KR101231231B1 - Foup opener - Google Patents

Foup opener Download PDF

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Publication number
KR101231231B1
KR101231231B1 KR1020120026119A KR20120026119A KR101231231B1 KR 101231231 B1 KR101231231 B1 KR 101231231B1 KR 1020120026119 A KR1020120026119 A KR 1020120026119A KR 20120026119 A KR20120026119 A KR 20120026119A KR 101231231 B1 KR101231231 B1 KR 101231231B1
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KR
South Korea
Prior art keywords
door
pull
lid
opener
unit
Prior art date
Application number
KR1020120026119A
Other languages
Korean (ko)
Inventor
유정호
Original Assignee
유정호
나노세미콘(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 유정호, 나노세미콘(주) filed Critical 유정호
Priority to KR1020120026119A priority Critical patent/KR101231231B1/en
Application granted granted Critical
Publication of KR101231231B1 publication Critical patent/KR101231231B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Abstract

The present invention relates to a pull opener, and more particularly, when opening the release lid by a door unit composed of an outer door and an inner door, nitrogen gas is injected to remove impurities and is generated by the composition of the door unit. The present invention relates to a pull opener capable of preventing the deterioration of the quality of the wafer conveyed by the pull by blocking the introduction of foreign matters.
To this end, the present invention, the frame portion having an opening for drawing and withdrawing the semiconductor material conveyed by the pull, and the loading unit which is installed in the front of the frame portion to transfer the pull to close to the opening and the rear of the frame portion The door unit includes an outer door and an inner door, the door unit being installed to open the releasing lid, and a closed cover is installed on the outer surface of the cylinder for driving the inner door, which is generated by driving the door unit. It is to prevent foreign matter from entering the pool.

Description

Pull Opener {FOUP OPENER}

The present invention relates to a pull opener, and more particularly, impurities, including oxygen, which form a natural oxide film on the surface of a wafer by injecting nitrogen gas when opening the pull lid by a door unit composed of an outer door and an inner door. The present invention relates to a pull opener capable of preventing the deterioration of the quality of the wafer transported by the pull by blocking the inflow of foreign substances that may be generated by the structure of the door unit.

Substrate loading and unloading devices, commonly referred to as FIMS loaders, are automated equipment related to the transport of materials such as wafers or reticles in the semiconductor manufacturing process. Included in the equipment that makes up the Standard Mechanical Interface (SMI) system.

Among the components of the PIM system, a sealed wafer storage container includes a detachable cassette mainly used for 200 mm wafers and a pod that is open downward, and a FOUP. .

Typically, the loose is made of synthetic resin, the sealing with the outside is made by the packing of the rubber material. Therefore, when the wafer is stored in the pool between processes, after some time, external oxygen or contaminants penetrate and a natural oxide film is formed on the wafer, which causes a defective wafer.

Thus, before the wafer is introduced into the next step, nitrogen gas is injected into the supply port formed on one side of the fulcrum, and contaminants such as oxygen are discharged into the exhaust port formed on the other side.

However, as described above, the local cleaning method of injecting nitrogen gas into the inside of the pool has a long purging type and some pollutants are not discharged smoothly. have.

Prior art in this regard is Korean Patent Laid-Open Publication No. 2006-0061935 (published on June 09, 2006, FIMS loader having a double door structure).

The present invention is provided with a door unit for opening the release cap is provided with an outer door and an inner door, the inner door is partially opened by the injection door and then injected with nitrogen gas to completely open by the outer door to inject nitrogen gas into the pool. It is to provide a pull opener that can shorten the purging time.

And the inner door is installed to move back and forth in the space portion of the outer door, the door cylinder for moving the inner door is isolated from the space portion by a sealed cover to remove the impurities that may occur when driving the door unit. It is to provide a pull opener that can prevent the flow of the wafer to prevent the quality of the wafer from being lowered.

In order to solve the above problems,

The present invention is provided with a frame portion formed with an opening for drawing and withdrawing the semiconductor material conveyed by the pull, and a loading unit which is installed on the front of the frame portion to transfer the pull to be in close contact with the opening and the rear of the frame portion And a door unit for opening the release lid.

The loading unit is composed of a loading bracket for moving the docking bracket and the docking bracket that can be mounted and detached to the pull,

The door unit is installed on the rear of the frame unit and is horizontally slid to move the outer lid to transfer the cap, and installed on one side of the outer door to inject nitrogen gas into the space formed between the outer and outer door A supply nozzle, an exhaust nozzle formed on the other side of the outer door to discharge nitrogen gas including foreign matter in the space portion, and disposed in the space portion of the outer door to move back and forth, and to unlock the loose lid A vacuum suction part adsorbed on the latch key and the release lid is provided, and includes an inner door for opening the release lid and a door cylinder installed in the space to move the inner door forward and backward.

In particular, the door unit is provided with a sealing cover surrounding the outer surface of the door cylinder so that the door cylinder is isolated from the space.

The supply nozzle is connected to a plurality of supply holes formed along one side of the outer door, the supply hole is characterized in that the diameter of 0.01 to 3 pi (mm).

The diameter is 0.01 to 3 pi (mm), the door unit is disposed in the space is provided with an oxygen concentration meter for measuring the concentration of oxygen in the door unit.

The door unit is partially opened by the inner door, and when the concentration of oxygen measured by the oxygen concentration meter is less than 20 to 70 ppm, the inner door is completely opened while the outer door is horizontally moved to introduce foreign substances. And oxide film formation on the wafer.

On the side of the inner door of the door unit is formed a through hole passing through.

The rear of the frame portion is provided with a pair of guide bars for guiding the sliding of the outer door.

And the door unit is provided with a sub-nozzle for injecting the nitrogen gas between the outer door and the inner door.

In addition, the frame portion is further provided with a sealing member along the circumference of the opening.

According to the solution of the above problems,

The present invention shortens the purging time of injecting nitrogen gas into the inside of the wafer for transporting the wafer and prevents the quality of the wafer from being degraded due to the formation of a natural oxide film by fully opening the pool lid when the oxygen concentration is below a certain level. It can work.

In addition, the door cylinder driven to move the inner door back and forth in the space portion of the outer door is isolated from the space portion by the sealing cover to prevent the impurities that may be generated due to the operation of the pull opener into the pool. There is also an effect.

In addition, a sub-nozzle for injecting nitrogen gas is provided between the outer door and the inner door to facilitate the discharge of oxygen including impurities.

1 is a perspective view showing a pull opener according to the present invention.
Figure 2 is a perspective view showing the configuration of the door unit.
Figure 3 is a side view schematically showing the inside of the door unit.
4 is a front view of the door unit.
5 is a view showing the operation sequence of the door unit.

Hereinafter, the pull opener 10 according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view showing a pull opener 10 according to the present invention, Figure 2 is a perspective view showing the configuration of the door unit 300, Figure 3 is a side view schematically showing the interior of the door unit 300 4 is a front view of the door unit 300, and FIG. 5 is a view illustrating an operation procedure of the door unit 300.

The pool 20 is a device for storing and transporting a wafer (not shown) used as a semiconductor material. When the pool 20 is transferred to each process facility, it is mounted on one side of each process facility to load and unload the transferred pool 20, and at this time, the pool 20 is closed while sealing the inside of the pool 20 from the outside. A pull opener 10 for opening and closing (not shown) is used.

The pull opener 10 may also be referred to as a load port module, a pims opener, or the like.

Referring to FIG. 1, the pull opener 10 will be described. The frame part 100 having an opening 110 for drawing out and drawing in semiconductor materials conveyed by the pull 20, and the frame part 100. The door unit 300 is installed on the front of the loading unit 200 for transporting the pool 20 to be in close contact with the opening 110 and the rear of the frame unit 100 to open the cap of the pool 20. ).

The loading unit 200 is to load and unload the pull 20 in each process, the loading cylinder for moving the docking bracket 210 and the docking bracket 210 that can be mounted and detached to the pull 20. 230.

The docking bracket 210 moves forward, backward, leftward, or rightward with respect to the opening 110 of the frame to closely contact the pull 20 with the opening 110. At this time, the pull 20 is temporarily fixed to the docking bracket 210 can be firmly adhered to the opening 110 to prevent the outside air flows between the pull 20 and the opening (110).

The loading cylinder 230 is installed in an optimal form for moving the docking bracket 210 according to the design of the process in which the pull opener 10 is installed, the direction and the number is not limited.

The door unit 300 is an apparatus for opening the cap of the cap 20 when the pull 20 is in close contact with the opening 110 of the frame part 100 by the loading unit 200.

When the door unit 300 is described in detail with reference to FIGS. 2 to 4, the outer door 310 which transfers the cap of the pull 20 is installed on the rear surface of the frame part 100 and is slid horizontally, and the A supply nozzle 320 installed at one side of the outer door 310 to inject nitrogen gas into the space 311 formed between the pull 20 and the outer door 310, and the outer door 310 of the The exhaust nozzle 330 is formed at the other side and discharges nitrogen gas including foreign matter in the space 311.

And disposed in the space portion 311 of the outer door 310 is movable back and forth, the latch (341) for releasing the lock of the cap (20) and the vacuum suction portion adsorbed to the cap (20) ( 342 is provided and includes an inner door 340 for opening the lid 20 and a door cylinder 350 installed in the space 311 to move the inner door 340 back and forth.

The outer door 310 has a front surface that is open and has a housing shape in which a space 311 is formed therein, and is slidably moved left and right with respect to the opening 110 of the frame part 100.

A pair of guide bars 120 are installed at the upper and lower portions of the opening 110 to guide the sliding movement of the outer door 310 in the frame part 100.

In addition, an elastic sealing member 130 is provided around the opening 110 to prevent oxygen from flowing between the opening 20 and the pull 20 in close contact with the opening 110.

One side of the outer door 310 is provided with a supply nozzle 320 for injecting nitrogen gas into the space portion 311 formed between the pull 20 and the outer door 310.

The supply nozzle 320 is connected to a plurality of supply holes 321 formed along one side of the outer door 310 to supply nitrogen gas to the entire side of the outer door 310.

In particular, the supply hole 321 is a diameter of 0.01 to 3 pi (mm), so that the nitrogen gas can be evenly injected in a short time.

An exhaust nozzle 330 is provided at the other side of the outer door 310 so that nitrogen gas is injected into the space part 311 so that oxygen and foreign substances that existed in the space between the pool 20 and the door unit 300 are stored. Drain the mixed nitrogen gas.

The exhaust nozzle 330 is also provided in plural to quickly discharge oxygen and foreign matter forming an oxide film on the surface of the wafer.

The inner door 340 is disposed in the space portion 311 of the outer door 310, and is movable back and forth with respect to the outer door 310, the latch key for releasing the lock of the cap (20) ( 341 and the suction 20 is provided with a vacuum suction part 342 adsorbed on the lid.

The latch key 341 is locked by a locking means (not shown) provided on the cap of the cap 20 for sealing the cap 20 after the cap 20 is coupled to the cap 20. When the pull 20 is brought into close contact with the frame part 100 by the loading unit 200, the latch key 341 is inserted into the locking means of the pull 20 lid to release the lock to open the lid of the pull 20. Let's do it.

When the lock of the cap 20 is released by the latch key 341, the cap of the cap 20 is attached to the inner door 340 by the vacuum suction part 342, and the inner door 340 moves. The loose 20 will be opened according to.

The inner door 340 is moved back and forth by the door cylinder 350 installed in the space 311.

In particular, the door cylinder 350 is provided with a sealing cover 360 to insulate the door cylinder 350 from the space 311 to surround the outer surface of the door cylinder 350.

The lower end of the sealing cover 360 is fixed to the lower surface of the outer door 310, the upper end is fixed to the lower surface of the inner door 340. Thus, when the door cylinder 350 is operated to move the inner door 340 forward or backward, the space 311 and the door cylinder 350 are isolated by the sealing cover 360, thereby preventing the door. Dust or foreign matter that may occur due to the operation of the cylinder 350 is prevented from flowing into the pool 20 through the space 311.

Preferably, the sealing cover 360 is made of a corrugated pipe type PVC material called 'Java', so that the sealing cover 360 is not damaged during the forward and backward operation without disturbing the operation of the door cylinder.

The door unit 300 is provided with an oxygen concentration meter 370 disposed in the space 311 to measure the concentration of oxygen.

The oxygen concentration meter 370 measures the concentration of oxygen present in the space 311 and injects nitrogen gas until the oxygen concentration is equal to or lower than a reference value, thereby preventing the formation of an oxide film on the surface of the wafer.

Preferably, after the lid 20 is partially opened by the inner door 340, when the concentration of oxygen measured by the oxygen concentration meter 370 is 20 to 70 ppm or less, the inner door 340 is rearward. It is completely moved and the outer door 310 is horizontally moved from the opening to completely open the lid of the pull 20.

Inside the inner door 340 is formed a space in which the device for operating the latch key 341 and the vacuum suction unit 342 is formed, the sub-nozzle 380 for injecting the nitrogen gas therein By effectively removing oxygen and foreign matter.

In particular, the inner door 340 according to the present invention is formed by the through-hole 343 is a part of the open side, it can facilitate the discharge of oxygen and foreign matter.

Hereinafter, the operation sequence of the pull opener 10 according to the above-described configuration will be described with reference to FIG. 5.

When the pull 20 is transferred and seated on the docking bracket 210 of the loading unit 200, the loading cylinder 230 is operated to close the pull 20 so as to be in close contact with the opening 110 of the frame part 100. Transfer.

Thereafter, the vacuum suction part 342 of the inner door 340 of the door unit 300 fixes the cap of the cap 20 and the lock of the cap of the cap 20 is released by the latch key 341.

At this time, nitrogen gas is purged through the supply nozzle 320 and the sub-nozzle 380 to exhaust oxygen including foreign matter present in the space unit 311 between the door unit 300 and the pool 20. It is discharged to the nozzle 330. At the same time, nitrogen gas is also supplied from the sub-nozzle 380 installed in the inner door 340 to discharge foreign substances and oxygen present in the inner door 340 to the exhaust nozzle 330.

When the concentration of oxygen measured by the oxygen densitometer 370 is less than or equal to a set value, the inner door 340 partially moves backward with the cap of the cap 20 attached to the vacuum adsorption part 342, and the supply nozzle Nitrogen gas is continuously purged from the 320 and the sub-nozzle 380 to discharge the remaining oxygen and foreign substances contained in the oxygen through the exhaust nozzle 330.

Thereafter, nitrogen gas is purged to the inside of the spool 20, and when the concentration of oxygen continuously measured at the oxygen concentration meter 370 is maintained below a set value, the inner door 340 is completely moved to the rear and the outer door. As the 310 moves horizontally with respect to the opening 110 along the guide bar 120, the pull 20 is opened.

The operation of the inner door 340 according to the driving of the door unit 300 as described above refers to the reference line (a) shown on the basis of when the inner door 340 is partially opened in FIG. 5. The operation of the pull opener 10 can be seen more clearly.

As such, by using the pull opener 10 according to the present invention, the door cylinder 350 for moving the inner door 340 is isolated by the airtight cover 360, so that the metal that may be generated when the door unit 300 is driven. By preventing the flow of lunar dust or the like into the pool 20, the quality of the wafer may be prevented from being degraded.

In addition, the nitrogen gas is effectively purged by the through hole 343 formed at the side of the inner door 340, thereby minimizing oxygen or foreign matter that may remain in the door unit 300.

In addition, when opening the lid 20, the inner door 340 does not open the lid 20 at a time, but after partially opening, the nitrogen gas is continuously purged to allow the oxygen to be measured by the oxygen concentration meter 370. When the concentration is maintained below the set value, by fully opening the lid 20, an oxide film is formed on the surface of the wafer to prevent deterioration of quality and to reduce the defective occurrence rate of the semiconductor.

It will be understood by those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is self-evident.

10: loose opener 20: loose
100 frame portion 110 opening
120: guide bar 130: sealing member
200: loading unit 210: docking bracket
230: loading cylinder
300: door unit 310: outer door
311: space part 320: supply nozzle
330 exhaust nozzle 340 inner door
341: Latch Key 342: Vacuum Suction Part
343: through hole 350: door cylinder
360: airtight cover 370: oxygen concentration meter
380: sub nozzle

Claims (20)

A frame portion having an opening for drawing out and drawing in the semiconductor material conveyed by the pull, a loading unit installed at the front of the frame portion to transfer the paste to be in close contact with the opening, and installed at the rear of the frame portion to open the pull lid In the pull opener comprising a door unit to
The loading unit,
Docking bracket that can be mounted and detached to the pull; And
Consists of a loading cylinder for moving the docking bracket,
The door unit,
An outer door installed at a rear surface of the frame part and sliding horizontally to transfer the release lid;
A supply nozzle installed at one side of the outer door to inject nitrogen gas into a space formed between the pull and the outer door;
An exhaust nozzle formed at the other side of the outer door to discharge nitrogen gas including foreign matter in the space part;
An inner door which is disposed in a space portion of the outer door and is movable back and forth, and has a latch key for releasing the unlocking lid and a vacuum suction part adsorbed to the release lid to open the release lid; And
A door cylinder installed in the space to move the inner door back and forth;
Is provided with a sealing cover surrounding the outer surface of the door cylinder so that the door cylinder is isolated from the space portion,
The door unit is disposed in the space portion is an oxygen concentration meter for measuring the concentration of oxygen in the door unit; is provided after the release lid is partially opened by the inner door, the concentration of oxygen measured in the oxygen concentration meter is 20 When it is less than or equal to 70 ppm, the inner door is completely opened while the outer door is horizontally moved.
And a sub-nozzle for injecting the nitrogen gas between the outer door and the inner door on the side of the inner door and passing through the inner door. delete The method according to claim 1,
The supply nozzle,
A pull opener, characterized in that connected to a plurality of supply holes formed along one side of the outer door. delete delete delete delete The method according to claim 1,
The frame unit includes:
The pull opener is installed on the rear of the frame portion is provided with a pair of guide bars for guiding the sliding of the outer door. delete The method according to claim 1,
The frame unit includes:
A pull opener, characterized in that the sealing member is further provided along the circumference of the opening. In the door unit of the pull opener to open the lid of the pull to transfer the semiconductor material,
An outer door which slides horizontally with respect to the lid of the pool to convey the opened lid;
A supply nozzle installed at one side of the outer door to inject nitrogen gas into a space formed between the pull and the outer door;
An exhaust nozzle formed at the other side of the outer door to discharge nitrogen gas including foreign matter in the space part;
An inner door disposed in a space of the outer door and movable back and forth and opening the lid of the pull; And
A door cylinder installed at the space part to move the inner door back and forth;
Is provided with a sealing cover surrounding the outer surface of the door cylinder so that the door cylinder is isolated from the space portion,
Is disposed in the space portion oxygen concentration meter for measuring the concentration of oxygen in the door unit; is provided,
After the lid of the pull is partially opened by the inner door, when the oxygen concentration measured in the oxygen concentration meter is 20 to 70 ppm or less, the inner door is completely opened while the outer door is horizontally moved.
And a sub-nozzle for injecting the nitrogen gas between the outer door and the inner door on the side of the inner door, the through-hole formed through the inner door. The method of claim 11,
The inner door is
A door opener of a pull opener, characterized in that a latch key for releasing the cap of the lock in a locked state is provided. The method of claim 11,
In the inner door,
The door opener of the pull opener, characterized in that provided with a vacuum suction unit adsorbed on the lid of the pull. delete The method of claim 11,
The supply nozzle,
The door opener of the pull opener, characterized in that connected to a plurality of supply holes formed along one side of the outer door. delete delete delete delete delete
KR1020120026119A 2012-03-14 2012-03-14 Foup opener KR101231231B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120026119A KR101231231B1 (en) 2012-03-14 2012-03-14 Foup opener

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120026119A KR101231231B1 (en) 2012-03-14 2012-03-14 Foup opener

Publications (1)

Publication Number Publication Date
KR101231231B1 true KR101231231B1 (en) 2013-02-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120026119A KR101231231B1 (en) 2012-03-14 2012-03-14 Foup opener

Country Status (1)

Country Link
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100221983B1 (en) * 1993-04-13 1999-09-15 히가시 데쓰로 A treating apparatus for semiconductor process
KR100593424B1 (en) * 2004-12-02 2006-06-30 (주)인터노바 FIMS loader with double door structure
KR100801631B1 (en) * 2007-08-29 2008-02-11 (주)메머드 Mapping apparatus of fims loader
KR100917147B1 (en) * 2007-06-29 2009-09-15 (주) 예스티 Foup opener with anti-oxidizing function

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100221983B1 (en) * 1993-04-13 1999-09-15 히가시 데쓰로 A treating apparatus for semiconductor process
KR100593424B1 (en) * 2004-12-02 2006-06-30 (주)인터노바 FIMS loader with double door structure
KR100917147B1 (en) * 2007-06-29 2009-09-15 (주) 예스티 Foup opener with anti-oxidizing function
KR100801631B1 (en) * 2007-08-29 2008-02-11 (주)메머드 Mapping apparatus of fims loader

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