is accommodated in a stage hole by movement by a squeegee, and a transfer pin is raised to make contact with a member to be transferred supported by a supporting means. 2. The cream solder deposition apparatus according to claim 1, wherein the support means is a vacuum suction pad. 3. The cream solder deposition apparatus according to claim 1, wherein the transfer target member is a printed wiring board. 4. A base, a housing for the cream solder movably arranged on the base of the base, a transfer unit arranged so that the peripheral surface is in contact with the cream solder in the housing, and a periphery of the transfer unit. The transfer unit includes a scraper located on the surface of the transfer unit for removing the cream solder adhering to the peripheral surface of the transfer unit, and a holder unit for supporting the transfer target member that moves while contacting the peripheral surface of the transfer unit. A rotary drum having a plurality of holes that open in the surface, a fixed drum that is located in the rotary drum and that has a hole that opens in the peripheral surface, a rotary shaft that is located in the fixed drum, and one end that rotates to the rotary shaft portion. A cream half characterized in that it includes a crankshaft that is operably connected and that the other end is inserted into a hole of a fixed drum, and that the transfer pin is operated by the crankshaft. Paddling device. 5. The cream solder deposition device according to claim 4, wherein a spring is arranged on the transfer pin such that the other end of the transfer pin elastically contacts the peripheral surface of the fixed drum. 6. A stage having a block on an upper portion thereof, a scraping floc having a comb tooth-shaped scraping portion which moves up and down on the block and has a side surface at a predetermined pitch interval, and a cream solder placed on the stage. Supports the squeegee that moves so as to press against the side of the block and the adherend,
Adhesion of cream solder, comprising: an application scraping unit that rotates the end of the adherend to contact the cream solder on the side surface of the block and to contact the scraping part of the scraping block. apparatus.