KR102189803B1 - Capacitor component - Google Patents

Abstract

The capacitor component according to an exemplary embodiment of the present disclosure is disposed on both sides of a capacitor including first and second external electrodes and a capacitor body, and first and second conductivity in which one surface is coupled to the first and second external electrodes. And a connection terminal including a frame and a flexible substrate disposed on the other surfaces of the first and second conductive frames. The connection terminal may include a flexible substrate to reduce the vibration of the capacitor transmitted to the substrate, thereby reducing the noise of the substrate.

Description

Capacitor component {CAPACITOR COMPONENT}

The present disclosure relates to capacitor components.

The capacitor has a structure in which internal electrodes of different polarities are alternately stacked between a plurality of dielectric layers. Such a multilayer electronic component device is widely used as a component of various electronic devices due to the advantages of miniaturization, high capacity, and easy mounting.

However, in the case of a capacitor using a ferroelectric material as a material, vibration noise (acoustic noise) caused by a piezoelectric phenomenon is a problem in some electronic devices.

In the acoustic noise, vibrations caused by the capacitor may be transmitted to the circuit board through solder, and noise may be generated by the vibration of the substrate. In order to reduce acoustic noise, a connection terminal capable of absorbing vibration may be additionally disposed between the capacitor and the circuit board. By arranging the connection terminals, it is possible to reduce the board noise by preventing the vibration of the capacitor from being transmitted to the board well.

In order to reduce the transmission of the vibration of the capacitor to the circuit board, the elastic modulus of the connection terminal (K; K=Y*a*t ³ /4L ³ , Y: Young's modulus, a: width, t: thickness, L: distance) must be small. do. The modulus of elasticity is proportional to the Young's modulus, and when the Young's modulus is low, the modulus of elasticity decreases.

The connection terminal electrically connects the capacitor and the circuit board, and may be made of a conductive metal. In general, the conductive metal has a high Young's modulus. For this reason, it is necessary to reduce the thickness (t) and width (a) of the connection terminal, or increase the distance (L), but this is limited in change due to the reliability and size standards of the product.

Therefore, there is a need for a way to reduce the vibration transmission of the capacitor without changing the size of the connection terminal.

The following Patent Documents 1 and 2 relate to capacitor components.

Japanese Published Patent Publication No. 2012-033660 Japanese Laid-Open Patent Publication No. 2000-182888

Meanwhile, the vibration of the capacitor is transmitted to the circuit board, causing the board to vibrate, which may cause noise in the board.

One of the various objects of the present disclosure is to provide a capacitor component capable of preventing such board noise.

One of the various solutions proposed through the present disclosure is to arrange a flexible substrate on one side of the conductive frame, thereby reducing the vibration of the capacitor from being transmitted to the substrate without increasing the length of the connection terminal, and reducing the noise of the substrate. have.

The capacitor component according to an exemplary embodiment of the present disclosure may reduce vibrations of the capacitor from being transmitted to the substrate without increasing the length of the connection terminal, thereby reducing noise of the substrate.

1 is a schematic perspective view of a capacitor component according to an embodiment of the present disclosure.
FIG. 2 schematically illustrates a cross-sectional view of a capacitor component in a direction AA′ of FIG. 1.
3 is a schematic cross-sectional view of a capacitor component according to another exemplary embodiment of the present disclosure.
4 is a schematic cross-sectional view of a capacitor component according to another exemplary embodiment of the present disclosure.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings. In the drawings, the shapes and sizes of elements may be exaggerated for clearer explanation.

1 schematically illustrates a perspective view of a capacitor component according to an embodiment of the present disclosure, and FIG. 2 schematically illustrates a cross-sectional view of the capacitor component in a direction AA′ of FIG. 1.

1 and 2, a capacitor component according to an embodiment of the present disclosure includes a capacitor body 12 and a second external electrode 14 disposed on at least two side surfaces of the capacitor body 12 opposite to each other. A capacitor 10 including ); And first and second conductive frames 120a and 120b disposed on both sides of the capacitor 10 and having one surface coupled to the first and second external electrodes 14 and the first and second conductive frames. And a connection terminal including the flexible substrates 130a and 130b disposed on the other surfaces of the 120a and 120b.

The capacitor body 12 is formed by stacking a plurality of dielectric layers (not shown).

The plurality of dielectric layers constituting the capacitor body 12 are in a sintered state, and the boundary between adjacent dielectric layers may be integrated so as not to be visible with the naked eye.

The dielectric layer may be formed by firing a ceramic green sheet including ceramic powder, an organic solvent, and an organic binder. The ceramic powder may include a perovskite material as a material having a high dielectric constant. The perovskite material is not limited thereto, but may be a barium titanate (BaTiO ₃ ) based material, a strontium titanate (SrTiO ₃ ) based material, or the like.

An internal electrode (not shown) is formed inside the capacitor body 12.

The internal electrodes may include a first internal electrode having a first polarity and a second internal electrode having a second polarity as a pair, and may be disposed to face each other with a dielectric layer therebetween.

The first and second internal electrodes may be exposed to both sides of the capacitor and may be electrically connected to the first and second external electrodes, respectively.

The first and second internal electrodes may be formed of a conductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof, but is not limited thereto.

The internal electrodes may be printed with a conductive paste on the ceramic green sheet forming the dielectric layer through a printing method such as a screen printing method or a gravure printing method.

The ceramic green sheets on which the internal electrodes are printed may be alternately stacked and fired to form a capacitor body.

The layered electronic component device 10 includes first and second external electrodes 14 formed to be connected to first and second internal electrodes exposed to both sides of the capacitor body 12, respectively.

The first and second external electrodes 14 are formed on both sides of the capacitor body 12 to be connected to the first and second internal electrodes, respectively, and extend to the upper and lower surfaces of the capacitor body 12. However, it is not limited thereto.

That is, the first and second external electrodes 14 may extend to one or more of both side surfaces, upper and lower surfaces, and both end surfaces of the capacitor body 12.

Accordingly, the first and second external electrodes 14 are connected to the first and second internal electrodes exposed to both sides of the capacitor body 12 and surround both end surfaces and upper and lower surfaces of the capacitor body 12. Can be formed while.

The first and second external electrodes 14 may be formed of a conductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), tin (Sn), or an alloy thereof, but is not limited thereto.

The conductive paste may further include an insulating material, for example, the insulating material may be glass.

The process of forming the first and second external electrodes may be performed after forming the display unit on the capacitor body.

The method of forming the first and second external electrodes may be formed by applying an external electrode paste to the capacitor body, or may be formed using other methods such as plating.

In general, in order to reduce the vibration of the circuit board due to the vibration of the capacitor, the capacitor may be electrically connected to a connection terminal made of a conductive metal. The metal connection terminal may have an L shape, and the vibration of the capacitor can be absorbed by the metal connection terminal by separating the capacitor from the circuit board, thereby reducing the transmission of vibration to the circuit board.

However, since the conductive metal is mainly composed of an Fe-based metal component, it has a high Young's modulus (Y) of around 200 GPa, thereby increasing the elastic modulus of the connection terminal made of the metal. For this reason, the effect of reducing the vibration of the capacitor from being transmitted to the circuit board may be insufficient.

The connection terminal 100 of the present disclosure includes flexible substrates 130a, 130b, and 130c having a low Young's modulus (Y), so that the length of the connection terminal can be reduced, and a low modulus of elasticity (K) can be implemented. . Accordingly, it is possible to reduce the vibration of the capacitor 10 transmitted to the circuit board.

That is, when the flexible substrate is included in the connection terminal, the separation distance between the capacitor and the circuit board can be reduced, and acoustic noise of the capacitor component can be reduced.

The first and second conductive frames 120a and 120b may have an L shape, and may have a step difference on one side and the other side.

One surface of the first and second conductive frames 120a and 120b may be electrically connected to the first and second external electrodes 14 through solder.

Solder 140 may be formed on the land area 142 required for soldering the component in order to mount the component on the circuit board. The first and second conductive frames 120a and 120b may be electrically connected to the circuit board 150 through solder 140 formed on the land 142.

The first and second conductive frames 120a and 120b may be conductive metal, but are not limited thereto, but may be nickel (Ni), copper (Cu), palladium (Pd), or an alloy thereof, but are limited thereto. no.

The flexible substrates 130a, 130b, and 130c may be disposed to cover portions of the first and second conductive frames 120a and 120b where a step is formed on one surface and the other surface.

The flexible substrates 130a, 130b, 130c may be a flexible printed circuit board (FPCB), and a flexible copper clad laminated (FCCL), a polyimide resin, and a copper sheet may be used. It may be alternately stacked.

The flexible substrates 130a, 130b, and 130c may be integrated with the first and second conductive frames 120a and 120b, and in this case, the connection terminal 100 may have a U shape.

The flexible substrates 130a, 130b, and 130c may include a thermosetting resin and a conductive metal.

The thermosetting resin may be one selected from an epoxy resin, a phenol resin, and a polyimide resin.

The conductive metal may be copper (Cu), silver (Ag), gold (Au), aluminum (Al), or an alloy thereof, but is not limited thereto.

The thermosetting resin may maintain heat resistance, chemical resistance, and the like, and may have a flexible appearance with low elasticity, and the conductive metal may enable electrical connection.

In the flexible substrates 130a, 130b, 130c, the thermosetting resin has a Young's modulus (Y) of around 2.5 GPa, and the conductive metal has a Young's modulus (Y) of around 120 GPa, so the Young's modulus (Y) of the connection terminal is 3 to 120 GPa. Can be

Accordingly, the connection terminal 100 of the present disclosure may have a reduced Young's modulus than that of a conventional metal connection terminal, and acoustic noise can be reduced even when the length of the connection terminal is reduced to a level of at least 15% and maximum 85% compared to the prior art. Can be secured.

That is, the connection terminal can reduce the height of the capacitor component, thereby improving the inefficiency of using a circuit space.

Table 1 shows the length of the connection terminal according to the Young's modulus (Y) of the connection terminal, assuming that the width (a), thickness (t), and elastic modulus (K) of the connection terminal are the same.

The comparative example is a connection terminal made of metal, and the example is a connection terminal including a flexible substrate.

division Width of connection terminal (a)
[mm] Connection terminal thickness (t)
[mm] Young's modulus (Y)
[GPa] Length of connection terminal (L)
[Relative value] Comparative example



1.6








0.12




200 1.00 Example 1 120 0.84 Example 2 100 0.79 Example 3 80 0.74 Example 4 60 0.67 Example 5 40 0.58 Example 6 20 0.46 Example 7 10 0.37 Example 8 5 0.29 Example 9 3 0.25

In Table 1 above, it can be seen that the Example has a lower Young's modulus (Y) than the comparative example, and assuming that each connection terminal has the same effect of suppressing the generation of vibration noise, in the Example, the lower the Young's modulus, the shorter the length of the connection terminal. I can.

3 is a schematic cross-sectional view of a capacitor component according to another embodiment of the present disclosure, and FIG. 4 is a schematic cross-sectional view of a capacitor component according to another embodiment of the present disclosure.

Among the components shown in FIGS. 3 and 4, descriptions of the same components as those shown in FIG. 1 will be omitted.

Referring to FIG. 3, a capacitor 10 including a capacitor body 12 and first and second external electrodes 14 disposed on two side surfaces of the capacitor body 12 facing each other; And first and second conductive frames 220a and 220b disposed on both sides of the capacitor body 12 and having one surface coupled to the first and second external electrodes 14 and the first and second conductive frames. And a connection terminal including the flexible substrates 230a, 230b, and 230c disposed on the other surfaces of the frames 220a and 220b.

The first and second conductive frames 220a and 220b may have a U-shape.

The first and second conductive frames 220a and 220b may be disposed in a direction in which an open portion in a U shape faces inwardly.

The flexible substrates 230a, 230b, 230c may be integrated with the first and second conductive frames 220a, 220b, and at this time, the connection terminal 200 may be disposed in a ㅡ shape under the capacitor 10. have.

The flexible substrates 230a, 230b, and 230c may include a thermosetting resin and a conductive metal. Accordingly, the connection terminal 200 may have a Young's modulus (Y) of 3 to 120 GPa, so that vibrations can be prevented from being transmitted to the substrate, thereby reducing acoustic noise of the capacitor component.

The connection terminals 200 are spaced apart from the circuit board 250 by a predetermined distance. At this time, the distance between the connection terminal 200 and the circuit board 250 may be greater than 0 to prevent the capacitor from tilting to one side and may be smaller than the height of the solder 240 (0<distance between the connection terminal and the circuit board< Twice the height of the solder).

Referring to FIG. 4, the first and second conductive frames 320a and 320b may have one surface coupled to the first and second external electrodes 14.

The first and second conductive frames 320a and 320b may be disposed facing each other in a shape with a U-shaped open portion facing outward.

The flexible substrates 330a, 330b, 330c, 335a, 335b include base layers 330a, 330b, 330c disposed on the other surfaces of the first and second conductive frames, and covers disposed on one surface of the first and second conductive frames. Layers 335a and 335b may be included.

The base layers 330a and 330b may be formed to cover an inner surface of the U-shape of the first and second conductive frames 320a and 320b.

An air gap may be formed between the base layer formed on the other upper surface and the base layer formed on the other lower surface in the U shape of the first and second conductive frames 320a and 320b.

The cover layers 335a and 335b may be formed to cover an outer surface of the U-shape of the first and second conductive frames 320a and 320b.

The flexible substrates 330a, 330b, 330c, 335a, 335b may be integrated with the first and second conductive frames 320a and 320b, and at this time, the connection terminal 300 may have an H shape.

The connection terminal 300 is disposed on the lower surface of the capacitor 10 to electrically connect the capacitor 10 and the circuit board 350.

The present disclosure is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited by the appended claims.

Therefore, various types of substitutions, modifications and changes will be possible by those of ordinary skill in the art within the scope not departing from the technical spirit of the present disclosure described in the claims, and this also belongs to the scope of the present disclosure. something to do.

10: capacitor
12: capacitor body
14: external electrode
100, 200, 300: connection terminal
110, 210, 310: solder
120a, 120b, 220a, 220b, 320a, 320b: first and second conductive frames
130a, 130b, 130c, 230a, 230b, 230c: flexible substrate
330a, 330b, 330c: base layer
335a, 335b: cover layer
140, 240, 340: solder
142.242.342: Rand
150, 250, 350: circuit board

Claims (10)

A capacitor including a capacitor body and first and second external electrodes disposed on at least two side surfaces of the capacitor body opposite to each other; And
A connection comprising first and second conductive frames disposed on both sides of the capacitor body and having one surface coupled to the first and second external electrodes, and a flexible substrate disposed on the other surface of the first and second conductive frames A capacitor component including a terminal.
The method of claim 1,
The connection terminal is a capacitor component having a U shape.
The method of claim 1,
A capacitor component having a Young's modulus (Y) of 3 to 120 GPa of the connection terminal.
The method of claim 1,
The flexible substrate is a capacitor component comprising a thermosetting resin and a conductive metal.
A capacitor including a capacitor body and first and second external electrodes disposed on at least two side surfaces of the capacitor body opposite to each other; And
It is disposed below the mounting surface of the capacitor body and includes first and second conductive frames having one surface coupled to the first and second external electrodes, and a flexible substrate disposed on the other surface of the first and second conductive frames. Capacitor component including;
The method of claim 5,
The first and second conductive frames are capacitor components having a U shape.
The method of claim 5,
The flexible substrate is a capacitor component formed to be integrated with the first and second conductive frames.
The method of claim 6,
A capacitor component having a Young's modulus (Y) of 3 to 120 GPa of the connection terminal.
The method of claim 6,
A capacitor component in which the connection terminal is integral.
The method of claim 6,
The flexible substrate is a capacitor component comprising a thermosetting resin and a conductive metal.

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