KR20160062368A - Touch pannel and method for manufacturing the same - Google Patents

Abstract

According to the present disclosure, disclosed is a display device. The display device comprises: a touch electrode layer formed on one surface of a first flexible substrate; an organic light emitting element layer formed on one surface of a second flexible substrate; and a touch driver controlling the touch electrode layer. A surface, opposite to a surface having the touch electrode layer, includes a coupling unit configured to couple the touch electrode layer and the touch driver. The present invention provides a touch panel capable of preventing a step difference possibly caused by a conductive film between substrates.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a touch panel,

The present invention relates to a display device including a touch panel and a method of manufacturing the same.

Flat panel displays (FPDs) are used in various types of electronic products including cellular phones, tablet PCs, and notebook computers. Specific examples of the flat panel display include a liquid crystal display (LCD), an organic light emitting display (OLED), a plasma display panel (PDP), a quantum dot display A field emission display device (FED), an electrophoretic display device (EPD), and the like. These devices commonly use a flat panel display panel that implements an image as an essential component The bar and the flat panel display panel have a structure in which a pair of transparent insulating substrates are bonded together with inherent light emission, polarization, or other optical material layers interposed therebetween.

On the other hand, as a method of inputting a control signal to an electronic product on which a display device is mounted, there are a method using a touch panel and a method using a button, but recently, a method using a touch panel has been widely used.

As a method for constructing a touch panel on a display device, there are an add-on type, an on-cell type, an integrated type or an in-cell type.

In the top plate attaching type, a touch panel is attached to an upper plate of a display device after separately manufacturing a display device and a touch panel formed with a touch sensor. The top plate integral type is a method of directly forming a touch sensor on the surface of the upper glass substrate of the display device. The built-in touch sensor incorporates a touch sensor inside the display device to achieve a thin display device and enhance durability.

Since the built-in touch sensor has durability and thinness, attention is focused on the fact that it can solve the disadvantages of the touch sensor with the top plate attachment type and the top plate integration type.

An object of the present invention is to provide a display device including a touch panel and a method of manufacturing the same. More particularly, the present invention aims to provide a touch panel in which a step due to a conductive film does not occur between substrates, and a manufacturing method thereof.

A display device is provided according to an embodiment of the present disclosure. The display device includes a touch electrode layer formed on one surface of a first flexible substrate; An organic light emitting element layer formed on one surface of the second flexible substrate; And a touch driver for controlling the touch electrode layer, and a connection portion for connecting the touch electrode layer and the touch driver is provided on a surface opposite to the surface provided with the touch electrode layer.

According to another embodiment of the present invention, a method of manufacturing a display device is provided. The method includes: forming a touch electrode layer on one surface of a first flexible substrate; Forming an organic light emitting element layer on one surface of a second flexible substrate; Attaching the first flexible substrate and the second flexible substrate so that the touch electrode layer is positioned between the first flexible substrate and the second flexible substrate; Forming a hole through the first flexible substrate; Forming a connection portion in contact with the touch electrode layer through the hole; Electrically connecting the connection portion and the circuit board on which the touch driver for controlling the touch electrode is mounted; .

According to the embodiments of the present invention, a touch panel can be realized without a conductive film interposed between upper and lower substrates. Accordingly, the display device according to the embodiment of the present invention can solve the problem of cracking of the touch electrode layer and damage of the adhesive layer by eliminating the step appearing due to the conductive film.

1 is a view schematically showing a display device according to an embodiment of the present invention.
2 is an exemplary view showing a mutual touch panel.
Fig. 3 is a view showing an example of a self-cap type touch panel.
4 is an example of a display device including a touch panel.
5 is a view illustrating a display device according to an embodiment of the present invention.
6 is a view illustrating a display device according to another embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention.

In describing the embodiments of the present specification, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the components from other components, and the terms do not limit the nature, order, order, or number of the components. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected or connected to the other component, Quot; intervening "or that each component may be" connected, "" coupled, "or " connected" through other components. An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between. The sizes and thicknesses of the respective components shown in the drawings are shown for convenience of explanation and the present invention is not limited to the sizes and thicknesses of the components shown.

It is to be understood that each of the features of the various embodiments herein may be combined or combinable, either partially or entirely, and may be technically variously interlocked and driven by one skilled in the art, and that each embodiment may be implemented independently of one another, .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Generally, the touch panel can be configured in various forms according to its arrangement position. That is, the touch panel may be configured as a type (on-cell type) in which the touch electrode is attached to the upper surface of the color filter substrate, or a mode in which the touch electrode is formed inside the cell constituting the display device Type or a shape in which one of two electrodes constituting the touch electrode is formed on the TFT substrate of the display device and the other is formed on the upper surface of the color filter substrate Type (Hybrid type). The embodiments of the present invention can be applied to a display device in which a touch panel is integrally formed on a panel of a display device, such as an in-cell type or a hybrid in-cell type. Accordingly, in the following, the panel in which the touch panel is integrally formed is referred to as an in-line touch panel, and the present invention is described as an in-cell touch panel as an example. The in-cell touch panel can be formed so that the electrodes formed on the in-cell touch panel can be used as a common electrode and a touch electrode, and can be applied to various types of display devices requiring a common electrode.

FIG. 1 is a view schematically showing a display device according to an embodiment of the present invention, FIG. 2 is an exemplary view showing a mutual touch panel, FIG. 3 is a view showing a self- Fig.

Referring to FIG. 1, a display device according to the present invention includes: a touch panel 100 having touch electrodes formed integrally; A touch driver (600) for calculating touch coordinates recognized by a touch using the sensing signal received from the touch panel and outputting the touch coordinates to an associated application program; 300, and 400 for controlling signals to be output to gate lines and data lines formed on the touch panel.

The touch panel 100 includes pixels formed in regions defined by the intersections of the gate lines GL1 to GLg and the data lines DL1 to DLd and a thin film transistor TFT is formed in each of the pixels .

The thin film transistor (TFT) supplies a data voltage supplied from the data line to the pixel electrode in response to a scan signal supplied from the gate line.

Meanwhile, the touch panel 100 may be formed in various forms such as a resistive type or a capacitive type. The electrostatic capacity type can be further divided into a mutual mode and a self cap mode.

2, the mutual-type touch panel 130 includes a plurality of driving electrodes 111 to which driving pulses are input and a plurality of receiving electrodes 121 to which sensing signals generated by driving pulses are led . The driving electrode 111 and the receiving electrodes are collectively referred to as a touch electrode.

3, the self-cap type touch panel 130 includes a plurality of touch electrodes 131 to which drive pulses are input.

That is, in the mutual type touch panel 130, the touch electrode is divided into the driving electrode 111 and the receiving electrode 121. However, in the self-cap type touch panel 130, a plurality of touch electrodes (131) are formed.

In the meantime, the touch electrode receives a common voltage to be supplied to the pixels during a video output period, and receives a driving pulse for touch sensing among the touch sensors. That is, the touch electrode repeatedly performs a function for outputting a video image and a function for sensing a touch for a predetermined period of time.

The driving units 200, 300, and 400 output data voltages to the data lines and output scan signals to the gate lines. As shown in FIG. 1, data for outputting the data voltages A driver 300, a gate driver 200 for outputting the scan signals, and a timing controller 400 for controlling the functions of the data driver and the gate driver. The gate driver 200, the data driver 300, and the timing controller 400 may be connected to the touch panel in various forms according to the size of the display device, the function of the display device, and the like.

The data driver 300 converts the digital image data transmitted from the timing controller 400 into a data voltage and supplies the data voltage of one horizontal line to the data line Lines. The data driver 300 may include at least one source driver IC connected to the panel 100 in a chip-on-film (COF) form.

The data driver 300 converts the image data into the data voltage using gamma voltages supplied from a gamma voltage generator (not shown), and outputs the data voltage to the data line. To this end, the data driver 300 may include a shift register unit, a latch unit, a digital-analog converter (DAC), and an output buffer.

The shift register unit outputs a sampling signal using data control signals (SSC, SSP, etc.) received from the timing controller (400). The latch unit latches the digital image data Data sequentially received from the timing controller 400 and simultaneously outputs the latched digital image data Data to the digital-analog converter (DAC) 330. The digital-to-analog converter converts the image data transmitted from the latch unit into a data voltage of positive or negative polarity and outputs the same. That is, the digital-analog converter uses the gamma voltage supplied from the gamma voltage generator (not shown) to generate the image data according to the polarity control signal POL transmitted from the timing controller 400 Polarity or negative polarity data voltage and outputs the data voltage to the data lines. In this case, the gamma voltage generator converts the image data into the data voltage using the input voltage Vdd.

The output buffer outputs a positive or negative polarity data voltage transmitted from the digital-analog converter to the data line DL of the panel according to a source output enable signal SOE transmitted from the timing controller 400, .

The timing controller 400 uses the timing signals input from an external system (not shown), that is, the vertical synchronization signal Vsync, the horizontal synchronization signal Hsync, and the data enable signal DE, The data driver 300 generates a gate control signal GCS for controlling the operation timing of the driver 200 and a data control signal DCS for controlling the operation timing of the data driver 300, And generates image data (RGB).

The timing controller may include a receiver for receiving input image data and timing signals from the external system, a control signal generator for generating various control signals, a rearrangement unit for rearranging the input image data, A data sorting unit for outputting the image data, and an output unit for outputting the control signals and the image data. That is, the timing controller rearranges the input image data input from the external system according to the structure and characteristics of the panel 100, and transmits the rearranged image data to the data driver 300 . Such a function can be executed in the data arrangement section.

The timing controller uses the timing signals transmitted from the external system, that is, the vertical synchronization signal (Vsync), the horizontal synchronization signal (Hsync), and the data enable signal (DE) Generates a control signal DCS and a gate control signal (GCS) for controlling the gate driver, and transmits the control signals to the data driver and the gate driver. This function can be executed in the control signal generation unit.

The data control signals generated by the control signal generator include a source start pulse SSP, a source shift clock signal SSC, a source output enable signal SOE, and a polarity control signal POL.

The gate control signals GCS generated by the control signal generator include a gate start pulse GSP, a gate shift clock GSC, a gate output enable signal GOE, a gate start signal VST, a gate clock GCLK, .

The timing controller 400 drives the data driver 300 and the gate driver 200 to output an image through the touch panel 100 during a video output period of one frame period, During the frame period, the touch driver 600 is driven to detect the touch between the touch detectors.

The gate driver 200 sequentially supplies a gate-on signal to each of the gate lines GL1 to GLg using a gate control signal transmitted from the time controller 400. [

Here, the gate-on signal refers to a voltage capable of turning on the switching thin film transistor connected to the gate lines. The voltage capable of turning off the switching thin film transistor is referred to as a gate off signal, and the gate on signal and the gate off signal are generically referred to as a scan signal.

When the thin film transistor is of the N type, the gate on signal is a high level voltage and the gate off signal is a low level voltage. When the thin film transistor is of the P type, the gate on signal is a low level voltage and the gate off signal is a high level voltage.

The gate driver 200 may be formed of Gate In Panels (GIP) 210 mounted in the panel 100.

The touch driver 600 calculates the touch coordinates recognized by touch using the sensing signal received from the touch panel and outputs the touch coordinates to an application unit for driving the touch related application program using the touch coordinates .

4 is an example of a display device including a touch panel.

When the display device is an organic light emitting diode (OLED) display, the display device includes a lower substrate 101, a thin film transistor layer 102a, an electroluminescence (EL) layer 103, an encapsulation layer 104, an adhesive layer 105, a touch electrode layer 106, an upper substrate 107, an anisotropic conductive film 108, and a circuit substrate 601.

The lower substrate 101 and the upper substrate 107 are plates for forming a mechanical structure of a display device cell, and glass, plastic, or the like can be used as the material.

The thin film transistor (TFT) layer is formed on the lower substrate 101 and is a layer in which switch elements for supplying data voltages to the pixel electrodes are arranged. A pad may be positioned on one side of the thin film transistor layer 102a. The pad portion 102b is a connection portion formed for signal connection between the panel and the driver IC.

The electroluminescent layer 103 is a layer that emits light to the outside by stimulation of electric energy. In the case of an organic light emitting display, an organic device that emits light to the outside by electric stimulation is formed on the electroluminescent layer Located.

The encapsulation layer is a layer that covers the organic light emitting diode using glass or metal. The encapsulation layer shields moisture and oxygen from the outside of the device to prevent oxidation of the light emitting material and the electrode material, .

The adhesive layer 105 is a layer for bonding the lower substrate 101 and the upper substrate 107, and may be made of resin. A resin is an amorphous solid or semi-solid substance composed of an organic compound and its derivatives, and is amorphous or nonvolatile.

The touch electrode layer is formed with a touch sensor and associated wiring for sensing a touch signal input from the outside.

The anisotropic conductive film (ACF) is a resin component film containing a conductive ball, which is used for adhesion to a printed circuit board and electrical conduction. The anisotropic conductive film is dispersed in the conductive particles to conduct current, and is hardened by heat and pressure to maintain the adhesive force.

The circuit board 601 is a circuit board on which a driver IC is mounted, and may be a PCB, an F-PCB (Flexible PCB), or the like. A data driving integrated circuit, a gate driving integrated circuit, a touch driving integrated circuit, and the like may be mounted on the circuit board 601. The driving integrated circuit may be connected to a bonding pad of a display panel by a tape automated bonding (TAB) method or a chip on glass (COG) method.

The display device of FIG. 4 can be manufactured through the following process. (A lower substrate and a supporting substrate (e.g., glass)) on which an electroluminescent layer 103 is deposited, and a lower substrate (e.g., a glass substrate) on which a touch electrode layer 106 is formed, Respectively. Next, the upper plate and the lower plate are attached to each other, pressure is applied to the upper and lower plates, and the conductive film 108 is brought into contact with the pad portion 102b of the lower plate. Thereafter, the support substrate of the upper plate is released, and the process of connecting the circuit board 601 to the pad portion 102b proceeds. Finally, the support substrate of the lower plate is released.

The display device manufactured through the above process has a thickness of the conductive film 108 attached to the upper plate and the thickness of the electroluminescent layer 103, the sealing layer 104 and the adhesive layer 105 deposited on the lower plate and / May be different. Therefore, a level difference (height difference) may occur around the conductive film 108 after the adhesion. Such a step may cause a crack in the touch electrode layer when pressure is applied to the upper plate and the lower plate, or failure of the resin of the adhesive layer to blow out may occur. Therefore, a solution to the problem caused by such a step difference is required.

5 is a view illustrating a display device according to an embodiment of the present invention.

When the display device is an organic light emitting diode (OLED) display, the display device includes a lower substrate 101, a thin film transistor layer 102a, an organic light emitting element layer 103, an encapsulation layer 104, A touch electrode layer 106a, an upper substrate 107, and a circuit board 601. [

The upper substrate (first substrate) and the lower substrate (second substrate) are plates for forming a mechanical structure of a display device and can be flexible substrates made of glass, metal, have.

The thin film transistor (TFT) layer is formed on the second substrate 101, and is a layer in which the number of switch elements for supplying a data voltage to the pixel electrode is arranged in a number corresponding to a Dot (Sub-Pixel). The organic light emitting device layer 103 is a layer that emits light to the outside by stimulation of electric energy and includes an organic device that emits light to the outside by electric stimulation. The organic light emitting device layer 103 is formed on one surface of the second substrate 101 together with the thin film transistor (TFT) layer.

The encapsulation layer is a layer that covers the organic light emitting diode using glass or metal. The encapsulation layer shields moisture and oxygen from the outside of the device to prevent oxidation of the light emitting material and the electrode material, .

The adhesive layer 105 is a layer for bonding the first substrate and the second substrate, and may be composed of a resin. Resin is an amorphous solid or semi-solid material composed of organic compounds and their derivatives.

The touch electrode layer is formed on the inner surface of the first substrate (the lower surface of the first substrate in Fig. 5) and is located between the first substrate and the second substrate. The touch electrode layer 106a is formed with a touch electrode that senses a touch signal input from the outside, an electric wire that transmits the sensed touch signal to the touch driving circuit, and other elements related to touch sensing.

The organic light emitting device layer 103 and the touch electrode layer 106a are opposed to each other with an adhesive layer interposed therebetween.

The circuit board 601 is a printed circuit board (e.g., F-PCB) on which a touch driver circuit for controlling the touch electrodes is mounted. This driving circuit may be connected to the display panel by a tape automated bonding (TAB) method or a chip on glass (COG) method.

The touch electrode layer 106a may further include a connection portion 106b that penetrates the first substrate and is formed on the circuit board 601. [ As shown in FIG. 5, the connection portion 106b is located on the outer surface of the first substrate and electrically connects the touch electrode layer 106a and the touch driver. At this time, the connection portion 106b may be made of a conductive material. A contact hole passing through the first substrate may be formed through a laser processing process or an etching process. Further, the connection portion may be a conductive object (e.g., metal) deposited on the first substrate through the contact hole.

The connection portion 106b may further include a pad portion provided on an outer surface of the first substrate. At this time, the connection portion 106b may be connected to the printed circuit board on which the touch driver is mounted through the pad portion.

4, the electric wiring formed on the touch electrode layer 106b may be connected to the circuit board 601 on which the touch driving circuit is mounted without passing through the conductive film. That is, the electric wiring is electrically connected to the circuit board on the first substrate (on the opposite side of the surface on which the touch electrode layer is formed) through a hole formed in the first substrate (substrate on which the touch electrode layer is formed) Lt; / RTI > When connected in this way, the display device of Fig. 5 may be configured without a conductive member (e.g., ACF) between the first substrate and the second substrate. Therefore, according to one embodiment of the present invention, in the display device constructed as shown in FIG. 5, the step appearing due to the conductive film disappears, so that the problem of the crack of the touch electrode layer and the problem of the breakage of the adhesive layer do not appear.

In the display device, the first substrate may be a transparent plastic substrate. The transparent plastic substrate is a substrate through which light is transmitted, and may be made of transparent PI (polyimide) having high transparency.

Meanwhile, the second substrate may be formed of a colored plastic substrate. The colored plastic substrate may be made of a material capable of withstanding a high temperature (about 400 DEG C) capable of depositing a TFT.

6 is a view illustrating a display device according to another embodiment of the present invention.

The display device includes a lower substrate 101, a thin film transistor layer 102a, an organic light emitting element layer 103, an encapsulation layer 104, an adhesive layer 105, a touch electrode layer 106a, a connection portion 106b, A circuit board 107, and a circuit board 601. Each of the above-described components is as described in FIG.

The display device shown in FIG. 6 may include a pad portion on one side of the thin film transistor layer 102a. The pad portion 102b is a connection portion formed for signal connection between the panel and the driver IC.

Referring to FIG. 6, the second substrate 101 includes a pad portion 102b, and the connection portion 106b and the circuit board 601 are electrically connected to each other through the pad portion 102b. The connection portion 106b may be interconnected with the pad portion 102b through an additional wiring 106c formed from the outer surface of the first substrate to the pad portion 102b of the second substrate. That is, the electric wiring formed on the first substrate extends through a hole formed in the first substrate (the plastic substrate including the touch electrode layer), and the second substrate (the substrate not including the touch electrode layer) And may be connected to a pad located on the pad.

In the display device, the first substrate may be a transparent plastic substrate. The transparent plastic substrate is a substrate through which light is transmitted, and may be made of transparent PI (polyimide) having high transparency.

Meanwhile, the second substrate may be formed of a colored plastic substrate. The colored plastic substrate may be made of a material capable of withstanding a high temperature (about 400 DEG C) capable of depositing a TFT.

The display device of Fig. 6 may also be configured without a conductive film (ACF) interposed between the first substrate and the second substrate. Therefore, in the display device constructed as in the example of Fig. 6, the step appearing due to the conductive film disappears, so that the problem of the crack of the touch electrode layer and the problem of destruction of the adhesive layer are not present.

7 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention.

The above manufacturing method can be executed by the manufacturing equipment of the display device. The display device has the features described in Figs. 1 to 6.

First, a step S710 of forming a touch electrode layer including a touch electrode on one surface of the first substrate is performed. Further, a step S720 of forming an organic light emitting element layer on one side of the second substrate is performed.

The touch electrode layer is formed on one surface of the first substrate (the lower surface of the first substrate in FIG. 5) and is located between the first substrate and the second substrate. The touch electrode layer is formed with a touch sensor and associated wiring for sensing a touch signal input from the outside.

(S730) of attaching the first substrate and the second substrate so that the touch electrode layer is positioned between the first substrate and the second substrate is performed.

Forming a contact hole through the first substrate after the laminating step and forming a connection portion contacting the touch electrode layer through the hole in step S740. The contact hole forming step may be performed through a laser machining process or an etching process. The connecting portion forming step may include depositing a metal connecting portion on the first substrate through the contact hole.

After the formation of the connection part is completed, connecting the circuit board on which the touch driver for controlling the touch electrode is mounted and the connection part (S750) is performed. The circuit board is a printed circuit board (e.g., F-PCB) on which a touch driver circuit is mounted.

At this time, the step of connecting the circuit board and the connection part may be a step of disposing the circuit board on the first flexible board so as to be in contact with the connection part.

Or connecting the connection unit to the circuit board may include forming a pad on the second flexible board to electrically connect the circuit board to the circuit board through a hole on the first flexible board, And forming an electric wiring in contact with the electrode layer so as to extend to and touch the pad portion of the second flexible substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the appended claims. , Separation, substitution, and alteration of the invention will be apparent to those skilled in the art. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents thereof should be construed as falling within the scope of the present invention.

Claims (13)

A touch electrode layer formed on one surface of the first flexible substrate;
An organic light emitting element layer formed on one surface of the second flexible substrate; And
And a touch driver for controlling the touch electrode layer,
And a connection portion connecting the touch electrode layer and the touch driver is formed on a surface opposite to the surface provided with the touch electrode layer. The method according to claim 1,
Wherein the touch electrode layer is provided on an inner surface of the first flexible substrate and the connection portion is connected to the touch electrode layer through a contact hole of the first flexible substrate. 3. The method of claim 2,
Wherein the touch driver is mounted on an external circuit board,
A pad for electrically connecting the external circuit board is disposed on one side of the second flexible board,
And an additional wiring extending from the connection portion to the pad portion. 3. The method of claim 2,
Wherein the touch driver is mounted on an external circuit board,
Wherein the connection portion further comprises a pad portion connected to the external circuit board at an outer surface of the first flexible substrate. The method according to claim 1,
Wherein the organic light emitting element layer and the touch electrode layer face each other with an adhesive layer interposed therebetween. The method according to claim 1,
Wherein the first flexible substrate is a transparent plastic substrate and the second flexible substrate is a colored plastic substrate. A pair of plastic substrates; And
And a touch electrode layer disposed on one surface of the pair of plastic substrates,
Wherein the electric wiring for transmitting the touch input signal sensed from the touch electrode layer to the touch driving circuit is electrically connected to the circuit board on which the touch driving circuit is mounted without passing through the conductive film. 8. The method of claim 7,
Wherein the electrical wiring is electrically connected to the circuit board on the opposite side of the surface of the plastic substrates on which the touch electrode layer is formed. 9. The method of claim 8,
Wherein the electric wiring is formed on a surface opposite to the touch electrode layer and is connected to the circuit board through a hole. 10. The method of claim 9,
Wherein the electric wiring extends to a pad located on a substrate not including the touch electrode layer. Forming a touch electrode layer on one surface of the first flexible substrate;
Forming an organic light emitting element layer on one surface of a second flexible substrate;
Attaching the first flexible substrate and the second flexible substrate so that the touch electrode layer is positioned between the first flexible substrate and the second flexible substrate;
Forming a hole through the first flexible substrate;
Forming a connection portion in contact with the touch electrode layer through the hole; And
Electrically connecting the connection portion and the circuit board on which the touch driver for controlling the touch electrode is mounted; And the second electrode is electrically connected to the second electrode. 12. The method of claim 11,
Wherein the step of connecting the connection portion and the circuit board is a step of disposing the circuit board on the first flexible board so as to be in contact with the connection portion. 12. The method of claim 11,
Wherein the step of connecting the connection portion and the circuit board comprises:
Forming a pad portion electrically connecting the circuit board on the second flexible board,
And forming an electrical wiring on the first flexible substrate to contact the touch electrode layer through the hole so as to extend to and touch the pad portion of the second flexible substrate.

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