KR102213105B1 - Equipment to prepare article for interlayer conveyance and method used therefor - Google Patents

Abstract

The present invention provides equipment and a method for preparing an object for interlayer conveyance. The equipment comprises: a rack module having a first loading unit for supporting a first object, a second loading unit disposed below the first loading unit to support a second object, and a lifting unit for lifting the first loading unit; a shuttle module which is movable between a receiving position and a loading position, receives the first object or the second object at the receiving position, and loads the same on the first loading unit or the second loading unit at the loading position; and a control module for controlling the lifting unit and the shuttle module so that the shuttle module loads the first object on the first loading unit, and the shuttle module loads the second object on the second loading unit after the lifting unit lifts the first loading unit. Therefore, the equipment can prepare a plurality of objects so that the objects can be conveyed at once, thereby reducing the time required to convey the objects.

Description

Equipment and method for preparing objects for inter-floor transfer {EQUIPMENT TO PREPARE ARTICLE FOR INTERLAYER CONVEYANCE AND METHOD USED THEREFOR}

The present invention relates to an object preparation facility and method for interlayer transport.

In recent years, semiconductor manufacturing technology has been developed in the direction of improving the degree of integration, reliability, and processing speed according to the rapid development of information and communication technology. The manufacturing steps of the semiconductor are as follows. First, a silicon wafer used as a semiconductor substrate is fabricated from a silicon single crystal, a processed film is formed on the semiconductor substrate, and then the processed film is formed into patterns having electrical or dielectric properties.

The patterns are formed by selectively or repetitively performing unit processes such as film formation, photo etching, polishing, and ion implantation. In the recent semiconductor manufacturing process that requires a design rule of 0.15㎛ or less, the control of process conditions such as pressure and temperature applied to the unit processes should be performed more precisely, and for this purpose, various control devices have been developed. This is actively going on. In addition, a large number of semiconductor manufacturing apparatuses for mass production are provided in manufacturing process lines, and their operations and controls are being automated.

As an example of automation, there is a transfer device including an auto guided vehicle (AGV) for transferring a semiconductor substrate in a bay area where devices for performing the manufacturing process are provided. In recent years, overhead transfer (OTT) as well as unmanned transfer trucks are applied to transfer.

In a semiconductor manufacturing facility of the prior art, a cassette is transferred by an automatic transfer device between a stocker for storing a cassette on which a plurality of wafers are mounted and a unit process device in which a unit process of the wafer is performed. The automatic transfer device can sequentially move the cassette between the stocker and the unit process unit according to a program set in an unmanned work space.

However, since the conventional automatic transfer device is configured to transfer only one cassette in sequence, it takes a long time to transfer the cassette. Furthermore, while preparing a cassette for automatic transport, an accident of dropping the cassette may occur.

An object of the present invention is to provide an object preparation facility and method for inter-floor transport, which can reduce object transport time by preparing an object in a manner capable of transporting a plurality of objects at once.

Another object of the present invention is to provide an object preparation facility and method for interlayer transport, which can structurally eliminate the possibility of dropping an object in the process of raising an object for transport preparation.

An object preparation facility for inter-floor transfer according to an aspect of the present invention for realizing the above-described problem includes a first loading part configured to support a first object, and a second object disposed under the first loading part. A shelf module including a second loading unit configured to support and an elevating drive unit configured to elevate and drive the first loading unit; A shuttle module configured to be movable between a receiving position and a loading position, and configured to receive the first object or the second object at the receiving position and load the first or second stacking unit at the loading position ; And the lift driving unit and the shuttle module being configured to control, wherein the shuttle module loads the first object onto the first loading unit and the lift drive unit raises the first loading unit, the shuttle The module may include a control module to load the second object onto the second loading unit.

Here, the shuttle module includes: a holding unit configured to hold the first object or the second object; A horizontal moving unit configured to horizontally move the holding unit between the receiving position and the loading position; And it may include a vertical movement unit configured to lift the holding unit.

Here, the holding unit may include a transport plate configured to support the first object or the second object.

Here, the vertical movement unit is configured to elevate the conveyance plate from a position higher than the first stacking unit and the second stacking unit to a position lower than them, and each of the first stacking unit and the second stacking unit May be formed to provide a passage space allowing the passage of the conveyance plate to enter the horizontal direction and descend in the vertical direction.

Here, the first loading portion includes a pair of support portions arranged side by side, and a direction in which the transfer plate enters the passage space defined between the pair of support portions is to take the first object and the second object Thus, the direction in which the rack master transporting between floors enters may be the opposite direction.

Here, the first loading portion, a first support portion; And a second support portion having a first region corresponding to the first support portion and a second region protruding and bent from the first region, and the passage space defined between the first support portion and the second support portion. The direction in which the transfer plate enters may be a direction crossing the direction in which the rack master, which takes over the first object and the second object, and carries the floor between floors.

Here, the shuttle module may further include a rotation driving unit that rotates the holding unit to change the direction of the first object or the second object.

Here, the shelf module may further include a sensor unit installed on the first loading unit and the second loading unit, sensing the first object or the second object, and transmitting it to the control module.

Here, a buffer conveyor module is further provided, which is arranged to transport the first object and the second object to the receiving position, and controlling the transport of the first object and the second object by the control module, and the receiving position Is located within the transport section of the buffer conveyor module, and the shuttle module may be configured to enter an area occupied by the buffer conveyor module in order to take over the first object and the second object.

Here, a positioning module may be further provided which is located within the transport section of the buffer conveyor module and correctly positions the loaded first object or the second object on the buffer conveyor module.

According to another aspect of the present invention, a method for preparing an object for inter-floor transport includes the steps of transporting a first object or a second object from a receiving position to a loading position using a shuttle module; Loading the first object into a first loading unit at the loading position using the shuttle module so that the first loading portion is in a state of supporting the first object; Raising the first loading part supporting the first object by using an elevation driving unit; And after completion of the elevation of the first loading part, loading the second object into the second loading part at the loading position using the shuttle module, so that the second loading part is in a state of supporting the second object. can do.

Here, determining whether the first object loaded on the first loading section is positioned in the first loading section using a sensor unit; If the first object is not correctly positioned on the first loading unit, retrying loading the first object on the first loading unit using the shuttle module; And when the first object is positioned in the first loading portion, preparing for operation of the lift driving unit to raise the first loading portion.

Here, determining whether the second object loaded on the second loading unit is positioned in the second loading unit using a sensor unit; If the second object is not correctly positioned on the second loading unit, retrying loading the second object on the second loading unit using the shuttle module; And accepting acceptance of the first object and the second object by the rack master for inter-floor transfer if the second object is positioned in the second loading unit.

Here, before loading the first object or the second object into the first loading unit or the second loading unit, rotating the shuttle module to change the direction of the first object or the second object More can be provided.

Here, before the transfer of the first object or the second object from the receiving position to the loading position using the shuttle module, the timing of providing the first object or the second object to the receiving position using a buffer conveyor module is adjusted. The step may be further provided.

Here, the step of receiving the first object or the second object from a supply position using a positioning module, and loading the first object or the second object into the buffer conveyor module while the positioning module descends It may be further provided.

According to the object preparation facility and method for inter-floor transfer according to the present invention configured as described above, the first loading portion and the second loading portion of the shelf module are configured to support the first object or the second object, respectively, and such a first loading portion In order to load the first object or the second object to the loader and the second loader, a shuttle module that moves between the receiving position and the loading position is used.After the shuttle module loads the first object to the first loader, Since the driving unit of the shelf module is operated so that the first loading unit rises in a state stably supporting the first object, and the shuttle module loads the second object to the second loading unit, the first object is in the shuttle module. Accordingly, it is possible to structurally eliminate the risk of falling and damaging the first object while rising from the height loaded on the first loading unit. Further, by arranging the first object and the second object in a double layer along the height direction, the rack master for inter-floor transport can take over and transport two objects at a time. This provides the advantage of being able to drastically shorten the conveyance time for the object.

1 is a conceptual diagram of an object preparation facility 100 for inter-floor transfer according to an embodiment of the present invention.
2 is a control block diagram of an object preparation facility 100 for inter-floor transfer of FIG. 1.
3 is a conceptual diagram illustrating an operation method of the object preparation facility 100 for inter-floor transfer of FIG. 1.
4 is a conceptual diagram showing another state of the object preparation facility 100 for inter-floor transfer of FIG. 3.
5 is a perspective view illustrating the shelf module 110 of FIG. 1.
6 is a perspective view for explaining the shelf module 110 ′ of FIG. 1.
7 is a flowchart illustrating a method of preparing an object for interlayer transport according to another embodiment of the present invention.
FIG. 8 is a flow chart for explaining specific contents of step S3 of FIG. 7.
9 is a flow chart for explaining specific details of another step (S9) of FIG. 7.
10 is a flow chart for explaining the preceding steps related to another step (S1 and S7) of FIG. 7.

Hereinafter, an object preparation facility and method for interlayer transport according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this specification, the same/similar reference numerals are assigned to the same/similar configurations even in different embodiments, and the description is replaced with the first description.

1 is a conceptual diagram of an object preparation facility 100 for inter-floor transfer according to an embodiment of the present invention.

Referring to this drawing, the object preparation facility 100 for inter-floor transport transports the object (A1, A2, see Fig. 3) and waits at the loading position (LP), and the prepared object is to the rack master (RM). Can be conveyed to another layer by Here, the object is a container for accommodating a wafer, and may be, for example, a FOUP (Front Open Unified Pod). The FOUP has a door that can be opened in the front, so it is a container with directionality. The rack master RM is movable between floors along vertical rails extending over several floors, and is also configured to take over the object by a fork F connected to the articulated arm.

The object preparation facility 100 for such interfloor transfer may selectively include, specifically, a shelf module 110, a shuttle module 130, a buffer conveyor module 150, and a positioning module 170. In this embodiment, the set consisting of the shelf module 110, the shuttle module 130, the buffer conveyor module 150, and the positioning module 170 is arranged in a total of three. Among these, the left and right sets have the same length based on the rack master RM, and the center set is configured to have a smaller length than the left and right sets. Thereby, the rack master RM can take over the object from the three sets while moving the fork F along a semicircular trajectory.

The shelf module 110 is configured to store the object in a state that the fork F of the rack master RM can take over. The shelf module 110 may be located in the loading position LP. The shelf module 110 has a first loading part 111 and a second loading part 115 (refer to FIG. 3 above), and they each have a first object (A1) or a second object (A2, see FIG. 3 above). It is configured to support. The first loading part 111 is disposed above the second loading part 115. The shelf module 110 is symmetrical to each other on the left and right based on the rack master (RM), but the center 110 ′ has a configuration different from that of the left and right. These will be described with reference to FIGS. 5 and 6, respectively.

Referring back to this drawing, the shuttle module 130 is configured to be movable between the receiving position RP and the loading position LP, and is configured to convey an object between them. Specifically, the shuttle module 130 is configured to receive the object at the receiving position RP and load the object onto the shelf module 110 at the loading position LP. In the receiving position, the shuttle module 130 takes the object from the buffer conveyor module 150. Here, since the receiving position RP is located within the transfer section CS of the buffer conveyor module 150, the shuttle module 130 enters into the transfer section CS to take over the object. In contrast, if the buffer conveyor module 150 is not employed, the shuttle module 130 may directly take over the object descending from the ceiling from an overhead transfer (OTT).

The buffer conveyor module 150 is a conveyor device configured to convey an object to the receiving position RP. The buffer conveyor module 150 may convey an object by a plurality of rollers 155 arranged side by side on both sides. The shuttle module 130 and the positioning module 170 may be located in an empty space between the two rows of rollers 155. Furthermore, the buffer conveyor module 150 is disposed to horizontally transfer the object from the supply position PP to the receiving position RP. Thereby, the conveying section CS of the buffer conveyor module 150 may include a section connecting the supplying position PP and the receiving position RP. The buffer conveyor module 150 may receive an object descending from the ceiling from the overhead transfer.

The positioning module 170 is a component for positioning an object supplied to the buffer conveyor module 150. To this end, the positioning module 170 is positioned at a supply position PP located within the transport section CS of the buffer conveyor module 150.

According to this configuration, the shuttle module 130 takes the object at the receiving position RP and conveys it to the loading position LP. Furthermore, the shuttle module 130 loads the object onto the shelf module 110 at the loading position LP. Then, the rack master (RM) takes over the object loaded on the shelf module 110, and transports the object to a floor different from the floor on which the shelf module 110 is located.

Here, the object received by the shuttle module 130 may be provided by the buffer conveyor module 150. Accordingly, the buffer conveyor module 150 may control a point in time at which the plurality of objects supplied from the supply position PP are moved to the receiving position RP. In other words, after the shuttle module 130 transports the object to the shelf module 110, the shuttle module 130 moves another object to the receiving position RP at the time it returns to the receiving position RP and waits. ) To be able to take over. Further, when the object reaches the take-up position RP but is not picked up by the shuttle module 130, the buffer conveyor module 150 no longer advances the object toward the take-up position RP. Compared to the case where the overhead transfer directly lowers the object to the shuttle module 130 by the buffer conveyor module 150, the time required to wait on the object preparation facility 100 for inter-floor transfer can be eliminated or reduced.

Further, by receiving the object through the positioning module 170 rather than the buffer conveyor module 150, the object is also transferred to the shelf module 110 through a series of conveying processes in a state in which the posture of the object is accurately aligned. Can be loaded in the correct posture.

A more specific configuration of the object preparation facility 100 for inter-floor transfer will be described with reference to FIG. 2.

2 is a control block diagram of the object preparation facility 100 for inter-floor transfer of FIG. 1.

Referring to this drawing, the shelving module 110 may further include an elevating driving unit 117 for elevating and driving the first loading unit 111. Furthermore, a sensor unit 119 for detecting whether an object is properly loaded may be installed in the first loading part 111 and the second loading part 115.

In addition to the holding unit 131 (see FIG. 3) for holding the object, the shuttle module 130 may include a horizontal movement unit 133, a vertical movement unit 135, and further a rotation driving unit 137. The horizontal moving unit 133 is configured to move the holding unit 131 for holding the object in the horizontal direction between the receiving position RP and the loading position LP. The vertical movement unit 135 is configured to lower the holding unit 131 at the loading position LP, and to raise the holding unit 131 at the receiving position RP. The rotation driving unit 137 is configured to change the direction of the object according to the rack master RM by rotating the holding unit 131. The horizontal movement unit 133, the vertical movement unit 135, and the rotation driving unit 137 may be operated by a mechanical configuration such as a pulley, a ball screw, or a gear while basically having a motor. These specific combinations can be sufficiently understood by those skilled in the art, and a more detailed description will be omitted.

The buffer conveyor module 150 may further include a roller driving unit 157 for driving the roller 155. The roller drive unit 157 may include, for example, a belt connecting a plurality of rollers 155, and a motor and a pulley for rotating the belt.

The positioning module 170 may have an elevating driving unit 175 for elevating and driving the support plate 171 (see FIG. 3 ).

The control module 190 is a component for controlling the shelf module 110, the shuttle module 130, the buffer conveyor module 150, and the positioning module 170. For example, the control module 190 controls the operation of the lift drive unit 117 in the shelf module 110 and obtains information about the position of the object from the sensor unit 119.

The memory 210 is a device that stores specific control information such as an elevation height of the elevation driving unit 117 and a control program. Information and the like stored in the memory 210 are referred to for the operation of the control module 190.

The operation method of the object preparation facility 100 for inter-floor transfer will be described with reference to FIGS. 3 and 4.

First, FIG. 3 is a conceptual diagram illustrating an operation method of the object preparation facility 100 for inter-floor transfer of FIG. 1.

Referring to this drawing, in the buffer conveyor module 150, the roller 155 is rotatably installed on the frame 151. The rollers 155 are arranged continuously from the feeding position PP to the receiving position RP.

The positioning module 170 receives the objects A1 and A2 from the overhead transfer through the support plate 171 at a level higher than the roller 155 in the frame 151. The seating pins 173 installed on the support plate 171 are inserted into the seating grooves formed on the bottom surfaces of the objects A1 and A2, thereby guiding the objects A1 and A2 to be positioned on the support plate 171. In a state in which the objects A1 and A2 are seated on the support plate 171, the support plate 171 descends to a lower level than the roller 155 by the operation of the lifting drive unit 175. Accordingly, the objects A1 and A2 are taken over by the rollers 155 on the buffer conveyor module 150 in their original position.

As the roller 155 rotates by the operation of the roller drive unit 157, the objects A1 and A2 are conveyed from the supply position PP to the receiving position RP. When the objects A1 and A2 reach the receiving position RP, the holding unit 131 of the shuttle module 130 rises in the vertical direction V and operates to take over the objects A1 and A2. In this drawing, the holding unit 131 shows a state in which the first object A1 is taken over. In addition, the holding unit 131 is illustrated as a transport plate in the form of supporting the objects A1 and A2, and the transport plate has a seating pin 132 inserted into the seating groove of the object A1 and A2. . Alternatively, the holding unit 131 may hold the upper portions of the objects A1 and A2.

The holding unit 131 taking over the objects A1 and A2 is rotated along the rotation direction R by the rotation driving unit 137 as needed. Thereby, the direction in which the doors of the objects A1 and A2 are directed can be changed.

The holding unit 131 is moved from the receiving position RP to the loading position LP by the horizontal moving unit 133 along the horizontal direction H. When entering the loading position LP, the holding unit 131 is positioned at a higher level than the first loading portion 111. When the holding unit 131 descends in the vertical direction V by the vertical movement unit 135, the first object A1 is naturally loaded on the first loading part 111 by gravity. This allows passage of the holding unit 131 when the first loading unit 111 and the second loading unit 115 enter the holding unit 131 along the horizontal direction (H) and descend along the vertical direction (V). It is possible to provide a space for passing through.

Thereafter, the holding unit 131 returns from the loading position LP to the receiving position RP along the horizontal direction H. The holding unit 131 rises again along the vertical direction V, and takes over the second object A2 that has reached the receiving position RP by the operation of the roller 155.

Next, FIG. 4 is a conceptual diagram showing another state of the object preparation facility 100 for inter-floor transfer of FIG. 3.

Referring to this drawing, in order for the second object A2 to be loaded on the second loading portion 115, the first loading portion 111 loaded with the first object A1 is driven by the lifting drive unit 117. It rises along the vertical direction (V). Then, a space through which the second object A2 can enter is created between the first loading part 111 and the second loading part 115.

In this state, the holding unit 131 of the shuttle module 130 enters the upper side of the second loading unit 115 while loading the second object A2. As the holding unit 131 descends in the vertical direction V, the second object A2 is loaded on the second loading unit 115, similar to the previous one. Thereafter, the holding unit 131 returns to the receiving position RP. Accordingly, the state in which the first object A1 and the second object A2 are stored in a multilayer structure in the first loading part 111 and the second loading part 115 in the shelf module 110 is completed.

A structure for loading the objects A1 and A2 by the shuttle module 130 on the shelf modules 110 and 110' will be described with reference to FIGS. 5 and 6.

First, FIG. 5 is a perspective view for explaining the shelf module 110 of FIG. 1.

Referring to this drawing, the shelf module 110 is located on the left side of the rack master (RM, see FIG. 1). The shelf module located on the right side of the rack master RM is formed symmetrically with respect to the loading position LP on the shelf module 110.

The first loading part 111 of the shelf module 110 may have a first support part 112 and a second support part 113. Here, the second support part 113 may have a larger area than the first support part 112. Specifically, the first region 113a of the second support part 113 may correspond to the first support part 112. Accordingly, the second support part 113 may further have a second region 113b that protrudes and bends from the first region 113a. Thereby, the second support part 113 may have a'U' shape as a whole.

Due to the shapes of the first support part 112 and the second support part 113, an open area having a'U' shape may be defined as the passage space. Further, the holding unit 131 of the shuttle module 130 enters the loading position LP in the entry direction SD toward the open portion of the'U' shape. On the other hand, the rack master RM may enter the loading position LP in the entry direction RD that crosses the entry direction SD of the shuttle module 130. Here, the door of the FOUP, which is the first object A1, may be disposed to face the entry direction RD of the rack master RM.

The second loading part 115 is located under the first loading part 111. This second loading part 115 may be installed on the upper surface of the base 139 of the shuttle module 130. Unlike the first loading part 111, the second loading part 115 may be fixedly installed on the base 139 because it does not need to rise.

On the other hand, the first loading portion 111 may be connected to the lifting drive unit 117 for lifting thereof. The lifting drive unit 117 has a frame 117a connected to the first loading part 111. The frame 117a may be movably connected to the post 117b. Here, the post 117b is disposed along the vertical direction V, and guides the elevation of the frame 117a and the first loading portion 111 connected thereto along the vertical direction V.

In the above, the first mounting portion 111 and the second mounting portion 115 are respectively formed with mounting pins (114, 116) protruding, these are inserted into the mounting grooves of the objects (A1, A2). Thereby, the directions (postures) of the objects A1 and A2 determined by the positioning module 170 can be maintained even in the shelf module 110.

Next, FIG. 6 is a perspective view for explaining the shelf module 110 ′ of FIG. 1.

Referring to this drawing, the first loading part 111 ′ may have a pair of support parts 112 ′ and 113 ′ arranged side by side. The space between the pair of support parts 112 ′ and 113 ′ may be defined as the passage space. Corresponding to this passage space, the direction SD in which the shuttle module 130 enters is the opposite direction to the direction RD′ in which the rack master RM enters.

The second loading part 115 ′ is also located under the first loading part 111 ′ and may be fixedly installed on the base 139 of the shuttle module 130.

The elevating driving unit 117 ′ for elevating the first loading part 111 ′ may have a frame 117a ′ and a post 117b ′ as before. Detailed explanations about them are replaced with the previous explanation.

In the above, the first mounting portion 111 ′ and the second mounting portion 115 ′ have mounting pins 114 ′ and 116 ′ protruding, respectively, and they are inserted into the mounting grooves of the objects A1 and A2. Thereby, the directions (postures) of the objects A1 and A2 determined by the positioning module 170 can be maintained even in the shelf module 110'.

Now, a method for preparing an object for inter-floor transport using the object preparation facility 100 for inter-floor transport will be described with reference to FIGS. 7 to 10.

First, FIG. 7 is a flow chart of a method for preparing an object for interlayer transport according to another embodiment of the present invention.

Referring to this drawing (and FIGS. 1 to 6 ), a method of preparing an object for interlayer transport may start from the step S1 of transporting the objects A1 and A2 to the loading position LP. To this end, the control module 190 allows the shuttle module 130 to take the objects A1 and A2 at the receiving position RP and transport them to the loading position LP. To this end, the control module 190 operates the horizontal movement unit 133 and the vertical movement unit 135 of the shuttle module 130, respectively. Further, the control module 190 may operate the rotation driving unit 137 to rotate the holding unit 131 by approximately 90° when the object A1 and A2 needs to be changed in direction.

At the loading position LP, the first object A1 is loaded on the first loading part 111 (S2). To this end, in a state in which the first loading portion 111 is disposed above the second loading portion 115, the control module 190 is the holding unit 131 of the shuttle module 130 and the first loading portion 111 After entering the upper side of ), the first object A1 is loaded onto the first loading part 111 while descending. Thereby, the first loading part 111 supports the lower part of the first object A1 to stably support it.

In this state, the first loading portion 111 is raised (S5). To this end, the control module 190 operates the lift driving unit 117 so that the first loading unit 111 rises to the state that supports the first object A1. Since the first object A1 rises with its lower portion stably supported by the first loading portion 111, the risk of falling during the ascent process is structurally eliminated.

After the 1st loading part 111 is raised, the 2nd object A2 is conveyed to the loading position LP (S7). This may be performed in the same manner as the control module 190 controls the shuttle module 130 to transport the first object A1.

After that, the second object A2 is loaded on the second loading unit 115 (S9). To this end, the control module 190 lowers the holding unit 131 of the shuttle module 130 from the loading position LP, so that the second object A2 is loaded on the second loading part 115. Thereby, the 2nd loading part 115 is also in a state which supports the 2nd object A2.

FIG. 8 is a flow chart for explaining specific contents of step S3 of FIG. 7.

Referring to this drawing (and FIGS. 1 to 6 ), when the first object A1 is loaded on the first loading unit 111, it can be determined whether or not the correct position thereof (S11). To this end, the control module 190 may detect the first object A1 using the sensor unit 119 and determine whether the first object A1 is in its correct position.

If the first object A1 is not correctly positioned on the first loading unit 111, the control module 190 restarts the shuttle module 130 to retry loading the first object A1. (S13). In other words, after the holding unit 131 raises the first object A1, it separates from the loading position LP, returns to the loading position LP, and descends to the lower side of the first loading part 111 It is to load the first object (A1) on the first loading portion 111.

If the first object A1 is correctly positioned on the first loading part 111 through such correction or without such correction, it is sufficient to prepare for the next step of raising the first loading part 111 (S15). In this case, the control module 190 may allow the elevation of the first loading unit 111 to be permitted to allow the elevation driving unit 117 to operate.

9 is a flow chart for explaining specific details of another step (S9) of FIG. 7.

Referring to this drawing (and FIGS. 1 to 6 ), it may be determined whether the second object A2 is correctly positioned on the second loading part 115 (S21). This is determined by the control module 190 also detecting the second object A2 using the sensor unit 119.

If the second object A2 is not positioned correctly, loading thereon may be retried (S23). This may be performed by controlling the shuttle module 130 by the control module 190 as in a retry on the first object A1.

If the second object A2 is positioned correctly, the acceptance of the objects A1 and A2 may be approved (S25). The control module 190 recognizes that the objects A1 and A2 are prepared in a acceptable state, and approves inter-floor transfer by the rack master RM. Accordingly, the rack master RM can access and take over the objects A1 and A2.

10 is a flow chart for explaining the preceding steps related to another step (S1 and S7) of FIG. 7.

Referring to this drawing (and FIGS. 1 to 6 ), additional control may be implemented in connection with conveying the objects A1 and A2 to the loading position LP.

Specifically, the objects A1 and A2 may be supplied from the supply position PP by an overhead transfer or the like (S31). In this case, the control module 190 raises the positioning module 170 higher than the buffer conveyor module 150, so that the objects A1 and A2 are seated on the positioning module 170, The exact position can be set. As the positioning module 170 descends, the objects A1 and A2 may be handed over to the buffer conveyor module 150 in a fixed position.

Next, it is determined whether the shuttle module 130 is waiting at the take-up position RP (S33).

If the holding unit 131 of the shuttle module 130 waits at the takeover position (RP), the control module 190 operates the rollers 155 to make the objects A1 and A2 reach the takeover position (RP). It becomes (S35). Otherwise, the control module 190 may adjust the operation of the buffer conveyor module 150 to control the timing of providing the objects A1 and A2 to the receiving position RP.

The shuttle module 130 takes over the objects A1 and A2 at the takeover position RP (S37). To this end, the control module 190 lifts the holding unit 131 of the shuttle module 130, so that the holding unit 131 lifts the objects A1 and A2 located on the roller 155, and the buffer conveyor module (150) to take over.

Next, it is determined whether or not it is necessary to change the direction of the objects A1 and A2 (S39). The control module 190 determines whether to change the direction in consideration of the effective directions of the objects A1 and A2 to be stored in the shelf modules 110 and 110'.

If direction change is required, the shuttle module 130 may be rotated (S41). Specifically, the control module 190 operates the rotation drive unit 137 to rotate the holding unit 131 holding the objects A1 and A2.

Thereafter, the objects A1 and A2 are returned to the loading position LP (S43). The control module 190 controls the shuttle module 130 so that the objects A1 and A2 are conveyed.

The equipment and method for preparing an object for interlayer transport as described above are not limited to the configuration and operation of the embodiments described above. The above embodiments may be configured so that all or a part of each of the embodiments may be selectively combined and various modifications may be made.

100: object preparation facility for interfloor transfer
110,110': shelf module 111,111': first loading part
115,115': second loading unit 130: shuttle module
131: holding unit 133: horizontal moving unit
135: vertical movement unit 137: rotation drive unit
150: buffer conveyor module 155: roller
170: positioning module 190: control module

Claims (16)

A first loading portion configured to support a first object, a second loading portion disposed below the first loading portion and configured to support a second object, and an elevating drive unit configured to drive the first loading portion up and down Shelf module having a;
A shuttle module configured to be movable between a receiving position and a loading position, and configured to receive the first object or the second object at the receiving position and load the first or second stacking unit at the loading position ; And
It is configured to control the lift drive unit and the shuttle module, and the shuttle module loads the first object onto the first loading unit and the lift drive unit raises the first loading unit, the shuttle module And a control module configured to load the second object into the second loading unit,
The shuttle module may include a holding unit having a transfer plate configured to support the first object or the second object; A horizontal moving unit configured to horizontally move the holding unit between the receiving position and the loading position; And a vertical movement unit configured to elevate the conveyance plate from a position higher than the first stacking unit and the second stacking unit to a position lower than them,
Each of the first loading portion and the second loading portion is formed to provide a passage space allowing passage of the conveying plate in the horizontal direction and descending in the vertical direction.
delete delete delete The method of claim 1,
The first loading part,
It has a pair of supports arranged side by side,
The direction in which the conveyance plate enters the passage space defined between the pair of support portions is,
An object preparation facility for inter-floor conveyance that becomes a direction opposite to the entry direction of the rack master that takes over the first object and the second object and carries the inter-floor transport.
The method of claim 1,
The first loading part,
A first support; And
And a second support portion having a first region corresponding to the first support portion and a second region protruding and bent from the first region,
The direction in which the transfer plate enters the passage space defined between the first support part and the second support part is,
An object preparation facility for inter-floor conveyance that becomes a direction crossing the entry direction of the rack master that takes the first object and the second object and carries the inter-floor transport.
The method of claim 1,
The shuttle module,
Further comprising a rotation drive unit for rotating the holding unit to change the direction of the first object or the second object.
The method of claim 1,
The shelf module,
An object preparation facility for inter-floor conveyance, further comprising a sensor unit installed on the first loading unit and the second loading unit, sensing the first object or the second object and transmitting it to the control module.
The method of claim 1,
Further comprising a buffer conveyor module arranged to convey the first object and the second object to the receiving position, and controlling the conveyance of the first object and the second object by the control module,
The argument position is,
Located within the transfer section of the buffer conveyor module, the shuttle module is configured to enter an area occupied by the buffer conveyor module in order to take over the first object and the second object.
The method of claim 9,
An object preparation facility for inter-floor transport, further comprising a positioning module positioned within the transport section of the buffer conveyor module and for correctly positioning the loaded first object or the second object on the buffer conveyor module.
Conveying the first object or the second object from the receiving position to the loading position using a shuttle module;
Loading the first object into a first loading unit at the loading position using the shuttle module so that the first loading portion is in a state of supporting the first object;
Determining whether the first object loaded on the first loading section is positioned in the first loading section using a sensor unit;
If the first object is not correctly positioned on the first loading unit, retrying loading the first object on the first loading unit using the shuttle module;
If the first object is positioned in the first loading portion, preparing for operation of the lifting drive unit to raise the first loading portion;
Raising the first loading part supporting the first object by using the lift driving unit; And
After completion of the elevation of the first loading part, loading the second object into the second loading part at the loading position using the shuttle module, and causing the second loading part to support the second object. , How to prepare objects for inter-floor transfer
delete The method of claim 11,
Determining whether the second object loaded on the second loading section is positioned in the second loading section using the sensor unit;
If the second object is not correctly positioned on the second loading unit, retrying loading the second object on the second loading unit using the shuttle module; And
If the second object is positioned in the second loading unit, further comprising the step of accepting the acceptance of the first object and the second object by the rack master for inter-floor transport, object for inter-floor transport How to prepare.
The method of claim 11,
Before loading the first object or the second object into the first loading unit or the second loading unit, rotating the shuttle module to change the direction of the first object or the second object Containing, a method of preparing an object for interlayer transport.
The method of claim 11,
Before conveying the first object or the second object from the receiving position to the loading position using the shuttle module,
The method of preparing an object for inter-floor conveyance further comprising the step of controlling a timing of providing the first object or the second object to the receiving position using a buffer conveyor module.
The method of claim 15,
The step of receiving the first object or the second object from a supply position using a positioning module, and loading the first object or the second object to the buffer conveyor module while the positioning module descends How to prepare an object for inter-floor transfer.

Images