KR20190109354A - Wafer sensing apparatus, wafer carrier loard port comprising the same and apparatus for semiconductor process comprising the same - Google Patents

Abstract

The present invention relates to a wafer sensing apparatus, including: a body including a first surface and a second surface facing the first surface; a first sensor part protruding from the first surface and provided on an upper portion of the body; and a second sensor part protruding from the first surface, provided on the upper portion of the body, and spaced apart from the first sensor part, wherein the first sensor part includes a transmitting part transmitting a light source to one end and a receiving part receiving the reflected light source. The second sensor part includes a transmitting part transmitting the light source to one end and a receiving part receiving the reflected light source. A distance between the first sensor part and the second sensor part is 125 to 145 mm.

Description

WAFER SENSING APPARATUS, WAFER CARRIER LOARD PORT COMPRISING THE SAME AND APPARATUS FOR SEMICONDUCTOR PROCESS COMPRISING THE SAME}

The present invention relates to a wafer sensing device, a wafer carrier load port comprising the same, and a semiconductor processing apparatus including the same.

In general, semiconductor devices are manufactured by depositing and patterning thin films that perform various functions on the wafer surface to form various circuit geometries. As a unit process for manufacturing such a semiconductor device, an impurity ion implantation step of implanting impurity ions into a semiconductor wafer largely, a thin film deposition process of forming a material film on a semiconductor substrate, and forming the material film in a predetermined pattern Units such as the etching process, the CMP (Chemical Mechanical Polishing) process to remove the step by polishing the surface of the wafer collectively after depositing the interlayer insulating film on the wafer, and the wafer cleaning process to remove impurities. Can be divided into processes.

Therefore, the semiconductor device is manufactured by repeatedly performing the above various unit processes, each of which is typically carried out on a wafer basis while being moved by a wafer storage container in which 25 or 50 wafers are accommodated.

On the other hand, when the wafer size is 8 inches (inch), the open wafer cassette was used a lot, but in order to prevent contamination that may occur during the recent movement of the wafer, a closed container (Front Open Unified Pod) , FOUP) is mainly used.

On the other hand, when the wafers accommodated in the cassette or the pool are loaded into process apparatuses for performing an ion implantation process, a deposition process, or a planarization process, the wafers and the storage state of the wafers stored in the pool are checked. Mapping process is performed.

The load port is a means by which a semiconductor manufacturing facility is connected to a semiconductor manufacturing fab. The wafers of cassettes or pulls disposed on the shelves of the load ports may be introduced into a process chamber inside the apparatus by a wafer handling robot after wafer mapping. Can be.

The cassette or unpack includes at least 25 slots corresponding to 25 wafers. For example, wafer 1 is inserted into slot 1 of the cassette or pull and wafer 5 is inserted into slot 5 of the cassette or pull. However, the wafer may cause loss of a specific wafer among 25 wafers due to wafer analysis due to defects in the process, contamination or breakage during semiconductor processing, and contamination or breakage during wafer transfer between devices. For example, in the photolithography step, all of wafers 1 to 25 are intact, and in the metal deposition step, the wafers may be empty slots for the purpose of disappearing wafer 3 and analyzing wafer 7 in the previous step. Less than 25 sheets can be delivered to the load port.

The wafers arranged in the cassette are transferred by the robot one by one to the reaction chamber for the next process. Before transferring the wafer to each reaction chamber by the robot, the position and alignment order of the wafers aligned in the cassette or the pull are checked to ensure that the wafers are aligned.

Conventional wafer sensing apparatus has a long pass distance of the light source may cause a shift and change according to the use time, there is a problem that the change in the amount of light increases.

Korean Laid-Open Patent Publication 2003-0001838

An object of the present invention is to provide a wafer sensing device in which the width of the first sensor unit and the second sensor unit are adjusted to significantly reduce the amount of light with time, and the accuracy and lifetime of mapping detection can be increased. .

In addition, another object of the present invention is to provide a wafer carrier load port including a wafer sensing device capable of detecting breakage due to detachment of the wafer.

According to an embodiment of the present invention, a wafer sensing device includes: a body including a first surface and a second surface opposite to the first surface; A first sensor part protruding from the first surface, the first sensor part disposed on the body and including a first sensor groove disposed at one end of the sensor; A second sensor part protruding from the first surface, spaced apart from the first sensor part on the body, and including a second sensor groove disposed at one end thereof; A first load port binding portion disposed at one end of the body; And a second load port binding portion disposed at the other end of the body, wherein a distance between the first sensor portion and the second sensor portion is 125 to 145 mm.

The first load port fastening portion extends from one end of the body in a direction perpendicular to the first surface, and includes a first terminal groove in which a terminal connected from a sensor disposed in the first sensor part is disposed. The second load port binding part may include a second terminal groove extending from a tartan of the body in a direction perpendicular to the first surface, and having a terminal connected from a sensor disposed on the second sensor part.

The width of the body portion between the first sensor portion and the second sensor portion may be thinner than the width of the remaining body portion.

A wafer carrier load port according to an embodiment of the present invention includes a wafer carrier port part including a plate for supporting a wafer carrier for storing a wafer therein and a fixing part for fixing the wafer carrier; And a cover part coupled to the carrier cover of the wafer carrier to separate the carrier cover. The cover unit includes a cover plate coupled to the wafer carrier cover to separate the carrier cover, and a wafer sensing device disposed on the cover plate to sense a wafer inside the wafer carrier. The wafer sensing device includes a body including a first surface and a second surface opposite to the first surface, a first sensor groove protruding from the first surface and disposed on the body and having a sensor disposed at one end thereof. A second sensor part comprising a first sensor part including a second sensor groove protruding from the first surface and spaced apart from the first sensor part on the body, and having a sensor disposed at one end thereof; A first load port binding portion disposed at one end of the body and coupling the cover plate and the body, and a second load port binding portion disposed at the other end of the body and coupling the cover plate and the body; The distance between the first sensor part and the second sensor part is 125 to 145 mm.

A semiconductor processing apparatus according to an embodiment of the present invention, a process unit for performing a process for the wafer; And

And a wafer carrier load port for supplying the wafer to the processing unit. The wafer carrier load port may include a wafer carrier port part including a plate for supporting a wafer carrier for storing a wafer therein and a fixing part for fixing the wafer carrier; And a cover part coupled to the carrier cover of the wafer carrier to separate the carrier cover. The cover unit includes a cover plate coupled to the wafer carrier cover to separate the carrier cover, and a wafer sensing device disposed on the cover plate to sense a wafer inside the wafer carrier. The wafer sensing device includes a body including a first surface and a second surface opposite to the first surface, a first sensor groove protruding from the first surface and disposed on the body and having a sensor disposed at one end thereof. A second sensor part comprising a first sensor part including a second sensor groove protruding from the first surface and spaced apart from the first sensor part on the body, and having a sensor disposed at one end thereof; A first load port binding portion disposed at one end of the body and coupling the cover plate and the body, and a second load port binding portion disposed at the other end of the body and coupling the cover plate and the body; The distance between the first sensor part and the second sensor part is 125 to 145 mm.

In the wafer sensing apparatus according to the embodiment of the present invention, since the distance between the first sensor portion and the second sensor portion is shortened, the amount of light may be significantly reduced as time passes, and the accuracy of mapping detection and the life of the apparatus may be increased. Can be.

The wafer sensing apparatus according to the embodiment of the present invention can map 200mm wafers and 300mm wafers without replacing the apparatus, and convenience of managing the wafer sensing apparatus can be increased.

1 and 2 illustrate a wafer sensing apparatus in accordance with an embodiment of the present invention.
3 to 5 illustrate wafer carrier load ports according to embodiments of the invention.
6 is a view illustrating a sensor unit scanning a 200 mm wafer in a wafer sensing apparatus according to an exemplary embodiment of the present invention.
FIG. 7 is a diagram illustrating a sensor unit scanning a 300 mm wafer according to an embodiment of the present invention.
8 and 9 illustrate a semiconductor processing apparatus according to an embodiment of the present invention.

1 and 2 illustrate a wafer sensing device 100 according to an embodiment of the present invention.

Referring to FIG. 1, a wafer sensing apparatus 100 according to an embodiment of the present invention may include a body 110 including a first surface and a second surface opposite to the first surface; A first sensor unit 120 protruding from the first surface and including a first sensor groove disposed on the body 110 and having a sensor disposed at one end thereof; The second sensor unit 130 protruding from the first surface, spaced apart from the first sensor unit 120 on the body 110, and includes a second sensor groove at one end of the sensor. ); A first load port binding unit 140 disposed at one end of the body 110; And a second load port binding unit 150 disposed at the other end of the body 110, wherein a distance between the first sensor unit 120 and the second sensor unit 130 is 125 to 145 mm.

The wafer sensing apparatus 100 may be disposed in the wafer carrier load port 1000 of the semiconductor processing apparatus 2000 to detect the presence or abnormality of the wafer in the wafer cassette or the FOUP. Generally, a plurality of wafers are layered at regular intervals in the wafer carrier or the unwind. Wafers go through hundreds of processes in semiconductor manufacturing, and some wafers can be broken and lost, so some wafers may be missing from the wafer cassette or pull. In this case, it is possible to improve the efficiency of the semiconductor process by determining the presence or absence of the wafer.

The first sensor unit 120 and the second sensor unit 130 are places where a sensor for detecting a wafer is disposed. As illustrated in FIGS. 1 and 2, the first sensor unit 120 and the second sensor unit 130 are spaced apart from each other by a predetermined interval. Since the wafer disposed in the wafer carrier or the pool is disposed between the first sensor unit 120 and the second sensor unit 130, the presence or absence of the wafer may be determined through the sensor.

The first sensor unit 120 and the second sensor unit 130 may include a first sensor groove 121 and a second sensor groove 131 on which the first sensor and the second sensor are disposed, respectively. The first sensor and the second sensor are fixed by being disposed in the first sensor groove 121 and the second sensor groove 131, respectively, and stably detect the presence or absence of a wafer from an external physical shock. The first sensor and the second sensor may be connected to a wire that transmits the sensed signal to the outside and receives power from the outside. At this time, the body 110 may include a wire groove for stably fixing the wire. Specifically, the first wire groove 123 in which the wire connected from the first sensor is disposed and the second wire groove 133 in which the wire connected from the second sensor are disposed may be included. The first wire groove 123 may extend from the first sensor groove 121 to the first load port binding unit 140. In addition, the first load port binding unit 140 may include a first terminal groove 141 in which a terminal for connecting a wire connected from the first sensor to an external wire is disposed, and the first wire groove ( 123 may be disposed to communicate with the first terminal groove 141. The second wire groove 133 may extend from the second sensor groove 131 to the second load port binding unit 150. In addition, the second load port binding unit 150 may include a second terminal groove 151 in which a terminal for connecting a wire connected from the second sensor to an external wire is disposed, and the second wire groove ( 133 may be disposed to communicate with the second terminal groove 151. As shown in FIGS. 1 and 2, the first wire groove 121 and the second wire groove 131 may have an L shape to provide an optimal path for the wire, and the wafer sensing apparatus 100 may be provided. Can be coupled to the load port stably and efficiently.

The first sensor groove 121 and the second sensor groove 131 may be formed corresponding to the shape and size of each sensor, and the first wire groove 123 and the second wire groove 133 are each wire The first terminal groove 141 and the second terminal groove 151 may be formed corresponding to the shape and size of each terminal.

On the side surfaces of the first sensor unit 120 and the second sensor unit 130, a screw thread communicating with the first sensor groove 121 and the second sensor groove 131 and a screw capable of rotating along the screw line may be coupled. It may further include. The first sensor and the second sensor disposed in the first sensor groove 121 and the second sensor groove 131 may be stably fixed through the screw.

The first sensor unit 120 and the second sensor unit 130 may include a first light receiving and receiving groove 122 that is open to each end from the first sensor groove 121 and the second sensor groove 131, and It may further include a second light receiving groove 132. The first light receiving groove 122 and the second light receiving groove 132 are reflected by a light source and a wafer transmitted from a sensor disposed in the first sensor groove 121 and the second sensor groove 131 to receive the light. It is a passage through which the light source moves. The first light receiving groove 122 and the second light receiving groove 132 may be formed parallel to the longitudinal direction of the body 110, that is, the surface direction of the detected wafer. This makes it possible to more accurately measure the presence of wafers at specific locations and to prevent external interference. A plurality of the first light receiving groove 122 and the second light receiving groove 132 may be arranged spaced apart from each other up and down.

In the wafer sensing apparatus 100 according to the exemplary embodiment of the present invention, a distance between the first sensor unit 120 and the second sensor unit 130 is 125 to 145 mm. When the distance between the first sensor unit 120 and the second sensor unit 130 exceeds 145 mm, the amount of light may decrease due to long use of the wafer sensing device 100, and thus the wafer located in the cassette may be removed. Detecting problems can occur. When the distance between the first sensor unit 120 and the second sensor unit 130 is less than 125 mm, the distance between the first sensor unit 120 and the second sensor unit 130 is too close, such as a 200 mm wafer or a 300 mm wafer. It can be difficult to detect.

FIG. 6 illustrates that a sensor unit of the wafer sensing apparatus 100 according to an embodiment of the present invention scans a 200 mm wafer, and FIG. 7 illustrates a sensor unit of the wafer sensing apparatus 100 according to an embodiment of the present invention. Scanning is shown. 6 and 7, the first sensor unit 120 of the wafer sensing apparatus 100 according to the embodiment of the present invention protrudes from the first surface, and the second sensor unit 130 is formed of the first sensor unit. It may protrude from one surface and be spaced apart from the first sensor unit 120.

The wafer sensing apparatus 100 according to the embodiment of the present invention stably detects both the 200 mm wafer and the 300 mm wafer by arranging the distance between the first sensor unit 120 and the second sensor unit 130 to 145 mm. can do.

Table 1 below is a test of whether the wafer is detected by changing the distance between the first sensor unit 120 and the second sensor unit 130. According to the embodiment, the distance between the first sensor unit 120 and the second sensor unit 130 is manufactured to 125 mm, 130 mm, and 145 m, and the comparative example is between the first sensor unit 120 and the second sensor unit 130. The distance of 120mm and 150mm was produced. The wafer sensing device 100 was mounted on the cover portion 1200 of the wafer carrier load port 1000, and 100 wafers each having a diameter of 200 mm and 300 mm were detected 100 times, and the number of detection errors was measured. The sensor used Panasonic's FX-100, and the amount of incident light in Table 1 corresponds to the display value indicated on the sensor.

division


Distance between sensor parts
(mm) Light incident amount measured by the 1st sensor and the 2nd sensor (average value) 200mm wafer detection error count
(time) 300mm wafer detection error count
(time)
Comparative Example 1 120 3872 4 7 Example 1 125 3903 0 0 Example 2 130 3911 0 0 Example 3 145 3908 0 0 Comparative Example 2 150 3887 3 One

Referring to Table 1, the distance between the first sensor unit 120 and the second sensor unit 130 is 125mm, 130mm, and 145m, so that it is possible to detect stable wafers on both 200mm and 300mm wafers. Can be.

Widths of the first sensor unit 120 and the second sensor unit 130 may be 15 to 25 mm. If the widths of the first sensor unit 120 and the second sensor unit 130 are less than 15 mm, a signal for receiving the reflected light source may be weakened, and a wafer detection error may occur. When the width of the sensor unit 130 exceeds 25 mm, the width of the sensor unit may be thick, making it difficult to detect a 200 mm wafer.

The first load port binding unit 140 may be arranged to be bent from one end of the body 110 in a direction perpendicular to the first surface. The wafer sensing apparatus 100 may be disposed in a cover portion 1200 that is coupled to the carrier cover of the wafer carrier of the wafer carrier load port 1000 to separate the carrier cover. 3 and 4, the wafer sensing apparatus 100 may be disposed on the cover portion 1200 to detect a wafer in the wafer carrier or the pull as the cover portion 1200 moves. The first load port binding unit 140 and the second load port binding unit 150 are formed to correspond to the shape of one surface of the cover unit 1200, so that the wafer sensing device 100 is equipped with a wafer carrier load port ( 1000) can be stably fixed. The first load port binding unit 140 and the second load port binding unit 150 may further include a screw thread into which a screw for coupling with the wafer carrier load port 1000 is inserted.

As described above, the terminal includes a first terminal groove 141 in which a terminal connected from a sensor disposed in the first sensor unit 120 is disposed, and the second load port binding unit 150 is the body 110. The second terminal groove 151 may be disposed to extend in a direction perpendicular to the first surface of the tartan and to be connected to a terminal connected from a sensor disposed in the second sensor unit 130.

The body 110 may stably support the first sensor unit 120 and the second sensor unit 130 by having a constant width. The width of the body 110 refers to a length between the first and second surfaces of the body 110. The width of the body 110 between the first sensor unit 120 and the second sensor unit 130 may be thinner than the width of the remaining body 110. Through this, the body 110 may be detected by the wafer slip out sensor 1500 disposed in the wafer carrier load port 1000, thereby preventing an erroneous alarm from occurring. Referring to FIG. 5, wafer slip out sensors 1500 and wafer slip out sensors may be disposed on upper and lower portions of a wafer carrier thermal opening that is a passage through which wafers move from a wafer carrier or a pull. The wafer slip-out sensor 1500 detects a case in which the wafer slides outward from the wafer carrier or the pull to generate an alarm. Since the wafer sensing device 100 disposed on the cover plate detects the presence or absence of the wafer along the vertical axis where the wafer slip-out sensor 1500 is disposed, the first sensor unit 120 and the second sensor unit of the wafer sensing device 100 are provided. If the width between the sensor unit 130 is thick, it may be detected by the wafer slip-out sensor 1500. In the wafer sensing apparatus 100 according to the exemplary embodiment, the width of the body 110 between the first sensor 120 and the second sensor 130 is thinner than the width of the remaining body 110. This can prevent this problem. Preferably, the width of the body portion between the first sensor portion and the second sensor portion is 7 to 12 mm, preferably 10 mm, and the width of the body portion outside the first sensor portion and the second sensor portion is 10 to 17. mm, preferably 14.5 mm. The width of the body 110 portion between the first sensor portion 120 and the second sensor portion 130 may be 1 to 5 mm thinner than the width of the remaining body 110 portion.

The wafer sensing apparatus 100 according to the embodiment of the present invention may be made of metal, ceramic, resin, or the like, and may be manufactured by anodizing after cutting aluminum. The material and manufacturing method of the wafer sensing device 100 are not particularly limited.

The first sensor and the second sensor disposed on the first sensor unit 120 and the second sensor unit 130 may include a transmitter for transmitting a light source at one end and a receiver for receiving the reflected light source. The first sensor and the second sensor may be optical sensors that detect the presence or absence of a wafer or an abnormal state of the wafer in a non-contact manner. The first sensor and the second sensor may detect the presence or absence of a wafer or an abnormal state of the wafer by a direct transmission / reception mode or a reflection mode.

The direct transmission / reception mode is a mode for locating at least a portion of the wafer on the same line as the transceiver of the first sensor and the second sensor and sensing the wafer. The direct transmission / reception mode transmits a light source from the transmitting unit of the first sensor to the receiving unit of the second sensor, and based on the difference between the light source detection signals according to the presence or absence of a wafer on the line of the transmitting unit of the first sensor and the receiving unit of the second sensor. The presence or absence of a wafer can be checked. Alternatively, the light source may be transmitted from the transmitter of the second sensor to the receiver of the first sensor, and the wafer may be present due to a difference in the light source detection signal depending on the presence or absence of the wafer on a straight line of the transmitter of the second sensor and the receiver of the first sensor. You can check

The reflection mode may include a light source reflected by a light source at a transmitter of the first sensor or a second sensor, or a light source reflected by a reflective member located at a side edge of the wafer or behind a wafer cassette or a pull. This is a method for detecting the changed light source at the receiver. In the reflection mode, when the light source reflected from the side edge of the wafer is detected by the transmitter of the first sensor or the second sensor, the light source emitted from the first sensor may be a receiver of the first sensor or the second sensor. The receiver may detect a light source reflected at the side edge of the wafer. Alternatively, the light source transmitted from the second sensor may detect the light source reflected from the side edge of the wafer at the receiver of the first sensor or the receiver of the second sensor. In the reflective mode, when the light source reflected from the reflective member located at the rear of the cassette or the fulcrum is detected by the transmitting unit of the first sensor or the second sensor, the reflective mode is the rear of the cassette or fulc containing the wafer for this purpose. May include a reflector, and when there is no wafer, the reflector may be reflected with almost no signal change of the light source emitted from the transmitter of the first sensor or the second sensor so that a signal may be detected at the receiver of the first sensor or the second sensor. have.

3 to 5 illustrate a wafer carrier load port 1000 according to an embodiment of the invention.

3 to 5, a wafer carrier load port 1000 according to an embodiment of the present invention includes a plate for supporting a wafer carrier for storing a wafer therein and a fixing part for fixing the wafer carrier. A wafer carrier port portion 1100; And a cover part 1200 coupled to the carrier cover of the wafer carrier to separate the carrier cover. The cover unit 1200 includes a cover plate coupled to the wafer carrier cover to separate the carrier cover, and a wafer sensing device 100 disposed on the cover plate to sense a wafer inside the wafer carrier. . The wafer sensing device may include a body 110 including a first surface and a second surface opposite to the first surface, protruding from the first surface and disposed on the body 110, and having a sensor at one end thereof. A first sensor unit 120 including a first sensor groove is disposed, protrudes from the first surface and is spaced apart from the first sensor unit 120 on the body 110 and the sensor at one end A second sensor unit 130 including a second sensor groove disposed therein, a first load port binding unit 140 disposed at one end of the body 110 and coupling the cover plate and the body 110, and It is disposed on the other end of the body 110 and includes a second load port fastening portion 150 for coupling the cover plate and the body 110, the first sensor unit 120 and the second sensor unit 130 The distance between) is 125 to 145 mm.

The wafer sensing device 100 may be the one described above.

The wafer carrier load port 1000 may be integrally disposed in the semiconductor processing apparatus 2000, and may be separately disposed to move a wafer of the wafer carrier or the pull to the processing unit 2100 of the semiconductor processing apparatus 2000. Do this.

The wafer carrier port part 1100 may include a plate for supporting a wafer carrier for storing a wafer therein and a fixing part that is a member disposed on the plate and stably processes the wafer carrier. In addition, it may include a sensor for detecting the presence or absence of the wafer carrier.

The cover part 1200 serves to separate the carrier cover of the wafer carrier and to recombine the separated carrier cover. The cover portion 1200 may include a latch that may be coupled to a groove disposed on one surface of the carrier cover to detach the carrier cover from the wafer carrier.

The wafer carrier load port 1000 may include a wafer carrier connector that is a passage through which a wafer inside the wafer carrier moves, and the cover part 1200 may open and close the wafer carrier connector. When the wafer carrier is disposed above the wafer carrier port portion 1100, the cover portion 1200 is coupled to the carrier cover of the wafer carrier to separate the carrier cover, and moves together with the carrier cover under the wafer carrier connector. The wafer carrier connector can be opened. While the cover unit 1200 is moved downward, the wafer sensing device 100 disposed on the cover unit 1200 may detect the presence or absence of a wafer inside the wafer carrier by scanning a wafer inside the wafer carrier. When the semiconductor manufacturing process of the semiconductor processing apparatus 2000 is completed and the wafer returns to the inside of the wafer carrier, the cover portion 1200 may move upward to bond the carrier cover to the wafer carrier. While the cover unit 1200 is moved upward, the wafer sensing apparatus 100 disposed on the cover unit 1200 may scan the wafer inside the wafer carrier to detect the presence or absence of the wafer inside the wafer carrier. The detection information of the presence or absence of the wafer is transferred to the semiconductor processing apparatus 2000, and if the normal state, the subsequent work can be performed, and if the abnormal state, the subsequent work of the device may not proceed and an alarm may sound.

The wafer carrier load port 1000 may further include a first driver 1300 which moves the cover part 1200 up and down. The moving part may include a hydraulic or pneumatic actuator or a linear motor, and is not particularly limited.

In addition, the cover unit 1200 may further include a second driving unit for driving the wafer sensing device 100. The first driving part may control the position and movement of the cover part 1200 and the wafer sensing device 100 in a first direction, that is, an up and down direction, and the second driving part may detect the cover part 1200 and the wafer. It is possible to control the position and movement of the device 100 in the second direction, that is, in the horizontal direction.

The first driving unit and the second driving unit may interlock with each other to control the position and the movement in the first direction or the position and the movement in the second direction.

As described above, the wafer carrier load port 1000 according to the embodiment of the present invention prevents the atmosphere of the semiconductor fabrication fab from flowing into the apparatus while being in close contact with the wafer moving wafer carrier connector when not in operation. The sealed state of the device 2000 can be maintained.

When the wafer cassette or the unwinder is disposed in the wafer carrier port portion 1100 of the load port for the progress of the semiconductor process, the cover portion 1200 and the wafer sensing device 100 move in a second direction from the semiconductor processing apparatus 2000. That is, it may be driven to at least partially spaced in the horizontal direction. Next, the cover unit 1200 and the wafer sensing device 100 may be driven in a first direction, that is, in a direction perpendicular to the ground.

5 illustrates a carrier connector including an upper sensor portion and a lower sensor portion of a wafer loading sensing apparatus according to another embodiment of the present invention.

Referring to FIG. 5, the wafer slip-out sensor 1500 disposed on the same line as the upper and lower portions of the wafer carrier connector may determine whether a wafer located inside the wafer carrier or the pull is out of a designated position from the wafer carrier or the pull. It can be detected.

Undesired collision with the robot 2210 moving the wafer may occur when a wafer located inside the wafer carrier or the pull is out of a designated position. Alternatively, the wafer may be damaged while the wafer is protruded from the wafer carrier or the pull and the cover portion 1200 is switched from the open state to the closed state. In the wafer sensing apparatus 100 included in the wafer carrier load port 1000 according to the embodiment of the present invention, the width of the body 110 between the first sensor unit 120 and the second sensor unit 130 is the remainder. This problem can be prevented by forming a thinner than the width of the body 110.

8 and 9 illustrate a semiconductor processing apparatus 2000 according to an embodiment of the present invention.

8 and 9, a semiconductor processing apparatus 2000 according to an embodiment of the present invention may include a process unit 2100 that processes a wafer; And a wafer carrier load port 1000 for supplying the wafer to the process unit 2100. The wafer carrier load port 1000 may include a wafer carrier port part 1100 including a plate for supporting a wafer carrier for storing a wafer therein and a fixing part for fixing the wafer carrier; And a cover part 1200 coupled to the carrier cover of the wafer carrier to separate the carrier cover. The cover unit 1200 includes a cover plate coupled to the wafer carrier cover to separate the carrier cover, and a wafer sensing device 100 disposed on the cover plate to sense a wafer inside the wafer carrier. . The wafer sensing device may include a body 110 including a first surface and a second surface opposite to the first surface, protruding from the first surface and disposed on the body 110, and having a sensor at one end thereof. A first sensor unit 120 including a first sensor groove is disposed, protrudes from the first surface and is spaced apart from the first sensor unit 120 on the body 110 and the sensor at one end A second sensor unit 130 including a second sensor groove disposed therein, a first load port binding unit 140 disposed at one end of the body 110 and coupling the cover plate and the body 110, and It is disposed on the other end of the body 110 and includes a second load port fastening portion 150 for coupling the cover plate and the body 110, the first sensor unit 120 and the second sensor unit 130 The distance between) is 125 to 145 mm.

The wafer carrier load port 1000 and the wafer sensing device 100 may be the same as described above.

The semiconductor processing apparatus 2000 is a device for manufacturing a semiconductor using a wafer, and may be a CVD apparatus, a PVD apparatus, an etching apparatus, a CMP apparatus, or the like, and is not particularly limited. In the process unit 2100, the CVD process, PVD process, etching process, and CMP process may be performed.

The semiconductor processing apparatus 2000 may be disposed between the processing unit 2100 and the wafer carrier load port 1000 to move the wafer from the wafer carrier load port 1000 to the processing unit 2100. (EFEM) may be further included. The robot 2210 may be disposed in the transfer unit 2200 to transfer the wafer.

In general, the semiconductor process includes a wafer carrier load port 1000 that moves the wafer inside the wafer carrier or the pool into the process unit 2100 because the semiconductor process proceeds in an enclosed environment.

10: 200mm wafer
20: 300mm wafer
100: wafer detection device
110: body
120: first sensor unit
121: first sensor groove
122: first light receiving groove
123: first electric wire groove
130: second sensor unit
131: second sensor groove
132: second transmission light groove
133: second electric wire groove
140: first load port binding portion
141: first terminal groove
150: second load port binding portion
151: second terminal groove
1000: wafer carrier load port
1100: wafer carrier port
1200: cover part
1300: first driving unit
1400: second drive unit
1500: wafer slip out sensor
2000: semiconductor processing equipment
2100: process
2200: transfer unit
2210: robot

Claims (5)

A body including a first face and a second face opposite the first face;
A first sensor part protruding from the first surface, the first sensor part including a first sensor groove disposed on the body and having a transmitting part transmitting a light source at one end and a receiving part receiving a reflected light source;
A second sensor groove protruding from the first surface, spaced apart from the first sensor unit on the body, and having a transmitting unit transmitting a light source at one end and a receiving unit receiving a reflected light source at one end thereof; A second sensor unit;
A first load port binding portion disposed at one end of the body; And
And a second load port binding portion disposed at the other end of the body.
The distance between the first sensor unit and the second sensor unit is 125 to 145 mm,
The first sensor unit and the second sensor unit has a width of 15 to 25 mm, the wafer sensing device for 200 mm and 300 mm diameter wafer.
The method of claim 1,
The width of the body portion between the first sensor portion and the second sensor portion is thinner than the width of the remaining body portion wafer sensing apparatus.
The method of claim 1,
The first load port fastening part extends from one end of the body in a direction perpendicular to the direction in which the first sensor part protrudes, and includes a first terminal groove in which a terminal connected from a sensor disposed in the first sensor part is disposed. and,
The second load port binding part may include a second terminal groove extending from a second end of the body in a direction perpendicular to a direction in which the first sensor part protrudes, and having a terminal connected from a sensor disposed in the second sensor part. Wafer detection device.
A wafer carrier port part including a plate for supporting a wafer carrier for storing 200 mm and 300 mm diameter wafers therein and a fixing part for fixing the wafer carrier; And
And a cover part coupled to the carrier cover of the wafer carrier to separate the carrier cover.
The cover part,
A cover plate coupled to the wafer carrier cover to separate the carrier cover; and
A wafer sensing device disposed on the cover plate to sense a wafer inside the wafer carrier,
The wafer detection device,
A body including a first face and a second face opposite to the first face, a transmitter projecting from the first face and disposed on the body and transmitting a light source at one end and a receiver receiving the reflected light source Receiving a first sensor unit including a first sensor groove disposed, a transmitter for projecting from the first surface and spaced apart from the first sensor unit on the body and transmitting a light source at one end and the reflected light source A second sensor unit including a second sensor groove in which a receiving unit is disposed, a first load port binding unit disposed at one end of the body and coupling the cover plate and the body, and disposed at the other end of the cover; And a second load port binding portion for coupling the plate and the body, and a distance between the first sensor portion and the second sensor portion is 125 to 145 mm, and the first sensor portion and the second sensor portion. The wafer carrier load port according to the destination of the wafer 15 to 25 mm is, 200 mm and 300 mm diameter.
A process unit for processing a 200 mm and 300 mm diameter wafer; And
And a wafer carrier load port for supplying the wafer to the processing unit.
The wafer carrier load port is
A wafer carrier port part including a plate for supporting a wafer carrier for storing 200 mm and 300 mm diameter wafers therein and a fixing part for fixing the wafer carrier; And a cover part coupled to the carrier cover of the wafer carrier to separate the carrier cover.
The cover part,
A cover plate coupled to the wafer carrier cover to separate the carrier cover, and a wafer sensing device disposed on the cover plate to sense a wafer inside the wafer carrier,
The wafer detection device,
A first sensor comprising a body including a first face and a second face opposite the first face, a first sensor groove projecting from the first face and disposed on the body and having a sensor disposed at one end thereof. A second sensor part protruding from the first surface and spaced apart from the first sensor part on the body and having a second sensor groove disposed at one end thereof, the second sensor part being disposed at one end of the body and A first load port binding portion for coupling the cover plate and the body, and a second load port binding portion disposed at the other end of the body and for coupling the cover plate and the body, wherein the first sensor portion and the second The distance between the sensor portion is 125 to 145 mm, the width of the first sensor portion and the second sensor portion is 15 to 25 mm, the semiconductor processing apparatus for a 200 mm and 300 mm diameter wafer.

Images