KR102166080B1 - Adhesive composition for carrier film and carrier film comprising the same - Google Patents

Abstract

The present invention relates to a carrier film including a substrate film, a carrier adhesive layer formed on one surface of the substrate film, and an antistatic layer formed on the opposite surface of the substrate film, wherein the carrier adhesive layer includes MQ resin, an organosiloxane polymer, an organohydrosilicon compound and a hydrosilation catalyst. The carrier film shows high low-speed peel force and causes no lifting or peeling during a process for manufacturing a flexible optical device film, thereby providing high peeling stability. In addition, the carrier film shows low high-speed peel force to provide high productivity.

Description

A pressure-sensitive adhesive composition for a carrier film, and a carrier film comprising the same TECHNICAL FIELD [0002] Adhesion composition for carrier film and carrier film comprising the same

The present invention relates to a carrier film for a flexible optical device film, and more particularly, to a pressure-sensitive adhesive composition for a carrier film capable of improving peel stability, preventing defects in peeling, and increasing productivity, and a carrier film including the same.

In general, the display may include a polarizing plate, a retardation plate, and other functional layers made of a plate-like material. These are attached to the adherend inside the device through the pressure-sensitive adhesive, and can be manufactured in various forms such as bent or folded.

Meanwhile, in the case of future displays, especially mobile displays, it is expected to develop into a flexible display that is thinner, lighter, and consumes less energy according to the deepening, generalization, and popularization of information.

In the case of optical devices and films used in conventional flat panel displays, there is little deformation due to external force, but in the case of optical devices and films applied to flexible displays, stress is generated by external bending or bending when used. Such a flexible display Existing optical elements or films cannot be used as they are, and it is required to reduce stress generated during bending or bending.

In response to these demands, optical films and protective films are being developed in a thin and soft form to reduce stress, and a carrier film serving as a support is attached and used in the process to increase the fairness (processability) of the thin and soft optical film.

Such a carrier film should proceed without defects in the process of going through various processes of the display device manufacturing process, but there are problems such as lifting or peeling of the carrier film during the process, and the carrier film peeling off when the release film on the other side is peeled off. May occur.

Therefore, it is an urgent setting to develop a carrier film that stably adheres to the optical film during the manufacturing process of a flexible optical device, does not cause lift or peeling in the release film peeling process, and falls easily upon final peeling after the process.

Republic of Korea Patent Publication No. 10-2016-0025050

The present invention was conceived to solve the above problems, and an object of the present invention is to increase peeling stability after the process due to high low-speed peeling force so that there is no lift or peeling during the manufacturing process of a flexible optical device film, and at the same time prevent peeling defects. It is intended to provide a pressure-sensitive adhesive composition for a carrier film and a carrier film including the same, which can increase productivity by lowering high-speed peeling force.

The above and other objects and advantages of the present invention will become apparent from the following description of preferred embodiments.

The above object includes an MQ resin of Formula 1, an organosiloxane polymer of Formula 2, an organohydrogen silicon compound, and a hydrosilylation reaction catalyst,

[Formula 1]

And R ₃ is an alkyl group,

[Formula 2]

R ₁ R ₂ ViSiO(R ₃ R ₄ SiO) _n SiR ₅ R ₆ Vi

And, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ and R ₆ may be the same as or different from each other as an alkyl group or phenyl group having 1 to 6 carbon atoms, and n is an integer greater than or equal to 1 to be achieved by the adhesive composition for a carrier film. I can.

Here, the molar ratio of the M unit and the Q unit of the MQ resin may be 0.6:1 to 4:1.

Preferably, the weight average molecular weight of the organosiloxane polymer may be 200,000 to 700,000 g/mol.

Preferably, the weight ratio of the MQ resin and the organosiloxane polymer may be 25:75 to 40:60.

Preferably, the organohydrogen silicon compound may be one or more cross-linked organohydrogensiloxane compounds having an average of two or more Si-H bonds per molecule.

In addition, the above object includes a base film, a carrier adhesive layer located on one side of the base film, and an antistatic layer located on the opposite side of the base film, wherein the carrier adhesive layer is a carrier adhesive layer of the adhesive composition for a carrier film described above. It is achieved by a carrier film.

Preferably, the carrier pressure-sensitive adhesive layer may have a peel force of 8 gf/25 mm or more and 20 gf/25 mm or less, measured at a peel rate of 0.3 m/min.

Preferably, the carrier pressure-sensitive adhesive layer may have a peel force of 15 gf/25 mm or more and 35 gf/25 mm or less, measured at a peel rate of 2.4 m/min.

Preferably, the carrier film may have a transmittance of 85% or more and a haze of 5% or less.

Preferably, the surface resistance of the antistatic layer may be 10 ⁴ to 10 ⁹ Ω/□.

Preferably, the carrier pressure-sensitive adhesive layer has a low-speed peeling force of 8 to 20 gf/25 mm, measured at a rate of 5 mm/sec, after being left for 120 hours in a thermo-hygrostat under 85°C and 85%RH conditions, and at a rate of 40 mm/sec. The measured high-speed peeling force may be 15 to 35 gf/25 mm.

According to the present invention, the low-speed peeling force during the manufacturing process of the flexible optical device film is high, so that lifting or peeling of the carrier film does not occur, so that peeling stability after the process is increased, and productivity is increased due to low high-speed peeling force.

However, the effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a cross-sectional view of a carrier film according to an embodiment of the present invention.
2 is a cross-sectional view of a multilayer flexible optical device film in which the carrier film of FIG. 1 is laminated.

Hereinafter, the present invention will be described in detail with reference to embodiments of the present invention and drawings. These examples are only illustratively presented to illustrate the present invention in more detail, and it will be apparent to those of ordinary skill in the art that the scope of the present invention is not limited by these examples. .

In the drawings, the thicknesses are enlarged to clearly express various layers and regions. The same reference numerals are assigned to similar parts throughout the specification. When a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in between. Conversely, when one part is "right above" another part, it means that there is no other part in the middle.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In case of conflict, the present specification, including definitions, will control. Also, although methods and materials similar or equivalent to those described herein can be used in the practice or testing of the present invention, suitable methods and materials are described herein.

1 is a cross-sectional view of a carrier film according to an embodiment of the present invention.

First, referring to FIG. 1, a carrier film 100 according to an embodiment of the present invention includes a base film 120, a carrier adhesive layer 130 and a base film 120 positioned on one side of the base film 120. It consists of an antistatic layer 110 located on the other side (opposite side) of the carrier adhesive layer 130, the base film 120, and the antistatic layer 110 is sequentially stacked. In the present specification, as a carrier film, a carrier film for a flexible optical device film is described as an example, but is not limited thereto.

The carrier adhesive layer 130 may be positioned by applying an adhesive composition for a carrier film on one surface of the base film 120.

In one embodiment, the pressure-sensitive adhesive composition for a carrier film may include an MQ resin, an organosiloxane polymer, an organohydrogen silicon compound, and a hydrosilylation catalyst.

MQ resin is a silicone resin and refers to a resin bonded according to the MQ ratio, which is the ratio of M-resin and Q-resin, as shown in the following formula (1), and there are various substances that bind to Si in M-resin. However, in the case of MQ resins that are generally commercially used, Si-CH ₃ is usually attached and is called organopolysiloxane.

[Formula 1]

Here, R ₃ is an alkyl group, for example a methyl group.

When the ratio of M increases in the molar ratio of M units and Q units constituting the MQ resin, there are many cases of structurally one-dimensional linear or two-dimensional structure, and when the ratio of M units decreases, a solid three-dimensional structure is obtained. Can affect the physical properties (adhesive properties, changes over time, etc.) in the adhesive. And since there are many cases of having a hydroxyl group (hydroxyl group) in the M unit, the adhesive strength tends to increase as the number of M units increases.

In the MQ resin of Formula 1, the molar ratio of the M unit and the Q unit is preferably 0.6:1 to 4:1. If the molar ratio between the M unit and the Q unit in Formula 1 is less than 0.6:1, the size and molecular weight of the MQ resin increases, so that the compatibility with the organosiloxane polymer of Formula 2 below decreases, and the viscosity is too high to make coating. When the molar ratio of M unit and Q unit exceeds 4:1, the size and molecular weight of the MQ resin decreases, so it has good compatibility with the organosiloxane polymer of Formula 2 below, and its viscosity is low, making it easy to coat the manufacturing process. This is because the dispersibility is poor and migration occurs at high temperatures, resulting in poor physical properties.

It is preferable that the weight average molecular weight of the MQ resin is 500 to 10,000 g/mol. If the weight average molecular weight of the MQ resin is less than 500g/mol, it moves when a high temperature or a long period of time has elapsed, causing a change in physical properties, and when it exceeds 10,000g/mol, it cannot be mixed with the organosiloxane polymer. It has a problem of hindering the deviation of and optical properties.

The organosiloxane polymer can be represented by the following formula (2).

[Formula 2]

R ₁ R ₂ ViSiO(R ₃ R ₄ SiO) _n SiR ₅ R ₆ Vi

Here, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ , and R ₆ may be the same as or different from each other as an alkyl group or a phenyl group having 1 to 6 carbon atoms, and n may be an integer of 1 or more.

The weight average molecular weight of the organosiloxane polymer of Formula 2 is preferably 200,000 to 700,000 g/mol. When the weight average molecular weight of the organosiloxane polymer is less than 200,000 g/mol, the degree of curing is greatly increased during curing, resulting in poor flexibility, and thus a low peel force cannot be realized, and when the degree of curing is lowered, the stability with time of the peel force decreases. In addition, when the weight average molecular weight of the organosiloxane polymer exceeds 700,000 g/mol, the stability of physical properties increases, but the viscosity increases, resulting in a problem that uniform coating is impossible.

In one embodiment, the weight ratio of the MQ resin and the organosiloxane polymer is preferably 25:75 to 40:60. When the weight ratio of MQ resin and organosiloxane polymer is less than 25:75 and the content of MQ resin decreases, adhesion to the flexible optical device decreases, resulting in lower high-speed peeling force, but the opposite side during storage or processing because the desired low-speed peeling force cannot be obtained. Lifting occurs when the release film of is peeled off. On the contrary, if the weight ratio of the MQ resin and the organosiloxane polymer exceeds 40:60 and contains a large amount of MQ resin, the low-speed peeling force increases and there is no lifting defect, but the high-speed peeling force also increases, causing a process defect during the carrier film peeling process.

In addition, the organohydrogen silicon compound includes one or more cross-linked organohydrogensiloxane compounds having an average of two or more Si-H bonds per molecule. Organohydrogensiloxane compounds suitable for use are preferably linear, branched, or cyclic molecules, and any mixtures or combinations thereof.

The catalyst may also include any catalyst known to those skilled in the art to be useful for catalyzing hydrosilylation reactions. The catalyst may be preferably a platinum group metal-containing catalyst. By definition, a platinum group metal refers to ruthenium, rhodium, palladium, osmium, iridium, and platinum metals, as well as any mixtures or complexes thereof. The platinum group metal may include solid or hollow particles, a layer deposited on a carrier such as silica gel or powdered charcoal, or an organometallic compound or complex. Some examples of platinum-containing catalysts include chloroplatinic acid in hexahydrate or anhydrous form, and platinum-containing catalysts obtained by reacting chloroplatinic acid or this platinum chloride with an aliphatic unsaturated organosilicon compound. It is preferable to use a platinum complex of 1,3 diethenyl-1,1,2,2-tetramethyldisiloxane, which has a platinum concentration of about 5,200 ppm among the many catalysts described above, and is diluted with a vinyl end-blocked polymer. Do. As an example of such a catalyst, a Pt 4000 catalyst (Dow Corning Corporation) may be used.

In one embodiment, the carrier pressure-sensitive adhesive layer 130 has a peel force of 8 gf/25 mm or more and 20 gf/25 mm or less, as measured at a peel rate of 0.3 m/min, and a peel force of 15 gf/min, measured at a peel rate of 2.4 m/min. It is preferably 25mm or more and 35gf/25mm or less. In case of peeling at a low speed of 0.3m/min, if the peeling force is less than 8gf/25mm, the edge may be lifted during handling or storage of the flexible optical film.When the release film is peeled from the flexible optical film, the carrier film is peeled to prevent defects. If it exceeds 20gf/25mm, the stress applied to the flexible optical film increases when the carrier film is subsequently peeled off, resulting in a problem of poor destruction of the optical element. In addition, when peeling at a high speed of 2.4m/min, if the peeling force is less than 15gf/25mm, there is a problem that the edge is lifted during handling or storage of the flexible optical film.If the peeling force exceeds 35gf/25mm, the carrier Since the film is not easily removed, productivity is greatly reduced, and automatic film removal becomes impossible, so that it cannot be applied to the actual process.

In one embodiment, the carrier pressure-sensitive adhesive layer 130 has a low-speed peeling force of 8 to 20 gf measured at a rate of 5 mm/sec (0.3 m/min) after leaving it for 120 hours in a thermo-hygrostat under 85°C and 85%RH conditions. It is preferably /25mm. If the low-speed peeling force at this time is less than 8gf/25mm, the edge may be lifted during handling or storage of the flexible optical film, and if it exceeds 20gf/25mm, the stress increases during peeling of the carrier film, resulting in a problem of failure of the optical device. .

In addition, the carrier adhesive layer 130 has a high-speed peeling force of 15 to 35 gf/25 mm measured at a rate of 40 mm/sec (2.4 m/min) after leaving it for 120 hours in a thermo-hygrostat under 85°C and 85%RH conditions. It is desirable. If the high-speed peeling force at this time is less than 15gf/25mm, the edge is lifted during handling or storage of the flexible optical film, and if it exceeds 35gf/25mm, the removal of the carrier film becomes difficult, making automatic film removal impossible. Have.

Therefore, the carrier film having a carrier pressure-sensitive adhesive layer of the pressure-sensitive adhesive composition for a carrier film according to the present invention has a high low-speed peeling force compared to a conventional carrier film, but has a low high-speed peeling force, so that the increase in peeling force according to the increase of the peeling speed It is gentle, and as a result, lift or peeling of the carrier film does not occur, so that the peeling stability after the process is high, and the high-speed peeling force is low, so the productivity is high, so that the physical properties as a pressure-sensitive adhesive are excellent.

In one embodiment, the antistatic layer 110 located on the other side of the base film 120 on which the carrier adhesive layer 130 is located preferably has a surface resistance of 10 ⁴ to 10 ⁹ Ω/□. Flexible optical elements are more susceptible to static electricity because they are more flexible and thinner than other optical elements, and films for optical elements are mostly stacked and there is a high risk of generating triboelectricity in the stacked state, so they must have antistatic properties. Therefore, it must have a surface resistance characteristic of 10 ⁹ Ω/□ or less, and a surface resistance of less than 10 ⁴ Ω/□ is not helpful in solving static electricity, but rather, optical characteristics deteriorate, making defect inspection difficult.

The carrier film 100 according to an embodiment of the present invention preferably has a transmittance of 85% or more and a haze of 5% or less. This is necessary for ease of inspection of the product. In other words, if the transmittance is less than 85%, the defect detection ability of the flexible optical device film is not smooth, and the detection ability of the defect decreases, and when the haze exceeds 5%, it becomes difficult to detect the same defect. Since position alignment (alignment) is difficult, process application becomes impossible.

Hereinafter, the configuration of the present invention and effects thereof will be described in more detail through examples and comparative examples. However, the present examples are for explaining the present invention more specifically, and the scope of the present invention is not limited to these examples.

[Example]

[Example 1]

Step 1: Preparation of a pressure-sensitive adhesive composition for a carrier film

Solids MQ having a weight average molecular weight of 8,000 g/mol, a molar ratio of M and Q units of 1.5:1, and an OH content of less than 5% in a 1,000 ml chemical reactor equipped with a stirrer, reflux cooler, thermometer and nitrogen injection device At room temperature by adding 60 g of toluene as a solvent to 30 g of resin, 61 g of an organosiloxane polymer having a weight average molecular weight of 650,000 g/mol and a vinyl functional group content of less than 0.1% and 8.5 g of an organohydrogen silicon compound having 1.0% of Si-H. The mixture was stirred for about 2 hours to achieve sufficient mixing.

Next, a total of 100 g by adding 0.5 g of a platinum complex of 1,3 diethenyl-1,1,2,2-tetramethyldisiloxane, which has a platinum content of 5,200 ppm and diluted with a vinyl end-blocking polymer, to the above mixture. I got it.

Step 2: Preparation of the carrier film

The pressure-sensitive adhesive composition for a carrier film prepared in step 1 was coated in a 75㎛ PET film (brand name XD537E, Toray Advanced Materials Co., Ltd.) coated with an antistatic layer on one side so that the thickness was 10㎛ on the uncoated side. Drying and curing in an oven at 140° C. for 6 minutes to prepare a carrier film.

Step 3: Preparation of the flexible optical element laminated film

The carrier film prepared in step 2 is protected by covering the surface of the pressure-sensitive adhesive layer with a liner PET film (brand name XD500P, Toray Advanced Materials). The liner PET film is a simple protection of the carrier adhesive layer and is removed before being laminated with the flexible optical device film.

Next, as shown in Figure 2, the carrier film 100 manufactured in step 2 on the surface of the flexible optical device film of the flexible optical device laminated film composed of a flexible optical device film 200, an adhesive layer 300 and a release film 400 ) Was combined.

[Example 2]

In step 1 of Example 1 (adhesive composition manufacturing process), the solid MQ resin was increased from 30 g to 35 g, and the same as in Example 1 was performed except that the organosiloxane polymer was reduced from 61 g to 56 g.

[Example 3]

In the step 1 of Example 1 (adhesive composition manufacturing process), the solid MQ resin was reduced from 30 g to 23 g, and the same was performed as in Example 1, except that the organosiloxane polymer was increased from 61 g to 68 g.

[Example 4]

In step 1 of Example 1 (adhesive composition manufacturing process), the same procedure as in Example 1 was performed, except that the molar ratio of the M unit and the Q unit in the solid MQ resin was 0.6:1.

[Example 5]

In step 1 of Example 1 (adhesive composition manufacturing process), the same procedure as in Example 1 was performed, except that the molar ratio of the M unit and the Q unit in the solid MQ resin was 4:1.

[Comparative Example 1]

In step 1 of Example 1 (adhesive composition manufacturing process), the same as in Example 1, except that the weight average molecular weight of the solid MQ resin was 8,000 g/mol and the molar ratio of the M unit and the Q unit was 0.5:1. Performed.

[Comparative Example 2]

In step 1 of Example 1 (adhesive composition manufacturing process), the same was performed as in Example 1, except that the molar ratio of the M unit and the Q unit in the solid MQ resin was 5:1.

[Comparative Example 3]

In step 1 of Example 1 (adhesive composition manufacturing process), the solid MQ resin was reduced from 30 g to 20 g, and the organosiloxane polymer was carried out in the same manner as in Example 1, except that the organosiloxane polymer was increased from 61 g to 71 g.

[Comparative Example 4]

In step 1 of Example 1 (adhesive composition manufacturing process), the same was performed as in Example 1, except that the solid MQ resin was increased from 30 g to 45 g, and the organosiloxane polymer was reduced from 61 g to 46 g.

[Comparative Example 5]

In step 1 of Example 1 (adhesive composition manufacturing process), the solid MQ resin was not mixed, and the same was performed as in Example 1, except that the organosiloxane polymer was increased from 61 g to 91 g.

[Comparative Example 6]

In step 1 of Example 1 (adhesive composition manufacturing process), the solid MQ resin was increased from 30 g to 91 g, and the same procedure as in Example 1 was performed except that the organosiloxane polymer was not mixed.

[Comparative Example 7]

In step 1 of Example 1 (adhesive composition manufacturing process), Example 1 except that the solid MQ resin was increased from 30 g to 34 g, the organosiloxane polymer was increased from 61 g to 65.5 g, and the organohydrogen silicon compound was not mixed. It was carried out in the same manner as.

[Comparative Example 8]

In step 1 of Example 1 (adhesive composition manufacturing process), the organosiloxane polymer was increased from 61 g to 61.5 g, and the same was performed as in Example 1, except that the platinum complex was not mixed.

The properties and content ratios of the components constituting the pressure-sensitive adhesive composition for a carrier film in Examples 1 to 5 and Comparative Examples 1 to 8 are shown in Tables 1 and 2 below.

Example 1 Example 2 Example 3 Example 4 Example 5 MQ resin
M/Q ratio 1.5
(1.5:1) 1.5
(1.5:1) 1.5
(1.5:1) 0.6
(0.6:1) 4
(4:1) MQ resin
Content(g) 30 35 23 30 30 Organosiloxane
Polymer (g) 61 56 68 61 61 Organohydrogen silicon
Compound (g) 8.5 8.5 8.5 8.5 8.5 Platinum complex
(g) 0.5 0.5 0.5 0.5 0.5

Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 MQ resin
M/Q ratio 0.5
(0.5:1) 5
(5:1) 1.5
(1.5:1) 1.5
(1.5:1) 1.5
(1.5:1) 1.5
(1.5:1) 1.5
(1.5:1) 1.5
(1.5:1) MQ resin
Content(g) 30 30 20 45 - 91 34 30 Organosiloxane
Polymer (g) 61 61 71 46 91 - 65.5 61.5 Organohydrogen Silicon Compound (g) 8.5 8.5 8.5 8.5 8.5 8.5 - 8.5 Platinum complex (g) 0.5 0.5 0.5 0.5 0.5 0.5 0.5 -

Physical properties of the carrier film and the flexible optical device laminated film prepared according to the above Examples and Comparative Examples were measured according to the following experimental examples, and the measured values are shown in Tables 3 and 4 below.

[Experimental Example]

(1) Low speed peeling force (gf/25mm)

The flexible optical device laminated film samples prepared in Examples and Comparative Examples were cut into 1 inch * 15 cm strips. When 60 minutes had elapsed after attachment, the peel force was measured by a 180° peel test method at a speed of 5 mm/sec (0.3 m/min) using a texture analyzer (TAXplus/50, SMS).

(2) High speed peeling force (gf/25mm)

The flexible optical element laminated film samples prepared in Examples and Comparative Examples were cut as in Experimental Example 1, and using a Texture Analyzer (TAXplus/50, SMS), at a speed of 40 mm/sec (2.4m/min). Peel force was measured by a 180˚ peel test method.

(3) Later peeling force (gf/25mm)

After leaving a sample of the same structure and size as the sample for which the initial peel strength was evaluated for 120 hours in a thermo-hygrostat under 85°C and 85%RH condition, using a Texture Analyzer (TAXplus/50, SMS), 5㎜/sec ( The peel force was measured using a 180° peel test method for a low-speed peeling force at a speed of 0.3m/min) and a high-speed peeling force at a speed of 40mm/sec (2.4m/min).

(4) Reliability evaluation

After leaving a sample of the same structure and size as the sample for which the initial peeling force was evaluated for 120 hours in a thermo-hygrostat under the conditions of 85°C and 85%RH, observe with the naked eye whether there is any lift, peeling, or bubbles on the adherend It was evaluated as a standard.

○: No bubbles or peeling phenomenon

X: A number of bubbles or peeling occur

(5) Evaluation of peeling properties

In a sample having the same structure and size as the sample for which the initial peel force was evaluated, the carrier film is placed on a flat table with the carrier film facing downward. The release film of the uppermost layer was peeled off using a double-sided adhesive hand roll while the film was flat, and at this time, whether the release film was peeled off, and whether the carrier film was lifted, peeled off, or bubbles were observed with the naked eye. In addition, when peeling the final carrier film, whether or not the flexible optical device film was peeled without deformation was visually observed, and evaluated based on the following criteria.

○: The release film is peeled off without lifting or bubbles of the carrier film, or there is no deformation of the optical device film during final carrier peeling.

X: The carrier film is lifted or bubbles are generated, the release film is not easily peeled off, or the optical device film is deformed at the time of final carrier peeling.

(6) Optical properties evaluation

The carrier films prepared in Examples and Comparative Examples were measured using a D65 light source using a Haze Meter (NDH 2000, Nippon Denshoku Co.), and total light transmittance and haze values were confirmed.

Example 1 Example 2 Example 3 Example 4 Example 5 Low speed peeling force (gf/25mm) 9.0 12.5 8.7 8.7 12.4 High speed peeling force (gf/25mm) 21.0 25.9 18.4 19.3 24.8 Later peel force (gf/25mm)-low speed 9.5 14.0 8.9 8.6 13.2 Later peel force (gf/25mm)-high speed 21.7 27.8 19.0 19.3 25.2 Reliability evaluation ○ ○ ○ ○ ○ Evaluation of peeling properties ○ ○ ○ ○ ○ Total light transmittance 90.2 90.3 90.2 90.3 90.1 Haze 3.1 3.2 3.1 3.0 3.2

Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 Low speed peeling force (gf/25mm) 8.4 13.5 7.1 15.7 3.2 50.7 35.2 25.4 High speed peeling force (gf/25mm) 19.2 25.4 18.1 37.3 7.0 Not peelable 102.8 84.2 Later peel force (gf/25mm)-low speed 11.8 21.4 7.5 19.8 3.5 Not peelable 47.2 32.7 Later peel force (gf/25mm)-high speed 23.9 36.7 18.7 43.2 7.6 Not peelable 113.5 98.4 Reliability evaluation ○ ○ X X X X X X Evaluation of peeling properties ○ X X X X X X X Total light transmittance 83.7 85.7 89.9 90.1 90.3 75.9 88.3 87.9 Haze 6.8 4.5 2.9 3.2 2.8 10.9 4.2 4.6

As shown in Table 3, in the case of Examples 1 to 5, compared with Comparative Examples 1 to 8, the low-speed peeling force is relatively high, and the high-speed peeling force is low, so that excellent effects are satisfied without problems in the evaluation of reliability and peeling properties. . In general, as the peeling rate increases, the peeling force increases. However, it is advantageous for the physical properties of the pressure-sensitive adhesive to slowly increase the peeling force even when the peeling speed increases as the increase in the peeling force is gentle with the increase of the peeling speed. Accordingly, in Examples 1 to 5 according to the present invention, compared to Comparative Examples 1 to 8, the low-speed peeling force was high, while the high-speed peeling force was low, and the amount of increase in peeling force according to the increase of the peeling rate was gentle, and thus it was shown in the peeling characteristics evaluation results. It can be seen that physical properties as a pressure-sensitive adhesive are excellent.

In the case of Comparative Example 1, the molar ratio of the M unit and the Q unit is 0.5:1, and the molar ratio of the M unit is low, so that the peel force can be stably maintained while out of the limited range, but the compatibility between the MQ resin and the organosiloxane polymer is poor, and the transmittance It can be seen that this drop, the haze greatly increases, and impairs physical properties of the carrier film.

In the case of Comparative Example 2, the molar ratio of the M unit and the Q unit is 5:1, and the structure of the MQ resin is changed while out of the limited range due to the high molar ratio of the M unit, thereby improving the compatibility with the organosiloxane polymer. The measured values at low speed and high speed are large, and it can be confirmed that the change of peel force over time occurs from the result that the difference between the low-speed peel force and the high-speed peel force measured in the general state is large.

In the case of Comparative Example 3, the ratio of the MQ resin did not fall within a limited range, so that the high-speed peeling force was low, and the peeling was easily performed, but the low-speed peeling force was reduced, resulting in defects in reliability and peeling characteristics. In addition, in the case of Comparative Example 4, on the contrary, as the ratio of the MQ resin was out of the range, the low-speed peeling force was stably high, but the high-speed peeling force was high. It can be seen that the effect cannot be implemented.

In the case of Comparative Example 5, since the MQ resin was not included, it could be confirmed that the peeling property was greatly degraded because the adhesion to the flexible optical device film, which was the adherend, was not possible and the peeling force could not be realized.

In the case of Comparative Example 6, it can be seen that the peeling force is too strong and high-speed peeling is impossible, and the peeling characteristics and optical characteristics are greatly reduced.

Since Comparative Example 7 does not contain an organohydrogen silicon compound, it can be confirmed that the hardening is not performed and the peeling force is increased, and the interfacial peeling is not performed, resulting in peeling defects.

In the case of Comparative Example 8, since the platinum complex required for the reaction was not included, it was confirmed that there was no catalyst required for the curing reaction, so that the curing was not performed, the peeling force increased, and the peeling defect occurred.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements by those skilled in the art using the basic concept of the present invention defined in the following claims are also present. It belongs to the scope of rights of

100: carrier film
110: antistatic layer
120: base film
130: carrier adhesive layer
200: flexible optical device film
300: adhesive layer
400: release film

Claims (11)

MQ resin of Formula 1, an organosiloxane polymer of Formula 2, an organohydrogen silicon compound, and a hydrosilylation reaction catalyst,
[Formula 1]

And R ₃ is an alkyl group,
[Formula 2]
R ₁ R ₂ ViSiO(R ₃ R ₄ SiO) _n SiR ₅ R ₆ Vi
And, R ₁ , R ₂ , R ₃ , R ₄ , R ₅ and R ₆ may be the same as or different from each other as an alkyl group or a phenyl group having 1 to 6 carbon atoms, and n is an integer of 1 or more, an adhesive composition for a carrier film. The method of claim 1,
The molar ratio of the M unit and the Q unit of the MQ resin is 0.6:1 to 4:1, the pressure-sensitive adhesive composition for a carrier film. The method of claim 1,
The weight average molecular weight of the organosiloxane polymer is 200,000 to 700,000 g/mol, an adhesive composition for a carrier film. The method of claim 1,
The weight ratio of the MQ resin and the organosiloxane polymer is 25:75 to 40:60, the pressure-sensitive adhesive composition for a carrier film. The method of claim 1,
The organohydrogen silicon compound is one or more crosslinked organohydrogensiloxane compounds having an average of two or more Si-H bonds per molecule, the pressure-sensitive adhesive composition for a carrier film. Base film;
A carrier adhesive layer positioned on one side of the base film; And
It includes an antistatic layer located on the opposite surface of the base film,
The carrier adhesive layer is a carrier adhesive layer of the adhesive composition for a carrier film according to any one of claims 1 to 5, a carrier film. The method of claim 6,
The carrier pressure-sensitive adhesive layer has a peeling force of 8 gf/25 mm or more and 20 gf/25 mm or less as measured at a peel rate of 0.3 m/min. The method of claim 6,
The carrier pressure-sensitive adhesive layer has a peeling force of 15 gf/25 mm or more and 35 gf/25 mm or less as measured at a peel rate of 2.4 m/min. The method of claim 6,
The carrier film has a transmittance of 85% or more and a haze of 5% or less. The method of claim 6,
The surface resistance of the antistatic layer is 10 ⁴ to 10 ⁹ Ω/□, a carrier film. The method of claim 6,
The carrier pressure-sensitive adhesive layer was left for 120 hours in a thermo-hygrostat under conditions of 85°C and 85%RH, and the low-speed peeling force measured at a rate of 5 mm/sec was 8 to 20 gf/25 mm, and the high-speed measured at a rate of 40 mm/sec. A peel force of 15 to 35 gf / 25 mm, a carrier film.

Images