KR102134033B1 - Wafer sensing apparatus, wafer carrier loard port comprising the same and apparatus for semiconductor process comprising the same - Google Patents

Abstract

The present invention relates to a wafer sensing device, the body including a first surface and a second surface opposite to the first surface; A first sensor unit protruding from the first surface and disposed on an upper portion of the body; And a second sensor part protruding from the first surface, disposed on an upper portion of the body, and spaced apart from the first sensor part, wherein the first sensor part includes a transmitter for transmitting a light source to one end, and A receiving unit for receiving the reflected light source, the second sensor unit includes a transmitting unit for transmitting a light source at one end and a receiving unit for receiving a reflected light source, and the distance between the first sensor unit and the second sensor unit is 125 It characterized in that it is from 145 mm.

Description

Wafer sensing device, wafer carrier load port including the same, and semiconductor processing device including the same{WAFER SENSING APPARATUS, WAFER CARRIER LOARD PORT COMPRISING THE SAME AND APPARATUS FOR SEMICONDUCTOR PROCESS COMPRISING THE SAME}

The present invention relates to a wafer sensing device, a wafer carrier load port including the same, and a semiconductor processing device including the same.

In general, a semiconductor device is manufactured by depositing a thin film that performs various functions on a wafer surface and patterning it to form various circuit geometries. As a unit process for manufacturing such a semiconductor device, an impurity ion implantation process in which impurity ions are implanted into a semiconductor wafer is largely performed, a thin film deposition process for forming a material film on a semiconductor substrate, and the material film is formed in a predetermined pattern. Etching process and several units such as wafer cleaning process for removing impurities, including flattening (CMP: Chemical Mechanical Polishing) process by removing the step by polishing the wafer surface in bulk after depositing an interlayer insulating film on the top of the wafer It can be divided into processes.

Accordingly, the semiconductor device is manufactured by repeatedly performing the above-described various unit processes, and each of these unit processes is generally performed in a wafer unit while being moved by a wafer storage container in which 25 or 50 wafers are accommodated.

On the other hand, as the wafer storage container, when the wafer size is 8 inches (inch), an open wafer cassette has been frequently used, but in order to prevent contamination that may occur in the process of moving the wafer recently, a closed container (Front Open Unified Pod) , FOUP).

On the other hand, when the wafers accommodated in the cassette or the pull are loaded into process devices for performing an ion implantation process, a deposition process or a planarization process, the position of the wafers stored in the pull and the storage state of the wafers are checked. The mapping process is performed.

The load port is a means by which a semiconductor manufacturing facility is connected to a semiconductor manufacturing fab, and a wafer of a cassette or a pull placed on a shelf of the load port is to be introduced into a process chamber inside the device by a wafer handling robot or the like after a wafer mapping operation. Can.

The cassette or pull contains at least 25 slots corresponding to 25 wafers. For example, wafer 1 is inserted into slot 1 of the cassette or pull, and wafer 5 is inserted into slot 5 of the cassette or pull. However, the wafer may have a loss of a specific wafer among 25 wafers due to wafer analysis due to defects in the process, contamination or damage during semiconductor processing, or contamination or damage during wafer transfer between devices. For example, in the photolithography step, wafers 1 to 25 are all intact, and in the metal deposition step, the wafer may be lost in the previous step and the empty slot may be used for analysis of the 7th wafer. Less than 25 sheets can be delivered to the load port.

The wafers arranged in the cassette are transferred to the reaction chamber for the next process, one sheet each by a robot. Before transferring the wafers to the respective reaction chambers by the robot, the position and alignment order of the wafers aligned in the cassette or pull are checked, and the alignment status of the wafers is recognized by the facility.

Conventional wafer sensing apparatuses have a problem in that, due to a long passing distance of a light source, distortion and change may occur according to the use time, and the variation width of the amount of light increases.

Korea Patent Publication 2003-0001838

An object of the present invention is to provide a wafer sensing device capable of adjusting the width of the first sensor unit and the second sensor unit to significantly reduce the amount of light as time passes, and increase the accuracy and lifetime of mapping detection. .

In addition, it is an object of the present invention to provide a wafer carrier load port including a wafer sensing device capable of detecting damage due to wafer detachment.

The wafer sensing apparatus 100 for a wafer having a diameter of 200 mm and 300 mm according to an embodiment of the present invention includes a first surface and a second surface opposite to the first surface, and is connected from the first sensor A body 110 including a first wire groove 123 in which electric wires are disposed; and a second wire groove 133 in which electric wires connected from a second sensor are disposed; A first sensor groove 121 that protrudes from the first surface, is disposed on the body 110, and has a transmitter for transmitting a light source and a receiver for receiving a reflected light source at one end. Sensor unit 120; Protruding from the first surface, and is spaced apart from the first sensor unit 120 by a predetermined interval on the body 110, a transmitter for transmitting a light source at one end and a receiver for receiving the reflected light source are arranged A second sensor unit 130 including a second sensor groove 131; Is disposed on one end of the body 110, the first wire groove 123 is disposed extending from the first sensor groove 121, a terminal connecting the wire connected from the first sensor with an external wire It includes a first terminal groove 141 is disposed, the first wire groove 123 is a first load port binding portion 140 disposed to communicate with the first terminal groove 141; And a terminal disposed at the other end of the body 110, the second wire groove 133 extending from the second sensor groove 131, and connecting the wire connected from the second sensor to an external wire. It includes a second terminal groove 151 is disposed, the second wire groove 133 is a second load port binding portion 150 disposed to communicate with the second terminal groove 151; includes,
The width of the body portion 110 between the first sensor portion 120 and the second sensor portion 130 is thinner than the width of the rest of the body portion 110, the first sensor portion 120 and the first 2 The width of the body 110 between the sensor parts 130 is 1 to 5 mm thinner than the width of the rest of the body 110, and the light source transmitted from the first sensor disposed in the first sensor groove 121 and A first light receiving and receiving groove 122 which is a path through which the light source reflected and received by the wafer moves is moved; and a light source transmitted from the second sensor disposed in the second sensor groove 131 and a light source reflected and received by the wafer. It includes; a second light receiving groove 132 that is a moving passage;
The distance between the first sensor unit 120 and the second sensor unit 130 is 125 to 145 mm, and the width of the first sensor unit 120 and the second sensor unit 130 is 15 to 25 mm,
The first sensor and the second sensor detect the presence or absence of a wafer or an abnormal state of the wafer by a direct transmission/reception mode or a reflection mode, wherein the direct transmission/reception mode transmits a light source from the transmitter of the first sensor to the receiver of the second sensor. Then, the presence or absence of the wafer is checked by the difference in the light source detection signal according to the presence or absence of the wafer on a straight line between the transmitter of the first sensor and the receiver of the second sensor, and the reflection mode is the transmitter of the first sensor or the second sensor In the case of detecting the light source reflected from the side edge of the wafer, the light source emitted from the first sensor detects the light source reflected from the side edge of the wafer at the receiver of the first sensor or the receiver of the second sensor. Is done.

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Wafer carrier load port 1000 according to an embodiment of the present invention, a wafer including a plate for supporting a wafer carrier for storing wafers having a diameter of 200 mm and 300 mm therein and a fixing part for fixing the wafer carrier A carrier port part 1100; And a cover portion 1200 coupled to the carrier cover of the wafer carrier.
The cover part 1200 is coupled to a carrier cover of the wafer carrier to separate the carrier cover, and is disposed on the cover plate to detect a wafer inside the wafer carrier, and the wafer sensing device 100 described above ).

A semiconductor processing apparatus according to an embodiment of the present invention includes a processing unit that performs a process for a wafer; And

It includes; a wafer carrier load port for supplying the wafer to the process unit. The wafer carrier load port includes: a wafer carrier port portion including a plate for supporting a wafer carrier for storing wafers therein and a fixing portion for fixing the wafer carrier; And a cover portion coupled to the carrier cover of the wafer carrier to separate the carrier cover. The cover part includes a cover plate that is coupled to the wafer carrier cover to separate the carrier cover, and a wafer sensing device disposed on the cover plate to sense a wafer inside the wafer carrier. The wafer sensing device includes a body including a first surface and a second surface opposite to the first surface, a first sensor groove protruding from the first surface and disposed on the body and having a sensor on one end A first sensor unit comprising a, a second sensor unit that includes a second sensor groove that protrudes from the first surface and is disposed spaced apart from the first sensor unit on the body and the sensor is disposed at one end. And a first load port binding part disposed at one end of the body and coupling the cover plate and the body, and a second load port binding part disposed at the other end of the body and coupling the cover plate and the body. The distance between the first sensor portion and the second sensor portion is 125 to 145 mm.

In the wafer sensing apparatus according to an embodiment of the present invention, since the distance between the first sensor unit and the second sensor unit is shortened, a decrease in the amount of light may be significantly reduced over time, and the accuracy of mapping detection and the life of the device are increased. Can be.

The wafer sensing apparatus according to an embodiment of the present invention can map a 200 mm wafer and a 300 mm wafer without exchanging the apparatus, and the convenience of managing the wafer sensing apparatus may be increased.

1 and 2 illustrate a wafer sensing device according to an embodiment of the present invention.
3 to 5 show a wafer carrier load port according to an embodiment of the present invention.
6 illustrates that the sensor unit of the wafer sensing apparatus according to the embodiment scans a 200 mm wafer.
7 illustrates that the sensor unit of the wafer sensing apparatus according to the embodiment scans a 300 mm wafer.
8 and 9 illustrate a semiconductor processing apparatus according to an embodiment of the present invention.

1 and 2 illustrate a wafer sensing apparatus 100 according to an embodiment of the present invention.

Referring to FIG. 1, a wafer sensing apparatus 100 according to an embodiment of the present invention includes: a body 110 including a first surface and a second surface opposite to the first surface; A first sensor unit 120 protruding from the first surface, disposed on the body 110, and including a first sensor groove in which a sensor is disposed; A second sensor unit 130 including a second sensor groove that protrudes from the first surface and is disposed on the body 110 from the first sensor unit 120 and is disposed at one end. ); A first load port binding part 140 disposed at one end of the body 110; And a second load port binding part 150 disposed at the other end of the body 110, wherein the distance between the first sensor part 120 and the second sensor part 130 is 125 to 145 mm.

The wafer sensing apparatus 100 may be disposed on the wafer carrier load port 1000 of the semiconductor processing apparatus 2000 to detect the presence or absence of a wafer in a wafer cassette or a FOUP. Generally, a plurality of wafers are layered at regular intervals on a wafer carrier or pull. When manufacturing a semiconductor, a wafer undergoes hundreds of processes, and some wafers may be damaged and disappear, so that some wafers may not be present in the wafer cassette or pull. In this case, the efficiency of the semiconductor process can be improved by grasping the presence or absence of the wafer.

The first sensor unit 120 and the second sensor unit 130 are where sensors for sensing a wafer are disposed. As illustrated in FIGS. 1 and 2, the first sensor unit 120 and the second sensor unit 130 are spaced apart at regular intervals. The presence or absence of a wafer can be grasped through the sensor by placing the wafer disposed in the wafer carrier or the pool between the first sensor unit 120 and the second sensor unit 130.

The first sensor unit 120 and the second sensor unit 130 may include a first sensor groove 121 and a second sensor groove 131 in which the first sensor and the second sensor are disposed, respectively. The first sensor and the second sensor are fixed by being disposed in the first sensor groove 121 and the second sensor groove 131, respectively, and the presence or absence of the wafer can be stably detected from external physical impact. The first sensor and the second sensor may transmit a sensed signal to the outside and be connected to a wire that receives power from the outside. At this time, the body 110 may include a wire groove for stably fixing the wire. Specifically, it may include a first wire groove 123 in which wires connected from the first sensor are disposed, and a second wire groove 133 in which wires connected from the second sensor are disposed. The first wire groove 123 may be disposed to extend from the first sensor groove 121 to the first load port binding portion 140. In addition, the first load port binding unit 140 may include a first terminal groove 141 in which a terminal connecting a wire connected from the first sensor to an external wire is disposed, and the first wire groove ( 123) may be arranged to communicate with the first terminal groove 141. The second wire groove 133 may be disposed to extend from the second sensor groove 131 to the second load port binding portion 150. In addition, the second load port binding portion 150 may include a second terminal groove 151 in which a terminal connecting a wire connected from the second sensor to an external wire is disposed, and the second wire groove ( 133) may be arranged to communicate with the second terminal groove 151. 1 and 2, the first wire groove 121 and the second wire groove 131 may have an L shape to provide an optimal path for the wire, and the wafer sensing device 100 ) Can be reliably and efficiently coupled to the load port.

The first sensor groove 121 and the second sensor groove 131 may be formed corresponding to the shape and size of each sensor, and the first wire groove 123 and the second wire groove 133 are each wire It may be formed corresponding to the shape and size of the, the first terminal groove 141 and the second terminal groove 151 may be formed corresponding to the shape and size of each terminal.

On the side surfaces of the first sensor unit 120 and the second sensor unit 130, a screw thread communicating with the first sensor groove 121 and the second sensor groove 131 and a screw that is rotatable along the screw thread can be coupled. It may further include. The first sensor and the second sensor disposed inside the first sensor groove 121 and the second sensor groove 131 may be stably fixed through the screw.

The first sensor unit 120 and the second sensor unit 130 include a first transmitting and receiving groove 122 opened to each end from the first sensor groove 121 and the second sensor groove 131, and The second light receiving groove 132 may be further included. The first light-receiving groove 122 and the second light-receiving groove 132 are reflected and received by a light source and a wafer transmitted from sensors disposed in the first sensor groove 121 and the second sensor groove 131 to be received. It is a passage through which the light source moves. The first light-receiving grooves 122 and the second light-receiving grooves 132 may be formed parallel to the longitudinal direction of the body 110, that is, the surface direction of the sensed wafer. Through this, it is possible to more accurately measure whether a wafer is present at a specific location, and to prevent external interference. A plurality of the first light-receiving grooves 122 and the second light-receiving grooves 132 may be arranged to be spaced up and down, respectively.

In the wafer sensing apparatus 100 according to an embodiment of the present invention, a distance between the first sensor unit 120 and the second sensor unit 130 is 125 to 145 mm. When the distance between the first sensor unit 120 and the second sensor unit 130 exceeds 145 mm, a decrease in the amount of light may occur due to the long use of the wafer sensing device 100, and accordingly, the wafer located in the cassette This can lead to detection problems. When the distance between the first sensor unit 120 and the second sensor unit 130 is less than 125 mm, the distance between the first sensor unit 120 and the second sensor unit 130 is too close, such as a 200 mm wafer or a 300 mm wafer. It can be difficult to detect.

6 illustrates that the sensor portion of the wafer sensing apparatus 100 according to an embodiment of the present invention scans a 200 mm wafer, and FIG. 7 shows a 300 mm wafer of sensor portion of the wafer sensing apparatus 100 according to an embodiment of the present invention. It is shown to scan. 6 and 7, the first sensor unit 120 of the wafer sensing apparatus 100 according to an embodiment of the present invention protrudes from the first surface, and the second sensor unit 130 is the first It may protrude from one surface and be spaced apart from the first sensor unit 120.

The wafer sensing apparatus 100 according to an embodiment of the present invention stably detects both a 200 mm wafer and a 300 mm wafer by arranging the distance between the first sensor unit 120 and the second sensor unit 125 to 145 mm can do.

Table 1 below is a test of whether the wafer is detected by changing the distance between the first sensor unit 120 and the second sensor unit 130. In the embodiment, the distance between the first sensor unit 120 and the second sensor unit 130 was manufactured to 125 mm, 130 mm, and 145 m, and the comparative example is between the first sensor unit 120 and the second sensor unit 130. The distances of 120mm and 150mm were produced. The wafer sensing device 100 was mounted on the cover portion 1200 of the wafer carrier load port 1000, respectively, and the wafers having diameters of 200 mm and 300 mm were detected 100 times, respectively, and the number of detection errors was measured. As the sensor, FX-100 manufactured by Panasonic was used, and the amount of incident light in Table 1 below corresponds to the displayed value displayed on the sensor.

division


Distance between sensor parts
(mm) The incident light intensity measured by the first sensor and the second sensor (average value) 200mm wafer detection error count
(time) 300mm wafer detection error count
(time)
Comparative Example 1 120 3872 4 7 Example 1 125 3903 0 0 Example 2 130 3911 0 0 Example 3 145 3908 0 0 Comparative Example 2 150 3887 3 One

Referring to Table 1, the distance between the first sensor unit 120 and the second sensor unit 130 is manufactured by 125 mm, 130 mm, and 145 m, so that it is possible to detect stable wafers on both 200 mm and 300 mm wafers. Can.

The width of the first sensor unit 120 and the second sensor unit 130 may be 15 to 25 mm. When the widths of the first sensor unit 120 and the second sensor unit 130 are less than 15 mm, a signal for receiving the reflected light source is weakened, and a wafer detection error may occur. The first sensor unit 120 and the second sensor unit 120 When the width of the sensor unit 130 exceeds 25 mm, the width of the sensor unit may be thick, making it difficult to detect a 200 mm wafer.

The first load port binding portion 140 may be disposed in a shape bent in a direction perpendicular to the first surface from one end of the body 110. The wafer sensing device 100 may be disposed on the cover portion 1200 that separates the carrier cover by combining with the carrier cover of the wafer carrier of the wafer carrier load port 1000. Referring to FIGS. 3 and 4, the wafer sensing device 100 is disposed on the cover portion 1200 to detect a wafer inside a wafer carrier or a pull as the cover portion 1200 moves. The first load port binding portion 140 and the second load port binding portion 150 are formed to correspond to the shape of one surface of the cover portion 1200, so that the wafer sensing device 100 is equipped with a wafer carrier load port ( 1000) can be stably fixed. The first load port binding portion 140 and the second load port binding portion 150 may further include a screw thread into which a screw for coupling with the wafer carrier load port 1000 is inserted.

As described above, a first terminal groove 141 in which a terminal connected from a sensor disposed in the first sensor unit 120 is disposed, and the second load port binding unit 150 includes the body 110 It may include a second terminal groove 151 is disposed extending from the tartan in the direction perpendicular to the first surface, the terminal connected from the sensor disposed in the second sensor unit 130 is disposed.

The body 110 has a constant width to stably support the first sensor unit 120 and the second sensor unit 130. The width of the body 110 means the length between the first and second surfaces of the body 110. The width of the body 110 between the first sensor unit 120 and the second sensor unit 130 may be thinner than the width of the remaining body 110 unit. Through this, the body 110 is detected by the wafer slip out sensor 1500 disposed in the wafer carrier load port 1000 to prevent an erroneous alarm from occurring. Referring to FIG. 5, a wafer slip-out sensor 1500 may be disposed on upper and lower portions of a wafer carrier hot-hole, which is a path through which a wafer moves from a wafer carrier or pull. The wafer slip-out sensor 1500 functions to detect a case in which a wafer is slid outward from a wafer carrier or pull and sound an alarm. The wafer sensing device 100 disposed on the cover plate detects the presence or absence of a wafer along the vertical axis in which the wafer slip-out sensor 1500 is disposed, so that the first sensor unit 120 and the second of the wafer sensing device 100 are detected. When the width between the sensor units 130 is thick, it may be detected by the wafer slip-out sensor 1500. In the wafer sensing apparatus 100 according to an embodiment of the present invention, the width of the body 110 between the first sensor unit 120 and the second sensor unit 130 is thinner than the width of the remaining body 110 unit. By doing so, such a problem can be prevented. Preferably, the width of the body portion between the first sensor portion and the second sensor portion is 7 to 12 mm, preferably 10 mm, and the width of the body portion outside the first sensor portion and the second sensor portion is 10 to 17. mm, preferably 14.5 mm. The width of the body 110 between the first sensor unit 120 and the second sensor unit 130 may be 1 to 5 mm thinner than the width of the remaining body 110 unit.

The wafer sensing apparatus 100 according to an embodiment of the present invention may be made of metal, ceramic, resin, or the like, and may be manufactured by anodizing after cutting aluminum. The material and manufacturing method of the wafer sensing device 100 are not particularly limited.

The first sensor and the second sensor disposed on the first sensor unit 120 and the second sensor unit 130 may include a transmitter for transmitting a light source and a receiver for receiving a reflected light source. The first sensor and the second sensor may be optical sensors that detect the presence or absence of a wafer or an abnormal state of the wafer in a non-contact manner. The first sensor and the second sensor may detect the presence or absence of a wafer or an abnormal state of the wafer by a direct transmission/reception mode or a reflection mode.

The direct transmission/reception mode is a mode in which at least a portion of the wafer is positioned on the same line of the transmission/reception portions of the first sensor and the second sensor, and the wafer is sensed. In the direct transmission/reception mode, a light source is transmitted from the transmitter of the first sensor to the receiver of the second sensor, and the difference between the light source detection signals according to the presence or absence of a wafer is in a straight line with the transmitter of the first sensor and the receiver of the second sensor. The presence or absence of a wafer can be checked. Alternatively, a light source is transmitted from the transmitter of the second sensor to the receiver of the first sensor, and the presence or absence of the wafer is caused by the difference in the light source detection signal according to the presence or absence of the wafer on the straight line of the transmitter of the second sensor and the receiver of the first sensor. You can check

In the reflection mode, a light source reflected by a light source reflected from a side edge of the wafer or a reflective member located at the rear of the wafer cassette or the pull is transmitted from the transmitter of the first sensor or the second sensor to the first sensor or the second sensor. It is a method of detecting the changed light source in the receiver. In the reflection mode, when the light source reflected from the side edge of the wafer is detected by the light source from the transmission unit of the first sensor or the second sensor, the light source transmitted from the first sensor is the receiving unit of the first sensor or the second sensor. The light source reflected from the wafer side edge may be detected by the receiver. Alternatively, the light source transmitted from the second sensor may detect the light source reflected from the edge of the wafer side at the receiver of the first sensor or the receiver of the second sensor. In the reflection mode, when the light source reflected from the reflective member located behind the cassette or the pull is detected by the transmitting unit of the first sensor or the second sensor, the rear of the cassette or pull storing the wafer for this purpose is detected. The sensor may include a reflector, and when there is no wafer, the signal may be detected at the receiver of the first sensor or the second sensor by being reflected in a state where there is little signal change of the light source transmitted from the transmitter of the first sensor or the second sensor. have.

3 to 5 show a wafer carrier load port 1000 according to an embodiment of the present invention.

3 to 5, the wafer carrier load port 1000 according to an embodiment of the present invention includes a plate for supporting a wafer carrier for storing wafers therein and a fixing part for fixing the wafer carrier A wafer carrier port portion 1100; And a cover portion 1200 that separates the carrier cover by combining with the carrier cover of the wafer carrier. The cover part 1200 includes a cover plate that is coupled to the wafer carrier cover and separates the carrier cover, and a wafer sensing device 100 disposed on the cover plate to detect a wafer inside the wafer carrier. . The wafer sensing device includes a body 110 including a first surface and a second surface opposite to the first surface, protruding from the first surface and disposed on the body 110 and having a sensor at one end. A first sensor unit 120 including a first sensor groove disposed, protruding from the first surface and spaced apart from the first sensor unit 120 on the body 110 and having a sensor at one end A second sensor part 130 including a second sensor groove disposed, a first load port binding part 140 disposed at one end of the body 110 and coupling the cover plate and the body 110, and It is disposed on the other end of the body 110 and includes a second rod port binding portion 150 for coupling the cover plate and the body 110, the first sensor unit 120 and the second sensor unit 130 ) Is between 125 and 145 mm.

The wafer sensing device 100 may be as described above.

The wafer carrier load port 1000 may be integrally disposed with the semiconductor processing apparatus 2000, and separately disposed to move the wafer of the wafer carrier or the puck to the processing unit 2100 of the semiconductor processing apparatus 2000. To perform.

The wafer carrier port part 1100 may include a plate for supporting a wafer carrier for storing a wafer therein, and a fixing part disposed on the plate and stably processing the wafer carrier. In addition, it may include a sensor for detecting the presence or absence of the wafer carrier.

The cover part 1200 serves to separate the carrier cover of the wafer carrier and re-couple the separated carrier cover. The cover part 1200 may include a clasp that is coupled to a groove disposed on one surface of the carrier cover to detach the carrier cover from the wafer carrier.

The wafer carrier load port 1000 includes a wafer carrier connector, which is a passage through which the wafer is moved, and the cover part 1200 can open and close the wafer carrier connector. When the wafer carrier is disposed on the wafer carrier port portion 1100, the cover portion 1200 is coupled to the carrier cover of the wafer carrier to separate the carrier cover, and by moving down the wafer carrier connector with the carrier cover The wafer carrier connector can be opened. While the cover portion 1200 is moved downward, the wafer sensing device 100 disposed on the cover portion 1200 may detect the presence or absence of a wafer inside the wafer carrier by scanning the wafer inside the wafer carrier. When the semiconductor manufacturing process of the semiconductor processing apparatus 2000 is completed and the wafer returns to the inside of the wafer carrier, the cover part 1200 may move upward to couple the carrier cover to the wafer carrier. While the cover part 1200 is moved upward, the wafer sensing device 100 disposed on the cover part 1200 may detect the presence or absence of a wafer inside the wafer carrier by scanning the wafer inside the wafer carrier. The detection information of the presence or absence of the wafer or the abnormal state is transmitted to the semiconductor processing apparatus 2000, so that a subsequent operation can be performed in a normal state, and an alarm may sound without a subsequent operation of the device in an abnormal state.

The wafer carrier load port 1000 may further include a first driver 1300 moving the cover portion 1200 up and down. The moving part may include a hydraulic or pneumatic actuator or a linear motor, and is not particularly limited.

In addition, a second driving unit driving the cover unit 1200 and the wafer sensing device 100 may be further included. The first driving part may control the position and movement of the cover part 1200 and the wafer sensing device 100 in the first direction, that is, the vertical direction, and the second driving part may detect the cover part 1200 and the wafer It is possible to control the position and movement of the device 100 in the second direction, that is, in the horizontal direction.

The first driving part and the second driving part may control the position and movement of the first direction or the position and movement of the second direction in cooperation with each other.

As described above, the wafer carrier load port 1000 according to an embodiment of the present invention is in a state in close contact with the wafer moving wafer carrier connector when not in operation, so that the atmosphere of the semiconductor manufacturing fab does not flow into the device, so that the semiconductor process The closed state of the device 2000 can be maintained.

When the wafer cassette or the unpacking is disposed in the wafer carrier port portion 1100 of the load port for the progress of the semiconductor process, the cover portion 1200 and the wafer sensing device 100 are directed in the second direction from the semiconductor processing apparatus 2000. That is, it can be driven to be spaced apart at least partially in the horizontal direction. Next, the cover part 1200 and the wafer sensing device 100 may be driven in a first direction, that is, in a direction perpendicular to the ground.

5 illustrates a carrier connector including an upper sensor portion and a lower sensor portion of a wafer loading sensing device according to another embodiment of the present invention.

Referring to FIG. 5, the wafer slip-out sensor 1500 disposed on the same line of the upper and lower portions of the wafer carrier connector is configured to determine whether a wafer located inside the wafer carrier or pull deviates from a designated position from the wafer carrier or pull. Can be detected.

When the wafer located inside the wafer carrier or the pull deviates from the designated position, an unwanted collision with the robot 2210 moving the wafer may occur. Alternatively, the wafer may be damaged in a process in which the cover portion 1200 is switched from an open state to a closed state with the wafer protruding from the wafer carrier or pull. The wafer sensing apparatus 100 included in the wafer carrier load port 1000 according to an embodiment of the present invention has a width of the body 110 between the first sensor unit 120 and the second sensor unit 130. This problem can be prevented by forming the body 110 thinner than the width.

8 and 9 illustrate a semiconductor processing apparatus 2000 according to an embodiment of the present invention.

8 and 9, a semiconductor processing apparatus 2000 according to an exemplary embodiment of the present invention includes a processing unit 2100 for processing a wafer; And a wafer carrier load port 1000 for supplying the wafer to the process unit 2100. The wafer carrier load port 1000 includes: a wafer carrier port portion 1100 including a plate supporting a wafer carrier therein for storing wafers therein and a fixing portion fixing the wafer carrier; And a cover portion 1200 that separates the carrier cover by combining with the carrier cover of the wafer carrier. The cover part 1200 includes a cover plate that is coupled to the wafer carrier cover and separates the carrier cover, and a wafer sensing device 100 disposed on the cover plate to detect a wafer inside the wafer carrier. . The wafer sensing device includes a body 110 including a first surface and a second surface opposite to the first surface, protruding from the first surface and disposed on the body 110 and having a sensor at one end. A first sensor unit 120 including a first sensor groove disposed, protruding from the first surface and spaced apart from the first sensor unit 120 on the body 110 and having a sensor at one end A second sensor part 130 including a second sensor groove disposed, a first load port binding part 140 disposed at one end of the body 110 and coupling the cover plate and the body 110, and It is disposed on the other end of the body 110 and includes a second rod port binding portion 150 for coupling the cover plate and the body 110, the first sensor unit 120 and the second sensor unit 130 ) Is between 125 and 145 mm.

The wafer carrier load port 1000 and the wafer sensing device 100 may be the same as described above.

The semiconductor processing apparatus 2000 is an apparatus for manufacturing a semiconductor using a wafer, and may be a CVD apparatus, a PVD apparatus, an etching apparatus, a CMP apparatus, etc., and is not particularly limited. In the process unit 2100, the CVD process, PVD process, etching process and CMP process are performed.

The semiconductor processing apparatus 2000 is disposed between the process unit 2100 and the wafer carrier load port 1000 to transfer the wafer from the wafer carrier load port 1000 to the process unit 2100. (EFEM) may be further included. A robot 2210 is disposed on the transfer unit 2200 to transfer the wafer.

In general, the semiconductor process includes a wafer carrier load port 1000 for moving a wafer inside a wafer carrier or a puck inside the processing unit 2100 because it is performed in an environment sealed from the outside.

10: 200mm wafer
20: 300mm wafer
100: wafer sensing device
110: body
120: first sensor unit
121: first sensor groove
122: 1st Soo-gwang Home
123: first front groove
130: second sensor unit
131: second sensor groove
132: the second transmission and reception home
133: second front groove
140: first load port connection
141: first terminal groove
150: second load port connection
151: second terminal groove
1000: wafer carrier load port
1100: wafer carrier port
1200: cover
1300: first driving unit
1400: second drive unit
1500: wafer slip-out sensor
2000: semiconductor processing equipment
2100: process unit
2200: transfer unit
2210: robot

Claims (5)

A first wire groove 123 including a first surface and a second surface facing the first surface, and on which wires connected from the first sensor are disposed; and second wire grooves on which the wires connected from the second sensor are disposed. (133); Body 110 including;
A first sensor groove 121 that protrudes from the first surface, is disposed on the body 110, and has a transmitter for transmitting a light source and a receiver for receiving a reflected light source at one end. Sensor unit 120;
Protruding from the first surface, and is spaced apart from the first sensor unit 120 by a predetermined interval on the body 110, a transmitter for transmitting a light source at one end and a receiver for receiving the reflected light source are arranged A second sensor unit 130 including a second sensor groove 131;
Is disposed on one end of the body 110, the first wire groove 123 is disposed extending from the first sensor groove 121, a terminal connecting the wire connected from the first sensor with an external wire It includes a first terminal groove 141 is disposed, the first wire groove 123 is a first load port binding portion 140 disposed to communicate with the first terminal groove 141; And
Is disposed on the other end of the body 110, the second wire groove 133 is disposed extending from the second sensor groove 131, the terminal connecting the wire connected from the second sensor with an external wire It includes a second terminal groove 151 is disposed, the second wire groove 133 is a second load port binding portion 150 disposed to communicate with the second terminal groove 151; includes,
The width of the body portion 110 between the first sensor portion 120 and the second sensor portion 130 is thinner than the width of the rest of the body portion 110, the first sensor portion 120 and the first 2 The width of the body 110 between the sensor parts 130 is 1 to 5 mm thinner than the width of the rest of the body 110,
The first light-receiving groove 122 is a passage through which the light source transmitted from the first sensor disposed in the first sensor groove 121 and the light source reflected and received by the wafer move, and the second sensor groove 131 It includes; a second light receiving groove 132, which is a passage through which the light source transmitted from the second sensor disposed in the light source and the light source reflected by the wafer is moved, and includes,
The distance between the first sensor unit 120 and the second sensor unit 130 is 125 to 145 mm,
The width of the first sensor unit 120 and the second sensor unit 130 is 15 to 25 mm,
The first sensor and the second sensor detect the presence or absence of a wafer or an abnormal state of the wafer by a direct transmission/reception mode or a reflection mode,
In the direct transmission/reception mode, a light source is transmitted from the transmitter of the first sensor to the receiver of the second sensor, and the difference between the light source detection signals according to the presence or absence of a wafer is in a straight line with the transmitter of the first sensor and the receiver of the second sensor. Check the presence or absence of the wafer,
In the reflection mode, when the light source reflected from the side edge of the wafer is detected by the light source from the transmission unit of the first sensor or the second sensor, the light source transmitted from the first sensor is the receiving unit of the first sensor or the second sensor. Characterized in that the receiver detects the light source reflected from the edge of the wafer side,
Wafer sensing device 100 for 200 mm and 300 mm diameter wafers.
delete delete A wafer carrier port part 1100 including a plate supporting a wafer carrier therein for storing 200 mm and 300 mm diameter wafers therein and a fixing part for fixing the wafer carrier; And
It includes; a cover portion 1200 for engaging with the carrier cover of the wafer carrier,
The cover portion 1200,
A cover plate that is combined with the carrier cover of the wafer carrier to separate the carrier cover, and
A wafer carrier load port 1000 disposed on the cover plate to sense a wafer inside the wafer carrier, and including the wafer sensing device 100 according to claim 1.
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