KR102259426B1 - 압축 성형 장치, 압축 성형 방법 및 압축 성형품의 제조 방법 - Google Patents

압축 성형 장치, 압축 성형 방법 및 압축 성형품의 제조 방법 Download PDF

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Publication number
KR102259426B1
KR102259426B1 KR1020197007827A KR20197007827A KR102259426B1 KR 102259426 B1 KR102259426 B1 KR 102259426B1 KR 1020197007827 A KR1020197007827 A KR 1020197007827A KR 20197007827 A KR20197007827 A KR 20197007827A KR 102259426 B1 KR102259426 B1 KR 102259426B1
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KR
South Korea
Prior art keywords
mold
resin
excess resin
excess
molding
Prior art date
Application number
KR1020197007827A
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English (en)
Korean (ko)
Other versions
KR20190090777A (ko
Inventor
타카시 타무라
노리유키 타카하시
Original Assignee
토와 가부시기가이샤
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Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20190090777A publication Critical patent/KR20190090777A/ko
Application granted granted Critical
Publication of KR102259426B1 publication Critical patent/KR102259426B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
KR1020197007827A 2016-11-29 2017-08-08 압축 성형 장치, 압축 성형 방법 및 압축 성형품의 제조 방법 KR102259426B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-231493 2016-11-29
JP2016231493A JP6861506B2 (ja) 2016-11-29 2016-11-29 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
PCT/JP2017/028752 WO2018100807A1 (ja) 2016-11-29 2017-08-08 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法

Publications (2)

Publication Number Publication Date
KR20190090777A KR20190090777A (ko) 2019-08-02
KR102259426B1 true KR102259426B1 (ko) 2021-05-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197007827A KR102259426B1 (ko) 2016-11-29 2017-08-08 압축 성형 장치, 압축 성형 방법 및 압축 성형품의 제조 방법

Country Status (5)

Country Link
JP (1) JP6861506B2 (zh)
KR (1) KR102259426B1 (zh)
CN (1) CN109689330B (zh)
TW (1) TWI663039B (zh)
WO (1) WO2018100807A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113274154B (zh) * 2021-05-11 2022-04-22 瑞丰口腔科技（深圳）有限公司 一种可摘树脂义齿腭皱模具结构及义齿腭皱成型工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043343A (ja) 2000-07-25 2002-02-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型及び半導体装置の樹脂封止方法、並びに樹脂封止半導体装置の離型方法
JP2007301950A (ja) 2006-05-15 2007-11-22 Sumitomo Heavy Ind Ltd 熱硬化性樹脂の成形方法及び成形装置

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Publication number Priority date Publication date Assignee Title
US3581804A (en) * 1970-05-11 1971-06-01 Hamilton Die Cast Inc Expansion gap compensating system for a die
WO1995019251A1 (fr) * 1994-01-13 1995-07-20 Citizen Watch Co., Ltd. Procede de soudage par resine de dispositifs semi-conducteurs
JPH07205191A (ja) * 1994-01-13 1995-08-08 Citizen Watch Co Ltd 樹脂成形用装置
US7833456B2 (en) * 2007-02-23 2010-11-16 Micron Technology, Inc. Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece
CN101143492A (zh) * 2007-11-02 2008-03-19 贵州云马飞机制造厂 压缩式rtm成型方法
CN202062601U (zh) * 2011-05-21 2011-12-07 铁岭市友邦橡胶制品有限公司 一种高压油泵密封垫模具
JP5934138B2 (ja) * 2013-04-12 2016-06-15 Ｔｏｗａ株式会社 電子部品の圧縮樹脂封止方法及び圧縮樹脂封止装置
JP6020822B2 (ja) * 2013-04-17 2016-11-02 パナソニックＩｐマネジメント株式会社 射出成形用金型と射出成形方法
US9744735B2 (en) * 2013-06-13 2017-08-29 Bridgestone Sports Co., Ltd. Method for forming golf ball and mold therefor
JP6125371B2 (ja) * 2013-08-15 2017-05-10 信越化学工業株式会社 半導体装置の製造方法
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
TWI689396B (zh) * 2014-07-22 2020-04-01 日商山田尖端科技股份有限公司 成形模具、成形裝置及成形品的製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002043343A (ja) 2000-07-25 2002-02-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型及び半導体装置の樹脂封止方法、並びに樹脂封止半導体装置の離型方法
JP2007301950A (ja) 2006-05-15 2007-11-22 Sumitomo Heavy Ind Ltd 熱硬化性樹脂の成形方法及び成形装置

Also Published As

Publication number Publication date
TWI663039B (zh) 2019-06-21
CN109689330B (zh) 2022-02-08
JP2018086793A (ja) 2018-06-07
KR20190090777A (ko) 2019-08-02
TW201819144A (zh) 2018-06-01
JP6861506B2 (ja) 2021-04-21
CN109689330A (zh) 2019-04-26
WO2018100807A1 (ja) 2018-06-07

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