KR102266527B1 - Substrate clamping device for surface treatment - Google Patents

Abstract

Disclosed in the present invention is a substrate clamping device for surface treatment. The disclosed substrate clamping device for surface treatment includes a frame, a clamping body provided in the frame, and a substrate gripper which is movably provided on the clamping body and selectively grips and fixes a substrate mounted on the frame through linear and rotational movements. Therefore, according to the present invention, it is possible to stably grip the substrate with a simple structure and also stably fix the substrate while gripping the substrate, which prevents the substrate from being bent or deformed in the process of fixing the substrate, thereby reducing defects in surface treatment. The substrate clamping device includes a frame, a clamping body, and a substrate gripper, wherein the clamping body includes a gripping guide part and the substrate gripper includes a linear moving member installed on the clamping body to be linearly movable and a tongs part rotating to grip the substrate while being guided by the gripping guide part of the clamping body according to the movement of the linear moving member.

Description

Substrate clamping device for surface treatment

The present invention relates to a substrate clamping device for surface treatment, which can stably hold a substrate with a simple structure and stably fix the substrate while holding the substrate, thereby preventing the substrate from being bent or deformed in the process of fixing the substrate. It relates to a substrate clamping device for surface treatment that can reduce the defect rate during surface treatment.

In general, surface treatment (plating, plating, coloring, film, etc.) is to cover the surface of a material with a thin film made of another material for the purpose of improving the surface condition of the material. There are various purposes of such surface treatment, but typically, first, to compensate for the lack of corrosion resistance of raw materials, a method of coating a metal thin film that can withstand a specific environment (防蝕), and secondly, surface hardening by coating a metal thin film that is harder than the raw material to withstand abrasion , Third, it is used to beautify the surface by attaching a thin film of precious metal or metal alloy with beautiful color to the surface of the raw material, and fourth, to increase the reflectance of light or heat, or to improve the smoothing and reflectance of the surface to which a thin metal film is attached for a smooth surface and gloss. .

In addition, the surface treatment method is largely divided into wet surface treatment and dry surface treatment. In wet surface treatment, the surface is treated by impregnating the workpiece in a wet environment, for example, a treatment solution, and dry surface treatment is performed using plasma or arc in a vacuum container. , The surface is treated using heated steam.

In the double wet surface treatment method, a cleaning step must be performed to remove the reaction solution and plating solution used in the previous process before and after the surface treatment process and during the process. In addition, when the substrate is surface-treated, the substrate is fixed to a holding device, impregnated with a reaction solution and a plating solution, and an electric current is applied to the substrate to perform surface treatment.

However, in the wet surface treatment apparatus of the prior art as described above, the substrate is finely bent or deformed during the process of mounting and fixing the substrate to the basket and the process of impregnating it in a solution, resulting in many defects in the surface treatment process. There is a problem.

Therefore, there is a need to improve it.

On the other hand, domestic registered patent No. 10-1744968 (registration date: June 01, 2017) discloses "wet surface treatment", and registered patent No. 10-1479442 (registration date: December 29, 2014) "carrier for wet surface treatment line" " is disclosed.

The present invention was created by the above necessity, and since the substrate can be stably held with a simple structure, the substrate is prevented from being bent or deformed in the process of fixing the substrate, thereby reducing the defect rate during surface treatment. An object of the present invention is to provide a substrate clamping device for

In order to achieve the above object, an apparatus for clamping a substrate for surface treatment according to an aspect of the present invention includes a frame, a clamping body provided in the frame, and a clamping body movably provided in the clamping body, and includes a linear motion and a rotational motion. Accordingly, it characterized in that it comprises a substrate gripper for selectively gripping and fixing the substrate mounted on the frame.

Also, in the present invention, the clamping body and the substrate gripper are provided in the frame to grip both sides of the substrate, respectively.

Also, in the present invention, the clamping body may include a gripping guide part for guiding the board gripper, which has been extended for insertion of the board, to rotate in a direction for gripping the board.

In addition, in the present invention, the clamping body includes a guide block coupled to the frame, the guide block having the gripping guide part and the tension maintaining guide part, and a block cover coupled to the guide block to guide the linear movement of the substrate gripper. characterized by including.

In addition, in the present invention, the guide block and the block cover are characterized in that the linear movement guide long hole for the linear movement of the substrate gripper is formed, respectively.

In addition, in the present invention, the substrate gripper is characterized in that it further moves to the outside of the clamping body in a state in which the substrate is gripped by the holding guide part to maintain the tension of the substrate.

In addition, in the present invention, the substrate gripper includes a linear moving member movably installed in the clamping body and provided inside the clamping body so as to be rotatably connected to the linear moving member, and the movement of the linear moving member is provided in the clamping body. It characterized in that it comprises a tongs portion that rotates to grip the substrate while being guided to the clamping body in accordance with the.

In addition, in the present invention, the linear movement member includes a linear movement hinge pin to which the tongs are rotatably coupled, an operation rod that moves toward the clamping body through an actuator, and the operation rod to the outside of the clamping body. It is characterized in that it comprises an elastic spring for elastically supporting.

In addition, in the present invention, the clamp portion is characterized in that it is elastically supported in an expanding direction by a torsion spring coupled to the linear movable hinge pin.

In addition, in the present invention, the substrate gripper includes a linear moving member movably installed in the clamping body, a tongs rotatably coupled to the clamping body to rotate in the clamping body and selectively gripping the substrate; , It characterized in that it comprises a clamp interlocking link connecting the linear moving member and the tongs so as to rotate the tongs as the linear moving member is operated.

In addition, the tongs in the present invention, the central portion through the clamping hinge pin is characterized in that it comprises a first tongs and a second tongs are rotatably coupled to the clamping body.

In addition, in the present invention, the tongs interlocking link includes a first interlocking link having one end hingedly connected to the linear moving member, and the other end being hingedly connected to any one of the first tongs and the second tongs through an interlocking hinge pin. , One end is hingedly connected to the linear moving member together with the first interlocking link, and the other end includes a second interlocking link that is hingedly connected to the other of the first tongs and the second tongs through an interlocking hinge pin. characterized.

As described above, the substrate clamping device for surface treatment according to an aspect of the present invention stably holds the substrate with a simple structure, unlike the prior art, so that the substrate is bent or deformed in the process of impregnating the substrate in the treatment solution. This has the effect of preventing defects from occurring in the surface treatment process.

1 is a plan view for explaining a substrate clamping apparatus for surface treatment according to a first embodiment of the present invention.
2 is a front view for explaining a substrate clamping apparatus for surface treatment according to a first embodiment of the present invention.
3 is an enlarged plan view of a main part for explaining a substrate clamping apparatus for surface treatment according to a first embodiment of the present invention.
4 is a perspective view illustrating a clamping body and a substrate gripper according to a first embodiment of the present invention.
5 is an exploded perspective view illustrating the clamping body and the substrate gripper according to the first embodiment of the present invention.
6 is a cross-sectional view for explaining the operation of the clamping body and the substrate gripper according to the first embodiment of the present invention.
7 is a perspective view for explaining the operation of the clamping body and the substrate gripper according to the second embodiment of the present invention.
8 is an exploded perspective view for explaining the operation of the clamping body and the substrate gripper according to the second embodiment of the present invention.
9 is an exploded perspective view for explaining the tongs and the tongs interlocking link according to the second embodiment of the present invention.
10 is a cross-sectional view for explaining the operation of the clamping body and the substrate gripper according to the second embodiment.
11 is a cross-sectional view for explaining the operation of the clamping body and the substrate gripper according to the third embodiment.

Hereinafter, a preferred embodiment of a substrate clamping device for position surface treatment according to the present invention will be described with reference to the accompanying drawings. In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of explanation.

In addition, the terms to be described later are terms defined in consideration of functions in the present invention, which may vary according to the intention or custom of the user or operator. Therefore, definitions of these terms should be made based on the content throughout this specification.

1 is a plan view illustrating a substrate clamping apparatus for surface treatment according to a first embodiment of the present invention, and FIG. 2 is a front view illustrating a substrate clamping apparatus for surface treatment according to a first embodiment of the present invention, 3 is an enlarged plan view of a main part for explaining a substrate clamping apparatus for surface treatment according to a first embodiment of the present invention.

4 is a perspective view illustrating the clamping body and the substrate gripper according to the first embodiment of the present invention, and FIG. 5 is an exploded perspective view illustrating the clamping body and the substrate gripper according to the first embodiment of the present invention. , FIG. 6 is a cross-sectional view for explaining the operation of the clamping body and the substrate gripper according to the first embodiment of the present invention.

1 to 6 , in the substrate clamping apparatus 100 for surface treatment according to the first embodiment of the present invention, a plurality of substrates 10 for wet surface treatment are mounted, and a plurality of substrates 10 are mounted. ) by holding both sides of the substrate 10 is fixed.

In addition, the substrate clamping apparatus 100 for surface treatment according to the present embodiment is impregnated in a treatment tank (not shown) in a state in which the substrate 10 is mounted, and is impregnated in the treatment tank by stably holding the substrate 10 . At the same time, it prevents the substrate 10 from moving and is prevented from being bent or deformed. Accordingly, it is possible to prevent defects from occurring during the surface treatment of the substrate 10 .

To this end, the substrate clamping apparatus 100 for surface treatment according to the first embodiment includes a frame 110 for mounting the substrate 10 , a clamping body 120 provided in the frame 110 , and the substrate 10 . ) and a substrate gripper 130 provided in the clamping body 120 to hold and fix. The substrate clamping apparatus 100 for processing selectively grips the substrate 10 while the substrate gripper 130 linearly moves and rotates in the clamping body 120 .

For example, when the substrate 10 is mounted on the frame 110, the substrate gripper 130 is extended while linearly moved to the inside of the clamping body 120 by an actuator (not shown), and the substrate 10 is inserted, When the substrate 10 is inserted, the substrate gripper 130 moves to the outside of the clamping body 120 to grip and fix the substrate 10 .

The frame 110 is provided with a plurality of clamping bodies 120 in a horizontal direction on both sides so that a plurality of substrates 10 can be mounted in a line, and three or four clamping bodies 120 are provided to be spaced apart in a vertical direction as well. This is to stably support the substrate 10 in the longitudinal direction.

The clamping body 120 is provided on the frame 110 to guide the operation of the substrate gripper 130 , and the substrate gripper 130 guides linear movement and gripping. For example, the clamping body 120 guides the linear movement of the substrate gripper 130 moving to the inside of the frame 110 by the actuator and at the same time stably guides the expansion of the substrate gripper 130 . In addition, the substrate gripper 130 is guided to grip the substrate 10 as the substrate gripper 130 is restored to its initial upward position.

Specifically, the clamping body 120 includes a guide block 121 coupled to the frame 110 and a block cover 123 that covers the guide block 121 , and the substrate gripper 130 is attached to the guide block 121 . ) are coupled to be movable in a straight line.

The guide block 121 has an operation hole 121a for linear movement of the substrate gripper 130 , and a gripping guide 125 , which guides the expansion and grip of the substrate gripper 130 , is provided on the front plate.

The block cover 123 is coupled to the guide block 121 to guide the linear movement of the substrate gripper 130 . To this end, a linear movement guide long hole 127 for guiding the linear movement of the substrate gripper 130 is formed in the guide block 121 and the block cover 123 , respectively, and the gripping guide part 125 is coupled to the front.

The grip guide part 125 prevents the board gripper 130 from being excessively extended and at the same time stably guides the board gripper 130 to grip the board 10 . Specifically, the gripping guide part 125 is rotatably provided on the body fixing pin 125a so that the main body fixing pin 125a coupled to the guide block 121 and the block cover 123 and the substrate gripper 130 come into contact with each other. It is provided with a guide bushing (125b) to be.

The body fixing pin 125a is inserted into the guide bushing 125b and coupled to the guide block 121 and the block cover 123 .

The substrate gripper 130 according to the first embodiment is provided to be linearly movable on the clamping body 120 , and selectively grips and fixes the substrate mounted on the frame 110 according to linear and rotational movements. The substrate grippers 130 are respectively disposed on both sides of the frame 110 to grip both sides of the substrate 10 .

Specifically, the substrate gripper 130 is rotatably coupled to the linear movement member 131 inserted into the operation hole portion 121a of the guide block 121 and the linear movement member 131 to selectively hold the substrate 10 . Includes tongs 133 for holding and fixing. The linear movement member 131 is linearly moved in the inner direction of the clamping body 120 by the actuator, and when the force of the actuator is removed, the clamping body 120 moves in a straight line to the outside of the clamping body 120 and is restored to its original position. 133 holds the substrate 10 .

The linear moving member 131 has an operation rod 131a having one end positioned inside the guide block 121 and the other end exposed to the outside of the guide block 121 through an operation hole portion 121a, and an operation rod ( 131a) includes an elastic spring (131b) for elastically supporting the guide block 121 in the outer direction (holding direction).

The actuating rod 131a is coupled to one end of the linear movable hinge pin 135 for rotatably coupling the tongs 133, and a spring support plate 131c for supporting the elastic spring 131b at the other end is coupled. . The actuating rod 131a is moved to the inside of the clamping body 120 by an actuator.

In addition, the linear movement hinge pin 135 is inserted into the linear movement guide long hole 127 to guide the linear movement of the operation rod 131a and the rotation of the tongs 133 while moving in a straight line.

The elastic spring 131b is installed on the operation rod 131a so that one end is in contact with the guide block 121 and the other end is supported by the spring support plate 131c to move the operation rod 131a to the outside of the guide block 121. elastic support. At this time, the elastic spring (131b) may be installed so that the operation rod (131a) is inserted therein.

The tongs 133 are rotatably connected to one end of the operation rod 131a through a linear movable hinge pin 135, and as the operation rod 131a is inserted into the guide block 121, the operation rod ( 131a) is expanded while moving, and the operation rod 131a moves along with the guide block 121 as it moves in the outward direction to grip the substrate 10.

To this end, the tongs 133 includes first tongs 133a and second tongs 133b, one end of which is hinge-coupled to the linear movable hinge pin 135, and the first tongs 133a and the second tongs ( 133b) is elastically supported in the expanding direction by the torsion spring 133c.

In addition, the tongs 133 is a linear movable hinge pin 135 is inserted into one end of the first tongs (133a) and the second tongs (133b), the first tongs (133a) and the second tongs (133b) A gripping surface for gripping the substrate 10 is formed at the other end, and outer surfaces of the first tongs 133a and the second tongs 133b are in contact with the gripping guide part 125 .

These tongs 133 are moved to the inside of the frame 110 by the operation rod 131a before the substrate 10 is mounted on the frame 110 so that the first tongs 133a and the second tongs 133b are formed. happens Then, when the substrate 10 is seated between the first tongs 133a and the second tongs 133b, the first tongs 133a and the second tongs 133b are in contact with the gripping guide part 125 . The substrate 10 is gripped while being inserted into the clamping body 120 by the operation rod 131a. At this time, since the guide bushing (125b) is rotated by the main body fixing pin (125a), the movement of the first tongs (133a) and the second tongs (133b) is guided more stably and smoothly. That is, the gripping operation of the first tongs 133a and the second tongs 133b is performed stably and smoothly.

The torsion spring 133c elastically supports the first clamp 133a and the second clamp 133b in the extending direction.

The operation of the substrate clamping device for surface treatment according to the first embodiment of the present invention configured as described above will be described.

First, before mounting the substrate 10 on the frame 110, the actuator operates to linearly move the actuating rod 131a in the clamping body 120's inside of the clamping body 120 in the clamp extension direction (A), the actuating rod (131a) and Together, the linear movement hinge pin 135 moves along the linear movement guide long hole 127 while moving the tongs 133 to the outside of the clamping body 120 .

Then, as the first tongs 133a and the second tongs 133b are expanded by the torsion spring 133c, the gripping portions of the tongs 133 are spaced apart from each other to hold the substrate 10 with the first tongs 133a and the second tongs. It can be mounted between (133b).

Thereafter, when the mounting of the substrate 10 is completed, the actuator is operated again to remove the force of the actuator applied to the operation rod 131a. Then, the actuating rod 131a moves linearly in the substrate holding direction B, which is the outside of the clamping body 120 by the elastic spring 131b, whereby the first clamp 133a and the second clamp 133b are clamped. The substrate 10 is gripped while moving together into the body 120 . At this time, since the outer surfaces of the first tongs 133a and the second tongs 133b move in contact with the gripping guide part 125, when the tongs 133 are expanded, the first tongs 133a and the second tongs ( 133b) is prevented from being excessively widened, and when the tongs 133 grip the substrate 10, the first tongs 133a and the second tongs 133b are stably retracted to grip the substrate 10.

Then, while the first tongs 133a and the second tongs 133b are in contact with the substrate 10, the operation rod 131a moves finely and linearly in the gripping direction ( ) to move the substrate 10 to both sides. will pull Through this, it is possible to prevent the substrate 10 from being bent or deformed when the frame 110 is deposited into the treatment tank.

Next, a substrate clamping device for surface treatment according to a second embodiment of the present invention will be described with reference to FIGS. 7 to 10 .

7 is a perspective view illustrating the operation of the clamping body and the substrate gripper according to the second embodiment of the present invention, and FIG. 8 is an exploded view illustrating the operation of the clamping body and the substrate gripper according to the second embodiment of the present invention. is a perspective view.

9 is an exploded perspective view for explaining the tongs and the tongs interlocking link according to the second embodiment of the present invention, and FIG. 10 is a cross-sectional view for explaining the operation of the clamping body and the substrate gripper according to the second embodiment. .

In describing the substrate clamping apparatus for surface treatment according to the second embodiment of the present invention, the same reference numerals are used to refer to structures corresponding to or similar to those of the substrate clamping apparatus for surface treatment according to the first embodiment, and the detailed description thereof will be omitted. do it with

7 to 10 , in the substrate clamping apparatus 100 for surface treatment according to the second embodiment of the present invention, the clamping unit 120 does not use the holding guide unit 125 of the clamping body 120 . is configured to enable the operation of

Specifically, the substrate clamping apparatus 100 for surface treatment according to the present embodiment is capable of linear movement and rotation on the clamping body 140 coupled to the frame 110 and the clamping body 140 for gripping the substrate 10 . and a substrate gripper 150 provided to

The clamping body 140 includes a hinge hole portion 141 to which the substrate gripper 150 is rotatably coupled, and a clamp hinge pin 143 coupled to the hinge hole portion 141 .

The substrate gripper 150 includes a linear movement member 151 installed in a linear movement guide long hole 127 of the clamping body 140 , and a hinge hole portion of the clamping body 140 through a clamp hinge pin 143 . It includes a tongs 153 rotatably coupled to the 141 and a tongs interlocking link 155 for interlocking the linear moving member 151 and the tongs 153 .

The tongs 153 grip the substrate 10 while rotating in the clamping body 140 according to the linear movement of the linear moving member 151 while expanding or retracting. To this end, the tongs 153 include the first tongs 153a and the second tongs 153b, which are hingedly coupled to the clamping body 140 in an “X” shape, and the first tongs 153a and the second tongs 153b. ) includes a clamp interlocking link 155 for hinge-connecting each to the linear moving member 151 .

The first clamp (153a) has a hinge hole formed in the central portion, the clamp linkage link 155 is hinge-connected to one end portion, and a grip portion for gripping the substrate 10 is formed at the other end portion.

The second tongs 153b also have a hinge hole formed in the central portion, the tongs interlocking link 155 is hinge-connected to one end, and a gripper for gripping the substrate 10 is formed at the other end.

These first tongs (153a) and second tongs (153b) are arranged in an "X" shape so that the hinge hole of the central portion overlaps, the tongs hinge pin 143 passes through the hinge hole, and the tongs interlocking link 155. While rotating together in the clamping body 140 by the extension or gripping the substrate 10 is fixed.

The tongs interlocking link 155 connects the linear moving member 151 and the tongs 153 so as to rotate the first tongs 153a and the second tongs 153b together as the linear moving member 151 moves in a straight line. do. Specifically, the clamp interlocking link 155 is a first interlocking link 155a connecting the linear moving member 151 and the first clamp 153a, and connecting the linear moving member 151 and the second clamp 153b. A second interlocking link (155b) is provided.

The first interlocking link 155a has one end hinge-connected to the operation rod 151a of the linear movement member 151 through the linear movement hinge pin 154, and the other end is connected to the first clamp through the interlocking hinge pin 155c. One end of (153a) is hinged. The second interlocking link 155b has one end hinge-connected to the operation rod 151a of the linear movement member 151 through the linear movement hinge pin 154, and the other end is connected to the second clamp through the interlocking hinge pin 155c. One end of (153b) is hinged. At this time, a linear movement guide long hole 147 for linear movement of the linear movement hinge pin 154 is formed in the clamping body 141 .

The first interlocking link 155a and the second interlocking link 155b are hinge-connected to the linear moving member 151 through the linear moving hinge pin 135 so that one end overlaps, and the linear moving member 151 moving in a straight line. Rotating the first tongs (153a) and the second tongs (153b) while rotating by the respectively. Through this, the first tongs 153a and the second tongs 153b are expanded and gripped.

On the other hand, the upper surface of the first tongs 153a and the lower surface of the second tongs 153b are provided with support bushings 145 for preventing the tongs 153 from moving up and down in the clamping body 140, respectively. The clamp hinge pin 143 is penetrated through the bushing 145 .

A substrate clamping apparatus for surface treatment according to a third embodiment of the present invention will be described with reference to FIG. 11 .

11 is a cross-sectional view for explaining the operation of the clamping body and the substrate gripper according to the third embodiment.

11, in describing the substrate clamping apparatus for surface treatment according to the third embodiment of the present invention, the same reference numerals are used to designate structures corresponding to or similar to those of the substrate clamping apparatus for surface treatment according to the first embodiment, A detailed description thereof will be omitted.

The substrate clamping apparatus 100 for surface treatment according to the third embodiment of the present invention includes a clamping body 160 provided in a frame 110 and a substrate gripper 130 provided in the clamping body 160 .

The clamping body 160 guides the first tongs 133a and the second tongs 133b of the substrate gripper 130, which have been extended for insertion of the substrate 10, to rotate in the direction of gripping the substrate 10. The gripping guide part 165 and the first tongs 133a and the second tongs 133b of the substrate gripper 130 holding the substrate 10 move finely linearly to maintain the tension of the substrate 10 . and a tension maintaining guide part 167 extending from the end of the gripping guide part 165 .

The gripping guide part 165 according to the third embodiment is inclined inside the clamping body 160 so that the outer surfaces of the first tongs 133a and the second tongs 133b are in contact, and in the gripping guide part 165 . The tension maintaining guide part 167 is formed to extend.

For example, the tension maintaining guide part 167 is formed to extend in a horizontal plane shape from the gripping guide part 165 having an inclined plane shape and is parallel to the operation direction of the linear moving member 131 .

In the substrate clamping apparatus 100 for surface treatment according to the third embodiment as described above, the first tongs 133a and the second tongs 133b are guided by the tension maintaining guide unit 167 to hold the substrate 10 . Then, while pulling the substrate 10 while moving finely linearly along the horizontal plane of the tension maintenance guide part 167, it is inserted into the inclined gripping guide part 165, and the substrate gripper 130 grips the substrate 10. is kept stable.

Although the present invention has been described with reference to the embodiment shown in the drawings, this is merely exemplary, and those of ordinary skill in the art to which various modifications and equivalent other embodiments are possible. will understand

Accordingly, the true technical protection scope of the present invention should be defined by the claims.

10: substrate 100: substrate clamping device for surface treatment
110: frame 120, 140, 160: clamping body
121: guide block 121a: operation hole part
123: block cover 125, 165: gripping guide part
125a: body fixing pin 125b: guide bushing
127: linear movement guide long hole 141: hinge hole part
143: clamp hinge pin 167: tension maintenance guide part
130, 150: substrate gripper 131, 151: linear moving member
131a, 151a: actuating rod 131b, 151b: elastic spring
131c, 151c: spring support plate 133, 153: clamp
133a, 153a: first tongs 133b, 153b: second tongs
133c: torsion spring 135: linear movement hinge pin
155: clamp interlocking link 155a: first link
155b: second link 155c: interlocking hinge pin

Claims (8)

frame; a clamping body provided on the frame; and a substrate gripper that is movably provided on the clamping body and selectively grips and fixes the substrate mounted on the frame according to linear and rotational movements,
The clamping body includes a holding guide part for guiding the substrate gripper, which has been extended for insertion of the substrate, to rotate in a direction to grip the substrate;
The substrate gripper may include a linear movement member installed on the clamping body to be linearly movable; and
Tongs which are provided rotatably and linearly on the clamping body so as to be rotatably connected to the linear movement member, and rotate to grip the substrate while being guided to the gripping guide part of the clamping body according to the movement of the linear movement member. part;
A substrate clamping device for surface treatment comprising a.
The method of claim 1,
The clamping body and the substrate gripper are provided in the frame to grip both sides of the substrate, respectively.
3. The method of claim 2,
The clamping body may include a guide block coupled to the frame and having the gripping guide part; and
and a block cover coupled to the guide block to guide the linear movement of the substrate gripper.
Linear movement guide long holes for linear movement of the substrate gripper are formed in the guide block and the block cover, respectively,
The substrate clamping device for surface treatment, characterized in that the substrate gripper is further moved to the outside of the clamping body while holding the substrate by the gripping guide part to maintain the tension of the substrate.
delete The method of claim 1,
The linear movement member may include: an operation rod having a linear movement hinge pin to which the tongs are rotatably coupled, and moving toward the clamping body through an actuator; and
an elastic spring elastically supporting the actuating rod to the outside of the clamping body;
A substrate clamping device for surface treatment comprising a.
6. The method of claim 5,
The clamping device for surface treatment, characterized in that the clamping portion is elastically supported in an expanding direction by a torsion spring coupled to the linear movable hinge pin.
The method of claim 1,
The substrate gripper may include: a tong interlocking link connecting the linear moving member and the tongs to rotate the tongs as the linear moving member operates;
A substrate clamping device for surface treatment comprising a.
8. The method of claim 7,
The tongs include first and second tongs, the central part of which is rotatably coupled to the clamping body through a clamping hinge pin,
The clamp interlocking link may include: a first interlocking link having one end hingedly connected to the linear moving member, and the other end being hingedly connected to any one of the first tongs and the second tongs through an interlocking hinge pin; and
a second interlocking link having one end hingedly connected to the linear moving member together with the first interlocking link, and the other end being hingedly connected to the other one of the first and second tongs through an interlocking hinge pin;
A substrate clamping device for surface treatment comprising a.

Images