CN114446641A - Capacitor assembly, circuit board assembly and display device - Google Patents

Capacitor assembly, circuit board assembly and display device Download PDF

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Publication number
CN114446641A
CN114446641A CN202210170547.0A CN202210170547A CN114446641A CN 114446641 A CN114446641 A CN 114446641A CN 202210170547 A CN202210170547 A CN 202210170547A CN 114446641 A CN114446641 A CN 114446641A
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CN
China
Prior art keywords
free end
capacitor
pin
vibration
assembly
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CN202210170547.0A
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Chinese (zh)
Inventor
冉睿迪
黄佩迪
袁海江
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HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
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HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
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Priority to CN202210170547.0A priority Critical patent/CN114446641A/en
Publication of CN114446641A publication Critical patent/CN114446641A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Vibration Prevention Devices (AREA)

Abstract

The application provides a capacitor assembly, a circuit board assembly and a display device. The capacitance assembly includes: a capacitor; a first pin; the second pin and the first pin are respectively connected to two ends of the capacitor, which are opposite to each other, and the second pin, the first pin and the capacitor form an accommodating space; the shock absorber is arranged in the accommodating space and comprises a first supporting piece, the first supporting piece is provided with a first free end, a first connecting portion and a second free end which are sequentially connected, the first free end is used for supporting the capacitor, the second free end deviates from the capacitor compared with the first free end, and the first free end can move relative to the second free end. According to the capacitor assembly, the vibration frequency of the capacitor can be reduced through the vibration damper, and howling generated in the working process of the capacitor can be restrained or even eliminated.

Description

Capacitor assembly, circuit board assembly and display device
Technical Field
The application relates to the field of display panels, in particular to a capacitor assembly, a circuit board assembly and a display device.
Background
With the progress of technology, electronic devices having display devices have become daily necessities for people. The display device generates a "creaking" sound during operation, which is called "howling". One of the reasons for the "squeal" is the vibration of the capacitor. Howling thus shows that the quality of the display device is not high in the related art due to the presence of "howling".
Disclosure of Invention
In a first aspect, the application provides a capacitor assembly, the capacitor assembly includes electric capacity, first pin, second pin and shock absorber, the second pin with first pin connect respectively in the both ends that electric capacity carried on the back mutually, the second pin, first pin reaches electric capacity forms the accommodation space, the shock absorber is located the accommodation space, the shock absorber includes first support piece, first support piece has first free end, first connecting portion and the second free end that connects gradually, first free end is used for supporting electric capacity, the second free end compare in first free end deviates from electric capacity, first free end can be relative the motion of second free end.
The shock absorber further comprises a second supporting piece, the second supporting piece is provided with a third free end, a second connecting portion and a fourth free end, the third free end, the second connecting portion and the fourth free end are sequentially connected, the third free end and the first free end are arranged at an interval and are used for supporting the capacitor, the second connecting portion is connected with the first connecting portion, the fourth free end deviates from the capacitor compared with the third free end, and the third free end can move relative to the fourth free end.
The number of the vibration dampers is two or more, and the vibration dampers are arranged at intervals in the extending direction of the first pins.
The number of the shock absorbers is two or more, the capacitor assembly is sequentially provided with a first area, a middle area and a second area in the direction that the first pin points to the second pin, the first area is arranged adjacent to the first pin, the second area is arranged adjacent to the second pin, the middle area is clamped between the first area and the second area, the distribution density of the shock absorbers in the first area is a first density, the distribution density of the shock absorbers in the second area is a second density, the distribution density of the shock absorbers in the middle area is a third density, the first density is greater than the third density, and the second density is greater than the third density.
When the shock absorber comprises a second support piece, the first free end and the third free end are arranged at intervals in the direction in which the first pin points to the second pin, the second free end is fixedly connected to the surface of the capacitor facing the first bending part, and the fourth free end is fixedly connected to the surface of the capacitor facing the second bending part.
Wherein the first lead comprises a first lead body and a first bending part, the first bending part is connected with the first lead body, and the second pin comprises a second pin body and a second bending part compared with the first pin body and faces the second pin, the second bending part is connected to the second lead body and faces the first lead compared with the second lead body, when the damper includes a second support member, the first free end and the third free end are disposed at an interval in the extending direction of the first pin, the second free end is respectively and fixedly connected to the surface of the first bending part facing the capacitor and the surface of the second bending part facing the capacitor, the fourth free end is respectively and fixedly connected to the surface of the first bending part facing the capacitor and the surface of the second bending part facing the capacitor.
The first free end and the third free end are fixedly connected to the capacitor, and the first free end and the third free end jointly support the capacitor.
The first support part is elastically abutted to the capacitor and the first bending part, and the second support part is elastically abutted to the capacitor and the second bending part.
In a second aspect, the present application further provides a circuit board assembly, which includes a circuit board and the capacitor assembly according to the first aspect, wherein the capacitor assembly is electrically connected to the circuit board.
In a third aspect, the present application further provides a display device, which includes a display panel and the circuit board assembly according to the second aspect, and the circuit board assembly is electrically connected to the display panel.
The capacitor assembly provided by the first aspect of the application comprises a capacitor, a first pin, a second pin and a shock absorber, wherein the shock absorber is arranged in an accommodating space formed by the capacitor, the first pin and the second pin, and the shock absorber is used for absorbing shock of the capacitor. Because the vibration damper supports the capacitor, the vibration amplitude and frequency of the capacitor are reduced. In addition, when the capacitor works, the vibration of the capacitor drives the vibration absorber to move, so that the vibration absorber can vibrate along with the capacitor, and deformation generated by the vibration of the capacitor is transmitted to the air in the accommodating space, namely, the vibration kinetic energy of the vibration absorber is converted into heat energy through the friction between the vibration absorber and the air and the heat energy is dissipated into the air. In addition, the air in the accommodating space is repeatedly compressed and released along with the vibration of the vibration absorber, and in the process, friction is generated among the air, the vibration absorber and the molecules of the air, so that damping force for the vibration of the vibration absorber is formed, and the amplitude and the frequency of the vibration absorber are inhibited. Therefore, the capacitor assembly provided by the application can reduce the vibration frequency of the capacitor through the damper to suppress or even eliminate the squeal generated in the working process of the capacitor. When the capacitor assembly is applied to a display device, the quality of the display device is higher.
The circuit board assembly provided by the second aspect of the present application comprises a circuit board and the capacitor assembly as described in the first aspect, the capacitor assembly is applied to the circuit board assembly, and the vibration absorber not only can reduce the vibration amplitude and frequency of the capacitor, but also can play a role of buffering between the capacitor and the circuit board to suppress or even eliminate the resonance between the capacitor and the circuit board, thereby suppressing or even eliminating the howling generated when the capacitor works on the circuit board.
A third aspect of the present application provides a display device including a display panel and the circuit board assembly according to the second aspect, wherein the circuit board assembly is applied to the display device, the vibration amplitude and frequency of the capacitor and the circuit board are reduced by the vibration absorber, and the resonance between the capacitor and the circuit board is suppressed or even eliminated, so that the howling generated when the capacitor operates in the display device is suppressed or even eliminated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a chip multilayer capacitor in the related art.
Fig. 2 is a schematic diagram illustrating a vibration of a chip multilayer capacitor in the related art.
Fig. 3 is a schematic structural diagram of a capacitor assembly according to a first embodiment of the present disclosure.
Fig. 4 is a schematic structural diagram of a capacitor module according to a second embodiment of the present disclosure.
Figure 5 is a schematic illustration of the elastic deformation of the damper provided in the embodiment of figure 3.
Figure 6 is a schematic illustration of the elastic deformation of the damper provided in the embodiment of figure 4.
Fig. 7 is a schematic diagram of a distribution of vibration dampers in the capacitor assembly provided in the embodiment of fig. 4.
FIG. 8 is a schematic view of another arrangement of vibration dampers in the capacitor assembly provided in the embodiment of FIG. 4.
Fig. 9 is a schematic structural diagram of a capacitor module according to a third embodiment of the present disclosure.
Fig. 10 is a schematic structural diagram of a capacitor module according to a fourth embodiment of the present disclosure.
Fig. 11 is a schematic cross-sectional view of the capacitor assembly of the embodiment of fig. 10 taken along line I-I.
Fig. 12 is a schematic cross-sectional view of the capacitor assembly of the embodiment of fig. 10 taken along the direction opposite to the line I-I.
Fig. 13 is a schematic structural diagram of a fixed connection between a vibration absorber and a capacitor in the capacitor assembly provided in the embodiment of fig. 9.
Fig. 14 is a schematic structural view of the elastic abutting pin of the damper and the capacitor in the capacitor assembly provided in the embodiment of fig. 13.
Fig. 15 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present application.
Fig. 16 is a circuit block diagram of a display device according to an embodiment of the present application.
Reference numerals: a display device 1; a circuit board assembly 10; a display panel 20; a capacitive component 100; a circuit board 200; a conductive member 300; a capacitor 110; a first pin 120; a second pin 130; a vibration damper 140; an accommodating space 150; a first region 160; a middle region 170; a second region 180; a medium 111; an inner electrode 112; an outer electrode 113; a first lead body 121; a first bending part 122; a second lead body 131; a second bending part 132; the first support 141; a second support 142; a first free end 1411; a first connection portion 1412; a second free end 1413; a third free end 1421; a second connection part 1422; fourth self-contained terminal 1423.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.
The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment or implementation can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1 and 2, fig. 1 is a schematic structural diagram of a chip multilayer capacitor in the related art; fig. 2 is a schematic diagram illustrating a vibration of a chip multilayer capacitor in the related art. The capacitor 110 generally comprises a dielectric 111, an inner electrode 112 and an outer electrode 113, the capacitor 110 is formed by overlapping dielectric films printed with the inner electrode 112 in a staggered manner, forming a chip with the dielectric 111 wrapping the inner electrode 112 through one-time high-temperature sintering, and sealing the outer electrode 113 at two ends of the chip. When the capacitor 110 is powered on, the voltage generates an electric field (e.g., E1 and E2 in fig. 2) on the inner electrode 112, and the electric field acts on the inner electrode 112 to form a mechanical force (e.g., F11, F12, F13, F21, F22 and F23 in fig. 2), i.e., a conversion between electrical energy and mechanical energy, i.e., an inverse piezoelectric effect. The mechanical force generated by the electric field on the inner electrode 112 causes the inner electrode 112 to slightly expand and contract (see d in fig. 2), and although the expansion and contraction amount of the inner electrode 112 is small and changes on a nanometer scale, the inner electrode 112 repeatedly expands and contracts during the power-on process, so that the vibration frequency of the capacitor 110 is increased, and the capacitor 110 generates a howling sound. Note that expansion and contraction of the internal electrodes 112 are mainly caused in the stacking direction of the internal electrodes 112, that is, vibration of the capacitor 110 in the stacking direction of the internal electrodes 112 is a factor of occurrence of howling in the capacitor 110.
The present application provides a capacitive assembly 100. Referring to fig. 3, fig. 3 is a schematic structural diagram of a capacitor device according to a first embodiment of the present disclosure. The capacitor assembly 100 includes a capacitor 110, a first lead 120, a second lead 130, and a vibration damper 140. The second pin 130 and the first pin 120 are respectively connected to two opposite ends of the capacitor 110, and the second pin 130, the first pin 120 and the capacitor 110 form an accommodating space 150. The vibration absorber 140 is disposed in the accommodating space 150, the vibration absorber 140 includes a first supporting member 141, the first supporting member 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413, which are sequentially connected, the first free end 1411 is used for supporting the capacitor, the second free end 1413 deviates from the capacitor compared with the first free end 1411, and the first free end 1411 can move relative to the second free end 1413.
The capacitor 110 provided in the present application is a chip multilayer Ceramic capacitor (MLCC). The capacitor 110 is a static charge storage medium, and the capacitor 110 is a wide-range electronic component that is indispensable in the fields of electronics and power. The capacitor 110 is mainly used in circuits such as power supply filtering, signal coupling, resonance, filtering, compensation, charging and discharging, energy storage, direct current isolation and the like.
The first pin 120 and the second pin 130 are respectively connected to two opposite ends of the capacitor 110. Specifically, the first pin 120 and the second pin 130 are respectively connected to the capacitor 110 through the outer electrodes 113 connected to opposite ends of the capacitor 110, and the first pin 120 and the second pin 130 are used for supporting the capacitor 110. The first pin 120 and the second pin 130 are electrically connected to the capacitor 110, that is, the first pin 120 and the second pin 130 are made of a conductive material, such as copper, iron, or aluminum.
The vibration absorber 140 is disposed in the accommodating space 150, and the vibration absorber 140 is used for supporting the capacitor 110. The damper 140 has elasticity. In one embodiment, the vibration reducer 140 is a material having elasticity, so that the vibration reducer 140 can move along with the vibration of the capacitor 110. For example, the vibration damper 140 may be rubber, latex, elastic fiber, or the like. In another embodiment, the vibration absorber 140 is a material with a larger hardness, and the material of the vibration absorber 140 has a smaller elasticity by itself, and may even have no elasticity, and the vibration absorber 140 has elasticity due to its shape, so that the vibration absorber 140 can move along with the vibration of the capacitor 110. For example, the damper 140 may be iron, steel, rigid plastic, or the like. The vibration damper 140 may have a "C" shape, a "Z" shape, an "O" shape, or the like. In one embodiment, the vibration damper 140 is not electrically conductive, so that the vibration damper 140 can avoid the magnetic circuit or the electrical property of the capacitor 110 from being affected, and the vibration damper 140 can be beneficial to damp the capacitor 110, thereby suppressing or even eliminating the squeal.
In the present embodiment (see fig. 3), the vibration reducer 140 includes a first support 141. The first support 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413 connected in sequence. The first free end 1411 is used to support the capacitor 110. The second free end 1413 faces away from the capacitor 110 as compared to the first free end 1411. The first free end 1411 is movable relative to the second free end 1413. The first connection portion 1412 may be, but is not limited to, connect the first free end 1411 and the second free end 1413 by a bent shape, an arc shape, or the like, as long as the first free end 1411 can move relative to the second free end 1413. In the capacitor module 100 of the present embodiment, the first free end 1411 supports the capacitor 110, and the first free end 1411 is movable relative to the second free end 1413, so that the first free end 1411 is not separated from the first connection portion 1412, but is elastically deformed by the elasticity of the first support 141. The first free end 1411 can be moved either toward the second free end 1413 or away from the second free end 1413.
The capacitor assembly 100 provided by the present application includes a capacitor 110, a first pin 120, a second pin 130, and a damper 140, wherein the damper 140 is disposed in an accommodating space 150 formed by the capacitor 110, the first pin 120, and the second pin 130, and the damper 140 is used for damping the capacitor 110. Because the vibration damper supports the capacitor, the vibration amplitude and frequency of the capacitor are reduced. In addition, when the capacitor 110 works, the vibration of the capacitor 110 drives the vibration absorber 140 to move, so that the vibration absorber 140 can vibrate together with the capacitor 110, and thus a deformation quantity generated by the vibration of the capacitor 110 is transmitted to the air in the accommodating space 150, that is, the kinetic energy of the vibration absorber 140 is converted into heat energy through the friction between the vibration absorber 140 and the air and is dissipated into the air. In addition, the air in the accommodating space 150 is repeatedly compressed and released along with the vibration of the vibration absorber 140, and in the process, friction occurs between the air and the vibration absorber 140 and between the air and its molecules, so that a damping force for the vibration of the vibration absorber 140 is formed, and the amplitude and frequency of the vibration absorber 140 are suppressed. Therefore, the present application provides a capacitor assembly 100, which can reduce the vibration frequency of the capacitor 110 through the vibration damper 140 to suppress or even eliminate the squeal generated during the operation of the capacitor 110. When the capacitor assembly 100 is applied to a display device, the quality of the display device is high.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a capacitor device according to a second embodiment of the present disclosure. In the present embodiment, the capacitor assembly 100 includes a capacitor 110, a first pin 120, a second pin 130, and a damper 140. The second pin 130 and the first pin 120 are respectively connected to two opposite ends of the capacitor 110, and the second pin 130, the first pin 120 and the capacitor 110 form an accommodating space 150. The vibration damper 140 is disposed in the accommodating space 150, and is used for damping vibration of the capacitor 110. The vibration absorber 140 includes a first support 141 and a second support 142. The first support 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413 connected in sequence. The first free end 1411 is used to support the capacitor 110. The second free end 1413 faces away from the capacitor 110 as compared to the first free end 1411. The first free end 1411 is movable relative to the second free end 1413. When the vibration damper 140 includes the second supporting member 142, the second supporting member 142 has a third free end 1421, a second connecting portion 1422 and a fourth free end 1423 connected in sequence. The third free end 1421 is spaced apart from the first free end 1411, and is used for supporting the capacitor 110. The second connection part 1422 is connected to the first connection part 1412. The fourth free end 1423 is opposite to the capacitor 110 compared to the third free end 1421. The third free end 1421 is movable relative to the fourth free end 1423.
In the present embodiment (see fig. 4), the vibration reducer 140 includes a first support 141 and a second support 142. The first support 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413 connected in sequence. The first free end 1411 is used to support the capacitor 110. The second free end 1413 faces away from the capacitor 110 as compared to the first free end 1411. The first free end 1411 is movable relative to the second free end 1413. The second supporting member 142 has a third free end 1421, a second connecting portion 1422 and a fourth free end 1423 connected in sequence. The third free end 1421 is spaced apart from the first free end 1411, and is used for supporting the capacitor 110. The second connection part 1422 is connected to the first connection part 1412. The fourth free end 1423 is opposite to the capacitor 110 compared to the third free end 1421. The third free end 1421 is movable relative to the fourth free end 1423.
In this embodiment, the first connection portion 1412 may be connected to the first free end 1411 and the second free end 1413 by a bending shape, an arc shape, or the like, as long as the first free end 1411 can move relative to the second free end 1413. In the capacitor module 100 of the present embodiment, the first free end 1411 supports the capacitor 110, and the first free end 1411 is movable relative to the second free end 1413, so that the first free end 1411 is not separated from the first connection portion 1412, but is elastically deformed by the elasticity of the first support 141. The first free end 1411 can be moved either toward the second free end 1413 or away from the second free end 1413. The second connecting portion 1422 may be, but not limited to, connected to the third free end 1421 and the fourth free end 1423 through a bending shape, an arc shape, or the like, as long as the third free end 1421 can move relative to the fourth free end 1423. The third free end 1421 moves relative to the fourth free end 1423, and the third free end 1421 is not connected to the second connecting portion 1422, but is elastically deformed by the elasticity of the second supporting member 142. The third free end 1421 can move to approach the fourth free end 1423, or move to move away from the fourth free end 1423.
In this embodiment, the third free end 1421 is used for supporting the capacitor 110, and the third free end 1421 and the capacitor 110 move together, that is, the third free end 1421 and the capacitor 110 can move together relative to the fourth free end 1423. Since the third free end 1421 and the first free end 1411 are disposed at an interval, and both the third free end 1421 and the first free end 1411 are used for supporting the capacitor 110, the third free end 1421 and the first free end 1411 support the capacitor 110 together. Meanwhile, the second connecting portion 1422 is connected to the first connecting portion 1412, so that the second supporting member 142 and the first supporting member 141 can vibrate with the capacitor 110 at the same time, that is, while the third free end 1421 moves relative to the fourth free end 1423, the first free end 1411 also moves relative to the second free end 1413. The second supporting member 142 and the first supporting member 141 support the capacitor 110 together and vibrate as the capacitor 110 vibrates, so that the capacitor 110 is more stable during vibration.
Referring to fig. 5, fig. 5 is a schematic view illustrating elastic deformation of the damper according to the embodiment of fig. 3. The first free end 1411 moves relative to the second free end 1413, and the first free end 1411 moves relative to the second free end 1413 by a stroke L1Satisfies the following conditions: l is not less than 1mm1Less than or equal to 1.5 mm. For example, L11mm, or L11.1mm, or L11.2mm, or L11.3mm, or L11.4mm, or L11.5 mm. Following a stroke L of movement of the first free end 1411 relative to the second free end 14131An introduction is made. The distance between the first free end 1411 and the second free end 1413 is L when the first support 141 is in the natural state (state a)11. The distance between the first free end 1411 and the second free end 1413 is L when the first support 141 is in the maximum compression state (state b)12. The distance between the first free end 1411 and the second free end 1413 is L when the first support 141 is in the maximum stretching state (state c)13. Then, the maximum travel of the first free end 1411 moving towards the direction close to the second free end 1413 is: l is1=L11-L12(ii) a A maximum travel L of the first free end 1411 in a direction away from the second free end 14131=L13-L11. In the present embodiment, the maximum stroke L of the first free end 1411 moving toward the second free end 1413 is not limited to the first free end 14111Or the maximum L of the travel of the first free end 1411 away from the second free end 14131All satisfy 1mm < L1Less than or equal to 1.5 mm. It should be noted that the maximum travel of the first free end 1411 in a direction approaching the second free end 1413 may be equal to or different from the maximum travel of the first free end 1411 in a direction departing from the second free end 1413. If the first free end 1411 moves with a stroke L relative to the second free end 14131>1.5mm, the vibration amplitude of the capacitor 110 is too large, which may cause the first free end 1411 to be connected to the second free end 1413The shock or even the collision may affect the vibration damping effect of the first support 141. If the first free end 1411 moves with a stroke L relative to the second free end 14131<1mm, which may cause the first support member 141 not to provide a sufficiently strong damping force during the vibration of the capacitor 110, may affect the vibration damping effect of the first support member 141. By a stroke L of movement of the first free end 1411 relative to the second free end 14131So that the first supporting member 141 provides a strong enough damping force during the vibration of the capacitor 110, thereby reducing the vibration amplitude and frequency of the capacitor 110, and achieving the purpose of suppressing or even eliminating the squeal generated by the vibration of the capacitor 110.
Referring to fig. 6, fig. 6 is a schematic view illustrating elastic deformation of the damper according to the embodiment of fig. 4. The first free end 1411 moves relative to the second free end 1413, and the first free end 1411 moves relative to the second free end 1413 by a stroke L1Satisfies the following conditions: l is not less than 1mm1Less than or equal to 1.5 mm. The stroke L of the third free end 1421 moving relative to the fourth free end 14232Satisfies the following conditions: l is not less than 1mm2≤1.5mm。
For example, L11mm, or L11.1mm, or L11.2mm, or L11.3mm, or L11.4mm, or L11.5 mm. Following a stroke L of movement of the first free end 1411 relative to the second free end 14131An introduction is made. The distance between the first free end 1411 and the second free end 1413 is L when the first support 141 is in the natural state (state A)11. The distance between the first free end 1411 and the second free end 1413 is L when the first support 141 is in the maximum compression state (state B)12. The distance between the first free end 1411 and the second free end 1413 is L when the first support 141 is in the maximum stretching state (state C)13. Then, the first free end 1411 moves toward the direction close to the second free end 1413 by the maximum stroke L1Comprises the following steps: l is1=L11-L12(ii) a First free end 1411The maximum travel towards the direction away from the second free end 1413 is: l is1=L13-L11. In the present embodiment, the maximum stroke L of the first free end 1411 moving toward the second free end 1413 is not limited to the first free end 14111Or the maximum L of the travel of the first free end 1411 away from the second free end 14131All satisfy 1mm < L1Less than or equal to 1.5 mm. It should be noted that the maximum travel of the first free end 1411 in a direction approaching the second free end 1413 may be equal to or different from the maximum travel of the first free end 1411 in a direction departing from the second free end 1413. If the first free end 1411 moves with a stroke L relative to the second free end 14131>1.5mm, the vibration amplitude of the capacitor 110 is too large, which may cause the first free end 1411 to contact or even collide with the second free end 1413, thereby affecting the vibration damping effect of the first support 141. If the first free end 1411 moves with a stroke L relative to the second free end 14131<1mm, which may cause the first support member 141 not to provide a strong enough damping force during the vibration of the capacitor 110, and may affect the vibration damping effect of the first support member 141. By a stroke L of movement of the first free end 1411 relative to the second free end 14131So that the first supporting member 141 provides a strong enough damping force during the vibration of the capacitor 110, thereby reducing the vibration amplitude and frequency of the capacitor 110, and achieving the purpose of suppressing or even eliminating the squeal generated by the vibration of the capacitor 110.
For example, L21mm, or L21.1mm, or L21.2mm, or L21.3mm, or L21.4mm, or L21.5 mm. Following a stroke L of movement of said third free end 1421 with respect to said fourth free end 14232An introduction is made. When the second supporting member 142 is in the natural state (state a), a distance between the third free end 1421 and the fourth free end 1423 is L21. The third support 142 is in the maximum compression state (state B)The distance between the free end 1421 and the fourth free end 1423 is L22. When the second supporting member 142 is in the maximum stretching state (state C), a distance between the third free end 1421 and the fourth free end 1423 is L23. Then, the third free end 1421 moves toward the maximum stroke L approaching the fourth free end 14232Comprises the following steps: l is2=L21-L22(ii) a The third free end 1421 moves towards the maximum stroke L facing away from the fourth free end 14232Comprises the following steps: l is2=L23-L21. In this embodiment, the maximum stroke L of the third free end 1421 moving toward the fourth free end 1423 is not limited to2Or the maximum stroke L of the third free end 1421 moving away from the fourth free end 14232All satisfy 1mm < L2Less than or equal to 1.5 mm. It should be noted that the maximum stroke of the third free end 1421 moving toward the direction close to the fourth free end 1423 may be equal to or different from the maximum stroke of the third free end 1421 moving away from the fourth free end 1423. If the third free end 1421 moves along a stroke L relative to the fourth free end 14232>1.5mm, the vibration amplitude of the capacitor 110 is too large, which may cause the third free end 1421 to contact or even collide with the fourth free end 1423, which may affect the vibration damping effect of the second support 142. If the third free end 1421 moves along the stroke L relative to the fourth free end 14232<1mm, which may cause the second support 142 not to provide a strong enough damping force during the vibration of the capacitor 110, and may affect the vibration damping effect of the second support 142. By a stroke L of movement of said third free end 1421 with respect to said fourth free end 14232So that the second supporting member 142 provides a strong enough damping force during the vibration of the capacitor 110, thereby reducing the vibration amplitude and frequency of the capacitor 110, and achieving the purpose of suppressing or even eliminating the squeal generated by the vibration of the capacitor 110.
Referring to fig. 4 and 7, fig. 7 is a schematic diagram illustrating a distribution of the vibration absorbers in the capacitor module according to the embodiment of fig. 4. In the present embodiment, the damper 140 includes a first support 141, or the damper 140 includes a first support 141 and a second support 142. The first support 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413 connected in sequence. The first free end 1411 is used to support the capacitor 110. The second free end 1413 faces away from the capacitor 110 as compared to the first free end 1411. The first free end 1411 is movable relative to the second free end 1413. When the vibration damper 140 includes the second supporting member 142, the second supporting member 142 has a third free end 1421, a second connecting portion 1422 and a fourth free end 1423 connected in sequence. The third free end 1421 is spaced apart from the first free end 1411, and is used for supporting the capacitor 110. The second connection part 1422 is connected to the first connection part 1412. The fourth free end 1423 is opposite to the capacitor 110 compared to the third free end 1421. The third free end 1421 is movable relative to the fourth free end 1423. In the present embodiment, the number of the dampers 140 is two or more, and the dampers 140 are provided at regular intervals in the extending direction of the first leg 120. It should be noted that the schematic diagram of the present embodiment is combined with the embodiment in fig. 4 by the number of the vibration dampers 140 being two or more, and it should be understood that the structural schematic diagram of the capacitor assembly 100 in fig. 7 does not limit the capacitor assembly 100 provided in the present application.
In the present embodiment, the extending direction of the first pin 120 refers to a direction in which the vibration reducer 140 is not wrapped by the capacitor 110, the first pin 120 and the second pin 130, that is, a direction indicated by an indication line D in fig. 7 or an opposite direction.
In the present embodiment, the number of the dampers 140 is two or more, and the dampers 140 are uniformly spaced in the extending direction of the first pins 120. In one embodiment, the number of the vibration dampers 140 is two, that is, the vibration dampers 140 may be spaced at any position in the extending direction of the first pins 120. In another embodiment, the number of the vibration dampers 140 is two or more, that is, the vibration dampers 140 are uniformly spaced in the extending direction of the first pins 120. Because the vibration of the capacitor 110 in the extending direction of the first pins 120 is distributed more uniformly, the vibration of the vibration absorbers 140 in the extending direction of the first pins 120 can increase the stability of the capacitor 110 in the working process, and when the capacitor 110 works, the vibration of the capacitor 110 drives the vibration absorbers 140 to move, so that the vibration absorbers 140 can vibrate together with the capacitor 110, and thus the deformation generated by the vibration of the capacitor 110 is transferred to the air in the accommodating space 150, that is, the kinetic energy generated by the vibration of the vibration absorbers 140 is converted into heat energy through the friction between the vibration absorbers 140 and the air and is dissipated into the air. Meanwhile, the air in the accommodating space 150 is repeatedly compressed and released along with the vibration of the plurality of vibration absorbers 140, and in the process, friction occurs between the air and the plurality of vibration absorbers 140 and between the air and the molecules of the air, so that a damping force for the vibration of the plurality of vibration absorbers 140 is formed, and the amplitude and the frequency of the vibration of the plurality of vibration absorbers 140 are suppressed. Because the plurality of vibration dampers 140 support the capacitor 110 together, the amplitude and frequency of the vibration of the capacitor 110 are further reduced, which is more beneficial to suppressing or even eliminating the squeal generated during the operation of the capacitor 110.
Referring to fig. 4 and 8, fig. 8 is a schematic view illustrating another distribution of the vibration dampers in the capacitor assembly according to the embodiment of fig. 4. In the present embodiment, the damper 140 includes a first support 141, or the damper 140 includes a first support 141 and a second support 142. The first support 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413 connected in sequence. The first free end 1411 is used to support the capacitor 110. The second free end 1413 faces away from the capacitor 110 as compared to the first free end 1411. The first free end 1411 is movable relative to the second free end 1413. When the vibration damper 140 includes the second supporting member 142, the second supporting member 142 has a third free end 1421, a second connecting portion 1422 and a fourth free end 1423 connected in sequence. The third free end 1421 is spaced apart from the first free end 1411, and is used for supporting the capacitor 110. The second connecting portion 1422 is connected to the first connecting portion 1412. The fourth free end 1423 is opposite to the capacitor 110 compared to the third free end 1421. The third free end 1421 is movable relative to the fourth free end 1423. In the present embodiment, the number of the dampers 140 is two or more. The capacitor assembly 100 has a first region 160, a middle region 170 and a second region 180 in sequence in a direction in which the first lead 120 points to the second lead 130. Wherein the first region 160 is disposed adjacent to the first lead 120. The second region 180 is disposed adjacent to the second lead 130. The intermediate region 170 is sandwiched between the first region 160 and the second region 180. Wherein the distribution density of the vibration damper 140 in the first region 160 is a first density. The distribution density in the second region 180 is a second density. The distribution density in the middle region 170 is a third density. Wherein the first density is greater than the third density and the second density is greater than the third density. It should be noted that the schematic diagram of the present embodiment is combined with the embodiment in fig. 4 by the number of the vibration dampers 140 being two or more, and it should be understood that the structural schematic diagram of the capacitor assembly 100 in fig. 8 does not limit the capacitor assembly 100 provided in the present application.
Since the capacitor 110 generally needs to be electrically connected to a circuit board through the first pin 120 and the second pin 130 to work, the first pin 120 and the second pin 130 on the capacitor 110 contact the circuit board, so that the vibration of the capacitor 110 is transmitted to the circuit board through the first pin 120 and the second pin 130, which causes the vibration of the circuit board and the vibration of the capacitor 110 to resonate, and the vibration amplitude near the first pin 120 and the second pin 130 is increased. That is, the vibration amplitude of the capacitor 110 in the first region 160 and the second region 180 is greater than the density of the middle region 170.
In the present embodiment, the dampers 140 are disposed at non-uniform intervals in the direction in which the first pins 120 point to the second pins 130, specifically, a first density of the dampers 140 disposed in the first region 160 is greater than a third density of the dampers 140 disposed in the middle region 170, that is, the number of the dampers 140 disposed in the first region 160 is greater than the number of the dampers 140 disposed in the middle region 170. The second density of the dampers 140 distributed in the second region 180 is greater than the third density of the dampers 140 distributed in the middle region 170, i.e., the number of the dampers 140 distributed in the second region 180 per unit area is greater than the number of the dampers 140 distributed in the middle region 170 per unit area. By distributing the vibration dampers 140 more densely in the first region 160 and the second region 180 than in the middle region 170, the vibration of the capacitor 110 in the first region 160 and the second region 180 with larger vibration amplitude can be damped, and the deformation of the capacitor 110 is more effectively reduced, so that the amplitude and frequency of the vibration of the capacitor 110 during operation are suppressed, the capacitor 110 is more stable during operation, and squeal generated during operation of the capacitor 110 is suppressed or even eliminated.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a capacitor device according to a third embodiment of the present disclosure. In the present embodiment, the damper 140 includes a first support 141, or the damper 140 includes a first support 141 and a second support 142. The first support 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413 connected in sequence. The first free end 1411 is used for supporting the capacitor 110. The second free end 1413 faces away from the capacitor 110 as compared to the first free end 1411. The first free end 1411 is movable relative to the second free end 1413. When the vibration damper 140 includes the second supporting member 142, the second supporting member 142 has a third free end 1421, a second connecting portion 1422 and a fourth free end 1423 connected in sequence. The third free end 1421 is spaced apart from the first free end 1411, and is used for supporting the capacitor 110. The second connection part 1422 is connected to the first connection part 1412. The fourth free end 1423 is opposite to the capacitor 110 compared to the third free end 1421. The third free end 1421 is movable relative to the fourth free end 1423. In addition, in the present embodiment, the first lead 120 includes a first lead body 121 and a first bending portion 122. The first bending part 122 is connected to the first lead body 121 and faces the second lead 130 compared to the first lead body 121. The second lead 130 includes a second lead body 131 and a second bending portion 132. The second bending portion 132 is connected to the second lead body 131 and faces the first lead 120 compared to the second lead body 131. When the vibration damper 140 includes the second support 142, the first free end 1411 and the third free end 1421 are spaced apart in a direction in which the first pins 120 point to the second pins 130. The second free end 1413 is fixedly connected to a surface of the first bending portion 122 facing the capacitor 110. The fourth free end 1423 is fixedly connected to a surface of the second bending portion 132 facing the capacitor 110. It should be noted that, the schematic diagram of the present embodiment is combined with the embodiment in fig. 4 by disposing the first free end 1411 and the third free end 1421 at intervals in the direction in which the first lead 120 points to the second lead 130, and it is understood that the structural schematic diagram of the capacitor assembly 100 in fig. 9 does not limit the capacitor assembly 100 provided in the present application.
In this embodiment, the first bending portion 122 is used for fixing the second free end 1413, and the first bending portion 122 supports the first supporting member 141 through the second free end 1413. The second bending portion 132 is used for fixing the fourth free end 1423, and the second bending portion 132 supports the second supporting member 142 through the fourth free end 1423. Therefore, the first bending portion 122 and the second bending portion 132 support the damper 140 together, and the damper 140 supports the capacitor 110, so that the stability of the vibration of the damper 140 and the capacitor 110 is increased, which is beneficial for the damper 140 to reduce the vibration amplitude and frequency of the capacitor 110, thereby suppressing or even eliminating the squeal generated by the vibration of the capacitor 110.
For example, the second free end 1413 can be fixed to the first bending portion 122 by, but not limited to, bonding or welding. The fourth free end 1423 may be, but is not limited to, fixed to the second bending portion 132 by bonding, welding, or the like.
In this embodiment, the capacitor 110 generally needs to be mounted on a circuit board through a conductive member 300 such as solder, conductive adhesive, etc., and the first bending portion 122 and the second bending portion 132 can increase the mounting area of the capacitor 110, so that the subsequent mounting application of the capacitor 110 is more stable and firm.
Referring to fig. 10, 11 and 12 together, fig. 10 is a schematic structural diagram of a capacitor assembly according to a fourth embodiment of the present disclosure; FIG. 11 is a schematic cross-sectional view of the capacitor assembly of the embodiment of FIG. 10 taken along line I-I; fig. 12 is a schematic cross-sectional view of the capacitor assembly of the embodiment of fig. 10 taken along the direction opposite to the line I-I. In the present embodiment, the damper 140 includes a first support 141, or the damper 140 includes a first support 141 and a second support 142. The first support 141 has a first free end 1411, a first connecting portion 1412 and a second free end 1413 connected in sequence. The first free end 1411 is used to support the capacitor 110. The second free end 1413 faces away from the capacitor 110 as compared to the first free end 1411. The first free end 1411 is movable relative to the second free end 1413. When the vibration absorber 140 includes the second supporting member 142, the second supporting member 142 has a third free end 1421, a second connecting portion 1422 and a fourth free end 1423 connected in sequence. The third free end 1421 is spaced apart from the first free end 1411, and is used for supporting the capacitor 110. The second connecting portion 1422 is connected to the first connecting portion 1412. The fourth free end 1423 is opposite to the capacitor 110 compared to the third free end 1421. The third free end 1421 is movable relative to the fourth free end 1423. In addition, in the present embodiment, the first lead 120 includes a first lead body 121 and a first bending portion 122. The first bending portion 122 is connected to the first lead body 121 and faces the second lead 130 compared to the first lead body 121. The second lead 130 includes a second lead body 131 and a second bending portion 132. The second bending portion 132 is connected to the second lead body 131 and faces the first lead 120 compared to the second lead body 131. When the vibration damper 140 includes the second support 142, the first free end 1411 and the third free end 1421 are spaced apart from each other in the extending direction of the first pin 120. The second free end 1413 is fixedly connected to the surface of the first bending portion 122 facing the capacitor 110 and the surface of the second bending portion 132 facing the capacitor 110. The fourth free end 1423 is fixedly connected to the surface of the first bending portion 122 facing the capacitor 110 and the surface of the second bending portion 132 facing the capacitor 110. It should be noted that, the schematic diagram of the present embodiment is combined with the embodiment in fig. 4 by disposing the first free end 1411 and the third free end 1421 at an interval in the extending direction of the first lead 120, and it should be understood that the schematic diagram of the present embodiment does not limit the capacitor assembly 100 provided in the present application.
The first free end 1411 and the third free end 1421 are spaced apart from each other in the extending direction of the first lead 120, i.e., the direction indicated by the indication line D in fig. 10 or the opposite direction.
In this embodiment, the first bending portion 122 and the second bending portion 132 jointly fix the second free end 1413, and the first bending portion 122 and the second bending portion 132 jointly support the first supporting member 141 through the second free end 1413. The first bending portion 122 and the second bending portion 132 are commonly used for fixing the fourth free end 1423, and the first bending portion 122 and the second bending portion 132 commonly support the second supporting element 142 through the fourth free end 1423. Therefore, the first bending portion 122 and the second bending portion 132 support the vibration absorber 140 together, and the vibration absorber 140 supports the capacitor 110, so that the stability of the vibration absorber 140 and the capacitor 110 is increased, which is beneficial for the vibration absorber 140 to reduce the vibration amplitude and frequency of the capacitor 110, thereby suppressing or even eliminating the squeal of the capacitor 110 caused by the vibration.
For example, the second free end 1413 can be fixed to the first bending portion 122 and the second bending portion 132 by, but not limited to, bonding or welding. The fourth free end 1423 can be fixed to the first bending portion 122 and the second bending portion 132 by, but not limited to, bonding or welding.
In this embodiment, the capacitor 110 generally needs to be mounted on a circuit board through a conductive member 300 such as solder, conductive adhesive, etc., and the first bending portion 122 and the second bending portion 132 can increase the mounting area of the capacitor 110, so that the subsequent mounting application of the capacitor 110 is more stable and firm.
Referring to fig. 13, fig. 13 is a schematic structural diagram illustrating a fixed connection between a shock absorber and a capacitor in the capacitor assembly according to the embodiment of fig. 9. In this embodiment, the first lead 120 includes a first lead body 121 and a first bending portion 122. The first bending portion 122 is connected to the first lead body 121 and faces the second lead 130 compared to the first lead body 121. The second lead 130 includes a second lead body 131 and a second bending portion 132. The second bending portion 132 is connected to the second lead body 131 and faces the first lead 120 compared to the second lead body 131. When the vibration damper 140 includes the second support 142, the first free end 1411 and the third free end 1421 are spaced apart in a direction in which the first pins 120 point to the second pins 130. The second free end 1413 is fixedly connected to a surface of the first bending portion 122 facing the capacitor 110. The fourth free end 1423 is fixedly connected to the surface of the second bending portion 132 facing the capacitor 110. Alternatively, when the vibration damper 140 includes the second support 142, the first free end 1411 and the third free end 1421 are spaced apart from each other in the extending direction of the first pin 120. The second free end 1413 is fixedly connected to the surface of the first bending portion 122 facing the capacitor 110 and the surface of the second bending portion 132 facing the capacitor 110. The fourth free end 1423 is fixedly connected to the surface of the first bending portion 122 facing the capacitor 110 and the surface of the second bending portion 132 facing the capacitor 110. In addition, in this embodiment, the first free end 1411 and the third free end 1421 are fixedly connected to the capacitor 110, and the first free end 1411 and the third free end 1421 support the capacitor 110 together. It should be noted that, the schematic diagram of the present embodiment is combined with the embodiment in fig. 9 in which the first free end 1411 and the third free end 1421 are fixedly connected to the capacitor 110, and it is understood that the structural schematic diagram of the capacitor assembly 100 in fig. 11 does not limit the capacitor assembly 100 provided in the present application.
In this embodiment, the first free end 1411 and the third free end 1421 are fixedly connected to the capacitor 110, and the first free end 1411 and the third free end 1421 support the capacitor 110 together. That is, the first supporting member 141 is fixedly connected to the capacitor 110 through the first free end 1411, and the first supporting member 141 supports the capacitor 110 through the first free end 1411. The second supporting member 142 is fixed to the capacitor 110 through the third free end 1421, and the second supporting member 142 supports the capacitor 110 through the third free end 1421. Therefore, the vibration damper 140 is fixedly connected to the capacitor 110 and supports the capacitor 110. When the capacitor 110 is in operation, the vibration of the capacitor 110 drives the first free end 1411 to move relative to the second free end 1413, and the vibration of the capacitor 110 drives the third free end 1421 to move relative to the fourth free end 1423, so that the vibration absorber 140 can vibrate together with the capacitor 110, thereby transmitting the deformation quantity generated by the vibration of the capacitor 110 to the vibration absorber 140, and converting the kinetic energy of the vibration absorber 140 into heat energy to be dissipated into the air through the friction between the vibration absorber 140 and the air. Meanwhile, the air in the accommodating space 150 is repeatedly compressed and released along with the vibration of the first support member 141 and the second support member 142, and friction occurs between the air and the vibration absorber 140 and between molecules of the air itself in the process, so that a damping force for the vibration of the vibration absorber 140 is formed, and the amplitude and the frequency of the vibration absorber 140 are suppressed. Since the first free end 1411 and the third free end 1421 of the vibration absorber 140 are fixedly connected to the capacitor 110 and support the capacitor 110, the vibration frequency of the capacitor 110 is reduced, and the howling generated during the operation of the capacitor 110 is suppressed or even eliminated.
Referring to fig. 14, fig. 14 is a schematic structural view of the elastic abutting pins of the shock absorber and the capacitor in the capacitor assembly provided in the embodiment of fig. 13. In this embodiment, the first lead 120 includes a first lead body 121 and a first bending portion 122. The first bending portion 122 is connected to the first lead body 121 and faces the second lead 130 compared to the first lead body 121. The second lead 130 includes a second lead body 131 and a second bending portion 132. The second bending portion 132 is connected to the second lead body 131 and faces the first lead 120 compared to the second lead body 131. When the vibration damper 140 includes the second support 142, the first free end 1411 and the third free end 1421 are spaced apart in a direction in which the first pins 120 point to the second pins 130. The second free end 1413 is fixedly connected to a surface of the first bending portion 122 facing the capacitor 110. The fourth free end 1423 is fixedly connected to the surface of the second bending portion 132 facing the capacitor 110. Alternatively, when the vibration damper 140 includes the second support 142, the first free end 1411 and the third free end 1421 are spaced apart from each other in the extending direction of the first pin 120. The second free end 1413 is fixedly connected to the surface of the first bending portion 122 facing the capacitor 110 and the surface of the second bending portion 132 facing the capacitor 110. The fourth free end 1423 is fixedly connected to the surface of the first bending portion 122 facing the capacitor 110 and the surface of the second bending portion 132 facing the capacitor 110. The first free end 1411 and the third free end 1421 are fixedly connected to the capacitor 110, and the first free end 1411 and the third free end 1421 support the capacitor 110 together. In addition, in the present embodiment, the first supporting member 141 elastically abuts against the capacitor 110 and the first bending portion 122. The second supporting member 142 elastically abuts against the capacitor 110 and the second bending portion 132. It should be noted that the schematic diagram of the present embodiment is illustrated in an embodiment that the vibration reducer 140 is elastically abutted to the capacitor 110 and the first pin 120 and the second pin 130 are combined to the embodiment in fig. 11, and it is understood that the structural schematic diagram of the capacitor assembly 100 in fig. 12 does not limit the capacitor assembly 100 provided in the present application.
In the present embodiment, the damper 140 elastically abuts the capacitor 110 and the first bent portion 122 through the first supporting member 141, and elastically abuts the capacitor 110 and the second bent portion 132 through the second supporting member 142. Specifically, when the capacitor 110 is not in operation, the first free end 1411 has potential energy moving in a direction away from the second free end 1413, and the third free end 1421 has potential energy moving in a direction away from the fourth free end 1423. Therefore, the vibration damper 140 has elastic potential energy for supporting the capacitor 110 in a direction away from the vibration damper 140. When the capacitor 110 works, the capacitor is usually connected to a circuit board to work, so that the vibration of the capacitor 110 is transmitted to the circuit board, and because the vibration absorber 140 has elastic potential energy opposite to the vibration propagation, the vibration absorber 140 can form resistance to the vibration of the capacitor 110 through the elasticity recovered by deformation, and can further suppress the amplitude and frequency of the vibration of the capacitor 110, thereby suppressing or even eliminating the squeal generated by the capacitor 110 in the working process.
The present application further provides a circuit board assembly 10. Referring to fig. 15, fig. 15 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure. The circuit board assembly 10 includes a circuit board 200 and the capacitor assembly 100 according to any of the above embodiments, wherein the capacitor assembly 100 is electrically connected to the circuit board 200.
In the present embodiment, the circuit board assembly 10 may be used for power filtering, signal coupling, resonance, filtering, compensation, charging and discharging, energy storage, dc isolation, and the like.
When the capacitor 110 is in operation, howling may occur due to too high self-vibration frequency. Meanwhile, when the capacitor 110 is powered on the circuit board 200 for operation, the capacitor 110 drives the circuit board 200 to vibrate, so that the capacitor 110 and the circuit board 200 generate squeal due to vibration.
In this embodiment, the capacitor module 100 is electrically connected to the circuit board 200 through the conductive members 300, so that the capacitor module 100 is electrically connected to the circuit board 200. The conductive member 300 may be, but not limited to, soldered or bonded by conductive adhesive. In one embodiment, the first lead body 121 and the second lead body 131 are electrically connected to the circuit board 200 through the conductive members 300 to form a side connection of the capacitor assembly 100. In another embodiment, the first lead body 121 and the second lead body 131 are electrically connected to the circuit board 200 through the conductive member 300 to form a side connection of the capacitor assembly 100, and the first bending portion 122 and the second bending portion 132 are electrically connected to the circuit board 200 through the conductive member 300 to form a bottom connection of the capacitor assembly 100, so that the capacitor assembly 100 can be more firmly and stably connected to the circuit board 200.
In the present embodiment, the vibration damper 140 not only can reduce the vibration amplitude and frequency of the capacitor 110, but also can play a role of buffering between the capacitor 110 and the circuit board 200 to suppress or even eliminate the resonance between the capacitor 110 and the circuit board 200, so as to suppress or even eliminate the howling generated when the capacitor 110 operates on the circuit board 200.
The present application also provides a display device 1. Referring to fig. 16, fig. 16 is a circuit block diagram of a display device according to an embodiment of the present disclosure. The display device 1 includes a display panel 20 and the circuit board assembly 10, and the circuit board assembly 10 is electrically connected to the display panel 20.
In the present embodiment, the vibration amplitude and frequency of the capacitor 110 and the circuit board 200 are reduced by the vibration reducer 140, and the resonance between the capacitor 110 and the circuit board 200 is suppressed or even eliminated, so that the howling generated when the capacitor 110 operates in the display device 1 is suppressed or even eliminated.
In one embodiment, the circuit board 200 includes a filter circuit. The capacitor 110 operates as a part of a filter circuit on the circuit board 200, and the filter circuit in the circuit board 200 filters an input first current to obtain a second current, and provides the second current to the display panel 20, so as to drive the display panel 20 to operate.
The filter circuit includes a high-pass filter circuit, a low-pass filter circuit, and a band-pass filter circuit, and the following describes details of the filter circuit as the high-pass filter circuit, the low-pass filter circuit, or the band-pass filter circuit.
In one embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a high-pass filter circuit. Specifically, the cut-off frequency of the high-pass filter circuit is f0, and the frequency f1 of the first current is: fa is less than f1 and less than fb, fa is less than f0 and less than fb, and the frequency f2 of the second current is: f0 is not less than f2 is not less than fb. For example, in one embodiment, the cutoff frequency f0 of the high-pass filter circuit is 50Hz, and the frequency f1 of the first current ranges from: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is less than or equal to 50Hz and less than or equal to 200Hz, in other words, the high-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 50Hz to 200 Hz. In another embodiment, the cut-off frequency f0 of the high-pass filter circuit is 100Hz, and the frequency f1 of the first current is in the range of: f1 is more than or equal to 20Hz and less than or equal to 200Hz, the frequency f2 of the second current ranges from f2 to 200Hz, in other words, the high-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 100Hz to 200 Hz.
In another embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a low pass filter circuit. Specifically, the cut-off frequency of the low-pass filter circuit is f0, and the frequency f1 of the first current is: fa is less than f1 and less than fb, fa is less than f0 and less than fb, and the frequency f2 of the second current is: fa is less than or equal to f2 and less than or equal to f 0. For example, in one embodiment, the cut-off frequency f0 of the low-pass filter circuit is 150Hz, and the frequency f1 of the first current is in the range: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is more than or equal to 20Hz and less than or equal to 150Hz, in other words, the low-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 20Hz to 150 Hz. In another embodiment, the cut-off frequency f0 of the low-pass filter circuit is 120Hz, and the frequency f1 of the first current is in the range of: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is more than or equal to 20Hz and less than or equal to 120Hz, in other words, the low-pass filter circuit of the circuit board 200 filters the current frequency from 20-200 Hz to 20-120 Hz.
In another embodiment, the circuit board 200 includes a filter circuit, and the filter circuit is a band-pass filter circuit. Specifically, the high-pass cutoff frequency of the band-pass filter circuit is f01, the low-pass cutoff frequency of the band-pass filter circuit is f02, and the frequency f1 of the first current is: fa is less than f1 and less than fb, fa is less than f01 and less than f02 and less than fb, and then the frequency f2 of the second current is: f01 is not less than f2 is not less than f 02. For example, in one embodiment, the high-pass cutoff frequency f01 of the band-pass filter circuit is 50Hz, the low-pass cutoff frequency f02 of the band-pass filter circuit is 150Hz, and the frequency f1 of the first current is in the range of: f1 is more than or equal to 20Hz and less than or equal to 200Hz, and the frequency f2 of the second current ranges from: f2 is less than or equal to 50Hz and less than or equal to 150Hz, in other words, the band-pass filter circuit of the circuit board 200 filters the current frequency from 20Hz to 200Hz to 50Hz to 150 Hz.
It should be noted that this embodiment only exemplifies some applications of the display device 1, and does not limit the application range of the display device 1.
Although embodiments of the present application have been shown and described, it is understood that the above embodiments are illustrative and not restrictive, and that those skilled in the art may make changes, modifications, substitutions and alterations to the above embodiments without departing from the scope of the present application, and that such changes and modifications are also to be considered as within the scope of the present application.

Claims (10)

1. A capacitive assembly, comprising:
a capacitor;
a first pin;
the second pin and the first pin are respectively connected to two ends of the capacitor, which are opposite to each other, and the second pin, the first pin and the capacitor form an accommodating space; and
the shock absorber is arranged in the accommodating space and comprises a first supporting piece, the first supporting piece is provided with a first free end, a first connecting portion and a second free end which are sequentially connected, the first free end is used for supporting the capacitor, the second free end deviates from the capacitor compared with the first free end, and the first free end can move relative to the second free end.
2. The capacitive assembly of claim 1 wherein said vibration damper further comprises:
the second supporting piece is provided with a third free end, a second connecting portion and a fourth free end which are sequentially connected, the third free end and the first free end are arranged at intervals and used for supporting the capacitor, the second connecting portion is connected with the first connecting portion, the fourth free end is opposite to the third free end and deviates from the capacitor, and the third free end can move relative to the fourth free end.
3. The capacitor assembly according to claim 2, wherein the number of the dampers is two or more, and the dampers are arranged at regular intervals in the extending direction of the first pin.
4. The capacitor assembly of claim 2, wherein the number of the dampers is two or more, the capacitor assembly has a first region, an intermediate region and a second region in sequence in a direction in which the first lead points to the second lead, wherein the first region is disposed adjacent to the first lead, the second region is disposed adjacent to the second lead, and the intermediate region is sandwiched between the first region and the second region, wherein the dampers have a first density in the first region, a second density in the second region, and a third density in the intermediate region, wherein the first density is greater than the third density, and the second density is greater than the third density.
5. The capacitive assembly of claim 2 wherein the first pin comprises:
a first pin body; and
the first bent part is connected to the first pin body and faces the second pin compared with the first pin body;
the second pin includes:
a second pin body; and
a second bending part connected to the second lead body and facing the first lead compared to the second lead body;
when the shock absorber comprises a second supporting piece, the first free end and the third free end are arranged at intervals in the direction that the first pin points to the second pin, the second free end is fixedly connected to the surface, facing the capacitor, of the first bending part, and the fourth free end is fixedly connected to the surface, facing the capacitor, of the second bending part.
6. The capacitive assembly of claim 2 wherein the first pin comprises:
a first pin body; and
the first bent part is connected to the first pin body and faces the second pin compared with the first pin body;
the second pin includes:
a second pin body; and
a second bending part connected to the second lead body and facing the first lead compared to the second lead body;
when the shock absorber includes the second supporting member, the first free end and the third free end are disposed at an interval in the extending direction of the first pin, the second free end is respectively and fixedly connected to the surface of the first bending portion facing the capacitor and the surface of the second bending portion facing the capacitor, and the fourth free end is respectively and fixedly connected to the surface of the first bending portion facing the capacitor and the surface of the second bending portion facing the capacitor.
7. The capacitor assembly of claim 5 or 6, wherein the first free end and the third free end are fixedly connected to the capacitor, and the first free end and the third free end jointly support the capacitor.
8. The capacitor assembly according to claim 7, wherein the first supporting member elastically abuts against the capacitor and the first bent portion, and the second supporting member elastically abuts against the capacitor and the second bent portion.
9. A circuit board assembly, comprising:
a circuit board; and
the capacitive assembly of any one of claims 1-8, electrically connected to the circuit board.
10. A display device, characterized in that the display device comprises:
a display panel; and
the circuit board assembly of claim 9, and electrically connected to the display panel.
CN202210170547.0A 2022-02-23 2022-02-23 Capacitor assembly, circuit board assembly and display device Pending CN114446641A (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000182888A (en) * 1998-12-16 2000-06-30 Taiyo Yuden Co Ltd Multilayer ceramic capacitor
JP2000223357A (en) * 1998-11-25 2000-08-11 Taiyo Yuden Co Ltd Laminated ceramic capacitor
KR20170017137A (en) * 2015-08-05 2017-02-15 삼성전기주식회사 Capacitor component
CN211479864U (en) * 2020-04-03 2020-09-11 兰州文理学院 Solid-state super capacitor
CN112750620A (en) * 2019-05-22 2021-05-04 何俊建 Anti-vibration capacitor and use method thereof
CN113539684A (en) * 2020-04-20 2021-10-22 三星电机株式会社 Multilayer capacitor and board for mounting the same
CN113725001A (en) * 2021-09-01 2021-11-30 李秀喜 Mixed type self-protection capacitor

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223357A (en) * 1998-11-25 2000-08-11 Taiyo Yuden Co Ltd Laminated ceramic capacitor
JP2000182888A (en) * 1998-12-16 2000-06-30 Taiyo Yuden Co Ltd Multilayer ceramic capacitor
KR20170017137A (en) * 2015-08-05 2017-02-15 삼성전기주식회사 Capacitor component
CN112750620A (en) * 2019-05-22 2021-05-04 何俊建 Anti-vibration capacitor and use method thereof
CN211479864U (en) * 2020-04-03 2020-09-11 兰州文理学院 Solid-state super capacitor
CN113539684A (en) * 2020-04-20 2021-10-22 三星电机株式会社 Multilayer capacitor and board for mounting the same
CN113725001A (en) * 2021-09-01 2021-11-30 李秀喜 Mixed type self-protection capacitor

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