KR102194723B1 - Chip coil component and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a chip-shaped coil component and a method of manufacturing the same. A chip-type coil component according to an embodiment of the present invention includes a plurality of insulating layers, a ceramic body having a lower surface provided as a mounting surface and an upper surface opposite thereto, and positioned inside the ceramic body, and the length of the ceramic body An internal coil portion having first and second lead-out portions exposed to both sides in a direction, an external electrode disposed on the lower surface of the ceramic body, and formed on both sides of the ceramic body in the length direction, and the first and second lead-outs It may include a plating spreading portion connecting the portion and the external electrode.

Description

Chip coil component and its manufacturing method {CHIP COIL COMPONENT AND MANUFACTURING METHOD THEREOF}

The present invention relates to a chip type coil component and a method of manufacturing the same.

An inductor, one of the stacked chip components, forms an electronic circuit along with a resistor and a capacitor to remove noise or is a representative passive device used as a component forming an LC resonance circuit.

On the other hand, in recent years, the multilayered inductor is becoming widespread, and the multilayered inductor has a structure in which a plurality of magnetic layers or dielectric layers having an internal coil pattern formed thereon are stacked, and the internal coil patterns are connected to each other to form a coil structure. By doing so, characteristics such as target inductance and impedance can be realized.

The development direction of the multilayer inductor is set to miniaturization, high current, and low direct current resistance (Rdc).

In addition, when a metal can for removing radiation noise is formed after mounting a multilayer inductor on a substrate, a short may occur due to contact between the metal can and an external electrode of the multilayer inductor.

Japanese Laid-Open Patent Publication No. 2010-165973

An embodiment of the present invention is to prevent the occurrence of a short circuit due to contact between the metal can and the external electrode of the multilayer inductor, and is formed on the lead portion of the internal coil pattern exposed to both sides in the length direction of the body and the lower surface of the body. It relates to a chip-shaped coil component and a method of manufacturing the same for connecting external electrodes to be formed using plating spread.

A chip-type coil component according to a first technical aspect of the present invention includes: a ceramic body including a plurality of insulating layers, and having a lower surface provided as a mounting surface and an upper surface opposed thereto; An internal coil unit positioned inside the ceramic body and having first and second lead-out portions exposed to both side surfaces of the ceramic body in a longitudinal direction; An external electrode disposed on a lower surface of the ceramic body; And formed on both side surfaces of the ceramic body in the longitudinal direction, and may connect the first and second lead portions and the external electrode.

A chip-type coil component according to a second technical aspect of the present invention includes: preparing an insulator sheet; Forming an inner coil pattern on the insulator sheet; Ceramic having an internal coil portion having a first lead portion and a second lead portion exposed to both sides in a length direction by stacking the insulator sheet having the internal coil pattern formed thereon, and having a lower surface provided as a mounting surface and an upper surface opposite thereto Forming a body; Forming an external electrode on a lower surface of the ceramic body; And connecting the first and second lead portions and the external electrode through plating. It may include.

In the chip-type coil component and its manufacturing method according to an embodiment of the present invention, plating spreading can be improved by coating four surfaces of the body with an insulating layer, and a short between the metal can and the external electrode can be prevented.

In addition, DC resistance and Ls characteristics may be improved by increasing the volume of the body.

1 is a perspective view showing a chip-shaped coil component according to an embodiment of the present invention so that an internal coil part is visible.
FIG. 2 is a diagram illustrating a cross-section of the chip-shaped coil component shown in FIG. 1 when cut in the longitudinal direction.
3 is a perspective view showing in more detail the chip-shaped coil component shown in FIG. 1.
4 is a view in which an insulating layer is added in the cross-sectional view shown in FIG. 2.
5A is a view showing a top surface of a chip-type coil component according to an embodiment of the present invention.
5B is a view showing a lower surface (mounting surface) of a chip-type coil component according to an embodiment of the present invention.
5C is a view showing one side in the width direction of a chip-type coil component according to an embodiment of the present invention.
5D is a view showing one side in the longitudinal direction of a chip-shaped coil component according to an embodiment of the present invention.
6A to 6E are views for explaining a method of manufacturing a chip-type coil component according to an embodiment of the present invention.
7 is a flow chart showing a method of manufacturing a chip-type coil component according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, embodiments of the present invention are provided in order to more completely explain the present invention to those having average knowledge in the art. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

In addition, in the drawings, portions not related to the description are omitted in order to clearly describe the present invention, and the thickness is enlarged to clearly express several layers and regions, and components having the same function within the scope of the same idea are the same reference. Describe using symbols.

Throughout the specification, when a part "includes" a certain component, it means that other components may be further included rather than excluding other components unless otherwise stated.

Chip type coil component

Hereinafter, a multilayer electronic component according to an embodiment of the present invention will be described, and in particular, a multilayer inductor will be described, but is not limited thereto. That is, an inductor using metal, for example, a thin-film inductor may be used.

1 is a perspective view showing a chip-shaped coil component according to an embodiment of the present invention so that an internal coil part is visible.

Referring to FIG. 1, a chip-type coil component according to an embodiment of the present invention may include a ceramic body 100, an internal coil part 200, an external electrode 300, and a plating spreading part 400.

The ceramic body 100 may include a plurality of insulating layers. At this time, the ceramic body 100 may be in a state in which a plurality of insulating layers are sintered, and the boundary between adjacent insulating layers may be integrated so that it is difficult to check without using a scanning electron microscope (SEM). have.

The ceramic body 100 may have a hexahedral shape. When the direction of the hexahedron is defined to clearly describe the embodiment of the present invention, L, W, and T shown in Fig. 1 denote the longitudinal direction, the width direction, and the thickness direction, respectively. In addition, the ceramic body 100 may have a lower surface provided as a mounting surface, an upper surface opposite thereto, both side surfaces in the length direction, and both side surfaces in the width direction.

The plurality of insulating layers may include known ferrites such as Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, and Li ferrite.

The internal coil unit 200 may be located inside the ceramic body 100 and may include first and second lead-out portions 210 and 220 exposed to the outside of the ceramic body 100. More specifically, the first and second lead portions 210 and 220 correspond to a portion of the internal coil unit 200 and may be exposed to both sides of the ceramic body 100 in the longitudinal direction.

The internal coil part 200 may be formed by printing a conductive paste containing a conductive metal. The conductive metal is not particularly limited as long as it has excellent electrical conductivity, and for example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper ( Cu) or platinum (Pt) may be used alone or in a mixed form.

The external electrode 300 may be disposed on the lower surface of the ceramic body 100. That is, the external electrode 300 may be composed of first and second external electrodes 310 and 320, and may be disposed on the lower surface of the ceramic body 100, respectively. Meanwhile, the first and second external electrodes 310 and 320 may be disposed to be spaced apart from each other by a predetermined distance. Hereinafter, a configuration commonly applied to the first and second external electrodes 310 and 320 will be described as an external electrode 300.

The external electrode 300 may be formed of a metal having excellent electrical conductivity, and for example, nickel (Ni), copper (Cu), tin (Sn), silver (Ag), etc. alone or an alloy thereof It can be formed as

The plating spreading part 400 may be formed on both side surfaces of the ceramic body 100 in the longitudinal direction.

In more detail, the plating spreading part 400 includes a first plating spreading part 410 electrically connected to the first withdrawing part 210 and a first plating spreading part 410 electrically connected to the second withdrawing part 220. It may include a 2 plating spreading part 420. Hereinafter, a configuration commonly applied to the first and second plating spreading portions 410 and 420 will be described as the plating spreading portion 400.

The first plating spreading part 410 may be formed to be electrically connected to the first lead part 210 and the first external electrode 310 through plating, and the second plating spreading part 420 May be formed to be electrically connected to the second lead part 220 and the second external electrode 320 through plating.

At this time, the plating material may be a conductive material, and silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), or platinum (Pt ), etc. may be in a single or mixed form.

On the other hand, the length of the plating spread portion 400 in the thickness direction may be longer than the length from the lower surface of the ceramic body 100 to the first and second lead portions 210 and 220, and the ceramic body 100 ) May be shorter than the length in the thickness direction.

In addition, although FIG. 1 shows that the first and second plating spreading portions 410 and 420 have the same length in the thickness direction, they are not necessarily the same, and the first and second lead portions 210 and 220 are ceramic Lengths of the first and second plating spreading portions 410 and 420 in the thickness direction may vary according to positions exposed from both sides of the body 100 in the length direction.

FIG. 2 is a diagram illustrating a cross-section of the chip-shaped coil component shown in FIG. 1 when cut in the longitudinal direction.

Referring to FIG. 2, the ceramic body 100 may be formed by stacking a plurality of insulating layers having an internal coil pattern formed thereon. In this case, the internal coil patterns formed on the plurality of insulating layers may be electrically connected to each other through via electrodes, and may be stacked according to the stacking direction to form a spiral internal coil part 200.

As described above in FIG. 1, the plating spreading part 400 may be formed on both sides of the ceramic body 100 in the longitudinal direction, and the first and second lead-out parts 210 and 220 and the first and second 2 The external electrodes 310 and 320 may be electrically connected respectively.

At this time, in the chip-type coil component according to an embodiment of the present invention, the external electrode 300 is formed on the lower surface of the ceramic body 100, and the plating spreading part 400 electrically connected to the external electrode 300 is As they are formed on both sides of the ceramic body 100 in the longitudinal direction, external electrodes or plating spreading portions may not be formed on the upper surface of the ceramic body 100.

Accordingly, after the chip-type coil component according to an embodiment of the present invention is mounted on a substrate, a short circuit with a metal can formed on the upper surface of the ceramic body 100 can be prevented in order to remove radiation noise.

3 is a perspective view showing in more detail the chip-shaped coil component shown in FIG. 1.

Referring to FIG. 3, the chip-type coil component according to an embodiment of the present invention may further include a marking pattern 500 formed on an upper surface of the ceramic body 100.

In FIG. 3, the marking pattern 500 is shown to be located on a part of the upper surface of the ceramic body 100 in a rectangular shape, but the shape and position are not limited to those shown in FIG. 3.

The marking pattern 500 is for identifying a surface on which the first and second lead-out portions 210 and 220 on which the first and second plating spread portions 400 are to be formed are exposed, as shown in FIG. 3. As such, it may be formed on the upper surface of the ceramic body 100. In addition, since the position is not limited as described above, it may be formed on the lower surface of the ceramic body 100.

That is, the marking pattern 500 may be formed on one surface parallel to the stacked surface of the ceramic body 100.

4 is a view in which the insulating layer 600 is added in the cross-sectional view shown in FIG. 2.

Referring to FIG. 4, the chip-type coil component according to the present invention may further include an insulating layer 600 positioned in a region of the ceramic body 100 in which the external electrode 300 and the plating spreading part 400 are not formed. have.

In more detail, the insulating layer 610 may be formed on the lower surface of the ceramic body 100 in a region where the first and second external electrodes 310 and 320 are not formed.

Also, an insulating layer 620 may be formed on the upper surface of the ceramic body 100. In this case, the insulating layer 620 may be formed to identify the marking pattern 500.

This will be described with reference to FIGS. 5A to 5D.

5A is a view showing a top surface of a chip-type coil component according to an embodiment of the present invention.

Referring to FIG. 5A, in the chip-shaped coil component according to an embodiment of the present invention, a marking pattern 500 may be formed on an upper surface, and an insulating layer 620 may be formed in a portion where the marking pattern 500 is not formed. I can.

5B is a view showing a lower surface (mounting surface) of a chip-type coil component according to an embodiment of the present invention.

Referring to FIG. 5B, first and second external electrodes 310 and 320 may be formed on the lower surface of the chip-shaped coil component according to an embodiment of the present invention, and first and second external electrodes 310 and 320 may be formed. The insulating layer 620 may be formed in the region in which this is not formed.

5C is a view showing one side in the width direction of a chip-type coil component according to an embodiment of the present invention.

Referring to FIG. 5C, in the chip-type coil component according to an embodiment of the present invention, insulating layers may be formed on both sides of the ceramic body 100 in the width direction.

That is, the chip-type coil component according to an embodiment of the present invention may further include an insulating layer positioned in a region in which the plating spreading part 400 and the external electrode 300 are not formed, thereby improving plating spreading. I can.

5D is a view showing one side in the longitudinal direction of a chip-shaped coil component according to an embodiment of the present invention.

Referring to FIG. 5D, in the chip-type coil component according to an embodiment of the present invention, plating spreading portions 400 may be formed on both sides of the ceramic body 100 in the longitudinal direction, and specifically, the first plating spreading portion The 410 may be electrically connected to the first withdrawal part 210.

In this case, an insulating layer 620 may be additionally formed on both sides of the ceramic body 100 in the length direction according to the length of the first plating spread portion 410 in the thickness direction.

On the other hand, if the first plating spreading portion 410 covers all of the side surfaces of the ceramic body 100 in the length direction, the insulating layer 620 may not be formed.

Manufacturing method of chip type coil component

6A to 6E are views for explaining a method of manufacturing a chip-type coil component according to an embodiment of the present invention.

7 is a flow chart showing a method of manufacturing a chip-type coil component according to an embodiment of the present invention.

First, referring to FIGS. 7 and 6A, a plurality of insulator sheets may be provided (S100 ).

The magnetic material used for manufacturing the insulator sheet is not particularly limited, and for example, Mn-Zn ferrite, Ni-Zn ferrite, Ni-Zn-Cu ferrite, Mn-Mg ferrite, Ba ferrite, Li ferrite, etc. Known ferrite powders of can be used.

A plurality of insulator sheets may be prepared by applying and drying a slurry formed by mixing the magnetic material and the organic material on a carrier film.

Next, an internal coil pattern may be formed on the insulator sheet (S200).

The internal coil pattern may be formed by applying a conductive paste containing a conductive metal onto the insulator sheet t by a printing method or the like. The conductive paste may be printed using a screen printing method or a gravure printing method, and the present invention is not limited thereto.

The conductive metal is not particularly limited as long as it has excellent electrical conductivity, and for example, silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper ( Cu) or platinum (Pt) may be used alone or in a mixed form.

Each insulating layer on which the internal coil pattern is printed has a via formed at a predetermined position, and the internal coil patterns formed in each insulating layer through the via are electrically interconnected to have one internal coil part 200. The ceramic body 100 may be formed (S300).

The first lead-out portion 210 and the second lead-out portion 220 of the internal coil portion 200 formed as a single coil may be exposed to both sides of the ceramic body 100 in the length direction, respectively.

Thereafter, a marking pattern 500 may be formed on the upper surface of the ceramic body 100 (S310). The exposed surfaces of the first and second lead-out portions 210 and 220 of the internal coil unit 200 can be identified through the marking pattern 500, thereby forming the ceramic body 100 with the plating spreading portion 400. Can be aligned in the direction to form.

Meanwhile, the shape and position of the marking pattern 500 are not limited to those shown in FIG. 6A.

Referring to FIG. 6B, an insulating layer 620 may be formed on a region of the upper surface of the ceramic body 100 in which the marking pattern 500 is not formed (S320 ).

Further, referring to FIG. 6C, an external electrode 300 may be formed on the lower surface of the ceramic body 100 (S400 ). The external electrode 300 may be formed using a conductive paste containing a metal having excellent electrical conductivity. For example, nickel (Ni), copper (Cu), tin (Sn) or silver (Ag) may be used alone. Alternatively, it may be a conductive paste containing an alloy thereof.

The first and second external electrodes 310 and 320 may be formed to be spaced apart from each other by a predetermined distance from the lower surface of the ceramic body 100.

Thereafter, an insulating layer 610 may be further formed on a region of the lower surface of the ceramic body 100 on which the first and second external electrodes 310 and 320 are not formed (S410).

However, as described above in FIGS. 7 and 6A to 6D, the method of manufacturing a chip-type coil component according to the present invention is described, but the order is not limited thereto. That is, before forming the marking pattern 500 on the upper surface of the ceramic body 100, the external electrode 300 may be first formed on the lower surface of the ceramic body 100.

Next, referring to FIG. 6E, a polishing process may be performed on a plurality of corners a positioned on both sides of the ceramic body 100 in the width direction (S420).

Thereafter, an insulating layer may be applied to both sides of the ceramic body 100 in the width direction (S430). Further, grinding may be performed on each of the first and second lead-out portions 210 and 220 exposed to both sides of the ceramic body 100 in the longitudinal direction (S440). In more detail, it is possible to remove the coating layer to prevent foreign matter and plating spread.

Further, referring to FIG. 6E, after removing the coating layer for preventing foreign matter and plating spreading, the first lead portion 210 and the first external electrode 310 may be electrically connected through plating. Similarly, the second lead 220 and the second external electrode 320 may be electrically connected through plating (S500).

In addition, portions that are the same as those of the multilayer electronic component according to the exemplary embodiment described above will be omitted here.

The present invention is not limited by the embodiments, and various types of substitutions and modifications are possible by those of ordinary skill in the art, and are not described in the present embodiment as long as they represent the same or equivalent idea. Even if it should be construed within the scope of the present invention, components described in the embodiments of the present invention but not described in the claims are not limitedly interpreted as essential components of the present invention.

100: ceramic body
200: internal coil part
210: first drawing unit
220: second withdrawal unit
300: external electrode
310, 320: first external electrode, second external electrode
400: plating spread

Claims (12)

A ceramic body including a plurality of insulating layers, and having a lower surface provided as a mounting surface and an upper surface opposed thereto;
An internal coil unit positioned inside the ceramic body and having first and second lead-out portions exposed to both side surfaces of the ceramic body in a longitudinal direction;
An external electrode disposed on a lower surface of the ceramic body; And
Plating spreading portions formed in contact with both side surfaces of the ceramic body in the longitudinal direction and connected to the first and second lead portions and the external electrodes, respectively; Including,
The length of the plating spreading portion in the thickness direction,
A chip-shaped coil component that is longer than a length from a lower surface of the ceramic body to the first and second lead portions and is shorter than a length in a thickness direction of the ceramic body.
The method of claim 1, wherein the plating spreading part,
A chip-shaped coil component comprising at least one selected from the group consisting of platinum (Pt), copper (Cu), silver (Ag), and palladium (Pd).
The method of claim 1,
A marking pattern disposed on an upper surface or a lower surface of the ceramic body; Chip type coil component further comprising a.
The method of claim 1,
An insulating layer positioned on the ceramic body in a region where the external electrode and the plating spread portion are not formed; Chip type coil component further comprising a.
Providing an insulator sheet;
Forming an inner coil pattern on the insulator sheet;
Ceramic having a lower surface provided as a mounting surface and an upper surface opposed thereto, including an internal coil unit having a first lead-out portion and a second lead-out portion exposed to both sides in a length direction by stacking the insulator sheet on which the internal coil pattern is formed Forming a body;
Forming an external electrode on a lower surface of the ceramic body; And
Connecting the first and second lead-out portions and the external electrode through plating; Including,
The step of connecting the first and second lead-out portions and the external electrode,
The first and second lead-out portions and the plating spread portions respectively contact-connected to the external electrode are formed by plating to contact both sides of the ceramic body in the longitudinal direction,
The length of the plating spreading portion in the thickness direction,
A method of manufacturing a chip-shaped coil component that is longer than a length from a lower surface of the ceramic body to the first and second lead portions and is shorter than a length in a thickness direction of the ceramic body.
The method of claim 5,
Forming a marking pattern on the upper surface of the ceramic body; And
Forming an insulating layer on a region of the upper surface of the insulating sheet in which the marking pattern is not formed; A method of manufacturing a chip-type coil component further comprising a.
The method of claim 5,
Forming an insulating layer on a lower surface of the ceramic body in which the external electrode is not formed; A method of manufacturing a chip-type coil component further comprising a.
The method of claim 5,
Polishing a plurality of edges positioned on both side surfaces of the ceramic body in the width direction;
Forming insulating layers on both sides of the ceramic body in the width direction; And
Removing the coating layer formed on the first and second lead portions; A method of manufacturing a chip-type coil component further comprising a.
The method of claim 5,
The external electrode is a method of manufacturing a chip-type coil component formed using one of a printing method and a transfer method.
The method of claim 5,
The plating spreading part,
A method of manufacturing a chip-shaped coil component formed on both sides of the ceramic body in a length direction by performing plating using a plurality of conductive materials.
The method of claim 10,
Further forming a plating film having a multilayer structure by performing one or more kinds of plating on the plating spread; A method of manufacturing a chip-type coil component further comprising a.
The method of claim 10, wherein the plating spreading part,
A method of manufacturing a chip-type coil component comprising at least one selected from the group consisting of platinum (Pt), copper (Cu), silver (Ag), and palladium (Pd).

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