KR102253770B1 - Touch pannel and method for manufacturing the same - Google Patents

Abstract

The present specification discloses a display device. The display device may include a touch electrode layer formed on one surface of a first flexible substrate; An organic light emitting device layer formed on one surface of the second flexible substrate; A touch driver for controlling the touch electrode layer, and a connection portion connecting the touch electrode layer and the touch driver is provided on a surface opposite to a surface on which the touch electrode layer is provided.

Description

Touch panel and its manufacturing method {TOUCH PANNEL AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to a display device including a touch panel and a method of manufacturing the same.

Flat panel displays (FPDs) are used in various types of electronic products including mobile phones, tablet PCs, and notebook computers. Specific examples of flat panel display devices include a liquid crystal display device (LCD), an organic light emitting display device (OLED), a plasma display panel device (PDP), and a quantum dot display device. Display Device), Field Emission Display Device (FED), Electrophoretic Display Device (EPD), etc. These are common elements that use a flat panel display that embodies an image as an essential component. Bar, flat panel display panels have a configuration in which a pair of transparent insulating substrates are bonded to each other with a unique light-emitting or polarized light or other optical material layer interposed therebetween.

Meanwhile, as a method of inputting a control signal to an electronic product equipped with a display device, there are a method of using a touch panel and a method of using a button, but recently, a method of using a touch panel has been widely used.

As a method of configuring a touch panel in a display device, there are an add-on type, an on-cell type, and an integrated type or in-cell type of a touch sensor.

In the top plate attachment type, a touch panel on which a display device and a touch sensor are formed is separately manufactured, and then the touch panel is attached to the top plate of the display device. The top plate integrated type is a method of directly forming a touch sensor on the surface of an upper glass substrate of a display device. In the built-in touch sensor type, a touch sensor is embedded in the display device to achieve a thinner display device and increase durability.

The built-in touch sensor is drawing attention in that it can solve the shortcomings of the top plate attached type and the top plate integrated type touch sensor in that durability and thickness reduction are possible.

An object of the present specification is to provide a display device including a touch panel and a method of manufacturing the same. More specifically, an object of the present specification is to provide a touch panel and a method of manufacturing the same, in which a step due to a conductive film does not occur between substrates.

A display device is provided according to an exemplary embodiment of the present specification. The display device may include a touch electrode layer formed on one surface of a first flexible substrate; An organic light emitting device layer formed on one surface of the second flexible substrate; A touch driver for controlling the touch electrode layer, and a connection portion connecting the touch electrode layer and the touch driver is provided on a surface opposite to a surface on which the touch electrode layer is provided.

According to another exemplary embodiment of the present specification, a method of manufacturing a display device is provided. The method includes forming a touch electrode layer on one surface of a first flexible substrate; Forming an organic light emitting device layer on one surface of the second flexible substrate; Bonding the first flexible substrate and the second flexible substrate so that the touch electrode layer is positioned between the first flexible substrate and the second flexible substrate; Forming a hole penetrating the first flexible substrate; Forming a connection part in contact with the touch electrode layer through the hole; Electrically connecting the connection part and the circuit board on which the touch driver for controlling the touch electrode is mounted; Includes.

According to the exemplary embodiment of the present specification, a touch panel may be implemented without a conductive film inserted between the upper and lower substrates. Accordingly, in the display device according to the exemplary embodiment of the present specification, the step difference caused by the conductive film disappears, thereby solving a problem of a crack of a touch electrode layer and a problem of a breakage of an adhesive layer.

1 is a schematic diagram of a display device according to an exemplary embodiment of the present specification.
2 is an exemplary diagram illustrating a mutual type touch panel.
3 is an exemplary view showing a self-cap type touch panel.
4 is an exemplary diagram of a display device including a touch panel.
5 is a diagram illustrating a display device according to an exemplary embodiment of the present specification.
6 is a diagram illustrating a display device according to another exemplary embodiment of the present specification.
7 is a flowchart illustrating a method of manufacturing a display device according to an exemplary embodiment of the present specification.

In describing the embodiments of the present specification, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the nature, order, order, or number of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to that other component, but other components between each component It should be understood that "interposed" or that each component may be "connected", "coupled" or "connected" through other components. When an element or layer is referred to as “on” another element or layer, it includes all cases in which another layer or other element is interposed directly on or in the middle of another element. The size and thickness of each component shown in the drawings are illustrated for convenience of description, and the present invention is not limited to the size and thickness of the illustrated component.

Each of the features of the various embodiments of the present specification may be partially or entirely combined or combined with each other, and various interlocking and driving may be technically performed by a person skilled in the art, and each of the embodiments may be independently implemented with respect to each other or together in an associated relationship. It can also be implemented.

Hereinafter, exemplary embodiments of the present specification will be described in detail with reference to the accompanying drawings.

In general, the touch panel may be configured in various forms according to its arrangement position. That is, the touch panel is configured in a form in which the touch electrode is attached to the upper surface of the color filter substrate (on-cell type), or in the form in which the touch electrode is formed inside the cell constituting the display device (in-cell In-cell type), or one of the two electrodes constituting the touch electrode is formed on the TFT substrate of the display device, and the other is formed on the upper surface of the color filter substrate (hybrid in-cell type). Type (Hybrid type)). The embodiments of the present specification may be applied to a display device in which a touch panel is integrally formed with a panel of the display device, such as an in-cell type and a hybrid in-cell type. Accordingly, hereinafter, a panel in which a touch panel is integrally formed is referred to as an in-cell touch panel, and the present invention is described by taking an in-cell touch panel as an example. The in-cell touch panel may be formed so that an electrode formed on the in-cell touch panel can be used as a common electrode and a touch electrode, and may be applied to various types of display devices requiring a common electrode.

1 is a diagram schematically illustrating a display device according to an exemplary embodiment of the present specification, FIG. 2 is an exemplary diagram illustrating a mutual type touch panel, and FIG. 3 is a self cap type touch panel. It is an exemplary diagram showing.

Referring to FIG. 1, a display device according to the present specification includes: a touch panel 100 in which a touch electrode is integrally formed; A touch driver 600 that calculates touch coordinates in which a touch is recognized using the sensing signal received from the touch panel, and outputs the touch coordinates to a related application program; It may include driving units 200, 300, and 400 for controlling signals to be output to gate lines and data lines formed on the touch panel.

The touch panel 100 includes pixels formed in each area defined by an intersection of gate lines GL1 to GLg and data lines DL1 to DLd, and a thin film transistor TFT is formed in each of the pixels. .

The thin film transistor TFT supplies a data voltage supplied from the data line to the pixel electrode in response to a scan signal supplied from the gate line.

Meanwhile, the touch panel 100 may be configured in various forms, such as a resistive film type and a capacitive type. The capacitive method can be further divided into a mutual method and a self cap method.

The mutual touch panel 130 includes a plurality of driving electrodes 111 to which a driving pulse is input and a plurality of receiving electrodes 121 to which a sensing signal generated by the driving pulse is induced, as shown in FIG. 2. Includes. The driving electrode 111 and the receiving electrodes are collectively referred to as a touch electrode.

The self-cap type touch panel 130 includes a plurality of touch electrodes 131 to which a driving pulse is input, as shown in FIG. 3.

That is, in the mutual type touch panel 130, the touch electrodes are divided into the driving electrode 111 and the receiving electrode 121, but the self-cap type touch panel 130 includes a plurality of touch electrodes performing the same function. (131) are formed.

Meanwhile, the touch electrode is supplied with a common voltage to be supplied to the pixels during an image output period and a driving pulse for touch detection during a touch detection period. That is, the touch electrode repeatedly performs a function for outputting an image and a function for detecting a touch for a certain period of time.

The driving units 200, 300, 400 are configured to output a data voltage to the data lines and a scan signal to the gate lines. As shown in FIG. 1, data for outputting the data voltage It may include a driver 300, a gate driver 200 for outputting the scan signal, and a timing controller 400 for controlling functions of the data driver and the gate driver. The gate driver 200, the data driver 300, and the timing controller 400 may be connected to the touch panel in various forms depending on the size of the display device, the function of the display device, and the like.

The data driver 300 converts the digital image data transmitted from the timing controller 400 into a data voltage and converts the data voltage for one horizontal line into the data voltage for every horizontal period in which a scan signal is supplied to the gate line. Supply to the lines. The data driver 300 may include at least one or more source drive ICs connected to the panel 100 in the form of a chip-on-film (COF).

The data driver 300 converts the image data into the data voltage using gamma voltages supplied from a gamma voltage generator (not shown) and outputs the converted image data to the data line. To this end, the data driver 300 may include a shift register unit, a latch unit, a digital-to-analog converter (DAC), and an output buffer.

The shift register unit outputs a sampling signal using data control signals (SSC, SSP, etc.) received from the timing controller 400. The latch unit latches the digital image data sequentially received from the timing controller 400 and simultaneously outputs the digital image data to the digital-to-analog converter (DAC) 330. The digital-to-analog converter converts the image data transmitted from the latch unit to a positive or negative data voltage and outputs it. That is, the digital-to-analog converter determines the image data according to the polarity control signal POL transmitted from the timing controller 400 using a gamma voltage supplied from the gamma voltage generator (not shown). The data voltage is converted into a polarity or negative polarity data voltage and is output to the data lines. In this case, the gamma voltage generator converts the image data into the data voltage using the input voltage Vdd.

The output buffer is a data line DL of the panel according to the source output enable signal SOE transmitted from the timing controller 400, the data voltage of the positive polarity or the negative polarity transmitted from the digital-to-analog converter. Output as

The timing controller 400 uses a timing signal input from an external system (not shown), that is, a vertical synchronization signal (Vsync), a horizontal synchronization signal (Hsync), a data enable signal (DE), etc. A gate control signal (GCS) for controlling the operation timing of the driver 200 and a data control signal (DCS) for controlling the operation timing of the data driver 300 are generated, and are transmitted to the data driver 300. Generate image data (RGB).

To this end, the timing controller includes a receiving unit for receiving input data and timing signals from the external system, a control signal generating unit for generating various control signals, and rearranging and rearranging the input image data. A data alignment unit for outputting image data Data and an output unit for outputting the control signals and the image data may be included. That is, the timing controller rearranges input image data input from the external system according to the structure and characteristics of the panel 100, and transmits the rearranged image data to the data driver 300. . This function can be executed in the data alignment unit.

The timing controller uses timing signals transmitted from the external system, that is, a vertical synchronization signal (Vsync), a horizontal synchronization signal (Hsync), a data enable signal (DE), and the like, to control the data driver. A control signal DCS and a gate control signal GCS for controlling the gate driver are generated, and the control signals are transmitted to the data driver and the gate driver. This function can be executed by the control signal generator.

The data control signals generated by the control signal generator include a source start pulse (SSP), a source shift clock signal (SSC), a source output enable signal (SOE), a polarity control signal (POL), and the like.

Gate control signals GCS generated by the control signal generator include a gate start pulse (GSP), a gate shift clock (GSC), a gate output enable signal (GOE), a gate start signal (VST), and a gate clock (GCLK). Etc.

In addition, the timing controller 400 drives the data driver 300 and the gate driver 200 during an image output period during one frame period to output an image through the touch panel 100, 1 During the frame period, during the touch sensing period, the touch driver 600 is driven to detect a touch.

The gate driver 200 sequentially supplies a gate-on signal to each of the gate lines GL1 to GLg using a gate control signal transmitted from the time controller 400.

Here, the gate-on signal refers to a voltage capable of turning on the switching thin film transistors connected to the gate lines. A voltage capable of turning off the switching thin film transistor is referred to as a gate-off signal, and the gate-on signal and the gate-off signal are collectively referred to as a scan signal.

When the thin film transistor is an N-type, the gate-on signal is a high-level voltage, and the gate-off signal is a low-level voltage. When the thin film transistor is a P type, the gate-on signal is a low-level voltage, and the gate-off signal is a high-level voltage.

The gate driver 200 may be formed of a gate in panel (GIP) 210 mounted in the panel 100.

The touch driver 600 calculates touch coordinates in which a touch is recognized using a sensing signal received from the touch panel, and outputs the touch coordinates to an application unit that will drive a touch-related application program using the touch coordinates. Perform.

4 is an exemplary diagram of a display device including a touch panel.

When the display device is an OLED display, the display device includes a lower substrate 101, a thin film transistor layer 102a, an electroluminescence (EL) layer 103, and an encapsulation layer ( 104), an adhesive layer 105, a touch electrode layer 106, an upper substrate 107, an anisotropic conductive film 108, and a circuit board 601.

The lower substrate 101 and the upper substrate 107 are plates for forming a mechanical structure of a display device cell, and glass, plastic, or the like may be used as a material thereof.

The thin film transistor (TFT) layer is formed on the lower substrate 101 and is a layer in which switch elements supplying a data voltage to a pixel electrode are arranged. A pad portion may be positioned on one side of the thin film transistor layer 102a. The pad part 102b is a connection part formed for signal connection between the panel and a driver IC.

The electroluminescent layer 103 is a layer that emits light to the outside by stimulation of electrical energy, and in the case of an organic light emitting display device, an organic device that emits light to the outside by electrical stimulation is placed on the electroluminescent layer. Located.

The encapsulation layer is a layer that covers the organic light emitting device using glass or metal, and blocks moisture and oxygen flowing from the outside of the device to prevent oxidation of the light emitting material and electrode material, and prevents the device from mechanical/physical impact. It plays a role to protect.

The adhesive layer 105 is a layer that bonds the lower substrate 101 and the upper substrate 107 to each other, and may be formed of a resin. Resin is an amorphous solid or semi-solid material composed of an organic compound and a derivative thereof, and is amorphous or non-volatile.

A touch sensor for sensing a touch signal input from the outside and related wires are formed on the touch electrode layer.

The anisotropic conductive film (ACF) is a resin component film containing conductive balls, which is used for bonding and electrical conduction of a printed circuit board. The anisotropic conductive film serves to allow electric current to pass because conductive particles are dispersed, and it is cured by heat and pressure to maintain adhesive strength.

The circuit board 601 is a circuit board on which a driver IC is mounted, and may be a PCB, a flexible PCB (F-PCB), or the like. A data driving integrated circuit, a gate driving integrated circuit, and a touch driving integrated circuit may be mounted on the circuit board 601. The driving integrated circuit may be connected to a bonding pad of a display panel in a tape automated bonding (TAB) method or a chip on glass (COG) method.

The display device of FIG. 4 may be manufactured through the following process. First, the upper plate on which the touch electrode layer 106 is formed (upper substrate and support substrate (eg, glass)), and the lower plate on which the electroluminescent layer 103 is deposited (lower substrate and support substrate (eg, glass)) Each of these are produced. Next, the upper and lower plates are bonded, and pressure is applied to the bonded upper and lower plates, so that the conductive film 108 comes into contact with the pad portion 102b of the lower plate. Thereafter, the support substrate of the upper plate is removed, and a process of connecting the circuit board 601 to the pad portion 102b is performed. Finally, the supporting substrate of the lower plate is released.

The display device manufactured through the above process includes the thickness of the conductive film 108 attached to the upper plate, the electroluminescent layer 103 and the encapsulation layer 104 and the adhesive layer 105 deposited on the lower plate and/or the upper plate. The sum of the thicknesses of may be different. For this reason, a step (height difference) may occur around the conductive film 108 after bonding. Due to such a step, a crack may occur in the touch electrode layer when pressure is applied to the upper plate and the lower plate, or a defect in which the resin of the adhesive layer may burst may occur. Therefore, there is a need for a solution to the problem caused by such a step difference.

5 is a diagram illustrating a display device according to an exemplary embodiment of the present specification.

When the display device is an OLED display, the display device includes a lower substrate 101, a thin film transistor layer 102a, an organic light emitting element layer 103, an encapsulation layer 104, and an adhesive layer 105. , A touch electrode layer 106a, an upper substrate 107, and a circuit board 601 may be included.

The upper substrate (first substrate) and the lower substrate (second substrate) are plates for forming a mechanical structure of a display device, and may be flexible substrates made of glass, metal, plastic, or the like. have.

The thin film transistor (TFT) layer is formed on the second substrate 101 and is a layer in which switch elements supplying a data voltage to a pixel electrode are arranged by the number corresponding to a dot (Sub-Pixel). The organic light-emitting device layer 103 is a layer that emits light to the outside by stimulation of electrical energy, and includes an organic device that emits light to the outside by electrical stimulation. The organic light emitting device layer 103 is formed on one surface of the second substrate 101 together with the thin film transistor (TFT) layer.

The encapsulation layer is a layer covering the organic light emitting device using glass or metal, and blocks moisture and oxygen flowing from the outside of the device to prevent oxidation of the light emitting material and electrode material, and prevents the device from mechanical/physical impact. It plays a role to protect.

The adhesive layer 105 is a layer bonding the first substrate and the second substrate, and may be formed of a resin. Resin is an amorphous solid or semi-solid material composed of organic compounds and derivatives thereof.

The touch electrode layer is formed on an inner surface of the first substrate (a lower surface of the first substrate in FIG. 5) and is positioned between the first substrate and the second substrate. The touch electrode layer 106a includes a touch electrode for sensing a touch signal input from the outside, an electric wire for transmitting the detected touch signal to a touch driving circuit, and other elements related to touch sensing.

The organic light-emitting device layer 103 and the touch electrode layer 106a face each other with an adhesive layer therebetween.

The circuit board 601 is a printed circuit board on which a touch driver for controlling a touch electrode is mounted (eg, F-PCB). Such a driving circuit may be connected to the display panel in a tape automated bonding (TAB) method or a chip on glass (COG) method.

The touch electrode layer 106a may further include a connection part 106b passing through the first substrate and connected to the circuit board 601. As shown in FIG. 5, the connection part 106b is located on the outer surface of the first substrate and serves to electrically connect the touch electrode layer 106a and the touch driver. At this time, the connection part 106b may be made of a conductive material. A contact hole penetrating the first substrate may be formed through a laser processing process or an etching process. In addition, the connection part may be a conductive object (eg, metal) deposited on the first substrate through a contact hole.

The connection part 106b may further include a pad part provided on the outer surface of the first substrate. In this case, the connection part 106b may be connected to a printed circuit board on which the touch driver is mounted through the pad part.

Unlike the display device of FIG. 4, the electric wiring formed on the touch electrode layer 106b may be connected to the circuit board 601 on which the touch driving circuit is mounted without passing through a conductive film. That is, the electrical wiring is electrically connected to the circuit board through a hole formed in the first substrate (a substrate on which the touch electrode layer is formed), on the first substrate (on a surface opposite to the surface on which the touch electrode layer is formed). It is connected by When connected in this way, the display device of FIG. 5 may be configured without a conductive member (eg, ACF) between the first substrate and the second substrate. Accordingly, in the display device configured as shown in FIG. 5 according to an exemplary embodiment of the present specification, a problem of cracking of a touch electrode layer and a problem of breakage of an adhesive layer does not appear because the step difference caused by the conductive film disappears.

In the display device, the first substrate may be formed of a transparent plastic substrate. The transparent plastic substrate is a substrate through which light is transmitted, and may be formed of a transparent PI (Polyimide) having high transmittance.

Meanwhile, the second substrate may be formed of a colored plastic substrate. The colored plastic substrate may be made of a material capable of withstanding high temperatures (about 400°C) capable of depositing TFTs.

6 is a diagram illustrating a display device according to another exemplary embodiment of the present specification.

The display device includes a lower substrate 101, a thin film transistor layer 102a, an organic light emitting device layer 103, an encapsulation layer 104, an adhesive layer 105, a touch electrode layer 106a, a connection part 106b, and an upper substrate. (107), it may be configured to include a circuit board (601). Each of the above components is as described in FIG. 5.

The display device illustrated in FIG. 6 may include a pad portion on one side of the thin film transistor layer 102a. The pad part 102b is a connection part formed for signal connection between a panel and a driver-IC.

Referring to FIG. 6, the second substrate 101 includes a pad portion 102b, and the connection portion 106b and the circuit board 601 are electrically connected to each other through the pad portion 102b. Meanwhile, the connection part 106b may be interconnected with the pad part 102b through an additional wiring 106c formed from the outer surface of the first substrate to the pad part 102b of the second substrate. That is, the electrical wiring formed on the first substrate extends through a hole formed in the first substrate (a plastic substrate including a touch electrode layer), and the second substrate (a substrate not including the touch electrode layer) ) May be connected to a pad located on the top.

In the display device, the first substrate may be formed of a transparent plastic substrate. The transparent plastic substrate is a substrate through which light is transmitted, and may be formed of a transparent PI (Polyimide) having high transmittance.

Meanwhile, the second substrate may be formed of a colored plastic substrate. The colored plastic substrate may be made of a material capable of withstanding high temperatures (about 400°C) capable of depositing TFTs.

The display device of FIG. 6 may also be configured without a conductive film (ACF) interposed between the first substrate and the second substrate. Therefore, even in the display device configured as in the example of FIG. 6, the step difference caused by the conductive film disappears, so that the problem of cracking the touch electrode layer and the problem of breaking the adhesive layer do not appear.

7 is a flowchart illustrating a method of manufacturing a display device according to an exemplary embodiment of the present specification.

The manufacturing method can be implemented by the manufacturing equipment of the display device. In addition, the display device has the features described in FIGS. 1 to 6.

First, a step (S710) of forming a touch electrode layer including a touch electrode on one surface of the first substrate is performed. In addition, a step (S720) of forming an organic light emitting device layer on one surface of the second substrate is performed.

The touch electrode layer is formed on one surface of the first substrate (the lower surface of the first substrate in FIG. 5) and is positioned between the first substrate and the second substrate. A touch sensor for sensing a touch signal input from the outside and related wires are formed on the touch electrode layer.

Thereafter, a step (S730) of bonding the first substrate and the second substrate so that the touch electrode layer is positioned between the first substrate and the second substrate (S730) is performed.

After the bonding step, a step of forming a contact hole penetrating the first substrate and a step of forming a connection portion contacting the touch electrode layer through the hole (S740) are performed. The step of forming the contact hole may be performed through a laser processing process or an etching process. In addition, the step of forming the connection part may include depositing a connection part made of a metal material on the first substrate through a contact hole.

When the formation of the connection part is completed, a step (S750) of connecting the connection part to the circuit board on which the touch driver for controlling the touch electrode is mounted is performed. The circuit board is a printed circuit board on which a touch driver is mounted (eg, F-PCB).

In this case, the step of connecting the circuit board and the connection part may be a step of arranging the circuit board on the first flexible substrate so as to be in contact with the connection part.

Alternatively, the connecting of the connection part and the circuit board may include forming a pad part electrically connecting the circuit board on the second flexible substrate; and the touch through the hole on the first flexible substrate It may include forming an electrical wire in contact with the electrode layer to extend to and in contact with the pad portion of the second flexible substrate.

The description above and the accompanying drawings are merely illustrative of the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention pertains, combinations of configurations within the scope not departing from the essential characteristics of the present invention. Various modifications and variations, such as separation, substitution, and alteration, will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

Claims (13)

A touch electrode layer formed on one surface of the first flexible substrate;
An organic light emitting device layer formed on one surface of the second flexible substrate; And
Including; an external circuit board on which a touch driver for controlling the touch electrode layer is mounted,
A connection part connecting the touch electrode layer and the touch driver is provided on a surface opposite to the surface on which the touch electrode layer is provided,
The external circuit board is in contact with the connection part and extends from an upper portion of the first flexible substrate to an upper portion of the second flexible substrate. The method of claim 1,
The touch electrode layer is provided on an inner surface of the first flexible substrate, and the connection portion is connected to the touch electrode layer through a contact hole of the first flexible substrate. delete The method of claim 2,
And the connection part further comprises a pad part directly connected to the external circuit board on an outer surface of the first flexible board. The method of claim 1,
Wherein the organic light emitting element layer and the touch electrode layer face each other with an adhesive layer therebetween. The method of claim 1,
The first flexible substrate is a transparent plastic substrate, and the second flexible substrate is a colored plastic substrate. A pair of plastic substrates;
A touch electrode layer positioned on a rear surface of a first flexible substrate among the pair of plastic substrates;
A pad positioned on an upper surface of a second flexible substrate among the pair of plastic substrates;
A circuit board connected to the pad and on which a touch driving circuit for controlling the touch electrode layer is mounted; And
An electric wire connected to the pad and transferring a touch input signal sensed by the touch electrode layer to the touch driving circuit,
The electric wiring is in contact with an upper surface and a side surface of the first flexible substrate and extends to contact the pad. delete The method of claim 7,
The electric wire is formed on a surface opposite to the touch electrode layer, and is connected to the touch electrode layer through a hole. delete Forming a touch electrode layer on one surface of the first flexible substrate;
Forming an organic light emitting device layer on one surface of the second flexible substrate;
Bonding the first flexible substrate and the second flexible substrate so that the touch electrode layer is positioned between the first flexible substrate and the second flexible substrate;
Forming a hole penetrating the first flexible substrate;
Forming a connection part in contact with the touch electrode layer through the hole; And
Electrically connecting a circuit board on which a touch driver for controlling the touch electrode is mounted to the connection unit; Including,
The circuit board is in contact with the connection part and extends from an upper portion of the first flexible substrate to an upper portion of the second flexible substrate. Forming a touch electrode layer on the rear surface of the first flexible substrate;
Forming an organic light emitting device layer on the upper surface of the second flexible substrate;
Bonding the first flexible substrate and the second flexible substrate so that the touch electrode layer is positioned between the first flexible substrate and the second flexible substrate;
Forming a hole penetrating the first flexible substrate;
Forming a connection part in contact with the touch electrode layer through the hole; And
Electrically connecting a circuit board on which a touch driver for controlling the touch electrode is mounted to the connection unit; Including,
The second flexible substrate further includes a pad portion connected to the circuit board,
And the circuit board and the connection part are electrically connected from the connection part to an upper surface and a side surface of the first flexible substrate by an electric wire extending to contact the pad part.
delete

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