KR102204749B1 - Coil component and manufacturing method there of - Google Patents

Abstract

The present invention relates in detail to a coil component that is easy to manufacture while minimizing the size of a coil component, and a method of manufacturing the same. For this, the coil component according to an embodiment of the present invention includes a first coil unit including a laminated substrate on which a first coil pattern is formed, a second coil unit including a main substrate on which a second coil pattern is formed and a plurality of electronic components are mounted. A coil unit, a core passing through the first and second coil units and coupled to the first and second coil units, and an insulating member securing an insulating distance between the second coil pattern and the electronic components mounted on the main substrate. I can.

Description

Coil component and its manufacturing method TECHNICAL FIELD [COIL COMPONENT AND MANUFACTURING METHOD THERE OF}

The present invention relates to a coil component that is easy to manufacture while minimizing the size of the coil component, and to a manufacturing method thereof.

An electronic device such as a display device or an adapter is provided with a power supply device that converts AC into DC.

The power supply is basically equipped with a coil component for converting alternating current to direct current, that is, a transformer, and a conventional transformer has a structure in which a coil is wound around a bobbin and a core is coupled to the bobbin.

Therefore, in the conventional coil component, since a coil in the form of a wire is wound around the bobbin, there is a limit to reducing the size of the bobbin. Due to this, there is also a limit to reducing the overall size of the coil component.

In addition, when a coil component is manufactured in a small size, there is a problem that it is difficult to secure insulation between the primary and secondary.

Japanese Laid-Open Patent Publication No. 2009-135456

An object of the present invention is to provide a coil component capable of minimizing the size and a method of manufacturing the same.

Another object of the present invention is to provide a coil component for implementing a coil unit using a main substrate and a method for manufacturing the same.

In addition, another object of the present invention is to provide a coil component capable of converting AC/DC to a small size and a method of manufacturing the same.

A coil component according to an embodiment of the present invention includes a first coil unit including a laminated substrate on which a first coil pattern is formed, a second coil unit including a main substrate on which a second coil pattern is formed and a plurality of electronic components are mounted. , A core passing through the first and second coil units and coupled to the first and second coil units, and an insulating member securing an insulating distance between the second coil pattern and the electronic components mounted on the main substrate. .

Here, the insulating member may be formed in the form of an insulating cover or a mold part.

In addition, in the coil component according to the embodiment of the present invention, a main substrate in which primary and secondary electronic components are mounted together and a second coil pattern is formed, and a stack in which the first coil pattern is formed and mounted on the main substrate Includes a substrate.

Here, the laminated substrate and the primary-side electronic components may be divided into a primary-side region, and the second coil pattern and the secondary-side electronic components may be divided into a secondary-side region.

In the coil component according to the present invention, since the coil is not wound on the bobbin and is formed in the form of a laminated substrate, the size and manufacturing cost of the coil component can be minimized.

In addition, since insulation between the primary and secondary can be secured through an insulation cover or a mold, it is possible to provide a coil component that is compact and capable of AC/DC transformation.

1 is a perspective view schematically showing a coil component according to an embodiment of the present invention.
FIG. 2 is a plan view of the coil component illustrated in FIG. 1, and FIG. 3 is an exploded perspective view of the coil component illustrated in FIG. 1.
Figure 4 is a partial bottom perspective view of the coil component shown in Figure 1;
5 is a perspective view schematically showing a coil component according to another embodiment of the present invention.
6 is a plan view of the coil component shown in FIG. 5.
7 is a perspective view schematically showing a coil component according to another embodiment of the present invention.
8 is a plan view of the coil component shown in FIG. 7, and FIG. 9 is an exploded perspective view of the coil component shown in FIG. 7.
FIG. 10 is a schematic cross-sectional view of a coil component shown in FIG. 7 according to another embodiment.
11 is a perspective view schematically showing a coil component according to another embodiment of the present invention.
12 is an exploded perspective view of the coil component shown in FIG. 11.
13 is a perspective view schematically showing a first coil part of the coil component shown in FIG. 11;
14 is a perspective view schematically showing a coil component according to another embodiment of the present invention.
15 is a perspective view schematically showing a first coil part of the coil component shown in FIG. 14.
16 is a side view schematically showing a coil component according to another embodiment of the present invention.
17 is a plan view of the coil component shown in FIG. 16;

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this case, it should be noted that the same components in the accompanying drawings are indicated by the same reference numerals as possible. In addition, detailed descriptions of known functions and configurations that may obscure the subject matter of the present invention will be omitted. For the same reason, some components in the accompanying drawings are exaggerated, omitted, or schematically illustrated, and the size of each component does not entirely reflect the actual size.

1 is a perspective view schematically showing a coil component according to an embodiment of the present invention, FIG. 2 is a plan view of the coil component illustrated in FIG. 1, and FIG. 3 is an exploded perspective view of the coil component illustrated in FIG. 1. 4 is a partial bottom perspective view of the coil component shown in FIG. 1.

The coil component according to the present invention is a coil component provided in a power supply device mounted on a TV or mounted on a charging adapter, and may be a transformer that converts AC power into DC power.

1 to 4, the coil component 100 according to the present exemplary embodiment may include a core 80, a coil unit 10, and an insulating member 50.

The core 80 may be coupled to the coil unit 10 to be described later, and the first and second cores 81 and 86 may be coupled to form a completed core 80.

The first and second cores 81 and 86 may be formed in the same shape, and may include a midfoot portion inserted into the coil unit 10 and an outer foot portion disposed outside the coil unit 10.

In this embodiment, the case where the core 80 is entirely formed in a rectangular parallelepiped shape is taken as an example. However, the present invention is not limited thereto, and may be modified in various forms as necessary.

Further, in this embodiment, the core 80 is illustrated as an E-E-shaped core having an E-shaped cross-sectional shape, but is not particularly limited thereto. For example, the core 80 may be formed of an E-I type, a U-U type, a U-I type, or the like.

The core 80 may be formed of ferrite having high permeability, low loss, high saturation magnetic flux density, stability and low production cost compared to other materials.

For example, the core 80 according to the present embodiment may be made of nickel (Ni)-based ferrite or manganese (Mn)-based ferrite.

The coil unit 10 may include a first coil unit 20 and a second coil unit 30.

The first coil part 20 may be formed in the form of a single insulating layer on which a conductor pattern (not shown) is formed, or a laminated substrate in which a plurality of insulating layers are stacked to form a first coil pattern.

Here, the laminated substrate may be formed in the form of a flexible substrate such as a PCB substrate or a film substrate, but is not limited thereto.

For example, the laminated substrate according to the present embodiment is a multilayered laminated substrate in which a conductor pattern layer is laminated in multiple layers of three or more layers. In addition, a plurality of coil turns (eg, 36 turns) constituting the first coil pattern (21 in FIG. 3) may be formed on the plurality of conductor pattern layers. In this case, a plurality of coil turns may be formed by being distributed over several conductor pattern layers, respectively.

In addition, the conductive pattern layers may be electrically connected to each other by a conductive via (not shown) penetrating the insulating layer.

The first coil unit 20 according to the present embodiment may be used as a primary coil. Therefore, the second coil unit 30 to be described later is used as a secondary coil. However, the present invention is not limited thereto, and various modifications are possible, such as using the second coil unit 30 to be described later as a primary coil.

The first coil unit 20 according to the present embodiment is entirely composed of a rectangular laminated substrate, and a through hole into which the core 80 is inserted is formed therein.

In addition, the laminated substrate includes a pattern portion 23 on which the first coil pattern 21 is formed, and a terminal portion 22 formed on one side of the pattern portion 23 to electrically connect the first coil pattern 21 to the outside. Can include.

Terminal pins 40 to be electrically connected to the main substrate 30 may be fastened to the terminal portion 22. However, the configuration of the present invention is not limited to the terminal pin 40, and any configuration capable of electrically connecting the first coil unit 20 and the main board 30, such as a solder bump, a solder ball, and a connector, is in various forms. It can be transformed.

The second coil unit 30 may be formed of the main substrate 30 on which the second coil pattern 31 is formed. Accordingly, the second coil unit 30 and the main substrate 30 are the same components, and will be described with reference to the same reference numerals.

The main substrate 30 refers to a parent substrate to which the coil component 100 according to the present invention is electrically connected, and may be, for example, a main substrate of a power supply device or an adapter.

Accordingly, the second coil pattern 31 according to the present exemplary embodiment is not separately manufactured and is directly formed on the main substrate 30, and may be formed together in the process of forming the wiring pattern of the main substrate 30.

A plurality of terminal pads 32 are formed on the main substrate 30, and a terminal pin 40 connected to the first coil unit 20 may be bonded to each of the terminal pads 32. Accordingly, the terminal pin 40 is bonded to the main substrate 30 to electrically connect the first coil pattern 21 of the first coil unit 20 and the main substrate 30.

On the other hand, various modifications, such as forming the terminal pad 32 of the main board 30 in a through hole shape rather than a pad shape, and configuring the terminal pin 40 to be inserted into the through hole and bonded to the main board 30 It is possible.

In addition, a core insertion portion 33 may be formed on the main substrate 30. The core insertion part 33 is a space for inserting the core 80 and the insulating cover 50 to be described later, and may be formed in the form of a through hole or a groove.

Accordingly, the core insertion portion 33 may be formed of a plurality of holes having a size and shape corresponding to the shape of the middle foot or the outer foot of the core 80.

In addition, the main substrate 30 according to the present embodiment may be a double-sided substrate in which the second coil patterns 31 are formed on both sides of one insulating layer. Therefore, the second coil pattern 31 of the main substrate 30 includes a smaller number of coil turns (eg, 3 turns) than the first coil pattern 21 formed on the laminated substrate of the first coil unit 20, and each The width of the coil turns may be wider than the coil turns of the first coil pattern 21.

In addition, the coil component 100 according to the present embodiment includes an insulating member.

The insulating member secures insulation between the second coil pattern 31 and the electronic components 35 mounted on the main substrate 30. In addition, insulation between the terminal pins 40 bonded to the first coil unit 20 and the second coil pattern 31 of the second coil unit 30 is secured.

In addition, the insulating member is interposed between the primary-side electronic components 35 and the secondary-side electronic components 25 mounted on the main substrate 30 to secure mutual insulation.

In this embodiment, the insulating member may be an insulating cover 50.

The insulating cover 50 is provided to secure insulation between the primary side and the secondary side of the coil component 100 according to the present embodiment. Accordingly, the insulating cover 50 may be disposed in a form interposed between the primary-side electronic components 35 and the secondary-side electronic components 25.

The insulating cover 50 is formed of an insulating material such as resin, and sidewalls for blocking may be formed in various directions for insulation.

In addition, in the case of this embodiment, a case in which the USB terminal 25 is electrically connected to the secondary coil 31 is exemplified. Accordingly, the insulating cover 50 is coupled to the main board 30 in a form in which a part of the sidewall is interposed between the USB terminal 25 which is a secondary electronic component and the primary electronic components 35.

In addition, the insulating cover 50 insulates between the primary coil and the secondary coil. Since the first coil pattern 21 is formed in the laminated substrate through the wiring pattern in the first coil part 20, insulation from the second coil part 30 may be secured by insulating layers constituting the laminated substrate. However, since the conductors of the terminal pins 40 electrically connected to the first coil pattern 21 are exposed to the outside as they are, an insulation distance and a creepage distance from the second coil pattern 31 must be secured.

To this end, the insulating cover 50 according to the present embodiment is interposed between the terminal pin 40 on the primary side and the secondary coil pattern 31 (the second coil pattern) to secure mutual insulation.

In addition, a cut-out part 37 of a cut-out shape is formed between the second coil pattern 31 of the second coil part 30 and the terminal pad 32 on the main substrate 30 according to the present embodiment. In addition, the insulating cover 50 is partially inserted into the cutout 37.

At this time, the insulating cover 50 is inserted into the cutout 37 so that a part of the insulating cover 50 also protrudes below the main substrate 30. For example, as shown in FIG. 4, the insulating cover 50 may be coupled to the main substrate 30 so as to protrude both above and below the main substrate 30.

Accordingly, it is possible to secure an insulation distance and a creepage distance between the second coil pattern 31 which is the secondary side and the terminal pin 40 which is the primary side.

Although not clearly shown, the cutout 37 is also formed between the primary-side electronic components 35 and the secondary-side USB terminal 25, and the insulating cover 50 is configured to be inserted into the above-described cutout. .

Meanwhile, the insulating cover 50 according to the present embodiment is not limited to the illustrated shape, and may be modified in various shapes depending on the size or arrangement of electronic components.

In addition, in the present embodiment, the first coil unit 20 is stacked on and coupled to the second coil unit 30 as an example, but the configuration of the present invention is not limited thereto. For example, by stacking the first coil unit 20 under the second coil unit 30 or forming a space in the center of the second coil unit 30, the first coil unit 20 is connected to the second coil unit. Various modifications are possible, such as placing it in the inner space of (30).

The coil component according to the present exemplary embodiment configured as described above implements a coil component using a part of the main substrate. Therefore, since the second coil unit is not manufactured as a separate component, manufacturing cost can be reduced.

In addition, the coil component according to this embodiment is a transformer that can be used for AC/DC transformation. Then, the primary side electronic component and the secondary side electronic component are mounted together on the main board.

In the case of AC/DC transformation, the insulation between the primary and secondary side is very important. To this end, in the coil component according to the present embodiment, a cutout is formed in the main substrate, and then an insulating cover is inserted to secure an insulation distance and a creepage distance between the primary side and the secondary side. Therefore, it can be easily adopted for AC/DC transformation.

In addition, in the coil component according to the present embodiment, primary-side electronic components, secondary-side electronic components, and a laminated substrate are mounted together on a main substrate, and a second coil pattern is formed on the secondary side. Then, a first coil pattern, which is a primary side, is formed on the laminated substrate.

In addition, since the core which is coupled through the main substrate and the laminated substrate is disposed adjacent to the second coil pattern than the first coil pattern, the core is divided into a secondary region.

Accordingly, the laminated substrate and the primary-side electronic components may be divided into a primary-side region, and the second coil pattern and the secondary-side electronic components may be divided into a secondary-side region. Also, the laminated substrate may be divided into a primary region and a core may be divided into a secondary region.

As described above, in the coil component according to the present embodiment, since both the primary side region and the secondary side region are formed in one main board, it is necessary to secure mutual insulation, which is implemented by the insulating member according to the present embodiment. . Therefore, insulation can be easily secured even if it is used for high current or high voltage transformation like AC/DC transformation.

Next, a method of manufacturing a coil component according to an embodiment of the present invention will be described with reference to FIG. 3. The configuration of the above-described coil component 100 will also be clearly described through the following description.

First, the main substrate 30 is prepared. The main substrate 30 may be in a state in which both the primary-side electronic components 35 and the secondary-side electronic components 25 are mounted.

In addition, the main substrate 30 may be a double-sided substrate on which the second coil pattern 31, the core insertion portion 33, the cutout portion 37, and the terminal pad 32 are formed.

Subsequently, the first coil unit 20 is coupled to the main substrate 30. The first coil unit 20 may be electrically and physically coupled to the main substrate 30 as the terminal pin 40 fastened to the terminal unit 22 is fixedly bonded to the terminal pad 32 of the main substrate 30. have.

On the other hand, in this embodiment, the terminal pin 40 is fastened to the first coil unit 20 as an example, but on the contrary, after fastening to the main board 30 first, the first coil unit 20 is connected to the main board ( It is also possible to configure to be bonded to the first coil unit 20 in the process of bonding to 30).

Then, the cores 81 and 86 are combined. The cores 81 and 86 are inserted into the core insertion portion 33 of the main substrate 30 and may be coupled to accommodate the first and second coil portions 20 and 30 therein.

Then, the insulating cover 50 is coupled to the main substrate 30. In this process, the insulating cover 50 is inserted into the cutout 37 and mounted on the main board 30, the primary electronic components 35, the secondary electronic components 25, and the primary terminal pins ( The insulation distance and creepage distance between 40) and the secondary second coil pattern 31 are secured.

The coil component according to the present invention described above is not limited to the above-described embodiment, and various modifications are possible.

The coil component described below has a structure similar to that of the coil component of the above-described embodiment, and has a partial difference. Accordingly, detailed descriptions of the same components will be omitted and will be described in more detail focusing on the components having differences. In addition, the same components as in the above-described embodiment will be described with the same reference numerals.

5 is a perspective view schematically showing a coil component according to another embodiment of the present invention, and FIG. 6 is a plan view of the coil component illustrated in FIG. 5.

Referring to FIG. 5, the coil component 200 according to the present embodiment differs from the above-described coil component (100 in FIG. 1) in the direction in which the terminal portion 22 of the first coil portion 20 is disposed. In addition, the insulating cover 50 is formed to cover the USB terminal 25, which is a secondary electronic component.

In addition, in the insulating cover 50 according to the present embodiment, sidewalls are formed not only under the terminal portion 22 of the first coil portion 20, but also at the upper portion of the terminal portion 22, so that the terminal portion 22 of the first coil portion 20. ) To secure the insulation between the core (80).

Similar to the above-described embodiment, the core 80 is disposed adjacent to the secondary coil pattern 31, and thus can be classified as a secondary component. Therefore, insulation must be secured between the first coil units 20 that are the primary side.

To this end, the insulating cover 50 according to the present embodiment is also disposed between the core 80 and the terminal portion 22 of the first coil unit 20 to secure an insulation distance and a creepage distance between them.

Of course, this configuration can be easily applied to the above-described coil component (100 in FIG. 1).

7 is a perspective view schematically showing a coil component according to another embodiment of the present invention, FIG. 8 is a plan view of the coil component shown in FIG. 7, and FIG. 9 is an exploded perspective view of the coil component shown in FIG. 7 .

7 to 9, the coil component 300 according to the present exemplary embodiment differs from the above-described coil components in the shape of the first coil unit 20.

In the first coil part 20 according to the present embodiment, the terminal part 22 protrudes from the pattern part 23 to form the terminal block 22.

The terminal block 22 is formed to protrude from one end of the pattern portion 23 to the side of the core 80 along the outline of the core 80. For example, the terminal block 22 may protrude from the pattern portion 23 in a'a' shape.

Meanwhile, the terminal pin 40 according to the present embodiment is fastened to the main substrate 30, and a terminal hole 24 into which the terminal pin 40 is inserted is formed in the first coil unit 20. Accordingly, the terminal pin 40 is inserted into the terminal hole 24 of the first coil unit 20 and is electrically connected to the first coil pattern 21 of the first coil unit 20.

Also, similar to the above-described embodiment, the core 80 according to the present embodiment may also be classified as a secondary side component. Therefore, in order to secure insulation from the first coil unit 20, which is the primary side, the insulating cover 50 according to the present embodiment is disposed between the core 80 and the terminal block 22 of the first coil unit 20 Secure the insulation distance and creepage distance between each other. At this time, the sidewalls of the insulating cover 50 disposed between the core 80 and the terminal block 22 of the first coil unit 20 are formed in the core insertion portion 33 and the cutout 37 of the main substrate 30. Can be inserted.

Therefore, compared to the above-described embodiments, it is possible to secure the insulation distance and the creepage distance more firmly.

FIG. 10 is a schematic cross-sectional view of the coil component shown in FIG. 7 according to another embodiment, and for convenience of explanation, only a first coil part, a second coil part, and a core are shown.

Referring to FIG. 10, the coil component 300 according to the present embodiment may include an insulating film 27 to insulate between the first coil unit 20 and the core 80.

This embodiment can be applied when it is difficult to secure insulation of the first coil unit 20 only with insulating layers constituting the laminated substrate of the first coil unit 20.

In this case, an insulation distance must be secured between the core 80 classified as a secondary component and the first coil unit 20 that is the primary side.

To this end, the insulating film 27 is formed of an insulating material and is disposed on both sides of the laminated substrate of the first coil unit 20, respectively. The insulating film 27 is formed to have a larger area than the first coil part 20, and accordingly, the side surface of the first coil part 20 is spaced apart from the inner surface of the core 80 by a certain distance D.

Here, the spaced distance D may be set as an insulation distance between the first coil unit 20 and the core 80. Accordingly, the insulating film 27 may be formed to have a size capable of securing an insulating distance between the core 80 and the first coil unit 20.

Therefore, insulation between the upper and lower surfaces of the first coil unit 20 and the core 80 is secured by the insulating film 27, and due to the difference in area between the insulating film 27 and the first coil unit 20 Insulation between the side surface of the first coil unit 20 and the core 80 is secured by the generated separation distance D.

The insulating film 27 according to this embodiment may be made of polypropylene (PP). However, it is not limited thereto.

11 is a perspective view schematically showing a coil component according to another embodiment of the present invention, FIG. 12 is an exploded perspective view of the coil component shown in FIG. 11, and FIG. 13 is a first diagram of the coil component shown in FIG. It is a perspective view schematically showing the coil unit.

11 to 13, the insulating member of the coil component 400 according to the present exemplary embodiment may be a mold part 60.

In the first coil part 20 according to the present embodiment, the pattern part 23 is accommodated or buried in the mold part 60, and only a part of the terminal part 22 on which the terminal pin 40 is formed is external to the mold part 60. Exposed as.

The mold part 60 includes at least two locking projections 62 and 64. The locking protrusions 62 and 64 fixedly couple any one core (eg, the second core 86) to the mold part 60 as shown in FIG. 13.

Accordingly, the locking protrusions 62 and 64 may include a protrusion 62 protruding from the mold part 60 to one side, that is, downward, and a ring part 64 protruding inward from the end of the protrusion 62.

The locking protrusions 62 and 64 pass through the main substrate 30 and are coupled to the second core 86 as shown in FIG. 12, wherein the ring portion 64 is an outer surface of the second core 86 or It will support the lower surface. Therefore, by the mold part 60, the first coil part 20, the main substrate 30, and the second core 86 may be mechanically coupled.

The mold part 60 may be formed of an insulating material such as an epoxy resin, and may be formed by placing the first coil part 20 in a mold and then performing injection molding. However, the present invention is not limited thereto, and various modifications are possible, such as integrally forming the first coil part 20 by inserting the first coil part 20 into the inner space of the mold part 60 after separately forming the mold part 60 having an inner space. .

In this way, when the first coil part 20 is embedded in the mold part 60, the first coil part 20, the second coil part 31, and the first coil part 20 by the mold part 60 Insulation is easily secured between the and the core 80. Therefore, the above-described insulating cover may be omitted.

Next, a method of manufacturing a coil component according to the exemplary embodiment illustrated in FIGS. 11 to 13 will be described with reference to FIG. 12. The configuration of the above-described coil components will also be clearly described through the following description.

First, the main substrate 30 is prepared. The main substrate 30 may be in a state in which both the primary-side electronic components 35 and the secondary-side electronic components 25 are mounted.

Subsequently, the coil assemblies 20 and 60 in which the first coil unit 20 is partially accommodated in the mold unit 60 are coupled to the main substrate 30. Here, the coil assemblies 20 and 60 may be manufactured by first forming the first coil unit 20, placing it in a mold, and forming the mold unit 60 through injection molding.

In addition, the coil assemblies 20 and 60 may be manufactured by separately forming the mold part 60 having an inner space, and then inserting the first coil part 20 into the inner space of the mold part 60 and integrating it.

Subsequently, the cores 81 and 86 are combined to complete the coil component 400. The cores 81 and 86 are inserted into the core insertion portion 33 of the main substrate 30 and may be coupled to the main substrate 30 and the laminated substrate in a form of penetrating through.

14 is a perspective view schematically showing a coil component according to another embodiment of the present invention, and FIG. 15 is a perspective view schematically showing a first coil part of the coil component shown in FIG. 14.

14 to 15, in the coil component 500 according to the present embodiment, a mold part 60 is formed on the first coil part 20 similarly to the embodiment of FIG. 11.

The mold part 60 according to this embodiment may include a buried part 65, a flange part 68, and a coupling protrusion 67.

The buried portion 65 fills the pattern portion (23 of FIG. 2) in which the first coil pattern is formed in the first coil portion 20. Accordingly, the terminal portion 22 of the first coil portion 20 is exposed to the outside of the buried portion 65.

The flange portion 68 is formed along the periphery of the terminal portion 22 exposed to the outside of the buried portion 65. The flange portion 68 is formed in a form that extends outward from the entrance of the buried portion 65 where the terminal portion 22 of the first coil portion 20 is exposed. For example, the flange portion 68 may be formed to be perpendicular to each surface of the first coil portion 20 and protrude to the outside.

The flange portion 68 is disposed between the terminal portion 22 of the first coil portion 20 and the core 80, and secures an insulation distance and a creepage distance therebetween.

In addition, the flange portion 68 may be disposed partially passing through the main substrate 30. Accordingly, the insulation distance and creepage distance between the terminal pad (not shown) of the main substrate 30 and the second coil unit 20 can be easily secured.

The coupling protrusion 67 may be a protrusion protruding from one surface of the buried portion 65 and is inserted into the main substrate 30. In response, a coupling groove (not shown) into which the coupling protrusion 67 is inserted may be formed in the main substrate 30.

Therefore, in the mold part 60, the coupling protrusion 67 is inserted into the coupling groove of the main substrate 30 and may be coupled to the main substrate 30, and thus the first coil part 20 embedded in the mold part 60 ) And the second coil unit, which is the main substrate 30, can always be coupled at a preset precise position.

Also, in the first coil unit 20 according to the present embodiment, only the terminal pad 24 is formed on the terminal unit 22. Therefore, the terminal pad 24 is bonded to the terminal pad (not shown) of the main board 30 and mounted using only a conductive bonding agent such as solder without a terminal pin.

Meanwhile, since the method of manufacturing the coil component 500 according to the present embodiment is similar to the method of manufacturing the coil component illustrated in FIG. 11 described above, a description thereof will be omitted.

16 is a side view schematically showing a coil component according to another embodiment of the present invention, and FIG. 17 is a plan view of the coil component shown in FIG. 16.

In the coil component 600 according to the present embodiment, a hole is formed in the terminal portion 22 of the first coil portion 20 including a laminated substrate, and a hole is formed in the main substrate 30 as the second coil portion. Further, the terminal board 70 is inserted through the hole of the first coil part 20 and the hole of the second coil part 30. The terminal board 70 may be a general PCB board, but other boards may be used.

A wiring pattern (not shown) is formed on the terminal substrate 70, and the coil pattern (not shown) of the first coil unit 20 and the wiring pattern (not shown) of the main substrate 30 are electrically connected through the wiring pattern. Connect with

Accordingly, the first coil unit 30 may have a terminal pad 27 electrically connected to the terminal substrate 70 formed on one surface, that is, an upper surface, and the main substrate 30 is electrically connected to the terminal substrate 70. Terminal pads 32 for connection may be formed on the lower surface. Accordingly, the terminal substrate 70 may physically and electrically connect the first coil unit 20 and the main substrate 30 through a conductive bonding agent 75 such as solder.

In the coil component according to the present embodiment, an insulation distance and a creepage distance are secured between a terminal pad of the first coil portion (or a terminal pad of the second coil portion) and the core by a terminal substrate. Therefore, the above-described insulating cover or mold may be omitted if necessary.

The coil component and its manufacturing method according to the present invention described above are not limited to the above-described embodiments, and various applications are possible.

In addition, in the present embodiment, a coil component applied to an AC/DC converter employed in a power supply has been described as an example, but the present invention is not limited thereto, and a coil component using a coil and a core can be widely applied to various electronic components and electronic devices. .

10: coil part
20: first coil unit
30: main substrate, second coil unit
50: insulation cover
60: mold part
70: terminal board
80: core

Claims (28)

A first coil unit including a laminated substrate on which a first coil pattern is formed;
A second coil unit including a main substrate on which a second coil pattern is formed and a plurality of electronic components are mounted;
A core passing through the first and second coil units and coupled to the first and second coil units; And
Including; an insulating member securing an insulating distance between the second coil pattern and the electronic components mounted on the main substrate,
The main substrate includes a first portion in which the second coil pattern is formed, a second portion in which terminal holes are provided, and a cut-out portion passing through the main substrate between the first portion and the second portion,
The sidewall of the insulating member penetrates the incision
The stacked substrate of the first coil part vertically overlaps the first part, the second part, and the sidewall of the insulating member.
The method of claim 1, wherein the insulating member,
An insulating cover including at least one sidewall, the sidewall being interposed between the second coil pattern and the electronic components.
The method of claim 2, wherein the insulating member,
A coil component interposed between terminal pins having the sidewalls joined to the first coil unit and the second coil pattern of the second coil unit. The method of claim 3,
A terminal pad to which the terminal pins are bonded is formed on the main substrate,
The cutout part is a coil component for cutting between the terminal pad and the second coil pattern.
The method of claim 1, wherein the electronic components mounted on the main substrate,
Including primary-side electronic components and secondary-side electronic components,
The insulating member is interposed between the primary-side electronic components and the secondary-side electronic components to secure an insulating distance therebetween.
The method of claim 1, wherein the laminated substrate,
A coil component comprising: a pattern portion on which the first coil pattern is formed; and a terminal block protruding from the pattern portion in a shape of'a', wherein the insulating member is interposed between the terminal block and the pattern portion.
The method of claim 6, wherein the laminated substrate,
A plurality of the terminal holes are formed in the terminal block,
A coil component into which a plurality of terminal pins formed on the main substrate are respectively inserted into the plurality of terminal holes.
The method of claim 1,
A coil component further comprising insulating films formed larger than an area of one side of the laminated substrate and bonded to both sides of the laminated substrate.
The method of claim 8, wherein the laminated substrate,
A coil component in which insulation from the inner surface of the core is secured by the insulating film.
A first coil unit including a laminated substrate on which a first coil pattern is formed;
A second coil unit including a main substrate on which a second coil pattern is formed and a plurality of electronic components are mounted;
A core passing through the first and second coil units and coupled to the first and second coil units; And
Including; an insulating member securing an insulating distance between the second coil pattern and the electronic components mounted on the main substrate,
The insulating member,
A coil part which is a mold part made of an insulating material that accommodates the first coil part therein.
The method of claim 10, wherein the laminated substrate,
A coil component in which the pattern part on which the first coil pattern is formed is accommodated in the mold part, and the terminal part is exposed to the outside of the mold part.
The method of claim 10, wherein the mold part,
A coil component comprising a locking protrusion protruding from one surface and mechanically coupled to the core.
The method of claim 12, wherein the locking projection of the mold part,
A coil component that penetrates the main substrate and is coupled to the core.
The method of claim 10, wherein the mold part,
A buried part exposing the terminal part of the first coil part to the outside and filling in a part where the first coil pattern is formed; And
A flange portion extending outward from the entrance of the buried portion;
Coil component comprising a.
The method of claim 14, wherein the flange portion,
A coil component disposed through the main substrate.
The method of claim 14, wherein the flange portion,
A coil component disposed between the terminal portion of the first coil unit and the core to secure mutual insulation.
The method of claim 14, wherein the mold part,
A coil component further comprising at least one coupling protrusion protruding from one surface of the buried portion and inserted into a coupling groove formed in the main substrate.
delete The method of claim 1,
Including terminal pins electrically connecting the first coil pattern and the main substrate,
The insulating member is interposed between the terminal pins and the core to secure insulation between the coil components.
delete delete delete delete delete delete A first coil unit including a laminated substrate on which a first coil pattern is formed;
A second coil unit including a main substrate on which a second coil pattern is formed;
A core passing through the first and second coil units and coupled to the first and second coil units; And
A terminal substrate penetrating the first and second coil portions, coupled to the first and second coil portions, and electrically connecting the first coil pattern to the main substrate;
Coil component comprising a.
The method of claim 26, wherein the terminal substrate,
A coil component electrically connected to a terminal pad formed on an upper surface of the laminated substrate and electrically connected to a terminal pad formed on a lower surface of the main board.
Preparing a main substrate on which primary-side electronic components and secondary-side electronic components are mounted and on which a second coil pattern is formed;
Coupling a coil assembly in which the laminated substrate on which the first coil pattern is formed is partially accommodated in the mold unit to the main substrate; And
Coupling a core through the main substrate and the coil assembly;
Coil component manufacturing method comprising a.

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