KR101335669B1 - Load port module - Google Patents

Load port module Download PDF

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Publication number
KR101335669B1
KR101335669B1 KR1020120142929A KR20120142929A KR101335669B1 KR 101335669 B1 KR101335669 B1 KR 101335669B1 KR 1020120142929 A KR1020120142929 A KR 1020120142929A KR 20120142929 A KR20120142929 A KR 20120142929A KR 101335669 B1 KR101335669 B1 KR 101335669B1
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KR
South Korea
Prior art keywords
unit
pool
stage unit
discharge
load port
Prior art date
Application number
KR1020120142929A
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Korean (ko)
Inventor
유정호
Original Assignee
나노세미콘(주)
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Priority to KR1020120142929A priority Critical patent/KR101335669B1/en
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Publication of KR101335669B1 publication Critical patent/KR101335669B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Abstract

The present invention relates to a load port module, and more particularly, when a pool is mounted on a stage unit, nitrogen gas is injected into the pool, and the wafer stored and transported in the pool is discharged to the outside of the pool by pollutants. It relates to a load port module that is prevented from being damaged by.

Description

Load port module {LOAD PORT MODULE}

The present invention relates to a load port module, and more particularly, when a pool is mounted on a stage unit, nitrogen gas is injected into the pool, and the wafer stored and transported in the pool is discharged to the outside of the pool by pollutants. It relates to a load port module that is prevented from being damaged by.

Substrate loading and unloading devices, commonly referred to as FIMS loaders, are automated equipment related to the transport of materials such as wafers or reticles in the semiconductor manufacturing process. Included in the equipment that makes up the Standard Mechanical Interface (SMI) system.

Among the components of the PIM system, a sealed wafer storage container includes a detachable cassette mainly used for 200 mm wafers and a pod that is open downward, and a FOUP. .

Typically, the loose is made of synthetic resin, the sealing with the outside is made by the packing of the rubber material. Therefore, when the wafer is stored in the pool between processes, after some time, external oxygen or contaminants penetrate and a natural oxide film is formed on the wafer, which causes a defective wafer.

Thus, before the wafer is introduced into the next step, nitrogen gas is injected into the supply port formed on one side of the fulcrum, and contaminants such as oxygen are discharged into the exhaust port formed on the other side.

However, as described above, the local cleaning method of injecting nitrogen gas into the inside of the pool has a long purging type and some pollutants are not discharged smoothly. have.

Prior art in this regard is Korean Patent Publication No. 2011-0024474 (2011.03.09. Publication, stage moving device).

An object of the present invention is to provide a load port module that can be prevented from damaging the wafer inside the pool by allowing nitrogen gas to be injected into the pool from the stage unit when the pool is mounted on the stage unit.

Another object of the present invention, the supply unit for injecting nitrogen gas into the pool and the discharge unit for discharging contaminants inside the pool is installed to be able to pull in and out from the stage unit to facilitate the installation of the pool, contaminated in the pool When the material is less than the set concentration to provide a load port module to prevent the work efficiency is reduced by controlling not to perform unnecessary processes without injecting nitrogen gas into the pool.

In order to solve the above problems,

The present invention includes a stage unit to which a pull in which a plurality of wafers are stored is mounted, a moving panel member for opening and closing the door of the pull, and a panel lifting unit for moving the moving panel member up or down, wherein the stage unit is provided. Silver, the fixing unit for fixing the spool to the stage unit when the spool is mounted, the supply unit for supplying nitrogen gas into the spool if the spool is mounted to the stage unit, and the spool if the spool is mounted to the stage unit And a discharge unit for discharging internal contaminants to the outside and a sensor unit for detecting whether a pull is mounted on the stage unit.

According to the measurement result of the concentration of contaminants in the pool control the nitrogen gas injection of the supply portion and the discharge of contaminants in the discharge portion.

The supply unit and the discharge unit are drawn into and out of the stage unit according to the detection signal of the sensor unit.

The sensor unit may be selected from an infrared sensor or an ultrasonic sensor.

The sensor unit may be a push switch protruding to the outside of the stage unit.

The supply unit injects nitrogen gas into the pool at a rate of 0.1 to 100 L / min.

According to another aspect of the present invention, there is provided a load port module including a wafer in which a wafer is stored and a stage unit in which the wafer is mounted, wherein the pool is formed at the pool and injects nitrogen gas into the pool, and the pool And a measuring unit configured to measure the concentration of contaminants remaining in the inside of the pool and an outlet through which contaminants are discharged inside the pool, wherein the stage unit includes the stage unit when the pool is mounted on the stage unit. A fixing part for fixing the spool to the supply unit, a supply unit coupled to the inlet to supply nitrogen gas when the spool is mounted on the stage unit, and a discharge unit coupled to the outlet when the spool is mounted to the stage unit to transfer contaminants And a concentration of the pollutant measured by the sensor unit and the measurement unit for detecting whether the stage unit is equipped with a pull And controlling the nitrogen gas injection and emission of pollutants of the outlet of the injection port in accordance with, and a control unit for controlling the fixing unit and the supply and discharge unit according to the sensor of the sense signal.

The said supply part and a discharge part are provided in the said stage unit so that drawing-in and drawing-out is possible.

The sensor unit may be selected from an infrared sensor or an ultrasonic sensor.

The sensor unit may be a push switch protruding to the outside of the stage unit.

The control unit, when the measurement result of the measurement unit exceeds a set concentration, injects nitrogen gas into the pool through the inlet, and controls to discharge contaminants through the outlet.

The measuring unit measures the concentration of oxygen in the pollutant, the set concentration is characterized in that 5 to 20ppm.

The measurement unit, when the sensor unit detects that the pool is mounted on the stage unit measures the contaminant concentration inside the pool.

The supply unit injects nitrogen gas into the pool at a rate of 0.1 to 100 L / min.

According to the solution of the above problems,

The present invention has the effect of preventing the wafer inside the pool from being damaged by contaminants.

In addition, there is an effect that the load port module of the present invention can be implemented by replacing only the stage unit with the conventional load port module without installing equipment or by processing the stage unit.

In addition, by removing the contaminants in the pool during the transfer process of the pool by the load port module has an effect of improving the work efficiency.

1 is a view schematically showing a load port module according to an embodiment of the present invention.
FIG. 2 is a side view schematically illustrating the load port module of FIG. 1.
Figure 3 is a bottom view showing a pull in accordance with an embodiment of the present invention.
4 is a perspective view schematically showing a stage unit of the present invention.
Figure 5 is a side view showing a stage unit in a state in which the pull is not mounted in the present invention.
Figure 6 is a side view showing a stage unit in a state in which the pull is mounted in the present invention.
7 is a view illustrating a state in which a pull is mounted on a stage unit in a load port module according to an embodiment of the present invention.

The present invention will now be described in detail with reference to the accompanying drawings.

Hereinafter, a detailed description of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

And embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art.

Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 is a view schematically showing a load port module 10 according to an embodiment of the present invention, Figure 2 is a side view schematically showing the pod port module of FIG.

The load port module 10 performs the function of directly opening the wafer 100 transferred by the pool 100 transfer robot to directly take out the wafer inside the pool 100 so that the wafers stored in the pool 100 are stored. It can be supplied to a fixed processing device. Alternatively, the wafer transfer robot included in the wafer transfer device may directly enter the pool 100 to carry out the wafer.

The load port module 10 may be installed at any position as long as it can transfer the wafer through a series of wafer movement paths connecting the wafer transfer device and the process processor.

The load port module 10 may be installed in plural, one or more of which may supply an unprocessed wafer stored in the pool 100 to a process processing apparatus, and the rest process a wafer processed in the process processing apparatus. It can be stored again in the pool 100 from the processing apparatus.

The pool 100 is mounted on the stage unit 200 of the load port and transported, and the pool 100 is opened to carry out wafers inside the pool 100 or to carry wafers into the pool 100. The pool 100 is transferred to the place where the robot is disposed.

1 and 2, the present invention is a rod mounted on the stage unit 200 to transfer the pool 100 storing a plurality of wafers so that the wafers in the pool 100 can be loaded and unloaded. Relates to the port module 10.

The load port module 10 includes a movable panel member 300 and a movable panel member provided with opening / closing means for opening / closing the pull 100 in order to carry out the wafer inside the pull 100. It is disposed on the lower side of the 300 and includes a stage unit 200 on which the pool 100 is placed on the top.

The door 100a opening / closing means protrudes on the front surface of the moving panel member 300 toward the pool 100, and is inserted into the locking groove 100b formed in the door 100a of the pool 100 so that A lock ring 310 is formed at one end of the door 100a to open and close the door 100a, and is rotated by a separate driving means to rotate the lock ring 310 and the movable panel member 300. Is connected to the panel lifting device 400 for moving the moving panel member 300 up and down.

The panel elevating device 400 is connected to the moving panel member 300 and the panel moving part 410 for moving the moving panel member 300 forward and backward and the panel moving part 410 connected to the moving panel member. The panel lifting unit 420 moves up and down 300.

The load port module 10 opens the door 100a of the pull 100 in the following operation.

On the upper surface of the stage unit 200, the pool 100 is seated so that the door 100a of the pool 100 is in close contact with the moving panel member 300. The lock ring 310 formed at the end of the rotation shaft of the door 100a opening and closing means is inserted into the lock groove 100b formed in the door 100a of the pull 100, and the rotation shaft inserted into the lock groove 100b is rotated. While the lock state of the door 100a of the release 100 is released.

The panel lifting device 400 moves backward to the panel moving part 410 so as not to be caught when the door 100a of the pull 100 in close contact with the moving panel member 300 and the moving panel member 300 is lowered. The panel is lowered to the lifting unit 420.

The pull 100 is opened while the moving panel member 300 and the door 100a of the pull 100 are lowered by the panel lifting device 400 together.

The load port module 10 is not limited to the above example, it will be noted that it can be variously modified to various structures that can open and close the door (100a) of the pull (100).

The pool 100 is formed in the pool 100 and the inlet port 110 through which nitrogen gas is injected into the pool 100, and similarly to the inlet port 110, the pool 100 is formed in the pool 100. And a measuring unit (not shown) for measuring the concentration of the pollutant remaining in the outlet 120 and the pool 100 through which the pollutant therein is discharged.

And, if the stage 100 is mounted to the stage unit 200, the stage unit 200 is coupled to the fixing groove (100c) formed on the bottom surface of the pool to the pool 100 in the stage unit 200 Fixing unit 240 to be fixed, and when the pool 100 is mounted to the stage unit 200 is coupled to the injection port 110 to supply the nitrogen gas 210 and, to the stage unit 200 When the 100 is mounted, the discharge unit 220 coupled to the discharge port 120 and transferring the pollutant, the sensor unit 230 for detecting whether the pool 100 is mounted on the stage unit 200 and the Controls the nitrogen gas injection of the injection port 110 and the discharge of the pollutant at the discharge port 120 according to the measurement result of the concentration of the pollutant measured by the measurement unit. 240, a control unit (not shown) for controlling the supply unit 210 and the discharge unit 220.

3 is a bottom view of the pool 100 according to an embodiment of the present invention, the inlet 110 and the outlet 120 formed in the pool 100 and the upper surface of the stage unit 200 and It is formed on the bottom of the pool 100 in contact. In addition, it is preferable that a fixing groove 100c is formed at the bottom of the pool 100 to which the fixing unit 240 of the stage unit 200 is coupled.

4 is a perspective view schematically showing the stage unit 200 of the present invention, wherein the sensor unit 230 detects whether the pull 100 is mounted on the stage unit 200.

In addition, the controller determines whether the pool 100 is mounted on the stage unit 200 from the sensor unit 230 and controls the fixing unit 240, the supply unit 210, and the discharge unit 220. In addition, the nitrogen gas is injected into the injection unit according to the concentration measurement result of the contaminant in the pool 100 measured by the measuring unit, and controls to discharge the pollutant through the outlet 120.

FIG. 5 is a side view illustrating the stage unit 200 in a state where the pull 100 is not mounted in the present invention, and FIG. 6 illustrates the stage unit 200 in a state where the pull 100 is mounted in the present invention. Figure 7 is a side view, Figure 7 is a view showing a state in which the pull 100 is mounted to the stage unit 200 in the load port module 10 according to an embodiment of the present invention.

5 to 7, the stage unit 200 is provided on the upper surface of the supply unit 210 for supplying nitrogen gas and the discharge unit 220 for discharging contaminants in the pool 100 is the stage unit The upper surface of the 200 is drawn in to the lower side, or installed to be pulled out to the upper side.

That is, when the pool 100 is not mounted on the stage unit 200, the supply unit 210 and the discharge unit 220 are introduced into the interior from the upper surface of the stage unit 200, and the stage unit ( When the pull 100 is mounted on the 200, as illustrated in FIGS. 5 and 6, the sensor unit 230 of the button type is pressed by the bottom of the pull 100, and thus the sensor unit 230 When detecting that the pull 100 is mounted, the sensor unit 230 transmits a signal to the controller.

The supply unit 210 and the discharge unit 220 are drawn out from the upper surface of the stage unit 200 by the control unit, and are coupled to the inlet 110 and the outlet 120 of the pool 100, respectively.

Preferably, a packing member for sealing the outside may be provided between the supply part 210, the injection hole 110, and the discharge part 220 and the discharge hole 120.

The sensor unit 230 may be disposed on the upper surface of the stage unit 200 and may use an electronic sensor such as an infrared sensor or an ultrasonic sensor that can detect whether the pull 100 is mounted, or FIGS. 5 and FIG. As shown in FIG. 6, a mechanical sensor using a plurality of push switches protruding to the upper surface of the stage unit 200 may be used.

The control unit injects nitrogen gas into the pool 100 through the inlet port 110 when the pollutant concentration in the pool 100 measured by the measuring unit exceeds the set concentration, and loosens through the outlet port 120. (100) Control to discharge the pollutants inside.

In the present invention, the measurement unit is to measure the concentration of the oxygen forming the oxide film on the wafer, the setting concentration for the control unit to control the inlet 110 and outlet 120 is 5 to 20ppm.

The measuring unit measures the oxygen concentration in the pool 100 when the sensor unit 230 detects that the pool 100 is mounted on the stage unit 200, and at this time, the oxygen concentration inside the pool 100 is set to the concentration level. When exceeding is injecting nitrogen gas at a rate of 0.1 to 100L / min inside the pool 100 to remove contaminants, that is, oxygen in the pool 100.

As such, when the load 100 in which the wafer is stored in the stage unit 200 is mounted in the load port module 10 according to the present invention, the sensor unit 230 detects the mounting of the pool 100 so that the measurement unit is unpacked 100. ) To measure the concentration of contaminants therein, and the fixing part 240 is inserted into the fixing groove 100c so that the pool 100 is firmly coupled to the stage unit 200, and a supply unit 210 supplying nitrogen gas. ) Rises and is inserted into the injection hole 110, and the discharge part 220 is lifted up and inserted into the discharge hole 120 to discharge the contaminants discharged through the discharge hole 120 through the discharge part 220 outside the pool 100. To be discharged.

When the measured concentration of the pollutant concentration exceeds the set concentration, the controller opens the supply unit 210 to inject nitrogen gas into the extract 100 through the inlet 110, and the outlet 120 is opened to loosen ( 100) to control the contaminants inside the discharge portion 220.

On the other hand, when the concentration of the contaminant in the pool 100 is less than the set concentration, the inlet 110 and outlet 120 is closed again and the supply unit 210 and the discharge unit 220 inside the stage unit 200 Is lowered.

As such, by forming an oxide film on the surface of the wafer in the pool 100 to remove oxygen, which is a contaminant, which is a cause of defective products, the oxide film is effectively formed on the wafer.

delete

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

10: load port module
100: loose 110: inlet
120: outlet 200: stage unit
210: supply part 220: discharge part
230: sensor portion 240: fixed portion
300: moving panel member 310: locking ring
400: panel lifting device 410: panel moving part
420: panel lifting unit

Claims (14)

A stage unit in which a pull in which a plurality of wafers are stored is mounted;
A moving panel member for opening and closing the door of the pull; And
It includes a panel lifting unit for moving the moving panel member up or down,
The stage unit includes:
A fixing part for fixing the fulcrum to the stage unit when the fulcrum is mounted to the stage unit;
A supply unit for supplying nitrogen gas into the pool when the pool is mounted on the stage unit;
A discharge unit for discharging contaminants in the pool to the outside when the pool is mounted on the stage unit; And
It is provided with a sensor unit for detecting whether the loosening is mounted on the stage unit,
The supply port and the discharge port is characterized in that the inlet and outlet to the stage unit in accordance with the detection signal of the sensor unit. The method according to claim 1,
The load port, characterized in that for controlling the injection of nitrogen gas and the discharge of the pollutant in the discharge portion in accordance with the concentration measurement result of the pollutant in the pool. delete The method according to claim 1,
The sensor unit includes:
Load port, characterized in that selected from the infrared sensor or ultrasonic sensor. The method according to claim 1,
The sensor unit includes:
The load port, characterized in that the push switch protruding to the outside of the stage unit. The method according to claim 1,
Wherein the supply unit includes:
The load port, characterized in that for injecting nitrogen gas at a rate of 0.1 to 100L / min inside the pool. A load port module comprising a pull in which a wafer is stored and a stage unit in which the pull is mounted,
Unwrapped,
An injection port formed in the pool to inject nitrogen gas into the pool;
A discharge port formed in the pool to discharge pollutants inside the pool; And
It includes; Measuring unit for measuring the concentration of contaminants remaining inside the pool;
The stage unit includes:
A fixing part for fixing the fulcrum to the stage unit when the fulcrum is mounted to the stage unit;
A supply unit coupled to the inlet to supply nitrogen gas when the stage is mounted on the stage unit;
A discharge unit which is coupled to the discharge port and transfers pollutants when the pool is mounted on the stage unit;
A sensor unit for sensing whether the stage unit is equipped with a pull; And
A controller for controlling nitrogen gas injection into the inlet and pollutant discharge through the outlet according to the concentration measurement result of the pollutant measured by the measuring unit, and controlling the fixing part, the supply part, and the discharge part according to a detection signal of the sensor part; Including;
The supply part and the discharge part,
The load port module, characterized in that installed in the stage unit to be pulled out and pulled out. delete The method of claim 7,
The sensor unit includes:
Load port module, characterized in that selected from the infrared sensor or ultrasonic sensor. The method of claim 7,
The sensor unit includes:
The load port module, characterized in that the push switch protruding to the outside of the stage unit. The method of claim 7,
The control unit,
When the measurement result of the measurement unit exceeds the set concentration load port module, characterized in that to inject nitrogen gas into the pool through the inlet, and to discharge the pollutants through the outlet. The method of claim 11,
The measuring unit measures the concentration of oxygen in the pollutant, the set concentration is a load port module, characterized in that 5 to 20ppm. The method of claim 7,
Wherein the measuring unit comprises:
The load port module, characterized in that for measuring the contaminant concentration inside the pool when the sensor unit is detected that the pool is mounted on the stage unit. The method of claim 7,
Wherein the supply unit includes:
The load port module, characterized in that for injecting nitrogen gas at a rate of 0.1 to 100L / min inside the pool.
KR1020120142929A 2012-12-10 2012-12-10 Load port module KR101335669B1 (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150076540A (en) * 2013-12-27 2015-07-07 삼성전자주식회사 Purge apparatus
KR20150087703A (en) * 2014-01-22 2015-07-30 삼성전자주식회사 Wafer storage apparatus having gas charging units and semiconductor manufacturing apparatus using the same
KR101545242B1 (en) 2013-12-31 2015-08-18 (주) 이더 Apparatus for purging FOUP inside using a semiconductor fabricating
CN109686687A (en) * 2018-11-21 2019-04-26 长江存储科技有限责任公司 Storage box, station and bearing system
US10790176B2 (en) 2017-10-30 2020-09-29 Samsung Electronics Co., Ltd. Substrate carrier
CN112635373A (en) * 2019-10-07 2021-04-09 Tdk株式会社 Load port device and drive method for load port device
WO2022211185A1 (en) * 2021-03-29 2022-10-06 주식회사 저스템 Stage device and load port module comprising same

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Publication number Priority date Publication date Assignee Title
JP2001284430A (en) * 2000-03-31 2001-10-12 Dainippon Screen Mfg Co Ltd Carrier placing apparatus
KR20060061935A (en) * 2004-12-02 2006-06-09 (주)인터노바 A loader for fims having double door
KR20070049138A (en) * 2007-01-16 2007-05-10 가부시키가이샤 라이트세이사쿠쇼 Load port
JP2012019046A (en) * 2010-07-07 2012-01-26 Sinfonia Technology Co Ltd Load port

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284430A (en) * 2000-03-31 2001-10-12 Dainippon Screen Mfg Co Ltd Carrier placing apparatus
KR20060061935A (en) * 2004-12-02 2006-06-09 (주)인터노바 A loader for fims having double door
KR20070049138A (en) * 2007-01-16 2007-05-10 가부시키가이샤 라이트세이사쿠쇼 Load port
JP2012019046A (en) * 2010-07-07 2012-01-26 Sinfonia Technology Co Ltd Load port

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150076540A (en) * 2013-12-27 2015-07-07 삼성전자주식회사 Purge apparatus
KR102141493B1 (en) * 2013-12-27 2020-08-05 삼성전자주식회사 Purge apparatus
KR101545242B1 (en) 2013-12-31 2015-08-18 (주) 이더 Apparatus for purging FOUP inside using a semiconductor fabricating
KR20150087703A (en) * 2014-01-22 2015-07-30 삼성전자주식회사 Wafer storage apparatus having gas charging units and semiconductor manufacturing apparatus using the same
KR102164544B1 (en) * 2014-01-22 2020-10-12 삼성전자 주식회사 semiconductor manufacturing apparatus including Wafer storage apparatus having gas charging units
US10790176B2 (en) 2017-10-30 2020-09-29 Samsung Electronics Co., Ltd. Substrate carrier
CN109686687A (en) * 2018-11-21 2019-04-26 长江存储科技有限责任公司 Storage box, station and bearing system
CN112635373A (en) * 2019-10-07 2021-04-09 Tdk株式会社 Load port device and drive method for load port device
WO2022211185A1 (en) * 2021-03-29 2022-10-06 주식회사 저스템 Stage device and load port module comprising same

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