JPH0673163U - Plating equipment - Google Patents
Plating equipmentInfo
- Publication number
- JPH0673163U JPH0673163U JP1418293U JP1418293U JPH0673163U JP H0673163 U JPH0673163 U JP H0673163U JP 1418293 U JP1418293 U JP 1418293U JP 1418293 U JP1418293 U JP 1418293U JP H0673163 U JPH0673163 U JP H0673163U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- plated
- jig
- tank
- anode plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
(57)【要約】
【目的】 金属析出皮膜面へのピット発生を防止して、
均一なめっき厚みを得られるような電鋳めっき装置を提
供する。
【構成】 めっき槽1の内壁周囲に陽極板2を配置する
と共に、めっき治具5に陽極板2aを接続して、前記め
っき治具5を回転させながらめっき液の攪拌を行い、同
時に被めっき物8に超音波照射を与える。
(57) [Summary] [Purpose] Prevents the formation of pits on the surface of metal deposition film,
Provided is an electroforming plating apparatus capable of obtaining a uniform plating thickness. [Arrangement] The anode plate 2 is arranged around the inner wall of the plating tank 1, the anode plate 2a is connected to the plating jig 5, and the plating solution is agitated while rotating the plating jig 5, and at the same time, the plating target is plated. Ultrasonic irradiation is given to the object 8.
Description
【0001】[0001]
本考案は、光ファイバーコネクタのフェルールなどを粉末射出成形により製造 するための型として用いる微細な針状部品を形成するためのめっき装置に関する 。 The present invention relates to a plating apparatus for forming fine needle-shaped parts used as a mold for manufacturing ferrules of optical fiber connectors by powder injection molding.
【0002】[0002]
従来の射出成形用の針状部品を形成するためのめっき装置は、図2に示すよう に、めっき槽1と、該めっき槽に接続された陽極板2と、前記めっき槽1内のめ っき液を攪拌するためのマグネチックスターラー14と、被めっき物8を支持す るめっき治具5と、該めっき治具5を回転させる陰極回転装置3とから構成され 、前記めっき治具5を回転あるいは非回転の状態でめっき槽の中に配置した時、 前記マグネチックスターラー14により前記めっき槽1内のめっき液を攪拌しな がらめっき槽1の両側に接続された陽極板2及び前記めっき治具5に接続した陰 極配線に電流を流し、所望のめっきを行うようにしたものであった。 As shown in FIG. 2, a conventional plating apparatus for forming a needle-shaped part for injection molding has a plating tank 1, an anode plate 2 connected to the plating tank, and a plating plate in the plating tank 1. The plating jig 5 comprises a magnetic stirrer 14 for agitating the syrup, a plating jig 5 for supporting the object 8 to be plated, and a cathode rotating device 3 for rotating the plating jig 5. When placed in the plating tank in a rotating or non-rotating state, the magnetic stirrer 14 stirs the plating solution in the plating tank 1 while stirring the plating solution in the plating tank 1 and the anode plates 2 and the plating plates connected to both sides of the plating tank 1. A current was applied to the negative electrode wiring connected to the jig 5 to perform desired plating.
【0003】[0003]
しかしながら、従来構造のめっき装置においては、金属皮膜の析出段階で発生 する水素ガスによる気泡が、被めっき物の鋭利な角度を形成する部分に付着して 離脱しないため、金属析出皮膜面に発生するピット(凹状析出)割合が多くなっ ていた。また、陽極板についてもめっき槽の両側にのみ配置していたことから、 被めっき物の金属析出厚みが不均一となる課題があった。 However, in the conventional plating equipment, the hydrogen gas bubbles generated during the metal film deposition stage adhere to the part of the object to be plated that forms a sharp angle and do not separate, so that they form on the surface of the metal film. The rate of pits (concave deposition) was high. Further, since the anode plates were also arranged only on both sides of the plating tank, there was a problem that the metal deposition thickness of the object to be plated was non-uniform.
【0004】 そこで、本考案の目的は、例えば、電鋳肉盛りめっきにより形成する被めっき 物にピットの発生がなく、金属析出厚みを均一に形成することのできる電鋳肉盛 りめっき装置を提供することにある。Therefore, an object of the present invention is, for example, an electroforming overlay plating apparatus capable of forming a metal deposition thickness uniformly without generating pits on an object to be plated formed by electroforming overlay plating. To provide.
【0005】[0005]
【課題を解決するための手段】 前記の課題を解決するため、めっき槽の内側の周囲全体に陽極板を配置すると ともに、めっき槽内に配置されるめっき治具の回転中心軸にも陽極板を設け、前 記めっき治具に被めっき物をセットし、前記めっき治具をめっき槽内で回転させ ることによって、めっき液の攪拌を行いながら、前記めっき槽の下方から超音波 を照射することにより、発生水素ガスによるピットやめっき厚みのバラツキを防 止するようにしたものである。[Means for Solving the Problems] In order to solve the above-mentioned problems, an anode plate is arranged on the entire inner periphery of a plating tank, and the anode plate is also arranged on a rotation center axis of a plating jig arranged in the plating tank. By setting the object to be plated on the plating jig and rotating the plating jig in the plating tank, ultrasonic waves are irradiated from below the plating tank while stirring the plating solution. As a result, it is possible to prevent pits due to generated hydrogen gas and variations in plating thickness.
【0006】[0006]
めっき槽の内壁の周囲と、めっき治具の中心に陽極板を配置すると共に、前記 めっき治具はめっき液を攪拌しながら回転することにより、被めっき物に対する 金属析出厚みが均一にコントロールされ、また、前記めっき槽の下方から前記め っき液攪拌と同時に超音波照射を与えることによって、金属析出段階で発生する 水素ガスの気泡が前記被めっき物に付着することを防止でき、この結果、ピット の発生を防止することができる。 By arranging the anode plate around the inner wall of the plating tank and in the center of the plating jig, and by rotating the plating jig while stirring the plating solution, the metal deposition thickness on the object to be plated is uniformly controlled, Further, by applying ultrasonic irradiation simultaneously with stirring the plating solution from below the plating tank, it is possible to prevent bubbles of hydrogen gas generated in the metal deposition step from adhering to the object to be plated. It is possible to prevent the occurrence of pits.
【0007】[0007]
以下に、この考案の実施例を図面に基づいて説明する。 図1(a)において、めっき槽1は、そ壁周囲のほぼ全周に陽極配線16が接 続された陽極板2が配置されると共に、その底部には超音波発生装置10を有し ている。一方、めっき治具5は一端がモータ9を有する陰極回転装置3により回 転自在に支持され、他端で同時に複数の被めっき物8が支持できるように複数の 被めっき物支持部を均等に分支して形成されると共に、前記めっき治具5には陰 極配線15が接続され、陰極電位を有している。また、前記被めっき物支持部に 相対した前記めっき治具5の回転中心部には電気的絶縁材からなる陽極用支軸7 により陰極と絶縁支持された陽極板2aが設けられている。 An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1 (a), a plating tank 1 has an anode plate 2 to which anode wiring 16 is connected almost all around the wall, and an ultrasonic wave generator 10 at the bottom thereof. There is. On the other hand, one end of the plating jig 5 is rotatably supported by the cathode rotating device 3 having the motor 9, and the other end of the plating jig 5 is evenly supported so that the plurality of products 8 can be simultaneously supported at the other end. The negative electrode wiring 15 is connected to the plating jig 5 and has a cathode potential. Further, at the center of rotation of the plating jig 5 facing the support for the object to be plated, there is provided an anode plate 2a which is insulated and supported from the cathode by an anode support shaft 7 made of an electrically insulating material.
【0008】 次に、作用について説明すれば、めっき槽1の所定位置まで前記めっき治具5 を下降させて被めっき物8をめっき槽1内のめっき液に浸漬すると共に、前記メ ッキ治具5とめっき槽に通電してめっき作業を開始する。この時、前記めっき治 具5は前記陰極回転装置3によりモータ9を介して回転させ、前記めっき治具5 の被めっき物支持部に支持された被めっき物8は、前記めっき槽1内のめっき液 を攪拌しながらゆっくり回転する。同時に、前記めっき槽1の底部に設けれた超 音波発生装置10からは被めっき物に超音波を照射してめっきを行う。Next, the operation will be described. The plating jig 5 is lowered to a predetermined position in the plating tank 1 to immerse the object 8 to be plated in the plating solution in the plating tank 1, and the plating treatment is performed. The tool 5 and the plating tank are energized to start the plating operation. At this time, the plating jig 5 is rotated by the cathode rotating device 3 via the motor 9, and the plated object 8 supported by the plated object supporting portion of the plating jig 5 is stored in the plating tank 1. Rotate the plating solution slowly while stirring. At the same time, plating is performed by irradiating the object to be plated with ultrasonic waves from the ultrasonic generator 10 provided at the bottom of the plating tank 1.
【0009】 今回の実施例では、被めっき物として直径約125μmのワイヤーを用いて1 500μm以上の先端の鋭利な針状部品を形成して部品のめっき皮膜の形成状態 を確認したところ、先端の鋭利な角度が保持され他状態でめっきが形成されてお り、しかもピットの発生もなく、先端以外の部分全体のめっき厚みの差も50μ m程度であり、従来見られためっき厚みの差150μm〜200μmに比べ極め てめっき厚のばらつきが少ない均一な電鋳肉盛りめっきの形成が確認できた。In the present example, when a wire having a diameter of about 125 μm was used as an object to be plated to form a sharp needle-shaped part having a tip of 1500 μm or more and the formation state of the plating film on the part was confirmed, The sharp angle is maintained and the plating is formed in other states. Moreover, no pits are generated, and the difference in the plating thickness of the entire part other than the tip is about 50 μm. It was confirmed that a uniform electroformed build-up plating was formed with less variation in the plating thickness than in the case of ~ 200 μm.
【0010】[0010]
以上のように、本考案は電鋳肉盛りめっきにおいて、陽極板をめっき槽の内壁 の周囲および被めっき物の内側中心に配置し、前記被めっき物の内側中心の陽極 板と被めっき形成体をセットしためっき治具を一体的に構成してこれを回転させ ると共に、めっき中に前記被めっき物に超音波照射を与えることにより、めっき 皮膜面にピットの発生がなく、均一なめっき皮膜が得られ、被めっき物の仕上げ 研削加工も容易にできる等の効果を有する。 As described above, in the present invention, in the electroforming overlay plating, the anode plate is arranged around the inner wall of the plating tank and in the center of the inside of the object to be plated, and the anode plate in the center of the inside of the object to be plated and the object to be plated. The plating jig is set as an integrated unit and rotated, and ultrasonic waves are applied to the object to be plated during plating, so that pits do not occur on the plating film surface and a uniform plating film is obtained. It has the effect that the finish grinding of the plated object can be easily performed.
【図面の簡単な説明】[Brief description of drawings]
【図1】本考案のめっき装置を示す略断面図である。FIG. 1 is a schematic sectional view showing a plating apparatus of the present invention.
【図2】従来のめっき装置を示す略断面図である。FIG. 2 is a schematic sectional view showing a conventional plating apparatus.
1 めっき槽 2、2a 陽極板 3 陰極回転装置 5 めっき治具 9 モータ 10 超音波発生装置 1 plating tank 2 2a anode plate 3 cathode rotating device 5 plating jig 9 motor 10 ultrasonic generator
Claims (1)
の陽極板を配置しためっき槽と、一端が回転装置に回転
自在に支持され、他端に複数の被めっき物を支持するた
めの複数の支持部を有し、該支持部中央の軸中心に、前
記支持部に相対して支持部とは電気的に絶縁された陽極
板を設けて陰極接続されためっき治具と、前記めっき槽
底部に設けられた超音波発生装置とからなることを特徴
とするめっき装置。1. A plating tank in which a plurality of anode plates are arranged all around the inner wall or at appropriate places, and a plurality of plating tanks having one end rotatably supported by a rotating device and the other end supporting a plurality of objects to be plated. A plating jig having a supporting part, and an anode plate facing the supporting part, which is electrically insulated from the supporting part, is provided at the center of the shaft at the center of the supporting part and is connected to the cathode by a cathode. A plating apparatus comprising an ultrasonic wave generator provided at the bottom.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1418293U JPH0673163U (en) | 1993-03-25 | 1993-03-25 | Plating equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1418293U JPH0673163U (en) | 1993-03-25 | 1993-03-25 | Plating equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0673163U true JPH0673163U (en) | 1994-10-11 |
Family
ID=11854000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1418293U Pending JPH0673163U (en) | 1993-03-25 | 1993-03-25 | Plating equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0673163U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009515367A (en) * | 2005-11-09 | 2009-04-09 | 謝 清雄 | Manufacturing method of surface mount type precision resistor |
JP2012062566A (en) * | 2010-08-16 | 2012-03-29 | Hitachi Metals Ltd | Plating apparatus |
KR102180673B1 (en) * | 2020-01-30 | 2020-11-20 | 주식회사 정석테크 | Substrate plating device for ultrasonic wave rotation type and the method of substrate plating using thereof |
-
1993
- 1993-03-25 JP JP1418293U patent/JPH0673163U/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009515367A (en) * | 2005-11-09 | 2009-04-09 | 謝 清雄 | Manufacturing method of surface mount type precision resistor |
JP2012062566A (en) * | 2010-08-16 | 2012-03-29 | Hitachi Metals Ltd | Plating apparatus |
KR102180673B1 (en) * | 2020-01-30 | 2020-11-20 | 주식회사 정석테크 | Substrate plating device for ultrasonic wave rotation type and the method of substrate plating using thereof |
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