KR102222827B1 - Group prober system and installation method thereof - Google Patents

Abstract

The present invention relates to a group prober system and an installation method thereof, and more particularly, to a group prober system controlled to individually inspect a wafer supplied by a plurality of probers, and a method of installing the same. To this end, there is provided a group prober system including a loader for supplying a plurality of wafers, and an inspection unit including a plurality of probers controlled to individually inspect the wafers supplied from the loader.

Description

GROUP PROBER SYSTEM AND INSTALLATION METHOD THEREOF}

The present invention relates to a group prober system and an installation method thereof, and more particularly, to a group prober system controlled to individually inspect a wafer supplied by a plurality of probers, and a method of installing the same.

In a semiconductor wafer on which a plurality of semiconductor elements are formed, a prober is used as a wafer inspection apparatus in order to inspect the electrical properties of each semiconductor element. The prober includes a disk-shaped probe card facing the wafer, and the probe card includes a contact probe, which is a plurality of columnar contact terminals disposed to face each electrode pad or each solder bump of a semiconductor element of the wafer.

In the prober, each contact probe of the probe card makes contact with the electrode pad or solder bump of the semiconductor element, and the electric circuit conducts by flowing an inspection signal from each contact probe to the electric circuit of the semiconductor element connected to each electrode pad or each solder bump. Check the condition, etc.

In recent years, in order to improve wafer inspection efficiency, a system has been developed in which probers are stacked in multiple stages to inspect semiconductor elements of a wafer in a plurality of probers. Since the size of the entire system is large in a system composed of such multi-stage probers, it is an important issue to compose the size of the entire system compactly. Publication No. 10-2013-0023065 (published on March 7, 2013) discloses an inspection apparatus and inspection method for a light-emitting device.

In addition, a prober system composed of multi-stage probers is important for maintenance and repair of complex and heavy components such as, for example, a tester, pogo frame, and wafer chuck. It was not easy to maintain and repair the heavy components by separating them from the prober.

In addition, in the case of a prober system composed of multi-stage probers, it is required to be manufactured to facilitate installation of the entire prober system because it weighs a lot and occupies a lot of installation space.

In addition, the prober system consisting of multi-stage probers is used to move wafers from a wafer storage container, e.g., a FOUP, to a plurality of probers from a wafer storage container, e.g., a FOUP, to a plurality of probers. The inspection process must be performed in the bur, and it is very important to shorten the inspection process time in such a process.

An object of the present invention is to provide a group prober system configured to shorten an inspection process time as a multistage group prober system and a method of installing the same.

Another object of the present invention is to provide a group prober system in which the size of the entire system is compactly configured and a method for installing the same.

Another object of the present invention is to provide a group prober system configured to facilitate maintenance and repair of a group prober system loaded in multiple stages, and a method of installing the same.

Another object of the present invention is to provide a group prober system manufactured to facilitate installation of the entire prober system and a method for installing the same.

In order to achieve the above object, according to an aspect of the present invention, an inspection unit including a loader for supplying a plurality of wafers, and a plurality of probers controlled to individually inspect the wafers supplied from the loader. Including a group prober system is provided.

In this case, the plurality of probers of the inspection unit may be arranged side by side in a transverse direction or a vertical direction, or a transverse direction and a vertical direction with respect to the bottom surface on which the prober is placed.

In this case, the inspection unit includes a plurality of horizontal frames extending in a horizontal direction and disposed on the front and rear sides of the prober, and disposed in a direction perpendicular to the plurality of horizontal frames to support between the plurality of horizontal frames. It includes a plurality of vertical frames, and the prober may be supported by the horizontal frame.

In this case, in the plurality of probers installed on the plurality of horizontal frames, the horizontal frames and the probers may be alternately stacked and coupled from a bottom surface to an upward direction.

In this case, an interval between a pair of vertical frames disposed on both sides of the prober may be formed to be narrower than a width in the transverse direction of the prober.

At this time, each of the plurality of probers, a prober housing including a base plate and a pair of side plates provided on both sides of the base plate, an XY transfer module provided on an upper portion of the base plate, and the XY transfer A rotation module installed on the top of the module, a tilt height adjustment module installed on the rotation module, and a wafer chuck installed on the tilt height adjustment module and on which a wafer to be inspected is mounted.

In this case, a head stage coupled to an upper portion of the pair of side plates, a probe card coupled to a lower portion of the head stage, and a tester coupled to an upper portion of the head stage to inspect the probe card may be included.

In this case, a tester fixing module may be provided on the upper part of the head stage so that the tester is movable from the upper part of the head stage in a sliding manner.

In this case, the tilt height adjustment module may include a plurality of supports disposed on the rotation module in an up-down direction to support the lower surface of the wafer chuck.

In this case, the head stage may be formed to be slidable in a direction opposite to the loader with respect to the pair of side plates.

In this case, the XY transfer module may include a Y-axis guide rail formed on the base plate, and an X-axis transfer member movable on the Y-axis guide rail and having an X-axis guide rail formed on an upper surface thereof.

At this time, further comprising an auxiliary guide member that can be coupled to the base plate of the prober housing from the rear side of the inspection unit so that the X-axis transfer member can be discharged to the rear side of the prober housing, on the auxiliary guide member A secondary guide rail connected to the Y-axis guide rail may be provided.

In this case, an electric device for controlling a plurality of probers may be disposed on at least one of a side surface or a rear surface of the inspection unit.

Meanwhile, in a method of installing a group prober system including a plurality of probers controlled to individually inspect a wafer, a plurality of horizontal frames extending in a horizontal direction and disposed at the front and rear sides of the prober And installing the prober to be supported by the plurality of horizontal frames, and a plurality of vertical frames disposed in a direction perpendicular to the plurality of horizontal frames to support between the plurality of horizontal frames. It may include the step of installing.

At this time, after the step of installing the plurality of vertical frames, the steps of installing the plurality of horizontal frames to be supported by the plurality of vertical frames, and the step of mounting the prober to be supported by the plurality of horizontal frames are further performed. Can include.

In this case, the step of installing the plurality of vertical frames includes installing the plurality of vertical frames so that the gap between the pair of vertical frames disposed on both sides of the prober is formed to be narrower than the width in the transverse direction of the prober. It can be a step.

According to an embodiment of the present invention, a plurality of probers for individually inspecting a plurality of wafers are provided, so that the inspection process time can be shortened.

In addition, a plurality of probers are arranged in the transverse or vertical directions or in the transverse and vertical directions so as to be supported by the horizontal frame. In particular, since the gap between the pair of vertical frames is formed narrower than the transverse width of the prober, the entire The size of the system can be configured to be compact.

In addition, since the tester provided in the prober is configured to be slidable on the head stage, the size of the prober housing can be compactly configured.

In addition, since the inclination and height of the wafer chuck are directly adjusted through the inclination height adjustment module, there is no need to adjust the inclination or height of the tester, thus simplifying the configuration.

In addition, since the tester, the head stage, and the wafer chuck slide to the rear of the inspection unit and are exposed to the outside, maintenance and repair of the group prober system stacked in multiple stages is facilitated.

In addition, after installing the horizontal frame, the prober is mounted, the vertical frame is installed, and the group prober system is installed by repeating the process of installing the horizontal frame and the prober on the vertical frame. It becomes easy to install.

1 is a perspective view showing a group prober system of the present invention.
2 is a perspective view showing an inspection unit of the present invention.
3 is a front view showing the inspection unit of the present invention.
4 is a plan view showing a horizontal frame of the present invention.
5 is a front view showing a state in which a prober is disposed between a horizontal frame and a vertical frame of the present invention.
6 is a front view showing the prober of the present invention.
7 is a perspective view showing a tester and a tester fixing module of the present invention.
8 is an exploded perspective view showing a tester and a tester fixing module of the present invention.
9 is an exploded perspective view of the tester fixing module of the present invention.
10 is a rear view showing a state in which the tester is spaced apart from the head stage by a predetermined interval by the tester fixing module of the present invention.
11 is a side view showing a state in which the tester of the present invention has moved to the rear of the inspection unit.
12 is an exploded perspective view of the tilt height adjustment module of the present invention.
13 and 14 are schematic views showing a state in which the height and inclination of the wafer chuck are adjusted by the tilt height adjustment module of the present invention.
15 is a perspective view showing a state in which the head stage of the present invention moves to the rear of the inspection unit.
16 and 17 are perspective views showing the head stage fixing module of the present invention.
18 is a perspective view showing an XY transfer module of the present invention.
19 is a perspective view showing an auxiliary guide member of the present invention.
20 is a perspective view showing a state in which the auxiliary guide member is coupled to the base plate of the present invention.
21 and 22 are flowcharts illustrating a method of installing a group prober system according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. The present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and the same reference numerals are assigned to the same or similar components throughout the specification.

In the present specification, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance. In addition, when a part such as a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where the other part is "directly above", but also the case where there is another part in the middle. Conversely, when a part of a layer, film, region, plate, etc. is said to be "below" another part, this includes not only the case where the other part is "directly below", but also the case where there is another part in the middle.

1 is a perspective view showing a group prober system of the present invention. As shown in FIG. 1, according to an aspect of the present invention, a loader 10 for supplying a plurality of wafers 1 and a wafer 1 supplied from the loader 10 are individually controlled to be inspected. A group prober system including an inspection unit 100 having a plurality of probers 200 is provided.

The loader 10 is provided with a loading section 11 on which a plurality of wafers 1 are loaded, and a transfer section 12 for moving the wafers 1 loaded on the loading section 11 to the inspection section 100. As shown in FIG. 1, a wafer receiving unit 11a such as FOUP is provided in the stacking unit 11 for storing the wafer 1, and a cleaning wafer for cleaning the inspection unit 100 is mounted. A pre-alignment module 11d for pre-aligning the cleaned wafer tray 11c and the wafer 1 to be inspected may also be provided.

As described above, in the inspection unit 100, each prober 200a, 200b, 200c, 200d is provided to individually inspect the wafer 1 supplied from the loader 10, so that the inspection process time can be shortened. do.

Figure 2 is a perspective view showing the inspection unit of the present invention, Figure 3 is a front view showing the inspection unit of the present invention.

As shown in FIG. 2, a plurality of probers 200 of the inspection unit 100 may be arranged side by side in a transverse direction or a vertical direction, or a transverse direction and a vertical direction with respect to the bottom surface on which the prober 200 is placed. If the probers 200 are arranged in this way, a plurality of probers 200 can be compactly arranged.

At this time, as shown in FIG. 3, the inspection unit 100 extends in the horizontal direction and is disposed on the front and rear sides of the prober 200. It includes a plurality of vertical frames 120 arranged in a vertical direction to support between the plurality of horizontal frames 110, and the prober 200 may be supported by the horizontal frame 110.

That is, the horizontal frame 110 has independent rigidity while supporting the prober 200, and the vertical frame 120 is configured to support the horizontal frame 110 so that the prober 200 is vertically positioned. It can also be stably arranged.

The plurality of probers 200 installed on the plurality of horizontal frames 110 may be arranged in a manner in which the horizontal frames 110 and the probers 200 are alternately stacked and coupled from the bottom to the upper side. A plurality of probers 200 can be compact and stably disposed.

4 is a plan view showing a horizontal frame of the present invention. As shown in FIG. 4, the horizontal frame 110 includes a horizontal frame 110 disposed in front of the inspection unit 100, and a horizontal frame disposed at the rear. Including 110, a side frame 130 disposed to face each other is provided between the horizontal frames 110 disposed to face each other.

The prober 200 is positioned between the horizontal frame 110 and the side frame 130 disposed opposite to each other. The prober is mounted between the horizontal frame 110 and the side frame 130 adjacent to each other so that the prober 200 can be stably disposed between the horizontal frame 110 and the side frame 130 that are disposed opposite to each other. The part 111 may be provided. That is, as shown in FIG. 4, prober seating portions 111 may be provided at each of the four corners between the horizontal frame 110 and the side frame 130 disposed opposite to each other, and the prober 200 ) May be disposed in such a way that it is seated on the prober seat 111.

In this case, the upper surface of the prober seat 111 on which the prober 200 is seated may be configured to be disposed at a position lower than the upper surface of the horizontal frame 110. In this configuration, since the height of the top of the prober 200 is lowered based on the state in which the prober 200 is seated on the prober seating portion 111, the height of the entire system is reduced to make it compact.

Alternatively, it is also possible to form a step portion extending downward to the horizontal frame 110 and the side frame 130, and configure the prober 200 to be seated on the upper surface of the step portion.

5 is a front view showing a state in which a prober is disposed between a horizontal frame and a vertical frame of the present invention.

As shown in FIG. 5, the distance d1 between the pair of vertical frames 120 disposed on both sides of the prober 200 is formed to be narrower than the lateral width w of the prober 200. I can.

That is, the vertical frame 120 is arranged narrowly so that the vertical frame 120 and the prober 200 overlap by a predetermined length (w-d1) when viewed from the front of the inspection unit 100. This configuration reduces the overall system width and becomes compact.

6 is a front view showing the prober of the present invention, as shown in FIG. 6, as long as each of the plurality of probers 200 is provided on both sides of the base plate 211 and the base plate 211 A prober housing 210 including a pair of side plates 212, an XY transfer module 220 provided on an upper portion of the base plate 211, and a rotation module 230 installed on an upper portion of the XY transfer module 220 ), and a tilt height adjustment module 240 installed on the top of the rotation module 230, and a wafer chuck 250 installed on the tilt height adjustment module 240 and on which the wafer 1 to be inspected is seated. I can.

That is, in each of the above-described probers 200, the XY transfer module 220 so that the wafer 1 moves on the XY plane inside the prober housing 210 composed of the base plate 211 and the side plate 212. And, a rotation module 230 for rotating the wafer 1, and a tilt height adjustment module 240 for adjusting the tilt and height of the wafer 1 are provided, and the wafer chuck 250 on which the wafer 1 is mounted. ) Is installed on the tilt height adjustment module 240.

In this way, if the wafer 1 is configured to move, rotate, and adjust the inclination or height on a plane, the position, inclination, and height of the wafer can be adjusted to correspond to the placement of the probe card 270. Since it is possible to stably contact the wafer 1, accurate inspection of the wafer 1 becomes possible.

The above-described tilt height adjustment module 240 may be configured to be installed under the rotation module 230. That is, the tilt height adjustment module 240 is first installed on the top of the XY transfer module 220, the rotation module 230 is installed on the top of the tilt height adjustment module 240, and the wafer on the rotation module 230 It is to install the chuck 250. In this way, the rotation module 230 and the tilt height adjustment module 240 may be installed by changing their order according to design specifications.

In addition, the head stage 260 is coupled to the upper portion of the pair of side plates 212, the probe card 270 coupled to the lower portion of the head stage 260, and the head stage 260 to inspect the probe card 270. It may also include a tester 280 coupled to the upper portion of the.

That is, the wafer 1 mounted on the wafer chuck 250 comes into contact with the probe provided in the probe card 270, and in this contact state, the tester 280 inspects the defect of the wafer 1. The head stage 260 is provided so that the probe card 270 and the tester 280 can be stably fixed and supported. The above-described probe card 270 may be coupled to the fog frame 261 provided in the head stage 260.

7 is a perspective view showing the tester and the tester fixing module of the present invention, as shown in FIG. 7, the tester 280 is moved from the top of the head stage 260 in a sliding manner on the top of the head stage 260 A tester fixing module 281 may be provided so as to be possible.

That is, the tester 280 is disposed on the head stage 260 and is configured to be movable from the head stage 260 in a sliding manner by the tester fixing module 281 so that the tester 280 is moved from the head stage 260. It can be separated or stably placed.

8 is an exploded perspective view showing a tester and a tester fixing module of the present invention, and FIG. 9 is an exploded perspective view of the tester fixing module of the present invention.

8 and 9, the tester 280 may be provided with a tester guide 282 extending along the sliding direction of the tester 280 so as to be coupled to the tester fixing module 281. The tester guide 282 is configured to be movable along the first guide 283b, which will be described later, through which the tester 280 is configured to be slidable.

At this time, the tester fixing module 281 includes a tester guide connecting member 283 and a tester guide connecting member 283 for sliding the tester 280 from the top of the head stage 260 to the head stage 260. It may include a tester support member 284 fixed to the upper surface.

The tester fixing module 281 may be configured to stably slide the tester 280 having a large load by being disposed on both sides of the tester 280 facing each other.

At this time, the tester guide connecting member 283 is arranged to face the side surface of the tester 280 on one side, and the other side is the tester fixing support 241 connected to the tester support member 284, and the tester 280 in a sliding manner. It may include a first guide 283b supporting the tester guide 282 to move.

The first guide 283b may be composed of a plurality of guide rollers, and the tester guide 282 can slide smoothly along the guide rollers.

In addition, the tester guide connecting member 283 further includes a second guide 283c for linearly moving the tester fixing support 241 upward so that the tester 280 is spaced upwardly at a predetermined interval with respect to the head stage 260. I can.

That is, before sliding the tester 280 to the rear of the inspection unit 100, it is necessary to separate the tester 280 and the head stage 260 by a predetermined distance (d2), and the tester fixing support 241 is the second In the process of moving upward along the guide 283c, the tester 280 and the head stage 260 may be spaced apart.

At this time, as shown in Figs. 8 and 9, the tester guide connecting member 283 is provided with an elastic member 283e, so that when the tester fixing support 241 moves upward, it is easily moved with a small force using an elastic force. It is desirable to configure this to be possible.

In addition, the above-described tester support member 284 includes a driving lever 284a capable of rotating at a predetermined angle, and a cam 284b provided on the driving lever 284a to rotate together with the driving lever 284a. Including, such a cam (284b) may support the driven roller (283d) provided in the tester guide connecting member (283).

That is, the handle 30 may be provided so that the user can rotate the driving lever 284a, and when the user rotates the driving lever 284a using the handle 30, the driving lever 284a The cam 284b provided in the unit rotates together, and as the cam 284b rotates, the driven roller 283d provided in the tester guide connecting member 283 moves upward. That is, in the process of moving the driven roller 283d upward, the tester fixing support 241 can be easily moved upward even with a small force by the elastic force of the elastic member 283e.

The driven roller 283d may be provided on the side support plate 284c of the tester guide connecting member 283.

At this time, as described above, the tester guide connection member 283 and the tester support member 284 are respectively disposed on opposite sides of the tester 280 to stably slide the tester 280 having a large load. It is desirable. In this case, only one of the tester support members 284 is provided with a driving lever 284a, and the tester support member 284 provided with the driving lever 284a and the tester support without the driving lever 284a It is also possible to further include an interlocking member capable of interlocking the members 284 so that the tester support members 284 interlock with each other. As shown in Fig. 9, as an example of such an interlocking member, it may be composed of a pulley 285 and a belt 286.

FIG. 10 is a rear view showing a state in which the tester is spaced apart from the head stage by a predetermined interval by the tester fixing module of the present invention. As shown in FIG. 10, when the driving lever 284a moves in the vertical direction, the cam 284b moves the driven roller 283d upward, and accordingly, the tester guide connecting member 283 equipped with the driven roller 283d also moves upward, and eventually fixedly supported by the tester guide connecting member 283. The tested tester 280 is also spaced apart from the head stage 260 by a predetermined distance d2.

11 is a side view showing a state in which the tester of the present invention is moved to the rear of the inspection unit, as described above, the inspection unit 100 in a state where the tester 280 is spaced apart from the head stage 260 by a predetermined distance d2 It may be completely separated from the inspection unit 100 for maintenance and repair by sliding to the rear of the unit.

That is, since the tester 280 provided in the prober 200 is configured to be slidable on the head stage 260, the size of the prober housing 210 can be compactly configured.

12 is an exploded perspective view of the tilt height adjustment module of the present invention, Figures 13 and 14 are schematic diagrams showing a state in which the height and inclination of the wafer chuck are adjusted by the tilt height adjustment module of the present invention.

As shown in FIG. 12, the tilt height adjustment module 240 may include a plurality of supports 241 disposed on the rotation module 230 in the vertical direction to support the lower surface of the wafer chuck 250. Each of these supports 241a, 241b, 241c may be configured such that a step motor or the like is mounted therein such that the upper end rises or descends.

An upper plate 242 may be provided between the support 241 and the wafer chuck 250, and through this, the wafer chuck 250 can be easily separated when maintenance or repair is required.

A plurality of at least two or more of these supports 241 may be mounted. That is, the support 241 is not necessarily limited to three, and it is possible to configure the support 241 according to the design specifications, such as the six support 241.

In this case, in the case of having three supports 241, they may be arranged in a triangular shape so as to be uniformly spaced based on the center point of the upper surface of the rotation module 230. Meanwhile, each of the plurality of supports 241 moves along the vertical direction with respect to the lower plate, but can be driven independently of each other, and the height and inclination of the wafer chuck 250 are determined according to the height of each of the supports 241. Can be adjusted.

In addition, since the height and inclination of the wafer chuck 250 is adjusted by using the three supports 241 in this way, the remaining areas except for the three areas in which the supports 241 are disposed can be used in various ways for other purposes.

As shown in (a) of FIG. 13, in a state in which the wafer chuck 250 is kept horizontal, as shown in (b) and (c) of FIG. 13, the inclination of the wafer chuck 250 is generated. However, even when the inclination occurs in this way, the position of the center of the wafer chuck 250 needs to be configured so as not to deviate from a straight line.

To this end, as shown in (b) of FIG. 13, when the support 241 rises a certain height h1, the relative position of the support 241 and the wafer chuck 250 is configured to change by a certain distance L1. It is to do. That is, when the support 241 rises, the wafer chuck 250 is configured to slip by a predetermined distance L1 so that the center of the wafer chuck 250 does not deviate from a straight line.

Likewise, as shown in (c) of FIG. 13, when the support 241 descends a certain height h2, the relative position of the support 241 and the wafer chuck 250 changes by a certain distance L2. It is desirable to do it. That is, even when the support 241 is lowered, the wafer chuck 250 is configured to slip by a predetermined distance L2 so that the center of the wafer chuck 250 does not deviate from a straight line.

That is, as shown in FIG. 14, when the support 241 rises by 100 μm, an inclination as much as θ1 occurs, and the wafer chuck 250 is inclined at an angle of θ2, resulting in a slippage as much as L2. .

In this way, since the inclination and height of the wafer chuck 250 are directly adjusted through the inclination height adjustment module 240, there is no need to adjust the inclination or height of the tester 280, thus simplifying the configuration and making the system compact. You will be able to.

15 is a perspective view showing a state in which the head stage of the present invention moves to the rear of the inspection unit.

As shown in FIG. 15, the head stage 260 may be formed to be slidable in a direction opposite to the loader 10 with respect to the pair of side plates 212. That is, the head stage 260 is configured to slide in the opposite direction of the loader 10, that is, to the rear of the inspection unit 100, so that even when a plurality of probers 200 are stacked and disposed, the head stage 260 ) Is moved to enable maintenance and repair.

16 and 17 are perspective views showing the head stage fixing module of the present invention.

As described above, when sliding the head stage 260 backwards for maintenance and repair, it is necessary to stably slide the head stage 260, and in a general case where the wafer 1 is inspected, the head stage (260) needs to be fixed stably.

As shown in FIGS. 16 and 17, the head stage fixing module 290 is provided for stable sliding and fixing of the head stage 260 as described above.

For the stable sliding movement of the head stage 260, the head stage fixing module 290 includes a fixing rod 291 fixedly mounted on a pair of side plates 212, and the head stage 260 is a fixing rod. It may be configured to slide along the 291. In this case, a guide roller 292 may be provided on the fixing rod 291, and a guide rail 293 engaged with the guide roller 292 may be provided on a side surface of the head stage 260.

The fixing rod 291 is disposed so that the inner surface thereof contacts the side surface of the head stage 260 and is preferably configured to be fixed to the upper edge of the side plate 212. The above-described guide roller 292 is mounted on the inner side of the fixing rod 291 facing the side surface of the head stage 260, and the guide rail 293 is the head stage 260 so as to engage with the guide roller 292. It is formed on the side of the guide roller 292 by the movement of the head stage 260 is configured to rotate.

The head stage 260 is configured to be movable in a sliding manner from the side plate 212 and the fixing rod 291 by the guide roller 292, so that the head stage 260 protrudes to the rear of the inspection unit 100 and is separated. As a result, a configuration such as the wafer chuck 250 located under the head stage 260 can be completely exposed for maintenance and repair.

On the contrary, for stable fixing of the head stage 260, the head stage fixing module 290 is mounted on a pair of side plates 212, and a cam provided with a protrusion 294b having an inclined surface 294a extending upward at a predetermined angle. A guide 294 and a cam roller 295 disposed between the cam guide 294 and the head stage 260 may be further included.

The cam guide 294 is mounted on the upper end of the side plate 212 facing the lower surface of the head stage 260, and the cam roller 295 is inserted and mounted between the cam guide 294 and the lower surface of the head stage 260. do. A protrusion 294b having an inclined surface 294a is provided on the upper surface of the cam guide 294 so that the height of the cam roller 295 changes during the relative movement of the cam roller 295 along the inclined surface 294a. . Meanwhile, a knob 296 connected to one end of the cam guide 294 is provided to move the cam guide 294 in the front and rear direction, and the cam guide 294 moves forward or backward according to the rotation direction of the knob 296. Will move.

That is, the lower surface of the head stage 260 is lifted upward by the height of the inclined surface 294a of the cam guide 294 using the cam roller 295, so that the side surface of the head stage 260 is connected to the fixing rod 291. The head stage 260 can be stably fixed by making it tightly attached.

18 is a perspective view showing the XY transfer module of the present invention, the XY transfer module 220 is a Y-axis guide rail 221 formed on the base plate 211, as shown in Figure 18, and the Y-axis guide It is movable on the rail 221 and may include an X-axis transfer member 222 having an X-axis guide rail 222A formed on an upper surface thereof.

That is, the wafer chuck 250 moves in the X-axis direction along the X-axis guide rail 222A on the X-axis transfer member 222, and this X-axis transfer member 222 is along the Y-axis guide rail 221. It is configured to move in the Y-axis direction so that the wafer chuck 250 can move in the X-axis and Y-axis directions.

For the maintenance and repair of the wafer chuck 250, it is necessary to move the wafer chuck 250 to be exposed to the rear of the inspection unit 100, and the X-axis transfer member 222 described above is It may further include an auxiliary guide member 223 that can be coupled to the base plate 211 of the prober housing 210 at the rear side of the inspection unit 100 so as to be discharged to the rear side.

19 is a perspective view showing an auxiliary guide member of the present invention, as shown in FIG. 19, an auxiliary guide rail 223a connected to the Y-axis guide rail 221 may be provided on the auxiliary guide member 223 have.

20 is a perspective view showing a state in which the auxiliary guide member is coupled to the base plate of the present invention, as shown in FIG. 20 after the X-axis transfer member 222 moves along the Y-axis guide rail 221 , It is possible to be completely discharged to the outside of the prober housing 210 along the auxiliary guide rail (223a) provided in the auxiliary guide member 223.

The base plate 211 is formed with a detachable portion 211a to which the auxiliary guide member 223 is coupled, and a coupling portion 223b coupled to and supported by the detachable portion 211a is formed on the auxiliary guide member 223. I can.

In this case, as shown in FIGS. 2 and 3, an electric device 300 for controlling the plurality of probers 200 may be disposed on the side of the inspection unit 100. That is, the control unit for controlling each prober 200 is integrated and disposed on the electric device 300, thereby making the system compact. Such an electric unit 300 may be disposed on the rear surface of the inspection unit 100, or may be disposed on both the side and rear surfaces of the inspection unit 100. That is, it is possible to configure the system compactly by arranging the electric device 300 on at least one of the side or rear side of the inspection unit 100.

At this time, a cable is provided so that each prober 200 and the electric unit 300 can be electrically connected to each other, but a space through which such cables can pass is formed in the horizontal frame 110 and the vertical frame 120. By preventing the cable from being exposed to the outside, it is possible to prevent the cable from being damaged during the maintenance and repair process of the prober 200.

21 and 22 are flowcharts illustrating a method of installing a group prober system according to the present invention.

On the other hand, as shown in FIG. 21, in the method of installing a group prober system including a plurality of probers 200 controlled to individually inspect the wafer 1, it is extended in the horizontal direction and Installing a plurality of horizontal frames 110 disposed on the front and rear sides of the bur 200 (S100), and mounting the prober 200 to be supported by the plurality of horizontal frames 110 (S200) , And installing a plurality of vertical frames 120 arranged in a vertical direction with respect to the plurality of horizontal frames 110 to support between the plurality of horizontal frames 110 (S300 ).

That is, the group prober system can be compactly installed by installing the horizontal frame 110 and installing the vertical frame 120 after the prober 200 is mounted on the horizontal frame 110.

In addition, after the step of installing the plurality of vertical frames 120 (S300), as shown in FIG. 22, the step of installing the plurality of horizontal frames 110 so as to be supported by the plurality of vertical frames 120 (S400) ), and mounting the prober 200 to be supported on the plurality of horizontal frames 110 (S500).

Through this, a plurality of probers 200 can be arranged vertically, and the group prober system can be compactly installed while repeating this process.

In addition, in the step of installing a plurality of vertical frames 120 (S300), the distance d1 between the pair of vertical frames 120 disposed on both sides of the prober 200 is It may be a step of installing a plurality of vertical frames 120 so as to be formed narrower than the width w in the transverse direction.

That is, after installing the horizontal frame 110, the prober 200 is seated, and then the vertical frame 120 is installed, but the distance d1 between the pair of vertical frames 120 is The system can be compactly installed by making it narrower than the lateral width w of 200.

Although an embodiment of the present invention has been described, the spirit of the present invention is not limited to the embodiments presented in the present specification, and those skilled in the art who understand the spirit of the present invention add or change components within the scope of the same idea. Other embodiments may be easily proposed by deletion, addition, and the like, but it will be said that this is also within the scope of the present invention.

1: wafer 10: loader
11: mounting portion 11a: wafer storage portion
11b: tray 11c: cleaning wafer tray
11d: pre-alignment module 12: transfer unit
30: handle 100: inspection unit
110: horizontal frame 111: prober mounting portion
120: vertical frame 130: side frame
200: prober
200a, 200b, 200c, 200d: each prober
210: prober housing 211: base plate
211a: detachable part 212: side plate
220: XY transfer module 221: Y-axis guide rail
222: X-axis transfer member 222a: X-axis guide rail
223: auxiliary guide member 223a: auxiliary guide rail
223b: coupling unit 230: rotation module
240: tilt height adjustment module 241: support
241a, 241b, 241c: each support
242: upper plate 250: wafer chuck
260: head stage 261: pogo frame
270: probe card 280: tester
281: tester fixing module 282: tester guide
283: tester guide connecting member 283a: tester fixing support
283b: first guide 283c: second guide
283d: driven roller 283e: elastic member
284: tester support member 284a: driving lever
284b: cam 284c: side support plate
285: pulley 286: belt
290: head stage fixing module 291: fixing rod
292: guide roller 293: guide rail
294: cam guide 294a: inclined surface
294b: protrusion 295: cam roller
296: knob 300: full length

Claims (16)

A loader for supplying a plurality of wafers; And
An inspection unit including a plurality of probers controlled to individually inspect the wafer supplied from the loader;
Including
The inspection unit,
A plurality of horizontal frames extending in a horizontal direction and disposed on the front and rear sides of the prober; And
A plurality of vertical frames disposed in a direction perpendicular to the plurality of horizontal frames to support between the plurality of horizontal frames;
Including,
The prober is supported by the horizontal frame,
A group prober system in which an electric device for controlling a plurality of probers is disposed on at least one of a side surface or a rear surface of the inspection unit. The method of claim 1,
The plurality of probers of the inspection unit are arranged side by side in a transverse direction or a vertical direction, or a transverse direction and a vertical direction with respect to a bottom surface on which the prober is placed. delete The method of claim 1,
The plurality of probers installed on the plurality of horizontal frames is a group prober system in which the horizontal frames and the probers are alternately stacked and coupled in a direction upward from a bottom surface. The method of claim 1,
A group prober system in which a gap between a pair of vertical frames disposed on both sides of the prober is formed to be narrower than a transverse width of the prober. A loader for supplying a plurality of wafers; And
An inspection unit including a plurality of probers controlled to individually inspect the wafer supplied from the loader;
Including,
Each of the plurality of probers,
A prober housing including a base plate and a pair of side plates provided on both sides of the base plate;
XY transfer module provided on the upper portion of the base plate;
A rotation module installed on the upper part of the XY transfer module;
A tilt height adjustment module installed on the upper part of the rotation module; And
A wafer chuck installed on the tilt height adjustment module and on which a wafer to be inspected is mounted;
Group prober system comprising a. The method of claim 6,
A head stage coupled to the upper portion of the pair of side plates;
A probe card coupled to a lower portion of the head stage; And
A tester coupled to an upper portion of the head stage to inspect the probe card;
Group prober system comprising a. The method of claim 7,
A group prober system in which a tester fixing module is provided on an upper portion of the head stage so that the tester can be moved in a sliding manner from an upper portion of the head stage. The method of claim 6,
The tilt height adjustment module is a group prober system including a plurality of supports disposed on the rotation module in a vertical direction to support a lower surface of the wafer chuck. The method of claim 7,
The head stage is a group prober system formed to be slidably moved in a direction opposite to the loader with respect to the pair of side plates. The method of claim 6,
The XY transfer module,
Y-axis guide rail formed on the base plate; And
An X-axis transfer member movable on the Y-axis guide rail and having an X-axis guide rail formed on an upper surface thereof;
Group prober system comprising a. The method of claim 11,
Further comprising an auxiliary guide member that can be coupled to the base plate of the prober housing from the rear side of the inspection unit so that the X-axis transfer member can be discharged to the rear side of the prober housing,
A group prober system comprising an auxiliary guide rail connected to the Y-axis guide rail on the auxiliary guide member. delete A method of installing a group prober system in which an inspection unit equipped with a plurality of probers controlled to individually inspect a wafer, and an electrical unit for controlling a plurality of probers are arranged on at least one of the side or rear surfaces of the inspection unit In,
Installing a plurality of horizontal frames extending in a horizontal direction and disposed on the front and rear sides of the prober;
Mounting the prober to be supported by the plurality of horizontal frames; And
Installing a plurality of vertical frames disposed in a direction perpendicular to the plurality of horizontal frames to support between the plurality of horizontal frames;
Installation method of a group prober system comprising a. The method of claim 14,
After the step of installing the plurality of vertical frames,
Installing the plurality of horizontal frames to be supported by the plurality of vertical frames; And
Mounting the prober to be supported by the plurality of horizontal frames;
Installation method of the group prober system further comprising a. The method of claim 14,
The step of installing the plurality of vertical frames,
A method of installing a group prober system comprising the step of installing the plurality of vertical frames such that a gap between a pair of vertical frames disposed on both sides of the prober is formed to be narrower than a transverse width of the prober.

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