KR102213162B1 - Coocker and operating method thereof - Google Patents

Abstract

According to an aspect of the technical idea of the present disclosure, a cooking appliance includes: a sensor module including an external temperature sensor for acquiring external temperature information of the cooking appliance; a memory for storing a mapping table of a plurality of target temperature values and boiling heating time values according to the external temperature information; and a processor which identifies an external temperature value of the cooking appliance by using the external temperature information, loads the target temperature value and a boiling heating time value corresponding to the identified external temperature value from the mapping table, and provides an instruction to perform a cooking process based on the loaded value. The present invention provides the cooking appliance for adaptively controlling the cooking process based on environmental information.

Description

Cooking equipment and its operation method {COOCKER AND OPERATING METHOD THEREOF}

The technical idea of the present disclosure relates to a cooking device and an operating method thereof, and more particularly, to a cooking device that controls a cooking process based on environmental information of the cooking device, and an operating method thereof.

As a cooking appliance, an electric rice cooker is a device capable of selectively performing a cooking process in which rice is cooked using food materials including rice and water, and a thermal insulation process in order to maintain the temperature of the rice. Since the cooking process of the electric rice cooker is set in advance based on room temperature, if the outside temperature is different from room temperature, it may cause unripe or rolled rice even after completing the cooking process. Therefore, it may be required to adaptively control the cooking process according to the external environment.

A problem to be solved by the technical idea of the present disclosure is to provide a cooking apparatus and an operating method for adaptively controlling a cooking process based on environmental information.

In order to achieve the above object, a cooking appliance according to an aspect of the technical idea of the present disclosure includes a sensor module including an external temperature sensor for acquiring external temperature information of the cooking appliance, and a plurality of pieces according to the external temperature information. A memory for storing a mapping table of target temperature values and boiling heating time values of, and using the external temperature information, identify the external temperature value of the cooking appliance, and correspond to the identified external temperature value in the mapping table. It may include a processor that loads a target temperature value and a boiling heating time value, and instructs to perform a cooking process based on the loaded value.

In order to achieve the above object, a method of operating a cooking appliance according to an aspect of the technical idea of the present disclosure includes acquiring external temperature information of the cooking appliance, and the cooking appliance using the obtained external temperature information. Identifying an external temperature value of, from among a mapping table of a plurality of target values and boiling heating time values, loading a target temperature value and a boiling heating time value corresponding to the identified external temperature value, and the loaded value Based on, it may include performing a cooking process.

In order to achieve the above object, a cooking appliance according to an aspect of the technical idea of the present disclosure includes an external temperature sensor for acquiring external temperature information of the cooking appliance and a pressure for acquiring internal pressure information of the cooking appliance. A sensor module including a sensor, a memory for storing a mapping table of a plurality of target temperature values and boiling heating time values according to the external temperature information and the internal pressure information, and the external temperature information of the cooking appliance A temperature value is identified, and the internal pressure information is used to identify whether the internal pressure of the cooking appliance is less than or equal to a critical pressure, corresponding to the identified external temperature value in the mapping table, and a result of comparison with the critical pressure It may include a processor that loads a corresponding target temperature value and boiling heating time value, and instructs to perform a cooking process based on the loaded value.

According to the technical idea of the present disclosure, by adaptively controlling the cooking process in consideration of not only the internal environment of the cooking appliance but also the external environment of the cooking appliance, it is possible to prevent the rice from being overcooked or pressed.

1 is a functional block diagram of a cooking appliance according to an exemplary embodiment of the present disclosure.
2 is a diagram illustrating a sensor arrangement of a cooking appliance according to an exemplary embodiment of the present disclosure.
3A is a graph of an internal temperature when a cooking process is performed at room temperature according to an exemplary embodiment of the present disclosure.
3B is a graph illustrating an internal temperature when a cooking process is performed at a high temperature according to an exemplary embodiment of the present disclosure.
3C is a graph of an internal temperature when a cooking process is performed at a low temperature according to an exemplary embodiment of the present disclosure.
4 is a flowchart illustrating an operation sequence of a cooking device based on external temperature information according to an exemplary embodiment of the present disclosure.
5A is a graph showing a change in an internal temperature according to an increase in a target temperature when a cooking process is performed at a high temperature according to an exemplary embodiment of the present disclosure.
5B is a graph showing a change in internal temperature according to an increase in heating time when a cooking process is performed at a high temperature according to an exemplary embodiment of the present disclosure.
6A is a graph illustrating a change in an internal temperature according to a decrease in a target temperature when a cooking process is performed at a low temperature according to an exemplary embodiment of the present disclosure.
6B is a graph illustrating changes in internal temperature according to a decrease in heating time when a cooking process is performed at a low temperature according to an exemplary embodiment of the present disclosure.
7 is a flowchart illustrating an operation sequence of a cooking device based on pressure information according to an exemplary embodiment of the present disclosure.

Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The embodiments of the present invention are provided to more completely describe the present invention to those with average knowledge in the art. In the present invention, various modifications may be made and various forms may be applied, and specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the present invention to a specific form of disclosure, it is to be understood as including all changes, equivalents, and substitutes included in the spirit and scope of the present invention. In describing each drawing, similar reference numerals are used for similar elements. In the accompanying drawings, the dimensions of the structures are shown to be enlarged or reduced than in actuality for clarity of the present invention.

The terms used in the present disclosure are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present disclosure, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification, but one or more other features It is to be understood that the possibility of addition or presence of elements or numbers, steps, actions, components, parts, or combinations thereof is not preliminarily excluded. The ordinal expressions such as “1st~” and “2nd~” used in the present disclosure are not limited to that “first~” precedes “2nd~”, and are understood as expressing similar configurations differently. Should be.

Unless otherwise defined, all terms, including technical or scientific terms, used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

1 shows a functional block of an early device according to an exemplary embodiment of the present disclosure.

Referring to FIG. 1, the cooking appliance 100 includes a sensor module 110, an input unit 120, a display unit 130, a processor 140, a memory 150, a heating unit 160, and a cooking container 170. Can include.

According to various embodiments, the cooking device 100 may be a cooking device that heats the cooking container 170 configured separately from the cooking device 100, for example, an electric rice cooker, a multi cooker, a robot cooker, or It may be an electric range. According to an embodiment, the cooking appliance 100 may be a cooking appliance that heats the cooking container 170 integrally formed with the cooking appliance 100, and may be, for example, an electric pot or a milk powder pot.

According to various embodiments, the sensor module 110 may acquire sensing data on an external and/or internal environment of the cooking appliance 100 and transmit the acquired data to the processor 140. The sensor module 110 may include an external temperature sensor 111, an internal temperature sensor 112 and a pressure sensor 113.

According to various embodiments, the input unit 120 may receive a user input, and may include a plurality of input buttons and/or a smart dial for receiving various user inputs. For example, the user input may be a touch input indicating the start of a cooking operation, selection of a cooking operation, reservation of a cooking operation, and the like. For example, the input unit 120 may detect a touch input according to various methods including a decompression method and a capacitive method.

According to various embodiments, the display unit 130 may display state information, setting information, or information corresponding to a user input of the cooking device 100. For example, the display unit 130 is at least among various display devices including a liquid crystal display (LCD), a plasma display panel (PDP), a thin-film-transistor LCD (TFT LCD), and an organic light emitting diode (OLED). It can be implemented as one. According to an embodiment, the input unit 120 and the display unit 130 may be implemented integrally. According to an embodiment, the cooking appliance 100 may further include a microphone capable of receiving an audio signal and/or a speaker capable of outputting an audio signal.

According to various embodiments, the processor 140 may overall control the operation of the cooking device 100. For example, the processor 140 may be implemented as a microcomputer. The processor 140 may receive a user input from the input unit 120 and initiate a control operation in response to the user input.

According to an embodiment, the cooking device 100 may cook contents to complete food. For example, the cooking device 100 may be a rice cooker (eg, 200 in FIG. 2 ), and the cooking device 100 may cook rice by cooking rice and water. The cooking device 100 may perform a plurality of processes for cooking rice. For example, the cooking device 100 may perform a cooking process and a warming process. The cooking process refers to a series of processes for completing rice that can be consumed by the user. The thermal insulation process refers to a state in which the temperature of food after cooking is maintained at a target temperature. The cooking process may further include a soaking process, a heating process, and a steaming process. The soaking process may refer to a process of maintaining a temperature within a certain range below the boiling point in order to sufficiently penetrate water into the rice included in the cooking container 170 to cook rice. The heating process refers to the process of heating the rice and water to rise above the boiling point. According to an embodiment, the heating process may include an upward heating process and a boiling heating process. The rising heating process may refer to a process of heating the rice and water to rise to a target temperature. The boiling heating process may refer to a process in which the temperature of rice and water maintain a target temperature. The steaming process may refer to a process of stopping the heating operation or weakening the heating.

According to an embodiment of the present disclosure, the processor 140 may load a target temperature value and a boiling heating time value corresponding to a group identified from the memory 150 based on data on the external temperature. It will be described later in detail in FIG. 4.

According to various embodiments, the memory 150 may store a control algorithm related to the operation of the processor 140 and/or various types of data generated by execution of the control algorithm. The memory 150 may include a volatile memory or a nonvolatile memory device. In addition, the memory 150 may be included in the processor 140 or may be, for example, a register included in the processor 140.

According to various embodiments, the heating unit 160 may heat the cooking container 170 through a heating operation, and the heating operation may be controlled by the processor 140. In one embodiment, the heating unit 160 may include a working coil that heats the cooking vessel 170 by an induction heating method. In one embodiment, the heating unit 160 may include a heating wire for heating the cooking vessel 170 in an electric resistance method. However, the configuration of the heating unit 160 is not limited thereto, and may have various configurations for heating the cooking container 170.

2 is a diagram illustrating a sensor arrangement of a cooking appliance according to an exemplary embodiment of the present disclosure.

Referring to FIG. 2, the electric rice cooker 200 may include a body 210 and a lid 220, and an external temperature sensor 111, an internal temperature sensor 112, a pressure sensor 113, and a processor 140 ), a heating unit 160, and a cooking container 170 may be included.

The external temperature sensor 111 may obtain information on the external temperature of the cooking device 100 and transmit it to the processor 140. The obtained information on the external temperature may be used to determine parameter values of a cooking process. For example, the processor 140 may perform a cooking process by loading a target temperature value and a boiling heating time value corresponding to the obtained external temperature from the mapping table stored in the memory 150.

When performing a number of processes, the internal temperature sensor 112 may acquire information about the internal temperature of the cooking container 170 and transmit the information about the obtained internal temperature to the processor 140. The processor 140 may adjust the internal temperature of the cooking container 170 by using the obtained information on the internal temperature. For example, the processor 140 receives information about the internal temperature from the internal temperature sensor 112, and when the internal temperature of the cooking vessel 170 reaches the target temperature, ends the rising heating section, and boiling The heating unit 160 can be controlled to start the section.

The pressure sensor 113 may acquire information about the internal pressure of the cooking container 170 and transmit information about the obtained internal pressure to the processor 140. The obtained pressure information may be used to determine parameter values of the cooking process. For example, the processor 140 uses the mapping table stored in the memory 150 to determine a target corresponding to a case where an internal pressure is lower than a threshold pressure among target temperature values and boiling heating time values corresponding to the obtained external temperature. The cooking process can be performed by loading the temperature value and boiling heating time value.

In the above-described embodiment, although one external temperature sensor 111 is shown as being disposed, it is not limited thereto. In various embodiments, the external temperature sensor 111 may include a plurality of sensors. For example, the external temperature sensor 111 may include a plurality of temperature sensors respectively disposed on the upper, lower, front, and rear surfaces of the cooking appliance 100. The external temperature sensor 111 calculates an average of external temperature data from a plurality of temperature sensors respectively disposed at the top, bottom, front, and rear of the cooking appliance 100 and outputs the external temperature information to the processor 140 You may.

3A is a graph of an internal temperature when a cooking process is performed at room temperature according to an exemplary embodiment of the present disclosure.

1 and 3A together, the processor 140 may receive a user input instructing to perform a cooking process at a time point t=0. The processor 140 may inject the amount of heat through the heating unit 160 until the internal temperature of the cooking container 170 becomes the same as the target temperature T _TARGET . That is, the t=0 to t=t _R section may correspond to the rising heating section in the cooking process. During the rising heating period, the temperature may increase according to the first slope 310. Although not shown in the graph, the processor 140 identifies that the internal temperature of the cooking vessel 170 has reached the target temperature T _TARGET using the internal temperature sensor 112, and the target temperature ( T _TARGET ) can be maintained. The predefined time may correspond to the boiling heating section.

3B is a graph illustrating an internal temperature when a cooking process is performed at a high temperature according to an exemplary embodiment of the present disclosure.

Referring to FIGS. 1 and 3B, the processor 140 may receive a user input instructing to perform a cooking process at a time point t=0, and may heat the cooking container 170.

When the external temperature of the cooking device 100 is high, the length of the rising heating section may be shortened. For example, while the amount of heat is input to increase the temperature of the cooking container 170 at a time point t=0, when the external temperature is high, an additional amount of heat may be input to the cooking container 170 from the outside. Accordingly, a rate at which the internal temperature of the cooking vessel 170 rises during the rising heating section may be increased, and a slope at which the temperature rises during the rising heating section may correspond to the second slope 320. The second slope 320 may be greater than the first slope 310. That is, the point in time when the internal temperature of the cooking container 170 reaches the target temperature T _TARGET may be advanced. Compared with the case where the ambient temperature is room temperature, the t _H value may be smaller than the t _R value.

When the processor 140 identifies that the internal temperature of the cooking vessel 170 reaches the target temperature T _TARGET , the processor 140 may enter the boiling heating section. After the predetermined amount of heat is input during the boiling heating section of the predetermined time according to the cooking process, the cooking process may be terminated. Therefore, even if the external temperature of the cooking device 100 is high, since the amount of heat is input during the same boiling heating section at the same target temperature (T _TARGET ) as at room temperature, the amount of heat input for cooking in the boiling heating section is the ambient temperature. It may be the same as at room temperature.

However, when comparing the rising heating section, when the ambient temperature of the cooking appliance 100 is high, the internal temperature of the cooking vessel 170 rapidly increases due to the amount of heat introduced from the outside, and the length of the rising heating section is short. However, the total amount of heat input during the rising heating period may be smaller than when the ambient temperature is at room temperature. Accordingly, the total amount of heat input during the rising heating section and the boiling heating section may be smaller when the external temperature of the cooking apparatus 100 is high, compared to the case where the external temperature is room temperature. Therefore, when the cooking process is completed, rice may be less cooked or unripe.

3C is a graph of an internal temperature when a cooking process is performed at a low temperature according to an exemplary embodiment of the present disclosure.

Referring to FIGS. 1 and 3C, the processor 140 may receive a user input instructing to perform a cooking process at a time point t=0 and heat the cooking container 170.

When the external temperature of the cooking device 100 is low, the length of the rising heating section may be lengthened. For example, while the amount of heat is input to increase the temperature of the cooking container 170 at a time t=0, when the external temperature is low, at least a portion of the amount of heat input to the cooking container 170 leaks to the outside ( may leak). Accordingly, a rate at which the internal temperature of the cooking vessel 170 rises during the rising heating section may be reduced, and a slope at which the temperature rises during the rising heating section may correspond to the third slope 330. That is, the time point when the internal temperature of the cooking container 170 reaches the target temperature T _TARGET may be delayed. Compared with the case where the ambient temperature is room temperature, the t _L value may be smaller than the t _R value.

When the processor 140 identifies that the internal temperature of the cooking vessel 170 reaches the target temperature T _TARGET , the processor 140 may enter the boiling heating section. After the predetermined amount of heat is input during the boiling heating section of the predetermined time according to the cooking process, the cooking process may be terminated. Therefore, even if the external temperature of the cooking device 100 is low, since the amount of heat is input during the same boiling heating section at the same target temperature (T _TARGET ) as at room temperature, the amount of heat input for cooking in the boiling heating section is the ambient temperature. It may be the same as at room temperature. However, when comparing the rising heating section, when the ambient temperature of the cooking appliance 100 is low, the internal temperature of the cooking container 170 gradually increases due to the amount of heat leaked to the outside, and the length of the rising heating section increases. Therefore, the total amount of heat input during the rising heating section may be greater than when the ambient temperature is at room temperature. The total amount of heat input during the rising heating section and the boiling heating section may be greater when the external temperature of the cooking device 100 is low, compared to the case where the external temperature is room temperature. Therefore, upon completion of the cooking process, the rice may be pressed.

4 is a flowchart illustrating an operation sequence of a cooking device based on external temperature information according to an exemplary embodiment of the present disclosure.

Referring to FIG. 4, the operation of the cooking device according to the present embodiment may be performed by the cooking device 100 of FIG. 1, for example. Accordingly, the contents described above with reference to FIG. 1 may also be applied to this embodiment.

In operation 410, the processor 140 may receive a cooking input. The input unit 120 may receive a user's cooking input and transmit the received cooking input to the processor 140.

In operation 420, the processor 140 may obtain external temperature information. The external temperature information may refer to sensing data on the external temperature of the cooking device 100. According to various embodiments, when a plurality of temperature sensors for measuring the external temperature are provided, external temperature information obtained from the plurality of temperature sensors may be averaged and determined as external temperature information.

In operation 430, the processor 140 may identify an external temperature value of the cooking device 100. The processor 140 may identify the ambient temperature of the cooking device 100 by decoding the obtained temperature information.

According to various embodiments, the processor 140 may identify one of a room temperature, a low temperature, and a high temperature group. That is, the processor 140 may determine whether the external temperature of the cooking device 100 is room temperature, high temperature, or low temperature based on the obtained external temperature information. The room temperature group may refer to, for example, ±10% based on 20°C, that is, a temperature in the range of 18°C to 22°C. According to various embodiments, the range of the room temperature group may be changed by a manufacturer or a user. According to various embodiments, the high temperature group may refer to a temperature higher than the maximum temperature of the room temperature group. For example, when the room temperature group is 18°C to 22°C, it may be determined that the temperature exceeds 22°C as the high temperature group. For another example, the high temperature group may refer to a temperature in a range that exceeds a predefined threshold temperature. For example, when a manufacturer or user sets the predefined temperature to 30°C, the high temperature group may refer to a temperature of 30°C or higher. According to various embodiments, the low temperature group may refer to a temperature lower than the lowest temperature of the room temperature group. For example, when the room temperature group is 18°C to 22°C, it may be determined that the temperature exceeds 18°C as the low temperature group. For another example, the low temperature group may refer to a temperature below a predefined threshold temperature. For example, when a manufacturer or user sets the predefined temperature to 10°C, the low temperature group may refer to a temperature of 10°C or less. Accordingly, the processor 140 may identify one group corresponding to the external temperature of the cooking apparatus 100 among preset temperature groups according to various embodiments.

In operation 440, the processor 140 may load a target temperature value and a boiling heating time value corresponding to the identified external temperature value. The processor 140 may transmit the identified external temperature value to the memory 150. The memory 150 may receive the temperature information value from the processor 140 and transmit a target temperature value and a boiling heating value corresponding thereto to the processor 140. According to an embodiment, the memory 150 may store a mapping table of different target temperature values and different boiling heating time values according to an external temperature value. For example, the mapping table may correspond to Table 1 below.

0℃ ... 19℃ 20℃ 21℃ ... 40℃ Target temperature value 120℃ ... 129.5℃ 130℃ 130.5℃ ... 150℃ Boiling heating time value 400s ... 301s 300s 299s ... 250s

According to various embodiments, a target temperature value and a boiling heating time value corresponding to the identified group may be loaded. The processor 140 may transmit information on the identified group to the memory 150. The memory 150 may receive information on the identified group from the processor 140 and transmit a target temperature value and a boiling heating value corresponding thereto to the processor 140.

According to various embodiments, the memory 150 may include a mapping table for mapping information of different target temperature values and different boiling heating time values according to a temperature group. For example, the mapping table may correspond to Table 2 below.

Room temperature group High temperature group Low temperature group Target temperature value 130℃ 150℃ 130℃ 120℃ 130℃ Boiling heating time value 300s 250s 500s 400s 250s

According to various embodiments, when it is identified that the external temperature of the cooking device 100 is included in the high-temperature group, as shown in FIG. 3B, the total amount of heat input is insufficient due to a rapid increase in temperature, so that rice is prepared. Can be cooked. Therefore, in order to prevent the rice from being unripe, it is necessary to input additional heat.

According to an embodiment, the target temperature value corresponding to the high temperature group (hereinafter, the second target temperature value) is greater than the target temperature corresponding to the room temperature group (hereinafter, the first target temperature), and the boiling heating time corresponding to the high temperature group The value (hereinafter, the second boiling heating time value) may be smaller than the boiling heating time value corresponding to the room temperature group (hereinafter, the first boiling heating time value).

When the target temperature value is increased from the first target temperature to the second target temperature, the length of the rising heating section may be increased. That is, the time to reach the second target temperature may be delayed. Accordingly, since the heating time to the second target temperature is increased, the amount of heat input during the rising heating section at high temperature may be the same as the amount of heat input during the rising heating section at room temperature.

In this case, the second boiling heating time value may be smaller than the first boiling heating time value. Since the target temperature has risen by the second target temperature, if the amount of heat is input at the second target temperature for the same first boiling heating time value as before, the total amount of heat input during the cooking process is the amount of heat input during the cooking process at room temperature. It may cause the rice to be overwhelmed. In this regard, it will be described later in FIG. 5A.

According to another embodiment, the processor 140 may load an increased second boiling heating time value while maintaining the target temperature at the first target temperature value. For example, when the external temperature of the cooking device 100 is extremely high, the processor 140 may malfunction due to overheating of the cooking device 100 when the temperature is increased to a target temperature. Accordingly, the processor 140 may additionally input an amount of heat less than the amount of heat input during the rising heating period at room temperature by increasing the length of the boiling heating section. That is, by increasing the heating time to the first target temperature, it is possible to prevent the rice from being unripe. In this regard, it will be described later in FIG. 5B.

According to various embodiments, when it is identified that the external temperature of the cooking device 100 is included in the low temperature group, as shown in FIG. 3C, the total amount of heat input is exceeded due to the slow temperature increase, and the rice is pressed. Can occur. Therefore, in order to prevent the rice from being pressed, it is necessary to reduce the amount of heat input.

According to an embodiment, the target temperature value corresponding to the low temperature group (hereinafter, the third target temperature) is smaller than the first target temperature corresponding to the room temperature group, and the boiling heating time value corresponding to the low temperature group (hereinafter, referred to as the third target temperature). The boiling heating time value) may be greater than the first boiling heating time value corresponding to the room temperature group.

When the target temperature value is decreased from the first target temperature to the third target temperature, the length of the rising heating section may be reduced. That is, the time to reach the reduced third target temperature may be shortened. Accordingly, since the heating time to the third target temperature is reduced, the amount of heat input during the rising heating section at low temperature may be the same as the amount of heat input during the rising heating section at room temperature.

In this case, the third boiling heating time value may be greater than the first boiling heating time value. Since the target temperature has been reduced by the third target temperature, if the amount of heat is input at the third target temperature by the same first boiling heating time value as before, the total amount of heat input during the cooking process is the amount of heat input during the cooking process at room temperature It is less, so it can cause uncooked rice. In this regard, it will be described later in FIG. 6A.

According to another embodiment, the processor 140 may load the reduced third boiling heating time value while maintaining the target temperature at the first target temperature value. By reducing the length of the boiling heating section, the processor 140 may inject less heat as much as the amount of heat that has been exceeded during the rising heating section at room temperature. That is, by reducing the length of the boiling heating section heated to the first target temperature, it is possible to prevent the rice from being pressed. In this regard, it will be described later in FIG. 6B.

5A is a graph showing a change in an internal temperature according to an increase in a target temperature when a cooking process is performed at a high temperature according to an exemplary embodiment of the present disclosure.

로 계산될 수 있다. Referring to FIGS. 1, 3 and 5A together, the temperature of the rising heating section at room temperature may increase according to the first slope 310. That is, when the cooking process is performed at room temperature, the internal temperature of the cooking container 170 reaches the first target temperature T _TARGET at the time t=t _R , and may enter the boiling heating section. The amount of heat input during the rising heating period at room temperature may correspond to an area under a straight line of the first slope 310 (hereinafter, area ①). The area of ① above is

Can be calculated as

로 계산될 수 있다. 여기서, 상기 ① 영역의 넓이와 상기 ② 영역의 넓이는 동일할 수 있다. 즉, 제2 목표 온도는 상온에서 상승 가열 구간 동안 투입된 열량과 동일한 크기의 열량이 투입되도록 설정될 수 있다. The temperature of the rising heating section at high temperature may increase according to the second slope 320. That is, when the cooking process is performed at a high temperature, the internal temperature of the cooking container 170 may reach the first target temperature T _TARGET at t=t _H1 . According to an embodiment of the present disclosure, when the target temperature of the cooking process at high temperature is changed to the second target temperature T _H , the internal temperature of the cooking container 170 increased according to the second slope 320 is t = The second target temperature T _H may be reached at a time point _tH2 . That is, when the target temperature is set to the second target temperature T _H , the length of the rising heating section may be increased. The amount of heat input during the elevated heating section at high temperature may correspond to the area under the straight line of the second slope (hereinafter, the area ②). The area of ② above is

Can be calculated as Here, the area ① and the area ② may be the same. That is, the second target temperature may be set such that the amount of heat equal to the amount of heat input during the rising heating section at room temperature is input.

Although not shown, when the cooking process is performed at a high temperature, the length of the boiling heating section may be shortened. As described above, when the target temperature of the cooking process is changed to the second target temperature (T _H ), the amount of heat input per unit time during the boiling heating section is due to the nature of the boiling heating section in which heat is injected while maintaining the target temperature. May be greater than the amount of heat input per unit time in the boiling heating section at room temperature. According to the above-described embodiment, since the size of the area ① and the area ② of the rising heating section at room temperature and high temperature are the same, the amount of heat input during the boiling heating section at room temperature and high temperature should be the same. Therefore, since the amount of heat input per unit time has increased according to the second target temperature T _H , the processor 140 can control the amount of heat input to be the same by reducing the length of the boiling heating time of the cooking process at high temperature. have.

5B is a graph showing a change in internal temperature according to an increase in heating time when a cooking process is performed at a high temperature according to an exemplary embodiment of the present disclosure.

1, 3 and 5B, the processor 140 may maintain a target temperature. That is, the processor 140 may load a set value in which the target temperature is not changed and only the boiling heating time value is changed among a plurality of values stored in the mapping table of the memory 150.

를 만족하도록 결정될 수 있다. According to an embodiment, the processor 140 may increase the length of the boiling heating section. Referring to FIG. 5B, after entering the boiling heating section at the time t=t _H , it can be seen that the boiling heating section ends at the time t=t _H +t _P1 . That is, it can be seen that the boiling heating section of the cooking process at room temperature lasts as long as t _P1 . The processor 140 may delay the time point at which the boiling heating section ends to t=t _H +t _P2 . Here, the size of t _P2 may be larger than the size of t _P1 . The length of the increased boiling heating section t _P2 -t _P1 may be determined based on a difference between the amount of heat input during the rising heating section at room temperature and the amount of heat input during the rising heating section at high temperature. That is, the length of the increased boiling heating section is the amount of heat added due to the increased boiling heating section.

Can be determined to satisfy

6A is a graph illustrating a change in an internal temperature according to a decrease in a target temperature when a cooking process is performed at a low temperature according to an exemplary embodiment of the present disclosure.

로 계산될 수 있다. 여기서, 상기 ① 영역의 넓이와 상기 ③ 영역의 넓이는 동일할 수 있다. 즉, 제3 목표 온도(T_L)는 상온에서 상승 가열 구간 동안 투입된 열량과 동일한 크기의 열량이 투입되도록 설정될 수 있다.Referring to FIGS. 1, 3 and 6A together, the temperature of the rising heating section at low temperature may increase according to the third slope 330. The third slope 330 may be smaller than the first slope 310. That is, when the cooking process is performed at a low temperature, the internal temperature of the cooking container 170 may reach the first target temperature T _TARGET at t=t _L1 . According to an embodiment of the present disclosure, when the target temperature of the cooking process at low temperature is changed to the third target temperature T _L , the internal temperature of the cooking container 170 increased according to the third slope 330 is The changed target temperature can be reached at the point of t= _tL2 . That is, when the target temperature value is set to the third target temperature T _L value, the length of the rising heating section may be reduced. The amount of heat input during the rising heating section at low temperature may correspond to the area under the straight line of the third slope 330 (hereinafter, area ③). The area of ③ above is

Can be calculated as Here, the area ① and the area ③ may be the same. That is, the third target temperature T _L may be set so that the amount of heat equal to the amount of heat input during the heating period at room temperature is input.

Although not shown, when the cooking process is performed at a low temperature, the length of the boiling heating section may be lengthened. As described above, when the target temperature of the cooking process is changed to the third target temperature (T _L ), the amount of heat input per unit time during the boiling heating section at low temperature is the amount of heat input per unit time of the boiling heating section at room temperature. It can be reduced in size. According to the above-described embodiment, since the size of the area ① and the area ③ of the rising heating section at room temperature and low temperature are the same, the amount of heat input during the boiling heating section at room temperature and low temperature should be the same. Therefore, since the size of the amount of heat input per unit time has been reduced according to the third target temperature T _L , the processor 140 reduces the length of the boiling heating section of the cooking process at low temperature to control the amount of heat input to be the same. I can.

6B is a graph illustrating changes in internal temperature according to a decrease in heating time when a cooking process is performed at a low temperature according to an exemplary embodiment of the present disclosure.

1, 3 and 6B, the processor 140 may maintain a target temperature. That is, the processor 140 may load a set value in which the target temperature is not changed and only the boiling heating time value is changed among a plurality of values stored in the mapping table of the memory 150.

를 만족하도록 결정될 수 있다. According to an embodiment, the processor 140 may reduce the length of the boiling heating section. Referring to FIG. 6B, after entering the boiling heating section at the time t=t _L , it can be seen that the boiling heating section ends at the time t=t _L +t _P3 . The processor 140 may delay the time point at which the boiling heating section ends to t=t _L +t _P4 . Here, the size of t _P4 may be smaller than the size of t _P3 . The length of the reduced boiling heating section t _P3 -t _P4 may be determined based on a difference between the amount of heat input during the rising heating section at room temperature and the amount of heat input during the rising heating section at low temperature. That is, the amount of heat excluded due to the depreciated boiling heating section,

Can be determined to satisfy

7 is a flowchart illustrating an operation sequence of a cooking device based on pressure information according to an exemplary embodiment of the present disclosure.

Referring to FIG. 7, the operation of the cooking appliance according to the present embodiment may be performed by the cooking appliance 100 of FIG. 1, for example. Accordingly, the contents described above with reference to FIG. 1 may also be applied to this embodiment.

In operation 710, the processor 140 may receive a cooking input. A detailed description related to operation 710 may be replaced with a description related to operation 410 of FIG. 4.

In operation 720, the processor 140 may obtain pressure information. For example, the pressure sensor 113 included in the sensor module 110 may acquire sensing data about the pressure in the cooking device 100, that is, the cooking container 170, and transmit it to the processor 140. . By repeatedly using the cooking device 100, the internal pressure of the cooking container 170 may be reduced. That is, the rubber packing for the internal pressure is torn or the packing performance is deteriorated, so that the internal pressure when the cooking container 170 is closed may be reduced. Accordingly, when receiving the cooking input, the processor 140 may obtain sensing data on the internal pressure of the cooking container 170 from the pressure sensor 113 to determine how much the internal pressure is reduced.

In operation 730, the processor 140 may identify that the internal pressure of the cooking device 100 has decreased below the threshold pressure. When the internal pressure of the cooking container 170 is reduced, not only the boiling point of water is reduced, but also the amount of heat injected into the cooking container 170 may leak to the outside of the cooking container 170. Rice may become unripe as the amount of heat input is leaked. According to various embodiments, the threshold value may be preset by a manufacturer. When the internal pressure exceeds the threshold value, the processor 140 may perform a preset cooking process. The preset cooking process may correspond to a cooking process preset based on room temperature. The processor 140 may perform operation 740 when the internal pressure is less than or equal to the threshold value.

In operation 740, the processor 140 may load a target temperature value and a boiling heating time value corresponding to or less than the threshold pressure. When it is identified that the internal pressure is less than the threshold value, it is necessary to input an additional amount of heat to compensate for the amount of heat leaked. Accordingly, the processor 140 loads a second target temperature T _H value higher than the first target temperature T _{TARGET at} room temperature, or a second boiling heating time longer than the first boiling heating time t _{p1 at} room temperature You can load the time (t _p2 ) value. A detailed description of the second target temperature or the second heating time may be replaced by a detailed description of FIGS. 5A and 5B. According to the above-described embodiment, it is possible to prevent rice unripe due to deterioration of the performance of the rubber packing for maintaining the internal pressure.

Although not shown, according to various embodiments, the memory 150 may store a mapping table in consideration of both external temperature and internal pressure. The processor 140 identifies one group including the external temperature of the cooking device 100 based on the data on the external temperature, and then the internal pressure of the cooking device 100 is critical based on the data on the pressure. It can be determined whether the pressure has decreased below the pressure. That is, the mapping table may include target temperature values and boiling heating time values for a case where the internal pressure is lower than the critical pressure and when the internal pressure is higher than the critical pressure for each temperature group.

As described above, exemplary embodiments have been disclosed in the drawings and specification. In the present specification, embodiments have been described using specific terms, but these are only used for the purpose of describing the technical idea of the present disclosure, and are not used to limit the meaning or the scope of the present disclosure described in the claims. . Therefore, those of ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the true technical scope of the present disclosure should be determined by the technical spirit of the appended claims.

Claims (10)

In the cooking appliance,
A sensor module including an external temperature sensor for obtaining external temperature information of the cooking appliance;
A memory for storing a mapping table of a plurality of target temperature values and boiling heating time values according to the external temperature information; And
Using the external temperature information, to identify the external temperature value of the cooking appliance,
Based on the identified external temperature value, identify one of a room temperature group, a high temperature group, and a low temperature group,
Load a target temperature value and a boiling heating time value corresponding to the identified group from the mapping table,
Includes a processor instructing to perform a cooking process based on the loaded value,
When the identified group is the room temperature group, the loaded value includes a first target temperature value and a first boiling heating time value,
If the identified group is the high temperature group, the loaded value includes a second target temperature value and a second boiling heating time value,
The second target temperature value is greater than the first target temperature value, and the second boiling heating time value is less than the first boiling heating time value, or
The second target temperature value is the same as the first target temperature value, and the second boiling heating time value is greater than the first boiling heating time value. delete delete The method of claim 1,
If the identified group is the low temperature group, the loaded value includes a third target temperature value and a third boiling heating time value,
The third target temperature value is less than the first target temperature value, and the third boiling heating time value is greater than the first boiling heating time value, or
The third target temperature value is the same as the first target temperature value, and the third boiling heating time value is smaller than the first boiling heating time value. In the operating method of the cooking appliance,
Obtaining external temperature information of the cooking appliance;
Identifying an external temperature value of the cooking appliance using the obtained external temperature information;
Identifying one of a room temperature group, a high temperature group, and a low temperature group based on the identified external temperature value;
Loading a target temperature value and a boiling heating time value corresponding to the identified group from among a mapping table including a plurality of target values and boiling heating time values according to the external temperature; And
Including the step of performing a cooking process based on the loaded value,
When the identified group is the room temperature group, the loaded value includes a first target temperature value and a first boiling heating time value,
If the identified group is the high temperature group, the loaded value includes a second target temperature value and a second boiling heating time value,
The second target temperature value is greater than the first target temperature value, and the second boiling heating time value is less than the first boiling heating time value, or
The second target temperature value is the same as the first target temperature value, and the second boiling heating time value is greater than the first boiling heating time value. delete delete The method of claim 5,
If the identified group is the low temperature group, the loaded value includes a third target temperature value and a third boiling heating time value,
The third target temperature value is less than the first target temperature value, and the third boiling heating time value is greater than the first boiling heating time value, or
The third target temperature value is the same as the first target temperature value, and the third boiling heating time value is smaller than the first boiling heating time value. In the cooking appliance,
A sensor module including an external temperature sensor for acquiring external temperature information of the cooking appliance and a pressure sensor for acquiring internal pressure information of the cooking appliance;
A memory for storing a mapping table of a plurality of target temperature values and boiling heating time values according to the external temperature information and the internal pressure information; And
Using the external temperature information, to identify the external temperature value of the cooking appliance,
Using the internal pressure information, to identify whether the internal pressure of the cooking appliance is below a critical pressure,
Load a target temperature value and a boiling heating time value corresponding to the identified external temperature value in the mapping table and corresponding to the critical pressure and the comparison result,
And a processor for instructing to perform a cooking process based on the loaded value. The method of claim 9,
The mapping table,
A target temperature when the internal pressure of the cooking appliance is less than the critical pressure is greater than a target temperature value corresponding to the identified external temperature value, and a boiling heating time when the internal pressure of the cooking appliance is less than the critical pressure Stores a value less than the boiling heating time value corresponding to the identified group, or
The target temperature when the internal pressure of the cooking appliance is less than the critical pressure is the same as the target temperature value corresponding to the identified external temperature value, and boiling heating when the internal pressure of the cooking appliance is less than the critical pressure The cooking appliance for storing the time is greater than the boiling heating time value corresponding to the identified group.

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