KR102203235B1 - Heat radiating apparatus using ion flow - Google Patents

Abstract

An ion wind heat dissipation device according to an embodiment of the present invention includes a heat sink in thermal contact with a heating component; A heat radiating fin protruding upward from the heat sink; An upper plate disposed on the upper side of the radiating fin; And an ion wind module mounted in the through hole formed on the upper plate and generating an ion wind flowing toward the heat sink. An outflow hole may be formed in the upper plate, which is spaced apart from the through hole and through which the ion wind hitting the heat sink is discharged.

Description

Ion wind heat dissipation device{HEAT RADIATING APPARATUS USING ION FLOW}

The present invention relates to an ion wind heat dissipation device for performing heat dissipation using ion wind.

In general, electronic equipment generates a lot of heat during operation, and the generated heat acts as a factor deteriorating the performance of the electronic equipment. Therefore, a heat dissipation device is essential for electronic equipment.

With the trend of miniaturization of electronic equipment, the integration density of micro electronic devices is getting higher and higher.However, as the density of microelectronic devices is getting smaller and larger, the degree of heat integration increases, so there is a lot of heat generated from electronic devices.If this heat is not sufficiently discharged to the outside, the Performance and lifespan are lowered, and it may cause failure due to deformation due to heat. Accordingly, the cooling device is also required to be miniaturized and improved in performance.

In order to cool the heat dissipation structure attached to the heating element of the conventional electronic equipment, natural convection through a heat sink is used or a blower fan is used to cool it. Among them, when using a heat sink, there is a problem in that it is difficult to miniaturize electronic devices because the volume and area must be increased. In addition, since air is forcibly flowed in the case of heat dissipation using a blower fan, the resulting foreign matter collides with the rotating body and wears the rotating body, shortening the lifespan, causing vibration and noise, and making it difficult to miniaturize the mechanical structure. There is this.

In order to solve the problem of heat dissipation by a heat sink or a blowing fan, a heat dissipation device using ion wind has been proposed. Ion wind refers to the wind generated when the air is ionized by applying a high voltage to an electrode such as a probe or a thin wire to cause a corona discharge and then moving it in a strong electric field.

This cooling using ion wind has several advantages, such as high reliability, low noise, low power, and miniaturization, since there is no element driven by a motor unlike the conventional blower fan.

One problem to be solved by the present invention is to provide an ion wind heat dissipating device with improved ion wind flow path and improved heat exchange efficiency.

In the ion wind heat dissipation apparatus according to an exemplary embodiment of the present invention, an outflow hole through which the collision jet hitting the heat sink is formed is formed in the upper plate, so that the cooling efficiency of the collision jet for the heat sink may be improved.

In more detail, a heat sink in thermal contact with the heating element; A radiating fin protruding upward from the radiating plate; An upper plate disposed on the upper side of the radiating fin; And an ion wind module mounted in the through hole formed in the upper plate and generating ion wind flowing toward the heat sink. The upper plate may be spaced apart from the through hole and may have an outlet hole through which the ion wind hitting the heat dissipating plate flows out.

The upper plate may be supported by contacting the upper end of the heat dissipation fin.

The thickness of the upper plate may be thinner than that of the heat sink.

The ion wind module may include a wire to which a voltage is applied; And a mesh disposed under the wire and electrically grounded.

The wire may be elongated in a direction parallel to the heat sink.

The vertical distance between the wire and the mesh may be shorter than the vertical distance between the upper and lower surfaces of the heat sink.

The ion wind module may further include an insertion body in which the wire and the mesh are fixed, inserted into the through hole, and open upper and lower surfaces.

The wire may be disposed above the insertion body, and the mesh may be disposed below the insertion body.

The insertion body may include an insulating material.

The upper plate may include a metal material.

A distance between the centers of the one through hole and the other through hole adjacent to the one through hole may be greater than the distance between the center of the one through hole and the one through hole and the adjacent outlet hole.

The outlet hole may be positioned between a pair of ion wind modules in a first direction, and may be positioned between another pair of ion wind modules in a second direction crossing the first direction.

The radiating fin may have a pin shape.

An ion wind heat dissipation device according to an embodiment of the present invention includes a heat sink in thermal contact with a heating component; A radiating fin protruding upward from the radiating plate; An upper plate disposed on the upper side of the radiating fin; A wire for generating ion wind flowing to the heat sink through a through hole formed in the upper plate; And a mesh disposed between the wire and the heat sink and electrically grounded. In the upper plate, an outlet hole may be formed that is spaced apart from the through hole and through which the ion wind hitting the heat dissipating plate flows out.

According to a preferred embodiment of the present invention, the ion wind generated in the ion wind module forms an impinging jet hitting the heat sink, and the impinging jet hitting the heat sink may flow out into the outlet hole. Thus, the impinging jet having a low flow rate and a low flow rate can flow smoothly without being stagnated between the heat sink and the upper plate.

In addition, by including a plurality of ion wind modules that are more compact than conventional fans, the ion wind heat dissipation device can be compact while securing sufficient heat dissipation performance.

In addition, since the heat dissipation fin is formed as a pin-fin, the impinging jet hitting the heat dissipation plate is spread evenly and smoothly flows into the peripheral outlet hole.

In addition, since the ion wind module and the outlet hole are arranged evenly in a matrix, the flow of the ion wind becomes uniform and heat exchange efficiency can be improved.

In addition, since the upper plate is formed thin and the distance between the wire and the mesh is shortened, it is possible to minimize the adhesion of ionized particles to the surroundings. Accordingly, it is possible to prevent the flow rate of the ion wind from decreasing or the flow rate from being slowed down.

In addition, ion wind passing through the electrically grounded mesh may be electrically neutralized and stabilized. As a result, it is possible to minimize unintended effects on electronic components disposed around the ion wind heat dissipation device.

In addition, the wire to which the voltage is applied is formed long in a direction parallel to the heat sink, and the electrically grounded mesh may be located under the wire. As a result, a collision jet toward the heat sink may be formed by the electric field between the wire and the mesh.

In addition, the ion wind module may include an insertion body in which the wire and the mesh are fixed and inserted into the through hole of the upper plate. This can facilitate the installation of the ion wind module.

In addition, the insertion body may include an insulating material. Accordingly, ionized particles around the wire are prevented from adhering to the inner circumference of the insertion body, and the flow rate of the ion wind may be reduced or the flow rate may not be slowed down.

In addition, the upper plate may include a metal material and may be in contact with the upper end of the radiating fin. Therefore, the cooling performance of the ion wind heat dissipation device can be improved.

1 is a perspective view of an ion wind heat dissipating device according to an embodiment of the present invention.
2 is a perspective view of an ion wind module according to an embodiment of the present invention.
3 is a cross-sectional view taken along AA′ of FIG. 1.
4 is a cross-sectional view taken along BB′ of FIG. 1.
5 is a plan view of an ion wind heat dissipating device according to an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail together with the drawings.

1 is a perspective view of an ion wind heat dissipating device according to an embodiment of the present invention, and FIG. 2 is a perspective view of an ion wind module according to an embodiment of the present invention.

The ion wind heat dissipation apparatus according to an embodiment of the present invention may include a heat sink 10, a heat radiating fin 20, an upper plate 30, and an ion wind module 60.

The heat sink 10 may be in thermal contact with a heat generating component (not shown). The heat sink 10 may contact the upper surface of the heat generating part, and heat from the heat generating part may be conducted to the heat sink.

The heat dissipation fin 20 may increase heat dissipation efficiency by increasing the area of thermal contact with ion wind, which will be described later.

The radiating fin 20 may protrude upward from the radiating plate 10. The radiating fins 20 may have a pin shape. Therefore, the radiating fin 20 may be referred to as a pin-fin. The radiating fins 20 are formed to be elongated vertically and may be perpendicular to the radiating plate 10.

A plurality of radiating fins 20 may be formed. The plurality of radiating fins 20 may be spaced apart from each other.

The upper plate 30 may be disposed on the upper side of the heat dissipation fin 20. That is, the upper plate 30 may be vertically spaced apart from the heat sink 10. The upper plate 30 may be parallel to the heat sink 10. The upper plate 30 may be supported by contacting the upper end of the heat dissipation fin 20.

The size and shape of the upper plate 30 may be the same as or similar to the heat sink 10.

The heat sink 10, the heat sink 20, and the upper plate 30 may include a material having high thermal conductivity. For example, the heat sink 10, the heat sink fins 20, and the upper plate 30 may include a metal material. The heat dissipation plate 10, the heat dissipation fin 20, and the upper plate 30 may act together as a heat sink.

A through hole 40 may be formed in the upper plate 30. The through hole 40 may be vertically penetrated through the upper plate 30.

A plurality of through holes 40 may be formed spaced apart from each other. The plurality of through holes 40 may be arranged to form at least one row and at least one column.

In addition, an outlet hole 50 may be formed in the upper plate 30. The outflow hole 50 may penetrate up and down through the upper plate 30.

The outlet hole 50 may be formed in a plurality of spaced apart from each other. The plurality of outlet holes 50 may be arranged to form at least one row and at least one column.

The outlet hole 50 may be spaced apart from the through hole 40. The size of the outlet hole 50 is preferably smaller than the through hole 40, but is not limited thereto.

The flow of ion wind hitting the heat sink 10 may flow out to the upper side of the upper plate 30 through the outlet hole 50.

The ion wind module 60 may generate an ion wind flowing toward the heat sink 10. The ion wind module 60 may be mounted in the through hole 40 formed in the upper plate 30.

A plurality of ion wind modules 60 may be provided. The plurality of ion wind modules 60 may be mounted in each of the plurality of through holes 40.

In more detail, the ion wind module 60 may include an insertion body 61, a wire 62, and a mesh 63.

The insertion body 61 may be inserted into the through hole 40 of the upper plate 30. The insertion body 61 may have an annular shape or a hollow cylinder shape. Preferably, the insertion body 61 may have a circular ring shape or a circular hollow cylinder shape. In addition, the upper and lower surfaces of the insertion body 61 may be open.

The upper and lower heights of the insertion body 61 may be the same as or similar to the thickness of the upper plate 30.

The insertion body 61 may include an insulating material. Accordingly, the wire 62 and the mesh 63 connected to the insertion body 61 can be electrically separated. In addition, the upper plate 30 made of a metal material may be electrically separated from the wire 62 and the mesh 63.

The wire 62 may generate an ionic wind by applying a voltage. The wire 70 may act as an electrode, and may include a material through which electricity passes. For example, the wire 70 may include a metal material.

The wire 62 may be disposed on the open upper surface of the insertion body 61 or may be fixed to the top of the insertion body 61.

When a sufficiently high voltage is applied to the wire 62, the air around the wire 62 may be ionized by corona discharge, and may move downward by an electric field to generate an ionic wind.

The wire 62 may be elongated in a direction parallel to the heat sink 10 and the upper plate 30. It is preferable that the length directions of the wires 62 included in each of the plurality of ion wind modules 60 are parallel to each other.

The mesh 63 (mesh) may be spaced apart from the wire 62. The mesh 63 may be located under the wire 62. The mesh 63 may cover an open bottom surface of the insertion body 61 or may be fixed to a lower portion of the insertion body 61.

The mesh 63 may include a material through which electricity is passed. The mesh 63 may be electrically grounded.

An electric field may be formed between the wire 62 to which a voltage is applied and the grounded mesh 63. The ionized particles around the wire 62 may move toward the mesh 63 by the electric field to generate an ion wind. Accordingly, the ion wind generated by the wire 62 may pass through the mesh 63 and flow toward the heat sink 10.

The ionized air may pass through the grounded mesh 63 and be electrically neutralized, and then flow toward the heat sink 10 by inertia. Since the ion wind passes through the mesh 63 and is neutralized, there is an advantage of minimizing the possibility of affecting electronic components disposed adjacent to the ion wind radiator.

Since the flow after passing through the mesh 63 is electrically stable, it may not be strictly "ionic" wind, but in this specification, it is collectively referred to as ionic wind for convenience of description.

As described above, since the insertion body 61 includes an insulating material, the insertion body 61 does not affect the electric field between the wire 62 and the mesh 63. Accordingly, it is possible to prevent the flow rate and flow rate of the ion wind passing through the inner circumference of the insertion body 61 from weakening.

The configuration of the ion wind module 60 is not limited to the above description. As another example, the ion wind module 60 may not include the insertion body 61. In this case, the wire 62 and the mesh 63 may be directly connected to the upper plate 30 so as to be positioned above and below the through hole 40. However, when the wire 62 and the mesh 63 are directly connected to the upper plate 30, the upper plate 30 must contain an insulating material, so the heat exchange efficiency will be lower than when the upper plate 30 contains a metal material. I can.

FIG. 3 is a cross-sectional view taken along line A-A′ of FIG. 1, and FIG. 4 is a cross-sectional view taken along line B-B′ in FIG. 1.

Even if the insertion body 61 includes an insulating material, if the path of the ion wind passing through the inner circumference of the insertion body 61 is long, ionized particles may adhere to the inner circumference of the insertion body. In order to prevent this, it is preferable that the moving distance of ionized particles around the wire 62 to pass through the mesh 63 is sufficiently short.

In more detail, the thickness t2 of the upper plate 30 may be thinner than the thickness t1 of the heat sink 10. The vertical length of the insertion member 61 may be shorter than the vertical distance t1 between the upper and lower surfaces of the heat sink 10. The vertical distance between the wire 62 and the mesh 63 may be shorter than the vertical distance t1 between the upper and lower surfaces of the heat sink 10.

Thereby, the ionized particles from the wire 62 toward the mesh 63 pass through the mesh 63 before adhering to the inner circumference of the insertion body 61 and are electrically neutralized, and the ion wind is smoothly directed toward the heat sink 10. Can be fluidized.

The ion wind generated in the ion wind module 60 may form an impinging jet hitting the upper surface of the heat sink 10. Since the impinging jet directly collides with the heat sink 10, the heat sink 10 can be efficiently cooled.

The collision jet colliding with the heat dissipation plate 10 is spread out to the periphery, and at least some of them may flow out to the upper side of the upper plate 30 through the plurality of outlet holes 50 formed in the upper plate 30.

If the outflow hole 50 is not formed in the upper plate 30, the impinging jet generated in the ion wind module 60 located at the center of the upper plate 30 and colliding with the heat sink 10 is the edge of the heat sink 10 And may flow slowly between the edges of the upper plate 30. Since the flow rate and flow rate of the ion wind generated by the ion wind module 60 is weak compared to the flow generated by the conventional fan, the flow rate between the upper plate 30 and the heat sink 10 is very small. This can happen. Accordingly, the flow boundary layer may be formed thickly on the upper surface of the heat sink 10. The flow boundary layer may interfere with an impinging jet directed toward the heat sink 10 in the other ion wind module 60 to prevent the impinging jet from colliding with the heat sink 10. That is, the heat dissipation performance of the heat dissipation plate 10 may be lowered.

On the other hand, when the outlet hole 50 is formed in the upper plate 30, most of the impinging jets that occur in the ion wind module 60 located in the center of the upper plate 30 and collide with the heat sink 10 are discharged from the outlet hole on the upper side of the heat sink. It can be leaked to (50). Therefore, the flow boundary layer formed on the upper surface of the heat sink 10 may not be formed or may be formed thin, and interference of the impinging jet from the other ion wind module 60 toward the heat sink 10 with the flow boundary layer can be minimized. . That is, there is an advantage that the cooling efficiency of the heat sink 10 by the impinging jet is increased.

In addition, the collision jet flows from the ion wind module 60 to the heat sink 10 and exchanges heat with the heat radiation fin 20, flows from the heat sink 10 to the outlet hole 50, and can exchange heat with the heat radiation fin 20 again. . Accordingly, the cooling efficiency of the heat dissipation fin 20 may be increased.

Since the heat dissipation fin 20 is formed as a pin-fin, the heat exchange area with the impinging jet can be maximized, and the impinging jet colliding with the heat dissipating plate 10 can easily flow out into the outlet hole 50. have.

5 is a plan view of an ion wind heat dissipation device according to an embodiment of the present invention.

The plurality of through holes 40 and the plurality of through holes 50 may be arranged to form at least one row and at least one column, respectively.

As an example, 28 through-holes 40 made up of four rows (M1, M2, M3, M4) and seven columns (N1, N2, N3, N4, N5, N6, N7) are formed in the upper plate 30 Can be. In addition, 18 outlet holes 50 including three rows I1, I2, and I3 and six columns J1, J2, J3, J4, J5, and J6 may be formed in the upper plate 30.

Based on the edge of the upper plate 30, the outermost rows (M1, M4) and columns (N1, N7) of the matrix formed by the plurality of through holes 40 are a matrix formed by a plurality of outlet holes 50 It may be closer than the outermost rows (I1, I3) and columns (J1, J6).

The rows I1, I2, and I3 formed by the plurality of outlet holes 50 may be parallel to the rows M1, M2, M3, and M4 formed by the plurality of through holes 40. In addition, the rows (J1, J2, J3, J4, J5, J6) formed by the plurality of outlet holes 50 are the columns (N1, N2, N3, N4, N5, N6, N7) formed by the plurality of through-holes (40). ) And can be parallel.

The rows I1, I2, and I3 formed by the plurality of outlet holes 50 may be located between a pair of rows M1, M2, M3, and M4 formed by the plurality of through holes 40. Accordingly, the number of rows I1, I2, and I3 formed by the plurality of outflow holes 50 may be one less than the number of rows M1, M2, M3, and M4 formed by the plurality of through-holes 40.

The rows (J1, J2, J3, J4, J5, J6) formed by the plurality of outflow holes 50 are a pair of rows (N1, N2, N3, N4, N5, N6) formed by the plurality of through holes 40. N7) can be located between. Therefore, the number of rows (J1, J2, J3, J4, J5, J6) formed by the plurality of outlet holes 50 is the rows (N1, N2, N3, N4, N5, N6) formed by the plurality of through-holes (40). , May be one less than the number of N7).

In addition, each outlet hole 50 is located between the pair of ion wind modules 60 in the first direction (X1), the other in the second direction (X2) intersecting the first direction (X1). It may be located between the pair of ion wind modules 60. The first direction X1 and the second direction X2 may be diagonal directions to rows and columns formed by the plurality of outlet holes 50 and the plurality of through holes 40.

Each of the rows M1, M2, M3, and M4 formed by the plurality of through holes 40 may be spaced apart from each other by a first distance L1. Each of the columns N1, N2, N3, N4, N5, N6, and N7 formed by the plurality of through holes 40 may be spaced apart from each other by a second distance L2. The first distance L1 and the second distance L2 may be the same or different from each other.

Each of the rows I1, I2, and I3 formed by the plurality of outlet holes 50 may be spaced apart from each other by a third distance L3. Each row (J1, J2, J3, J4, J5, J6) formed by the plurality of outlet holes 50 may be spaced apart from each other by a fourth distance L4. The third distance L3 and the fourth distance L4 may be the same or different from each other.

The third distance L3 may be the same as the first distance L1. The fourth distance L4 may be the same as the second distance L2.

The distance (L1 or L2) between the centers of one through-hole 40 and the other through-hole 40 adjacent to the one through-hole 40 is adjacent to the one through-hole 40 and the one through-hole 40 It may be farther than the distance L5 between the centers of the outlet hole 50.

The ion wind module 60 is generated in the ion wind module 60 by a constant arrangement of the ion wind module 60 and the outlet hole 50, collides with the heat sink 10, and flows of the ion wind flowing out to the outlet hole 50 may be uniform. . In addition, a plurality of through-holes 40 and outlet holes 50 may be formed in the upper plate having a limited size.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains will be able to make various modifications and variations without departing from the essential characteristics of the present invention.

Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments.

The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

10: heat sink 20: heat sink fin
30: top plate 40: through hole
50: outlet hole 60: ion wind module
61: insert body 62: wire
63: mesh

Claims (14)

A heat sink in thermal contact with the heating element;
A radiating fin protruding upward from the radiating plate;
An upper plate disposed on the upper side of the radiating fin; And
A plurality of ion wind modules each mounted in a plurality of through-holes formed in the upper plate and generating ion wind flowing toward the heat sink,
In the upper plate, a plurality of outlet holes are formed which are spaced apart from the through hole and through which the ion wind hitting the heat sink is discharged,
The plurality of through holes and the plurality of outlet holes are arranged to form at least one row and at least one column, respectively,
The outlet hole,
An ion wind heat dissipating device positioned between a pair of ion wind modules with respect to a first direction and between a pair of ion wind modules with respect to a second direction crossing the first direction. The method of claim 1,
The upper plate is an ion wind heat dissipating device supported by contacting an upper end of the heat dissipating fin. The method of claim 1,
The thickness of the upper plate is thinner than that of the heat radiation plate. The method of claim 1,
The ion wind module,
A wire to which voltage is applied; And
Ion wind heat dissipation device comprising a mesh disposed under the wire and electrically grounded. The method of claim 4,
The wire is an ion wind heat dissipating device formed to be elongated in a direction parallel to the heat sink. The method of claim 4,
Ion wind heat dissipation device in which the vertical distance between the wire and the mesh is shorter than the vertical distance between the upper and lower surfaces of the heat sink. The method of claim 4,
The ion wind module,
Ion wind heat dissipation device further comprising an insertion body in which the wire and the mesh are fixed and inserted into the through hole, and the top and bottom surfaces are open. The method of claim 7,
The wire is disposed above the insertion body,
The mesh is an ion wind heat dissipating device disposed under the insertion body. The method of claim 7,
The insert body is an ion wind heat dissipating device comprising an insulating material. The method of claim 9,
The upper plate is an ion wind heat dissipating device comprising a metal material. The method of claim 1,
The distance between the centers of the one through hole and the other through hole adjacent to the one through hole is greater than the distance between the center of the one through hole and the one through hole and the adjacent outlet hole. delete The method of claim 1,
The heat dissipation fin is an ion wind heat dissipation device having a pin shape. A heat sink in thermal contact with the heating element;
A radiating fin protruding upward from the radiating plate;
An upper plate disposed on the upper side of the radiating fin; And
A plurality of ion wind modules each mounted in a plurality of through-holes formed in the upper plate and generating ion wind flowing toward the heat sink,
The ion wind module,
A wire for generating ion wind flowing to the heat sink through the through hole; And
It includes a mesh disposed between the wire and the heat sink and electrically grounded,
In the upper plate, a plurality of outlet holes are formed which are spaced apart from the through hole and through which the ion wind hitting the heat sink is discharged,
The outlet hole,
An ion wind heat dissipating device positioned between a pair of ion wind modules with respect to a first direction and between a pair of ion wind modules with respect to a second direction crossing the first direction.

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