KR102208449B1 - Gas pressure casting method using porous tube for diffusion bonding copper to monoblock tungsten, and method for manufacturing laminated parts using nuclear fusion reactor - Google Patents

Abstract

The present invention relates to a gas-pressure casting method using a porous tube for diffusion-bonding copper to monoblock-type tungsten by applying a pressure in a direction perpendicular to a bonding surface by inserting a porous tube into the circumference of a cylindrical oxygen-free copper (OFC) layer when casting the oxygen-free copper (OFC) layer in a tungsten monoblock, and a manufacturing method of a laminated part of a nuclear fusion reactor using the same. The gas-pressure casting method comprises: a step of inserting a cylindrical oxygen-free copper (OFC) layer into the circumference of a monoblock made of tungsten or a tungsten alloy and provided with a penetration hole, and inserting a porous tube into the circumference of the oxygen-free copper (OFC) layer to manufacture an assembly; a step of melting the oxygen-free copper (OFC) layer by applying heat after inserting the assembly into a vacuum chamber; and a step of pressurizing argon gas in the vacuum chamber while cooling the assembly to diffusion-bond the oxygen-free copper (OFC) layer to the tungsten monoblock.

Description

Gas pressure casting method using porous tube for diffusion bonding copper to monoblock tungsten, and method for manufacturing laminated parts for diffusion bonding copper to monoblock tungsten using nuclear fusion reactor}

The present invention relates to a gas pressure casting method using a porous tube for diffusion bonding copper to monoblock tungsten, and a method for manufacturing a fusion reactor laminate component using the same, and more specifically, to a cylindrical oxygen-free copper (OFC) in a tungsten monoblock. When casting the layer, a gas pressure casting method using a porous tube for diffusion bonding copper to monoblock-type tungsten by inserting a porous tube into the inner diameter of an oxygen-free copper (OFC) layer and applying pressure in the vertical direction of the bonding surface, and It relates to a method for manufacturing a fusion reactor laminate component using the same.

Tungsten is considered as the main candidate material as the inner wall material of plasma countering device (PFC) of ITER or higher large tokamak and nuclear fusion demonstration furnace, and tungsten facing material is used for brazing or HIP (Hot) in the cooling pipe to withstand high heat flux from plasma. Isostatic Press) and HRP (Hot Radial Press) are used to increase the heat transfer rate to enable active cooling. Such active cooling can be said to be an essential element in a diverter system for a nuclear fusion furnace for long periods of high heat flux.

In the plasma countermeasure (PFC), the face material tungsten is generally used in a form in which a circular cooling tube is inserted into a monoblock type of tungsten, and an intermediate material is added to improve the bonding characteristics of the face material and the cooling tube. And can be joined.

When trying to bond between different types of an oxygen-free copper tube as an intermediate material inside the monoblock tungsten by casting, a vacuum casting method is generally used. The casting method in vacuum is to prevent oxidation of tungsten and copper.However, in the process of melting and cooling the copper to be cast, fine pores are created inside the copper, the density of the copper decreases, and the joint surface is also defective. There is a problem with this occurring.

One object of the present invention is to cast a cylindrical oxygen-free copper (OFC) layer in a tungsten monoblock, insert a porous tube into the inner diameter of the oxygen-free copper (OFC) layer, and apply pressure in the vertical direction of the bonding surface to form a monoblock type. It is to provide a gas pressure casting method using a porous tube for diffusion bonding copper to tungsten.

Another object of the present invention is to provide a method for manufacturing a fusion reactor laminate component using the above method.

The gas pressure casting method using a porous tube for diffusion bonding copper to monoblock-type tungsten for an object of the present invention is made of tungsten or a tungsten alloy, and has a cylindrical oxygen-free copper (OFC) within the inner diameter of the monoblock having a through hole. ) Inserting a layer and inserting a porous tube into the inner diameter of the oxygen-free copper (OFC) layer to produce an assembly; After loading the assembly into the vacuum chamber, applying heat to melt the oxygen-free copper (OFC) layer; And diffusing the monoblock and the oxygen-free copper (OFC) layer by pressing argon gas in the vacuum chamber while cooling the assembly.

The melting step is preferably carried out for 20 to 40 minutes at a temperature of 1100 to 1200 ℃.

In addition, in the diffusion bonding step, argon gas may be pressed in a vertical direction between the bonding surface of the oxygen-free copper (OFC) layer and the monoblock while penetrating the porous tube.

Specifically, in the diffusion bonding step, it is preferable to pressurize argon gas of 9.5 to 10.5 MPa in the vacuum chamber from when the temperature of the assembly is below 1000°C.

In addition, the oxygen-free copper (OFC) layer is made of oxygen-free copper (OFHC-Cu, Oxygen free high conductivity-copper) having an oxygen content of 5 ppm or less, and the porous tube is preferably made of a material including graphite. Do.

On the other hand, for another object of the present invention, a method of manufacturing a laminated component for a fusion reactor comprises: removing a porous tube from an assembly diffusion-bonded by the casting method; Cutting the inner diameter of the oxygen-free copper (OFC) layer; And bonding a circular cooling tube made of a copper alloy within the inner diameter of the oxygen-free copper (OFC) layer.

At this time, the oxygen-free copper (OFC) layer is made of oxygen-free copper (OFHC-Cu, Oxygen free high conductivity-copper) having an oxygen content of 5 ppm or less, and the cooling tube is preferably made of a Cu-Cr-Zr alloy.

In one embodiment, the oxygen-free copper (OFC) layer and the circular cooling tube may be joined by brazing. Here, it is preferable that the filler material used for the brazing bonding is made of a Ni-Cu-Mn alloy.

On the other hand, the brazing bonding may be performed in a vacuum furnace at a temperature of 960 to 990°C for 20 to 40 minutes, and after the brazing bonding, quenching the inside of the vacuum furnace to a temperature of 400°C under argon gas and vacuum It may further include maintaining the inside of the furnace at a temperature of about 450 to 490 °C for 160 to 200 minutes.

According to the present invention, when casting a cylindrical oxygen-free copper (OFC) layer in a tungsten monoblock, a porous tube is inserted into the inner diameter of the oxygen-free copper (OFC) layer, and the melted oxygen-free copper is pressurized in the vacuum chamber during cooling. Bubbles generated in the (OFC) layer can be removed, and thus, an oxygen-free copper (OFC) layer with a dense structure can be cast.

In addition, the oxygen-free copper (OFC) layer can be diffusion bonded to the monoblock by applying pressure in the vertical direction of the bonding surface through the porous tube during cooling.

In addition, it is possible to manufacture a fusion reactor laminate component exhibiting the maximum bonding strength at the junction by bonding a cooling tube within the inner diameter of the monoblock to which the oxygen-free copper (OFC) layer is diffusion bonded.

1 and 2 are views schematically showing a gas pressure casting method using a porous tube for diffusion bonding copper to monoblock tungsten according to an embodiment of the present invention.
3 is a view showing a laminated component for a fusion reactor according to an embodiment of the present invention.
4 is an image of an assembly in which a monoblock and an oxygen-free copper (OFC) layer are diffusion-bonded manufactured according to an embodiment of the present invention.
5 is an image showing the result of SEM analysis of an assembly according to an embodiment of the present invention.
6 and 7 are diagrams showing EDS analysis results according to an embodiment of the present invention.
8 is an image of specimens manufactured using HIP bonding.
9 is an image of specimens manufactured using vacuum casting bonding.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present invention, various modifications may be made and various forms may be applied, and specific embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific form of disclosure, it is to be understood as including all changes, equivalents, or substitutes included in the spirit and scope of the present invention. In describing each drawing, similar reference numerals have been used for similar elements.

The terms used in the present application are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the existence of features, steps, actions, components, parts, or a combination thereof described in the specification, but one or more other features or steps It is to be understood that it does not preclude the possibility of addition or presence of, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

1 and 2, the gas pressure casting method using a porous tube for diffusion bonding copper to monoblock-type tungsten according to an embodiment of the present invention is made of tungsten or a tungsten alloy, and has a through hole. Inserting a cylindrical oxygen-free copper (OFC) layer (2) within the inner diameter of the monoblock (1), and inserting a porous tube into the inner diameter of the oxygen-free copper (OFC) layer (2) to manufacture an assembly; After loading the assembly into a vacuum chamber, heating is applied to melt the oxygen-free copper (OFC) layer (2); And diffusing the oxygen-free copper (OFC) layer 2 to the monoblock 1 by pressing argon gas in the vacuum chamber while cooling the assembly.

The monoblock 1 is used as a plasma facing material of a PFC, has a through hole, and is made of tungsten or a tungsten alloy. Pure tungsten (W. tungsten) has a melting point of about 3,422℃, the highest among metal elements. It is a plasma-facing material such as high thermal conductivity, low retention of deuterium and tritium, and poor thin film deposition on the surface. It has several advantages.

When the monoblock 1 of the present invention is made of pure tungsten, it may be manufactured using a hot-rolled sheet material having a purity of 99.95% or more, a density of about 19.1 g/cm ³ or more, and ASTM B760-86 standards.

As another example, the monoblock 1 may be made of a tungsten alloy. In this case, the tungsten alloy may be a tungsten-copper alloy in which copper is added in a certain ratio, and in addition, elements such as Re and Y may be alloyed to be used. However, it is not limited thereto.

On the other hand, tungsten is well oxidized at about 400° C. or higher to generate an oxide such as tungsten trioxide (WO ₃ ). Since the diffusion bonding is performed at a high temperature, bonding is generally performed in a vacuum atmosphere or an inert gas atmosphere, and oxygen-free copper (FHC-Cu, Oxygen free) having an oxygen content of 5 ppm or less to prevent oxidation of tungsten at the bonding surface. An oxygen-free copper (OFC) layer (2) made of high conductivity-copper) can be used as an intermediate material.

As described above, the oxygen-free copper (OFC) layer 2 is made of oxygen-free copper (OFHC-Cu, Oxygen free high conductivity-copper) having an oxygen content of 5 ppm or less, and has a relatively low yield strength and elastic modulus. Because of its high ductility, there is an effect of mitigating residual stress in the joints generated after joining due to a large difference in thermal expansion coefficient between tungsten and copper alloys.

The porous tube is for diffusion bonding the oxygen-free copper (OFC) layer 2 to the monoblock 1 by applying pressure in the vertical direction of the bonding surface during the cooling process, and includes graphite having high heat resistance. It is preferably made of a material.

Hereinafter, a gas pressure casting method using a porous tube for diffusion bonding copper to monoblock tungsten of the present invention will be described in detail with reference to FIGS. 1 and 2.

First, a cylindrical oxygen-free copper (OFC) layer 2 is inserted into the inner diameter of the monoblock 1 made of tungsten or a tungsten alloy and provided with a through hole, and the oxygen-free copper (OFC) layer 2 is Proceed with the step of manufacturing an assembly by inserting a porous tube.

Thereafter, the assembly may be charged into the vacuum chamber, and then heat may be applied to melt the oxygen-free copper (OFC) layer 2.

At this time, the assembly is preferably acid washed, washed with water, and dried before loading into the vacuum chamber, and then directly loaded into the vacuum chamber to prevent further contamination. If the assembly is stored for a certain period of time (30 minutes or more) after cleaning, the cleaning process must be performed again and then loaded into the vacuum chamber.

In addition, the melting step is preferably carried out in a vacuum chamber with a vacuum degree of about 5*10 ^-5 torr or less in order to prevent oxidation of each material, and can be performed at a temperature of 1100 to 1200°C for 20 to 40 minutes. have.

Since most of the vacuum chambers are radiant heating systems, they are first heated from the outer surface of the material and the temperature is the highest. Therefore, in order to indirectly check the actual temperature rise of the assembly apart from the temperature sensor that controls the temperature of the vacuum chamber, the temperature sensor is mounted on a temporary specimen of the same material, and the temperature is increased by applying heat in the same manner as the assembly of the present invention. It is desirable to proceed with confirmation.

Alternatively, the temperature of the vacuum chamber is raised to about 6°C per minute up to about 850°C, and after holding time at about 850°C for about 30 minutes for the uniform temperature increase of each material and final removal of impurities, about The oxygen-free copper (OFC) layer 2 may be melted at 1150° C. for 30 minutes.

Next, while cooling the assembly, argon gas is pressurized in the vacuum chamber to diffusely bond the oxygen-free copper (OFC) layer to the monoblock.

Specifically, the diffusion bonding step is to pressurize argon gas of 9.5 to 10.5 MPa in the vacuum chamber while the temperature of the assembly becomes 1000°C or less, and thus the oxygen-free copper (OFC) layer 2 is cured. As it cools, fine air bubbles generated in the oxygen-free copper (OFC) layer 2 can be removed.

In addition, as shown in FIG. 1, in the diffusion bonding step, argon gas is pressed in the vertical direction of the bonding surface of the oxygen-free copper (OFC) layer 2 and the monoblock 1 while penetrating the porous tube, The oxygen-free copper (OFC) layer 2 may be diffusion bonded to the monoblock 1.

Thereafter, the assembly is naturally cooled in a vacuum chamber, and when the temperature inside the vacuum chamber drops to about 100°C or less, it is taken out, and finally cooled in air to join the oxygen-free copper (OFC) layer (2) and the monoblock (1). The assembled product can be obtained (see Fig. 2(b)).

3 is a view showing a laminated component for a fusion reactor according to an embodiment of the present invention.

Referring to FIG. 3, a method of manufacturing a laminated component for a fusion reactor for another object of the present invention includes: removing a porous tube from an assembly in which an oxygen-free copper layer 2 and a monoblock 1 are diffusion bonded; Cutting the inner diameter of the oxygen-free copper (OFC) layer (2); And bonding a circular cooling tube 3 made of a copper alloy within the inner diameter of the oxygen-free copper (OFC) layer 2.

First, the step of removing the porous tube from the diffusion bonded assembly by the gas pressure casting method can be performed, and then, in order to be used as a laminate component for a fusion reactor, the inner diameter of the oxygen-free copper (OFC) layer 2 The step of cutting can be performed.

Thereafter, a step of joining the circular cooling tube 3 made of a copper alloy within the inner diameter of the oxygen-free copper (OFC) layer 2 is performed.

The cooling pipe (3) is for cooling the monoblock (1), made of a copper alloy, preferably chromium (Cr, 0.6-0.9 wt%) and zirconium (Zr, 0.07-0.15wt%) in copper It may be made of a Cu-Cr-Zr alloy with improved thermal conductivity, hardness and strength by adding. In addition, the cooling pipe 3 may be manufactured in a circular shape using a plate material based on ASTM C18150.

Meanwhile, in one embodiment, the oxygen-free copper (OFC) layer 2 and the circular cooling tube 3 may be bonded through various bonding methods such as HIP bonding, vacuum casting bonding, and brazing bonding, but most commonly brazing Can be joined.

Here, the filler material used for brazing bonding should be a material that can be used at high temperatures, and the melting point should not exceed about 1550°C, which is the recrystallization temperature of tungsten, and the melting point of oxygen-free copper (OFC) and copper alloy (about 1080°C). It is advisable to choose a material with the highest melting point without exceeding ).

Therefore, the filler material used for the brazing bonding is preferably made of a Ni-Cu-Mn alloy, and specifically, copper (Cu, 52.5 wt%), manganese (Mn, 38 wt%), nickel (Ni, 9.5 wt%) It is more preferable to use this containing alloy.

The liquefaction temperature of the filler material made of the above material is about 925℃, and the solidification temperature is about 880℃. In addition, the filler material may be manufactured in a sheet or liquid form.

In addition, the brazing bonding may be performed in a vacuum furnace at a temperature of 960 to 990°C for 20 to 40 minutes.

The bonding is preferably performed in a vacuum furnace with a vacuum degree of about 5*10 ^-5 torr or less in order to prevent oxidation of each material, and it is most preferable to maintain the vacuum furnace at an internal temperature of about 980°C for 30 minutes. This is the result of setting the internal temperature higher in consideration of the uniform thermal equilibrium of the oxygen-free copper (OFC) layer 2 and the cooling tube 3, although the liquefaction temperature of the filler material is about 925°C.

Specifically, for a uniform temperature increase of each material, a holding time of about 850° C. for about 30 minutes may be held, and brazing bonding may be performed at about 980° C. for 30 minutes.

In addition, after the brazing bonding, the step of quenching the inside of the vacuum furnace to a temperature of 400° C. under argon gas and maintaining the inside of the vacuum furnace at a temperature of about 340 to 490° C. for 160 to 200 minutes may be further included, This is to restore the strength of the copper alloy.

Through the above method, a monoblock 1 made of tungsten or a tungsten alloy and having a through hole; A cylindrical oxygen-free copper (OFC) layer 2 formed on the inner surface of the through hole of the monoblock 1; And it is formed on the inner surface of the oxygen-free copper (OFC) layer (2), a circular cooling tube (3) made of a copper alloy; a laminated component for a fusion reactor can be manufactured.

Hereinafter, various embodiments and experimental examples of the present invention will be described in detail. However, the following examples are only some examples of the present invention, and the present invention should not be construed as being limited to the following examples.

Experimental Example 1

Example 1

A cylindrical oxygen-free copper (OFC) layer made of a monoblock made of tungsten (purity 99.95%, density 19.1 cm ³ ) and oxygen-free copper (OFHC-Cu, Oxygen free high conductivity-copper) having an oxygen content of 5 ppm or less was prepared.

The monoblock is a block having a width of 25.0mm, a height of 28.2mm, and a thickness of 12.4mm with a through hole of 17.00mm in diameter, and the cylindrical oxygen-free copper (OFC) layer has an outer diameter of 16.80mm, an inner diameter of 15.0mm, and a length of 12.4mm. It is a form processed into mm.

Thereafter, a cylindrical oxygen-free copper (OFC) layer was inserted into the inner diameter of the monoblock, and a porous tube was inserted into the inner diameter of the oxygen-free copper (OFC) layer to produce an assembly.

Next, after washing the assembly by performing acid washing, water washing, and drying processes, it is charged into a vacuum chamber with a vacuum degree of about 5*10 ^-5 torr or less, and has a holding time at about 850℃ for about 30 minutes, and oxygen-free copper (OFC ) The layer was held at about 1150° C. for 30 minutes to melt.

Thereafter, while cooling the granulated product, while the oxygen-free copper (OFC) layer was cooled from a temperature of 1000° C. or lower, an argon gas of 10 MPa was pressurized in the vacuum chamber.

After the pressurization is completed, the assembly is naturally cooled in the vacuum chamber, then taken out when the temperature inside the vacuum chamber drops to about 100℃ or lower, and finally cooled in air, whereby an oxygen-free copper (OFC) layer and monoblock are joined. Got it. The porous tube was removed from the assembly, and the inner diameter of the oxygen-free copper (OFC) layer was cut to 15.16 mm to prepare Example 1 (see FIG. 4).

Thereafter, SEM analysis was performed to check the presence or absence of defects on the bonding surface of Example 1, and EDS analysis was performed to measure the degree of diffusion at the bonding surface, and the results are shown in FIGS. 5 to 7 respectively.

Referring to FIG. 5, it can be seen that no defects occurred at the bonding surface of the monoblock and the oxygen-free copper (OFC) layer.

In addition, referring to FIGS. 6 to 7, it can be seen that there is a region in which tungsten and an oxygen-free copper (OFC) layer coexist with a length of about 2 to 3 μm in the interface. This is a result indicating that it has spread.

Comparative Example 1

A cylindrical oxygen-free copper (OFC) layer made of tungsten (purity 99.95%, density 19.1 cm ³ ) and formed of a monoblock having a through hole and an oxygen content of 5 ppm or less was prepared. At this time, the prepared monoblock and oxygen-free copper (OFC) layers were manufactured such that the tolerance between the outer diameter of the oxygen-free copper (OFC) layer and the inner diameter of the monoblock was 0.006mm, 0.002mm, and 0.026mm, respectively.

Thereafter, a cylindrical oxygen-free copper (OFC) layer was inserted into the inner diameter of the monoblock, and bonding was performed using a hot isostatic pressure (HIP) bonding method to prepare a specimen (Comparative Example 1).

8 is an image of specimens manufactured using HIP bonding.

As shown in Fig. 8, defects in the bonding surface were found in all three specimens.

Comparative Example 2

A cylindrical oxygen-free copper (OFC) layer made of tungsten (purity 99.95%, density 19.1 cm ³ ) and formed of a monoblock having a through hole and an oxygen content of 5 ppm or less was prepared. At this time, the prepared monoblock and oxygen-free copper (OFC) layers were manufactured such that the tolerance between the outer diameter of the oxygen-free copper (OFC) layer and the inner diameter of the monoblock was 0.006mm, 0.002mm, and 0.026mm, respectively.

Thereafter, a cylindrical oxygen-free copper (OFC) layer was inserted into the inner diameter of the monoblock, and bonding was performed using a vacuum casting bonding method to prepare a specimen (Comparative Example 2).

9 is an image of specimens manufactured using vacuum casting bonding.

Referring to FIG. 9, it was confirmed that many pores remained in the oxygen-free copper (OFC) layer of all three specimens. In addition, the bonding strength on the bonding surface was also low, and thus, the oxygen-free copper (OFC) layer was separated from the tungsten monoblock even under a small impact.

Although described above with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the present invention described in the following claims. You will understand that you can.

Claims (11)

Manufacturing an assembly by inserting a cylindrical oxygen-free copper (OFC) layer into the inner diameter of a monoblock made of tungsten or tungsten alloy and having a through hole, and inserting a porous tube into the inner diameter of the oxygen-free copper (OFC) layer;
After loading the assembly into the vacuum chamber, applying heat to melt the oxygen-free copper (OFC) layer; And
While cooling the assembly, pressurizing argon gas to the porous tube to diffusely bond the monoblock and the oxygen-free copper (OFC) layer; Including,
In the diffusion bonding step, argon gas is pressed in the vertical direction of the bonding surface of the oxygen-free copper (OFC) layer and the monoblock while penetrating the porous tube to improve the bonding strength of the bonding surface,
Gas pressure casting method using a porous tube for diffusion bonding copper to monoblock tungsten.
The method of claim 1,
The melting step is characterized in that carried out for 20 to 40 minutes at a temperature of 1100 to 1200 ℃,
Gas pressure casting method using a porous tube for diffusion bonding copper to monoblock tungsten.
delete The method of claim 1,
The diffusion bonding step is characterized in that the pressure of argon gas of 9.5 to 10.5 MPa to the porous tube from when the temperature of the assembly is less than 1000 ℃,
Gas pressure casting method using a porous tube for diffusion bonding copper to monoblock tungsten.
The method of claim 1,
The oxygen-free copper (OFC) layer is made of oxygen-free copper (OFHC-Cu, Oxygen free high conductivity-copper) having an oxygen content of 5 ppm or less,
The porous tube is characterized in that made of a material containing graphite (Graphite),
Gas pressure casting method using a porous tube for diffusion bonding copper to monoblock tungsten.
Manufacturing an assembly by inserting a cylindrical oxygen-free copper (OFC) layer into the inner diameter of a monoblock made of tungsten or tungsten alloy and having a through hole, and inserting a porous tube into the inner diameter of the oxygen-free copper (OFC) layer;
After loading the assembly into the vacuum chamber, applying heat to melt the oxygen-free copper (OFC) layer;
Diffusing the monoblock and the oxygen-free copper (OFC) layer by pressing argon gas to the porous tube while cooling the assembly;
Removing the porous tube from the assembly after the diffusion bonding;
Cutting the inner diameter of the oxygen-free copper (OFC) layer; And
Including; joining a circular cooling tube made of a copper alloy within the inner diameter of the oxygen-free copper (OFC) layer,
In the diffusion bonding step, argon gas is pressed in the vertical direction of the bonding surface of the oxygen-free copper (OFC) layer and the monoblock while penetrating the porous tube to improve the bonding strength of the bonding surface,
Method for manufacturing laminated parts for fusion reactors.
The method of claim 6,
The oxygen-free copper (OFC) layer is made of oxygen-free copper (OFHC-Cu, Oxygen free high conductivity-copper) having an oxygen content of 5 ppm or less,
The cooling tube is characterized in that made of a Cu-Cr-Zr alloy,
A method of manufacturing a laminated component for a fusion reactor.
The method of claim 6,
The oxygen-free copper (OFC) layer and the circular cooling tube, characterized in that the brazing bonding,
A method of manufacturing a laminated component for a fusion reactor.
The method of claim 8,
The filler material used for the brazing bonding is characterized in that it is made of a Ni-Cu-Mn alloy,
Method for manufacturing laminated parts for fusion reactors.
The method of claim 8,
The brazing bonding is characterized in that carried out for 20 to 40 minutes at a temperature of 960 to 990 °C in a vacuum furnace,
A method of manufacturing a laminated component for a fusion reactor.
The method of claim 10,
After the brazing bonding, quenching the inside of the vacuum furnace to a temperature of 400 °C under argon gas; And
Maintaining the inside of the vacuum furnace at a temperature of 450 to 490 °C for 160 to 200 minutes; characterized in that it further comprises,
A method of manufacturing a laminated component for a fusion reactor.

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