CN103377747B - Conductive film and preparation method thereof - Google Patents
Conductive film and preparation method thereof Download PDFInfo
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- CN103377747B CN103377747B CN201210116181.5A CN201210116181A CN103377747B CN 103377747 B CN103377747 B CN 103377747B CN 201210116181 A CN201210116181 A CN 201210116181A CN 103377747 B CN103377747 B CN 103377747B
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- wire netting
- hole
- conductive film
- metal
- plastic film
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Abstract
A kind of conductive film, including plastic film substrate and the double layer of metal net that is layed on described plastic film substrate, described plastic film substrate has first surface and the second surface relative with described first surface, wherein layer of metal net laying is located at the first surface of described plastic film substrate, another layer of wire netting is layed in the second surface of described plastic film substrate, and described wire netting has the hole of multiple array arrangement.The cost of above-mentioned conductive film is relatively low.The present invention also provides for the preparation method of a kind of conductive film.
Description
Technical field
The present invention relates to a kind of conductive film and preparation method thereof.
Background technology
The advantages in the majority such as capacitance touch screen is high with its transparency, multiple point touching, life-span length, in recent years, more come
More favored by market.At present, generally use vacuum evaporation or magnetron sputtering mode by electrically conducting transparent material
Material tin indium oxide (ITO) is coated on pet substrate formation conductive film to be applied to capacitance touch screen.
But, phosphide element is a kind of rare earth element, and in the Nature, reserves are smaller, and price comparison is expensive,
So that conductive film is relatively costly.
Summary of the invention
Based on this, it is necessary to provide a kind of lower-cost conductive film and preparation method thereof.
A kind of conductive film includes plastic film substrate and is layed in the double layer of metal on described plastic film substrate
Net, described plastic film substrate has first surface and the second surface relative with described first surface, wherein
Layer of metal net laying is located at the first surface of described plastic film substrate, another layer of wire netting be layed in described in mould
The second surface of material film substrate, described wire netting has the hole of multiple array arrangement.
Wherein in an embodiment, described hole is square or rhombus, described wire netting include multiple mutually
The first parallel metal wire and multiple the second metal wire being parallel to each other, described first metal wire and described second
Metal wire is crossed to form described hole.
Wherein in an embodiment, the hole of described wire netting is the regular hexagon of arrangement in honeycomb.
Wherein in an embodiment, the hole of described wire netting is triangle, and described wire netting includes multiple
The first metal wire being parallel to each other, multiple the second metal wire being parallel to each other and multiple the 3rd gold medal being parallel to each other
Belong to line, the second metal wire and the first metal wire to tilt to be crossed to form the diamond hole of multiple array arrangement, the 3rd gold medal
Belong to line to intersect with the two of diamond hole relative end points thus by the hole of the diamond hole segmentation described triangle of formation
Hole.
Wherein in an embodiment, the surface of described wire netting is formed with antioxidation coating, described antioxidation
The material of coating is gold, platinum, nickel or nickel billon.
The preparation method of a kind of conductive film, comprises the following steps:
First surface and the second surface relative with described first surface at plastic film substrate are respectively formed on gold
Belong to layer；And
Utilize exposure imaging method that described metal level processes grid and be layed in described plastic sheeting base to be formed
The described first surface of material and the wire netting of described second surface, described wire netting has multiple array arrangement
Hole.
Wherein in an embodiment, the surface of described wire netting is formed with antioxidation coating, described antioxidation
The material of coating is gold, platinum, nickel or nickel billon.
Wherein in an embodiment, the surface of described plastic film substrate also formed have anti-dazzle, hardening,
Anti-reflection or the functional layer of atomizing functions, described metal level is formed at described functional layer surface.
Wherein in an embodiment, described hole is square or rhombus, described wire netting include multiple mutually
The first parallel metal wire and multiple the second metal wire being parallel to each other, described first metal wire and described second
Metal wire is crossed to form described hole.
Wherein in an embodiment, the hole of described wire netting is the regular hexagon of arrangement in honeycomb.
Above-mentioned conductive film and preparation method thereof, by laying wire netting on plastic film substrate surface, uses
Time can as required by wire netting exposure imaging again thus on plastic film substrate formed pattern inductive layer
And be applied in touch screen, conductive film avoids using tin indium oxide, thus the cost of conductive film is relatively low.
Accompanying drawing explanation
Fig. 1 is the structural representation of the conductive film of an embodiment；
Fig. 2 is the structural representation of the wire netting of conductive film in Fig. 1；
Fig. 3 is the structural representation of the wire netting of conductive film in another embodiment；
Fig. 4 is the structural representation of the wire netting of conductive film in another embodiment；
Fig. 5 is the structural representation of the wire netting of conductive film in another embodiment；
Fig. 6 is the flow chart of the preparation method of the conductive film of an embodiment.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.
Accompanying drawing gives the first-selected embodiment of the present invention.But, the present invention can come real in many different forms
Existing, however it is not limited to embodiment described herein.On the contrary, providing the purpose of these embodiments is to make this
Disclosure of the invention content is more thorough comprehensively.
It should be noted that when element is referred to as " being fixedly arranged on " another element, and it can be directly at another
On individual element or element placed in the middle can also be there is.When an element is considered as " connection " another yuan
Part, it can be directly to another element or may be simultaneously present centering elements.Used herein
Term " vertical ", " level ", "left", "right" and similar statement simply to illustrate that mesh
's.
Unless otherwise defined, all of technology used herein and scientific terminology and the technology belonging to the present invention
The implication that the technical staff in field is generally understood that is identical.The art used the most in the description of the invention
Language is intended merely to describe the purpose of specific embodiment, it is not intended that in limiting the present invention.Used herein
Term " and/or " include the arbitrary and all of combination of one or more relevant Listed Items.
Referring to Fig. 1, the conductive film 10 of an embodiment includes plastic film substrate 110 and wire netting 120.
Plastic film substrate 110 generally lamellar.The material of plastic film substrate 110 is poly terephthalic acid
Class plastics (PET) or Merlon (PC).Plastic film substrate 110 has first surface 112 and with
The second surface 114 that one surface 112 is relative.The first surface 112 of plastic film substrate 110 and second surface
Be also formed with having anti-dazzle, hardening at least one in 114, (figure is not for the functional layer of anti-reflection or atomizing functions
Show).
Wherein, there is the anti-dazzle or functional layer of atomizing functions, by the applying coating with anti-dazzle or atomizing functions
Formed, inside coating, have metal oxide particle；There is the functional layer of hardening function by having hardening function
High-molecular coating coating is formed；Have the functional layer of anti-reflection function be titanium dioxide coating, Afluon (Asta) coating or
Calcium fluoride coating.
Wire netting 120 has two-layer, and wherein layer of metal net 120 is layed in the of plastic film substrate 110
One surface 112, another layer of wire netting 120 is layed in the second surface 114 of plastic film substrate 110.Need
Illustrating, when the surface of plastic film substrate 110 has functional layer, wire netting 120 is formed at function
The surface of layer.
Please refer to Fig. 2, wire netting 120 has the hole 121 of multiple array arrangement.In present embodiment,
The form and dimension of multiple holes 121 is the most identical.In present embodiment, hole 121 is square, multiple
Hole 121 array arrangement.Wire netting 120 includes multiple the first metal wires 123 being parallel to each other and multiple phase
The second the most parallel metal wire 125, the first metal wire 123 and the second metal wire 125 intersect vertically formation multiple
The foursquare hole 321 of array arrangement.
In present embodiment, the material of wire netting 120 is copper, silver, molybdenum aluminium molybdenum alloys or corronil.For
Prevent the wire netting 120 from aoxidizing, it is also possible to form anti oxidation layer, anti oxidation layer on the surface of wire netting 120
Material be the inert metals such as gold, platinum, nickel or nickel billon.
The thickness of wire netting 120 is more than or equal to 45nm and less than or equal to 40000nm.
Netting twine (i.e. first metal wire 123 and the second metal wire 125) width D of wire netting 120 is more than
In 45nm and less than or equal to 40000nm.It should be noted that the width D pair of the netting twine of wire netting 120
The resolution of touch screen 10 can have an impact, and when the netting twine width D of wire netting 120 is excessive, naked eyes can be seen
To netting twine, thus the resolution of touch screen 10 can be affected.Preferably, the netting twine width of wire netting 120 is more than
Equal to 45nm and less than or equal to 5000nm.
In order to ensure the touch screen 10 sensitivity to signal, then the aperture opening ratio K of wire netting 120 and conductive film
Transmitance T of 101And transmitance T of plastic film substrate2Between there is following relation: T1=T2*K.By
This can calculate the opening of the wire netting 120 meeting condition according to the design optical transmittance of conductive film 10
Rate.
Illustrate as a example by the hole 121 of wire netting 120 is as square below.The netting twine of wire netting 120
Width is D, and the A/F of the hole 121 of wire netting 120 is L.Wire netting 120 is considered as by multiple
The length of side is the structure cell composition of D+L, and the area of the aperture opening ratio K=hole 121 of wire netting 120 is divided by structure cell
Area.The most in the present embodiment, K=L2/(L+D)2。
In above-mentioned conductive film 10, lay wire netting 120 on plastic film substrate 110 surface, can during use
With as required by wire netting exposure imaging again thus on plastic film substrate 110 formed pattern inductive layer
And be applied in touch screen, conductive film 10 avoids using tin indium oxide, thus the cost of conductive film 10
Relatively low；Meanwhile, the transmitance of wire netting is higher, and the pliability of conductive film 10 is preferable；Conductive film 10
Square resistance relatively low, 1 ohm/ can be reached；The transmitance of conductive film 10 can be by controlling metal
The aperture opening ratio of net 120 and the transmitance of plastic film substrate 110 control, the most flexibly.
It should be noted that the hole 121 of wire netting 120 is not limited to the square shown in Fig. 2, it is possible to
For polygon.
Referring to Fig. 3, the hole 321 of the wire netting 320 of another embodiment is the rhombus of array arrangement.Gold
Belong to net 320 and include multiple the first metal wire 323 being parallel to each other and multiple the second metal wire being parallel to each other
325, the first metal wire 323 intersects with the second metal wire 325 and the first metal wire 323 and the second metal wire 325
It is mutually inclined the hole 321 of the rhombus forming multiple array arrangements.
Referring to Fig. 4, the hole 421 of the wire netting 420 of another embodiment is the triangle of array arrangement.
Wire netting 420 include multiple be parallel to each other the first metal wire 423, multiple the second metal wire being parallel to each other
425 and multiple the 3rd metal wire 427 being parallel to each other, the second metal wire 425 tilts with the first metal wire 423
It is crossed to form the diamond hole of multiple array arrangement, the 3rd metal wire 427 and the two of diamond hole relative end points
Intersect thus diamond hole is divided into the hole 421 of the triangle of array distribution.
Referring to Fig. 5, the hole 521 of the wire netting 520 of another embodiment is positive six arranged in honeycomb
Limit shape.
Please refer to Fig. 1, Fig. 2 and Fig. 6, the preparation method of above-mentioned conductive film 10, including following step
Rapid:
Step S101, at the first surface 112 of plastic film substrate 110 and relative with first surface 112
Second surface 114 is respectively formed on metal level.
The material of plastic film substrate 110 is poly terephthalic acid class plastics (PET) or Merlon (PC).
It is also formed with at least one in the first surface 112 of plastic film substrate 110 and second surface 114 having
Anti-dazzle, hardening, the anti-reflection or functional layer (not shown) of atomizing functions.
Wherein, there is the anti-dazzle or functional layer of atomizing functions, by the applying coating with anti-dazzle or atomizing functions
Formed, inside coating, have metal oxide particle；There is the functional layer of hardening function by having hardening function
High-molecular coating coating is formed；The functional layer with anti-reflection function is the dioxy formed by evaporation or magnetron sputtering
Change titanium coating, Afluon (Asta) coating or calcium fluoride coating.
Metal level has two-layer, and wherein layer of metal layer is layed in the first surface 112 of plastic film substrate 110,
Another layer of metal level is layed in the second surface 114 of plastic film substrate 110.In present embodiment, metal level
Formed by vacuum evaporation, chemical gaseous phase deposition or collosol and gel.The material of metal level is copper, silver, molybdenum aluminum molybdenum
Alloy or corronil.It should be noted that when the first surface 112 and second of plastic film substrate 110
When being formed with functional layer on surface 114, metal level is formed at the surface of functional layer.The thickness of metal level is more than
Equal to 45nm and less than or equal to 40000nm.
In order to prevent metal layer, it is also possible to the surface vacuum at metal level is deposited with or magnetron sputtering is formed anti-
Oxide layer, the material of anti oxidation layer is the inert metals such as gold, platinum, nickel or nickel billon.
Step S102, utilize exposure imaging method metal level is processed grid with formed wire netting 120 with shape
Become to be layed in the first surface 112 of plastic film substrate 110 and the wire netting 120 of second surface 114, metal
Net 120 has the hole 121 of multiple array arrangement.
In present embodiment, the form and dimension of multiple holes 121 is the most identical.The hole of wire netting 120 is
The square of array arrangement, rhombus, triangle or regular hexagon.
The netting twine width D of wire netting 120 is more than or equal to 45nm and less than or equal to 40000nm.Need explanation
, the resolution of touch screen 10 can be had an impact, work as wire netting by the width D of the netting twine of wire netting 120
When the netting twine width D of 120 is excessive, naked eyes are it can be seen that netting twine, thus can affect the resolution of touch screen 10.
Preferably, the netting twine width of wire netting 120 is more than or equal to 45nm and less than or equal to 5000nm.
The aperture opening ratio K of wire netting 120 and transmitance T of conductive film 101And plastic film substrate 110
Transmitance T2Between there is following relation: K=T1/T2。
Wire netting 120 laid by above-mentioned conductive film 10 on plastic film substrate 110 surface, can root during use
By wire netting 120 exposure imaging again thus on plastic film substrate 110, pattern inductive layer is formed according to needs
And be applied in touch screen, conductive film 10 avoids using tin indium oxide, thus the cost of conductive film 10
Relatively low, and wire netting 120 can be prepared by the method for exposure imaging, technique is simple, and efficiency is higher.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed,
But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area
Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and
Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended
Claim is as the criterion.
Claims (7)
1. a conductive film, including plastic film substrate, it is characterised in that described conductive film also includes
The double layer of metal net being layed on described plastic film substrate, described plastic film substrate have first surface and
The second surface relative with described first surface, wherein layer of metal net laying is located at described plastic film substrate
First surface, another layer of wire netting is layed in the second surface of described plastic film substrate, described expanded metal
There is the hole of multiple array arrangement；The aperture opening ratio K of described wire netting and transmitance T of described conductive film1With
And transmitance T of described plastic film substrate2Between there is following relation: T1=T2*K；
The surface of described wire netting is formed with antioxidation coating, the material of described antioxidation coating be gold, platinum,
Nickel or nickel billon；
The surface of described plastic film substrate also forms the functional layer with anti-reflection function, and described wire netting is formed
In described functional layer surface, the functional layer with anti-reflection function is Afluon (Asta) coating or calcium fluoride coating.
Conductive film the most according to claim 1, it is characterised in that described hole is square or rhombus,
Described wire netting includes multiple the first metal wire being parallel to each other and multiple the second metal wire being parallel to each other, institute
State the first metal wire and be crossed to form described hole with described second metal wire.
Conductive film the most according to claim 1, it is characterised in that the hole of described wire netting be in
The regular hexagon of honeycomb arrangement.
Conductive film the most according to claim 1, it is characterised in that the hole of described wire netting is three
Dihedral, described wire netting include multiple be parallel to each other the first metal wire, multiple the second metal being parallel to each other
Line and multiple the 3rd metal wire being parallel to each other, the second metal wire and the first metal wire tilt to be crossed to form multiple
The diamond hole of array arrangement, the 3rd metal wire intersects thus by diamond hole with the two of diamond hole relative end points
Segmentation forms the hole of described triangle.
5. the preparation method of a conductive film, it is characterised in that comprise the following steps:
First surface and the second surface relative with described first surface at plastic film substrate are respectively formed on gold
Belong to layer；And
Utilize exposure imaging method that described metal level processes grid and be layed in described plastic sheeting base to be formed
The described first surface of material and the wire netting of described second surface, described wire netting has multiple array arrangement
Hole, the aperture opening ratio K of wire netting and transmitance T of conductive film1And the transmitance of plastic film substrate
T2Between there is following relation: K=T1/T2,
The surface of described wire netting is formed with antioxidation coating, the material of described antioxidation coating be gold, platinum,
Nickel or nickel billon, the surface of described plastic film substrate also forms the functional layer with anti-reflection function, described
Metal level is formed at described functional layer surface, has the functional layer of anti-reflection function for by evaporation or magnetron sputtering shape
The Afluon (Asta) coating become or calcium fluoride coating.
The preparation method of conductive film the most according to claim 5, it is characterised in that described hole is
Square or rhombus, described wire netting include multiple the first metal wire being parallel to each other and multiple be parallel to each other
Two metal wires, described first metal wire and described second metal wire are crossed to form described hole.
The preparation method of conductive film the most according to claim 5, it is characterised in that described wire netting
Hole be in honeycomb arrangement regular hexagon.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210116181.5A CN103377747B (en) | 2012-04-19 | 2012-04-19 | Conductive film and preparation method thereof |
| JP2014510654A JP5701450B2 (en) | 2012-04-19 | 2012-12-21 | Conductive component and preparation method thereof |
| PCT/CN2012/087198 WO2013155855A1 (en) | 2012-04-19 | 2012-12-21 | Electrically conductive component and manufacturing method therefor |
| US14/000,157 US20140054076A1 (en) | 2012-04-19 | 2012-12-21 | Conductive component and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210116181.5A CN103377747B (en) | 2012-04-19 | 2012-04-19 | Conductive film and preparation method thereof |
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| Publication Number | Publication Date |
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| CN103377747A CN103377747A (en) | 2013-10-30 |
| CN103377747B true CN103377747B (en) | 2016-08-24 |
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| CN201210116181.5A Active CN103377747B (en) | 2012-04-19 | 2012-04-19 | Conductive film and preparation method thereof |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105446559B (en) * | 2014-08-27 | 2019-06-28 | 欧浦登（顺昌）光学有限公司 | A kind of capacitive touch screen and manufacturing method of single-layer double-side conductor wire electrode film |
| CN109468612A (en) * | 2019-01-07 | 2019-03-15 | 中国科学院兰州化学物理研究所 | Mechanical toughening carbon-based solid composite lubricating film and its preparation method and application |
| CN110597422B (en) * | 2019-09-02 | 2023-01-06 | 海宁光圣晶体材料有限公司 | Aluminum metal grid capacitor touch film and manufacturing method thereof |
| CN112736403B (en) * | 2020-12-22 | 2023-01-03 | 上海卫星工程研究所 | Deployable double-layer hybrid spatial planar antenna |
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| CN1653561A (en) * | 2002-05-23 | 2005-08-10 | 日本油脂株式会社 | Transparent conductive laminate film, touch panel having this transparent conductive laminate film, and production method for this transparent conductive laminate film |
| CN101276079A (en) * | 2007-03-28 | 2008-10-01 | C.R.F.阿西安尼顾问公司 | Method for obtaining a transparent conductive film |
| CN101604634A (en) * | 2008-06-13 | 2009-12-16 | 旭德科技股份有限公司 | The manufacture method of electronic component support plate |
| CN202632793U (en) * | 2012-04-19 | 2012-12-26 | 深圳欧菲光科技股份有限公司 | Conductive film |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02160310A (en) * | 1988-12-12 | 1990-06-20 | Nitto Denko Corp | Transparent conductive film |
| US8921726B2 (en) * | 2009-02-06 | 2014-12-30 | Lg Chem, Ltd. | Touch screen and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1653561A (en) * | 2002-05-23 | 2005-08-10 | 日本油脂株式会社 | Transparent conductive laminate film, touch panel having this transparent conductive laminate film, and production method for this transparent conductive laminate film |
| CN101276079A (en) * | 2007-03-28 | 2008-10-01 | C.R.F.阿西安尼顾问公司 | Method for obtaining a transparent conductive film |
| CN101604634A (en) * | 2008-06-13 | 2009-12-16 | 旭德科技股份有限公司 | The manufacture method of electronic component support plate |
| CN202632793U (en) * | 2012-04-19 | 2012-12-26 | 深圳欧菲光科技股份有限公司 | Conductive film |
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