KR102201151B1 - Process gas supply device for foup using humidity sensing - Google Patents

Process gas supply device for foup using humidity sensing Download PDF

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KR102201151B1
KR102201151B1 KR1020200099193A KR20200099193A KR102201151B1 KR 102201151 B1 KR102201151 B1 KR 102201151B1 KR 1020200099193 A KR1020200099193 A KR 1020200099193A KR 20200099193 A KR20200099193 A KR 20200099193A KR 102201151 B1 KR102201151 B1 KR 102201151B1
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process gas
humidity
gas supply
sensing
unit
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KR1020200099193A
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Korean (ko)
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권민현
김영환
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주식회사 테라베니어
김영환
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention can remove moisture by sensing humidity contained in an inner space of a front opening unified pod (FOUP) in which a wafer is accommodated and injecting a process gas into the inner space of the FOUP. The present invention includes: a wafer storage member (100) that is discharged to the other side of the inner space after the process gas supplied from the outside flows into one side of the inner space in which the wafer is accommodated; a stage member (200) on which the wafer storage member (100) is seated; a process gas supply member (300) for supplying a process gas to the wafer storage member (100) seated on the stage member (200) and guiding the discharge of the process gas and air supplied to the wafer storage member (100); a humidity sensing member (400) for sensing humidity in the air discharged from the wafer storage member (100); a wafer storage member sensing member (500) for detecting the wafer storage member (100) seated on the stage member (200); and a process gas control member (600) for operating the process gas supply member (300) according to the detection of the wafer storage member sensing member (500) and maintaining or stopping the operation of the process gas supply member (300) according to the humidity detected by the humidity sensing member (400).

Description

습도감지를 이용한 퍼프용 공정가스 공급장치{PROCESS GAS SUPPLY DEVICE FOR FOUP USING HUMIDITY SENSING}Process gas supply device for puff using humidity sensing {PROCESS GAS SUPPLY DEVICE FOR FOUP USING HUMIDITY SENSING}

본 발명은 웨이퍼가 수납되는 퍼프의 내부공간에 함유된 습도를 센싱하여 퍼프의 내부공간에 공정가스를 주입하여 습기를 제거할 수 있는 습도감지를 이용한 퍼프용 공정가스 공급장치에 관한 것이다. The present invention relates to a process gas supply device for puff using humidity sensing capable of removing moisture by sensing the humidity contained in the inner space of the puff in which the wafer is stored and by injecting the process gas into the inner space of the puff.

일반적으로, 반도체소자는 웨이퍼 상에 증착공정, 연마공정, 포토리소그래피공정, 식각공정, 이온주입공정, 세정공정, 검사공정, 열처리공정 등이 선택적이면서 반복적으로 수행되어 제조된다. 그리고, 반도체소자로 형성되기 위하여 웨이퍼는 각 공정에서 특정위치로 운반되어야 한다. In general, semiconductor devices are manufactured by selectively and repeatedly performing a deposition process, a polishing process, a photolithography process, an etching process, an ion implantation process, a cleaning process, an inspection process, and a heat treatment process on a wafer. And, in order to be formed into a semiconductor device, the wafer must be transported to a specific location in each process.

반도체 제조공정 시에 가공되는 웨이퍼는 고정밀도의 물품으로 보관 및 운반 시 외부의 오염물질에 의해 오염되거나 충격으로부터 손상되지 않도록 웨이퍼 수납 용기인 개구 통합형 포드(FRONT OPENING UNIFIED POD : FOUP)에 수납되어 이송된다. Wafers processed during the semiconductor manufacturing process are stored and transported as high-precision items in the front opening integrated pod (FOUP), which is a wafer storage container, so that they are not contaminated by external contaminants or damaged from impact. do.

이와 같이, 웨이퍼 이송장치 내로 유입되는 공기는 필터링되어 여과되지만, 밀폐된 퍼프(FOUP)의 내부는 필터링되지 않은 공기가 존재한다. 이러한 공기는 산소(O2), 수분(H2O) 및 오존(O3)과 같은 분자성 오염물질들을 포함하고 있다. In this way, the air introduced into the wafer transfer device is filtered and filtered, but unfiltered air is present inside the closed FOUP. This air contains molecular contaminants such as oxygen (O2), moisture (H2O) and ozone (O3).

따라서 밀폐된 퍼프(FOUP)의 내부에 존재하는 산소 함유의 가스오염물질들은 밀폐된 퍼프 내의 웨이퍼 표면을 자연 산화시켜 웨이퍼 상에 자연 산화막(NATURAL OXIDE)을 형성한다. Accordingly, oxygen-containing gaseous contaminants present in the sealed puff naturally oxidize the wafer surface in the sealed puff to form a natural oxide film on the wafer.

이러한 자연 산화막은 경우에 따라서 양품의 반도체 생산을 저해하는 원인으로 작용하였으며, 밀폐된 퍼프의 내부 습도가 40%~50%일 경우 웨이퍼의 자연 산화막이 활성화됨으로 인해 공정특성을 변화시켜 반도체 품질을 저하시키는 문제점이 있다. In some cases, this natural oxide film acted as a cause of hindering the production of good-quality semiconductors, and when the internal humidity of the sealed puff is 40% to 50%, the natural oxide film of the wafer is activated, thereby changing the process characteristics and lowering the semiconductor quality. There is a problem to make.

본 발명의 배경기술은 대한민국 특허청에 출원되어 등록된 등록특허공보 제10-1147191호(등록일자:2012.05.10.)가 게재되어 있다. The background technology of the present invention has been published in Patent Publication No. 10-1147191 (Registration Date: 2012.05.10.) registered and applied to the Korean Intellectual Property Office.

본 발명이 해결하고자 하는 과제는, 웨이퍼가 수납되는 퍼프의 내부공간에 함유된 습도를 센싱하여 퍼프의 내부공간에 공정가스를 주입하여 습기를 제거할 수 있는 습도감지를 이용한 퍼프용 공정가스 공급장치을 제공하는 데 있다. The problem to be solved by the present invention is to provide a process gas supply device for puff using humidity detection capable of removing moisture by injecting process gas into the puff's internal space by sensing the humidity contained in the puff's inner space where the wafer is stored. To provide.

본 발명의 일실시예에 따른 습도감지를 이용한 퍼프용 공정가스 공급장치는, 외부로부터 공급되는 공정가스가 웨이퍼가 수납되는 내부공간의 일측으로 유입된 후에 내부공간의 타측으로 배출되는 웨이퍼수납부재(100)와, 웨이퍼수납부재(100)가 안착되는 스테이지부재(200)와, 스테이지부재(200)에 안착된 웨이퍼수납부재(100)에 공정가스를 공급하고 웨이퍼수납부재(100)에 공급된 공정가스 및 공기의 배출을 안내하는 공정가스공급부재(300)와, 웨이퍼수납부재(100)에서 배출되는 공기에서 습도를 감지하는 습도감지부재(400)와, 스테이지부재(200)에 안착되는 웨이퍼수납부재(100)를 감지하는 수납부재감지부재(500)와, 수납부재감지부재(500)의 감지에 따라 공정가스공급부재(300)를 작동시키고 습도감지부재(400)에서 감지되는 습도에 따라 공정가스공급부재(300)의 작동을 유지하거나 정지시키는 공정가스제어부재(600)를 포함하는 것을 특징으로 한다. A process gas supply device for puff using humidity sensing according to an embodiment of the present invention includes a wafer storage member that is discharged to the other side of the inner space after the process gas supplied from the outside flows into one side of the inner space in which the wafer is accommodated ( 100), the stage member 200 on which the wafer storage member 100 is mounted, and the process gas supplied to the wafer storage member 100 mounted on the stage member 200 and supplied to the wafer storage member 100 A process gas supply member 300 for guiding the discharge of gas and air, a humidity sensing member 400 for sensing humidity in the air discharged from the wafer storage member 100, and a wafer storage mounted on the stage member 200 The storage member sensing member 500 for sensing the member 100 and the processing gas supply member 300 are operated according to the detection of the storage member sensing member 500 and processed according to the humidity detected by the humidity sensing member 400 It characterized in that it comprises a process gas control member 600 for maintaining or stopping the operation of the gas supply member 300.

바람직하게, 공정가스공급부재(300)는 스테이지부재(200)의 일측에 구비되어 웨이퍼수납부재(100)의 일측에 연통된 상태로 공정가스를 분사하는 가스공급노즐부(310)와, 스테이지부재(200)의 타측에 구비되어 웨이퍼수납부재(100)의 일측에 연통된 상태로 공정가스를 배출하는 가스배출부(320)와, 외부로부터 공급되는 공정가스를 가스공급노즐(310)로 공급하는 공정가스공급부(330)를 포함하고, 가스공급노즐부(310)는 스테이지부재(200)에 관통되게 설치되는 노즐본체(311)와, 노즐본체(311)에 고정된 상태로 웨이퍼수납부재(100)에 밀착되어 공정가스의 유실을 방지하는 유입방지부(312)를 포함하는 것을 특징으로 한다. Preferably, the process gas supply member 300 is provided on one side of the stage member 200 and is in communication with one side of the wafer storage member 100 and injects the process gas into a gas supply nozzle unit 310, and the stage member A gas discharge unit 320 provided on the other side of the 200 to discharge process gas in a state in communication with one side of the wafer storage member 100, and supplying process gas supplied from the outside to the gas supply nozzle 310 Including a process gas supply unit 330, the gas supply nozzle unit 310 is a nozzle body 311 installed to pass through the stage member 200, and the wafer storage member 100 while being fixed to the nozzle body 311 It is characterized in that it comprises an inflow prevention unit 312 which is in close contact with the process gas to prevent loss.

바람직하게, 노즐본체(311)는 하단에 공정가스가 유입되는 유입구(313)가 형성되고, 상단에 공정가스가 분사되는 분사구(314)가 형성되며, 공정가스의 압력이 증대되어서 분사구(314)로 공급되도록 유입구(313)에서 분사구(314)를 향해 점점 좁혀지게 가스통로(315)가 형성되는 것을 특징으로 한다. Preferably, the nozzle body 311 has an inlet 313 through which the process gas is introduced at the lower end, and the injection port 314 through which the process gas is injected is formed at the upper end, and the pressure of the process gas is increased so that the injection port 314 It is characterized in that the gas passage 315 is formed to be gradually narrowed toward the injection port 314 from the inlet port 313 so that it is supplied to.

바람직하게, 노즐본체(311)는 상부에서 외측에 걸림턱(316)이 형성되고, 유입방지부(312)는 캡형태로 형성되고, 상부에 분사구(314)에 연통되는 연통홀(317)이 형성되며, 하부에 노즐본체(311)의 걸림턱(316)에 걸려서 고정되는 내향플랜지(318)가 형성되는 것을 특징으로 한다. Preferably, the nozzle body 311 has a locking projection 316 formed on the outside from the top, the inflow prevention part 312 is formed in a cap shape, and a communication hole 317 communicating with the injection port 314 is formed on the top. It is formed, characterized in that the inward flange 318 is formed to be fixed by hooking the locking projection 316 of the nozzle body 311 at the bottom.

바람직하게, 습도감지부재(400)는 공정가스공급부재(300)에 의해 배출되는 공정가스가 관류되는 감지케이스(410)와, 감지케이스(410)에 설치되는 회로기판(420)과, 회로기판(420)에 구비된 상태로 공기에서 습도를 센싱하는 습도센서(430)와, 습도센서(430)에서 센싱되는 습도에 대한 아날로그수치를 디지털수치로 변환한 습도정보를 외부로 발신하는 습도정보발신부재(440)를 포함하며, 회로기판(420)은 내측에서 서로 마주되면서 이격되어 습도센서(430)의 양측이 고정되는 고정편(421)이 형성되고, 고정편(421)들의 양측에 공기가 유통되는 공기유통홀(422)이 형성되는 것을 특징으로 한다. Preferably, the humidity sensing member 400 includes a sensing case 410 through which the process gas discharged from the process gas supply member 300 flows, a circuit board 420 installed in the sensing case 410, and a circuit board. Humidity information transmission that transmits humidity information obtained by converting an analog value for humidity sensed by the humidity sensor 430 into a digital value and a humidity sensor 430 that senses humidity in the air in a state provided in 420 Including a member 440, the circuit board 420 is spaced apart while facing each other from the inside to form a fixing piece 421 to which both sides of the humidity sensor 430 are fixed, and air is supplied to both sides of the fixing pieces 421. It is characterized in that the air circulation hole 422 to be distributed is formed.

바람직하게, 고정편(421)들은 서로 마주되는 끝단의 간격이 습도센서(430)의 길이보다 짧게 형성되는 것을 특징으로 한다. Preferably, the fixed pieces 421 are characterized in that the distance between the ends facing each other is formed shorter than the length of the humidity sensor 430.

바람직하게, 공기유통홀(422)들은 고정편(421)들의 사이에 연통되는 것을 특징으로 한다. Preferably, the air flow holes 422 are characterized in that communication between the fixing pieces 421.

바람직하게, 수납부재감지부재(500)는 스테이지부재(200)에 구비되어 웨이퍼수납부재(100)를 감지하면 감지신호를 발신하는 포토센서로 구성되고, 공정가스제어부재(600)는 습도감지부재(400)에서 감지되는 감지습도를 확인하는 습도확인부(610)와, 감지습도에 비교되기 위한 기준습도를 설정하는 기준습도설정부(620)와, 감지습도를 기준습도에 비교하여 감지습도가 기준습도에 일치하는지 판단하는 습도판단부(630)와, 수납부재감지부재(500)에서 웨이퍼수납부재(100)를 감지함에 따라 발신되는 감지신호를 인식하는 감지인식부(640)와, 감지인식부(640)에서 수납부재감지부재(500)의 감지신호를 인식하면 공정가스공급부재(300)가 작동되도록 제어하고, 감지인식부(640)에서 수납부재감지부재(500)의 감지신호를 인식하지 않으면 공정가스공급부재(300)가 정지되도록 제어하며, 습도판단부(630)에서 감지습도가 기준습도에 일치하는 것으로 판단하면 공정가스공급부재(300)가 작동되는 상태를 유지하고, 습도판단부(630)에서 감지습도가 기준습도에 일치하지 않는 것으로 판단하면 공정가스공급부재(300)가 정지되도록 제어하는 제어부(650)를 포함하는 것을 특징으로 한다. Preferably, the storage member sensing member 500 is provided in the stage member 200 and is composed of a photosensor that transmits a detection signal when it detects the wafer storage member 100, and the process gas control member 600 is a humidity sensing member. A humidity check unit 610 that checks the sensed humidity sensed at 400, a reference humidity setting unit 620 that sets a reference humidity to be compared to the sensed humidity, and the sensed humidity is compared with the reference humidity. A humidity determination unit 630 that determines whether it matches the reference humidity, a sensing recognition unit 640 that recognizes a sensing signal transmitted as the storage member sensing member 500 detects the wafer storage member 100, and sensing recognition When the unit 640 recognizes the detection signal of the storage member detection member 500, the process gas supply member 300 is controlled to operate, and the detection and recognition unit 640 recognizes the detection signal of the storage member detection member 500 Otherwise, the process gas supply member 300 is controlled to stop, and if the humidity determination unit 630 determines that the detected humidity matches the reference humidity, the process gas supply member 300 maintains an operating state, and determines the humidity. It characterized in that it comprises a control unit 650 for controlling the process gas supply member 300 to stop when it is determined that the detected humidity does not match the reference humidity.

바람직하게, 공정가스제어부재(600)는 시간을 제공하는 전자시계(660)와, 감지인식부(640)에서 감지신호가 인식되고 다음 감지신호가 인식될 때마다 전자시계(660)를 통해 시간을 확인하고, 확인된 시간들을 근거로 시간주기를 산출하는 시간주기산출부(670)와, 산출된 시간주기들의 평균주기를 산출하는 평균주기산출부(680)와, 산출된 평균주기보다 짧은 작동주기를 설정하여 제어부(650)에 제공하는 작동주기설정부(690)를 포함하고, 제어부(650)는 감지인식부(640)에서 감지신호가 인식될 때마다 산출된 작동주기를 근거로 공정가스공급부재(300)를 작동시키도록 설정되는 것을 특징으로 한다. Preferably, the process gas control member 600 includes an electronic clock 660 that provides time, and the time through the electronic clock 660 whenever a detection signal is recognized by the detection and recognition unit 640 and the next detection signal is recognized. A time period calculation unit 670 that checks and calculates a time period based on the identified times, an average period calculation unit 680 that calculates the average period of the calculated time periods, and an operation shorter than the calculated average period Includes an operation cycle setting unit 690 that sets a cycle and provides it to the control unit 650, and the control unit 650 supplies process gas based on the calculated operation cycle each time a detection signal is recognized by the detection and recognition unit 640 It is characterized in that it is set to operate the member 300.

바람직하게, 본 발명은 공정가스공급부재(300)의 가스공급노즐부(310)에 공정가스를 공급하는 가스공급라인(L1)이 연결되고, 공정가스공급부재(300)의 가스배출부(320)에 공정가스가 배출되는 가스배출라인(L2)이 연결되며, 가스배출라인(L2)을 개폐하는 배출밸브(B1)가 가스배출라인(L2)에 구비되고, 가스공급라인(L1) 및 가스배출라인(L2)의 사이에 공정가스가 관류되는 가스연결라인(L3)이 연결되되, 가스연결라인(L3)의 일단이 가스공급라인(L1)에 연결되고 가스연결라인(L3)의 타단이 가스배출부(320) 및 배출밸브(B1)의 사이에서 가스배출라인(L2)에 연결되며, 가스연결라인(L3)을 개폐하는 연결밸브(B2)가 가스연결라인(L3)에 구비되고, 공정가스제어부재(600)는 배출밸브(B1)를 개방하면서 연결밸브(B2)를 폐쇄하거나 배출밸브(B1)를 폐쇄하면서 연결밸브(B2)를 개방하는 밸브조작부(601)를 포함하는 것을 특징으로 한다. Preferably, in the present invention, a gas supply line (L1) for supplying a process gas to the gas supply nozzle unit 310 of the process gas supply member 300 is connected, and the gas discharge unit 320 of the process gas supply member 300 ), a gas discharge line (L2) from which the process gas is discharged is connected, a discharge valve (B1) for opening and closing the gas discharge line (L2) is provided in the gas discharge line (L2), and the gas supply line (L1) and the gas A gas connection line (L3) through which process gas flows is connected between the discharge lines (L2), and one end of the gas connection line (L3) is connected to the gas supply line (L1) and the other end of the gas connection line (L3) is connected. A connection valve (B2) for opening and closing the gas connection line (L3) is connected to the gas discharge line (L2) between the gas discharge unit (320) and the discharge valve (B1) is provided in the gas connection line (L3), The process gas control member 600 is characterized in that it includes a valve operation unit 601 that closes the connection valve B2 while opening the discharge valve B1 or opens the connection valve B2 while closing the discharge valve B1. To do.

본 발명은, 웨이퍼가 수납되는 퍼프의 내부공간에 함유된 습도를 센싱하여 퍼프의 내부공간에 공정가스를 주입하여 습기를 제거할 수 있어서, 퍼프의 내부공간에 수납된 웨이퍼가 산화되어 손상됨을 방지할 수 있다. The present invention senses the humidity contained in the inner space of the puff in which the wafer is stored, and injects process gas into the inner space of the puff to remove moisture, thereby preventing the wafer stored in the puff from being oxidized and damaged. can do.

그리고 퍼프에서 배출되는 공기에서 습도를 감지하므로 퍼프의 내부에 습도센서를 설치하기 위해 퍼프의 구조를 변형하지 않아도 되는 이점이 있고, 퍼프에서 습도를 포함하는 공기가 완전히 배출됨을 정확하게 확인할 수 있다. In addition, since humidity is sensed in the air discharged from the puff, there is an advantage of not having to change the structure of the puff to install a humidity sensor inside the puff, and it can be accurately confirmed that air including humidity is completely discharged from the puff.

도 1은 본 발명의 일실시예에 따른 습도감지를 이용한 퍼프용 공정가스 공급장치를 보인 도면.
도 2는 본 발명의 스테이지부재에서 웨이퍼수납부재가 분리된 상태를 보인 분해 사시도.
도 3은 본 발명의 공정가스공급부재에 적용되는 가스공급노즐부를 보인 분해 사시도.
도 4는 본 발명의 웨이퍼수납부재의 가스유통구가 공정가스공급부재의 가스공급노즐부에서 분리된 상태를 보인 부분 단면도.
도 5는 본 발명의 웨이퍼수납부재의 가스유통구가 공정가스공급부재의 가스공급노즐부에 결합된 상태를 보인 부분 단면도.
도 6은 본 발명의 공정가스공급부재의 가스배출부 및 습도감지부재를 보인 분해 사시도.
도 7은 본 발명의 습도감지부재에 적용되는 회로기판을 보인 도면.
도 8은 본 발명에 추가로 적용되어 공정가스가 관류되는 라인 및 라인을 개방하거나 차단하는 밸브를 보인 도면.
도 9는 본 발명의 공정가스제어부재를 개략적으로 보인 블록도. 1 is a view showing a process gas supply device for puff using humidity sensing according to an embodiment of the present invention.
Figure 2 is an exploded perspective view showing a state in which the wafer storage member is separated from the stage member of the present invention.
Figure 3 is an exploded perspective view showing a gas supply nozzle applied to the process gas supply member of the present invention.
4 is a partial cross-sectional view showing a state where the gas flow port of the wafer storage member of the present invention is separated from the gas supply nozzle portion of the process gas supply member.
Figure 5 is a partial cross-sectional view showing a state in which the gas flow port of the wafer storage member of the present invention is coupled to the gas supply nozzle of the process gas supply member.
Figure 6 is an exploded perspective view showing a gas discharge unit and a humidity sensing member of the process gas supply member of the present invention.
7 is a view showing a circuit board applied to the humidity sensing member of the present invention.
FIG. 8 is a view showing a line through which process gas flows and a valve that opens or blocks a line applied in addition to the present invention.
9 is a block diagram schematically showing a process gas control member of the present invention.

이하, 첨부된 도면을 참조하여 본 발명의 일실시예에 따른 습도감지를 이용한 퍼프용 공정가스 공급장치를 자세히 설명한다. Hereinafter, a process gas supply device for puff using humidity sensing according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1 내지 도 9에 도시된 바와 같이, 본 발명의 습도감지를 이용한 퍼프용 공정가스 공급장치는, 외부로부터 공급되는 공정가스가 웨이퍼가 수납되는 내부공간의 일측으로 유입된 후에 내부공간의 타측으로 배출되는 웨이퍼수납부재(100)와, 웨이퍼수납부재(100)가 안착되는 스테이지부재(200)와, 스테이지부재(200)에 안착된 웨이퍼수납부재(100)에 공정가스를 공급하고 웨이퍼수납부재(100)에 공급된 공정가스 및 공기의 배출을 안내하는 공정가스공급부재(300)와, 웨이퍼수납부재(100)에서 배출되는 공기에서 습도를 감지하는 습도감지부재(400)와, 스테이지부재(200)에 안착되는 웨이퍼수납부재(100)를 감지하는 수납부재감지부재(500)와, 수납부재감지부재(500)의 감지에 따라 공정가스공급부재(300)를 작동시키고 습도감지부재(400)에서 감지되는 습도에 따라 공정가스공급부재(300)의 작동을 유지하거나 정지시키는 공정가스제어부재(600)를 포함한다. As shown in Figures 1 to 9, the process gas supply device for puff using humidity detection of the present invention, after the process gas supplied from the outside flows into one side of the inner space in which the wafer is accommodated, to the other side of the inner space. Process gas is supplied to the discharged wafer storage member 100, the stage member 200 on which the wafer storage member 100 is mounted, and the wafer storage member 100 mounted on the stage member 200, and the wafer storage member ( A process gas supply member 300 for guiding the discharge of the process gas and air supplied to 100, a humidity sensing member 400 for sensing humidity in the air discharged from the wafer storage member 100, and a stage member 200 ) And operates the process gas supply member 300 according to the detection of the storage member sensing member 500 and the storage member sensing member 500 to detect the wafer storage member 100, and the humidity sensing member 400 It includes a process gas control member 600 for maintaining or stopping the operation of the process gas supply member 300 according to the sensed humidity.

웨이퍼수납부재(100)는 내부공간에 웨이퍼들이 적층되어서 수납되는 퍼프(FOUP)로 구성될 수 있다. 이러한 웨이퍼수납부재(100)는 하부에서 양측에 가스유통구(110)가 형성된다. 일측의 가스유통구(110)를 통해 공정가스가 주입되고 타측의 가스유통구(110)를 통해 공정가스가 배출된다. The wafer storage member 100 may be composed of a puff in which wafers are stacked and received in an internal space. Gas distribution ports 110 are formed on both sides of the wafer storage member 100 from the bottom. The process gas is injected through the gas distribution port 110 on one side, and the process gas is discharged through the gas distribution port 110 on the other side.

가스유통구(110)는 웨이퍼수납부재(100)의 하부에 오목하게 형성되는 홈(111)과 홈(111)에 형성되어 공정가스 및 공기가 유통되는 홀(112)을 포함한다. The gas flow port 110 includes a groove 111 formed concave below the wafer storage member 100 and a hole 112 formed in the groove 111 through which process gas and air flow.

이러한, 홈(111)은 평탄하게 형성된다. Such, the groove 111 is formed flat.

그리고 웨이퍼수납부재(100)는 대략 직육면체로 형성되면서 다수의 웨이퍼가 다단으로 적층되어서 수납(CHARGE)되도록 내부공간에서 양측에 걸림턱들이 다단으로 형성된다. 또한 도어(미도시)가 설치되어 내부공간이 개폐될 수 있다. In addition, while the wafer storage member 100 is formed in a substantially rectangular parallelepiped shape, a plurality of wafers are stacked in multiple stages, and locking protrusions are formed in multiple stages on both sides of the inner space so as to be CHARGE. In addition, a door (not shown) may be installed to open and close the inner space.

아울러 웨이퍼수납부재(100)는 이송로봇(미도시)에 의해 각각의 공정으로 이송될 수 있다. In addition, the wafer storage member 100 may be transferred in each process by a transfer robot (not shown).

스테이지부재(200)는 웨이퍼수납부재(100)가 안착되는 상판과, 상판의 양측에 형성되어 지면에 지지되는 외측판을 포함한다. The stage member 200 includes an upper plate on which the wafer storage member 100 is mounted, and an outer plate formed on both sides of the upper plate and supported on the ground.

이러한 스테이지부재(200)는 상판에서 양측에 웨이퍼수납부재(100)의 가스유통구(110)에 대응되는 연결홀이 형성된다. The stage member 200 has connection holes corresponding to the gas flow ports 110 of the wafer storage member 100 on both sides of the upper plate.

공정가스공급부재(300)는 스테이지부재(200)의 일측에 구비되어 웨이퍼수납부재(100)의 일측에 연통된 상태로 공정가스를 분사하는 가스공급노즐부(310)와, 스테이지부재(200)의 타측에 구비되어 웨이퍼수납부재(100)의 일측에 연통된 상태로 공정가스를 배출하는 가스배출부(320)와, 외부로부터 공급되는 공정가스를 가스공급노즐(310)로 공급하는 공정가스공급부(330)를 포함한다. The process gas supply member 300 is provided on one side of the stage member 200 and is in communication with one side of the wafer storage member 100 and injects the process gas into a gas supply nozzle part 310, and the stage member 200 A gas discharge unit 320 provided at the other side of the wafer storage member 100 to discharge process gas and a process gas supply unit supplying process gas supplied from the outside to the gas supply nozzle 310 Includes 330.

가스공급노즐부(310)는 웨이퍼수납부재(100)의 스테이지부재(200)의 연결홀에 관통된 상태로 볼트에 의해 설치되는 것으로, 스테이지부재(200)에 관통되게 설치되는 노즐본체(311)와, 노즐본체(311)에 고정된 상태로 웨이퍼수납부재(100)에 밀착되어 공정가스의 유실을 방지하는 유입방지부(312)를 포함한다. The gas supply nozzle unit 310 is installed by a bolt while penetrating through the connection hole of the stage member 200 of the wafer storage member 100, and the nozzle body 311 installed to penetrate the stage member 200 And, an inflow prevention part 312 that is fixed to the nozzle body 311 and is in close contact with the wafer storage member 100 to prevent loss of process gas.

노즐본체(311)는 하단에 공정가스가 유입되는 유입구(313)가 형성되고, 상단에 공정가스가 분사되는 분사구(314)가 형성되며, 공정가스의 압력이 증대되어서 분사구(314)로 공급되도록 유입구(313)에서 분사구(314)를 향해 점점 좁혀지게 가스통로(315)가 형성되며, 상부에서 외측에 걸림턱(316)이 형성된다. The nozzle body 311 has an inlet 313 through which the process gas is introduced at the lower end, and the injection port 314 through which the process gas is injected is formed at the upper end, and the pressure of the process gas is increased so that it is supplied to the injection port 314. The gas passage 315 is formed to be gradually narrowed from the inlet 313 toward the injection port 314, and a locking protrusion 316 is formed on the outside from the top.

그리고 노즐본체(311)는 외향플랜지가 형성되어 스테이지부재(200)에 볼트로 고정된다. Further, the nozzle body 311 is formed with an outward flange and is fixed to the stage member 200 with bolts.

유입구(313)는 공정가스를 공급하는 공정가스공급부(330)에 연결된 파이프가 나사결합 되도록 내주면에 암나사가 형성된다. The inlet 313 has a female thread formed on the inner circumferential surface so that the pipe connected to the process gas supply unit 330 supplying the process gas is screwed.

가스통로(315)는 깔때기형태로 형성되어 공정가스가 압축되므로 분사구(314)를 통해 고압으로 분사될 수 있다. 분사구(314)를 통해 분사되는 공정가스가 웨이퍼수납부재(100)의 내부공간으로 공급될 수 있다. Since the gas passage 315 is formed in a funnel shape to compress the process gas, it can be injected at high pressure through the injection port 314. The process gas injected through the injection hole 314 may be supplied to the inner space of the wafer storage member 100.

유입방지부(312)는 캡형태로 형성되고, 상부에 분사구(314)에 연통되는 연통홀(317)이 형성되며, 하부에 노즐본체(311)의 걸림턱(316)에 걸려서 고정되는 내향플랜지(318)가 형성된다. The inflow prevention part 312 is formed in a cap shape, a communication hole 317 communicating with the injection hole 314 is formed in the upper part, and an inward flange fixed by being caught by the locking projection 316 of the nozzle body 311 at the lower part 318 is formed.

이러한 유입방지부(312)는 상부에 평탄면이 형성되어 가스유통구(110)의 홈(111)에 삽입되면 홈(111)의 평탄면에 밀착되므로 가스유실을 방지하기 위한 밀착면이 증대될 수 있다. When the inflow prevention part 312 has a flat surface formed on the top and is inserted into the groove 111 of the gas flow port 110, it is in close contact with the flat surface of the groove 111, so that the contact surface for preventing gas loss is increased. I can.

가스배출부(320)는 스테이지부재(200)에 관통되게 설치되는 배출본체(321)와, 노즐본체(321)에 고정된 상태로 웨이퍼수납부재(100)에 밀착되어 공정가스의 유실을 방지하는 배출방지부(322)를 포함한다. The gas discharge unit 320 is in close contact with the discharge body 321 installed to penetrate the stage member 200 and the wafer storage member 100 while being fixed to the nozzle body 321 to prevent loss of process gas. It includes a discharge prevention part 322.

배출본체(321)는 웨이퍼수납부재(100)에서 배출되는 공정가스가 관류되도록 일단에서 타단까지 관통되고 테이지부재(200)에 볼트로 고정된다. 그리고 배출본체(321)는 호스나 파이프를 통해 습도감지부재(400)가 연결된다. 또한 배출본체(321)는 노즐본체(311)와 동일하게 형성될 수 있다. The discharge main body 321 penetrates from one end to the other end so that the process gas discharged from the wafer storage member 100 flows through, and is fixed to the tape member 200 with bolts. And the discharge body 321 is connected to the humidity sensing member 400 through a hose or pipe. In addition, the discharge body 321 may be formed in the same manner as the nozzle body 311.

배출방지부(322)는 배출본체(321)에 고정되도록 유입방지부(312)와 동일한 구조로 형성될 수 있다. The discharge prevention part 322 may be formed in the same structure as the inflow prevention part 312 so as to be fixed to the discharge body 321.

공정가스공급부(330)는 공정가스를 고압으로 공급하는 콤프레셔를 포함할 수 있다. 이러한 공정가스공급부(330)는 호스나 파이프를 통해 노즐본체(311)에 연결된다. The process gas supply unit 330 may include a compressor that supplies process gas at high pressure. The process gas supply unit 330 is connected to the nozzle body 311 through a hose or pipe.

따라서 공정가스공급부재(300)에 의해 공급되는 공정가스가 웨이퍼수납부재(100)의 내부공간으로 공급되므로 공정가스공급부재(300)를 통해 공기가 배출될 수 있다. 즉 웨이퍼수납부재(100)의 내부공간에 공정가스가 채워지면서 공기가 배출되므로 웨이퍼수납부재(100)의 내부공간에서 습도가 저하될 수 있다. Therefore, since the process gas supplied by the process gas supply member 300 is supplied to the inner space of the wafer storage member 100, air can be discharged through the process gas supply member 300. That is, since the process gas is filled in the inner space of the wafer storage member 100 and air is discharged, the humidity in the inner space of the wafer storage member 100 may decrease.

이와 같이 웨이퍼수납부재(100)의 내부공간에 공정가스가 채워지면 공기와 함께 산소(O2), 수분(H2O) 및 오존(O3)과 같은 분자성 오염물질들이 배출되는 것이다. As described above, when the process gas is filled in the inner space of the wafer storage member 100, molecular contaminants such as oxygen (O2), moisture (H2O), and ozone (O3) are discharged together with air.

습도감지부재(400)는 공정가스공급부재(300)에 의해 배출되는 공정가스가 관류되는 감지케이스(410)와, 감지케이스(410)에 설치되는 회로기판(420)과, 회로기판(420)에 구비된 상태로 공기에서 습도를 센싱하는 습도센서(430)와, 습도센서(430)에서 센싱되는 습도에 대한 아날로그수치를 디지털수치로 변환한 습도정보를 외부로 발신하는 습도정보발신부재(440)를 포함한다. The humidity sensing member 400 includes a sensing case 410 through which the process gas discharged from the process gas supply member 300 flows, a circuit board 420 installed in the sensing case 410, and a circuit board 420 A humidity sensor 430 that senses humidity in the air while provided in a humidity information transmitting member 440 that transmits humidity information obtained by converting an analog value for humidity sensed by the humidity sensor 430 into a digital value to the outside. ).

감지케이스(410)는 내부공간이 양단으로 개방되고 일단이 가스배출부(320)에 연결된다. 가스배출부(320)를 통해 배출되는 공기가 감지케이스(410)의 내부공간을 관류한 후에 외부로 배출된다. The sensing case 410 has an inner space open to both ends and one end is connected to the gas discharge unit 320. The air discharged through the gas discharge unit 320 is discharged to the outside after passing through the inner space of the sensing case 410.

이러한 감지케이스(410)는 호스나 배관(파이프) 등을 통해 가스배출부(320)에 연결되므로, 웨이퍼수납부재(100)의 내부공간에 수용된 공기에서 습도를 센싱하기 위해 웨이퍼수납부재(100)의 구조를 변형하지 않아도 되는 이점이 있다. Since the sensing case 410 is connected to the gas discharge unit 320 through a hose or pipe (pipe), the wafer storage member 100 is used to sense humidity in the air contained in the inner space of the wafer storage member 100. There is an advantage of not having to change the structure of.

회로기판(420)은 감지케이스(410)의 내부공간에 설치되고, 내측에서 서로 마주되면서 이격되어 습도센서(430)의 양측이 고정되는 고정편(421)이 형성되고, 고정편(421)들의 양측에 공기가 유통되는 공기유통홀(422)이 형성된다. The circuit board 420 is installed in the inner space of the sensing case 410, is spaced apart from each other while facing each other from the inside to form a fixing piece 421 to which both sides of the humidity sensor 430 are fixed, and the fixing pieces 421 Air circulation holes 422 through which air is circulated are formed on both sides.

여기서 회로기판(420)이 대략 원판형태로 형성되어 감지케이스(410)의 내부공간을 가로지르게 설치되므로 감지케이스(410)의 내부공간에서 관류되는 공기가 공기유통홀(422)을 통해서만 이동될 수 있다. Here, since the circuit board 420 is formed in an approximately disk shape and installed across the inner space of the sensing case 410, the air flowing through the inner space of the sensing case 410 can only be moved through the air distribution hole 422. have.

고정편(421)들은 서로 마주되는 끝단의 간격이 습도센서(430)의 길이보다 짧게 형성된다. 따라서, 습도센서(430)의 양단이 고정편(421)들에 고정되면 습도센서(430)의 하부가 고정편(421)들의 사이에 위치된다. The fixed pieces 421 are formed in which the distance between the ends facing each other is shorter than the length of the humidity sensor 430. Accordingly, when both ends of the humidity sensor 430 are fixed to the fixing pieces 421, the lower portion of the humidity sensor 430 is located between the fixing pieces 421.

공기유통홀(422)들은 고정편(421)들의 사이에 연통되게 형성되므로 공기가 습도센서(430)에 접촉된 후에 습도센서(430)의 양측을 통해 이동되어서 배출된다. Since the air distribution holes 422 are formed to be in communication between the fixing pieces 421, the air is moved through both sides of the humidity sensor 430 after contacting the humidity sensor 430 and discharged.

따라서, 공기가 고정편(421)들의 사이로 노출되는 습도센서(430)의 중간부분에 접촉된 후에, 습도센서(430)의 양측으로 이동되어서 공기유통홀(422)들을 통과하므로, 습도센서(430)가 이동되는 공기 중에서 습도를 정확하게 측정할 수 있다. Therefore, after the air comes into contact with the middle portion of the humidity sensor 430 exposed between the fixing pieces 421, it is moved to both sides of the humidity sensor 430 and passes through the air distribution holes 422, so that the humidity sensor 430 ) Can accurately measure the humidity in the moving air.

그리고, 회로기판(420)에는 전원선 및 통신선이 연결될 수 있는 연결잭(423)이 구비될 수 있다. 연결잭(423)에 연결되는 전원선의 전원에 의해 습도센서(430) 및 습도정보발신부재(440)가 작동될 수 있고, 통신선을 통해 도센서(430) 및 습도정보발신부재(440)를 제어하는 제어신호 및 습도정보가 송수신될 수 있다. In addition, the circuit board 420 may be provided with a connection jack 423 through which a power line and a communication line can be connected. The humidity sensor 430 and the humidity information transmitting member 440 can be operated by the power of the power line connected to the connection jack 423, and control the degree sensor 430 and the humidity information transmitting member 440 through a communication line. Control signals and humidity information can be transmitted and received.

습도센서(430)는 고정편(421)들에 양단이 고정되므로 고정편(421)들의 사이를 통해 하부가 노출될 수 있다. 즉, 습도센서(430)는 하부에 접촉되는 공기에서 습도를 센싱한다. Since both ends of the humidity sensor 430 are fixed to the fixing pieces 421, the lower part may be exposed through the fixing pieces 421. That is, the humidity sensor 430 senses humidity in the air contacting the lower part.

습도정보발신부재(440)는 회로기판(420)에 탑재되는 전자부품들을 제어하는 CPU로 구성될 수 있고, 회로기판(420)의 연결잭(423)에 연결되는 신호선을 통해 습도정보를 전송할 수 있다. The humidity information transmitting member 440 may be configured as a CPU that controls electronic components mounted on the circuit board 420, and may transmit humidity information through a signal line connected to the connection jack 423 of the circuit board 420. .

수납부재감지부재(500)는 스테이지부재(200)에 구비되어 웨이퍼수납부재(100)를 감지하면 감지신호를 발신하는 포토센서로 구성된다. The storage member sensing member 500 is provided in the stage member 200 and is composed of a photosensor that transmits a detection signal when the wafer storage member 100 is sensed.

공정가스제어부재(600)는 습도감지부재(400)에서 감지되는 감지습도를 확인하는 습도확인부(610)와, 감지습도에 비교되기 위한 기준습도를 설정하는 기준습도설정부(620)와, 감지습도를 기준습도에 비교하여 감지습도가 기준습도에 일치하는지 판단하는 습도판단부(630)와, 수납부재감지부재(500)에서 웨이퍼수납부재(100)를 감지함에 따라 발신되는 감지신호를 인식하는 감지인식부(640)와, 감지인식부(640)에서 수납부재감지부재(500)의 감지신호를 인식하면 공정가스공급부재(300)가 작동되도록 제어하고, 감지인식부(640)에서 수납부재감지부재(500)의 감지신호를 인식하지 않으면 공정가스공급부재(300)가 정지되도록 제어하며, 습도판단부(630)에서 감지습도가 기준습도에 일치하는 것으로 판단하면 공정가스공급부재(300)가 작동되는 상태를 유지하고, 습도판단부(630)에서 감지습도가 기준습도에 일치하지 않는 것으로 판단하면 공정가스공급부재(300)가 정지되도록 제어하는 제어부(650)를 포함한다. The process gas control member 600 includes a humidity checking unit 610 for checking the detected humidity detected by the humidity sensing member 400, a reference humidity setting unit 620 for setting a reference humidity for comparison with the detected humidity, A humidity determination unit 630 that compares the sensed humidity with the reference humidity to determine whether the sensed humidity matches the reference humidity, and the receiving member detecting member 500 recognizes a detection signal transmitted as the wafer storage member 100 is detected. When the detection and recognition unit 640 and the detection and recognition unit 640 recognizes the detection signal of the storage member detection member 500, the process gas supply member 300 is controlled to be operated, and received in the detection and recognition unit 640 If the detection signal of the member detecting member 500 is not recognized, the process gas supply member 300 is controlled to stop, and if the humidity determination unit 630 determines that the detected humidity matches the reference humidity, the process gas supply member 300 ) Maintains the operating state, and includes a control unit 650 for controlling the process gas supply member 300 to stop when the humidity determination unit 630 determines that the detected humidity does not match the reference humidity.

여기서 기준습도는 30~40%의 습도로 설정할 수 있다. Here, the standard humidity can be set to a humidity of 30 to 40%.

따라서 습도판단부(630)에서 감지습도가 10~20% 일 때 기준습도보다 낮아 기준습도에 일치하지 않는 경우, 웨이퍼수납부재(100)의 내부공간에 공정가스가 미리 주입되어 있어서 공기가 적은 것으로 판단하여 공정가스를 주입하지 않는다. 또한 습도판단부(630)에서 감지습도가 60~80% 일 때 기준습도보다 높아서 기준습도에 일치하지 않는 경우, 웨이퍼수납부재(100)의 내부공간에 웨이퍼가 수납되지 않는 것으로 판단하여 공정가스를 주입하지 않는다. Therefore, when the humidity detection unit 630 detects that the humidity is 10 to 20%, it is less than the reference humidity and does not match the reference humidity, the process gas is pre-injected into the inner space of the wafer storage member 100 and thus the air is small. Judging, do not inject process gas. In addition, when the humidity detection unit 630 does not match the reference humidity because it is higher than the reference humidity when the detected humidity is 60 to 80%, it is determined that the wafer is not accommodated in the internal space of the wafer storage member 100 and the process gas is Do not inject

이와 같이 공정가스제어부재(600)는 웨이퍼수납부재(100)가 스테이지부재(200)에 안착된 상태를 확인하 후에 습도감지를 근거로 공정가스를 정확하게 주입하므로 공정가스가 낭비됨을 예방하여 절약할 수 있다. In this way, the process gas control member 600 accurately injects the process gas based on humidity detection after checking the state in which the wafer storage member 100 is seated on the stage member 200, thereby preventing waste of process gas and saving. I can.

또한 공정가스제어부재(600)는 시간을 제공하는 전자시계(660)와, 감지인식부(640)에서 감지신호가 인식되고 다음 감지신호가 인식될 때마다 전자시계(660)를 통해 시간을 확인하고, 확인된 시간들을 근거로 시간주기를 산출하는 시간주기산출부(670)와, 산출된 시간주기들의 평균주기를 산출하는 평균주기산출부(680)와, 산출된 평균주기보다 짧은 작동주기를 설정하여 제어부(650)에 제공하는 작동주기설정부(690)를 포함한다. In addition, the process gas control member 600 checks the time through the electronic clock 660 that provides time and the electronic clock 660 whenever the detection signal is recognized by the detection and recognition unit 640 and the next detection signal is recognized. And, a time period calculation unit 670 that calculates a time period based on the identified times, an average period calculation unit 680 that calculates the average period of the calculated time periods, and an operation period shorter than the calculated average period. It includes an operation period setting unit 690 that is set and provided to the control unit 650.

제어부(650)는 감지인식부(640)에서 감지신호가 인식될 때마다 산출된 작동주기를 근거로 공정가스공급부재(300)를 작동시키도록 설정될 수 있다. The control unit 650 may be set to operate the process gas supply member 300 based on the calculated operation period each time a detection signal is recognized by the detection and recognition unit 640.

그리고 제어부(650)는 공정가스공급부재(300)를 3~5초 동안 1초 작동시키고 1초 정지시키도록 설정될 수 있다. 여기서 시간은 3~5초보다 적거나 많게 설정될 수 있다. In addition, the control unit 650 may be set to operate the process gas supply member 300 for 1 second for 3 to 5 seconds and stop for 1 second. Here, the time may be set less or more than 3 to 5 seconds.

따라서 감지인식부(640)에서 감지신호가 인식되면 제어부(650)는 공정가스공급부재(300)를 작동시켜서 웨이퍼수납부재(100)의 내부공간으로 공정가스를 공급한다. 이어서 이송로봇에 의해 웨이퍼수납부재(100)가 다음공정으로 이송된 후에 다음 웨이퍼수납부재(100)가 이송되어 오기 전에 제어부(650)가 공정가스공급부재(300)를 제어하여 대략 몇 초 동안 공정가스를 분사시킬 수 있다. Accordingly, when the detection signal is recognized by the detection and recognition unit 640, the control unit 650 operates the process gas supply member 300 to supply the process gas to the inner space of the wafer storage member 100. Subsequently, after the wafer storage member 100 is transferred to the next process by the transfer robot, the control unit 650 controls the process gas supply member 300 before the next wafer storage member 100 is transferred to process the process for about several seconds. Gas can be injected.

이에 의해 공정가스공급부재(300)의 가스공급노즐부(310)를 통해 공정가스가 분사되면서 가스공급노즐부(310)의 분사구(314)가 청소되므로, 분사구(314)에 외부의 이물질이 침투됨이 방지될 수 있다. As a result, as the process gas is injected through the gas supply nozzle part 310 of the process gas supply member 300, the injection hole 314 of the gas supply nozzle part 310 is cleaned, so that external foreign substances penetrate into the injection hole 314. Can be prevented.

한편, 공정가스제어부재(600)는 시간을 제공하는 전자시계(660)와, 습도확인부(610)에서 확인되는 감지습도를 저장하여 관리하는 습도관리부(602)와, 습도확인부(610)에서 감지습도가 확인될 때마다 전자시계(660)를 통해 시간을 확인하는 시간확인부(603)와, 제어부(650)에 의해 공정가스공급부재(300)가 작동되거나 정지된 이력을 확인하여 저장 및 관리하는 이력관리부(604)와, 습도관리부(602)에서 관리되는 감지습도와 시간확인부(603)에서 확인되는 시간과 이력관리부(604)에서 관리되는 이력을 정보화하여 외부로 전송하는 정보전송부(605)를 포함한다. Meanwhile, the process gas control member 600 includes an electronic clock 660 that provides time, a humidity management unit 602 that stores and manages the humidity detected by the humidity check unit 610, and a humidity check unit 610. Whenever the detected humidity is checked, the time check unit 603 that checks the time through the electronic clock 660 and the control unit 650 checks and stores the history of the operation or stop of the process gas supply member 300 And the management history management unit 604, the detected humidity managed by the humidity management unit 602 and the time checked by the time check unit 603 and the information managed by the history management unit 604 and transmitted to the outside. Includes part 605.

정보전송부(605)는 정보를 유선이나 무선으로 외부의 관리센터에서 관리되는 서버에 실시간으로 전송될 수 있으므로, 서버를 관리하는 작업자가 서버를 통해 실시간으로 수신되는 정보를 확인할 수 있다. The information transmission unit 605 may transmit information in real time to a server managed by an external management center by wire or wirelessly, so that a worker who manages the server can check the information received through the server in real time.

이와 같이 외부의 관리센터에서 실시간으로 정보를 확인하므로 이상발생시 이에 대해 즉시 대처할 수 있다. In this way, the external management center checks the information in real time, so when an abnormality occurs, it is possible to respond immediately.

또한 본 발명에서 공정가스공급부재(300)의 가스공급노즐부(310)에 공정가스를 공급하는 가스공급라인(L1)이 연결되고, 공정가스공급부재(300)의 가스배출부(320)에 공정가스가 배출되는 가스배출라인(L2)이 연결되며, 가스배출라인(L2)을 개폐하는 배출밸브(B1)가 가스배출라인(L2)에 구비되고, 가스공급라인(L1) 및 가스배출라인(L2)의 사이에 공정가스가 관류되는 가스연결라인(L3)이 연결되되, 가스연결라인(L3)의 일단이 가스공급라인(L1)에 연결되고 가스연결라인(L3)의 타단이 가스배출부(320) 및 배출밸브(B1)의 사이에서 가스배출라인(L2)에 연결되며, 가스연결라인(L3)을 개폐하는 연결밸브(B2)가 가스연결라인(L3)에 구비된다. In addition, in the present invention, a gas supply line (L1) for supplying a process gas to the gas supply nozzle unit 310 of the process gas supply member 300 is connected, and the gas discharge unit 320 of the process gas supply member 300 A gas discharge line (L2) from which the process gas is discharged is connected, a discharge valve (B1) for opening and closing the gas discharge line (L2) is provided in the gas discharge line (L2), and a gas supply line (L1) and a gas discharge line A gas connection line (L3) through which process gas flows is connected between (L2), one end of the gas connection line (L3) is connected to the gas supply line (L1), and the other end of the gas connection line (L3) discharges gas. A connection valve B2 connected to the gas discharge line L2 between the unit 320 and the discharge valve B1 and for opening and closing the gas connection line L3 is provided in the gas connection line L3.

여기서 가스공급라인(L1), 가스배출라인(L2) 및 가스연결라인(L3)은 파이프나 호스로 구성될 수 있다. Here, the gas supply line (L1), the gas discharge line (L2) and the gas connection line (L3) may be composed of a pipe or a hose.

그리고 공정가스제어부재(600)는 배출밸브(B1)를 개방하면서 연결밸브(B2)를 폐쇄하거나 배출밸브(B1)를 폐쇄하면서 연결밸브(B2)를 개방하는 밸브조작부(601)를 포함한다. In addition, the process gas control member 600 includes a valve operation unit 601 that closes the connection valve B2 while opening the discharge valve B1 or opens the connection valve B2 while closing the discharge valve B1.

따라서 밸브조작부(601)에 의해 배출밸브(B1)가 개방되면서 연결밸브(B2)가 폐쇄되면, 가스공급노즐부(310)을 통해 공정가스가 공급되고 가스배출부(320)를 통해 공정가스가 배출된다. 즉 웨이퍼수납부재(100)에 공정가스를 공급할 수 있다. Therefore, when the discharge valve B1 is opened by the valve operation unit 601 and the connection valve B2 is closed, the process gas is supplied through the gas supply nozzle unit 310 and the process gas is supplied through the gas discharge unit 320. Is discharged. That is, the process gas can be supplied to the wafer storage member 100.

이와 달리 밸브조작부(601)에 의해 배출밸브(B1)가 폐쇄되면서 연결밸브(B2)가 개방되면, 가스공급노즐부(310) 및 가스배출부(320)를 통해 공정가스가 공급된다. 즉 웨이퍼수납부재(100)가 이송되어 오기 전에 공정가스를 분사하여서 가스공급노즐부(310) 및 가스배출부(320)를 청소할 수 있다. Unlike this, when the connection valve B2 is opened while the discharge valve B1 is closed by the valve operation unit 601, the process gas is supplied through the gas supply nozzle unit 310 and the gas discharge unit 320. That is, before the wafer storage member 100 is transferred, the gas supply nozzle unit 310 and the gas discharge unit 320 may be cleaned by spraying a process gas.

이와 같은, 본 발명은 웨이퍼가 수납되는 퍼프의 내부공간에 함유된 습도를 센싱하여 퍼프의 내부공간에 공정가스를 주입하여 습기를 제거할 수 있는 편리함이 있어서, 해당 분야에서 널리 사용될 수 있는 매우 유용한 발명이라 할 수 있다. As such, the present invention has the convenience of removing moisture by sensing the humidity contained in the inner space of the puff in which the wafer is accommodated, and injecting the process gas into the inner space of the puff, so it is very useful that can be widely used in the relevant field. It can be called an invention.

본 발명이 속하는 기술분야의 당업자는 본 발명이 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예는 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 하고, 본 발명의 범위는 상세한 설명보다는 후술하는 청구범위에 의하여 나타내어지며, 청구범위의 의의 및 범위 그리고 그 등가개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다. Those skilled in the art to which the present invention pertains will appreciate that the present invention can be implemented in other specific forms without changing the technical spirit or essential features thereof. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and the meaning and scope of the claims and their equivalent concepts All changes or modified forms derived from it should be interpreted as being included in the scope of the present invention.

100 : 웨이퍼수납부재 110 : 가스유통구
111 : 홈 112 : 홀
200 : 스테이지부재 300 : 공정가스공급부재
310 : 가스공급노즐부 311 : 노즐본체
312 : 유입방지부 313 : 유입구
314 : 분사구 315 : 가스통로
316 : 걸림턱 317 : 연통홀
318 : 내향플랜지 320 : 가스배출부
330 : 공정가스공급부 400 : 습도감지부재
410 : 감지케이스 420 : 회로기판
421 : 고정편 422 : 공기유통홀
423 : 연결잭 430 : 습도센서
440 : 습도정보발신부재 500 : 수납부재감지부재
600 : 공정가스제어부재 610 : 습도확인부
620 : 기준습도설정부 630 : 습도판단부
640 : 감지인식부 650 : 제어부
660 : 전자시계 670 : 시간주기산출부
680 : 평균주기산출부 690 : 작동주기설정부
601 : 밸브조작부 602 : 습도관리부
603 : 시간확인부 604 : 이력관리부
605 : 정보전송부 L1 : 가스공급라인
L2 : 가스배출라인 L3 : 가스연결라인
B1 : 배출밸브 B2 : 연결밸브100: wafer storage member 110: gas flow port
111: groove 112: hall
200: stage member 300: process gas supply member
310: gas supply nozzle part 311: nozzle body
312: inflow prevention part 313: inlet
314: nozzle 315: gas passage
316: locking jaw 317: communication hole
318: inward flange 320: gas outlet
330: process gas supply unit 400: humidity sensing member
410: sensing case 420: circuit board
421: fixed piece 422: air circulation hole
423: connection jack 430: humidity sensor
440: humidity information transmitting member 500: storage member detecting member
600: process gas control member 610: humidity check unit
620: standard humidity setting unit 630: humidity determination unit
640: detection and recognition unit 650: control unit
660: electronic watch 670: time period calculation unit
680: average cycle calculation unit 690: operation cycle setting unit
601: valve operation unit 602: humidity management unit
603: time check unit 604: history management unit
605: information transmission unit L1: gas supply line
L2: gas discharge line L3: gas connection line
B1: discharge valve B2: connection valve

Claims (11)

외부로부터 공급되는 공정가스가 웨이퍼가 수납되는 내부공간의 일측으로 유입된 후에 내부공간의 타측으로 배출되는 웨이퍼수납부재(100)와,
웨이퍼수납부재(100)가 안착되는 스테이지부재(200)와,
스테이지부재(200)에 안착된 웨이퍼수납부재(100)에 공정가스를 공급하고 웨이퍼수납부재(100)에 공급된 공정가스 및 공기의 배출을 안내하는 공정가스공급부재(300)와,
웨이퍼수납부재(100)에서 배출되는 공기에서 습도를 감지하는 습도감지부재(400)와,
스테이지부재(200)에 안착되는 웨이퍼수납부재(100)를 감지하는 수납부재감지부재(500)와,
수납부재감지부재(500)의 감지에 따라 공정가스공급부재(300)를 작동시키고 습도감지부재(400)에서 감지되는 습도에 따라 공정가스공급부재(300)의 작동을 유지하거나 정지시키는 공정가스제어부재(600)를 포함하며,
수납부재감지부재(500)는 스테이지부재(200)에 구비되어 웨이퍼수납부재(100)를 감지하면 감지신호를 발신하는 포토센서로 구성되고,
공정가스제어부재(600)는
습도감지부재(400)에서 감지되는 감지습도를 확인하는 습도확인부(610)와,
감지습도에 비교되기 위한 기준습도를 설정하는 기준습도설정부(620)와,
감지습도를 기준습도에 비교하여 감지습도가 기준습도에 일치하는지 판단하는 습도판단부(630)와,
수납부재감지부재(500)에서 웨이퍼수납부재(100)를 감지함에 따라 발신되는 감지신호를 인식하는 감지인식부(640)와,
감지인식부(640)에서 수납부재감지부재(500)의 감지신호를 인식하면 공정가스공급부재(300)가 작동되도록 제어하고, 감지인식부(640)에서 수납부재감지부재(500)의 감지신호를 인식하지 않으면 공정가스공급부재(300)가 정지되도록 제어하며, 습도판단부(630)에서 감지습도가 기준습도에 일치하는 것으로 판단하면 공정가스공급부재(300)가 작동되는 상태를 유지하고, 습도판단부(630)에서 감지습도가 기준습도에 일치하지 않는 것으로 판단하면 공정가스공급부재(300)가 정지되도록 제어하는 제어부(650)와,
시간을 제공하는 전자시계(660)와,
감지인식부(640)에서 감지신호가 인식되고 다음 감지신호가 인식될 때마다 전자시계(660)를 통해 시간을 확인하고, 확인된 시간들을 근거로 시간주기를 산출하는 시간주기산출부(670)와,
산출된 시간주기들의 평균주기를 산출하는 평균주기산출부(680)와,
산출된 평균주기보다 짧은 작동주기를 설정하여 제어부(650)에 제공하는 작동주기설정부(690)를 포함하고,
제어부(650)는 감지인식부(640)에서 감지신호가 인식될 때마다 산출된 작동주기를 근거로 공정가스공급부재(300)를 작동시키도록 설정되는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
A wafer storage member 100 that is discharged to the other side of the inner space after the process gas supplied from the outside flows into one side of the inner space where the wafer is stored,
A stage member 200 on which the wafer storage member 100 is mounted,
A process gas supply member 300 that supplies a process gas to the wafer storage member 100 seated on the stage member 200 and guides the discharge of the process gas and air supplied to the wafer storage member 100;
A humidity sensing member 400 for sensing humidity in the air discharged from the wafer storage member 100,
A storage member sensing member 500 for sensing the wafer storage member 100 seated on the stage member 200,
Process gas control that operates the process gas supply member 300 according to the detection of the storage member sensing member 500 and maintains or stops the operation of the process gas supply member 300 according to the humidity detected by the humidity sensing member 400 Including member 600,
The storage member sensing member 500 is provided in the stage member 200 and is composed of a photosensor that transmits a detection signal when it detects the wafer storage member 100,
The process gas control member 600 is
A humidity check unit 610 for checking the detected humidity detected by the humidity sensing member 400,
A reference humidity setting unit 620 that sets a reference humidity to be compared to the detected humidity,
A humidity determination unit 630 that compares the sensed humidity with the reference humidity and determines whether the sensed humidity matches the reference humidity,
A sensing recognition unit 640 for recognizing a sensing signal transmitted as the storage member sensing member 500 detects the wafer storage member 100,
When the detection and recognition unit 640 recognizes the detection signal of the storage member detection member 500, the process gas supply member 300 is controlled to be operated, and the detection signal of the storage member detection member 500 at the detection and recognition unit 640 If it is not recognized, the process gas supply member 300 is controlled to be stopped, and if the humidity determination unit 630 determines that the detected humidity matches the reference humidity, the process gas supply member 300 is maintained in an operating state, When the humidity determination unit 630 determines that the detected humidity does not match the reference humidity, the control unit 650 for controlling the process gas supply member 300 to be stopped, and
An electronic clock 660 that provides time,
A time period calculation unit 670 that checks the time through the electronic clock 660 whenever the detection signal is recognized by the detection and recognition unit 640 and the next detection signal is recognized, and calculates a time period based on the checked times. Wow,
An average period calculation unit 680 that calculates the average period of the calculated time periods,
It includes an operation period setting unit 690 that sets an operation period shorter than the calculated average period and provides it to the control unit 650,
The control unit 650 is a process for puff using humidity detection, characterized in that it is set to operate the process gas supply member 300 based on the calculated operation period each time a detection signal is recognized by the detection and recognition unit 640 Gas supply.
 청구항 1에 있어서, 공정가스공급부재(300)는
스테이지부재(200)의 일측에 구비되어 웨이퍼수납부재(100)의 일측에 연통된 상태로 공정가스를 분사하는 가스공급노즐부(310)와,
스테이지부재(200)의 타측에 구비되어 웨이퍼수납부재(100)의 일측에 연통된 상태로 공정가스를 배출하는 가스배출부(320)와,
외부로부터 공급되는 공정가스를 가스공급노즐(310)로 공급하는 공정가스공급부(330)를 포함하고,
가스공급노즐부(310)는
스테이지부재(200)에 관통되게 설치되는 노즐본체(311)와,
노즐본체(311)에 고정된 상태로 웨이퍼수납부재(100)에 밀착되어 공정가스의 유실을 방지하는 유입방지부(312)를 포함하는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
The method according to claim 1, the process gas supply member 300
A gas supply nozzle part 310 provided on one side of the stage member 200 to inject a process gas in a state in communication with one side of the wafer storage member 100,
A gas discharge unit 320 provided on the other side of the stage member 200 to discharge process gas in a state in communication with one side of the wafer storage member 100,
Including a process gas supply unit 330 for supplying the process gas supplied from the outside to the gas supply nozzle 310,
The gas supply nozzle part 310 is
A nozzle body 311 installed to pass through the stage member 200,
Process gas supply device for puff using humidity sensing, characterized in that it includes an inflow prevention unit 312 that is fixed to the nozzle body 311 and is in close contact with the wafer storage member 100 to prevent loss of process gas.
 청구항 2에 있어서, 노즐본체(311)는 하단에 공정가스가 유입되는 유입구(313)가 형성되고, 상단에 공정가스가 분사되는 분사구(314)가 형성되며, 공정가스의 압력이 증대되어서 분사구(314)로 공급되도록 유입구(313)에서 분사구(314)를 향해 점점 좁혀지게 가스통로(315)가 형성되는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
The method according to claim 2, wherein the nozzle body 311 is formed with an inlet 313 through which the process gas is introduced at the lower end, the injection port 314 through which the process gas is injected is formed at the upper end, and the pressure of the process gas is increased so that the injection port ( Process gas supply device for puff using humidity detection, characterized in that the gas passage 315 is formed to be gradually narrowed toward the injection port 314 from the inlet 313 so as to be supplied to the 314.
 청구항 3에 있어서,
노즐본체(311)는 상부에서 외측에 걸림턱(316)이 형성되고,
유입방지부(312)는 캡형태로 형성되고, 상부에 분사구(314)에 연통되는 연통홀(317)이 형성되며, 하부에 노즐본체(311)의 걸림턱(316)에 걸려서 고정되는 내향플랜지(318)가 형성되는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
The method of claim 3,
The nozzle body 311 has a locking projection 316 formed on the outside from the top,
The inflow prevention part 312 is formed in a cap shape, a communication hole 317 communicating with the injection hole 314 is formed at the top, and an inward flange fixed by being caught by the locking protrusion 316 of the nozzle body 311 at the bottom Process gas supply device for puff using humidity sensing, characterized in that (318) is formed.
 청구항 1에 있어서,
가스유통구(110)는 웨이퍼수납부재(100)의 하부에 오목하게 형성되는 홈(111)과 홈(111)에 형성되어 공정가스 및 공기가 유통되는 홀(112)을 포함하고,
홈(111)은 평탄하게 형성되며,
유입방지부(312)는 상부에 평탄면이 형성되는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
The method according to claim 1,
The gas flow port 110 includes a groove 111 formed concave below the wafer storage member 100 and a hole 112 formed in the groove 111 through which process gas and air flow,
The groove 111 is formed flat,
The inflow prevention unit 312 is a process gas supply device for puff using humidity sensing, characterized in that a flat surface is formed on the top.
 청구항 1에 있어서, 습도감지부재(400)는
공정가스공급부재(300)에 의해 배출되는 공정가스가 관류되는 감지케이스(410)와,
감지케이스(410)에 설치되는 회로기판(420)과,
회로기판(420)에 구비된 상태로 공기에서 습도를 센싱하는 습도센서(430)와,
습도센서(430)에서 센싱되는 습도에 대한 아날로그수치를 디지털수치로 변환한 습도정보를 외부로 발신하는 습도정보발신부재(440)를 포함하며,
회로기판(420)은
내측에서 서로 마주되면서 이격되어 습도센서(430)의 양측이 고정되는 고정편(421)이 형성되고,
고정편(421)들의 양측에 공기가 유통되는 공기유통홀(422)이 형성되는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
The method according to claim 1, the humidity sensing member 400
A sensing case 410 through which the process gas discharged by the process gas supply member 300 flows,
A circuit board 420 installed in the sensing case 410,
A humidity sensor 430 that senses humidity in the air while being provided on the circuit board 420,
It includes a humidity information transmitting member 440 that transmits the humidity information to the outside by converting the analog value of the humidity sensed by the humidity sensor 430 to a digital value,
The circuit board 420 is
Fixing pieces 421 to which both sides of the humidity sensor 430 are fixed while being spaced apart while facing each other from the inside are formed,
Process gas supply device for puff using humidity sensing, characterized in that air distribution holes 422 through which air is circulated are formed on both sides of the fixing pieces 421.
 청구항 6에 있어서,
고정편(421)들은 서로 마주되는 끝단의 간격이 습도센서(430)의 길이보다 짧게 형성되는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
The method of claim 6,
The fixing piece 421 is a process gas supply device for puff using humidity sensing, characterized in that the distance between the ends facing each other is formed shorter than the length of the humidity sensor (430).
 청구항 6에 있어서, 공기유통홀(422)들은 고정편(421)들의 사이에 연통되는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치.
The process gas supply device for puff using humidity sensing according to claim 6, wherein the air flow holes 422 communicate between the fixing pieces 421.
 삭제delete 삭제delete 청구항 1에 있어서,
공정가스공급부재(300)의 가스공급노즐부(310)에 공정가스를 공급하는 가스공급라인(L1)이 연결되고,
공정가스공급부재(300)의 가스배출부(320)에 공정가스가 배출되는 가스배출라인(L2)이 연결되며,
가스배출라인(L2)을 개폐하는 배출밸브(B1)가 가스배출라인(L2)에 구비되고,
가스공급라인(L1) 및 가스배출라인(L2)의 사이에 공정가스가 관류되는 가스연결라인(L3)이 연결되되, 가스연결라인(L3)의 일단이 가스공급라인(L1)에 연결되고 가스연결라인(L3)의 타단이 가스배출부(320) 및 배출밸브(B1)의 사이에서 가스배출라인(L2)에 연결되며,
가스연결라인(L3)을 개폐하는 연결밸브(B2)가 가스연결라인(L3)에 구비되고,
공정가스제어부재(600)는 배출밸브(B1)를 개방하면서 연결밸브(B2)를 폐쇄하거나 배출밸브(B1)를 폐쇄하면서 연결밸브(B2)를 개방하는 밸브조작부(601)를 포함하는 것을 특징으로 하는 습도감지를 이용한 퍼프용 공정가스 공급장치. The method according to claim 1,
A gas supply line (L1) for supplying the process gas to the gas supply nozzle unit 310 of the process gas supply member 300 is connected,
A gas discharge line (L2) through which the process gas is discharged is connected to the gas discharge unit 320 of the process gas supply member 300,
A discharge valve (B1) for opening and closing the gas discharge line (L2) is provided in the gas discharge line (L2),
A gas connection line (L3) through which process gas flows is connected between the gas supply line (L1) and the gas discharge line (L2), and one end of the gas connection line (L3) is connected to the gas supply line (L1). The other end of the connection line (L3) is connected to the gas discharge line (L2) between the gas discharge unit (320) and the discharge valve (B1),
A connection valve (B2) for opening and closing the gas connection line (L3) is provided in the gas connection line (L3),
The process gas control member 600 is characterized in that it includes a valve operation unit 601 that closes the connection valve B2 while opening the discharge valve B1 or opens the connection valve B2 while closing the discharge valve B1. Process gas supply device for puff using humidity detection.
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