KR102254187B1 - 기판 건조 장치 - Google Patents

기판 건조 장치 Download PDF

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Publication number
KR102254187B1
KR102254187B1 KR1020190087443A KR20190087443A KR102254187B1 KR 102254187 B1 KR102254187 B1 KR 102254187B1 KR 1020190087443 A KR1020190087443 A KR 1020190087443A KR 20190087443 A KR20190087443 A KR 20190087443A KR 102254187 B1 KR102254187 B1 KR 102254187B1
Authority
KR
South Korea
Prior art keywords
substrate
supercritical fluid
drying
supply
chamber
Prior art date
Application number
KR1020190087443A
Other languages
English (en)
Korean (ko)
Other versions
KR20210010057A (ko
Inventor
신희용
이태경
윤병문
Original Assignee
무진전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무진전자 주식회사 filed Critical 무진전자 주식회사
Priority to KR1020190087443A priority Critical patent/KR102254187B1/ko
Priority to CN202010690139.9A priority patent/CN112242323A/zh
Publication of KR20210010057A publication Critical patent/KR20210010057A/ko
Application granted granted Critical
Publication of KR102254187B1 publication Critical patent/KR102254187B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
KR1020190087443A 2019-07-19 2019-07-19 기판 건조 장치 KR102254187B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020190087443A KR102254187B1 (ko) 2019-07-19 2019-07-19 기판 건조 장치
CN202010690139.9A CN112242323A (zh) 2019-07-19 2020-07-17 基板干燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190087443A KR102254187B1 (ko) 2019-07-19 2019-07-19 기판 건조 장치

Publications (2)

Publication Number Publication Date
KR20210010057A KR20210010057A (ko) 2021-01-27
KR102254187B1 true KR102254187B1 (ko) 2021-05-21

Family

ID=74171395

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190087443A KR102254187B1 (ko) 2019-07-19 2019-07-19 기판 건조 장치

Country Status (2)

Country Link
KR (1) KR102254187B1 (zh)
CN (1) CN112242323A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115540527B (zh) * 2022-09-29 2024-02-27 浙江大学 超临界流体干燥系统及干燥方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101096122B1 (ko) * 2009-11-25 2011-12-20 세메스 주식회사 기판 건조 장치 및 그의 기판 건조 방법
JP2012049446A (ja) * 2010-08-30 2012-03-08 Toshiba Corp 超臨界乾燥方法及び超臨界乾燥システム
JP5647845B2 (ja) * 2010-09-29 2015-01-07 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置及び基板乾燥方法
KR101874901B1 (ko) * 2011-12-07 2018-07-06 삼성전자주식회사 기판 건조 장치 및 방법
US9587880B2 (en) * 2012-05-31 2017-03-07 Semes Co., Ltd. Apparatus and method for drying substrate
KR102037844B1 (ko) * 2013-03-12 2019-11-27 삼성전자주식회사 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법
EP3255661B1 (en) * 2013-03-12 2020-07-01 Samsung Electronics Co., Ltd. Substrate treatment method using supercritical fluid
JP2015114966A (ja) * 2013-12-13 2015-06-22 アドバンス電気工業株式会社 流量制御弁及びこれを用いた流量制御装置
KR101681190B1 (ko) * 2015-05-15 2016-12-02 세메스 주식회사 기판 건조 장치 및 방법
KR101856606B1 (ko) 2016-06-02 2018-05-15 세메스 주식회사 기판 처리 장치 및 방법
JP2018081966A (ja) * 2016-11-14 2018-05-24 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
KR102603528B1 (ko) * 2016-12-29 2023-11-17 삼성전자주식회사 기판 처리 장치 및 이를 포함한 기판 처리 시스템
US10825698B2 (en) * 2017-06-15 2020-11-03 Samsung Electronics Co., Ltd. Substrate drying apparatus, facility of manufacturing semiconductor device, and method of drying substrate
KR20190001753A (ko) * 2017-06-28 2019-01-07 주식회사 케이씨텍 초임계유체 가열장치 및 이를 포함하는 기판처리장치
KR102075683B1 (ko) * 2018-12-17 2020-03-02 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
KR102254186B1 (ko) * 2019-06-04 2021-05-21 무진전자 주식회사 기판 건조 장치

Also Published As

Publication number Publication date
KR20210010057A (ko) 2021-01-27
CN112242323A (zh) 2021-01-19

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AMND Amendment
E601 Decision to refuse application
X091 Application refused [patent]
AMND Amendment
X701 Decision to grant (after re-examination)