KR102258986B1 - 기판 건조 챔버 - Google Patents

기판 건조 챔버 Download PDF

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Publication number
KR102258986B1
KR102258986B1 KR1020190016600A KR20190016600A KR102258986B1 KR 102258986 B1 KR102258986 B1 KR 102258986B1 KR 1020190016600 A KR1020190016600 A KR 1020190016600A KR 20190016600 A KR20190016600 A KR 20190016600A KR 102258986 B1 KR102258986 B1 KR 102258986B1
Authority
KR
South Korea
Prior art keywords
substrate
drying
supercritical fluid
supply
lower housing
Prior art date
Application number
KR1020190016600A
Other languages
English (en)
Korean (ko)
Other versions
KR20200098900A (ko
Inventor
신희용
윤병문
Original Assignee
무진전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무진전자 주식회사 filed Critical 무진전자 주식회사
Priority to KR1020190016600A priority Critical patent/KR102258986B1/ko
Priority to PCT/KR2020/000159 priority patent/WO2020166824A1/ko
Priority to TW109104438A priority patent/TWI748341B/zh
Publication of KR20200098900A publication Critical patent/KR20200098900A/ko
Application granted granted Critical
Publication of KR102258986B1 publication Critical patent/KR102258986B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
KR1020190016600A 2019-02-13 2019-02-13 기판 건조 챔버 KR102258986B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020190016600A KR102258986B1 (ko) 2019-02-13 2019-02-13 기판 건조 챔버
PCT/KR2020/000159 WO2020166824A1 (ko) 2019-02-13 2020-01-06 기판 건조 챔버
TW109104438A TWI748341B (zh) 2019-02-13 2020-02-13 基板乾燥腔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190016600A KR102258986B1 (ko) 2019-02-13 2019-02-13 기판 건조 챔버

Publications (2)

Publication Number Publication Date
KR20200098900A KR20200098900A (ko) 2020-08-21
KR102258986B1 true KR102258986B1 (ko) 2021-06-02

Family

ID=72045029

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190016600A KR102258986B1 (ko) 2019-02-13 2019-02-13 기판 건조 챔버

Country Status (3)

Country Link
KR (1) KR102258986B1 (zh)
TW (1) TWI748341B (zh)
WO (1) WO2020166824A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036109A (ja) 2005-07-29 2007-02-08 Dainippon Screen Mfg Co Ltd 高圧処理装置
KR101619166B1 (ko) 2015-06-12 2016-05-18 카즈오 스기하라 기판의 세정·건조 처리 장치
KR101874901B1 (ko) 2011-12-07 2018-07-06 삼성전자주식회사 기판 건조 장치 및 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100929364B1 (ko) * 2003-05-26 2009-12-02 주식회사 케이씨텍 초임계 세정장치 및 방법
KR101012780B1 (ko) * 2008-09-10 2011-02-08 세메스 주식회사 기판 건조 장치
KR101096122B1 (ko) * 2009-11-25 2011-12-20 세메스 주식회사 기판 건조 장치 및 그의 기판 건조 방법
KR102037844B1 (ko) * 2013-03-12 2019-11-27 삼성전자주식회사 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법
KR101623411B1 (ko) * 2014-11-03 2016-05-24 세메스 주식회사 기판 처리 장치
KR101856606B1 (ko) 2016-06-02 2018-05-15 세메스 주식회사 기판 처리 장치 및 방법
KR101935951B1 (ko) * 2016-11-25 2019-01-08 세메스 주식회사 기판 처리 장치 및 방법
KR102417011B1 (ko) * 2017-05-16 2022-07-07 주식회사 케이씨텍 기판 처리용 챔버
KR102375985B1 (ko) * 2017-05-16 2022-03-21 주식회사 케이씨텍 기판 처리용 챔버
KR101981559B1 (ko) * 2018-07-11 2019-05-23 세메스 주식회사 기판 처리 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007036109A (ja) 2005-07-29 2007-02-08 Dainippon Screen Mfg Co Ltd 高圧処理装置
KR101874901B1 (ko) 2011-12-07 2018-07-06 삼성전자주식회사 기판 건조 장치 및 방법
KR101619166B1 (ko) 2015-06-12 2016-05-18 카즈오 스기하라 기판의 세정·건조 처리 장치

Also Published As

Publication number Publication date
WO2020166824A1 (ko) 2020-08-20
TWI748341B (zh) 2021-12-01
KR20200098900A (ko) 2020-08-21
TW202046427A (zh) 2020-12-16

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