KR102232495B1 - 기판 건조 챔버 - Google Patents

기판 건조 챔버 Download PDF

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Publication number
KR102232495B1
KR102232495B1 KR1020190031178A KR20190031178A KR102232495B1 KR 102232495 B1 KR102232495 B1 KR 102232495B1 KR 1020190031178 A KR1020190031178 A KR 1020190031178A KR 20190031178 A KR20190031178 A KR 20190031178A KR 102232495 B1 KR102232495 B1 KR 102232495B1
Authority
KR
South Korea
Prior art keywords
substrate
drying
supercritical fluid
lower housing
supply
Prior art date
Application number
KR1020190031178A
Other languages
English (en)
Korean (ko)
Other versions
KR20200111468A (ko
Inventor
신희용
윤병문
Original Assignee
무진전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 무진전자 주식회사 filed Critical 무진전자 주식회사
Priority to KR1020190031178A priority Critical patent/KR102232495B1/ko
Priority to PCT/KR2020/001764 priority patent/WO2020189892A1/ko
Priority to TW109108914A priority patent/TWI725779B/zh
Publication of KR20200111468A publication Critical patent/KR20200111468A/ko
Application granted granted Critical
Publication of KR102232495B1 publication Critical patent/KR102232495B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
KR1020190031178A 2019-03-19 2019-03-19 기판 건조 챔버 KR102232495B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020190031178A KR102232495B1 (ko) 2019-03-19 2019-03-19 기판 건조 챔버
PCT/KR2020/001764 WO2020189892A1 (ko) 2019-03-19 2020-02-07 기판 건조 챔버
TW109108914A TWI725779B (zh) 2019-03-19 2020-03-18 基板乾燥腔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020190031178A KR102232495B1 (ko) 2019-03-19 2019-03-19 기판 건조 챔버

Publications (2)

Publication Number Publication Date
KR20200111468A KR20200111468A (ko) 2020-09-29
KR102232495B1 true KR102232495B1 (ko) 2021-03-26

Family

ID=72520342

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190031178A KR102232495B1 (ko) 2019-03-19 2019-03-19 기판 건조 챔버

Country Status (3)

Country Link
KR (1) KR102232495B1 (zh)
TW (1) TWI725779B (zh)
WO (1) WO2020189892A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230405642A1 (en) * 2022-06-14 2023-12-21 Tokyo Electron Limited Method and single wafer processing system for processing of semiconductor wafers

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001028368A (ja) * 1999-05-12 2001-01-30 Kobe Steel Ltd 成膜方法及び成膜装置
US6782900B2 (en) * 2001-09-13 2004-08-31 Micell Technologies, Inc. Methods and apparatus for cleaning and/or treating a substrate using CO2
JP2003282408A (ja) * 2002-03-25 2003-10-03 Dainippon Screen Mfg Co Ltd 高圧基板処理装置
JP5647845B2 (ja) * 2010-09-29 2015-01-07 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥装置及び基板乾燥方法
US8539952B2 (en) * 2011-05-13 2013-09-24 Hill-Rom Services Pte. Ltd. Mechanical insufflation/exsufflation airway clearance apparatus
JP2013055230A (ja) * 2011-09-05 2013-03-21 Toshiba Corp 半導体基板の超臨界乾燥方法
KR101874901B1 (ko) * 2011-12-07 2018-07-06 삼성전자주식회사 기판 건조 장치 및 방법
KR102037844B1 (ko) * 2013-03-12 2019-11-27 삼성전자주식회사 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법
KR101623411B1 (ko) * 2014-11-03 2016-05-24 세메스 주식회사 기판 처리 장치
KR101856606B1 (ko) 2016-06-02 2018-05-15 세메스 주식회사 기판 처리 장치 및 방법
KR101935951B1 (ko) * 2016-11-25 2019-01-08 세메스 주식회사 기판 처리 장치 및 방법
KR101987711B1 (ko) * 2017-05-11 2019-06-11 (주)엔피홀딩스 기판 전체에 유체 분사가 가능한 노즐 및 이를 이용한 기판 세정 시스템
KR101981559B1 (ko) * 2018-07-11 2019-05-23 세메스 주식회사 기판 처리 장치

Also Published As

Publication number Publication date
TW202043687A (zh) 2020-12-01
WO2020189892A1 (ko) 2020-09-24
TWI725779B (zh) 2021-04-21
KR20200111468A (ko) 2020-09-29

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AMND Amendment
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