KR102268086B1 - Display panel teg testing assembly, forming method and testing method for the same - Google Patents

Abstract

A monitor panel TEG test assembly according to the present invention includes: a plurality of test bonding pads sequentially installed on the monitor panel; and a plurality of metal lead wires that are electrically isolated from each other and are installed to correspond to the plurality of test bonding pads one by one and are drawn out one by one from each test bonding pad, wherein the first metal lead wire drawn from the first test bonding pad is used for the third test The third metal lead wire drawn out from the bonding pad is connected to form a first test key, and the second metal lead wire drawn out from the second test bonding pad is connected to the fifth metal lead wire drawn out from the fifth test bonding pad to form a second test key. a test key is formed, and a fourth metal lead wire drawn out from the fourth test bonding pad is connected to a sixth metal lead wire drawn out from the sixth test bonding pad to form a third test key; The first test key and the second test key are crossed, and the second test key and the third test key are crossed. The present invention reduces the area occupied by the test bonding pad and the metal lead wire on the panel, thereby improving the glass utilization and increasing the monitoring items of the test key.

Description

DISPLAY PANEL TEG TESTING ASSEMBLY, FORMING METHOD AND TESTING METHOD FOR THE SAME

The present invention relates to a liquid crystal monitor and/or OLED monitor technology field, and in particular, a TEG (Test Element Group) test key group (or test) that tests for RC (Contact Resistance) characteristics in an electric circuit of a monitor panel. assembly) and a method for forming and testing the same.

In the manufacturing stage of the monitor panel product, in order to monitor the characteristic value of the effective light emitting area (AA area, active area) of the monitor panel product, some TEG test keys are installed around the big board or around the panel of the monitor panel. Bar, such a test key is, for example, RC of various assemblies such as TFT (thin film transistor) / RS (line resistance or sheet resistance) / RC (contact resistance between different conductors) / C (capacitance) in the electric circuit of the monitor panel Used to monitor characteristics. Considering the effective utilization rate of the product substrate (glass), the smaller the area occupied by the test key under the condition that the monitoring demand is satisfied, the better.

1 is a diagram of the basic arrangement and structure of a monitor panel TEG test assembly in the prior art. The current RC test key is designed using four independent bonding pad (PAD) design methods, and two test key sets R (Metal 1, Metal 2) and R (Metal 2) , at least 8 bonding pads PAD1-PAD8 and 8 metal lead wires are required to form a metal 3). Here, the independent bonding pad (PAD) design method of the four probes is in each test key set R (Metal 1, Metal 2) or R (Metal 2, Metal 3), Each of the four probes is placed on PAD1, PAD2, PAD3 and PAD4 or on PAD5, PAD6, PAD7 and PAD8 to perform 4-point resistivity measurement.

Therefore, under the premise of conducting an effective test on the RC characteristics of the monitor panel, reducing the number of bonding pads and lead wires and their area is a problem that needs to be urgently solved in the current industry.

In order to overcome the deficiencies of the prior art, the present invention provides a monitor panel TEG test assembly and a test method therefor. The use of a test bonding pad and a metal lead wire is reduced in an RC characteristic test design so that the test bonding pad and the metal lead wire are installed on the panel. The glass utilization rate is improved by reducing the occupied area of

Furthermore, the present invention increases the monitoring items of the test key under the premise of reducing the area occupied by the bonding pad of the test key.

The present invention uses the following technical measures.

According to one aspect of the present invention, the monitor panel TEG test assembly includes a plurality of test bonding pads sequentially installed on the monitor panel; and a plurality of metal lead wires that are electrically isolated from each other and are installed to correspond to the plurality of test bonding pads one by one and are drawn out one by one from each test bonding pad, wherein the first metal lead wire drawn out from the first test bonding pad is the first The third metal lead wire drawn out from the third test bonding pad is connected to form a first test key, and the second metal lead wire drawn out from the second test bonding pad is connected to the fifth metal lead wire drawn out from the fifth test bonding pad. a second test key is formed, and a fourth metal lead wire drawn out from the fourth test bonding pad is connected to a sixth metal lead wire drawn out from the sixth test bonding pad to form a third test key; The first test key and the second test key cross each other, and the second test key crosses the third test key.

According to another method of the present invention, the test method of the monitor panel TEG test assembly is a test method of the monitor panel TEG test assembly that tests the RC characteristics of the monitor panel using the monitor panel TEG test assembly as described above. The test method includes the steps of: performing an online/offline test on the RC characteristics of the panel product using a machine workbench among the manufacturing methods of the panel product; comparing the test result with the index standard of the RC characteristic related to the product to determine whether it meets the requirements of the product quality standard; If the requirements are met, continuing to use the product manufacturing method to manufacture subsequent products; And if it does not meet the requirements, the step of disposing of the product and at the same time improving the product manufacturing method; includes.

The present invention can reduce the occupied area on the monitor panel by 1/4 by reducing two test bonding pads and two metal lead wires through an optimized design for the arrangement and structure of the TEG test assembly. On the basis of ensuring that monitoring proceeds for point-independent bonding pads and two test key groups R (Metal 1, Metal 2) and R (Metal 2, Metal 3) By increasing the monitoring for one separate test key group R (Metal 1, Metal 2, Metal 3), the characteristics of the effective light emitting area can be monitored comprehensively, and the monitoring results are also It further approaches the true situation of the RC characteristics of the effective monitor area.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The arrangement and embodiments will be described in detail with reference to the following drawings, wherein the same reference numerals indicate the same elements.
1 is a diagram of the basic arrangement and structure of a monitor panel TEG test assembly in the prior art.
2 is a diagram of a specific arrangement and structure of a monitor panel TEG test assembly of an embodiment according to the present invention.
3 is a diagram of a specific arrangement and formation method of a monitor panel TEG test assembly according to an embodiment according to the present invention.
4 is a flowchart of a monitor panel TEG test method according to an embodiment of the present invention.

Hereinafter, a plurality of embodiments of the present invention will be described in detail with reference to the drawings. For clarity of explanation, details of a plurality of embodiments are described together in the following description. However, it should be understood that the details of these examples are not intended to limit the present invention.

2 is a diagram of a specific arrangement and structure of a monitor panel TEG test assembly of an embodiment according to the present invention.

As shown in Fig. 2, in the embodiment according to the present invention, the monitor panel TEG test assembly includes six test bonding pads PAD1 to PAD6 sequentially installed on the monitor panel; and six metal lead wires that are installed to correspond to the six test bonding pads and are drawn out one by one from each test bonding pad, wherein the first metal lead drawn from the first test bonding pad is drawn from the third test bonding pad. The third metal lead wire is connected to form a first test key metal 1, and the second metal lead wire drawn out from the second test bonding pad is connected to the fifth metal lead wire drawn out from the fifth test bonding pad to form a second A test key metal 2 is formed, and a fourth metal lead wire drawn out from the fourth test bonding pad is connected to a sixth metal lead wire drawn out from the sixth test bonding pad to form a third test key metal 3 do.

The first test key metal 1 and the second test key metal 2 cross each other, and the second test key metal 2 and the third test key metal 3 cross each other.

Here, the monitor panel TEG test assembly further includes a plurality of insulating layers installed between each of the two metal lead wires among the plurality of metal lead wires, and the first test key metal 1 and the first test key metal 1 of the first insulating layer A first through hole H1 is installed at a position where a second test key metal 2 intersects, and the second test key metal 2 and the third test key metal 3 of the second insulating layer are formed. A second through hole H2 is installed at the intersecting position.

By inserting a first conductive passage V1 into the first through hole H1 at a position where the first test key metal 1 and the second test key metal 2 intersect, a first test key group R ( Forming a metal (metal) 1, a metal (metal) 2),

A second test key group R ( Forming a metal (metal)2, a metal (metal3),

Among the first through-hole H1 at a position where the first test key metal 1 and the second test key metal 2 intersect, the second test key metal 2 and the third test key metal A third test key group R (metal 1, metal) by simultaneously inserting the first conductive passage V1 and the second conductive passage V2 into the second through hole H2 at a position where (metal) 3 intersects )2, a metal 3) is formed.

It should be noted that the intersection between the first test key metal 1 and the second test key metal 2 and between the second test key metal 2 and the third test key metal 3 is all This is an electrically isolated crossing method, that is, when a conductive passage is not inserted into such a through hole at the crossing position, these test keys are electrically isolated from each other. In this way, the number of test bonding pads installed on the monitor panel may not be limited to six according to the function or performance index of the product to be tested in this way.

Hereinafter, a method for forming a monitor panel TEG test assembly and a test method according to the present invention will be described in detail.

As described above, the design method of the monitor panel TEG test assembly according to the present invention is as follows. During the manufacturing process of the monitor panel product, 3 groups of test key groups R (metal 1, metal 2), R (metal 2, metal 3) and Install six test bonding pads PAD1 to PAD6 for testing and monitoring the circuit of R (metal1, metal2, metal3), wherein the test bonding pad PAD1 and the test bonding pad PAD3 Form test key metal 1 by connecting the metal lead wires of the test key metal 1, connect the metal lead wires of test bonding pad PAD4 and test bonding pad PAD6 to form test key metal 3, and test bonding pad PAD2 and test bonding A test key metal 2 is formed by connecting the metal lead wire of the pad PAD5. The test key metal 2 intersects the test key metal 1 and the test key metal 3, respectively, and the two contact through holes corresponding to the two intersecting positions, respectively, and the conductive passage inserted therein. through mutual contact.

The distribution method of the test bonding pads PAD1 to PAD6 and their metal lead wires on the monitor panel is not limited to that shown in FIG. 2, but may be determined according to the actual space of the substrate (glass).

3 is a view exemplarily showing a specific structure and forming method of a monitor panel TEG test assembly according to an embodiment of the present invention.

As shown in Figure 3, in one embodiment according to the present invention, the method of forming the test key group R (Metal 1, Metal 2) of the present invention is as follows.

Step 1.1: Coating, exposure and etching are performed on the first metal layer Metal 1, and a pattern of the first metal layer Metal 1 is formed according to the demand;

Step 1.2: depositing the first insulating layer in the first half on top of the pattern of the first metal layer Metal1, and corresponding to a position where the first test key and the second test key of the first insulating layer intersect The first through hole is cut and installed at the

Step 1.3: A pattern of the second metal layer is formed on the first insulating layer by a method similar to the method of forming the pattern of the first metal layer (Metal) 1 on the first insulating layer; and

Step 1.4: At this time, insert the first conductive passage V1 in the first through hole to form the first test key group R (Metal 1, Metal 2), and test using the 4-point probe resistivity measurement method. However, the four probes are installed on the bonding pads PAD1, PAD 2, PAD 3 and PAD 5, respectively, as shown in FIG. 2 .

Similarly, referring to Figure 3, in one embodiment according to the present invention, the method of forming the test key group R (Metal 2, Metal 3) of the present invention is as follows.

Step 2.1: According to the above method, the first half of the second insulating layer is deposited on top of the pattern of the second metal layer, Metal2, and the position where the second test key of the second insulating layer and the third test intersect The second through-hole is cut and installed at a position corresponding to ;

Step 2.2: forming a pattern of the third metal layer metal 3 in a method similar to the method of forming the pattern of the first metal layer Metal 1 above the second insulating layer;

Step 2.3: A second test key group R (Metal 2, Metal 3) is formed by inserting a second conductive passage V2 into the second through hole, and the first through hole and the first through hole are formed. A third test key group R (Metal 1, Metal 2, Metal 3) is formed by simultaneously inserting the first conductive passage V1 and the second conductive passage V2 into the second through-holes, The test is carried out using a four-point probe resistivity measurement method, where the four probes of the second test key group R (Metal 2, Metal 3) are each bonding pad PAD2, Installed on PAD4, PAD5 and PAD6, the 4 probes of the third test key group R (Metal 1, Metal 2, Metal 3) are bonding pads as shown in FIG. 2, respectively. Install on PAD1, PAD2, PAD5 and PAD6.

4 is a flowchart of a monitor panel TEG test method according to an embodiment of the present invention.

As shown in Fig. 4, in one embodiment according to the present invention, the basic principle of the test method of the monitor panel TEG test assembly of the present invention is to perform a four-point probe resistivity test using a test machine workbench. , specifically including monitoring or testing steps as follows.

In the panel product manufacturing method, an online/offline test is performed on the RC characteristics of the panel product using a machine workbench, and the specific test operation is as follows.

1) A first test key group R (Metal 1, Metal 2) is formed by inserting a first conductive passage into the first through hole, and four probes are applied to the test bonding pads PAD1 and PAD2, respectively. , test the electrical circuit contact resistance between these 4 test bonding pads by installing them on PAD3 and PAD5;

2) A second test key group R (Metal 2, Metal 3) is formed by inserting a second conductive passage into the second through hole, and four probes are applied to the test bonding pads PAD2 and PAD4, respectively. , test the electrical circuit contact resistance between these 4 test bonding pads by installing them on PAD5 and PAD6; and/or

3) The third test key group R (Metal 1, Metal 2, Metal) by simultaneously inserting the first conductive passage and the second conductive passage into the first and second through holes. 3), and test the electrical circuit contact resistance between these four test bonding pads by installing four probes on the test bonding pads PAD1, PAD2, PAD5 and PAD6, respectively.

comparing the test result with the index standard of the RC characteristic related to the product to determine whether it meets the requirements of the product quality standard;

If the requirements are met, continue to use the manufacturing method to manufacture subsequent products; and

If the requirements are not met, the product is discarded and the product manufacturing method is improved, and the above steps are repeated.

By designing in this way, the effective use space of the substrate (glass) of the monitor panel product can be increased, and the occupied area on the monitor panel is reduced by 1/4 by reducing two test bonding pads and two metal lead wires. In addition, effective light emission by increasing the monitoring (that is, increasing the monitoring items of the test key) of a separate test key group R (Metal 1, Metal 2, Metal 3) The characteristics of the area can be monitored comprehensively, and the monitoring results are closer to the true situation of the RC characteristics of the effective monitoring area. This makes the monitoring of the test key more meaningful.

For those of ordinary skill in the art, various changes and corrections can be made to the present invention under the premise that does not depart from the spirit and scope of the present invention. Accordingly, various corrections and changes made with respect to the present invention should be regarded as belonging to the present invention as long as they are included within the scope of protection of the appended claims and their equivalent measures.

Claims (5)

a plurality of test bonding pads sequentially installed on the monitor panel; and
and a plurality of metal lead wires electrically isolated from each other and installed to correspond to a plurality of test bonding pads one by one and drawn out one by one from each test bonding pad,
The first metal lead wire drawn out from the first test bonding pad is connected to the third metal lead wire drawn out from the third test bonding pad to form a first test key, and the second metal lead wire drawn out from the second test bonding pad is the second metal lead wire drawn out from the second test bonding pad. The fifth metal lead wire drawn out from the 5 test bonding pad is connected to form a second test key, and the fourth metal lead wire drawn out from the fourth test bonding pad is connected to the sixth metal lead wire drawn out from the sixth test bonding pad. forming a third test key;
The monitor panel TEG test assembly, characterized in that the first test key and the second test key cross each other, and the second test key and the third test key cross each other.
According to claim 1,
Further comprising a plurality of insulating layers provided between each of the two metal lead wires among the plurality of metal lead wires,
A first through hole is provided at a position corresponding to the intersection of the first test key and the second test key of the first insulating layer, and at the intersection of the second test key and the third test key of the second insulating layer. A monitor panel TEG test assembly, characterized in that the second through-hole is installed at a corresponding position.
3. The method of claim 2,
A first test key group is formed by inserting a first conductive passage into the first through hole,
A second test key group is formed by inserting a second conductive passage into the second through hole,
and a third test key group is formed by inserting the first conductive passage and the second conductive passage into the first through hole and the second through hole.
4. The method according to any one of claims 1 to 3,
The number of the plurality of test bonding pads is 6, and the number of the plurality of metal lead wires is 6, the monitor panel TEG test assembly.
In the test method of the monitor panel TEG test assembly, the RC characteristic of the monitor panel is tested using the monitor panel TEG test assembly according to any one of claims 1 to 3,
In a method for manufacturing a panel product, performing an online/offline test on the RC characteristics of the panel product using a machine workbench;
comparing the test result with the index standard of the RC characteristic related to the product to determine whether it meets the requirements of the product quality standard;
If the requirements are met, continuing to use the product manufacturing method to manufacture subsequent products; and
If it does not meet the requirements, the step of disposing of the product and improving the manufacturing method of the product at the same time;
Testing performed using a machine workbench,
A first test key group is formed by inserting a first conductive passage into the first through hole, and four probes are respectively placed on the first test bonding pad, the second test bonding pad, the third test bonding pad and the fifth test bonding pad. testing the electrical circuit contact resistance between the four test bonding pads by installing in the ;
A second conductive passage is inserted into the second through hole to form a second test key group, and four probes are placed on the second test bonding pad, the fourth test bonding pad, the fifth test bonding pad, and the sixth test bonding pad, respectively. testing the electrical circuit contact resistance between the four test bonding pads by installing in the ; and/or
A third test key group is formed by simultaneously inserting the first conductive passage and the second conductive passage into the first through hole and the second through hole, and the four probes are respectively inserted into the first test bonding pad and the second test bonding pad. and testing the electrical circuit contact resistance between the four test bonding pads by installing them on the fifth test bonding pad and the sixth test bonding pad.

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