CN203631542U - Via reliability testing structure - Google Patents
Via reliability testing structure Download PDFInfo
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- CN203631542U CN203631542U CN201320804315.2U CN201320804315U CN203631542U CN 203631542 U CN203631542 U CN 203631542U CN 201320804315 U CN201320804315 U CN 201320804315U CN 203631542 U CN203631542 U CN 203631542U
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Abstract
The utility model discloses a via reliability testing structure comprising at least two adjacent interconnection layers. Every two adjacent interconnection layers are connected through a via structure. Each interconnection layer comprises a plurality of units. Each unit comprises a first interconnection line and multiple second interconnection lines connected with the first interconnection line. The first interconnection lines of different units are arranged in a first direction. The multiple second interconnection lines in a same unit are arranged in a second direction. The via structure comprises a first via and a second via. The first interconnection lines of adjacent interconnection layers are correspondingly connected through the first via. The second interconnection lines of adjacent interconnection layers are correspondingly connected through the second via. The testing structure may accurately evaluate the reliability of the via.
Description
Technical field
The utility model relates to reliability (Reliability) field in semiconductor manufacturing industry, particularly relates to a kind of through hole reliability testing structure.
Background technology
At the back segment (back-end-of-line of semiconductor device, BEOL) in technique, can be according to the difference multiple layer metal interconnection layer of need to growing in Semiconductor substrate, every layer of metal interconnecting layer comprises metal interconnecting wires and insulating barrier (being generally dielectric), between different metal interconnecting layers, realizes electrical connection by through hole (via).This just need to manufacture groove (trench) and through hole to above-mentioned insulating barrier, then plated metal in above-mentioned groove and through hole, and the metal of deposition is metal interconnecting wires, generally selects copper or aluminium as metal interconnected wire material.
As shown in Figure 1, in the prior art in normal interconnection structure, on active area (active area) 11, deposit an interlayer dielectric layer (Interlayer Dielectric, be called for short ILD) 12, in described interlayer dielectric layer 12, there is connecting hole (contact, be called for short CT) 13, described connecting hole 13 is for realizing the electrical communication of active area 11 and the interconnection structure of back segment.On described interlayer dielectric layer 12, deposit one deck dielectric 14, described dielectric 14 is commonly referred to as inter-metal dielectric (Inter Metal Dielectric is called for short IMD), for isolated interconnection line 15 and through hole 16.
But, in the time preparing through hole 16, usually there is over etching.As shown in Figure 2, in the drawings 2, identical reference number represents to be equal to the label in Fig. 1.Through hole 16 ', due to over etching, can be formed in the other described dielectric 14 of interconnection line 15, as shown in Fig. 2 dashed region, thereby forms cavity.But, in the test structure of prior art, can not assess exactly the reliability of through hole.Therefore, how to provide a kind of through hole reliability testing structure, the reliability of energy accurate evaluation through hole, thus the accuracy of assurance interconnection structure fail-safe analysis has become the problem that those skilled in the art need to solve.
Utility model content
The purpose of this utility model is, a kind of through hole reliability testing structure is provided, the reliability of energy accurate evaluation through hole, thereby the accuracy of assurance interconnection structure fail-safe analysis.
For solving the problems of the technologies described above, the utility model provides a kind of through hole reliability testing structure, comprises at least two-layer adjacent interconnection layer, all connects by a through-hole structure, wherein between the interconnection layer of every adjacent two layers;
Each interconnection layer all has and comprises some unit, multiple the second interconnection lines that described in each, unit includes one first interconnection line and is connected with described the first interconnection line, described the first interconnection line between different described unit is arranged at first direction, and multiple described the second interconnection line among same described unit is arranged in second direction;
Described through-hole structure comprises the first through hole and the second through hole, between the first interconnection line of adjacent described interconnection layer, connects by described the first through hole is corresponding, between the second interconnection line of adjacent described interconnection layer, connects by described the second through hole is corresponding;
Described the first interconnection line, the second interconnection line, the first through hole and the second through hole are by a dielectric insulation interval.
Further, described the first interconnection line and the second interconnection line are bar shaped.
Further, in same described unit, described the first interconnection line is cross with multiple described the second interconnection lines respectively.
Further, described the first interconnection line has multiple the first junctions, and described the first interconnection line is connected with described the first through hole in described the first junction; Described the first interconnection line has multiple the second junctions, and described the first interconnection line is crossing with described the second interconnection line in described the second junction, and described multiple the first junctions and multiple the second junction are staggered in described second direction.
Further, described the second interconnection line cross arrangement in described second direction in different described unit.
Further, described the second interconnection line is connected with described the second through hole at end points place.
Further, in same described interconnection layer, the width of the width of described the first interconnection line and the second interconnection line is the minimum widith of the interconnection line of design rule.
Further, in same described interconnection layer, the spacing between spacing and the second interconnection line between described the first interconnection line is the minimum spacing of the interconnection line of design rule.
Further, in same described interconnection layer, the diameter of the diameter of described the first through hole and the second through hole is the through hole minimum widith of design rule.
Further, in same described interconnection layer, the spacing between spacing and the first through hole and the second through hole between spacing, the second through hole between described the first through hole is all more than or equal to the through hole minimum spacing of design rule.
Compared with prior art, the through hole reliability testing structure that the utility model provides has the following advantages;
The through hole reliability testing structure that the utility model provides, each interconnection layer of this test structure all has described the first interconnection line of arranging at first direction and described the second interconnection line of arranging in second direction, between the first interconnection line of adjacent described interconnection layer, connect by described the first through hole is corresponding, between the second interconnection line of adjacent described interconnection layer, connect by described the second through hole is corresponding, compared with prior art, whether this test structure can detect the position of described the first through hole on described first direction and occur extremely, whether can detect the position of described the second through hole in described second direction occurs extremely simultaneously, the reliability of through-hole structure described in energy accurate evaluation, thereby guarantee the accuracy of interconnection structure fail-safe analysis.
Accompanying drawing explanation
Fig. 1 is the profile of normal interconnection structure in prior art;
Fig. 2 is the profile of improper interconnection structure in prior art;
Fig. 3 is the vertical view of through hole reliability testing structure in the utility model one embodiment;
Fig. 4 is the profile of Fig. 3 along cutting line A-A ';
Fig. 5 is the profile of Fig. 3 along cutting line B-B '.
Embodiment
Below in conjunction with schematic diagram, through hole reliability testing structure of the present utility model is described in more detail, wherein represent preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to about system or about the restriction of business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with way of example, the utility model is more specifically described with reference to accompanying drawing.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of through hole reliability testing structure is provided, through hole reliability testing structure comprises at least two-layer adjacent interconnection layer, between the interconnection layer of every adjacent two layers, all connect by a through-hole structure, wherein: each interconnection layer all has and comprises some unit, multiple the second interconnection lines that described in each, unit includes one first interconnection line and is connected with described the first interconnection line, described the first interconnection line between different described unit is arranged at first direction, and multiple described the second interconnection line among same described unit is arranged in second direction; Described through-hole structure comprises the first through hole and the second through hole, between the first interconnection line of adjacent described interconnection layer, connects by described the first through hole is corresponding, between the second interconnection line of adjacent described interconnection layer, connects by described the second through hole is corresponding; Described the first interconnection line, the second interconnection line, the first through hole and the second through hole are by a dielectric insulation interval.Whether this test structure can detect the position of described the first through hole on described first direction and occur extremely, whether can detect the position of described the second through hole in described second direction occurs extremely simultaneously, the reliability of through-hole structure described in energy accurate evaluation, thereby the accuracy of assurance interconnection structure fail-safe analysis.
Please refer to Fig. 3-Fig. 5, Fig. 3 is the vertical view of through hole reliability testing structure in the utility model one embodiment, and Fig. 4 is the profile of Fig. 3 along cutting line A-A ', and Fig. 5 is the profile of Fig. 3 along cutting line B-B '.In the present embodiment, described through hole reliability testing structure comprises two-layer adjacent interconnection layer, between two-layer described interconnection layer, all connects by a through-hole structure.For example, described two-layer interconnection layer can be the first interconnection layer (Metal1) and the second interconnection layer (Metal2), and, described through-hole structure is the first through-hole interconnection (Via1); Described two-layer interconnection layer can be also the second interconnection layer (Metal2) and the 3rd interconnection layer (Metal3), and, described through-hole structure is the second through-hole interconnection (Via2); Described two-layer interconnection layer can also be the 3rd interconnection layer (Metal3) and the 4th interconnection layer (Metal4), and, described through-hole structure is the 3rd through-hole interconnection (Via3), etc.In the present embodiment, described through hole reliability testing structure can also include the necessary structures such as source region, this common practise that is this area, and therefore not to repeat here.
Now, take the second interconnection layer (Metal2) as example, illustrate the structure of each interconnection layer, wherein, the structure correspondence of each interconnection layer is identical.As shown in Figure 3, the second interconnection layer comprises 4 unit 21,22,23,24, multiple the second interconnection lines that described in each, unit includes one first interconnection line and is connected with described the first interconnection line.Multiple the second interconnection lines 211 that described unit 21 comprises described the first interconnection line 210 and is connected with described the first interconnection line 210; Multiple the second interconnection lines 221 that described unit 22 comprises described the first interconnection line 220 and is connected with described the first interconnection line 220; Multiple the second interconnection lines 231 that described unit 23 comprises described the first interconnection line 230 and is connected with described the first interconnection line 230; Multiple the second interconnection lines 241 that described unit 24 comprises described the first interconnection line 240 and is connected with described the first interconnection line 240.
Described the first interconnection line 210, the second interconnection line 220, the 3rd interconnection line 230, the 4th interconnection line 240 are arranged in first direction Y-direction, and multiple described the second interconnection line among same described unit is arranged at second direction directions X.Take described unit 21 as example, multiple described the second interconnection lines 211 are arranged at second direction directions X.Described through-hole structure comprises the first through hole 1101 and the second through hole 1102, between the first interconnection line of adjacent described interconnection layer, by the corresponding connection of described the first through hole 1101, between the second interconnection line of adjacent described interconnection layer, connect by described the second through hole 1102 correspondences.As shown in Figure 4, between described first interconnection line 110 of the first interconnection layer and described second interconnection line 210 of the second interconnection layer, pass through the corresponding connection of described the first through hole 1101; As shown in Figure 5, between described second interconnection line 111 of the first interconnection layer and described second interconnection line 211 of the second interconnection layer by the corresponding connection of described the second through hole 1102, thereby realize the electric connection between different interconnection layers.
Because each interconnection layer of this test structure all has described the first interconnection line of arranging in first direction Y-direction and described the second interconnection line of arranging at second direction directions X, between the first interconnection line of adjacent described interconnection layer, connect by described the first through hole is corresponding, between the second interconnection line of adjacent described interconnection layer, connect by described the second through hole is corresponding, so, whether this test structure can detect the position of described the first through hole in described first direction Y-direction and occur extremely, whether can detect the position of described the second through hole on described second direction directions X occurs extremely simultaneously, the reliability of through-hole structure described in energy accurate evaluation, thereby guarantee the accuracy of interconnection structure fail-safe analysis
Preferably, in the present embodiment, described the first interconnection line and the second interconnection line are bar shaped.But described the first interconnection line and the second interconnection line are not limited to strip structure, can also be comb shaped structure etc., the design general knowledge that this is this area, therefore not to repeat here.
Preferably, in the present embodiment, in same described unit, described the first interconnection line is cross with multiple described the second interconnection lines respectively.As shown in Figure 3, described the first interconnection line 210 is cross with multiple described the second interconnection lines 211 respectively, can effectively utilize the space of described test structure, thereby can on described test structure, arrange more described the first through hole 1101 and the second through hole 1102, thereby improve the reliability of test structure.
As shown in Figure 3, described the first interconnection line 210 has multiple the first junctions 212, and described the first interconnection line 210 is connected with described the first through hole 1101 in described the first junction 212, as shown in Figure 4; Described the first interconnection line 210 has multiple the second junctions 213, described the first interconnection line 210 is crossing with described the second interconnection line 211 in described the second junction 213, described multiple the first junction 212 is staggered on described second direction directions X with multiple the second junctions 213, as shown in Figure 3.Wherein, described the first interconnection line 220,230,240 also has similar structure, and therefore not to repeat here.This staggered mode has effectively utilized the space of described test structure, thereby can on described test structure, arrange more described the first through hole 1101 and the second through hole 1102, thereby improves the reliability of test structure.Wherein, described the second interconnection line 211 is connected with described the second through hole 1102 at end points place 214, as shown in Figure 5, but described the second interconnection line 211 is not limited to be connected with described the second through hole 1102 at end points place 214, described the second interconnection line 211 can also be connected with described the second through hole 1102 at non-end points place, also within thought range of the present utility model.
In the present embodiment, described the second interconnection line cross arrangement on described second direction directions X in adjacent described unit, for example, described the second interconnection line 211 and the cross arrangement on described second direction directions X of the second interconnection line 221, described the second interconnection line 221 and the cross arrangement on described second direction directions X of the second interconnection line 231, described the second interconnection line 231 and the cross arrangement on described second direction directions X of the second interconnection line 241.The mode of this cross arrangement has effectively utilized the space of described test structure, thereby can on described test structure, arrange more described the first through hole 1101 and the second through hole 1102, thereby improves the reliability of test structure.
In the present embodiment, in same described interconnection layer, the width of the width of described the first interconnection line and the second interconnection line is the minimum widith of the interconnection line of design rule (design rule), but the minimum widith of interconnection line does not do concrete restriction, is determined by design rule.For example, in the present embodiment, the minimum widith of the interconnection line of design rule (design rule) is 50nm, and the width of the width of described the first interconnection line and the second interconnection line is 50nm.
In the present embodiment, in same described interconnection layer, the spacing between spacing and the second interconnection line between described the first interconnection line is the minimum spacing of the interconnection line of design rule, but the minimum spacing of interconnection line is not done concrete restriction, is determined by design rule.For example, in the present embodiment, the minimum spacing of the interconnection line of design rule (design rule) is 60nm, and the spacing between spacing and the second interconnection line between described the first interconnection line is 60nm.
In the present embodiment, in same described interconnection layer, the diameter of the diameter of described the first through hole 1101 and the second through hole 1102 is the through hole minimum widith of design rule, but through hole minimum widith does not do concrete restriction, is determined by design rule.For example, in the present embodiment, the through hole minimum widith of design rule (design rule) is 50nm, and the diameter of the diameter of described the first through hole 1101 and the second through hole 1102 is 60nm.。
In the present embodiment, in same described interconnection layer, the spacing between spacing and the first through hole 1101 and the second through hole 1102 between spacing, the second through hole 1102 between described the first through hole 1101 is all more than or equal to the through hole minimum spacing of design rule.For example, in the present embodiment, the through hole minimum spacing of design rule (design rule) is 30nm, and the spacing between the first through hole 1101 and the second through hole 1102 is 30nm, and the spacing between spacing, the second through hole 1102 between described the first through hole 1101 is 100 your nm.
Preferably, the material of described the first interconnection line, the second interconnection line and through-hole structure can be metal or alloy, as metallic copper, metallic aluminium or albronze, general, the material of the first interconnection line, the second interconnection line and through-hole structure is identical, but also can be different, if the material of the second interconnection line is metallic copper, the material of the first interconnection line and through-hole structure is metallic aluminium.
Described the first interconnection line, the second interconnection line, the first through hole and the second through hole are by dielectric 200 insulation gaps.Preferably, described dielectric material has the dielectric constant that is less than or equal to 4.0, wherein, described dielectric material can be one or more the combination in the silica of silicon dioxide, silicon nitride, silicon oxynitride or carbon dope, but is not limited to above-mentioned different materials.
Test structure described in the present embodiment is in the time carrying out reliability testing, first form a concrete geodesic structure for the treatment of according to described test structure, described in the method for boosting or the test of time-based dielectric breakdown voltage method, treat the dielectric breakdown reliability of the dielectric 200 of geodesic structure, thereby obtain the reliability of described through-hole structure.Wherein, the common practise that the method for boosting or time-based dielectric breakdown voltage method are this area, therefore not to repeat here.If described in treat geodesic structure dielectric breakdown reliability occur extremely, illustrate that described through-hole structure in described test structure occurs abnormal, thereby guarantee the accuracy of interconnection structure fail-safe analysis.
The utility model is not limited to above-described embodiment, and for example each interconnection layer is not limited to 4 described unit, can also be 3,5,8,10 etc., and, described test structure is not limited to as two-layer described interconnection layer, can also be three layers or more interconnection layer, for example, described test structure comprises the first interconnection layer (Metal1), the second interconnection layer (Metal2) and the 3rd interconnection layer (Metal3), , described through-hole structure between the first interconnection layer (Metal1) and the second interconnection layer (Metal2) is the first through-hole interconnection (Via1), described through-hole structure between the second interconnection layer (Metal2) and the 3rd interconnection layer (Metal3) is the second through-hole interconnection (Via2) etc., in addition, described the first interconnection line is not limited to be cross with multiple described the second interconnection lines respectively, described the first interconnection line can also be to be respectively T-shaped crossing with multiple described the second interconnection lines, can reach the object of the reliability of through-hole structure described in accurate evaluation of the present utility model, also within thought range of the present utility model.
In sum, the utility model provides a kind of through hole reliability testing structure, comprise at least two-layer adjacent interconnection layer, between the interconnection layer of every adjacent two layers, all connect by a through-hole structure, wherein: each interconnection layer all has and comprises some unit, multiple the second interconnection lines that described in each, unit includes one first interconnection line and is connected with described the first interconnection line, described the first interconnection line between different described unit is arranged at first direction, and multiple described the second interconnection line among same described unit is arranged in second direction; Described through-hole structure comprises the first through hole and the second through hole, between the first interconnection line of adjacent described interconnection layer, connects by described the first through hole is corresponding, between the second interconnection line of adjacent described interconnection layer, connects by described the second through hole is corresponding; Described the first interconnection line, the second interconnection line, the first through hole and the second through hole are by a dielectric insulation interval.What compared with prior art, the utility model provided contain bias voltage temperature instability test circuit has the following advantages:
The through hole reliability testing structure that the utility model provides, each interconnection layer of this test structure all has described the first interconnection line of arranging at first direction and described the second interconnection line of arranging in second direction, between the first interconnection line of adjacent described interconnection layer, connect by described the first through hole is corresponding, between the second interconnection line of adjacent described interconnection layer, connect by described the second through hole is corresponding, compared with prior art, whether this test structure can detect the position of described the first through hole on described first direction and occur extremely, whether can detect the position of described the second through hole in described second direction occurs extremely simultaneously, the reliability of through-hole structure described in energy accurate evaluation, thereby guarantee the accuracy of interconnection structure fail-safe analysis.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (10)
1. a through hole reliability testing structure, is characterized in that, comprises at least two-layer adjacent interconnection layer, between the interconnection layer of every adjacent two layers, all connect by a through-hole structure, wherein:
Each interconnection layer all has and comprises some unit, multiple the second interconnection lines that described in each, unit includes one first interconnection line and is connected with described the first interconnection line, described the first interconnection line between different described unit is arranged at first direction, and multiple described the second interconnection line among same described unit is arranged in second direction;
Described through-hole structure comprises the first through hole and the second through hole, between the first interconnection line of adjacent described interconnection layer, connects by described the first through hole is corresponding, between the second interconnection line of adjacent described interconnection layer, connects by described the second through hole is corresponding;
Described the first interconnection line, the second interconnection line, the first through hole and the second through hole are by a dielectric insulation interval.
2. through hole reliability testing structure as claimed in claim 1, is characterized in that, described the first interconnection line and the second interconnection line are bar shaped.
3. through hole reliability testing structure as claimed in claim 2, is characterized in that, in same described unit, described the first interconnection line is cross with multiple described the second interconnection lines respectively.
4. through hole reliability testing structure as claimed in claim 3, is characterized in that, described the first interconnection line has multiple the first junctions, and described the first interconnection line is connected with described the first through hole in described the first junction; Described the first interconnection line has multiple the second junctions, and described the first interconnection line is crossing with described the second interconnection line in described the second junction, and described multiple the first junctions and multiple the second junction are staggered in described second direction.
5. through hole reliability testing structure as claimed in claim 3, is characterized in that, described the second interconnection line cross arrangement in described second direction in different described unit.
6. through hole reliability testing structure as claimed in claim 3, is characterized in that, described the second interconnection line is connected with described the second through hole at end points place.
7. through hole reliability testing structure as claimed in claim 1, is characterized in that, in same described interconnection layer, the width of the width of described the first interconnection line and the second interconnection line is the minimum widith of the interconnection line of design rule.
8. through hole reliability testing structure as claimed in claim 1, is characterized in that, in same described interconnection layer, the spacing between spacing and the second interconnection line between described the first interconnection line is the minimum spacing of the interconnection line of design rule.
9. through hole reliability testing structure as claimed in claim 1, is characterized in that, in same described interconnection layer, the diameter of the diameter of described the first through hole and the second through hole is the through hole minimum widith of design rule.
10. through hole reliability testing structure as claimed in claim 1, it is characterized in that, in same described interconnection layer, the spacing between spacing and the first through hole and the second through hole between spacing, the second through hole between described the first through hole is all more than or equal to the through hole minimum spacing of design rule.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320804315.2U CN203631542U (en) | 2013-12-09 | 2013-12-09 | Via reliability testing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320804315.2U CN203631542U (en) | 2013-12-09 | 2013-12-09 | Via reliability testing structure |
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| Publication Number | Publication Date |
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| CN203631542U true CN203631542U (en) | 2014-06-04 |
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| CN201320804315.2U Expired - Fee Related CN203631542U (en) | 2013-12-09 | 2013-12-09 | Via reliability testing structure |
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| CN (1) | CN203631542U (en) |
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Granted publication date: 20140604 Termination date: 20191209 |