KR102238165B1 - Transparent heater structure and Transparent heater device using the same - Google Patents

Abstract

Embodiments of the present invention are for a heating structure that is flexible and economical, and it is possible to increase the efficiency of heating through a heating structure having a heating pattern that crosses each other, and through fine patterning of a general conductive material, not ITO. By implementing a heating element with secured transparency, it is economical, visibility is improved, and flexibility can be achieved.

Description

Heating structure and heating device including the same {Transparent heater structure and Transparent heater device using the same}

Embodiments of the present invention relate to a heating structure that is economical while securing flexibility.

Various heating structures can be applied to the outside and windows where visibility can be secured to remove condensation or frost.

A typical example of application of such a heating structure is heating glass for automobiles or buildings. Most of the heating glass uses the concept of attaching a heating wire sheet to the glass surface or forming a heating wire directly on the glass surface and then applying electricity to both terminals of the heating wire to generate heat from the heating wire, thereby raising the temperature of the glass surface. to be.

In consideration of the fact that heating glass for automobiles or constructions generates heat smoothly and maintains low resistance and transparency to secure a smooth external view, the existing transparent heating glass uses transparent conductive materials such as ITO and Ag thin films. After forming a transparent surface heating layer by a sputtering process, a method of manufacturing an electrode was used, but the heating glass according to this method had a problem that it was difficult to drive at a low voltage of 40V or less due to high surface resistance. Due to its characteristics, there was a limited problem in realizing a large area.

In the case of a heating structure using ITO, which is used as a heating element for such heating glass, in recent years, due to the lack of supply of indium, which is the main material of ITO, the price increases, resulting in an increase in manufacturing cost, and also lacks flexibility due to the nature of ITO itself. Therefore, there is a problem that is not suitable for structures that require flexibility.

Further, in the case of a heating structure employing carbon nanotubes used as a heating element for heating glass, a nanomaterial dense layer consisting of a structure in which carbon nanotubes are connected to each other, and a terminal formed by being electrically connected to the nanomaterial dense layer. Therefore, there is a problem that the manufacturing process cost tends to be high when mass production of carbon nanotubes, and the technical difficulty of the construction method is high.

Embodiments of the present invention have been devised to solve the above-described problem, and in particular, it is possible to increase the efficiency of heating through a heating structure having a heating pattern that crosses each other, and through fine patterning of a general conductive material, not ITO. By implementing a heating element with secured transparency, it is possible to provide a heating structure that is economical, has improved visibility, and has flexibility.

In order to solve the above-described problem, in an embodiment of the present invention, a plurality of heating patterns on a substrate and at least one of the plurality of heating patterns may provide a heating structure that crosses each other. In this case, the heating structure may further include a polymer pattern provided on the substrate so as not to overlap the heating pattern, and a protective layer filling the heating pattern and the polymer pattern.

According to an embodiment of the present invention, it is possible to increase the efficiency of heating through a heating structure having a heating pattern that crosses each other, and by implementing a heating element having transparency through fine patterning of a general conductive material other than ITO, it is economical and visible. This is improved and there is an effect of providing a heating structure having flexibility.

In particular, in the embodiment of the present invention, a polymer pattern structure adjacent to the heating pattern can be inserted to increase the ductility and stability of the product itself, and the patterning material itself is used in a roll-to-roll production method using photocurable or thermosetting resin. In the case of grafting, mass production can also be improved.

1 is a plan view of a heating structure according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view taken along AA′ of FIG. 1.
3 is a plan view showing an arrangement of a heating pattern of a heating structure according to an embodiment of the present invention.
4A to 4E are schematic plan views of a heating structure according to various modified embodiments of the present invention.

Hereinafter, the configuration and operation according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same components are assigned the same reference regardless of the reference numerals, and redundant descriptions thereof will be omitted. Terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another component.

1 is a plan view of a heating structure according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view of AA′ of FIG. 1, and FIG. 3 is a diagram illustrating an arrangement of a heating pattern of the heating structure according to the embodiment of the present invention of FIG. It is a schematic diagram.

1 to 3, the heating structure according to the embodiment of the present invention may include a substrate 110 and a plurality of heating patterns 130 on the substrate 110, and in particular, the plurality of At least one of the heating patterns 130 may be implemented in a structure that crosses each other. In this case, when the heating structure is used for a purpose such as a transparent heater, electrode patterns 120a and 120b for supplying power to the heating pattern 130 may be further included, and the electrode pattern and the heating pattern are electrically It can be implemented so that it can be connected to.

2 and 3, a characteristic part of the heating structure according to the embodiment of the present invention is implemented as a plurality of patterns in which the heating pattern 130 has a directionality, and at least one or more of the plurality of patterns It can be implemented with this intersecting structure. Here, the'intersecting' structure means forming a structure in which straight lines, curves, or closed curve patterns composed of straight lines or curves meet, and the shapes of these patterns may also be regular or irregular patterns.

As the regular pattern, a pattern type in the art, such as a mesh pattern, may be used. The mesh pattern may include a regular polygonal pattern including one or more of a triangle, a square, a pentagon, a hexagon, and an octagon.

In addition, the irregular pattern is that the shape of the random pattern is randomly arranged, and may include a structure of a closed curve having various structures. The irregular pattern includes a border structure of closed figures connected in succession, and no closed figures of the same shape exist within the irregular random unit area (1cm × 1cm), and the number of vertices of the closed figures is, It may be different from the number of vertices of the same number of squares as the closed figures.

More specifically, the number of vertices of the closed figures may be greater when compared to the number of vertices of the same number of squares as the closed figures, and may be 1.9 to 2.1 times more, but is not limited thereto. The closed figures are connected to each other in succession. For example, when the closed figures are polygonal, adjacent closed figures may share at least one side.

In addition, the irregular pattern includes a border structure of closed figures connected in succession, and the irregular pattern does not have a closed figure of the same shape within an arbitrary unit area (1cm × 1cm), and the vertices of the closed figures The number may be different from the number of vertices of a polygon formed by connecting the shortest distance between the centers of gravity of each of the closed figures. More specifically, the number of vertices of the closed figures may be greater when compared to the number of vertices of a polygon formed by connecting the shortest distance between the centers of gravity of each of the closed figures, and may be 1.9 to 2.1 times more. However, it is not limited thereto. In the present invention, the vertex is defined to mean a point where the lines constituting the edges of the closed figures of the conductive pattern intersect each other. The irregular pattern may be in the form of a frame structure of closed figures formed by arranging random points in a unit cell arranged regularly and then connecting each point to a point closest to the distance from other points. have.

As an example of such a structure of'intersection', a mesh-like structure with a structure in which the arrangement directions of the heating patterns are overlapped with a certain direction will be described. As shown in the structure of FIG. 3, the width direction of the substrate 110 The first heating pattern 131 arranged in one direction and the second heating pattern 132 arranged in the second direction, which is the length direction of the substrate 110, are intersected in a mesh-like structure. .

In this case, in the structure of FIG. 3, the first heating pattern and the second heating pattern implement a mutually crossing structure, but are arranged in a structure in which the crossing angle is 90 degrees, but this is an example, and the crossing angle is essentially orthogonal. Of course, it is also possible to have a structure that does not. Such a cross structure can increase the heat generation rate in a certain area of the substrate, and can be implemented by patterning various conductive materials other than ITO to have transparency through a vacuum deposition method.

That is, the substrate 110 in the embodiment of the present invention may be a substrate or sheet member made of a material having a certain light transmittance, that is, transparency, and a conductive heating material is used to secure fairness and flexibility while improving visibility. By applying a conductive material, it is possible to pattern in a thin film type.

To this end, the material that can be applied to the heating pattern is from the group consisting of silver, copper, nickel, tin, indium, titanium, palladium, aluminum, chromium, silicon, tungsten, vanadium, zinc, tantalum, gold, platinum, and cobalt. A single layer or laminate of at least one metal selected, or a single layer or laminate of an alloy thin film of one metal may be applied. Alternatively, the heating pattern is at least 1 selected from the group consisting of silver, copper, nickel, tin, indium, titanium, palladium, aluminum, chromium, silicon, tungsten, vanadium, zinc, tantalum, gold, platinum, and cobalt. It may be implemented as a single layer or a laminate of a mixture thin film containing more than one kind of metal. In the case of patterning such a metal-based material through vacuum evaporation, processability becomes easy and thin film can be formed, so that it is possible to implement an electrode close to transparency.

In addition, on the heating pattern, a single layer comprising at least one material selected from the group consisting of metal oxides, metal nitrides, metal oxynitrides, metal hydrides, and metal carbides, or an antireflection layer consisting of two or more layers is further included. It is also possible to do it. When such an anti-reflection layer is formed, it is possible to easily adjust the heat generation characteristics, and increase reliability by adjusting the desired resistance and oxidation characteristics. The thickness of the protective layer may be formed in the range of 0.05 um to 0.2 um, and when the thickness of the protective layer is less than 0.05 um, it is difficult to control the oxidation characteristics and it is difficult to form a resistance range for desired heat generation. In this case, the width of the resistance increases, thereby impairing the heat generation characteristic, and it acts as a factor that makes it difficult to secure the visibility and flexibility required for the heating structure.

The substrate 110 in the embodiment of the present invention may be made of a material having light transmittance, that is, transparency, as described above. In this case, transparency is a concept including a material having a light transmittance of 1 to 99%, and for example, a material including any one of PI, PET, PC, PE, PC, and PVA may be applied.

In addition, as shown in the drawing of FIG. 2, the heating structure according to the embodiment of the present invention may further include a polymer pattern 140 adjacent to the heating pattern 130. Various materials having a polymer chain may be applied to the polymer pattern 140. For example, by applying a photocurable resin or a thermosetting resin so that it can be formed in a portion adjacent to the heating pattern 130, while securing the overall flexibility of the heating structure, the strength of the entire structure can be strengthened, and the heating pattern can be protected. , It performs a function of efficiently diffusing the heat generated from the heating pattern to the surface of the substrate 110.

When explaining an embodiment of the structure of the heating pattern and the polymer pattern as an embodiment of the present invention shown in Figs. 2 and 3, the polymer pattern 140 is disposed on the substrate so as not to overlap with the heating pattern 130. I can.

In this case, the heating pattern 130 includes a first heating pattern 131 disposed in a first direction that is a width direction of the substrate, and a second heating pattern 132 disposed in a second direction that is a length direction of the substrate. ). Of course, in this case, as shown in FIG. 3, each heating pattern may be electrically connected to the external electrodes 120a and 120b. As shown in FIG. 3, in the arrangement structure of the heating pattern, a structure in which the arrangement axis of the first heating pattern and the arrangement axis of the second heating pattern are substantially orthogonal is described as an example. Is not limited thereto, and may be implemented as a mesh-like structure that crosses by being transformed into various angles and shapes.

Further, the polymer pattern 140 may be disposed at a location adjacent to the heating pattern 130 having a structure that intersects with each other. In this case, the concept of'adjacent' is a concept that includes all configurations that can be placed in close contact with the outer surface of the heating pattern or spaced apart at a predetermined interval. As described above, the polymer pattern 140 can enhance the strength of the entire structure while securing the flexibility of the entire heating structure, protect the heating pattern, and efficiently remove heat generated from the heating pattern. It makes it possible to implement a function that can diffuse to the surface.

In addition, the line width of the first heating pattern or the second heating pattern may be formed to satisfy a range of 0.2 μm to 10 μm. If it is out of the above range, it is difficult to meet the resistance value for realizing the characteristic of heat generation at a line width of less than 0.2 μm, and a problem in that it is difficult to secure the visibility and flexibility required for the heating structure in the range exceeding 10 μm. . To this end, the height (thickness in the upper direction from the substrate surface) of the first heating pattern or the second heating pattern may be formed in a range of 0.01 μm to 2 μm.

Further, it has been illustrated that the heating pattern in the structures of FIGS. 2 and 3 is formed to be disposed on the substrate, but here, in addition to being disposed on the surface of the substrate, the term'arrangement on the substrate' It is a concept including a structure in which a pattern is implemented and then a material of a heating pattern is filled therein. That is, it is possible to implement a structure in which part or all of the heating pattern is embedded in the surface of the substrate. This buried structure has the advantage of increasing the flexibility while being able to further reduce the thickness of the heating structure.

4A to 4E illustrate various modified embodiments of the heating pattern and the polymer pattern according to the embodiment of the present invention.

The structure of FIG. 4A is an illustration of the arrangement structure of the first heating pattern 131 and the second heating pattern 132 intersecting with each other described above in FIG. 3, and this crossing structure is a structure that crosses at various angles in addition to being orthogonal. Including is the same as described above.

Referring to the structure of FIG. 4B, in addition to the structure in which the heating patterns 130 simply intersect in the embodiment of the present invention, a structure that is transformed into the shape of the first heating pattern and the second heating pattern in the form of a line (hereinafter , Called'expansion pattern') can be implemented. As an example, as shown in FIG. 4B, the first heating pattern 131 or the second heating pattern 132 may each include an expansion pattern 133 in the center of which the surface of the substrate is exposed. . Of course, in the structure of FIG. 4B, it is illustrated that the expansion pattern 133 is disposed at the intersection of the first heating pattern and the second heating pattern, but is not limited thereto, and various expansion patterns as shown in FIG. 4E Can be implemented, and the structure that intersects with each other can be diversified. The expansion pattern 133 has an advantage of increasing the heating surface area of a simple linear heating pattern, and has a feature that does not impede securing flexibility by implementing a structure in which the center portion is empty. As shown in FIG. 4B, the shape of the planar cross-section of the expansion pattern is a circular shape, but is not limited thereto and may be implemented in the shape of an ellipse, a semicircle, and various shapes having a curvature.

Furthermore, the above-described expansion pattern 133 may be implemented as a polygonal figure having a structure in which an apex, that is, a vertex, is implemented at a certain location, as shown in FIGS. 4C and 4D.

The line width of the expansion pattern 133 described above may be implemented to have the same line width as the first heating pattern 131 and the second heating pattern 132 described above, but in order to secure visibility and flexibility, the first heating pattern described above It may be implemented to be smaller than the line width of the heating pattern 131 and the second heating pattern 132.

In the structure shown in FIG. 4E, the expansion pattern 133 is implemented in the above-described first heating pattern 131 and the second heating pattern 132, respectively, and the expansion pattern 133 is the first heating pattern 131 described above. ) And the second heating pattern 132 to be disposed in a region other than the intersection of the second heating pattern 132.

Of course, in the structure of FIGS. 4A to 4E, the polymer pattern 140 may be disposed in a portion 142 adjacent to the first heating pattern 131 and the second heating pattern 132 described above, and further, the expansion pattern It may be implemented in the exposed portion 141 of the substrate at the center of 133.

Furthermore, the heating structure according to the embodiment of the present invention may further include a protective layer 150 filling the heating pattern 130 and the polymer pattern 140 as shown in FIG. 2. . The protective layer 150 is laminated on the heating pattern 130 and the polymer pattern 140 using a resin (polymer material) having transparency, and the heating pattern 130 and the polymer pattern 140 If there is a spaced part in, it can be implemented as a structure to fill the spaced part. As a material for the protective layer, a resin having the characteristics of a polymer, film, or adhesive material may be used.

The heating structure according to the embodiment of the present invention described above can be applied to various heating devices by combining it with a power supply module as described above. For example, it can be applied to various structures such as front and rear for vehicles, or glass for lamps, glass for construction, ships, and aircraft. This is due to the structural and material characteristics that the heating structure according to the embodiment of the present invention is realized to be mass-produced at low cost, and in particular, it has flexibility, so that it can be applied to various places and shapes. .

In the detailed description of the present invention as described above, specific embodiments have been described. However, various modifications are possible without departing from the scope of the present invention. The technical idea of the present invention is limited to the above-described embodiments of the present invention and should not be defined, and should not be defined by the claims as well as the claims and equivalents.

110: substrate
120a, 120b: electrode
130: heating pattern
131: first heating pattern
132: second heating pattern
133: expansion pattern
140: polymer pattern

Claims (15)

materials;
A plurality of heating patterns disposed in direct contact with one surface of the substrate;
An electrode pattern electrically connected to the heating pattern and disposed in direct contact with one surface of the substrate;
A polymer pattern disposed in direct contact on one surface of the substrate so as not to overlap with the heating pattern; And
And a protective layer filling the plurality of heating patterns, the electrode pattern, and the polymer pattern,
At least one of the plurality of heating patterns crosses,
The heating pattern,
A first heating pattern disposed in a first direction, which is a width direction of the substrate,
And a second heating pattern disposed in a second direction, which is a longitudinal direction of the substrate,
The arrangement axis of the first heating pattern and the arrangement axis of the second heating pattern are orthogonal,
The above description,
Including any one of light-transmitting PI, PET, PE, PC, and PVA,
The heating pattern is at least one metal selected from the group consisting of silver, copper, nickel, tin, indium, titanium, palladium, aluminum, chromium, silicon, tungsten, vanadium, zinc, tantalum, gold, platinum, and cobalt Including,
The heating pattern is disposed adjacent to the polymer pattern,
At least one side surface of the heating pattern includes contacting the polymer pattern,
The polymer pattern comprises a material different from the protective layer, the heating structure. The method according to claim 1,
The first heating pattern or the second heating pattern further includes an expansion pattern,
The expansion pattern is a structure in which the shape of the first heating pattern or the second heating pattern of a straight line is deformed. The method according to claim 2,
A heating structure in which a region in which the surface of the substrate is exposed is present in the center of the expansion pattern. The method of claim 3,
The expansion pattern,
A heating structure disposed at an intersection of the first heating pattern and the second heating pattern. The method according to claim 2,
A heating structure in which the shape of the plane of the expansion pattern has a curvature. The method according to claim 1,
The protective layer is formed of any one of a polymer, a film, and a resin,
The polymer pattern is formed of a photocurable resin or a thermosetting resin, the heating structure. The method according to claim 1,
A heating structure in which the height of the polymer pattern is higher than the height of the heating pattern. The method according to claim 1,
The heating pattern is a single layer or stacked body of the metal, or a single layer or stacked body of an alloy thin film of one type of metal. The method according to claim 1,
The heating pattern,
A heating structure further comprising a single layer of at least one material selected from the group consisting of metal oxides, metal nitrides, metal oxynitrides, metal hydrides, and metal carbides, or an antireflection layer consisting of two or more layers. delete delete delete delete delete delete

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