KR102180673B1 - Substrate plating device for ultrasonic wave rotation type and the method of substrate plating using thereof - Google Patents

Abstract

The present invention relates to a plating apparatus for a substrate and a substrate plating method using the same. Specifically, the present invention relates to the plating apparatus for the ultrasonic wave-type substrate and the substrate plating method using the same, which are able to rotate an inner tub, to generate a rotary water current, to allow a plating solution to sufficiently come in contact with an inner wall of a hole unit of the substrate, to prevent an erroneous work which causes a part not to be coated with the plating solution, to prevent the substrate from being corroded by the solution in which it has come in contact during the next process since the plating solution is not applied, to prevent erroneous work which discovers a defect of the substrate after various components have been installed on the substrate, which results in discarding all the various components installed on the substrate, to irradiate an ultrasonic wave to the plating solution, to allow the plating solution to be easily introduced by removing air bubbles from the inner wall of the hole unit of the substrate by vibration and removing foreign substances from the substrate.

Description

Ultrasonic type substrate plating apparatus and substrate plating method using the same {SUBSTRATE PLATING DEVICE FOR ULTRASONIC WAVE ROTATION TYPE AND THE METHOD OF SUBSTRATE PLATING USING THEREOF}

The present invention relates to a plating apparatus for a substrate and a substrate plating method using the same, and in detail, by rotating an inner cylinder to generate a rotational flow, the plating solution is sufficiently contacted with the inner wall of the hole portion of the substrate, resulting in a portion where the plating solution is not applied. Work can be prevented, and the substrate can be prevented from being corroded by the solution that comes into contact during the next process because the plating solution is not applied, and various parts installed on the substrate due to the defect of the substrate being found after various components are installed on the substrate. This is an ultrasonic type substrate that prevents mis-work that must all be discarded in advance, and removes foreign substances from the substrate by irradiating ultrasonic waves to the plating solution to remove bubbles on the inner wall of the hole portion of the substrate by vibration of the plating solution. It relates to a plating apparatus and a substrate plating method using the same.

In general, a printed circuit board (PCB), a panel level package (PLP), and a wafer level package (Wafer) constituting an electronic component package due to the high density, high speed and microminiature of semiconductor integrated circuits (ICs). Level Package: WLP) In addition, the need for research and development on miniaturization, thinness, high speed and reliability is required.

Wire bonding pads, solder joint pads, or contact terminals for chip mounting on wiring boards that play a key role in transferring current, voltage, and signals between such electronic devices and electronic component packages. It is (Land Grid Array).

In the case of a board for a wire bonding package, gold plating is required on the part where the wire bonding surface and the solder ball are joined, and in the case of a flip chip board (FCLGA) having contact terminals that are recently produced, the part where the flip chip is mounted and the mother board ( Gold plating is required for the land part that is in contact with the main board.

The electronic component package serves to electrically connect semiconductor chips and allow various semiconductor chips to be installed on a substrate. Electronic component packages are generally composed of a substrate and a conductive circuit formed on the surface of the substrate. In order to construct a conductive circuit, the electronic component package is a copper plating process in which a plating layer having a thickness of less than about 1㎛ is formed on the surface. This can be done.

The copper plating process is largely divided into two types, one is chemical copper plating and the other is electro-copper plating (also referred to as electrolytic plating).

Electro-copper plating has the advantage of being plated faster than chemical copper plating, but plating companies prefer chemical copper plating due to the disadvantage that it cannot be uniformly plated over the entire substrate due to the difference in current intensity by location.

In particular, in the conventional substrate plating apparatus for chemical copper plating, the substrate is mounted on a fixing jig and inserted into a processing tank to perform the plating process.However, the conventional fixing jig does not firmly fix the substrate, so deformation such as distortion of the substrate. There was a structural problem in that product defects frequently occur during the plating process due to this.

Accordingly, research and development of a fixing jig for a substrate plating apparatus capable of preventing deformation such as distortion by firmly fixing the substrate in the processing tank of the substrate plating apparatus during chemical copper plating of the substrate constituting the electronic component package is required. Actually.

In order to solve the above problems, a fixing jig for a substrate plating apparatus has been developed, and the fixing jig according to the prior art can fix a substrate inserted into a processing tank of a substrate plating apparatus when chemical copper plating of a substrate constituting an electronic component package. In the fixing jig for a substrate plating apparatus with a rectangular frame, a fixing jig body that forms a rectangular frame, a clamp-shaped upper clamp installed on the top of the fixing jig body and formed to fix the top of the board, and the fixing jig body A plurality of lower clamps are installed at a predetermined interval at the lower portion and formed to fix the lower portion of the substrate.

The background technology of the present invention is disclosed in Korean Registered Patent Publication No. 10-1944963 (announced on February 07, 2019, title of invention: fixing jig for substrate plating apparatus).

Plating apparatus using a fixing jig according to the prior art does not have a separate technical configuration for sufficiently contacting the plating solution with the inner wall of the hole when a fine hole is formed on the substrate, so that the plating on the inner wall of the hole of the substrate with the fine hole is provided. There is a problem in that the unplated part may be generated, and the non-plated part may be corroded during the next process on the substrate in which the complete plating is not performed.

In addition, in the plating apparatus according to the prior art, various components can be installed on the substrate without plating on the inner wall of the fine hole, and when defects of the substrate are found after various components are installed on the substrate, various components installed on the substrate Since they have to be discarded, there is a problem that it is not possible to reduce the time and cost required for manufacturing the substrate.

In addition, in the plating apparatus according to the prior art, it is difficult to install the substrate, and the plating process becomes complicated, as the time required for the plating process of the substrate is complicated because the substrate must be placed in the processing tank together with the fixing jig after installing the substrate on a separate fixing jig. And it is difficult to reduce the cost.

Korean Patent Publication No. 10-1944963

The present invention is to solve the above problems, by rotating the inner cylinder to generate a rotational water flow, it is possible to prevent erroneous work in which a portion where the plating solution is not applied occurs when the plating solution sufficiently contacts the inner wall of the hole portion of the substrate, Since the plating solution is not applied, it is possible to prevent the substrate from being corroded by the solution that comes into contact during the next process, and after various parts are installed on the substrate, defects in the substrate are found and all the various parts installed on the substrate must be discarded. The ultrasonic type substrate plating apparatus and substrate plating using the same to prevent foreign substances from the substrate while the plating solution removes air bubbles on the inner wall of the hole portion of the substrate by vibration by irradiating ultrasonic waves to the plating solution and removes foreign substances from the substrate. Its purpose is to provide a method.

Features of the present invention for achieving the above object,

An inner passage having an open top cylindrical shape, a plurality of water flow blades provided in a height direction on an inner surface, and a plurality of discharge holes formed on a side surface; An outer passage surrounding the inner casing and discharging the plating solution discharged from the inner casing; A substrate fixing portion fixed to the central portion of the inner cylinder, a plurality of substrates fixed, and a plating solution supplied and discharged therein; Rotate the inner cylinder to rotate the plating solution stored in the inner cylinder at a reference level to generate a rotational water flow, thereby rotatably supporting the inner cylinder so that the plating solution passes through the hole portion of the substrate to proceed with the plating process, and provides power to the inner cylinder A driving unit to perform; A circulation unit supplying a predetermined amount of a plating solution discharged from the inner cylinder to the outer cylinder to the substrate fixing unit; An ultrasonic generator installed on the bottom surface of the outer cylinder to generate ultrasonic waves; And a filter unit installed in the circulation unit to remove foreign substances from the plating solution.

Here, the substrate fixing part is formed in a tube shape so that the plating solution that is pressurized into the inside is introduced, and a plurality of nozzles are arranged in a row in the longitudinal direction on the outside, and each row is radially arranged to discharge the plating solution to the substrate. A fixed column provided with a nozzle; A support that is formed in an "L" shape to fix the substrate and has a cross-sectional shape of a "degeunja" and is installed at a non-interference position between the plurality of nozzles and the nozzles; And a pressure clamp installed inside the support and pressurizing the substrate.

Here, the pressure clamp is formed in a square shape, and a body having a guide hole; A pressing plate having a guide protrusion inserted into the guide hole of the main body on an outer surface and a silicone pad attached to the inner surface; And a coil spring inserted into the guide hole of the main body to provide elasticity to the pressure plate.

Here, the nozzle of the fixed column sprays the plating solution in the same direction as the rotation direction of the inner cylinder, thereby increasing the rotational force of the rotating water flow.

Here, the circulation part includes a circulation pipe having one end connected to the lower end of the outer cylinder and the other end connected to the substrate fixing part; It is installed in the circulation pipe and consists of a pump that pressurizes the plating liquid stored in the outer cylinder into the substrate fixing part.

Another feature of the present invention,

A substrate plating method using the ultrasonic type substrate plating apparatus, comprising: a substrate fixing step of fixing a plurality of substrates to a substrate fixing portion; A rotation process of injecting a plating solution into the inner cylinder at a reference level through a substrate fixing unit, and rotating the inner cylinder through a driving unit to generate a rotational water flow with the plating solution; A plating process in which plating is performed while the plating solution is injected into the hole portion of the substrate by the rotational water flow; An ultrasonic generation process of generating ultrasonic waves in an ultrasonic generator during the plating process; A plating solution circulation process in which the plating solution discharged to the outer tube through the inner tube is pressurized using a circulation unit to circulate to the substrate fixing unit; And a filtering process of removing foreign substances contained in the plating solution through a filter unit when the plating solution circulation process is performed.

Here, the plating solution circulation process increases the rotational force of the rotational water flow while discharging it in the same direction as the rotational water flow through the nozzle of the substrate fixing part.

According to the ultrasonic type substrate plating apparatus and the substrate plating method using the same according to the present invention constituted as described above, the substrate is installed, the plating solution is supplied, and the inner cylinder rotated by the driving unit is provided. Because of this rotation, a rotational water flow occurs in the plating solution and passes through the hole formed in the substrate, so that the plating solution sufficiently contacts the inner wall of the minute hole formed in the substrate, thereby enabling precise plating.

In addition, according to the present invention, after the plating solution in the inner cylinder is discharged to the outer cylinder, it is pressed and circulated through the substrate fixing portion to the center of the inner cylinder. Plating is performed to effectively prevent defects in the substrate.

In addition, according to the present invention, by irradiating ultrasonic waves to the plating solution to generate vibration, air bubbles in the hole portion of the substrate are removed so that the plating solution flows smoothly into the hole portion, and the occurrence of defects is minimized by removing foreign substances attached to the hole portion of the substrate. I can make it.

In addition, according to the present invention, when the substrate is inserted into the column fixing portion, the substrate is easily attached and detached by the operator because the substrate is easily detached and fixed by a pressure clamp by means of a pressure clamp, thereby providing convenience to the operator.

1 is a cross-sectional view showing the configuration of an ultrasonic type substrate plating apparatus according to the present invention.
2 is a plan view showing the configuration of an ultrasonic type substrate plating apparatus according to the present invention.
3 is a perspective view showing the configuration of a substrate fixing unit in the plating apparatus for an ultrasonic type substrate according to the present invention.
4 is a partial cross-sectional view taken along AA of FIG. 3.
5 is a process diagram for explaining a substrate plating method using the ultrasonic type substrate plating apparatus according to the present invention.
6 is an operation explanatory diagram for explaining the operation of the plating apparatus for an ultrasonic type substrate according to the present invention.

Hereinafter, the configuration of the ultrasonic type substrate plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted. In addition, terms to be described later are terms defined in consideration of functions in the present invention, which may vary depending on the intention or custom of users or operators. Therefore, the definition should be made based on the contents throughout this specification.

1 is a cross-sectional view showing the configuration of an ultrasonic type substrate plating apparatus according to the present invention, FIG. 2 is a plan view showing the configuration of an ultrasonic type substrate plating apparatus according to the present invention, and FIG. 3 is an ultrasonic type substrate according to the present invention It is a perspective view showing the configuration of a substrate fixing part of the plating apparatus, and FIG. 4 is a partial cross-sectional view taken along AA of FIG. 3.

1 to 4, the ultrasonic type substrate plating apparatus 1 according to the present invention includes an inner cylinder 10, an outer cylinder 20, a substrate fixing portion 30, a driving portion 40, and a circulation. It is composed of a unit 50, an ultrasonic generator 60, and a filter unit 70.

First, the inner cylinder 10 is formed in a cylindrical shape with an open top of a metal material, a plurality of water flow blades 11 are provided in the height direction on the inner surface, and a plurality of discharge holes 13 are formed on the side surface.

In addition, the outer cylinder 20 is formed in a cylindrical shape with an open top of a metal material, and surrounds the inner cylinder 10 and discharges the plating solution discharged from the inner cylinder 10.

In addition, the substrate fixing portion 30 is composed of a fixing column 31, a support stand 33, and a pressure clamp 35.

The fixed column 31 is formed in a tube shape so that the plating solution pressurized into the inner cylinder 10 is introduced and fixed to the center, and a plurality of nozzles (N) are arranged in a row in the longitudinal direction on the outside, each row is radial And discharges the plating solution to the substrate S side. At this time, it is preferable that the nozzle N of the fixed column 31 sprays the plating solution in the same direction as the rotation direction of the inner cylinder 10 to increase the rotational force of the rotational water flow. It is also possible to increase the contact time by spraying the plating solution in the opposite direction to generate resistance to the rotating water flow.

The support (33) is formed in a "L" shape to fix a plurality of substrates (S), and its cross-sectional shape is formed in the form of a "Digeon", so that there is no interference between the plurality of nozzles (N) and the nozzles (N) Is installed in

The pressure clamp 35 is installed inside the support 33, is formed in a square shape to pressurize the substrate S, a body 35a in which a guide hole G1 is formed, and a body 35a on the outer surface Of the pressing plate 35d and the main body 35a to which a guide protrusion G2 inserted into the guide hole G1 of the panel is provided, and a silicon pad P that prevents corrosion by the plating solution and provides elasticity is attached to the inner surface. It is composed of a coil spring (35c) that is inserted into the guide hole (G1) to provide elasticity to the pressure plate (35d).

Subsequently, the driving unit 40 rotates the inner cylinder 10 to rotate the plating liquid stored in the inner cylinder 10 at a reference level to generate a rotational water flow, and the plating proceeds while the plating liquid passes through the hole portion H of the substrate S. In order to support the inner cylinder 10 so as to be rotatably supported, and to provide power to the inner cylinder 10, a belt 41 connected to a rotational shaft at the center of the bottom of the inner cylinder 10, and a belt 41 connected to the inner cylinder 10 It consists of a rotation motor 43 to enable rotation.

Subsequently, the circulation unit 50 has one end connected to the lower end of the outer cylinder 20 to supply the plating solution discharged from the inner cylinder 10 to the outer cylinder 20 in a predetermined amount to the substrate fixing unit 30, and the other end It consists of a circulation pipe 51 connected to the 30, and a pump 53 installed in the circulation pipe 51 and for pumping the plating liquid stored in the outer cylinder 20 into the substrate fixing part 30.

In addition, the ultrasonic generator 60 generates ultrasonic waves with an ultrasonic oscillator to vibrate the plating solution to remove air bubbles generated when the plating solution enters the hole portion H of the substrate S, and enters the hole portion H of the substrate S. It is attached to the bottom of the outer cylinder 20 to remove the jammed foreign matter.

In addition, the filter unit 70 is applied to a fiber filter, a strainer, and the like, and is installed in the circulation pipe 51 of the circulation unit 50 to remove foreign substances that have fallen out of the substrate S during the circulation process of the plating solution.

Hereinafter, a plating method using an ultrasonic type substrate plating apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

5 is a process chart for explaining a substrate plating method using the ultrasonic type substrate plating apparatus according to the present invention, and FIG. 6 is an operation explanatory diagram for explaining the operation of the ultrasonic type substrate plating apparatus according to the present invention.

5 and 6, the substrate plating method using the ultrasonic type substrate plating apparatus according to the present invention includes a substrate fixing process (S10), a rotating process (S20), a plating process (S30), and an ultrasonic generating process. It consists of (S40), a plating liquid circulation process (S50), and a filtering process (S60).

《Substrate fixing process-S10》

First, the operator press-fits each substrate (S) to the support (33) of the substrate fixing unit (30), and presses the one side and the lower end by pressing the substrate (S) in the state of being inserted into the support (33). Insert into the clamp (35).

Then, the pressing plate 35d of the pressing clamp 35 is moved toward the main body 35a while compressing the coil spring 35c, so that the silicon pads P fix both sides of the substrate S. At this time, by the elasticity of the coil spring 35c, the silicon pad P maintains a state in which the substrate S is pressed and fixed.

《Rotation process-S20》

When the fixing of the substrate S is completed, the plating solution of the plating solution tank (not shown) separately connected to the circulation pipe 51 of the circulation unit 50 is transferred to the fixing column of the substrate fixing unit 30 through the circulation pipe 51. 31). In this case, the plating solution may be supplied into the inner cylinder 10 through a separate plating solution supply pipe.

Then, the plating solution is sprayed from the nozzle N of the fixed pillar 31 and is stored in the inner cylinder 10, and the plating solution is injected into the inner cylinder 10 at a reference level. At this time, plating is primarily performed while the plating solution is passed through the hole portion H of the substrate S by the plating solution sprayed from the nozzle N.

In a state in which the plating solution is stored in the inner cylinder 10 at a reference level, when the rotation motor 43 of the driving unit 40 is operated, the belt 41 rotates to rotate the inner cylinder 10.

《Plating process-S30》

When the inner cylinder 10 is rotated, rotational water flow is generated in the plating liquid by the water flow blades 11, and the plating liquid penetrates through the hole portion H of the substrate S to perform secondary plating.

《Ultrasonic generation process-S40》

Simultaneously with the rotation of the inner cylinder 10, the ultrasonic generator 60 generates ultrasonic waves to cause the plating solution to vibrate. When micro-vibration occurs in the plating solution, air bubbles generated when the plating solution flows into the hole portion H of the substrate S are removed, thereby smoothly flowing the plating solution into the hole portion H of the substrate S, and the hole portion of the substrate S Foreign matter adhering to (H) is also removed.

《Plating solution circulation process-S50》

Then, the plating solution of the outer cylinder 20 is discharged to the discharge hole 13 of the inner cylinder 10 is pressurized by the pump 53 through the circulation pipe 51 of the circulation unit 50 as shown in FIG. It is supplied back to the fixing pillar 31 of the substrate fixing part 30. At this time, the plating solution is discharged in the same direction as the rotational water flow through the nozzle N of the substrate fixing part 30, and the rotational force of the rotational water flow is increased to increase plating efficiency.

<< filtering process-S60 >>

When the plating solution is circulated, foreign matters removed from the substrate S by ultrasonic waves are also circulated, and only the filtered plating solution is circulated by removing foreign matters from the filter unit 70 installed in the circulation pipe 51 of the circulation unit 50. Let it.

The present invention may be variously modified and may take various forms, and in the detailed description of the present invention, only specific embodiments thereof have been described. However, it should be understood that the present invention is not limited to a particular form mentioned in the detailed description, but rather, it is understood to include all modifications, equivalents, and substitutes within the spirit and scope of the present invention as defined by the appended claims. Should be.

10: inner cylinder 20: outer cylinder
30: substrate fixing unit 40: driving unit
50: circulation unit 60: ultrasonic generator
70: filter unit

Claims (7)

An inner passage having an open top cylindrical shape, a plurality of water flow blades provided in a height direction on an inner surface, and a plurality of discharge holes formed on a side surface;
An outer passage surrounding the inner casing and discharging the plating solution discharged from the inner casing;
A substrate fixing portion fixed to the central portion of the inner cylinder, a plurality of substrates fixed, and a plating solution supplied and discharged therein;
Rotating the inner cylinder to rotate the plating solution stored in the inner cylinder at a reference level to generate a rotational water flow to support the inner cylinder rotatably so that the plating solution proceeds with plating while passing through the hole portion of the substrate, and providing power to the inner cylinder A driving unit;
A circulation unit supplying a predetermined amount of a plating solution discharged from the inner cylinder to the outer cylinder to the substrate fixing unit;
An ultrasonic generator installed on the bottom surface of the outer cylinder to generate ultrasonic waves; And
An ultrasonic type substrate plating apparatus comprising a filter unit installed in the circulation unit to remove foreign substances from the plating solution. The method of claim 1,
The substrate fixing part,
A fixed column formed in the shape of a tube so that the plating solution pressurized into the interior is introduced, and a plurality of nozzles are arranged in a row in the longitudinal direction on the outside, and each row is radially arranged to discharge the plating solution to the substrate side. ;
A support that is formed in an "L" shape to fix the substrate and has a cross-sectional shape of a "degeunja" and is installed at a non-interference position between the plurality of nozzles and the nozzles; And
An ultrasonic type substrate plating apparatus comprising a pressure clamp installed inside the support and pressing the substrate. The method of claim 2,
The pressure clamp,
A main body formed in a square shape and having a guide hole;
A pressing plate having a guide protrusion inserted into the guide hole of the main body on an outer surface and a silicone pad attached to the inner surface; And
An ultrasonic type substrate plating apparatus comprising a coil spring inserted into the guide hole of the main body to provide elasticity to the pressure plate. The method of claim 2,
The nozzle of the fixed column,
A plating apparatus for an ultrasonic type substrate, characterized in that by spraying the plating solution in the same direction as the rotation direction of the inner cylinder to increase the rotational force of the rotating water flow. The method of claim 1,
The circulation unit,
A circulation pipe having one end connected to the lower end of the outer cylinder and the other end connected to the substrate fixing part;
An ultrasonic type substrate plating apparatus comprising a pump installed in the circulation pipe and configured to pressurize the plating liquid stored in the outer cylinder into the substrate fixing portion. In the substrate plating method using the ultrasonic type substrate plating apparatus of claim 1,
A substrate fixing step of fixing a plurality of substrates to the substrate fixing portion;
A rotation process of injecting a plating solution into the inner cylinder at a reference level through a substrate fixing unit, and rotating the inner cylinder through a driving unit to generate a rotational water flow with the plating solution;
A plating process in which plating is performed while the plating solution is injected into the hole portion of the substrate by the rotational water flow;
An ultrasonic generation process of generating ultrasonic waves in an ultrasonic generator during the plating process;
A plating solution circulation process in which the plating solution discharged to the outer tube through the inner tube is pressurized using a circulation unit to circulate to the substrate fixing unit; And
A substrate plating method using an ultrasonic type substrate plating apparatus comprising a filtering process in which foreign substances contained in the plating solution are removed through a filter unit when the plating solution circulation process is performed. The method of claim 6,
The plating solution circulation process,
A substrate plating method using an ultrasonic type substrate plating apparatus, characterized in that the rotational force of the rotating water flow is increased while discharging the rotating water flow in the same direction through the nozzle of the substrate fixing part.

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