KR102227259B1 - Adhesive composition for carrier film and carrier film comprising the same - Google Patents

Abstract

The present invention relates to a carrier film comprising: a base film; a carrier adhesive layer formed on one side of the base film; and an antistatic layer formed on the opposite side of the base film, wherein the carrier adhesive layer includes: an MQ resin; an organosiloxane polymer; a phenyl group-containing organosiloxane polymer; an organosilicon compound; and a hydrosilylation reaction catalyst. Accordingly, the carrier film has high low-speed peeling force, so that lifting or peeling of the carrier film does not occur in a manufacturing process of an flexible optical device film, thereby increasing the peeling stability after the process, and having high productivity due to low high-speed peeling force.

Description

A pressure-sensitive adhesive composition for a carrier film, and a carrier film comprising the same TECHNICAL FIELD OF THE INVENTION

The present invention relates to a carrier film for a flexible optical device film, and more particularly, improves peel stability at high-speed peeling and prevents peeling defects, thereby increasing productivity. It relates to a pressure-sensitive adhesive composition for a carrier film and a carrier film comprising the same.

In general, a display may include a polarizing plate, a retardation plate, and other functional layers made of a plate-like material. These are attached to the adherend inside the device via the pressure-sensitive adhesive, and can be manufactured in various forms such as bent or folded.

Meanwhile, in the case of future displays, especially mobile displays, it is expected to develop into a flexible display that is thinner, lighter, and consumes less energy in accordance with the deepening, generalization, and popularization of information.

In the case of optical devices and films used in conventional flat panel displays, there is little deformation due to external force, but in the case of optical devices and films applied to flexible displays, stress is generated by external bending or bending when used. Existing optical devices or films cannot be used as they are, and it is required to reduce stress generated during bending or bending.

In response to these demands, optical films and protective films used in flexible displays are being developed in a thin and soft form to reduce stress, and a carrier film serving as a support is attached to increase the fairness (processability) of the thin and soft optical film. Will be used for

Such a carrier film should proceed without defects in the process of going through various processes included in the manufacturing process of the display device, but the carrier film may be lifted or peeled off during the process, and the carrier film is peeled off when the release film on the other side is peeled off. Back problems may occur. In addition, in recent years, as fairness begins to become important, it is required to stably maintain a low peeling force in order to stably peel during high-speed peeling.

Therefore, it is an urgent setting to develop a carrier film that stably adheres to the optical film during the manufacturing process of a flexible optical device, does not cause lift or peeling in the release film peeling process, and falls easily upon final peeling after the process.

Korean Patent Registration No. 10-1375948

The present invention was conceived to solve the above problems, and an object of the present invention is to increase peeling stability after the process due to high low-speed peeling force so that there is no lift or peeling during the manufacturing process of a flexible optical device film, and at the same time prevent peeling defects. It is intended to provide a pressure-sensitive adhesive composition for a carrier film and a carrier film including the same, which can increase productivity by lowering the high-speed peeling force.

The above and other objects and advantages of the present invention will become apparent from the following description of preferred embodiments.

The above object includes the MQ resin of Formula 1, the organosiloxane polymer of Formula 2 as an organosiloxane polymer, an organosiloxane polymer containing a phenyl group of Formula 3, an organohydrogen silicon compound, and a hydrosilylation reaction catalyst,

[Formula 1]

R ₃ is an alkyl group,

[Formula 2]

R ₁ R ₂ ViSiO(R ₁ R ₂ SiO)nSiR ₁ R ₂ Vi

R ₁ and R ₂ are a vinyl group or an alkyl group having 1 to 6 carbon atoms, n is an integer of 1 or more,

[Formula 3]

R ₃ R ₄ ViSiO(R ₃ R ₄ SiO)m(R ₅ R ₆ SiO)l SiR ₃ R ₄ Vi

R ₃ and R ₄ are a vinyl group or an alkyl group having 1 to 6 carbon atoms, R ₅ and R ₆ have a phenyl group or an alkyl group having 1 to 6 carbon atoms, m and l are natural numbers, and m+l is 2 to 500.

Preferably, the weight average molecular weight of the MQ resin may be 500 to 10,000 g/mol.

Preferably, the weight average molecular weight of the organosiloxane polymer of Formula 2 is 200,000 to 800,000 g/mol, and the weight average molecular weight of the phenyl group-containing organosiloxane polymer of Formula 3 may be 1,000 to 20,000 g/mol.

Preferably, the weight average molecular weight of the organosiloxane polymer of Formula 2 may be 400,000 to 600,000 g/mol, and the weight average molecular weight of the phenyl group-containing organosiloxane polymer of Formula 3 may be 5,000 to 10,000 g/mol.

Preferably, the weight ratio of the MQ resin and the entire organosiloxane polymer may be 25:75 to 40:60.

Preferably, the organosiloxane polymer may include 0.5 to 3 parts by weight of the phenyl group-containing organosiloxane polymer of Formula 3 with respect to 100 parts by weight of the organosiloxane polymer of Formula 2.

Preferably, it may include 5 to 15 parts by weight of the organohydrogen silicon compound and 0.1 to 1.0 parts by weight of the hydrosilylation catalyst based on the total 100 parts by weight of the organosiloxane polymer.

Preferably, the hydrosilylation catalyst has a platinum concentration of about 5,200 ppm and may be a platinum complex of 1,3 diethenyl-1,1,2,2-tetramethyldisiloxane diluted with a vinyl end-blocked polymer. have.

In addition, the object is a base film, a carrier adhesive layer located on one side of the base film; And an antistatic layer positioned on the opposite side of the base film, wherein the carrier pressure-sensitive adhesive layer is achieved by a carrier film, which is the pressure-sensitive adhesive layer of the pressure-sensitive adhesive composition for a carrier film described above.

Preferably, the high-speed peeling force and the low-speed peeling force ratio (PS) of the carrier pressure-sensitive adhesive layer satisfies Equation 1 below,

[Equation 1]

1.5 ≤ PS = S_h/S_l ≤ 3.5

S_h is a high-speed peeling force when peeling at a high speed of 2.4 m/min, and S_l may be a low-speed peeling force when peeling at a low speed of 0.3 m/min.

Preferably, the carrier pressure-sensitive adhesive layer may have a peel force of 7 gf/25 mm or more and 20 gf/25 mm or less, measured at a peel rate of 0.3 m/min.

Preferably, the carrier pressure-sensitive adhesive layer may have a peel force of 15 gf/25 mm or more and 30 gf/25 mm or less, measured at a peel rate of 2.4 m/min.

Preferably, the carrier film may have a transmittance of 85% or more and a haze of 5% or less.

Preferably, the carrier pressure-sensitive adhesive layer has a peeling force of 7 to 20 gf/25 mm, measured at a rate of 0.3 m/min, and a rate of 2.4 m/min, after being left for 120 hours in a thermo-hygrostat under 85°C and 85%RH conditions. The peel force measured by may be 15 to 30 gf/25mm.

Preferably, the surface resistance of the antistatic layer may be 10 ⁴ to 10 ⁹ Ω/□.

The pressure-sensitive adhesive composition for a carrier film and a carrier film comprising the same according to the present invention have high low-speed peeling force during the manufacturing process of a flexible optical device film, so that lift or peeling of the carrier film does not occur, so that peeling stability after the process is high, and high-speed peeling force It has an effect such as having a low level and high productivity.

However, the effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a cross-sectional view of a carrier film according to an embodiment of the present invention.
2 is a cross-sectional view of a multilayer flexible optical device film in which the carrier film of FIG. 1 is laminated.

Hereinafter, the present invention will be described in detail with reference to embodiments of the present invention and drawings. These examples are only illustratively presented to explain the present invention in more detail, and it will be apparent to those of ordinary skill in the art that the scope of the present invention is not limited by these examples. .

In the drawings, the thicknesses are enlarged in order to clearly express various layers and regions. Like reference numerals are attached to similar parts throughout the specification. When a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in the middle. Conversely, when one part is "directly above" another part, it means that there is no other part in the middle.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control. Also, although methods and materials similar or equivalent to those described herein may be used in the practice or testing of the present invention, suitable methods and materials are described herein.

1 is a cross-sectional view of a carrier film according to an embodiment of the present invention.

First, referring to FIG. 1, a carrier film 100 according to an embodiment of the present invention includes a base film 120, a carrier adhesive layer 130 and a base film 120 positioned on one side of the base film 120. Consisting of an antistatic layer 110 positioned on the other side (opposite side) of, the carrier adhesive layer 130, the base film 120, and the antistatic layer 110 are sequentially stacked. In the present specification, as a carrier film, a carrier film for a flexible optical device film is described as an example, but is not limited thereto.

The carrier adhesive layer 130 may be formed by applying an adhesive composition for a carrier film on one surface of the base film 120.

In one embodiment, the pressure-sensitive adhesive composition for a carrier film may include an MQ resin, an organosiloxane polymer, an organohydrogen silicon compound, and a hydrosilylation catalyst.

MQ resin is a silicone resin and refers to a resin bonded according to the MQ ratio, which is the ratio of M-resin and Q-resin, as shown in the following formula (1), and there are various substances that bind to Si in M-resin. However, in the case of MQ resins generally commercially used, Si-CH ₃ is usually attached and is called organopolysiloxane.

[Formula 1]

Here, R ₃ is preferably a methyl group as an alkyl group. However, without departing from the scope of the present invention, instead of a methyl group, other aliphatic groups having about 20 or less carbon atoms may be used. In addition, the MQ resin may contain up to 5% by weight of silanol functionality, with less than about 1% by weight alternatively being used.

When the ratio of M increases in the molar ratio of M units and Q units constituting MQ resin, there are many cases of structurally one-dimensional linear or two-dimensional structure, and when the ratio of M units decreases, it will have a solid three-dimensional structure. Can affect the physical properties (adhesive properties, changes over time, etc.) in the adhesive. And since there are many cases of having a hydroxyl group (hydroxyl group) in the M unit, the adhesive strength tends to increase as the number of M units increases.

In the MQ resin of Formula 1, the molar ratio of the M unit and the Q unit is preferably 0.6:1 to 4:1. When the molar ratio of the M unit and the Q unit in Formula 1 is less than 0.6:1, the size and molecular weight of the MQ resin increases, so that the compatibility with the organosiloxane polymer of Formula 2 below decreases, and the viscosity is excessively increased to prevent coating. When the molar ratio of M unit and Q unit exceeds 4:1, the size and molecular weight of the MQ resin decreases, so it has good compatibility with the organosiloxane polymer of Formula 2 below, and its viscosity is low, making it easy to coat the manufacturing process. This is because the dispersibility is inferior and migration occurs at high temperatures, resulting in poor physical property uniformity.

At this time, it is preferable that the weight average molecular weight of the MQ resin is 500 to 10,000 g/mol. If the weight average molecular weight of the MQ resin is less than 500g/mol, there is a problem of causing a change in physical properties when a high temperature or a long period of time has elapsed, and when it exceeds 10,000g/mol, it cannot be mixed with the organosiloxane polymer, resulting in variations in physical properties. It has a problem of impairing optical properties.

Next, the organosiloxane polymer contained in the pressure-sensitive adhesive composition for a carrier film may include an organosiloxane polymer according to Formula 2 and a phenyl group-containing organosiloxane polymer according to Formula 3.

The organosiloxane polymer according to Formula 2 is as follows.

[Formula 2]

R ₁ R ₂ ViSiO(R ₁ R ₂ SiO)nSiR ₁ R ₂ Vi

Here, R1 and R2 are a vinyl group or an alkyl group having 1 to 6 carbon atoms, and n may be an integer of 1 or more.

It is preferable that the weight average molecular weight of the organosiloxane polymer of Formula 2 is 200,000 to 800,000 g/mol. When the weight average molecular weight of the organosiloxane polymer is less than 200,000 g/mol, the degree of curing is greatly increased during curing, resulting in poor flexibility and thus low peeling force cannot be realized. If the degree of curing is lowered, the stability of the peeling force over time is deteriorated. In addition, when the weight average molecular weight of the organosiloxane polymer exceeds 800,000 g/mol, the stability of physical properties increases, but the viscosity increases, resulting in a problem that uniform coating is impossible. More preferably, having a peeling stability of 400,000g/mol to 600,000g/mol is advantageous.

The phenyl group-containing organosiloxane polymer according to Formula 3 is as follows.

[Formula 3]

R ₃ R ₄ ViSiO(R ₃ R ₄ SiO)m(R ₅ R ₆ SiO)l SiR ₃ R ₄ Vi

Here, R ₃ , and R ₄ are a vinyl group or an alkyl group having 1 to 6 carbon atoms, R ₅ and R ₆ have a phenyl group or an alkyl group having 1 to 6 carbon atoms, m and l are natural numbers, m+l is 2 to 500 Can be

It is preferable that the weight average molecular weight of the phenyl group-containing organosiloxane polymer of Formula 3 is 1,000 to 20,000 g/mol. When the weight average molecular weight of the phenyl group-containing organosiloxane polymer is less than 1,000 g/mol, silicon is transferred to the adherend, resulting in a problem of contaminating the adherend surface. In addition, when the weight average molecular weight exceeds 20,000 g/mol, the surface of the pressure-sensitive adhesive becomes hard and the peeling force further increases, so that physical properties cannot be satisfied.

At this time, the weight average molecular weight of the phenyl group-containing organosiloxane polymer is more preferably 5,000 g/mol to 10,000 g/mol to realize peeling stability.

In one embodiment, 0.5 to 3 parts by weight of the phenyl group-containing organosiloxane polymer of Formula 3 may be included with respect to 100 parts by weight of the organosiloxane polymer of Formula 2. When the phenyl group-containing organosiloxane polymer of Formula 3 is included in less than 0.5, the high-speed peeling force is high and the desired technical effect cannot be expected. If it exceeds 3 parts by weight, the peeling force changes with time, which impairs peeling stability. .

In one embodiment, the weight ratio of the MQ resin and the entire organosiloxane polymer (the organosiloxane polymer according to Formula 2 and the entire phenyl group-containing organosiloxane polymer according to Formula 3) is preferably 25:75 to 40:60. When the weight ratio of MQ resin and organosiloxane polymer is less than 25:75 and the content of MQ resin decreases, the adhesive strength to the flexible optical device decreases, resulting in lower high-speed peeling force, but the opposite side during storage or processing because the desired low-speed peeling force cannot be obtained. Lifting occurs when the release film of the release film is peeled off. On the contrary, when the weight ratio of MQ resin and organosiloxane polymer exceeds 40:60 and MQ resin is increased, the low-speed peeling force increases and there is no lift defect, but the high-speed peeling force also increases. Process defects occur during the carrier film peeling process.

Next, the organohydrogen silicon compound includes one or more crosslinked organohydrogensiloxane compounds having an average of two or more Si-H bonds per molecule. Organohydrogensiloxane compounds suitable for use are preferably linear, branched, or cyclic molecules and any mixtures or combinations thereof.

Next, the catalyst may include any catalyst known to those skilled in the art to be useful for catalyzing hydrosilylation reactions. Preferably, the catalyst may be a platinum group metal-containing catalyst. By definition, a platinum group metal refers to ruthenium, rhodium, palladium, osmium, iridium and platinum metals, as well as any mixtures or complexes thereof. The platinum group metal may comprise solid or hollow particles, a layer deposited on a carrier such as silica gel or powdered charcoal, or an organometallic compound or complex. Examples of platinum-containing catalysts include chloroplatinic acid in hexahydrate form or anhydrous form, and platinum-containing catalysts obtained by reacting chloroplatinic acid or this platinum chloride with an aliphatic unsaturated organosilicon compound. It is preferable to use a platinum complex of 1,3 diethenyl-1,1,2,2-tetramethyldisiloxane, which has a platinum concentration of about 5,200 ppm among the many catalysts described above, and is diluted with a vinyl end-blocked polymer. Do. As an example of such a catalyst, a Pt 4000 catalyst (Dow Corning Corporation) may be used.

In one embodiment, the pressure-sensitive adhesive composition for a carrier film is 5 to 15 parts by weight of an organohydrogen silicon compound and hydrosilylation based on 100 parts by weight of the entire organosiloxane polymer (organosiloxane polymer of Formula 2 and phenyl group-containing organosiloxane polymer of Formula 3) It is preferably 0.1 to 1.0 parts by weight of the catalyst.

At this time, if the amount of the organohydrogen silicon compound is less than 5 parts by weight, the degree of curing decreases, resulting in a change in physical properties over time. If the amount exceeds 15 parts by weight, the required physical properties are not satisfied due to an excessive amount of the curing agent, or a side reaction is caused by Has a problem that causes it.

In addition, when the hydrosilylation catalyst is less than 0.1 parts by weight, the curing reaction does not occur sufficiently, and when the amount of the hydrosilylation catalyst is more than 1.0, side reactions are caused by the residual catalyst and the adhesive strength changes with time.

In one embodiment, the high-speed peeling force and the low-speed peeling force ratio (PS) of the carrier adhesive layer 130 satisfies Equation 1 below.

[Equation 1]

1.5 ≤ PS = S_h/S_l ≤ 3.5

In Equation 1, S_h represents the peeling force when peeling at a high speed of 2.4m/min (high-speed peeling force), and S_l represents the peeling force when peeling at a low speed of 0.3m/min (low-speed peeling force). .

Equation 1 above is applied not only to the initial peeling force, but also to the later peeling force measured after leaving it for 120 hours in a thermo-hygrostat under the conditions of 85℃ and 85%RH. At this time, when the high-speed peeling force and the low-speed peeling force ratio (PS) is less than 1.5, S_h becomes similar or smaller than S_l. This makes the surface of the adhesive hard, so when peeling, a noise of a zipped sound is generated. If the surface becomes susceptible to impact, and if the high-speed peeling force and the low-speed peeling force ratio (PS) exceeds 3.5, S_h becomes too high and impairs fairness, or S_l becomes too low, resulting in defects in which peeling occurs during product storage.

In addition, for the carrier adhesive layer 130 formed on one side of the base film 120, the peeling force (low-velocity peeling force) measured at a peeling rate of 0.3m/min is 7gf/25mm or more and 20gf/25mm or less, and the peeling rate is 2.4 It is preferable that the peeling force (high-velocity peeling force) measured at m/min speed is 15 gf/25 mm or more and 30 gf/25 mm or less. When peeling at a low speed of 0.3m/min, if the peeling force is less than 7gf/25mm, the edge may be lifted during handling or storage of the flexible optical film.When peeling the release film from the flexible optical film, the carrier film is peeled to prevent defects. If it exceeds 20gf/25mm, the stress applied to the flexible optical film increases when the carrier film is subsequently peeled off, resulting in a problem of defective destruction of the optical element. In addition, when peeling at a high speed of 2.4m/min, if the peeling force is less than 15gf/25mm, there is a problem that the edge is lifted during handling or storage of the flexible optical film.If the peeling force exceeds 30gf/25mm, the carrier film As the removal of the film is not easy, productivity is greatly reduced, and automatic film removal becomes impossible, so that it cannot be applied to the actual process.

In addition, it is preferable that the carrier adhesive layer 130 has a peel force (low-speed peel force) of 7 to 20 gf/25 mm measured at a rate of 0.3 m/min after leaving it for 120 hours in a thermo-hygrostat under conditions of 85°C and 85%RH. . If the low-speed peeling force at this time is less than 7gf/25mm, the edge may be lifted during handling or storage of the flexible optical film, and if it exceeds 20gf/25mm, the stress increases during peeling of the carrier film, resulting in a problem of failure to destroy the optical element. .

In addition, it is preferable that the carrier adhesive layer 130 has a peel force (high-speed peel force) of 15 to 30 gf/25 mm measured at a rate of 2.4 m/min after leaving it for 120 hours in a thermo-hygrostat under 85°C and 85%RH conditions. Do. If the high-speed peeling force at this time is less than 15gf/25mm, the edge is lifted during handling or storage of the flexible optical film, and if it exceeds 30gf/25mm, the removal of the carrier film becomes difficult, making automatic film removal impossible. Have.

It is preferable that the antistatic layer 110 positioned on the opposite side to one side of the base film 120 on which the carrier adhesive layer 130 is positioned has a ^{surface resistance of 10 4} to 10 ^{9 Ω/□.} Flexible optical devices are susceptible to static electricity generation because they are flexible and thinner than other optical devices. In addition, films for optical elements are mostly laminated and have a high risk of generating triboelectricity in the laminated state, so they must have antistatic properties. Therefore, it must have a surface resistance characteristic of ^{10 9 Ω/□ or less, and a surface resistance of less than 10 4} Ω/□ is not helpful in solving static electricity, but rather, optical characteristics deteriorate, making defect inspection difficult. That is, when the antistatic layer 110 has ^{a surface resistance of less than 10 4} Ω/□, the antistatic function is insufficient, and when it has a surface resistance of more than 10 ⁹ Ω/□, optical characteristics are deteriorated.

In addition, the carrier film 100 according to an embodiment of the present invention preferably has a transmittance of 85% or more and a haze of 5% or less. This is necessary for the ease of inspection of the product. If the transmittance is less than 85%, the defect detection ability of the flexible optical device film is not smooth, and the detection ability of the defect decreases. If the haze exceeds 5%, the defect detection is equally possible. It becomes difficult and it is impossible to apply the process because it is difficult to align (align) the position of the film when manufacturing a flexible optical device.

Hereinafter, the configuration of the present invention and effects thereof will be described in more detail through examples and comparative examples. However, the present examples are for explaining the present invention more specifically, and the scope of the present invention is not limited to these examples.

[Example]

[Example 1]

Step 1: Preparation of a pressure-sensitive adhesive composition for a carrier film

Solids MQ having a weight average molecular weight of 8,000 g/mol, a molar ratio of M and Q units of 1.5:1, and an OH content of less than 5% in a 1,000 ml chemical reactor equipped with a stirrer, reflux cooler, thermometer and nitrogen injection device Contents of resin 35g, weight average molecular weight 600,000g/mol and vinyl functional group content of less than 0.1% of organosiloxane polymer B 61g, weight average molecular weight of 7,000g/mol phenyl group-containing organosiloxane polymer B 0.31g and Si-H 60 g of toluene was added as a solvent to 8.5 g of an organohydrogen silicon compound having 1.0%, and the mixture was stirred for about 2 hours to sufficiently mix at room temperature.

Next, a total of 100 g by adding 0.5 g of a platinum complex of 1,3 diethenyl-1,1,2,2-tetramethyldisiloxane, which has a platinum content of 5,200 ppm and diluted with a vinyl end-blocking polymer, to the above mixture. I got it.

Step 2: Preparation of the carrier film

The pressure-sensitive adhesive composition for a carrier film prepared in step 1 was coated on the uncoated surface of a 75㎛ PET film (brand name XD537E, Toray Advanced Materials) coated with an antistatic layer on one side so that the thickness was 10㎛. Drying and curing in an oven at 140° C. for 6 minutes to prepare a carrier film.

Step 3: Preparation of the flexible optical element laminated film

The carrier film prepared in step 2 is protected by covering the surface of the pressure-sensitive adhesive layer with a liner PET film (trade name XD500P, Toray Advanced Materials). The liner PET film simply protects the carrier adhesive layer and is removed before being laminated with the flexible optical device film. Next, as shown in Figure 2, the flexible optical device film 200, the pressure-sensitive adhesive layer 300, and the flexible optical device laminated film composed of a release film 400, prepared in step 2 on the surface of the flexible optical device film 200 The carrier film 100 was laminated.

[Example 2]

In step 1 of Example 1 (adhesive composition manufacturing process), the same procedure as in Example 1 was performed except that the phenyl group-containing organosiloxane polymer B was increased from 0.31 g to 1.2 g.

[Example 3]

In step 1 of Example 1 (adhesive composition manufacturing process), the same procedure as in Example 1 was performed except that the phenyl group-containing organosiloxane polymer B was increased from 0.31 g to 1.8 g.

[Example 4]

In step 1 of Example 1 (adhesive composition manufacturing process), it was carried out in the same manner as in Example 1, except that the MQ resin was reduced from 35g to 22g.

[Example 5]

In step 1 (adhesive composition manufacturing process) of Example 1, the same procedure as in Example 1 was performed, except that the MQ resin was increased from 35 g to 40 g.

[Comparative Example 1]

In step 1 (adhesive composition manufacturing process) of Example 1, the same procedure as in Example 1 was performed, except that 61 g of organosiloxane polymer B was changed to 61 g of organosiloxane polymer A having a weight average molecular weight of 150,000 g/mol.

[Comparative Example 2]

In step 1 of Example 1 (adhesive composition manufacturing process), the same was carried out as in Example 1, except that 61 g of organosiloxane polymer B was changed to 61 g of organosiloxane polymer C having a weight average molecular weight of 900,000 g/mol.

[Comparative Example 3]

In step 1 of Example 1 (adhesive composition manufacturing process), the same procedure as in Example 1 was performed, except that 0.31 g of the phenyl group-containing organosiloxane polymer B was reduced to 0.1 g.

[Comparative Example 4]

In step 1 of Example 1 (adhesive composition manufacturing process), the same procedure as in Example 1 was performed, except that 0.31 g of the phenyl group-containing organosiloxane polymer B was increased to 2.2 g.

[Comparative Example 5]

In step 1 (adhesive composition manufacturing process) of Example 1, 0.31 g of phenyl group-containing organosiloxane polymer B having a weight average molecular weight of 7,000 g/mol was changed to 0.31 g of phenyl group-containing organosiloxane polymer A having a weight average molecular weight of 700 g/mol. Except for that, it was carried out in the same manner as in Example 1.

[Comparative Example 6]

In step 1 (adhesive composition manufacturing process) of Example 1, 0.31 g of a phenyl group-containing organosiloxane polymer B having a weight average molecular weight of 7,000 g/mol was converted to 0.31 g of a phenyl group-containing organosiloxane polymer C having a weight average molecular weight of 25,000 g/mol. Except for changing, it was carried out in the same manner as in Example 1.

[Comparative Example 7]

In step 1 of Example 1 (adhesive composition manufacturing process), it was carried out in the same manner as in Example 1, except that the MQ resin was reduced from 35g to 20g.

[ Comparative example 8]

In step 1 (adhesive composition manufacturing process) of Example 1, the same procedure as in Example 1 was performed, except that the MQ resin was increased from 35 g to 43 g.

The properties and content ratios of the components constituting the pressure-sensitive adhesive compositions for carrier films of Examples 1 to 5 and Comparative Examples 1 to 8 are shown in Tables 1 and 2 below.

Example 1 Example 2 Example 3 Example 4 Example 5 MQ resin M/Q ratio 1.5 1.5 1.5 1.5 1.5 MQ resin content (g) 35 35 35 22 40 Organosiloxane polymer (g) A (g) B (g) 61 61 61 61 61 C (g) Phenyl group-containing organosiloxane polymer (g) A (g) B (g) 0.31 1.2 1.8 0.31 0.31 C (g) Organohydrogen Silicon Compound (g) 8.5 8.5 8.5 8.5 8.5 Platinum complex (g) 0.5 0.5 0.5 0.5 0.5

Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 MQ resin M/Q ratio 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 MQ resin content (g) 35 35 35 35 35 35 20 43 Organosiloxane polymer (g) A (g) 61 B (g) 61 61 61 61 61 61 C (g) 61 Phenyl group-containing organosiloxane polymer (g) A (g) 0.31 B (g) 0.31 0.31 0.1 2.2 0.31 0.31 C (g) 0.31 Organohydrogen Silicon Compound (g) 8.5 8.5 8.5 8.5 8.5 8.5 8.5 8.5 Platinum complex (g) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5

The physical properties of the carrier film and the flexible optical device laminated film prepared according to the above Examples and Comparative Examples were measured according to the following experimental examples, and the measured values are shown in Tables 3 and 4 below.

[Experimental Example]

(1) Low speed peeling force (gf/25mm)

The flexible optical device laminated film samples prepared in Examples and Comparative Examples were cut into 1 inch × 15 cm strips. When 60 minutes elapsed after attachment, the peel force was measured by a 180° peel test method at a speed of 5 mm/sec (0.3 m/min) using a texture analyzer (TAXplus/50, SMS).

(2) High speed peeling force (gf/25mm)

The flexible optical element laminated film samples prepared in Examples and Comparative Examples were cut as in Experimental Example 1, and using a Texture Analyzer (TAXplus/50, SMS), at a speed of 40 mm/sec (2.4m/min). Peel force was measured by a 180˚ peel test method.

(3) Later peeling force (gf/25mm)

After leaving a sample of the same structure and size as the sample for which the initial peel strength was evaluated for 120 hours in a thermo-hygrostat under 85°C and 85%RH condition, use a Texture Analyzer (TAXplus/50, SMS) for 0.3m/min. Peel force was measured using a 180° peel test method for a low-speed peeling force of a speed and a high-speed peeling force of 2.4m/min.

(4) Reliability evaluation

After leaving a sample of the same structure and size as the sample for which the initial peel strength was evaluated for 120 hours in a thermo-hygrostat under the conditions of 85°C and 85%RH, observe with the naked eye whether there is any lift, peeling, or bubbles on the adherend It was evaluated as a standard.

○: No air bubbles or peeling phenomenon

X: A large number of bubbles or peeling phenomenon occurred

(5) Evaluation of peeling properties

In a sample having the same structure and size as the sample for which the initial peel force was evaluated, the carrier film is placed on a flat table with the carrier film facing downward. When the film was flat, the uppermost layer of the release film was peeled using a double-sided adhesive hand roll, and at this time, whether the release film was peeled off, and whether the carrier film was lifted, peeled off, or bubbles were observed with the naked eye. In addition, when peeling the final carrier film, whether or not the flexible optical device film was peeled without deformation was observed with the naked eye and evaluated based on the following criteria.

○: The release film is peeled off without lifting or bubbles of the carrier film, or there is no deformation of the optical device film during final carrier peeling.

X: The carrier film is lifted or bubbles are generated, the release film is not easily peeled off, or the optical device film is deformed at the time of final carrier peeling.

(6) Optical property evaluation

The carrier films prepared in Examples and Comparative Examples were measured using a D65 light source using a Haze Meter (NDH 2000, Nippon Denshoku, Inc.), and total light transmittance and haze values were confirmed.

Example 1 Example 2 Example 3 Example 4 Example 5 Low speed peeling force (gf/25mm) 10.7 8.5 8.3 8.1 12.2 High speed peeling force (gf/25mm) 23.5 17.0 16.3 20.2 26.4 PS value (=P_h/P_l) 2.2 2.0 2.0 2.5 2.2 Later peel force (gf/25mm)-low speed 11.0 8.6 8.5 9.8 12.8 Later peel force (gf/25mm)-high speed 24.1 18.4 17.8 22.1 27.8 Later PS value (=P_h/P_l) 2.2 2.1 2.1 2.3 2.2 Reliability evaluation ○ ○ ○ ○ ○ Evaluation of peeling properties ○ ○ ○ ○ ○ Total light transmittance 90.2 90.1 90.1 90.3 90.4 Haze 2.9 3.3 3.4 2.9 3.1

Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Low speed peeling force (gf/25mm) 7.5 16.8 12.4 8.3 6.1 8.7 6.8 8.2 High speed peeling force (gf/25mm) 22.1 31.1 26.0 22.4 13.2 22.4 20.3 25.1 PS value (=P_h/P_l) 2.9 1.9 2.1 2.7 2.2 2.6 3.0 3.1 Later peel force (gf/25mm)-low speed 8.1 17.2 15.6 13.5 6.1 14.8 7.5 9.8 Later peel force (gf/25mm)-high speed 31.2 33.2 30.2 52.1 13.2 32.1 29.2 33.5 Later PS value (=P_h/P_l) 3.9 1.9 1.9 3.9 2.2 2.2 3.9 3.4 Reliability evaluation ○ X ○ ○ X ○ ○ ○ Evaluation of peeling properties X X ○ X ○ X X X Total light transmittance 90.1 86.4 89.8 83.2 90.2 90.2 90.1 90.2 Haze 3.1 5.5 3.2 6.3 3.1 3.0 3.0 2.9

As described in Tables 3 and 4, Examples 1 to 5 according to an embodiment of the present invention have a configuration in which both the low-speed peeling force and the high-speed peeling force, and the low-speed and high-speed peeling force after being left in a thermo-hygrostat for 120 hours are limited. It is satisfactory, it is excellent in both reliability and peeling characteristics, and it can be seen that all the measurement results for total light transmittance and haze are also satisfactory.

On the other hand, in the case of Comparative Example 1, as a result of using the organosiloxane polymer having a small weight average molecular weight, the deviation of the low-speed peeling force and the high-speed peeling force occurred large, and effective peeling stability could not be secured due to the change over time. In addition, in the case of Comparative Example 2, as a result of using an organosiloxane polymer having a large weight average molecular weight, the haze increased while the compatibility with the MQ resin was lowered, and the peeling characteristics could not be satisfied due to the increase of the peeling force.

In addition, in the case of Comparative Example 3, the use of an organosiloxane polymer containing a small amount of a phenyl group caused a change in peeling force over time, and the range of effective low-speed peeling force and high-speed peeling force could not be satisfied. In addition, in the case of Comparative Example 4, the use of an excessive phenyl group-containing organosiloxane polymer caused a significant change in peeling force over time, so that the values of the low-speed peeling force, the high-speed peeling force, and the value of PS were greatly changed, and the peeling characteristics could not be satisfied.

In addition, in the case of Comparative Example 5, the use of an organosiloxane polymer containing a phenyl group having a low weight average molecular weight caused a problem in that low-speed peeling force characteristics were deteriorated and a defect such as bubbles was generated in reliability. In addition, in the case of Comparative Example 6, as the phenyl group-containing organosiloxane polymer having a large weight average molecular weight was used, the low-speed peeling force and the high-speed peeling force changed over time, resulting in a defect in the evaluation of peeling properties as the required peeling force was out of range. .

In addition, in the case of Comparative Example 7, the content of the MQ resin compared to the organosiloxane polymer was reduced, so that the adhesion to the flexible optical device was lowered, so that the high-speed peeling force was lowered, but the desired low-speed peeling force could not be obtained. Lifting occurs when the film is peeled off, and in the case of Comparative Example 8, the low-speed peeling force was increased due to the excessive content of the MQ resin compared to the organosiloxane polymer, so there was no lift off defect, but the high-speed peeling force was also increased. A defect occurred.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also present. It belongs to the scope of rights of

100: carrier film 110: antistatic layer
120: base film 130: carrier adhesive layer
200: flexible optical device film 300: pressure-sensitive adhesive layer
400: release film

Claims (15)

MQ resin of Formula 1, an organosiloxane polymer of Formula 2 as an organosiloxane polymer, an organosiloxane polymer containing a phenyl group of Formula 3, an organohydrogen silicon compound, and a hydrosilylation reaction catalyst,
[Formula 1]

R ₃ is an alkyl group,
[Formula 2]
R ₁ R ₂ ViSiO(R ₁ R ₂ SiO)nSiR ₁ R ₂ Vi
R ₁ and R ₂ are a vinyl group or an alkyl group having 1 to 6 carbon atoms, n is an integer of 1 or more,
[Formula 3]
R ₃ R ₄ ViSiO(R ₃ R ₄ SiO)m(R ₅ R ₆ SiO)l SiR ₃ R ₄ Vi
R ₃ and R ₄ are a vinyl group or an alkyl group having 1 to 6 carbon atoms, R ₅ and R ₆ have a phenyl group or an alkyl group having 1 to 6 carbon atoms, m and l are natural numbers, m+l is 2 to 500,
The weight average molecular weight of the organosiloxane polymer of Formula 2 is 200,000 to 800,000 g/mol, and the weight average molecular weight of the phenyl group-containing organosiloxane polymer of Formula 3 is 1,000 to 20,000 g/mol. The method of claim 1,
The weight average molecular weight of the MQ resin is 500 to 10,000 g / mol, the pressure-sensitive adhesive composition for a carrier film. delete The method of claim 1,
The weight average molecular weight of the organosiloxane polymer of Formula 2 is 400,000 to 600,000 g/mol, and the weight average molecular weight of the phenyl group-containing organosiloxane polymer of Formula 3 is 5,000 to 10,000 g/mol. The method of claim 1,
The weight ratio of the MQ resin and the entire organosiloxane polymer is 25:75 to 40:60, the pressure-sensitive adhesive composition for a carrier film. The method of claim 5,
The organosiloxane polymer comprises 0.5 to 3 parts by weight of the phenyl group-containing organosiloxane polymer of Formula 3 based on 100 parts by weight of the organosiloxane polymer of Formula 2, a pressure-sensitive adhesive composition for a carrier film. The method of claim 1,
An adhesive composition for a carrier film comprising 5 to 15 parts by weight of the organohydrogen silicon compound and 0.1 to 1.0 parts by weight of the hydrosilylation reaction catalyst based on the total 100 parts by weight of the organosiloxane polymer. The method of claim 1,
The hydrosilylation reaction catalyst has a platinum concentration of 5,200 ppm and is a platinum complex of 1,3 diethenyl-1,1,2,2-tetramethyldisiloxane diluted with a vinyl terminal-blocking polymer, an adhesive for a carrier film Composition. Base film;
A carrier adhesive layer positioned on one side of the base film; And
Including an antistatic layer located on the opposite side of the base film,
The carrier pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer of the pressure-sensitive adhesive composition for a carrier film according to any one of claims 1, 2 and 4 to 8, a carrier film. The method of claim 9,
The high-speed peeling force and the low-speed peeling force ratio (PS) of the carrier adhesive layer satisfies Equation 1 below,
[Equation 1]
1.5 ≤ PS = S_h/S_l ≤ 3.5
S_h is a high-speed peeling force when peeling at a high speed of 2.4 m/min, and S_l is a low-speed peeling force when peeling at a low speed of 0.3 m/min. The method of claim 9
The carrier pressure-sensitive adhesive layer has a peeling force of 7 gf/25 mm or more and 20 gf/25 mm or less as measured at a peel rate of 0.3 m/min. The method of claim 9,
The carrier pressure-sensitive adhesive layer has a peeling force of 15 gf/25 mm or more and 30 gf/25 mm or less, as measured at a peel rate of 2.4 m/min. The method of claim 9,
The carrier film has a transmittance of 85% or more and a haze of 5% or less. The method of claim 9,
The carrier pressure-sensitive adhesive layer was left for 120 hours in a thermo-hygrostat under conditions of 85°C and 85%RH, and the peel force measured at a rate of 0.3 m/min was 7 to 20 gf/25 mm, and measured at a rate of 2.4 m/min. A peel force of 15 to 30 gf / 25 mm, a carrier film. The method of claim 9,
The surface resistance of the antistatic layer is 10 ⁴ to 10 ⁹ Ω / □, a carrier film.

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