JPH0673163U - Plating equipment - Google Patents

Abstract

(57) [Summary] [Purpose] Prevents the formation of pits on the surface of metal deposition film,
Provided is an electroforming plating apparatus capable of obtaining a uniform plating thickness. [Arrangement] The anode plate 2 is arranged around the inner wall of the plating tank 1, the anode plate 2a is connected to the plating jig 5, and the plating solution is agitated while rotating the plating jig 5, and at the same time, the plating target is plated. Ultrasonic irradiation is given to the object 8.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a plating apparatus for forming fine needle-shaped parts used as a mold for manufacturing ferrules of optical fiber connectors by powder injection molding.

[0002]

[Prior art]

 As shown in FIG. 2, a conventional plating apparatus for forming a needle-shaped part for injection molding has a plating tank 1, an anode plate 2 connected to the plating tank, and a plating plate in the plating tank 1. The plating jig 5 comprises a magnetic stirrer 14 for agitating the syrup, a plating jig 5 for supporting the object 8 to be plated, and a cathode rotating device 3 for rotating the plating jig 5. When placed in the plating tank in a rotating or non-rotating state, the magnetic stirrer 14 stirs the plating solution in the plating tank 1 while stirring the plating solution in the plating tank 1 and the anode plates 2 and the plating plates connected to both sides of the plating tank 1. A current was applied to the negative electrode wiring connected to the jig 5 to perform desired plating.

[0003]

[Problems to be solved by the device]

 However, in the conventional plating equipment, the hydrogen gas bubbles generated during the metal film deposition stage adhere to the part of the object to be plated that forms a sharp angle and do not separate, so that they form on the surface of the metal film. The rate of pits (concave deposition) was high. Further, since the anode plates were also arranged only on both sides of the plating tank, there was a problem that the metal deposition thickness of the object to be plated was non-uniform.

Therefore, an object of the present invention is, for example, an electroforming overlay plating apparatus capable of forming a metal deposition thickness uniformly without generating pits on an object to be plated formed by electroforming overlay plating. To provide.

[0005]

[Means for Solving the Problems] In order to solve the above-mentioned problems, an anode plate is arranged on the entire inner periphery of a plating tank, and the anode plate is also arranged on a rotation center axis of a plating jig arranged in the plating tank. By setting the object to be plated on the plating jig and rotating the plating jig in the plating tank, ultrasonic waves are irradiated from below the plating tank while stirring the plating solution. As a result, it is possible to prevent pits due to generated hydrogen gas and variations in plating thickness.

[0006]

[Action]

 By arranging the anode plate around the inner wall of the plating tank and in the center of the plating jig, and by rotating the plating jig while stirring the plating solution, the metal deposition thickness on the object to be plated is uniformly controlled, Further, by applying ultrasonic irradiation simultaneously with stirring the plating solution from below the plating tank, it is possible to prevent bubbles of hydrogen gas generated in the metal deposition step from adhering to the object to be plated. It is possible to prevent the occurrence of pits.

[0007]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1 (a), a plating tank 1 has an anode plate 2 to which anode wiring 16 is connected almost all around the wall, and an ultrasonic wave generator 10 at the bottom thereof. There is. On the other hand, one end of the plating jig 5 is rotatably supported by the cathode rotating device 3 having the motor 9, and the other end of the plating jig 5 is evenly supported so that the plurality of products 8 can be simultaneously supported at the other end. The negative electrode wiring 15 is connected to the plating jig 5 and has a cathode potential. Further, at the center of rotation of the plating jig 5 facing the support for the object to be plated, there is provided an anode plate 2a which is insulated and supported from the cathode by an anode support shaft 7 made of an electrically insulating material.

Next, the operation will be described. The plating jig 5 is lowered to a predetermined position in the plating tank 1 to immerse the object 8 to be plated in the plating solution in the plating tank 1, and the plating treatment is performed. The tool 5 and the plating tank are energized to start the plating operation. At this time, the plating jig 5 is rotated by the cathode rotating device 3 via the motor 9, and the plated object 8 supported by the plated object supporting portion of the plating jig 5 is stored in the plating tank 1. Rotate the plating solution slowly while stirring. At the same time, plating is performed by irradiating the object to be plated with ultrasonic waves from the ultrasonic generator 10 provided at the bottom of the plating tank 1.

In the present example, when a wire having a diameter of about 125 μm was used as an object to be plated to form a sharp needle-shaped part having a tip of 1500 μm or more and the formation state of the plating film on the part was confirmed, The sharp angle is maintained and the plating is formed in other states. Moreover, no pits are generated, and the difference in the plating thickness of the entire part other than the tip is about 50 μm. It was confirmed that a uniform electroformed build-up plating was formed with less variation in the plating thickness than in the case of ~ 200 μm.

[0010]

[Effect of device]

 As described above, in the present invention, in the electroforming overlay plating, the anode plate is arranged around the inner wall of the plating tank and in the center of the inside of the object to be plated, and the anode plate in the center of the inside of the object to be plated and the object to be plated. The plating jig is set as an integrated unit and rotated, and ultrasonic waves are applied to the object to be plated during plating, so that pits do not occur on the plating film surface and a uniform plating film is obtained. It has the effect that the finish grinding of the plated object can be easily performed.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing a plating apparatus of the present invention.

FIG. 2 is a schematic sectional view showing a conventional plating apparatus.

[Explanation of symbols]

 1 plating tank 2 2a anode plate 3 cathode rotating device 5 plating jig 9 motor 10 ultrasonic generator

Claims (1)

[Scope of utility model registration request] 1. A plating tank in which a plurality of anode plates are arranged all around the inner wall or at appropriate places, and a plurality of plating tanks having one end rotatably supported by a rotating device and the other end supporting a plurality of objects to be plated. A plating jig having a supporting part, and an anode plate facing the supporting part, which is electrically insulated from the supporting part, is provided at the center of the shaft at the center of the supporting part and is connected to the cathode by a cathode. A plating apparatus comprising an ultrasonic wave generator provided at the bottom.