JP2012146809A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, capable of detecting protrusion of a wafer at a ring boat and protrusion of a ring-like plate.SOLUTION: Protrusion detecting means, which detects protrusion of a substrate 12 and a substrate support part 70 respectively from a specified position of a substrate support body, includes a first protrusion detection sensor 92, a second protrusion detection sensor 94, a protrusion detection sensor supporting part which supports the first protrusion detection sensor 92 and the second protrusion detection sensor 94, and moving means which moves the protrusion detection sensor support part toward the placement position of the substrate 12 or the substrate support part 70. The second protrusion detection sensor 94 is positioned farther away from the substrate support part than the first protrusion detection sensor 92, being provided in front of the front side, in moving direction, of the protrusion detection sensor support part at the position where the first protrusion detection sensor 92 is provided.

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate such as a semiconductor device.

  As a substrate processing apparatus, it has a substrate holder (boat) that holds substrates (wafers) in multiple stages, and a substrate transfer machine that transfers substrates to the substrate holder, and holds a large number of substrates on the substrate holder. What processes a board | substrate with a processing furnace in the state which carried out is known.

  When carrying out substrate processing by the substrate processing apparatus, if the wafer mounted on the boat or hoop is in a state of jumping out of the boat or hoop, the substrate transfer machine is used for transporting the wafer in the semiconductor manufacturing apparatus. There is a possibility of colliding with wafer transfer parts attached to the wafer. In the case of a collision, there is a risk of the destruction or breakage of the collided part or wafer, and as a result, a large number of fine dusts are generated and adhere to the surrounding product wafer, resulting in damage that cannot be used as a product. In addition, when wafers mounted on the boat are popping out, there is a possibility that when the boat is put into the processing furnace in a process such as wafer film deposition, the wafers etc. jumping out to the furnace port part may contact or collide, Major damages such as breakage of equipment parts, wafers and boats occur.

  In order to prevent such damage from occurring in advance, wafer pop-out detection may be performed. Wafer pop-up detection refers to detecting whether or not a wafer mounted on a boat or hoop is in a state of jumping out of the boat or hoop.

  In Patent Document 1, as a substrate processing apparatus that can prevent damage to a boat or a wafer, the wafer held by the boat is brought to a normal position by detecting the peak value of the light amount by a photosensor provided in the substrate transfer machine. A substrate processing apparatus for detecting whether there is an abnormal position or not is disclosed. More specifically, the amount of light due to the substrate transfer machine moving from the lower end to the upper end of the boat while the optical axis by the photosensor provided on the substrate transfer machine is blocked by the wafer mounted on the boat. Based on this change, it is detected whether the wafer is in a normal position or an abnormal position.

JP 2005-142245 A

  Wafer pop-out detection can be performed in the same manner as the detection method disclosed in Patent Document 1. However, since the purpose of detecting the pop-out of the wafer is to detect the state in which the wafer has jumped out of the boat or the like, the photo sensor provided in the substrate transfer machine does not detect the pop-up of the wafer in a normal position. It moves from the lower end toward the upper end at a position away from the outer shape portion.

  However, when the shape of the boat on the substrate transfer machine side is larger than the outer shape of the wafer, for example, like the ring-shaped plate portion of the ring boat, the wafer is outside the outer shape of the wafer even though it does not jump out. There is a problem that the boat blocks the optical axis. In this case, it is conceivable to use the photo sensor at a position away from the boat so that the boat does not block the optical axis, but even if the wafer has popped out, it does not pop out so as to block the optical axis of the photo sensor. Cannot be detected.

  Further, for example, in a boat in which the ring-shaped plate can be removed, not only the wafer but also the ring-shaped plate may be shifted out of a normal position, so that each of the wafer and the ring-shaped plate is detected. Is required.

  An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of detecting the jumping of a wafer and the popping of a ring-shaped plate with a ring boat.

  In order to achieve the above object, a substrate processing apparatus according to the present invention includes a substrate support that supports a substrate and a substrate support that supports the substrate, and a substrate support of the substrate and the substrate support. Pop-out detecting means for detecting the pop-out from the predetermined position.

  Preferably, the substrate support body can mount a plurality of substrates or substrate support portions in one direction, and the pop-up detection means includes a first pop-up detection sensor, a second pop-up detection sensor, and the first A pop-up detection sensor support portion that supports the one pop-out detection sensor and the second pop-up detection sensor; and a moving means that moves the pop-up detection sensor support portion in the mounting direction of the substrate or the substrate support portion, The second pop-up detection sensor is farther from the substrate support than the first pop-out detection sensor, and is a front surface in the moving direction of the pop-up detection sensor support portion at a position where the first pop-up detection sensor is provided. It is provided at a more forward position.

  Preferably, the apparatus further includes storage means for previously storing the position of the substrate support portion in the mounting direction.

  Further, in the substrate processing method according to the present invention, the substrate and the substrate support part that supports the substrate are placed on the substrate support, and the substrate and the substrate support part protrude from the predetermined positions of the substrate support, respectively. Detect and perform substrate processing on the substrate placed on the substrate support.

  Preferably, a plurality of substrates or substrate support portions are placed in one direction on the substrate support, the first pop-up detection sensor is further away from the substrate support than the first pop-up detection sensor, and the first A pop-up detection sensor support portion that supports a second pop-up detection sensor provided at a position in front of the front surface in the movement direction of the pop-up detection sensor support portion at a position where the one pop-up detection sensor is provided is the substrate or When the substrate support part moves in the mounting direction to detect the substrate and the substrate support of the substrate support part, and the second protrusion detection sensor detects the substrate or the substrate support part. Stops the movement of the pop-up detection sensor support part, and both the first pop-up detection sensor and the second pop-up detection sensor both jump out of the substrate or the substrate support part. When detecting no teeth, to the substrate processing to the substrate placed on the substrate support.

  ADVANTAGE OF THE INVENTION According to this invention, the substrate processing apparatus and substrate processing method which can detect the jumping of a wafer and the popping of a ring-shaped plate with a ring boat can be provided.

1 is a perspective view showing an entire substrate processing apparatus according to an embodiment of the present invention. It is sectional drawing which shows the whole substrate processing apparatus which concerns on embodiment of this invention. It is a figure which shows the substrate holding body (ring boat) used for the substrate processing apparatus which concerns on embodiment of this invention, (a) is sectional drawing, (b) is a top view. In addition, (a) is the sectional view on the AA line of (b). It is sectional drawing which shows the processing furnace used for the substrate processing apparatus which concerns on embodiment of this invention, and its periphery. It is a side view of the substrate transfer machine used for the substrate processing apparatus concerning the embodiment of the present invention. It is a side view shown about a slide type | mold detection part, (a) is a side view in the case of mounting a board | substrate on a board | substrate holding body, (b) is a side view in the case of performing a detection. It is a figure which shows the electric mechanism of the detection mechanism which concerns on embodiment of this invention. The operation | movement of the wafer position reference | standard setting used for the substrate processing apparatus which concerns on embodiment of this invention is shown. The operation | movement of the ring position reference | standard setting used for the substrate processing apparatus which concerns on embodiment of this invention is shown. (A) which concerns on embodiment of this invention shows the side view of the ring boat in the state which mounted the wafer in the substrate holding body (ring boat) used for the substrate processing apparatus which concerns on embodiment of this invention, (b) ) Shows an example of setting the position reference range of the wafer and the ring-shaped plate. (A) which concerns on embodiment of this invention is a side view which shows the relationship of the installation position of a wafer protrusion detection sensor and a ring protrusion detection sensor, and the optical axis movement range of each sensor, (b) is the top view. . It is the top view which showed a mode that the arm contacted the protruded wafer. In the substrate holder (ring boat) according to the embodiment of the present invention, (a) is a side view showing a state in which the wafer is in a protruding state, and (b) is a state in which the ring-shaped plate is in a protruding state. FIG. It is a figure which shows an example of operation | movement of the detection mechanism which concerns on embodiment of this invention. It is a figure which shows an example of the data flow of the detection mechanism which concerns on embodiment of this invention. An example of the determination method by the detection result which concerns on embodiment of this invention is shown.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  1 and 2 show a substrate processing apparatus 10 according to an embodiment of the present invention. The substrate processing apparatus 10 is a vertical type that performs diffusion processing, CVD processing, and the like on a substrate. In the substrate processing apparatus 10, an input / output stage 18 for inserting a pod 14 containing a substrate 12 made of silicon or the like into the housing 16 from the outside is attached to the front surface of the housing 16. A cassette shelf 22 for storing the inserted pod 14 is provided in the housing 16. Further, an N2 purge chamber 24 is provided in the housing 16, and this N2 purge chamber 24 is a transfer area for the substrate 12, and serves as a loading / unloading space for the substrate holder (boat) 26. . The N 2 purge chamber 24 is filled with an inert gas such as N 2 gas when processing the substrate 12, thereby preventing a natural oxide film from being formed on the substrate 12.

  A FOUP is used as the pod 14 described above, and the substrate 12 is isolated and transported from the atmosphere by closing an opening provided on one side of the pod 14 with a lid (not shown). The substrate 12 can be put into and out of the pod 14 by removing the lid. For example, 25 substrates 12 are stored in the pod 14. A pod opener 28 is provided in front of the N2 purge chamber 24 in order to remove the lid of the pod 14 so that the atmosphere in the pod 14 communicates with the atmosphere in the N2 purge chamber 24. The conveyance of the pod 14 between the pod opener 28, the cassette shelf 22 and the loading / unloading stage 18 is performed by a cassette transfer machine 30. Air that has been cleaned by a clean unit (not shown) provided in the casing 16 is caused to flow in the transport space of the pod 14 by the cassette transfer machine 30.

  Inside the N2 purge chamber 24, a substrate holder 26 for loading a plurality of substrates 12 in multiple stages, a substrate alignment device 32 for adjusting the position of a notch (or orientation flat) of the substrate 12 to an arbitrary position, and a pod opener A substrate transfer device 34 is provided as a substrate transfer device for transferring the substrate 12 between the pod 14 on the 28 and the substrate alignment device 32. Further, a processing furnace 36 for processing the substrate 12 is provided in the upper part of the N2 purge chamber 24, and the substrate holder 26 is loaded into the processing furnace 36 by a boat elevator 38 which is an elevating means, or the processing furnace. Unloaded from 36. The furnace port of the processing furnace 36 is closed by the furnace port shutter 40 except when the substrate 12 is being processed.

Next, the operation of the substrate processing apparatus 10 according to the above embodiment will be described.
First, the pod 14 conveyed from the outside of the housing 16 by AGV, OHT, or the like is placed on the input / output stage 18. The pod 14 placed on the entry / exit stage 18 is directly transferred onto the pod opener 28 by the cassette transfer machine 30 or once stored on the cassette shelf 22 and then transferred onto the pod opener 28. The pod 14 transported onto the pod opener 28 is removed from the lid of the pod 14 by the pod opener 28, and the internal atmosphere of the pod 14 is communicated with the atmosphere of the N 2 purge chamber 24.

  Next, the substrate transfer machine 34 removes the substrate 12 from the pod 14 in communication with the atmosphere of the N 2 purge chamber 24. The extracted substrate 12 is aligned by a substrate alignment device 32 so that a notch or an orientation flat is determined at an arbitrary position, and is transferred to the substrate holder 26 after alignment.

When the transfer of the substrate 12 to the substrate holder 26 is completed, the furnace port shutter 40 of the processing furnace 36 is opened, and the substrate holder 26 loaded with the substrate 12 is loaded into the processing furnace 36 by the boat elevator 38.
After loading, predetermined processing is performed on the substrate 12 in the processing furnace 36, and after the processing, the substrate 12 and the pod 14 are discharged to the outside of the housing 16 in the reverse procedure described above.

  FIG. 3 shows a substrate holder (ring boat) 26 used in the substrate processing apparatus 10 according to the present embodiment. FIG. 3A is a longitudinal sectional view of the substrate holder 26, and FIG. 3B is a plan view of the substrate holder 26.

  The substrate holder 26 is supported by, for example, four columnar columns 50 that connect a disk-shaped top plate (not shown) and a disk-shaped bottom plate (not shown), and the columns 50. It has a plurality of substrate support portions, that is, for example, a ring-shaped plate (ring-shaped plate 70). As shown in FIG. 3A, a plurality of ring-shaped plates 70 are supported by four columns 50 and are mounted in the vertical direction. The ring-shaped plate 70 is provided with a plurality of claws 72 for placing the wafer 12 on the upper surface close to the support column 50. It is possible to place the substrate 12 on the claw 72. As shown in FIG. 3B, the four support columns 50 are arranged so that the substrate 12 can be placed on the substrate holder 26 by the substrate transfer machine 34.

  In FIG. 4, the peripheral configuration of the processing furnace 36 is shown. The processing furnace 36 includes an outer tube 42 made of a heat resistant material such as quartz (SiO 2). The outer tube 42 has a cylindrical shape with an upper end closed and an opening at the lower end. An inner tube 44 is disposed concentrically within the outer tube 42. A heater 46 as a heating means is concentrically arranged on the outer periphery of the outer tube 42. The heater 46 is held on the housing 16 via a heater base 48.

  As shown in FIGS. 4 and 5, the substrate transfer machine 34 includes a transfer machine body 54 that moves in the vertical direction and rotates, and a main tweezer body 56 that reciprocates on the transfer machine body 54. Have. For example, four tweezers 58a, 58b, 58c, and 58d are fixed to the main tweezer main body 56 so as to extend in parallel. A sub tweezer main body 57 is provided on the transfer machine main body 54 so as to reciprocate integrally with the main tweezer main body 56 and to reciprocate independently of the main tweezer main body 56. In this sub tweezer main body 57, a tweezer 58e is fixed in parallel at a position below the four tweezers 58a to 58d described above. For this reason, as shown in FIG. 5, the substrate transfer machine 34 can transfer five substrates 12 at a time using five tweezers 58a to 58e, and one sheet using the lowest tweezer 58e. It is also possible to transfer the monitor substrate (sheet transfer).

  For example, 25 substrates 12 are stored in the pod 14, and when the substrate 12 is transferred to the substrate holder 26 or recovered from the substrate holder 26 by the substrate transfer machine 34, five slots (slot groups) are stored. When there are no abnormal substrates, the five substrates 12a to 58e are used to collectively transfer or collect the five substrates 12, and when there are abnormal substrates in the slot group, the normal substrates Only the bottom tweezer 58e is recovered. Note that the monitor boards may be collected one by one as in the case of insertion.

  A detection unit 60 as a detection device is provided in the transfer machine main body 54. The detection unit 60 includes two parallel arms 62 a and 62 b, and the arms 62 a and 62 b are provided so as to be rotatable on the side surface of the transfer machine main body 54. Photosensors 64a, 64b, 64c, 64d, 64e, and 64f are provided on the arms 62a and 62b. More specifically, transmissive photosensors 64a, 64c, and 64e made of a light projecting element are provided near the tip of the arm 62a, and a transmissive photosensor made of a light receiving element is provided near the tip of the arm 62b. It is assumed that type photosensors 64b, 64d, and 64f are arranged. The arm 62a may be provided with a transmissive photosensor made of a light receiving element, and the arm 62b may be provided with a transmissive photosensor made of a light projecting element.

Here, the photosensors 64a and 64b are provided as the position detection sensor 90, the photosensors 64c and 64d are provided as the wafer pop-up detection sensor 92, and the photosensors 64e and 64f are provided as the ring pop-up detection sensor 94, respectively. The position detection sensor 90 is used to determine a wafer position reference and a ring position reference, which will be described later, and whether the mounted substrate 12 and the ring-shaped plate 70 are within a predetermined range in the vertical direction of the substrate holder 26. It is a sensor for confirming whether or not. Here, the wafer position reference is set for each stage of the substrate holder 26, and indicates the position of the wafer 12 in the vertical direction of the substrate holder 26 when the wafer 12 is normally mounted in the stage. Is. Similarly, the ring position reference is set for each stage of the substrate holder 26, and the ring-shaped plate 70 in the vertical direction of the substrate holder 26 when the ring-shaped plate 70 is normally mounted at the stage. Is shown.
The wafer pop-out detection sensor 92 is a sensor that detects a state in which the wafer 12 is popping out from the substrate holder 26. The ring pop-out detection sensor 94 is a sensor that detects a state in which the ring-shaped plate 70 is popping out from the substrate holder 26.

  When detecting the holding state of the substrate 12 transferred to the substrate holder 26, the arms 62a and 62b are rotated and fixed to the substrate holder 26 side, and the optical axes of the photosensors 64a and 64b pass through the substrate 12. Thus, the substrate transfer device 34 is moved from the lower end to the upper end of the substrate holder 26, and the detection outputs of the photosensors 64a, 64b, 64c, 64d, 64e, and 64f are monitored. On the other hand, when the substrate 12 is transferred to the substrate holder 26 by the substrate transfer machine 34, the arms 62a and 62b are rotated to the side opposite to the substrate holder, and the arms 62a and 62b interfere with the substrate 12 or the substrate holder 26. To prevent it.

  The configuration of the detection unit is not limited to the above configuration. FIG. 6 is a diagram showing a slide-type detection unit 61. Similarly to the detection unit 60, the slide-type detection unit 61 has two arms 62c and 62d, and photosensors 64a, 64b, 64c, 64d, 64e, and 64f are provided near the tips of the arms 62c and 62d. ing. FIG. 6A shows the orientation of the substrate transfer machine 34 when the substrate is placed on the substrate holder 26. On the other hand, FIG. 6B shows the orientation of the substrate transfer machine 34 when detecting the holding state of the substrate 12 transferred to the substrate holder 26. That is, when the holding state of the substrate 12 is detected, the substrate transfer machine 34 rotates and directs the arms 62c and 62d to the detection target. Further, when detecting the holding state of the substrate 12, the arms 62c and 62d provided on the side surface of the transfer machine main body 54 move in the lateral direction.

  As shown in FIG. 4, the analog signals output from the photosensors 64a, 64b, 64c, 64d, 64e, and 64f are output to the control unit 66 as a control device including a computer, for example. The control unit 66 includes a storage unit 67 as a storage device and a determination unit 69 as a determination device. In the determination unit 69, data detected by the detection unit 60 as a detection device and data stored in the storage unit 67 are determined. In comparison, the substrate transfer machine 34 is controlled via a drive unit 68 made of, for example, a motor.

FIG. 7 is a diagram illustrating the electrical mechanism of the detection mechanism according to the embodiment of the present invention in further detail.
The sensor used as the detection mechanism in the present embodiment is a transmissive photoelectric sensor, and the same sensor as shown in FIG. 4 is used. In addition, a mechanism for converting the value output into an amplifier output is provided. The detection mechanism includes an input / output device 80, a sequencer 84, amplifiers 86a, 86b and 86c, and photosensors 64a, 64b, 64c, 64d, 64e and 64f. The input / output device 80, the sequencer 84, and the amplifiers 86a, 86b, and 86c are connected to the photosensors 64a, 64b, 64c, 64d, 64e, and 64f via a network 85 such as a direct wiring connection LAN or WAN. Therefore, when detecting, the received light amount change obtained from the photosensors 64a, 64b, 64c, 64d, 64e, and 64f is replaced with the change in the voltage value by the amplifiers 86a, 86b, and 86c, respectively. Reportedly. The state of the wafer is determined based on the degree of the change in the numerical value and is transmitted to the input / output device 80 or the like. The input / output device 80 is provided integrally with the substrate processing apparatus 10 or connected via the network 85, and displays an operation screen. On the operation screen, an input screen for inputting predetermined data by the user, a display screen indicating the status of the apparatus, and the like are displayed. The input / output device 80 is provided with a control unit 66.

A method for setting the wafer position reference and the ring position reference using the position detection sensor 90 will be described.
The setting of the ring position reference for the wafer 12 and the ring-shaped plate 70 is performed by a two-point teaching method. Here, the two-point teaching method is one of methods for obtaining a reference position of each stage of the detected object (in this embodiment, the wafer 12 on the boat or the ring of the ring-shaped plate 70) and is based on actual measurement. Among the multiple detection objects, the detection object at the lowest position and the detection object at the uppermost position are detected, that is, the lowest value and the highest value are detected, and the difference value is equally divided between the stages. Use the value of the reference position.

  Here, in the analog data acquisition, the peak value of the detected waveform is not used on the basis of the ring position of each stage. This time, the thickness of any wafer is almost the same in the transmission type photoelectric sensor, and a peak appears when data is acquired with the wafer end face horizontal, but the thickness of the ring varies depending on the ring shape. This is because, in some cases, the light emitting unit is thicker than the sensor lens diameter of the photosensor, and the peak of the detection waveform does not always appear at the center of the ring.

In this embodiment, an analog method is used as the data acquisition method. However, when the data acquisition method is digital, there is no peak value, and therefore determination is performed at two points, OFF and ON.
Even if the data acquisition method is an analog method, the peak value is not used, and processing and determination of the peak portion may be omitted.

Next, the setting of the wafer position reference for obtaining the normal position range data as the first normal position range of the wafer will be described with reference to FIG.
In step S10, first, an allowable deviation value that can be regarded as a normal position range in setting the wafer position reference is set.
Next, as step S12, the wafers 12 having no abnormality same as those used in the future are placed on the uppermost and lowermost stages of the ring boat 26.
Next, as step S14, data of the ring-shaped plate 70 of the ring boat 26 and the wafer 12 are acquired by the above-described detection mechanism.
Next, as step S16, the acquired data is used as raw data, and then each peak position, OFF position, and ON position are extracted.
Next, as step S18, based on each peak position, OFF position, ON position, the ring position reference data of each stage stored (stored) in the storage unit 67 from the respective data and the input deviation allowable value. Then, position data outside the proper ring position range is extracted, and the theoretical wafer position of each stage is calculated by the two-point teaching method using the extracted position data.
Next, as step S20, the theoretical position of each stage of each peak position, OFF position, and ON position is stored (stored) in the storage unit 67 as a wafer position reference.

Next, the setting of the ring position reference for obtaining normal position range data as the second normal position range of the ring-shaped plate 70 will be described with reference to FIG.
In step S22, the number of stages of the ring boat 26 is input as an initial setting.
Next, as step S24, data of the ring-shaped plate 70 of the ring boat 26 is acquired in a state where no wafer is mounted by the above-described detection mechanism.
Next, in step S26, the acquired data is used as raw data, and then each peak position, OFF position, and ON position are extracted.
Next, as step S28, the theoretical position of each stage ring is calculated by the two-point teaching method at each peak position, OFF position, and ON position.
Next, as step S30, the theoretical position of each stage of the OFF position and the ON position is stored (stored) in the storage unit 67 as a ring position reference. Here, the peak value is not used.

Each position reference is set by setting the wafer position reference and the ring position reference.
FIG. 10A shows a side view of the ring boat 26 with the wafer 12 placed thereon, and FIG. 10B shows an example of setting the position reference range of the wafer 12 and the ring-shaped plate 70.
As shown in FIG. 10B, A1 indicates a one-stage ring boat allowable position range, A2 indicates a two-stage ring boat allowable position range, B1 indicates a single-stage wafer allowable position range, and B2 indicates a two-stage wafer allowable position range. Further, C1 and D1 indicate a one-stage abnormal position range, and C2 and D2 indicate a two-stage abnormal position range.
That is, the first stage ring-shaped plate 70 of the ring boat 26 is not within the allowable range of the first-stage ring boat where the first-stage ring plate 70 is A1, and the second-stage ring-boat 70 is not within the allowable range of the two-stage ring boat where the second-stage ring-shaped plate 70 is A2. The first wafer 12 is not in the 1st wafer allowable position range of B1, the 2nd wafer allowable position range of B2, and is in the 1st stage abnormal position range of C1 and D1, the 2nd stage abnormal position range of C2 and D2, etc. In this case, it is determined that the position of the wafer 12 or the ring boat 26 is abnormal.

  The determination unit 69 collates the wafer and ring position reference range stored in the storage unit 67 with the detected waveform of the detected wafer 12 and ring-shaped plate 70, and even one detected data is in an abnormal range. If it is in C, the transfer of the wafers 12 is stopped, or wafers other than the wafers determined to be in the abnormal range are transferred one by one.

  Next, detection of the protruding state of the wafer 12 and the ring-shaped plate 70 by the wafer protrusion detection sensor 92 and the ring protrusion detection sensor 94 will be described.

FIG. 11A is a side view showing the relationship between the installation positions of the wafer pop-up detection sensor 92 and the ring pop-up detection sensor 94 and the optical axis movement range of each sensor, and FIG. 11B is a plan view thereof. E, F, and G in the figure indicate the movement ranges of the optical axes of the position detection sensor 90, the wafer protrusion detection sensor 92, and the ring protrusion detection sensor 94, respectively. In FIGS. 11A and 11B, the wafer 12 and the ring-shaped plate 70 mounted on the substrate holder 26 are in a normal position, that is, in a state where they do not protrude.
Here, as shown in FIG. 11A, the positional relationship between the position detection sensor 90, the wafer protrusion detection sensor 92, and the ring protrusion detection sensor 94 provided on the arms 62a and 62b is as follows. Each sensor is provided in the order of the position detection sensor 90, the wafer pop-up detection sensor 92, and the ring pop-up detection sensor 94 from the tip of the arms 62a and 62b. Further, the wafer pop-up detection sensor 92 is located above the position detection sensor 90. The ring pop-up detection sensor 94 is provided at a position above the wafer pop-out detection sensor 92. FIG. 11A shows a configuration in which the arms 62a and 62b are detected by moving from the lower end to the upper end of the substrate holder 26. For example, the arms 62a and 62b are the upper ends of the substrate holder 26. When moving from the bottom to the bottom, the vertical positional relationship of each sensor is reversed. That is, the wafer pop-out detection sensor 92 is provided at a position below the position detection sensor 90, and the ring pop-out detection sensor 94 is provided at a position below the wafer pop-out detection sensor 92.

  FIG. 12 is a view showing a state in which the arms 62a and 62b come into contact with the protruding wafer 12. FIG. As shown in FIG. 12, depending on the degree of protrusion of the wafer 12, there is a possibility of contact with the arm moving from the lower end of the substrate holder 26. To solve this problem, it is conceivable to increase the distance between the arm 62a and the arm 62b to such an extent that contact with the protruding wafer 12 does not occur.

  However, in the detection mechanism according to the present embodiment, each sensor is provided in the positional relationship described above, so that the wafer 12 or the ring-shaped plate 70 protruding to the optical axis movement range of the ring protrusion detection sensor 94 is detected. When the ring pop-out detection sensor 94 detects the pop-out, the wafer pop-out detection sensor 92, the position detection sensor 90, and the arms 62a and 62b exist below the wafer 12 or the ring-shaped plate 70 that has popped out. Therefore, when the ring pop-out detection sensor 94 detects the pop-out, the control of stopping the movement of the substrate transfer machine is performed to stop the arms 62a and 62b from rising, thereby preventing contact.

Further, as shown in FIGS. 11A and 11B, the wafer pop-up detection sensor 92 is separated from the wafer 12 in which the optical axis movement range F of the wafer pop-up detection sensor 92 is in a normal position by a certain allowable width H1. It is provided so that it may become the position. Similarly, the ring pop-up detection sensor 94 is provided such that the optical axis movement range G of the ring pop-out detection sensor 94 is at a position away from the ring-shaped plate 70 at a normal position by a certain allowable width H2. . Therefore, the wafer jump-out detection sensor 92 and the ring pop-out detection sensor 94 can detect the wafer jump-out state and the ring-like plate 70 pop-out state, respectively. Further, in the detection of the protruding state of the wafer, it is possible to detect the protruding state even when the protruding state of the wafer 12 does not deviate from the outer shape of the ring-shaped plate 70.
Although the ring-shaped plate 70 at a normal position can be included in the optical axis movement range F of the wafer pop-up detection sensor, a method for detecting only the wafer pop-out will be described later.

  FIG. 13 is a side view showing the wafer 12 or the ring-shaped plate 70 in the protruding state. FIG. 13A shows a state in which the wafer 12 is in a protruding state, and FIG. 13B shows a state in which the ring-shaped plate 70 is in a protruding state. When the arms 62a and 62b move from the lower end to the upper end of the substrate holder 26, the wafer jump-out detection sensor is detected by the wafer 12 or the ring-shaped plate 70 that jumps to the optical axis movement range of the wafer pop-out detection sensor 92 or the ring pop-out detection sensor 94. 92 or the optical axis of the ring protrusion detection sensor 94 is blocked. By blocking the optical axis in this way, it is detected that the wafer 12 or the ring-shaped plate 70 is in a protruding state.

Here, although the optical axis of the wafer pop-up detection sensor 92 is blocked by the ring-shaped plate 70 that is not popped out, the position data of the wafer 12 or the ring-shaped plate 70 in the vertical direction of the substrate holder 26 is used. Thus, it is possible to detect only the protrusion of the wafer 12. The position data is stored in advance in the storage unit 67, for example. As a method for detecting only the protrusion of the wafer, for example, referring to the reference position of the protrusion of the wafer, only the interruption of the optical axis at the position where the wafer is mounted may be an effective protrusion detection result, or the ring With reference to the pop-out position reference, a process of invalidating the blocking at the position where the ring-shaped plate 70 is mounted among the detected blocking of the optical axis may be performed.
The wafer pop-out position reference is set for each stage of the substrate holder 26 and indicates the position of the substrate holder 26 in the vertical direction with respect to the jump of the wafer at that stage. The ring pop-out position reference is set for each step of the substrate holder 26, and indicates the vertical position of the substrate holder 26 with respect to the pop-out of the ring-shaped plate 70 at that step. . The wafer protrusion position reference and ring protrusion position reference can be set in the same manner as the wafer position reference and ring position reference described above.

  In addition, when the pop-out detection sensor 92 or the ring pop-out detection sensor 94 detects the pop-out, the vertical position of the substrate holder 26 where the pop-out has occurred can be grasped. As a method for realizing such a configuration, for example, it is recorded how long each ON / OFF signal of the sensor due to the optical axis being interrupted is generated from the start of detection, or the sensor is turned ON / OFF. The pop-out position can be grasped by using the position signal of the driving unit (signal indicating the position numerically, etc.) when the error occurs. In addition, by using the above-described wafer protrusion reference or ring protrusion position reference, it is possible to grasp at which stage of the substrate holder 26 the protrusion has occurred.

  FIG. 14 is a flow showing an example of the operation of the detection mechanism according to the present embodiment. As shown in FIG. 14, when pop-out detection is not performed (hereinafter referred to as pop-out detection invalid), when pop-out detection is performed and the position where the pop-out has occurred is acquired (hereinafter referred to as the pop-out position confirmation function), When the pop-up detection is performed and the substrate moving machine is stopped immediately after the pop-out is detected (hereinafter referred to as an immediate operation stop function at the time of pop-out confirmation), the operation is different for each.

  First, in step S100, it is determined whether or not to detect pop-out. If pop-out detection is performed, the process proceeds to step S102. If pop-out detection is not performed, the process proceeds to step S130.

  In step S102, when popping out is detected during the detection operation, it is determined whether to immediately stop the detection operation. When the detection operation is to be stopped immediately, the process proceeds to step S104, and the movement of the substrate transfer machine 34 is started. If the detection operation is not immediately stopped, the process proceeds to step S120.

Hereinafter, the flow after step S104, that is, the case of the immediate operation stop function at the time of pop-out confirmation will be described.
In step S106, the position detection sensor 90 detects the position of the wafer 12 or the ring-shaped plate 70, and acquires position data.

  In step S108, it is determined whether or not the protrusion of the wafer 12 or the ring-shaped plate 70 has been detected. If the protrusion is detected, the position data where the protrusion has occurred is acquired in step S110, and the substrate transfer machine is immediately acquired. The movement of 34 is stopped and the detection operation is stopped (step S112). If no jump has been detected, the process proceeds to step S114. Note that in the case of the immediate operation stop function at the time of pop-out confirmation, the pop-up position data is not acquired even if another pop-out occurs because the operation is stopped immediately when the pop-up is detected for the first time after starting the detection operation. .

  In step S <b> 114, the substrate transfer machine 34 moves to the detection end position, and it is determined whether or not the acquisition of position data has been completed for all the wafers 12 and the ring-shaped plates 70 mounted on the substrate holder 26. If it has moved to the detection end position, the process proceeds to step S112 to end the detection operation. If it has not moved to the detection end position, the process returns to step S106, and acquisition of position data is continued.

Next, the flow after step S120, that is, the case of the pop-out position confirmation function will be described.
In step S120, the movement of the substrate transfer machine 34 is started as in step S104.

  In step S122, as in step S106, the position detection sensor 90 detects the position of the wafer 12 or the ring-shaped plate 70, and acquires position data.

  In step S124, as in step S108, it is determined whether or not the protrusion of the wafer 12 or the ring-shaped plate 70 is detected. If pop-out is detected, the process proceeds to step S126. If pop-out is not detected, the process proceeds to step S128.

  In step S126, the position data where the pop-out has occurred is acquired.

  In step S128, as in step S114, it is determined whether the substrate transfer machine 34 has moved to the detection end position and acquisition of position data has been completed for all the wafers 12 and the ring-shaped plate 70 mounted on the substrate holder 26. To do. If it has moved to the detection end position, the process proceeds to step S112 to end the detection operation. If it has not moved to the detection end position, the process returns to step S122 and the acquisition of position data is continued.

Next, a flow after step S130, that is, a case where pop-out detection is invalid will be described.
In step S130, the movement of the substrate transfer machine 34 is started as in step S104.

  In step S132, as in step S106, the position detection sensor 90 detects the position of the wafer 12 or the ring-shaped plate 70, and acquires position data.

  In step S134, as in step S114, it is determined whether the substrate transfer machine 34 has moved to the detection end position and acquisition of position data for all the wafers 12 and the ring-shaped plate 70 mounted on the substrate holder 26 has been completed. To do. If it has moved to the detection end position, the process proceeds to step S112 to end the detection operation. If it has not moved to the detection end position, the process returns to step S132, and acquisition of position data is continued.

  FIG. 15 is a diagram illustrating an example of a data flow in the case of the above-described pop-out position confirmation function. As shown in FIG. 15, the detection mechanism of the present invention can use not only a ring boat but also a standard boat having no ring-shaped plate 70 as a substrate holder. An embodiment in which a standard boat is used will be described later.

  First, in step S200, it is determined whether or not the substrate holder is a ring boat. If it is a ring boat, the process proceeds to step S202, and if it is a standard boat, the process proceeds to step S220.

  In step S202, it is determined whether or not a ring position reference including normal position range data of the ring-shaped plate 70 is stored in the storage unit 67 as a storage device. If it is determined that the ring position reference is stored, the process proceeds to the next step S204. If it is determined that the ring position reference is not stored, the above-described ring position reference is set.

  In the next step S204, it is determined whether or not a wafer position reference including normal position range data of the wafer 12 is stored in the storage unit 67 as a storage device. If it is determined that the wafer position reference is stored, the process proceeds to the next step S206. If it is determined that the wafer position reference is not stored, the above-described wafer position reference is set.

  In step S206, it is determined whether or not the wafer pop-out position reference and the ring pop-out position reference are stored in the storage unit 67 as a storage device. If it is determined that the wafer position reference is stored, the process proceeds to step S208. If it is determined that the wafer position reference is not stored, the setting is performed in the same manner as the wafer position reference and ring position reference.

In step S208, detection for determining whether the wafer 12 and the ring-shaped plate 70 are in a normal position is started.
Specifically, first, after setting a deviation allowable value that can be regarded as a normal position range in the ring position reference and the wafer position reference, the wafer 12 is placed on the ring boat 26, and the substrate transfer device 34 and the photosensor 64a are placed. , 64b, 64c, 64d, 64e, 64f are started. That is, as shown in FIG. 5, the five wafers 12 are collectively transferred by the substrate transfer machine 34 by the five tweezers 58 a to 58 e. When all the wafers 12 are placed on the boat 26, as shown in FIG. 4, the arms 62a and 62b are pivotally fixed to the boat 26 side, and the substrate transfer device 34 is fixed from the lowest end of the boat 26. The speed is increased, and the transfer state of the wafer 12 and the state of the boat 26 are detected by the photosensors 64a, 64b, 64c, 64d, 64e, and 64f. The amount of light emitted / received by the photosensors 64a, 64b, 64c, 64d, 64e, and 64f is input to the control unit 66 as an analog signal.

  In the next step S210, analog signals input from the photosensors 64a, 64b, 64c, 64d, 64e, and 64f are converted into digital signals, and detection outputs from the photosensors 64a, 64b, 64c, 64d, 64e, and 64f are output. To obtain data. Specifically, the acquired data is used as raw data, and then each OFF position and ON position are extracted. Steps S212a, S212b, S212c, which are processes for determining whether the wafer position data and the ring position data extracted from the detection outputs of the photosensors 64a and 64b are within the normal position range. Passed to S212d. Further, the OFF position and the ON position of the pop-out position data extracted from the detection outputs by the photosensors 64c, 64d, 64e, and 64f are transferred to S212e that is a process for determining the pop-out position.

  The process of step S210 continues until the acquisition of position data for all the wafers 12 and the ring-shaped plate 70 mounted on the substrate holder 26 is completed, and when the acquisition of position data is completed, the subsequent steps S212a, The process proceeds to S212b, S212c, S212d, and S212e.

  In steps S212a, S212b, S212c, and S212d, the determination unit 69 as a determination device determines whether or not the position of the ring-shaped plate 70 is within the proper range, that is, the normal position range, and the wafer position is within the proper range. It is determined whether it is within the normal position range. Specifically, in steps S212a and S212c, based on the OFF position and ON position of the ring-shaped plate 70, the ring position reference data of each stage stored (stored), and the input allowable deviation value. A pass / fail judgment is made as to whether the ring position is in an appropriate position. In steps S212b and S212d, the wafer position is determined appropriately based on the OFF position and the ON position of the wafer 12, the wafer position reference data of each stage stored (stored), and the input allowable deviation value. A pass / fail judgment is made as to whether or not it is in the position.

  On the other hand, in step S212e, a determination unit 69 as a determination device determines a position where the protrusion has occurred based on the wafer protrusion position reference and the ring protrusion position reference.

  In the next step S214, comprehensive determination to be described later is performed based on the determination results in steps S212a, S212b, S212c, S212d, and S212e.

Next, in the case of a standard boat, that is, the data flow after step S220 will be described.
In step S220, as in step S204, it is determined whether or not the wafer position reference is stored in the storage unit 67. If it is determined that the wafer position reference is stored, the process proceeds to the next step S222. If it is determined that the wafer position reference is not stored, the above-described wafer position reference is set.

  In step S222, as in step S206, it is determined whether or not the storage unit 67 stores the wafer protrusion position reference and the ring protrusion position reference. If it is determined that the wafer position reference is stored, the process proceeds to step S224. If it is determined that the wafer position reference is not stored, the setting is performed in the same manner as the wafer position reference and ring position reference.

  In step S224, detection for determining whether or not the wafer 12 is in a normal position is started.

  In the next step S226, processing similar to that in step S210 is performed. However, it differs from step S210 in that the OFF position and the ON position of the ring position data are not acquired.

  In the next steps S228a, S228b, and S228c, processing similar to that in steps S212a, S212b, and S212e described above is performed. However, step S228c is different from step S212e in that there is no processing for popping of the ring-shaped plate 70.

  In the next step S230, comprehensive determination is performed based on the determination results in steps S228a, S228b, and S228c.

Next, comprehensive determination will be described. FIG. 16 is an example of comprehensive determination in step S214.
The ring boat position determination is determined based on the determination results in steps S212c and S212d. When all the ring-shaped plates 70 are in the normal position range, “normal”, and when there is a ring-shaped plate 70 not in the normal position range. If there is no “abnormal” and no ring-shaped plate 70, “no” is determined.
The wafer position is determined based on the determination results in steps S212a and S212b. When all the wafers 12 are in the normal position range, “normal” is indicated, and when there is a wafer 12 not in the normal position range, “abnormal” is indicated. When there is no 12, there is determined as “none”.
The pop-out determination is determined based on the determination result in step S212e. When the pop-out is detected, “jump out” is determined. When the pop-out is not detected, “no” is determined.
In the example shown in FIG. 16, both the ring boat position determination and the wafer position determination are “normal”, and when the pop-out determination is “none”, the overall determination is normal.
When the ring boat position determination is “normal” or “none” and the wafer position determination and the pop-out determination are both “none”, the comprehensive determination indicates that the wafer 12 does not exist. It is determined as “No”. In other cases, it is determined as “abnormal” as a comprehensive determination.
Note that if it is determined as “none” in the ring boat position determination, the overall determination may be “abnormal” regardless of the results of the wafer position determination and the pop-out determination.

  Also in the comprehensive determination in step S230, the same determination as the determination shown in FIG. 16 is performed. However, it differs from the comprehensive determination in step S214 in that the ring boat position determination is not performed.

The above is the description of the data flow in the case of the pop-out position confirmation function. The data flow in the case of the pop-up confirmation immediate operation stop function is the same as the data flow in the case of the pop-out position confirmation function shown in FIG. 15, but differs in the following points. In the case of the immediate operation stop function at the time of pop-out confirmation, since the operation is stopped immediately when the pop-out is detected, the ring position reference setting, wafer position reference setting, pop-out position reference setting, Alternatively, when popping out is detected during the process of step S208, the detection operation is stopped and the subsequent data processing is stopped.
Further, the data flow in the case of pop-out detection invalid differs from the data flow in the case of the pop-out position confirmation function in that there is no processing regarding pop-out detection. Specifically, in the data flow in the case where pop-out detection is invalid, steps S206, S212e, S222, and S228c in the data flow shown in FIG. 15 are not provided.

  In the case of the pop-out position confirmation function, the function for stopping the immediate operation at the time of pop-out confirmation, and each program for realizing the data flow when the pop-out detection is invalid is stored in the control unit 66, and processing is performed based on any program. It may be possible to select either.

Next, a modification of this embodiment will be described. In the modification, a standard boat is used as the substrate holder. Here, the standard boat refers to a substrate holder that does not have the ring-shaped plate 70. Therefore, when the substrate is normally placed on the standard boat, the outer shape of the boat on the substrate transfer machine side exists inside the substrate.
In the jump-out detection when the standard boat is used, the wafer jump-out detection sensor 92 and the ring pop-out detection sensor 94 detect the jump-out of the wafer 12, respectively. Detection can be performed.

  Further, in the case of the function for stopping the immediate operation when confirming the pop-out, the detection operation may be stopped immediately when the pop-out detection sensor 92 detects the pop-out.

  The greater the protrusion of the wafer 12, the higher the risk of contact between the protruded wafer 12 and the arms 62a and 62b. Therefore, when the pop-out detection sensor 94 detects pop-out, the detection operation is immediately stopped, and when pop-out is detected only by the wafer pop-out detection sensor 92, the pop-up position is confirmed without immediately stopping the detection operation. You may set as follows.

  In the above modification, the case where the jumping out of the wafer mounted on the standard boat is detected has been described. However, the same processing can be performed by detecting the jumping out of the wafer mounted on the pod 14.

10 substrate processing apparatus 12 substrate (wafer)
26 Substrate holder (boat)
34 substrate transfer machine 36 processing furnace 50 support 60 detection unit 66 control unit 67 storage unit 68 drive unit 70 substrate support unit (ring-shaped plate)
90 Position detection sensor 92 Wafer popping detection sensor 94 Ring popping detection sensor

Claims (5)

A substrate support that supports the substrate and a substrate support unit that supports the substrate in a mountable manner; and
A substrate processing apparatus, comprising: a substrate and a pop-up detecting means for detecting the pop-up of the substrate support portion from a predetermined position of the substrate support. The substrate support can be mounted with a plurality of substrates or substrate support portions in one direction,
The pop-out detection means is
A first pop-up detection sensor;
A second pop-up detection sensor;
A pop-out detection sensor support portion for supporting the first pop-out detection sensor and the second pop-out detection sensor;
Moving means for moving the pop-up detection sensor support portion in the mounting direction of the substrate or the substrate support portion,
The second pop-up detection sensor is farther from the substrate support than the first pop-out detection sensor, and is a front surface in the moving direction of the pop-up detection sensor support portion at a position where the first pop-up detection sensor is provided. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is provided at a more forward position. The substrate processing apparatus according to claim 1, further comprising a storage unit that stores in advance a position of the substrate support unit in the mounting direction. The substrate and the substrate support part that supports the substrate are placed on the substrate support,
Detecting jumping out from a predetermined position of the substrate support of the substrate and the substrate support part,
A substrate processing method for executing substrate processing on the substrate placed on the substrate support. A plurality of substrates or substrate support portions are placed in one direction on the substrate support,
From the front surface of the first pop-up detection sensor and the moving direction of the pop-up detection sensor support portion at a position where the first pop-up detection sensor is provided at a position farther from the substrate support than the first pop-up detection sensor. The substrate and the substrate support body of the substrate support portion are moved by moving a protrusion detection sensor support portion supporting a second protrusion detection sensor provided at a front position in the mounting direction of the substrate or the substrate support portion. Each of the popping out of
When the second pop-up detection sensor detects the pop-up of the substrate or the substrate support, the movement of the pop-up detection sensor support is stopped,
When neither the first pop-up detection sensor nor the second pop-out detection sensor detects the pop-out of the substrate or the substrate support portion, the substrate processing is executed on the substrate placed on the substrate support. The substrate processing method according to claim 4.

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