KR102210152B1 - Method for manufacturing display apparatus and display apparatus - Google Patents

Abstract

The present invention relates to a method of manufacturing a display device and a display device, and more particularly, to a method of manufacturing a display device capable of rapidly and efficiently transferring a plurality of light emitting elements to a display panel, and a display device manufactured thereby. .
A method of manufacturing a display device according to an embodiment comprises forming a pixel CSP including a plurality of light emitting elements in each of a plurality of openings arranged in an array form in a transfer frame to form a pixel CSP array in the transfer frame, forming a pixel CSP array. step; A primary transfer step of transferring the pixel CSP array from the transfer frame to a carrier substrate; And a secondary transfer step of transferring the pixel CSP array transferred to the carrier substrate to the display panel.

Description

A display device manufacturing method and a display device TECHNICAL FIELD [METHOD FOR MANUFACTURING DISPLAY APPARATUS AND DISPLAY APPARATUS}

The present invention relates to a method of manufacturing a display device and a display device, and more particularly, to a method of manufacturing a display device capable of rapidly and efficiently transferring a plurality of light emitting elements to a display panel, and a display device manufactured thereby. .

Light Emitting Diode (LED) is one of light emitting devices that emit light when current is applied. Light-emitting diodes can emit high-efficiency light with low voltage, so they have excellent energy saving effects. Recently, the problem of luminance of light emitting diodes has been greatly improved, and thus, it has been applied to various devices such as backlight units of liquid crystal display devices, electric signs, displays, and home appliances.

The size of a micro light emitting diode (μ-LED) is very small, ranging from 1 to 100 μm, and approximately 25 million or more pixels are required to implement a 40-inch display device. Accordingly, there is a problem in that it takes at least one month in time by a simple pick and place method to make one 40-inch display device.

Existing micro light-emitting diodes (μ-LEDs) are manufactured in plural on a sapphire substrate, and then, by a mechanical transfer method, pick & place, the micro light-emitting diodes are one by one on a glass or flexible substrate. Is transferred. Since the micro light emitting diodes are picked up one by one and transferred, it is referred to as a 1:1 pick-and-place transfer method.

However, since the size of the micro light emitting diode chip manufactured on the sapphire substrate is small and thin, the chip is damaged, the transfer fails, or the chip is aligned during the pick-and-place transfer process of transferring the micro light emitting diode chips one by one. Problems such as (Alignment) failure or chip tilting occur. In addition, there is a problem that the time required for the transfer process takes too long.

The present invention provides a method of manufacturing a display device capable of rapidly transferring a plurality of light emitting elements to a display panel.

In addition, a method of manufacturing a display device capable of rapidly manufacturing a large-area display device is provided.

In addition, there is provided a display device manufactured by a method of manufacturing a display device.

The problem to be solved of the present invention is not limited to the problems mentioned above, and other problems that are not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the following description. will be.

A method of manufacturing a display device according to an embodiment comprises forming a pixel CSP including a plurality of light emitting elements in each of a plurality of openings arranged in an array form in a transfer frame to form a pixel CSP array in the transfer frame, forming a pixel CSP array. step; A primary transfer step of transferring the pixel CSP array from the transfer frame to a carrier substrate; And a secondary transfer step of transferring the pixel CSP array transferred to the carrier substrate to the display panel.

A method of manufacturing a display device according to an embodiment includes forming a plurality of pixels CSPs including a plurality of light emitting elements on a first transfer medium, each of the plurality of pixels CSPs being separated by a protective layer, and the first transfer medium Forming a pixel CSP array having a first adhesive force between the and the protective layer; A primary transfer step of transferring the pixel CSP array from the first transfer medium to a second transfer medium having a second adhesive force greater than the first adhesive force; And a second transfer step of transferring the pixel CSP array transferred to the second transfer medium to a third transfer medium having a third adhesive force greater than the second adhesive force applied to the display panel.

The display device according to the embodiment may be manufactured by the method of manufacturing the display device described above.

The use of the method for manufacturing a display device according to the embodiment has an advantage of being able to quickly and efficiently transfer a plurality of light emitting elements to a display panel. In particular, it is possible to quickly transfer a plurality of light emitting devices to the display panel at once without controlling one by one of the micro or mini light emitting devices. Therefore, there is an advantage in that manufacturing cost and time of the display device can be significantly reduced.

In addition, the method of manufacturing the display device according to the embodiment has an advantage of maximizing a transfer success rate because it uses a large difference in adhesion between transfer media, not a method of controlling physical force or adhesion such as electrostatic attraction.

In addition, when the size of the light emitting area of the LED chip is 100 μm or less, the light efficiency rapidly decreases due to epitaxial damage due to dicing or the like. On the other hand, the present invention has an advantage that the light efficiency does not deteriorate because the transfer is performed in a pixel CSP unit rather than a light emitting diode chip unit. More specifically, when the dicing process is performed, damage may be caused by the laser. The percentage (%) occupied by the damaged portion of the light emitting area varies according to the size of the light emitting area Epi of the light emitting diode. That is, the ratio of the length of the surface circumference to the area increases as the size of the light emitting area decreases. For example, when the size of the light emitting area is 300x300um, the surface-to-area ratio is 1, and 50x50um is about 6 times larger. Therefore, the influence of defects on the surface can be at least 6 times greater. As a result, the luminous efficiency drops sharply. On the other hand, the present invention is not dicing in units of chips, but dicing in units of pixels, regardless of the EPI area. Therefore, there is an advantage that there is little reduction in light efficiency at the pixel level.

In addition, when manufacturing a large-area display device, there is an advantage in that the transfer method can be rapidly manufactured by changing the position and repeatedly executing the transfer method.

1 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention.
2A to 2C are views for explaining a transfer frame 200 used in a method of manufacturing a display device according to an embodiment of the present invention.
3 to 7 are diagrams for explaining in detail the step 110 of forming a pixel CSP array in the transfer frame shown in FIG. 1.
8 to 10 are diagrams for explaining in detail a step 130 of transferring the pixel CSP array formed on the transfer frame shown in FIG. 1 to a carrier substrate.
11 to 15 are diagrams for explaining in detail a step 150 of transferring the pixel CSP array transferred to the carrier substrate shown in FIG. 1 to the display panel.

In the description of the embodiment, in the case of being described as being formed on the “top (top) or bottom (bottom)” of each component, the top (top) or bottom (bottom) of the two components directly contact each other Or one or more other components are disposed between the two components. In addition, when expressed as "upper (upper) or lower (lower)", the meaning of not only an upward direction but also a downward direction based on one component may be included.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Also, the size of each component does not fully reflect the actual size.

1 is a flowchart illustrating a method of manufacturing a display device according to an embodiment of the present invention.

Referring to FIG. 1, a method of manufacturing a display device according to an embodiment of the present invention includes forming a pixel CSP array on a transfer frame (110), and using a pixel CSP array formed on the transfer frame as a carrier substrate. Transferring 130 and transferring 150 of the pixel CSP array transferred to the carrier substrate to the display panel. Steps 110, 130, and 150 will be described in detail below with reference to the accompanying drawings.

2A to 2C are views for explaining a transfer frame 200 used in a method for manufacturing a display device according to an embodiment of the present invention, and FIG. 2A is a transfer frame 200 2(b) is a partially enlarged plan view of FIG. 2(a), and FIG. 2(c) is a cross-sectional view of FIG. 2(b).

2A to 2C, the transfer frame 200 has a plate shape, and includes an upper surface and a lower surface, and a plurality of side surfaces. The transfer frame 200 may have a flat plate shape, but is not limited thereto, and may have a plate shape having a predetermined curvature. When the transfer frame 200 has a flat plate shape, the transfer frame 200 may be referred to as a horizontal frame.

The transfer frame 200 has a plurality of openings 210. Each of the openings 210 is formed to penetrate the upper and lower surfaces of the transfer frame 200, and the plurality of openings 210 may be arranged in an array form in the transfer frame 200 in a plurality of row and column directions. The interval (picth) between the plurality of openings 210 may be the same as the interval of a pixel CSP array formed on a display panel to be described later.

The size of the opening 210 of the transfer frame 200 may correspond to the size of a pixel CSP (CSP). For example, the width (W) * length (h) * thickness (t) of the opening 210 of the transfer frame 200 may be 30 * 30 * 10 (μm) ~ 1000 * 1000 * 500 (μm). .

The upper opening and the lower opening of the opening 210 of the transfer frame 200 may have a rectangular shape, but are not limited thereto and may be a circle, an ellipse, or a polygon. In addition, the upper opening and the lower opening may have different shapes, and may have different sizes.

The three-dimensional structure of the opening 210 of the transfer frame 200 may be a hexahedral empty space, but is not limited thereto, and the shape of the opening 210 may be a cylindrical empty space or an oval-cylindrical empty space. It may be a space, an empty space in the shape of a polygonal cylinder, or an empty space in the shape of a polyhedron.

The material of the transfer frame 200 is a hard material, and may be, for example, any one of metal, ceramic, resin, plastic, or a combination thereof.

The thickness t of the transfer frame 200 may be 10 (μm) to 500 (μm).

3 to 7 are diagrams for explaining in detail the step 110 of forming a pixel CSP array in the transfer frame shown in FIG. 1.

3 is a schematic cross-sectional view of any one of the plurality of openings 210 of the transfer frame 200 shown in FIG. 2.

Referring to FIG. 3, a substrate 300 is formed on one of the upper and lower surfaces of the transfer frame 200 (lower surface in FIG. 3 ). As the substrate 300 is formed under the transfer frame 200, the lower opening of the opening 210 is blocked by the substrate 300. A space in which a pixel CSP can be formed is provided by the opening 210 and the substrate 300.

Next, referring to FIG. 4, a plurality of light emitting devices 400R, 400G, and 400B are disposed on the substrate 300 inside the opening 210. Here, the pads of each of the plurality of light emitting devices 400R, 400G, and 400B may be disposed to contact the upper surface of the substrate 300.

The plurality of light-emitting elements 400R, 400G, and 400B may include a first light-emitting element 400R, a second light-emitting element 400G, and a third light-emitting element 400B. The first light emitting device 400R may be a red light emitting chip that emits red light, the second light emitting device 400G may be a green light emitting chip that emits green light, and the third light emitting device 400B emits blue light It may be a blue light emitting chip.

Each of the light emitting devices 400R, 400G, and 400B may have a flip chip structure that does not require a wire. Each of the light-emitting devices 400R, 400G, and 400B may each emit light of a specific wavelength, or may emit light of the specific wavelength by a fluorescent material or quantum dot included therein.

In addition, each of the light emitting devices 400R, 400G, and 400B may be a Chip Scale Package (CSP). CSP (Chip Scale Package) is a generic term for a small package close to the size of a chip, and is a package having a size close to a bare chip without a lead frame protecting the outer shape of the chip and a wire for electrical connection. When each of the light-emitting elements 400R, 400G, and 400B is a CSP, it may be composed of a flip chip emitting light of a specific wavelength and a phosphor covering the flip chip. Light emitted from the flip chip excites the phosphor, so that light of a specific wavelength may be emitted.

A plurality of light emitting devices 400R, 400G, and 400B disposed in the opening 210 may be included in one pixel CSP 400. One pixel CSP 400 may function as one pixel that emits various colors in a display panel to be described later. One pixel CSP 400 may include a plurality of CSPs. For example, one pixel CSP 400 may include a red CSP, a green CSP, and a blue CSP.

Next, referring to FIG. 5, the protective layer 500 is filled in the opening 210 and the protective layer 500 is cured. One pixel CSP 400 may include a passivation layer 500. That is, one pixel CSP 400 may include a plurality of light-emitting elements 400R, 400G, and 400B and a protective layer 500 encapsulating the plurality of light-emitting elements 400R, 400G, and 400B.

The shape of the cured protective layer 500 or the shape of one pixel CSP 400 corresponds to the shape of the opening 210 of the transfer frame 200. Accordingly, the shape of the protective layer 500 or the shape of one pixel CSP 400 may vary depending on the shape of the opening 210 of the transfer frame 200. The shape of the opening 210 of the transfer frame 200 can be understood from the shape of the protective layer 500 or the shape of one pixel CSP 400, and through this, a method of manufacturing a display device according to an embodiment of the present invention can be described. Can be estimated.

Next, referring to FIG. 6, when the protective layer 500 is cured, the substrate 300 is separated from the transfer frame 200 and the protective layer 500. When the substrate 300 is separated, a plurality of pads 410R, 410G, and 410B of the pixel CSP 400 may be exposed to the outside. The number of pads 410R, 410G, 410B may vary depending on the number of light-emitting elements included in one pixel CSP 400, for example, the number of light-emitting elements included in one pixel CSP 400 If there are three, since two pads are required for each light emitting element, a total of six pads can be formed, or a total of four pads can be formed when the (+) electrode is a common electrode.

After forming the pixel CSP 400 in each of the plurality of openings 210 of the transfer frame 200, and filling and curing the protective layer 500 for each of the plurality of openings 210, the substrate as shown in FIG. When 300 is removed from the transfer frame 200, the plurality of light emitting devices 400R, 400G, 400B, and the protective layer 500, a plurality of openings 210 of the transfer frame 200 as shown in FIG. 7 A pixel CSP array including a plurality of pixel CSPs 400 may be formed.

Meanwhile, the transfer frame 200 may be referred to as a first transfer medium in a method of manufacturing a display device according to an embodiment of the present invention. More specifically, a pixel CSP array may be formed by forming a plurality of pixel CSPs including a plurality of light emitting elements on the first transfer medium. Here, each of the plurality of pixel CSPs is separated by a protective layer, and has a first adhesive force between the first transfer medium and the protective layer.

8 to 10 are diagrams for explaining in detail a step 130 of transferring the pixel CSP array formed on the transfer frame shown in FIG. 1 to a carrier substrate. The step 130 of transferring the pixel CSP array formed on the transfer frame to the carrier substrate may be referred to as'primary transfer'.

FIG. 8 is a cross-sectional view of a part of a transfer frame 200 and three pixel CSPs 400P1, 400P2, 400P3 including protective layers 500P1, 500P2, and 500P3 encapsulating three light emitting devices in FIG. 7 to be.

Referring to FIG. 8, a first pixel CSP 400P1 is encapsulated in a first opening of a transfer frame 200 by a first protective layer 500P1, and a second pixel CSP 400P2 is protected as a second pixel. The layer 500P2 is encapsulated in the second opening of the transfer frame 200, and the third pixel CSP 400P3 is inserted into the third opening of the transfer frame 200 by the third protective layer 500P3. It is encapsulated.

Next, referring to FIG. 9, the carrier substrate 900 is attached to the upper surface of the transfer frame 200 and the upper surfaces of the first to third protective layers 500P1, 500P2, and 500P3. Here, the carrier substrate 900 is for extracting the corresponding protective layers 500P1, 500P2, 500P3 encapsulating each pixel CSP (400P1, 400P2, 400P3) from the plurality of openings 210 of the transfer frame 200. will be. Here, the carrier substrate 900 may also be referred to as a'transfer adhesive member'. The carrier substrate may also be referred to as a transfer adhesive member, and an adhesive or adhesive is applied to these materials such as PET, PP, PE, PS resin plates, etc., or these materials have a thin thickness in the form of a tape and are adhesive on one side thereof. B adhesive can be applied.

Next, referring to FIG. 10, the transfer frame 200 is removed. If the adhesive force between the carrier substrate 900 and each protective layer 500P1, 500P2, 500P3 is greater than the adhesive force between the transfer frame 200 and each protective layer 500P1, 500P2, 500P3, only the transfer frame 200 is carrier. It can be removed from the substrate 900 and the plurality of protective layers 500P1, 500P2, 500P3. Therefore, it is preferable that the carrier substrate 900 has an adhesive force greater than that between the transfer frame 200 and each of the protective layers 500P1, 500P2, and 500P3.

Meanwhile, the carrier substrate 900 may be referred to as a second transfer medium in the method of manufacturing a display device according to an embodiment of the present invention. The second transfer medium and the protective layer have a second adhesive force greater than the first adhesive force. Accordingly, the above-described primary transfer step may be a step of transferring the pixel CSP array formed on the first transfer medium from the first transfer medium to a second transfer medium having a second adhesive force greater than the first adhesive force. For example, the second adhesive force may be several hundred times greater than the first adhesive force. More specifically, the first adhesive force may be 5 gf/25mm to 15 gf/25mm, and the second adhesive force may be 2,000 gf/25mm to 4,000 gf/25mm. More preferably, the first adhesive force may be 10 gf/25mm, and the second adhesive force may be 3,000 gf/25mm.

11 to 15 are diagrams for explaining in detail a step 150 of transferring the pixel CSP array transferred to the carrier substrate shown in FIG. 1 to the display panel.

11 is a view for explaining the structure of the display panel 1100, FIG. 11(a) is an enlarged plan view of a part of the display panel 1100, and FIG. 11(b) is a view of FIG. 11(a) ) Is a side view.

Referring to FIG. 11, the display panel 1100 includes a plurality of pads 1150 electrically connected to the pads 410P1, 410P2, and 410P3 of the plurality of pixel CSPs shown in FIG. 10.

A plurality of pads 1150 may be arranged on the upper surface of the display panel 1100. The plurality of pads 1150 are arranged in row and column directions for each of the plurality of pad groups. Each pad group includes a plurality of pads electrically connected to one pixel CSP. Here, the number of pads may be 6, but is not limited thereto, and the number of pads may vary according to the number of pads formed in one pixel CSP. Here, the pitch between the plurality of pad groups may be the same as the distance between the plurality of openings 210 of the transfer frame 200 shown in FIG. 2.

Next, referring to FIG. 12, a solder paste 1200 is applied on a plurality of pads 1150 of the display panel 1100. The solder paste 1200 may be applied on the plurality of pads 1150 of the display panel 1100 through various methods such as screen printing, dispensing, and jetting.

Next, referring to FIG. 13, a plurality of protective layers 500P1, 500P2 attached to the carrier substrate 900 and the carrier substrate 900 manufactured in FIG. 10 and having pixel CSPs 400P1, 400P2, 400P3 therein. , 500P3) is transferred onto the display panel 1100, and the pads 410P1, 410P2, 410P3 of each pixel CSP (400P1, 400P2, 400P3) are applied to the pads 1150 of the display panel 1100. 1200).

After the pads 410P1, 410P2, 410P3 of the pixel CSPs 400P1, 400P2, and 400P3 are in contact with the pads 1150 of the display panel 1100 through the solder paste 1200, for example, a self-aligning paste (Self Align Paste, SAP) When a predetermined heat is applied using a soldering method, the solder particles contained in the solder paste 1200 are pads of the pixel CSPs (400P1, 400P2, 400P3) (410P1, 410P2, 410P3) And the pad 1150 of the display panel 1100 may be self-assembled. Meanwhile, the thermosetting resin included in the solder paste 1200 may be cured by heat.

Next, referring to FIG. 14, when the pads 410P1, 410P2, 410P3 of the pixel CSPs 400P1, 400P2, and 400P3 and the pads 1150 of the display panel 1100 are soldered, the carrier substrate 900 is It is peeled off from the protective layers 500P1, 500P2, 500P3. Here, the soldering adhesion between the pads 410P1, 410P2, 410P3 of the pixel CSPs (400P1, 400P2, 400P3) and the pads 1150 of the display panel 1100 is the carrier substrate 900 and each of the protective layers 500P1, 500P2, Since the adhesion between 500P3) is much greater than that between, only the carrier substrate 900 can be easily separated.

15 is a plan view showing that a plurality of protective layers 500P1, 500P2, 500P3 encapsulating one pixel CSP shown in FIG. 14 are transferred to the display panel 1100 along a plurality of row and column directions. .

Meanwhile, the solder paste 1200 may be referred to as a third transfer medium in the method of manufacturing a display device according to an embodiment of the present invention. The third adhesive force, which is the soldering adhesive force between the third transfer medium and the pad of the pixel CSP, is greater than the second adhesive force. Accordingly, the above-described secondary transfer step may be a step of transferring the pixel CSP array transferred to the second transfer medium to a third transfer medium having a third adhesive force greater than the second adhesive force applied to the display panel. For example, the third adhesion may be thousands of times greater than the second adhesion. More specifically, the second adhesive force may be 2,000 gf/25mm to 4,000 gf/25mm, and the third adhesive force may be 800,000 gf/25mm to 1,200,000 gf/25mm. More preferably, the second adhesive force may be 3,000 gf/25mm, and the third adhesive force may be 1,000,000 gf/25mm.

It is a task to be achieved by the present invention to implement the third adhesive force to have a significant adhesive force that is hundreds to thousands of times larger than the first adhesive force for the second adhesive force than for the second adhesive force so that simultaneous transfer to all pixel CSPs can be completed. , This has the advantage of maximizing the transfer success rate by using the bonding force of the adhesive force itself, rather than the concept of transferring by controlling the physical force or adhesive force such as electrostatic attraction. Here, the meaning of controlling the adhesive force means controlling the adhesive force by controlling certain conditions such as exposure, temperature, and heat, and in the embodiment of the present invention, the adhesive force is not controlled, but the difference in the adhesive force between the transfer media is used.

The number of openings 210 of the transfer frame 200 illustrated in FIG. 2 and the number of pixel CSPs 400 formed in the display panel 1100 illustrated in FIG. 15 are illustrated to correspond to each other, but the present invention is not limited thereto. . For example, in order to manufacture a large-area display panel, the transfer frame 200 may be repeatedly used two or more times on one large-area display panel. This has the advantage of being able to quickly manufacture a large-area display panel.

Again, referring to FIG. 1, although not shown in FIG. 1, a rework step may be further included. The rework step is a step of removing a pixel CSP determined to be malfunctioning or defective from among the pixel CSPs formed in the display panel 1100 illustrated in FIG. 15 and placing a new pixel CSP at the position of the removed pixel CSP. A new pixel CSP that is normally operating may be located using a pick and place device (not shown). By further proceeding with the rework step, since the malfunction or defective pixel CSP is removed, and a new pixel CSP is filled in the place where the defective pixel CSP was to be located in the display panel, compared to the method of manufacturing the display device shown in FIG. There is an advantage of remarkably reducing the defects of (1100).

Features, structures, effects, and the like described in the embodiments above are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Further, the features, structures, effects, and the like illustrated in each embodiment can be implemented by combining or modifying other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Accordingly, contents related to such combinations and modifications should be interpreted as being included in the scope of the present invention.

In addition, although the embodiments have been described above, these are only examples and do not limit the present invention, and those of ordinary skill in the field to which the present invention pertains will not depart from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications not illustrated are possible. For example, each constituent element specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention defined in the appended claims.

200: transcription frame
300: substrate
400: Pixel CSP
500: protective layer
900: carrier substrate
1100: display panel

Claims (12)

Forming a pixel CSP array including a plurality of light emitting elements in each of a plurality of openings arranged in an array in the transfer frame to form a pixel CSP array in the transfer frame;
A primary transfer step of transferring the pixel CSP array from the transfer frame to a carrier substrate; And
A secondary transfer step of transferring the pixel CSP array transferred to the carrier substrate to a display panel;
Containing, a method of manufacturing a display device.
The method of claim 1,
The spacing between the plurality of openings of the transfer frame is the same as the spacing between the pixel CSP arrays transferred to the display panel.
The method of claim 1,
The pixel CSP includes a red light emitting device, a green light emitting device, and a blue light emitting device.
The method of claim 1, wherein the step of forming the pixel CSP array comprises:
Disposing a substrate under the transfer frame to close a lower opening of each of the plurality of openings;
Disposing the plurality of light emitting devices on the substrate inside the plurality of openings;
Filling and curing a protective layer encapsulating the plurality of light emitting devices in the plurality of openings; And
Removing the substrate from the transfer frame, the plurality of light emitting devices, and the protective layer;
Containing, a method of manufacturing a display device.
The method of claim 4,
The plurality of light emitting devices are flip chips,
The disposing of the plurality of light-emitting elements on the substrate in the plurality of openings includes placing the flip chip pads in contact with the upper surface of the substrate in the plurality of openings.
The method of claim 1, wherein the first transfer step,
Attaching the carrier substrate to the transfer frame and the pixel CSP array; And
Separating the carrier substrate from the transfer frame from the plurality of openings of the transfer frame while the pixel CSP array is attached to the carrier substrate;
Containing, a method of manufacturing a display device.
The method of claim 6,
The adhesive force between the carrier substrate and the pixel CSP is greater than that between the transfer frame and the pixel CSP.
The method of claim 1, wherein the secondary transfer step,
Applying a solder paste on a plurality of pads of the display panel;
Soldering the pads of the pixel CSP array transferred to the carrier substrate by contacting the applied solder paste; And
Separating the carrier substrate from the pixel CSP array;
Containing, a method of manufacturing a display device.
The method of claim 8, wherein the soldering step,
Applying predetermined heat to the pad of the display panel, the solder paste, and the pad of the pixel CSP array; And
Self-assembling solder particles in the solder paste between pads of the display panel and pads of the pixel CSP array;
Containing, a method of manufacturing a display device.
The method of claim 1,
A method of manufacturing a display device, further comprising a rework step of replacing a defective pixel CSP among the pixel CSP array transferred to the display panel with a new pixel CSP.
A plurality of pixel CSPs including a plurality of light emitting elements are formed on a first transfer medium, each of the plurality of pixels CSPs being separated by a protective layer, and having a first adhesive force between the first transfer medium and the protective layer, Forming a pixel CSP array;
A primary transfer step of transferring the pixel CSP array from the first transfer medium to a second transfer medium having a second adhesive force greater than the first adhesive force; And
A secondary transfer step of transferring the pixel CSP array transferred to the second transfer medium to a third transfer medium having a third adhesive force greater than the second adhesive force applied to the display panel;
Containing, a method of manufacturing a display device.
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