CN114446642A

CN114446642A - Capacitor assembly, circuit board assembly and display device

Info

Publication number: CN114446642A
Application number: CN202210170565.9A
Authority: CN
Inventors: 冉睿迪; 郑浩旋
Original assignee: HKC Co Ltd; Chongqing HKC Optoelectronics Technology Co Ltd
Current assignee: HKC Co Ltd; Chongqing HKC Optoelectronics Technology Co Ltd
Priority date: 2022-02-23
Filing date: 2022-02-23
Publication date: 2022-05-06

Abstract

The application provides a capacitor assembly, a circuit board assembly and a display device. The capacitance assembly includes: the capacitor comprises a dielectric part, a first electrode and a second electrode, wherein the first electrode wraps one end of the dielectric part, the second electrode wraps the other end of the dielectric part, the second electrode is arranged opposite to the first electrode, and the second electrode, the first electrode and the dielectric part form a first accommodating space together; and the first damping piece is arranged in the first accommodating space and fixedly connected with the dielectric part. According to the capacitor assembly, the vibration amplitude and frequency of the capacitor can be reduced through the first vibration reduction piece, and squeaking generated in the working process of the capacitor is restrained or even eliminated.

Description

Capacitor assembly, circuit board assembly and display device

Technical Field

The application relates to the field of display panels, in particular to a capacitor assembly, a circuit board assembly and a display device.

Background

With the progress of technology, electronic devices having display devices have become daily necessities for people. The display device generates a "creaking" sound during operation, which is called "howling". One of the reasons for the "squeal" is the vibration of the capacitor. Howling thus shows that the quality of the display device is not high in the related art due to the presence of "howling".

Disclosure of Invention

In a first aspect, the present application provides a capacitor assembly, where the capacitor assembly includes a capacitor and a first vibration damping member, the capacitor includes a dielectric portion, a first electrode and a second electrode, the first electrode wraps one end of the dielectric portion, the second electrode wraps the other end of the dielectric portion, the second electrode is disposed opposite to the first electrode, the second electrode, the first electrode and the dielectric portion together form a first accommodating space, the first vibration damping member is disposed in the first accommodating space, and the first vibration damping member is fixedly connected to the dielectric portion.

The capacitor assembly further includes a second damping member, the second damping member is disposed in the second receiving space, and the second damping member abuts against the dielectric portion and the first electrode.

The capacitor assembly further includes a third damping member, the third damping member is disposed in the third accommodating space, and the third damping member abuts against the dielectric portion and the first electrode.

The capacitor assembly further includes a fourth damping member, the fourth damping member is disposed in the fourth accommodating space, and the fourth damping member abuts against the dielectric portion and the first electrode.

The capacitor assembly further includes a fifth damping member, the fifth damping member is disposed in the fifth accommodating space, and the fifth damping member abuts against the dielectric portion and the second electrode.

The capacitor assembly further includes a sixth damping member, the sixth damping member is disposed in the sixth accommodating space, and the sixth damping member abuts against the dielectric portion and the second electrode.

The capacitor assembly further includes a seventh damping member, the seventh damping member is disposed in the seventh accommodating space, and the seventh damping member abuts against the dielectric portion and the second electrode.

Wherein a gap exists between the first vibration damping member and the first electrode, and a gap exists between the first vibration damping member and the second electrode.

In a second aspect, the present application further provides a circuit board assembly, which includes a circuit board and the capacitor assembly according to the first aspect, wherein the capacitor assembly is electrically connected to the circuit board.

In a third aspect, the present application further provides a display device, which includes a display panel and the circuit board assembly according to the second aspect, and the circuit board assembly is electrically connected to the display panel.

The capacitor assembly provided by the first aspect of the present application includes a capacitor and a first damping member. The capacitor comprises a dielectric part, a first electrode and a second electrode, a first accommodating space is formed among the first electrode, the second electrode and the dielectric part, the first damping piece is arranged in the first accommodating space, and the first damping piece is fixedly connected with the dielectric part. Because the first vibration damping piece is fixedly connected to the dielectric part of the capacitor, the vibration amplitude and frequency of the capacitor are reduced. In addition, when the capacitor works, the vibration of the capacitor drives the first vibration damping piece to vibrate together, so that a deformation quantity generated by the vibration of the capacitor is transmitted to the air in the first accommodating space, the air in the first accommodating space is repeatedly compressed and released along with the vibration of the first vibration damping piece, and in the process, friction is generated among the air, the first vibration damping piece and the air molecules, so that a damping force for the vibration of the first vibration damping piece is formed, and the amplitude and the frequency of the vibration of the first vibration damping piece are suppressed. Therefore, the capacitor assembly provided by the application can reduce the vibration amplitude and frequency of the capacitor through the first vibration reduction piece, so that squeaking generated in the working process of the capacitor is suppressed or even eliminated. When the capacitor assembly is applied to a display device, the quality of the display device is higher.

The circuit board assembly provided by the second aspect of the present application comprises a circuit board and the capacitor assembly as described in the first aspect, wherein the capacitor assembly is applied to the circuit board assembly, and the first vibration reduction member not only can reduce the vibration amplitude and frequency of the capacitor, but also can play a role in buffering between the capacitor and the circuit board to suppress or even eliminate the resonance between the capacitor and the circuit board, thereby suppressing or even eliminating the squeal generated when the capacitor works on the circuit board.

A third aspect of the present application provides a display device including a display panel and the circuit board assembly according to the second aspect, wherein the circuit board assembly is applied to the display device, the first vibration reduction member reduces the amplitude and frequency of vibration of the capacitor and the circuit board, and suppresses or even eliminates resonance between the capacitor and the circuit board, thereby suppressing or even eliminating howling generated when the capacitor operates in the display device.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a chip multilayer capacitor in the related art.

Fig. 2 is a schematic diagram of a chip multilayer capacitor in the related art vibrating.

Fig. 3 is a schematic structural diagram of a capacitor assembly according to a first embodiment of the present disclosure.

Fig. 4 is a schematic structural diagram of a capacitor module according to a second embodiment of the present disclosure.

Fig. 5 is a schematic structural view illustrating a second damping member disposed in a second accommodating space of the capacitor module according to the embodiment of fig. 4.

Fig. 6 is a schematic structural diagram of a capacitor module according to a third embodiment of the present disclosure.

Fig. 7 is a schematic structural view illustrating a third damping member disposed in a third accommodating space of the capacitor module according to the embodiment of fig. 6.

Fig. 8 is a schematic structural diagram of a capacitor module according to a fourth embodiment of the present disclosure.

Fig. 9 is a schematic structural view of a fourth damping member disposed in a fourth accommodating space in the capacitor module according to the embodiment of fig. 8.

Fig. 10 is a schematic structural diagram of a capacitor module according to a fifth embodiment of the present application.

Fig. 11 is a schematic structural view illustrating a fifth damping member disposed in a fifth accommodating space of the capacitor module according to the embodiment of fig. 10.

Fig. 12 is a schematic structural diagram of a capacitor module according to a sixth embodiment of the present application.

Fig. 13 is a schematic structural view illustrating a sixth damping member disposed in a sixth accommodating space of the capacitor module according to the embodiment of fig. 12.

Fig. 14 is a schematic structural diagram of a capacitor module according to a seventh embodiment of the present application.

Fig. 15 is a schematic structural view illustrating a seventh damping member disposed in a seventh accommodating space of the capacitor module according to the embodiment of fig. 14.

Fig. 16 is a schematic structural diagram of a capacitor module according to an eighth embodiment of the present application.

Fig. 17 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application.

Fig. 18 is a circuit block diagram of a display device according to an embodiment of the present application.

Reference numerals: a display device 1; a circuit board assembly 10; a display panel 20; a capacitive component 100; a circuit board 200; a capacitor 110; a first damping member 120; a second damping member 130; a third damping member 140; a fourth damping member 150; a fifth vibration damping member 160; a sixth damping member 170; a seventh damping member 180; the dielectric portion 111; a first electrode 112; a second electrode 113; a first accommodating space 114; a void 115; an inner electrode 1111; media 1112; a second accommodating space 1121; the third accommodating space 1122; a fourth accommodation space 1123; the fifth accommodating space 1131; the sixth receiving space 1132; the seventh accommodating space 1133.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a chip multilayer capacitor in the related art; fig. 2 is a schematic diagram illustrating a vibration of a chip multilayer capacitor in the related art. The capacitor 110 generally includes the dielectric portion 111, the first electrode 112, and the second electrode 113. The dielectric portion 111 includes an inner electrode 1111 and a dielectric 1112. The medium 1112 may be, but is not limited to, ceramic. The capacitor 110 is formed by stacking dielectric films provided with inner electrodes 1111 in a staggered manner, forming a dielectric part 111 with the inner electrodes 1111 wrapped by the dielectric 1112 through one-time high-temperature sintering, and sealing the first electrode 112 and the second electrode 113 at two ends of the dielectric part 111. When the capacitor 110 is powered on, a voltage generates an electric field (e.g., E1 and E2 in fig. 2) on the inner electrode 1111, and the electric field acts on the inner electrode 1111 to form a mechanical force (e.g., F11, F12, F13, F21, F22 and F23 in fig. 2), i.e., a conversion between electrical energy and mechanical energy, i.e., an inverse piezoelectric effect. The mechanical force generated by the electric field on the inner electrode 1111 causes the inner electrode 1111 to slightly expand (as shown in d in fig. 2), and although the expansion amount of the inner electrode 1111 is small and is changed in a nanometer scale, the inner electrode 1111 repeatedly expands and contracts during the power-on process, so that the vibration frequency of the capacitor 110 is increased, and the capacitor 110 generates a howling sound. Note that expansion and contraction of the internal electrodes 1111 are mainly caused by the stacking direction of the internal electrodes 1111, that is, vibration of the capacitor 110 in the stacking direction of the internal electrodes 1111 is a factor of generating howling in the capacitor 110.

One embodiment of the present application provides a capacitive assembly 100. Referring to fig. 3, fig. 3 is a schematic structural diagram of a capacitor assembly according to a first embodiment of the present disclosure. The capacitor assembly 100 includes a capacitor 110 and a first damping member 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111.

The capacitor 110 according to an embodiment of the present disclosure is a chip multilayer Ceramic capacitor (MLCC). The capacitor 110 is a static charge storage medium, and the capacitor 110 is a wide-range electronic component that is indispensable in the fields of electronics and power. The capacitor 110 is mainly used in circuits such as power supply filtering, signal coupling, resonance, filtering, compensation, charging and discharging, energy storage, direct current isolation and the like.

First damping piece 120 is deformation damping material, namely, first damping piece 120 has elasticity and toughness good, can the damping resistance to compression, can resume former shape fast after producing deformation to the energy that produces the vibration of electric capacity 110 recovers the dissipation to the air through deformation and deformation. For example, the first damping member 120 is Expanded Polypropylene (EPP), Expandable Polyethylene (EPE), Polystyrene foam (EPS), or the like.

Specifically, the EPP material has good elasticity, good toughness, vibration resistance and compression resistance, high deformation recovery rate and good absorption performance, is high-temperature resistant (can normally work at the temperature of-40-130 ℃ at least), and can adapt to the high-temperature working environment of the capacitor 110. In addition, the EPP material is corrosion-resistant, acid-resistant and oil-resistant, and can adapt to severe working environment. Furthermore, EPP material is also an environmentally friendly material.

In the present embodiment, the first damping member 120 is fixedly connected to the dielectric portion 111, so that the first damping member 120 is prevented from loosening, which is beneficial for the first damping member 120 to damp the capacitor 110. For example, the first damping member 120 may be, but is not limited to, fixedly connected to the capacitor 110 by bonding, welding, or the like.

In the present embodiment, the first electrode 112, the second electrode 113 and the dielectric portion 111 together form the first accommodating space 114, the accommodating space is used for accommodating the first damping member 120, and the first damping member 120 is fixedly connected to the dielectric portion 111. The dimension of the first damping element 120 in the direction in which the first electrode 112 points to the second electrode 113 is greater than the dimension of the first damping element 120 in the direction in which the first damping element 120 points to the capacitor 110, so that the first damping element 120 has a larger contact area with the surface of the capacitor 110 on the side facing the first damping element 120, which facilitates the first damping element 120 damping the capacitor 110 in the direction in which the capacitor 110 points to the first damping element 120.

The capacitor assembly 100 provided by the present application includes a capacitor 110 and a first damping member 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112 and a second electrode 113, a first receiving space 114 is formed between the first electrode 112, the second electrode 113 and the dielectric portion 111, the first damping member 120 is disposed in the first receiving space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. Since the first damping member 120 is fixedly coupled to the dielectric portion 111 of the capacitor 110, the vibration amplitude and frequency of the capacitor 110 are reduced. In addition, when the capacitor 110 works, the vibration of the capacitor 110 drives the first vibration damping member 120 to vibrate together, so that the deformation generated by the vibration of the capacitor 110 is transmitted to the air in the first accommodating space 114. In addition, the air in the first receiving space 114 is repeatedly compressed and released along with the vibration of the first vibration damper 120, and in the process, friction occurs between the air and the first vibration damper 120 and between the air itself and molecules of the air, so that a damping force for the vibration of the first vibration damper 120 is formed, and the amplitude and frequency of the vibration of the first vibration damper 120 are suppressed. Since the first damping member 120 is fixedly coupled to the dielectric portion 111 of the capacitor 110, the vibration amplitude and frequency of the capacitor 110 are reduced. Therefore, the capacitor assembly 100 provided by the present application can reduce the vibration amplitude and frequency of the capacitor 110 through the first vibration damping member 120, so as to suppress or even eliminate the squeal generated during the operation of the capacitor 110. When the capacitor assembly 100 is applied to a display device, the quality of the display device is high.

Referring to fig. 4 and 5, fig. 4 is a schematic structural diagram of a capacitor device according to a second embodiment of the present disclosure; fig. 5 is a schematic structural view illustrating a second vibration damping member disposed in a second accommodating space of the capacitor module according to the embodiment of fig. 4. In the present embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. In addition, in the present embodiment, a second accommodating space 1121 is disposed inside the first electrode 112, and the second accommodating space 1121 and the first accommodating space 114 are both located on the same side of the dielectric portion 111, the capacitor assembly 100 further includes a second vibration damping member 130, the second vibration damping member 130 is disposed in the second accommodating space 1121, and the second vibration damping member 130 abuts against the dielectric portion 111 and the first electrode 112.

Please refer to the foregoing description for the capacitor 110 and the first damping element 120, which is not described herein again.

The second damping piece 130 is a deformation damping material, that is, the second damping piece 130 has elasticity and toughness good, can damp and resist pressure, and can restore the original shape after deformation is generated, so that the energy generated by vibration is restored and dissipated to the air through deformation and deformation. For example, the second vibration damper 130 is EPP, EPE, EPS, or the like. In the present embodiment, the material of the second damper 130 is the same as the material of the first damper 120, for example, the material of the second damper 130 and the material of the first damper 120 are both EPP. In other embodiments, the material of the second damping member 130 is different from the material of the first damping member 120.

In this embodiment, a dimension of the second damping member 130 in a direction in which the first electrode 112 points to the second electrode 113 is larger than a dimension of the second damping member 130 in a direction in which the second damping member 130 points to the capacitor 110, so that the second damping member 130 has a larger contact area with a surface of the capacitor 110 facing the second damping member 130, which is beneficial for the second damping member 130 to damp the capacitor 110 in a direction in which the capacitor 110 points to the first damping member 120.

In the present embodiment, the second vibration damper 130 is disposed in the second accommodating space 1121, and specifically, the second vibration damper 130 fills the entire second accommodating space 1121 such that the second vibration damper 130 abuts against the dielectric portion 111 and the first electrode 112. In addition, the second vibration damper 130 may have an air hole therein due to its material characteristics, and thus, in the process that the second vibration damper 130 vibrates along with the capacitor 110, the second vibration damper 130 may be deformed and restored through its internal air hole, thereby damping the capacitor 110.

When the capacitor 110 works, the vibration of the capacitor 110 drives the first vibration damping member 120 and the second vibration damping member 130 to vibrate together, so that the deformation generated by the vibration of the capacitor 110 is transmitted to the air in the first accommodating space 114 and the internal air holes of the second vibration damping member 130. In addition, the air in the first receiving space 114 and the air in the inner air holes of the second vibration damper 130 are repeatedly compressed and released along with the vibration of the first vibration damper 120 and the vibration of the second vibration damper 130, and in the process, the air generates friction with the first vibration damper 120, the second vibration damper 130 and the air itself, so that a damping force for the vibration of the first vibration damper 120 and the second vibration damper 130 is formed, and the amplitude and the frequency of the vibration of the first vibration damper 120 and the second vibration damper 130 are suppressed. Because the first damping member 120 is fixedly connected to the dielectric portion 111 of the capacitor 110, and the second damping member 130 abuts against the dielectric portion 111 of the capacitor 110, the vibration amplitude and frequency of the capacitor 110 are reduced, and howling generated during the operation of the capacitor 110 is further suppressed or even eliminated.

Referring to fig. 6 and 7, fig. 6 is a schematic structural diagram of a capacitor device according to a third embodiment of the present disclosure; fig. 7 is a schematic structural view illustrating a third damping member disposed in a third accommodating space of the capacitor module according to the embodiment of fig. 6. In the present embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. A second accommodating space 1121 is disposed inside the first electrode 112. The second accommodating space 1121 and the first accommodating space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a second damping member 130. The second vibration damper 130 is disposed in the second accommodating space 1121, and the second vibration damper 130 abuts against the dielectric portion 111 and the first electrode 112. In the present embodiment, a third accommodating space 1122 is provided in the first electrode 112. The third accommodating space 1122 is disposed on a side of the dielectric portion 111 away from the first vibration damper 120, and the third accommodating space 1122 is away from the second electrode 113 relative to the second accommodating space 1121. The capacitor assembly 100 further includes a third damping member 140. The third vibration damper 140 is disposed in the third accommodating space 1122, and the third vibration damper 140 abuts against the dielectric portion 111 and the first electrode 112.

Please refer to the foregoing description for the capacitor 110, the first vibration damping member 120, and the second vibration damping member 130, which is not described herein again.

The third vibration damping member 140 is a deformation vibration damping material, that is, the third vibration damping member 140 has elasticity and good toughness, can reduce vibration and resist pressure, and can quickly recover the original shape after deformation is generated, so that the energy generated by vibration is recovered and dissipated to the air through deformation and deformation. For example, the third vibration damper 140 is EPP, EPE, EPS, or the like. The third vibration damping member 140 and the first vibration damping member 120 may be made of the same material or different materials. The third vibration damping member 140 and the second vibration damping member 130 may be made of the same material or different materials. In the present embodiment, the third damper 140, the second damper 130, and the first damper 120 are schematically illustrated as being made of the same material, and for example, all of them are EPP.

In this embodiment, the dimension of the third damping member 140 in the direction from the first electrode 112 to the second electrode 113 is greater than the dimension of the third damping member 140 in the direction from the third damping member 140 to the capacitor 110, so that the third damping member 140 has a larger contact area with the surface of the capacitor 110 facing the third damping member 140, which is beneficial for the third damping member 140 to damp the capacitor 110 in the direction from the capacitor 110 to the first damping member 120.

In the present embodiment, the third vibration damper 140 is disposed in the third accommodation space 1122, and specifically, the third accommodation space 1122 is filled with the entire third vibration damper 140 so that the third vibration damper 140 abuts against the dielectric portion 111 and the first electrode 112. In addition, the third vibration damping member 140 may have an air hole therein due to its material characteristics, and thus, in the process that the third vibration damping member 140 vibrates along with the capacitor 110, the third vibration damping member 140 may be deformed and restored through its internal air hole, thereby damping the capacitor 110.

In the present embodiment, the third accommodating space 1122 is provided on the side of the dielectric portion 111 facing away from the first vibration damper 120, and the third accommodating space 1122 is away from the second electrode 113 with respect to the second accommodating space 1121, so that the third vibration damper 140 is away from the second electrode 113 with respect to the second vibration damper 130, that is, the second vibration damper 130 is closer to the surface of the first electrode 112 facing the second electrode 113 with respect to the third vibration damper 140. Referring to fig. 1 and 17 again, the capacitor 110 is generally connected to a circuit board 200 through the first electrode 112 and the second electrode 113. When the capacitor 110 vibrates, the capacitor 110 drives the circuit board 200 to deform, and the deformation of the capacitor 110 in the areas of the first electrode 112 and the second electrode 113 close to the circuit board 200 is greater than that in other areas. The second vibration damping member 130 is disposed near a surface of the first electrode 112 facing the second electrode 113, which is more beneficial for the second vibration damping member 130 to damp the vibration of the capacitor 110. Further, the second vibration damper 130 forms a fulcrum when the capacitor 110 vibrates. A connecting line between the third vibration damping member 140 and the second vibration damping member 130 can be regarded as a moment arm of the third vibration damping member 140 with the second vibration damping member 130 as a fulcrum, and the third vibration damping member 140 can form a longer moment arm relative to the second vibration damping member 130 away from the second electrode 113, so that the third vibration damping member 140 can generate a larger damping force to the capacitor 110 under the same deformation amount, thereby suppressing the amplitude and frequency of the vibration of the capacitor 110, and suppressing or even eliminating squeal generated by the capacitor 110 in the working process.

Referring to fig. 8 and 9, fig. 8 is a schematic structural diagram of a capacitor device according to a fourth embodiment of the present disclosure; fig. 9 is a schematic structural view of a fourth damping member disposed in a fourth accommodating space in the capacitor module according to the embodiment of fig. 8. The capacitor assembly 100 further comprises a fourth damping member 150 which may be incorporated into the capacitor assembly 100 provided in any of the previous embodiments. In the present embodiment, the capacitive assembly 100 provided in an embodiment (fig. 6 and its related embodiment) in which the capacitive assembly 100 further includes the fourth damping member 150 incorporated therein is illustrated as an example, and should not be understood as a limitation that the capacitive assembly 100 provided in the present application further includes the fourth damping member 150. In the present embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. A second accommodating space 1121 is disposed inside the first electrode 112. The second accommodating space 1121 and the first accommodating space 114 are both located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a second damping member 130. The second vibration damper 130 is disposed in the second accommodating space 1121, and the second vibration damper 130 abuts against the dielectric portion 111 and the first electrode 112. A third accommodating space 1122 is formed in the first electrode 112. The third accommodating space 1122 is disposed on a side of the dielectric portion 111 away from the first vibration damper 120, and the third accommodating space 1122 is away from the second electrode 113 relative to the second accommodating space 1121. The capacitor assembly 100 further includes a third damping member 140. The third vibration damper 140 is disposed in the third accommodating space 1122, and the third vibration damper 140 abuts against the dielectric portion 111 and the first electrode 112. In addition, in the present embodiment, a fourth accommodating space 1123 is formed inside the first electrode 112. The fourth accommodating space 1123 is disposed on a side of the dielectric portion 111 away from the second electrode 113. The capacitor assembly 100 further includes a fourth damping member 150. The fourth damping member 150 is disposed in the fourth accommodating space 1123, and the fourth damping member 150 abuts against the dielectric portion 111 and the first electrode 112.

Please refer to the foregoing description for the capacitor 110, the first vibration damping member 120, the second vibration damping member 130, and the third vibration damping member 140, which is not described herein again.

Fourth damping piece 150 is deformation damping material, namely, fourth damping piece 150 has elasticity and toughness good, can the damping resistance to compression, can resume former shape fast after producing deformation to the energy that produces the vibration recovers the dissipation to the air through deformation and deformation. For example, the fourth damping member 150 is EPP, EPE, EPS, or the like. The fourth damping member 150 and the first damping member 120 may be made of the same material or different materials. The fourth vibration damping member 150 and the second vibration damping member 130 may be made of the same material or different materials. The fourth vibration damping member 150 and the third vibration damping member 140 may be made of the same material or different materials. In the present embodiment, the fourth damper 150, the third damper 140, the second damper 130, and the first damper 120 are schematically illustrated as being made of the same material, and for example, all of them are EPP.

In this embodiment, the size of the fourth vibration damping member 150 in the direction of the capacitor 110 pointing to the first vibration damping member 120 is larger than the size of the fourth vibration damping member 150 in the direction of the fourth vibration damping member 150 pointing to the capacitor 110, so that the fourth vibration damping member 150 has a larger contact area with the surface of the capacitor 110 facing the fourth vibration damping member 150, which is beneficial for the fourth vibration damping member 150 to damp the vibration of the capacitor 110 in the direction of the fourth vibration damping member 150 pointing to the capacitor 110.

In the present embodiment, the fourth damping member 150 is disposed in the fourth accommodation space 1123, and specifically, the fourth damping member 150 is filled in the entire fourth accommodation space 1123 such that the fourth damping member 150 abuts against the dielectric portion 111 and the first electrode 112. In addition, since the fourth damping member 150 has an air hole inside due to its material characteristics, the fourth damping member 150 can be deformed and restored by its internal air hole in the process that the fourth damping member 150 vibrates along with the capacitor 110, thereby damping the capacitor 110.

In this embodiment, the first vibration damper 120, the second vibration damper 130, and the third vibration damper 140 damp the capacitor 110 in a direction in which the capacitor 110 points to the first vibration damper 120, and the fourth vibration damper 150 damps the capacitor 110 in a direction in which the first electrode 112 points to the second electrode 113, where the direction in which the first electrode 112 points to the second electrode 113 is different from the direction in which the capacitor 110 points to the first vibration damper 120, so that the fourth vibration damper 150 increases the damping of the capacitor 110 in different directions, further suppresses the amplitude and frequency of the vibration of the capacitor 110, and suppresses or even eliminates the squeal generated by the capacitor 110 during operation.

Referring to fig. 10 and 11, fig. 10 is a schematic structural diagram of a capacitor device according to a fifth embodiment of the present disclosure; fig. 11 is a schematic structural view illustrating a fifth damping member disposed in a fifth accommodating space of the capacitor module according to the embodiment of fig. 10. In the present embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. In addition, in the present embodiment, a fifth accommodating space 1131 is provided inside the first electrode 112. The fifth accommodating space 1131 and the first accommodating space 114 are located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a fifth damping member 160. The fifth vibration damper 160 is disposed in the fifth accommodating space 1131, and the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112.

Fifth damping piece 160 is deformation damping material, namely, fifth damping piece 160 has elasticity and toughness good, can the damping resistance to compression, can resume former shape fast after producing deformation to the energy that produces the vibration recovers the dissipation to the air through deformation and deformation. For example, the fifth vibration damper 160 is EPP, EPE, EPS, or the like. In the present embodiment, the fifth damper 160 and the first damper 120 are made of the same material, for example, both the fifth damper 160 and the first damper 120 are made of EPP. In other embodiments, the fifth damping member 160 and the first damping member 120 are made of different materials.

In this embodiment, the dimension of the fifth vibration damping member 160 in the direction from the first electrode 112 to the second electrode 113 is greater than the dimension of the fifth vibration damping member 160 in the direction from the fifth vibration damping member 160 to the capacitor 110, so that the fifth vibration damping member 160 has a larger contact area with the surface of the capacitor 110 facing the fifth vibration damping member 160, which is beneficial for the fifth vibration damping member 160 to damp the vibration of the capacitor 110 in the direction from the capacitor 110 to the first vibration damping member 120.

In the present embodiment, the fifth vibration damper 160 is disposed in the fifth accommodation space 1131, specifically, the fifth vibration damper 160 fills the entire fifth accommodation space 1131, so that the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112. In addition, since the fifth vibration damping member 160 has an air hole inside due to its material characteristics, the fifth vibration damping member 160 can be deformed and restored by its internal air hole in the process that the fifth vibration damping member 160 vibrates along with the capacitor 110, thereby damping the capacitor 110.

When the capacitor 110 works, the vibration of the capacitor 110 drives the first vibration damping member 120 and the fifth vibration damping member 160 to vibrate together, so that the deformation generated by the vibration of the capacitor 110 is transmitted to the air in the first accommodating space 114 and the inner air holes of the fifth vibration damping member 160. In addition, the air in the first receiving space 114 and the air in the inner air holes of the fifth vibration damper 160 are repeatedly compressed and released along with the vibration of the first vibration damper 120 and the vibration of the fifth vibration damper 160, and friction occurs between the air and the first vibration damper 120, the fifth vibration damper 160 and the air itself during the process, so that a damping force for the vibration of the first vibration damper 120 and the fifth vibration damper 160 is formed, and the amplitude and frequency of the vibration of the first vibration damper 120 and the fifth vibration damper 160 are suppressed. Since the first vibration damping member 120 is fixedly connected to the dielectric portion 111 of the capacitor 110, and the fifth vibration damping member 160 abuts against the dielectric portion 111 of the capacitor 110, the vibration amplitude and frequency of the capacitor 110 are reduced, and howling generated during the operation of the capacitor 110 is further suppressed or even eliminated.

It should be noted that the relative position of the fifth accommodating space 1131 in the first electrode 112 may be the same as or different from the relative position of the second accommodating space 1121 in the second electrode 113. In the present embodiment, the relative position of the fifth accommodating space 1131 in the first electrode 112 is the same as the relative position of the second accommodating space 1121 in the second electrode 113.

Referring to fig. 12 and 13, fig. 12 is a schematic structural diagram of a capacitor device according to a sixth embodiment of the present disclosure; fig. 13 is a schematic structural view illustrating a sixth damping member disposed in a sixth accommodating space of the capacitor module according to the embodiment of fig. 12. In the present embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. A fifth accommodating space 1131 is disposed inside the first electrode 112. The fifth accommodating space 1131 and the first accommodating space 114 are located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a fifth damping member 160. The fifth vibration damper 160 is disposed in the fifth accommodating space 1131, and the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112. In addition, in the present embodiment, a sixth accommodating space 1132 is provided inside the first electrode 112. The sixth receiving space 1132 is disposed on a side of the dielectric portion 111 facing away from the first damping member 120. The sixth receiving space 1132 is far from the second electrode 113 relative to the fifth receiving space 1131. The capacitor assembly 100 further includes a sixth damping member 170. The sixth damping member 170 is disposed in the sixth receiving space 1132, and the sixth damping member 170 abuts against the dielectric portion 111 and the first electrode 112.

Please refer to the foregoing description for the capacitor 110, the first vibration damping member 120 and the fifth vibration damping member 160, which are not described herein again.

The sixth vibration damping member 170 is a deformation vibration damping material, that is, the sixth vibration damping member 170 has elasticity and good toughness, can reduce vibration and resist pressure, and can quickly recover the original shape after deformation is generated, so that energy generated by vibration is recovered and dissipated to the air through deformation and deformation. For example, the sixth vibration damping member 170 is EPP, EPE, EPS, or the like. The sixth damping member 170 and the first damping member 120 may be made of the same material or different materials. The sixth vibration damping member 170 and the fifth vibration damping member 160 may be made of the same material or different materials. In the present embodiment, the sixth damper 170, the fifth damper 160, and the first damper 120 are schematically described as being made of the same material, and for example, all of them are EPP.

Specifically, the EPP material has good elasticity, good toughness, vibration resistance and compression resistance, high deformation recovery rate and good absorption performance, is high-temperature resistant (can normally work at the temperature of-40-130 ℃ at least), and can adapt to the high-temperature working environment of the capacitor 110. And the EPP material is also corrosion-resistant, acid-resistant and oil-resistant, and can adapt to severe working environment. Furthermore, EPP material is also an environmentally friendly material.

In this embodiment, the dimension of the sixth vibration damper 170 in the direction of the first electrode 112 pointing to the second electrode 113 is greater than the dimension of the sixth vibration damper 170 in the direction of the sixth vibration damper 170 pointing to the capacitor 110, so that the sixth vibration damper 170 has a larger contact area with the surface of the capacitor 110 facing the sixth vibration damper 170, which is beneficial for the sixth vibration damper 170 to damp the vibration of the capacitor 110 in the direction of the capacitor 110 pointing to the first vibration damper 120.

In the present embodiment, the sixth vibration damper 170 is disposed in the sixth receiving space 1132, and specifically, the sixth vibration damper 170 fills the entire sixth receiving space 1132, so that the sixth vibration damper 170 abuts against the dielectric portion 111 and the first electrode 112. In addition, the sixth vibration damper 170 may have an air hole inside due to its material characteristics, and thus, in a process in which the sixth vibration damper 170 vibrates along with the capacitor 110, the sixth vibration damper 170 may be deformed and restored by the air hole inside itself, thereby damping the capacitor 110.

In this embodiment, the sixth receiving space 1132 is provided on a side of the dielectric portion 111 facing away from the first vibration damper 120, and the sixth receiving space 1132 is separated from the second electrode 113 with respect to the fifth receiving space 1131, so that the sixth vibration damper 170 is separated from the second electrode 113 with respect to the fifth vibration damper 160, that is, the fifth vibration damper 160 is closer to a surface of the first electrode 112 facing the second electrode 113 with respect to the sixth vibration damper 170. Referring to fig. 1 again, the capacitor 110 is usually connected to a circuit board through the first electrode 112 and the second electrode 113, when the capacitor 110 vibrates, the capacitor 110 drives the circuit board to deform together, the deformation amount of the capacitor 110 in the area of the first electrode 112 and the second electrode 113 close to the circuit board is larger than that in other areas, and the fifth vibration damping member 160 is disposed on the surface of the capacitor 110 close to the first electrode 112 facing the second electrode 113, which is more favorable for the fifth vibration damping member 160 to damp the capacitor 110. The fifth vibration damping member 160 forms a fulcrum when the capacitor 110 vibrates, a connecting line between the sixth vibration damping member 170 and the fifth vibration damping member 160 can be regarded as a moment arm of the sixth vibration damping member 170 with the fifth vibration damping member 160 as the fulcrum, and the sixth vibration damping member 170 can form a longer moment arm relative to the fifth vibration damping member 160 away from the second electrode 113, so that the sixth vibration damping member 170 can generate a larger damping force to the capacitor 110 under the same deformation amount, thereby suppressing the amplitude and frequency of the vibration of the capacitor 110, and suppressing or even eliminating the squeal generated by the capacitor 110 in the working process.

It should be noted that the relative position of the sixth accommodating space 1132 in the first electrode 112 may be the same as or different from the relative position of the third accommodating space 1122 in the second electrode 113. In the present embodiment, the relative position of the sixth receiving space 1132 with respect to the first electrode 112 is the same as the relative position of the third receiving space 1122 with respect to the second electrode 113.

Referring to fig. 14 and 15, fig. 14 is a schematic structural diagram of a capacitor device according to a seventh embodiment of the present disclosure; fig. 15 is a schematic structural view illustrating a seventh damping member disposed in a seventh accommodating space of the capacitor module according to the embodiment of fig. 14. The capacitor assembly 100 further comprises a seventh damping member 180 which can be incorporated into the capacitor assembly 100 provided in the previous embodiments. In this embodiment, the capacitor assembly 100 further including the seventh vibration damping member 180 is exemplified to be incorporated into the capacitor assembly 100 provided in one embodiment (fig. 12 and its related embodiment), and should not be construed as a limitation that the capacitor assembly 100 further including the seventh vibration damping member 180 is provided in this application. In the present embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. A fifth accommodating space 1131 is disposed inside the first electrode 112. The fifth accommodating space 1131 and the first accommodating space 114 are located on the same side of the dielectric portion 111. The capacitor assembly 100 further includes a fifth damping member 160. The fifth vibration damper 160 is disposed in the fifth accommodating space 1131, and the fifth vibration damper 160 abuts against the dielectric portion 111 and the first electrode 112. A sixth receiving space 1132 is disposed inside the first electrode 112. The sixth receiving space 1132 is disposed on a side of the dielectric portion 111 facing away from the first vibration damping member 120, and the sixth receiving space 1132 is far away from the second electrode 113 relative to the fifth receiving space 1131. The capacitor assembly 100 further includes a sixth damping member 170. The sixth damping member 170 is disposed in the sixth receiving space 1132, and the sixth damping member 170 abuts against the dielectric portion 111 and the first electrode 112. In addition, in the present embodiment, a seventh accommodating space 1133 is provided inside the first electrode 112. The seventh accommodating space 1133 is disposed on a side of the dielectric portion 111 facing away from the second electrode 113. The capacitor assembly 100 further includes a seventh damping member 180. The seventh vibration damper 180 is disposed in the seventh accommodation space 1133, and the seventh vibration damper 180 abuts against the dielectric portion 111 and the first electrode 112.

Please refer to the foregoing description for the capacitor 110, the first vibration damping member 120, the fifth vibration damping member 160, and the sixth vibration damping member 170, which is not described herein again.

The seventh vibration damping member 180 is made of a deformation vibration damping material, that is, the seventh vibration damping member 180 has good elasticity and toughness, can damp and resist pressure, and can quickly recover the original shape after deformation is generated, so that the energy generated by vibration is recovered and dissipated to the air through deformation and deformation. For example, the seventh vibration damper 180 is EPP, EPE, EPS, or the like. The seventh vibration damping member 180 may be made of the same material as the first vibration damping member 120, or may be made of different materials. The seventh vibration damping member 180 and the fifth vibration damping member 160 may be made of the same material or different materials. The seventh vibration damping member 180 and the sixth vibration damping member 170 may be made of the same material or different materials. In the present embodiment, the seventh damper 180, the sixth damper 170, the fifth damper 160, and the first damper 120 are schematically described as being made of the same material, and for example, all of them are EPP.

In this embodiment, the dimension of the seventh damping member 180 in the direction of the capacitor 110 toward the first damping member 120 is larger than the dimension of the seventh damping member 180 in the direction of the capacitor 110, so that the seventh damping member 180 has a larger contact area with the surface of the capacitor 110 facing the seventh damping member 180, which facilitates the seventh damping member 180 to damp the capacitor 110 in the direction of the fourth damping member 150 toward the capacitor 110.

In the present embodiment, the seventh vibration damper 180 is disposed in the seventh accommodation space 1133, specifically, the seventh vibration damper 180 fills the entire seventh accommodation space 1133, so that the seventh vibration damper 180 abuts against the dielectric portion 111 and the first electrode 112. In addition, since the seventh vibration damper 180 has an air hole inside due to its material characteristics, the seventh vibration damper 180 can be deformed and restored by its internal air hole in the process of vibrating the seventh vibration damper 180 along with the capacitor 110, thereby damping the vibration of the capacitor 110.

In this embodiment, the first vibration damper 120, the fifth vibration damper 160, and the sixth vibration damper 170 damp the capacitor 110 in a direction in which the capacitor 110 points to the first vibration damper 120, and the seventh vibration damper 180 damps the capacitor 110 in a direction in which the first electrode 112 points to the second electrode 113, where the direction in which the first electrode 112 points to the second electrode 113 is different from the direction in which the capacitor 110 points to the first vibration damper 120, so that the seventh vibration damper 180 increases the damping of the capacitor 110 in different directions, further suppresses the amplitude and frequency of the vibration of the capacitor 110, and suppresses or even eliminates the squeal generated by the capacitor 110 during operation.

It should be noted that the relative position of the seventh accommodating space 1133 in the first electrode 112 may be the same as or different from the relative position of the fourth accommodating space 1123 in the second electrode 113. In the present embodiment, the relative position of the seventh accommodating space 1133 in the first electrode 112 is the same as the relative position of the fourth accommodating space 1123 in the second electrode 113.

Referring to fig. 16, fig. 16 is a schematic structural diagram of a capacitor assembly according to an eighth embodiment of the present disclosure. In the present embodiment, the capacitor assembly 100 includes a capacitor 110 and a first vibration damper 120. The capacitor 110 includes a dielectric portion 111, a first electrode 112, and a second electrode 113. The first electrode 112 wraps one end of the dielectric portion 111. The second electrode 113 wraps the other end of the dielectric portion 111, and the second electrode 113 is disposed opposite to the first electrode 112. The second electrode 113, the first electrode 112 and the dielectric portion 111 together form a first accommodating space 114. The first damping member 120 is disposed in the first accommodating space 114, and the first damping member 120 is fixedly connected to the dielectric portion 111. In the present embodiment, a gap 115 is provided between the first damper 120 and the first electrode 112, and a gap 115 is provided between the first damper 120 and the second electrode 113.

In this embodiment, in the vibration process of the capacitor 110, the capacitor 110 drives the first vibration damping member 120 to vibrate together with the capacitor 110, so that the first vibration damping member 120 deforms, and the gap 115 provides a deformation space for the first vibration damping member 120 in the direction from the first electrode 112 to the second electrode 113, which is beneficial for the first vibration damping member 120 to deform, so that the energy of the vibration of the capacitor 110 is absorbed, the amplitude and frequency of the vibration of the capacitor 110 are suppressed, and the squeal generated in the working process of the capacitor 110 is suppressed or even eliminated.

The present application further provides a circuit board assembly 10. Referring to fig. 17, fig. 17 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure. The circuit board assembly 10 includes a circuit board 200 and the capacitor assembly 100 according to any of the above embodiments, wherein the capacitor assembly 100 is electrically connected to the circuit board 200.

In the present embodiment, the circuit board assembly 10 may be used for power filtering, signal coupling, resonance, filtering, compensation, charging and discharging, energy storage, dc isolation, and the like.

When the capacitor 110 is in operation, howling may occur due to too high self-vibration frequency. Meanwhile, when the capacitor 110 is powered on the circuit board 200 for operation, the capacitor 110 drives the circuit board 200 to vibrate, so that the capacitor 110 and the circuit board 200 generate squeal due to vibration.

In this embodiment, the capacitor module 100 may be, but is not limited to, electrically connected to the circuit board 200 by soldering, bonding with conductive adhesive, or the like, so that the capacitor module 100 is electrically connected to the circuit board 200.

In the present embodiment, the first vibration damper 120 not only can reduce the vibration amplitude and frequency of the capacitor 110, but also can play a role in buffering between the capacitor 110 and the circuit board 200 to suppress or even eliminate the resonance between the capacitor 110 and the circuit board 200, thereby suppressing or even eliminating the howling generated when the capacitor 110 operates on the circuit board 200.

The present application also provides a display device 1. Referring to fig. 17 and 18, fig. 18 is a circuit block diagram of a display device according to an embodiment of the present application. The display device 1 includes a display panel 20 and the circuit board assembly 10, and the circuit board assembly 10 is electrically connected to the display panel 20.

In the present embodiment, the first vibration dampers 120 reduce the vibration amplitude and frequency of the capacitor 110 and the circuit board 200, and suppress or even eliminate resonance between the capacitor 110 and the circuit board 200, thereby suppressing or even eliminating howling generated when the capacitor 110 operates in the display device 1.

In one embodiment, the circuit board 200 includes a filter circuit. The capacitor 110 operates as a part of a filter circuit on the circuit board 200, and the filter circuit in the circuit board 200 filters an input first current to obtain a second current, and provides the second current to the display panel 20, so as to drive the display panel 20 to operate.

The filter circuit includes a high-pass filter circuit, a low-pass filter circuit, and a band-pass filter circuit, and the following describes details of the filter circuit as the high-pass filter circuit, the low-pass filter circuit, or the band-pass filter circuit.

In one embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a high-pass filter circuit. Specifically, the cut-off frequency of the high-pass filter circuit is f0, and the frequency f1 of the first current is: fa is less than f1 and less than fb, fa is less than f0 and less than fb, and the frequency f2 of the second current is: f0 is not less than f2 is not less than fb. For example, in one embodiment, the cutoff frequency f0 of the high-pass filter circuit is 50Hz, and the frequency f1 of the first current ranges from: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is less than or equal to 50Hz and less than or equal to 200Hz, in other words, the high-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 50Hz to 200 Hz. In another embodiment, the cut-off frequency f0 of the high-pass filter circuit is 100Hz, and the frequency f1 of the first current is in the range of: f1 is more than or equal to 20Hz and less than or equal to 200Hz, the frequency f2 of the second current ranges from f2 to 200Hz, in other words, the high-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 100Hz to 200 Hz.

In another embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a low pass filter circuit. Specifically, the cut-off frequency of the low-pass filter circuit is f0, and the frequency f1 of the first current is: fa is less than f1 and less than fb, fa is less than f0 and less than fb, and the frequency f2 of the second current is: fa is less than or equal to f2 and less than or equal to f 0. For example, in one embodiment, the cut-off frequency f0 of the low-pass filter circuit is 150Hz, and the frequency f1 of the first current is in the range: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is more than or equal to 20Hz and less than or equal to 150Hz, in other words, the low-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 20Hz to 150 Hz. In another embodiment, the cut-off frequency f0 of the low-pass filter circuit is 120Hz, and the frequency f1 of the first current is in the range of: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is not less than 20Hz and not more than 120Hz, in other words, the low-pass filter circuit of the circuit board 200 filters the current frequency from 20-200 Hz to 20-120 Hz.

In another embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a band-pass filter circuit. Specifically, the high-pass cutoff frequency of the band-pass filter circuit is f01, the low-pass cutoff frequency of the band-pass filter circuit is f02, and the frequency f1 of the first current is: fa is less than f1 and less than fb, fa is less than f01 and less than f02 and less than fb, and then the frequency f2 of the second current is: f01 is not less than f2 is not less than f 02. For example, in one embodiment, the high-pass cutoff frequency f01 of the band-pass filter circuit is 50Hz, the low-pass cutoff frequency f02 of the band-pass filter circuit is 150Hz, and the frequency f1 of the first current is in a range of: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is less than or equal to 50Hz and less than or equal to 150Hz, in other words, the band-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 50Hz to 150 Hz.

It should be noted that this embodiment only exemplifies some applications of the display device 1, and does not limit the application range of the display device 1.

Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present application, and that such changes and modifications are also to be considered as within the scope of the present application.

Claims

1. A capacitive assembly, comprising:

the capacitor comprises a dielectric part, a first electrode and a second electrode, wherein the first electrode wraps one end of the dielectric part, the second electrode wraps the other end of the dielectric part, the second electrode is arranged opposite to the first electrode, and the second electrode, the first electrode and the dielectric part form a first accommodating space together; and

the first damping piece is arranged in the first accommodating space and fixedly connected with the dielectric part.

2. The capacitor assembly of claim 1, wherein a second receiving space is disposed inside the first electrode, and the second receiving space and the first receiving space are both on a same side of the dielectric portion, the capacitor assembly further comprising:

and the second damping piece is arranged in the second accommodating space and is abutted against the dielectric part and the first electrode.

3. The capacitor assembly according to claim 2, wherein a third accommodating space is provided inside the first electrode, the third accommodating space is provided on a side of the dielectric portion facing away from the first damping member, and the third accommodating space is away from the second electrode relative to the second accommodating space, and the capacitor assembly further comprises:

and the third damping piece is arranged in the third accommodating space and is abutted against the dielectric part and the first electrode.

4. The capacitor assembly according to any one of claims 1-3, wherein a fourth accommodating space is provided inside the first electrode, and the fourth accommodating space is provided on a side of the dielectric portion facing away from the second electrode, the capacitor assembly further comprising:

and the fourth damping piece is arranged in the fourth accommodating space and is abutted against the dielectric part and the first electrode.

5. The capacitor assembly of claim 1, wherein a fifth receiving space is defined in the second electrode, the fifth receiving space being defined on a side of the dielectric portion facing the first damping member, the capacitor assembly further comprising:

and the fifth damping piece is arranged in the fifth accommodating space and is abutted against the dielectric part and the second electrode.

6. The capacitor assembly according to claim 5, wherein a sixth accommodating space is provided inside the second electrode, the sixth accommodating space is provided on a side of the dielectric part facing away from the first damping member, and the sixth accommodating space is away from the first electrode relative to the fifth accommodating space, and the capacitor assembly further comprises:

and the sixth damping piece is arranged in the sixth accommodating space and is abutted against the dielectric part and the second electrode.

7. The capacitor assembly according to any one of claims 1, 5 or 6, wherein a seventh accommodating space is provided inside the second electrode, and the seventh accommodating space is provided on a side of the dielectric portion facing away from the first electrode, the capacitor assembly further comprising:

and the seventh vibration damping piece is arranged in the seventh accommodating space and is abutted against the dielectric part and the second electrode.

8. The capacitive assembly of claim 1 wherein a gap exists between the first damping member and the first electrode and a gap exists between the first damping member and the second electrode.

9. A circuit board assembly, comprising:

a circuit board; and

the capacitive assembly of any one of claims 1-8, electrically connected to the circuit board.

10. A display device, characterized in that the display device comprises:

a display panel; and

the circuit board assembly of claim 9, wherein the circuit board assembly is electrically connected to the display panel.