KR102241899B1 - 동시적 암시야 및 위상 대비 검사를 위한 시스템 및 방법 - Google Patents

동시적 암시야 및 위상 대비 검사를 위한 시스템 및 방법 Download PDF

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KR102241899B1
KR102241899B1 KR1020177004868A KR20177004868A KR102241899B1 KR 102241899 B1 KR102241899 B1 KR 102241899B1 KR 1020177004868 A KR1020177004868 A KR 1020177004868A KR 20177004868 A KR20177004868 A KR 20177004868A KR 102241899 B1 KR102241899 B1 KR 102241899B1
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signal
dark field
differential interference
illumination
interference contrast
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KR20170033884A (ko
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추안용 후앙
칭 리
도널드 페티본
버즈 그레이브스
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Microscoopes, Condenser (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
KR1020177004868A 2014-07-22 2015-07-21 동시적 암시야 및 위상 대비 검사를 위한 시스템 및 방법 Active KR102241899B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462027393P 2014-07-22 2014-07-22
US62/027,393 2014-07-22
US14/804,296 2015-07-20
US14/804,296 US9726615B2 (en) 2014-07-22 2015-07-20 System and method for simultaneous dark field and phase contrast inspection
PCT/US2015/041409 WO2016014590A1 (en) 2014-07-22 2015-07-21 System and method for simultaneous dark field and phase contrast inspection

Publications (2)

Publication Number Publication Date
KR20170033884A KR20170033884A (ko) 2017-03-27
KR102241899B1 true KR102241899B1 (ko) 2021-04-16

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Country Status (8)

Country Link
US (1) US9726615B2 (https=)
JP (1) JP6807829B2 (https=)
KR (1) KR102241899B1 (https=)
CN (1) CN106575631B (https=)
DE (1) DE112015003394B4 (https=)
SG (1) SG11201610820YA (https=)
TW (1) TWI639822B (https=)
WO (1) WO2016014590A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9726615B2 (en) 2014-07-22 2017-08-08 Kla-Tencor Corporation System and method for simultaneous dark field and phase contrast inspection
TWI606101B (zh) 2016-12-28 2017-11-21 財團法人工業技術研究院 塗佈組合物及其製備方法
US10422984B2 (en) * 2017-05-12 2019-09-24 Applied Materials, Inc. Flexible mode scanning optical microscopy and inspection system
CN108022849B (zh) * 2017-11-30 2020-06-16 上海华力微电子有限公司 一种亮场缺陷检测设备自动优化光强条件的方法及系统
US10845187B2 (en) * 2018-03-02 2020-11-24 Drexel University Multiscale deformation measurements leveraging tailorable and multispectral speckle patterns
US11067389B2 (en) * 2018-03-13 2021-07-20 Kla Corporation Overlay metrology system and method
US10732130B2 (en) * 2018-06-19 2020-08-04 Kla-Tencor Corporation Embedded particle depth binning based on multiple scattering signals
US11017520B2 (en) * 2018-09-04 2021-05-25 Kla Corporation Multi-wavelength interferometry for defect classification
US10705026B2 (en) * 2018-10-26 2020-07-07 Kla Corporation Scanning differential interference contrast in an imaging system design
US10948423B2 (en) * 2019-02-17 2021-03-16 Kla Corporation Sensitive particle detection with spatially-varying polarization rotator and polarizer
CN115380203B (zh) * 2020-02-12 2025-07-22 深圳华大智造科技股份有限公司 光学成像系统及应用所述光学成像系统的生化物质检测系统
WO2023286220A1 (ja) * 2021-07-14 2023-01-19 株式会社日立ハイテク 欠陥検査装置
KR20260004001A (ko) 2024-07-01 2026-01-08 인천대학교 산학협력단 결함검출을 위한 레이저 스패클 제거 고출력 광원시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004156978A (ja) 2002-11-06 2004-06-03 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
US20050254065A1 (en) 2004-05-12 2005-11-17 Stokowski Stanley E Method and apparatus for detecting surface characteristics on a mask blank
US20090180176A1 (en) 2003-02-21 2009-07-16 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
JP2009180561A (ja) 2008-01-29 2009-08-13 Nikon Corp 表面欠陥検査方法及びその装置
JP2010048813A (ja) 2002-03-22 2010-03-04 Applied Materials Israel Ltd 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961142A (ja) * 1982-09-30 1984-04-07 Fujitsu Ltd 欠陥検出装置
US5798829A (en) 1996-03-05 1998-08-25 Kla-Tencor Corporation Single laser bright field and dark field system for detecting anomalies of a sample
US6999183B2 (en) 1998-11-18 2006-02-14 Kla-Tencor Corporation Detection system for nanometer scale topographic measurements of reflective surfaces
US20030215791A1 (en) 2002-05-20 2003-11-20 Applied Spectral Imaging Ltd. Method of and system for multiplexed analysis by spectral imaging
WO2007016682A2 (en) 2005-08-02 2007-02-08 Kla-Tencor Technologies Corporation Systems configured to generate output corresponding to defects on a specimen
US7345754B1 (en) 2005-09-16 2008-03-18 Kla-Tencor Technologies Corp. Fourier filters and wafer inspection systems
WO2008048612A2 (en) 2006-10-17 2008-04-24 Hnuphotonics Miniature microscope camera
US7728969B2 (en) 2006-12-05 2010-06-01 Kla-Tencor Technologies Corp. Methods and systems for identifying defect types on a wafer
JP2008151865A (ja) 2006-12-14 2008-07-03 Olympus Corp 顕微鏡システム
DE102007047935A1 (de) 2007-03-19 2008-09-25 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Inspektion von Defekten am Randbereich eines Wafers und Verwendung der Vorrichtung in einer Inspektionseinrichtung für Wafer
US7782452B2 (en) 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
US20120225475A1 (en) 2010-11-16 2012-09-06 1087 Systems, Inc. Cytometry system with quantum cascade laser source, acoustic detector, and micro-fluidic cell handling system configured for inspection of individual cells
US10048480B2 (en) 2011-01-07 2018-08-14 Zeta Instruments, Inc. 3D microscope including insertable components to provide multiple imaging and measurement capabilities
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
AU2012288992B2 (en) * 2011-07-28 2015-03-12 Paul Scherrer Institut Method for image fusion based on principal component analysis
US8755044B2 (en) 2011-08-15 2014-06-17 Kla-Tencor Corporation Large particle detection for multi-spot surface scanning inspection systems
JP6345125B2 (ja) 2012-03-07 2018-06-20 ケーエルエー−テンカー コーポレイション ウェハおよびレチクル検査システムならびに照明瞳配置を選択するための方法
US9053390B2 (en) 2012-08-14 2015-06-09 Kla-Tencor Corporation Automated inspection scenario generation
JP6124774B2 (ja) * 2013-03-22 2017-05-10 オリンパス株式会社 位相分布計測方法、及び、位相分布計測装置
US9726615B2 (en) 2014-07-22 2017-08-08 Kla-Tencor Corporation System and method for simultaneous dark field and phase contrast inspection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010048813A (ja) 2002-03-22 2010-03-04 Applied Materials Israel Ltd 移動レンズマルチビームスキャナを備えたウェハ欠陥検出システム
JP2004156978A (ja) 2002-11-06 2004-06-03 Hitachi High-Technologies Corp 欠陥検査方法及びその装置
US20090180176A1 (en) 2003-02-21 2009-07-16 Kla-Tencor Corporation Split field inspection system using small catadioptric objectives
US20050254065A1 (en) 2004-05-12 2005-11-17 Stokowski Stanley E Method and apparatus for detecting surface characteristics on a mask blank
JP2009180561A (ja) 2008-01-29 2009-08-13 Nikon Corp 表面欠陥検査方法及びその装置

Also Published As

Publication number Publication date
DE112015003394T5 (de) 2017-03-30
CN106575631B (zh) 2019-02-01
TWI639822B (zh) 2018-11-01
JP2017531162A (ja) 2017-10-19
DE112015003394B4 (de) 2023-04-27
JP6807829B2 (ja) 2021-01-06
TW201617603A (zh) 2016-05-16
KR20170033884A (ko) 2017-03-27
US9726615B2 (en) 2017-08-08
CN106575631A (zh) 2017-04-19
SG11201610820YA (en) 2017-02-27
US20160025645A1 (en) 2016-01-28
WO2016014590A1 (en) 2016-01-28

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