JP6422317B2 - Small manufacturing equipment - Google Patents

Description

  The present invention particularly relates to a small-sized manufacturing apparatus such as a semiconductor manufacturing apparatus for manufacturing a small-diameter semiconductor wafer having a diameter of 20 mm or less.

  Conventionally, in the semiconductor manufacturing technology, the chip manufacturing unit cost has been reduced by increasing the diameter of the wafer. For this reason, the semiconductor manufacturing equipment used in a series of manufacturing processes has become larger and more expensive, and the scale of the manufacturing factory and the construction and operation costs have been enlarged. Such a large-scale manufacturing system contributes to a reduction in the unit cost of chip production in small-quantity mass production, but it is difficult to meet the demand for small-quantity, high-variety production, making it difficult to adjust the production volume according to market conditions, Make it difficult for companies to enter.

  In order to solve these problems, a small semiconductor manufacturing apparatus that can manufacture a semiconductor chip at low cost using a semiconductor wafer having a small diameter (for example, a diameter of 20 mm or less) is desired. When building a production line using such a small semiconductor manufacturing apparatus, a plurality of semiconductor manufacturing apparatuses are arranged in a straight line on the floor, and in a series of manufacturing processes for semiconductor wafers, A semiconductor wafer is transferred between semiconductor manufacturing apparatuses in a state of being accommodated in a wafer transfer container (for example, see Patent Documents 1 and 2).

  In such a production line composed of a plurality of semiconductor manufacturing apparatuses, in order to efficiently advance a series of manufacturing processes for semiconductor wafers, it is necessary to automatically transfer a wafer transfer container between the plurality of semiconductor manufacturing apparatuses. .

JP 2014-110358 A JP 2014-110359 A

  However, when the floor surface on which the semiconductor manufacturing apparatus is installed is wavy, a slight positional deviation occurs in the three directions (X direction, Y direction, Z direction) between the semiconductor manufacturing apparatuses, and the wafer transfer container is automatically There is a risk that the transfer cannot be performed smoothly. The X direction is the width direction (left-right direction) of the housing of the semiconductor manufacturing apparatus, the Y direction is the depth direction (front-back direction) of the housing of the semiconductor manufacturing apparatus, and the Z direction is the height direction of the housing of the semiconductor manufacturing apparatus ( (Vertical direction).

  In view of such circumstances, the present invention enables automatic transfer of wafer transfer containers between these semiconductor manufacturing apparatuses even if there is a positional shift between these semiconductor manufacturing apparatuses in a production line composed of a plurality of semiconductor manufacturing apparatuses. It aims at providing the technique which can be performed smoothly.

In order to achieve such an object, according to the invention described in claim 1, the processing chamber and the front chamber of the apparatus are disposed inside the casing, and a concave portion is formed in the casing, and the processing substrate is accommodated in the concave portion. When the processing substrate is processed, the processing substrate is transferred from the container mounting table to the processing chamber through the front chamber of the apparatus. A small manufacturing apparatus that is transported and processed in the processing chamber, and then returned from the processing chamber to the container mounting table through the front chamber of the apparatus, and is carried out in the recess. Temporary holding trays that are temporarily held, and container transfer means for transferring the substrate transfer container between the temporary setting tray and the container mounting table are provided, and the container transfer means includes a plurality of the small manufacturing apparatuses. When juxtaposed, any small manufacturing equipment The substrate transport container can be transported between the container mounting table and the temporary storage tray of the small manufacturing apparatus adjacent to the small manufacturing apparatus, and the temporary transport container is placed by the container transport means. A small-sized manufacturing apparatus incorporating a positioning mechanism for positioning the substrate transport container at a reference position on the temporary storage tray when placed on the tray is provided.

  According to a second aspect of the present invention, in addition to the configuration according to the first aspect, the positioning mechanism is configured such that the substrate transport container is a reference on the temporary placement tray in the X direction that is the width direction of the housing. An X-direction stop switch for detecting whether or not the substrate transport container is positioned at a position, and when it is detected by the X-direction stop switch that the substrate transport container is positioned at a reference position on the temporary storage tray in the X direction. A transmitter for transmitting a signal of the above, a receiver for receiving a signal indicating that the substrate transport container is positioned at a reference position on the temporary storage tray in the X direction, and the container based on the signal from the receiver An X-direction positioning mechanism including a stop control device for stopping the transfer operation of the substrate transfer container by the transfer means is included.

  According to a third aspect of the present invention, in addition to the configuration according to the first or second aspect, the container transport means includes a transport arm that is movably attached to the housing in the X direction, and the transport arm. An arm driving device that drives the arm in the X direction; and a container gripping member that is movably attached to the transport arm in the X direction and that detachably grips the substrate transport container.

  In addition to the configuration according to claim 3, the invention according to claim 4 is configured such that the container gripping member moves in the X direction in conjunction with movement of the transfer arm in the X direction. A speed increasing mechanism is provided between the transfer arm and the container gripping member to increase the movement of the transport arm in the X direction and transmit the movement to the container gripping member.

  According to a fifth aspect of the present invention, in addition to the configuration according to any one of the first to fourth aspects, the container transport means is supported by the casing so as to be movable up and down via a constant load spring. It is characterized by.

  According to a sixth aspect of the present invention, in addition to the configuration according to any of the first to fifth aspects, the positioning mechanism is centered on a reference position on the housing in the Y direction that is the depth direction of the housing. A tray swinging means for elastically swinging the temporary placing tray in the Y direction, and when the substrate carrying container is placed on the temporary placing tray by the container carrying means, the temporary placing tray is moved in the Y direction. A Y-direction positioning mechanism including a guide member that guides and positions the substrate transport container at a reference position on the temporary storage tray is included.

  According to a seventh aspect of the present invention, in addition to the configuration according to any one of the first to sixth aspects, the positioning mechanism is configured such that the substrate transport container is in the Z direction, which is the height direction of the housing. A Z-direction stop switch that detects whether or not the reference position on the temporary placement tray is positioned, and the Z-direction stop switch detects that the substrate transport container has been positioned at the reference position on the temporary placement tray in the Z direction. A transmitter that transmits a signal to that effect, a receiver that receives a signal that the substrate transport container is positioned at a reference position on the temporary storage tray in the Z direction, and a A Z-direction positioning mechanism including a stop control device for stopping the transfer operation of the substrate transfer container by the container transfer means based on the signal is included.

  According to the present invention, each small manufacturing apparatus includes a container transport unit and a temporary storage tray, and further includes a positioning mechanism for absorbing misalignment that may occur between the plurality of small manufacturing apparatuses. In the production line comprising the small manufacturing apparatuses, even if there is a positional shift between these small manufacturing apparatuses, it is possible to smoothly carry out automatic transfer of the wafer transfer container between these small manufacturing apparatuses.

It is a figure which shows the production line which concerns on Embodiment 1 of this invention, Comprising: (a) is the front view, (b) is the left view. It is detail drawing which shows the container conveyance means which concerns on the same Embodiment 1, Comprising: (a) is the left view, (b) is the front view. It is a figure which shows the X direction positioning mechanism which concerns on the same Embodiment 1, Comprising: (a) is a top view which shows the state by which the wafer conveyance apparatus container was mounted in the temporary placement tray by the container conveyance means adjacent to the right side, (B) is a top view which shows the state by which the wafer conveyance equipment container was mounted in the temporary placement tray by the container conveyance means installed in the semiconductor manufacturing apparatus united with this temporary placement tray. 2A and 2B are diagrams illustrating a Y-direction positioning mechanism according to the first embodiment, in which FIG. 1A is a side view illustrating a state immediately before the wafer transfer container is placed on a temporary storage tray, and FIG. It is a side view which shows the state immediately after mounting in a placing tray. It is a side view which shows the Z direction positioning mechanism which concerns on the same Embodiment 1. FIG. It is a figure which shows the conveyance process of the wafer conveyance container by the container conveyance means of the production line which concerns on the same Embodiment 1. FIG.

  Embodiments of the present invention will be described below.

Embodiment 1 of the Invention
1 to 6 show a first embodiment of the present invention.

  As shown in FIG. 1, the production line 1 according to the first embodiment has three small semiconductor manufacturing apparatuses (small manufacturing apparatuses) 2 arranged in parallel on the floor 16 in this first embodiment. Configured. These three semiconductor manufacturing apparatuses 2 (the right semiconductor manufacturing apparatus 2A, the central semiconductor manufacturing apparatus 2B, and the left semiconductor manufacturing apparatus 2C) face each other with a predetermined gap (for example, 6 mm) therebetween. Yes.

  As shown in FIG. 1, each semiconductor manufacturing apparatus 2 includes a substantially rectangular parallelepiped casing 3 having a predetermined size (for example, a width of 30 cm, a depth of 45 cm, and a height of 144 cm). A processing chamber 5 and an apparatus front chamber 6 are disposed inside.

  Further, as shown in FIG. 1, a recess 7 is formed in the front part of the housing 3 above the apparatus front chamber 6. The recess 7 is open on the front side and the side, and is recessed from the front toward the depth. The recess 7 is provided with a container mounting table 9 for mounting a wafer transfer container (substrate transfer container) 10 in which a semiconductor wafer having a small diameter (for example, a diameter of 20 mm or less) is contained in a sealed state. A temporary storage tray 8 for temporarily holding the wafer transfer container 10 is installed. Here, as shown in FIG. 1A, the temporary placement tray 8 is configured such that when a plurality of semiconductor manufacturing apparatuses 2 are arranged side by side, a container mounting table 9 of an arbitrary semiconductor manufacturing apparatus 2 and a semiconductor manufacturing apparatus adjacent thereto. It is provided so that it may be located between the container mounting base 9 of the apparatus 2. In each semiconductor manufacturing apparatus 2, the positional relationship (the width direction, the depth direction, and the height direction of the housing) between the container mounting table 9 and the temporary placement tray 8 is accurately determined.

  When a plurality of semiconductor manufacturing apparatuses 2 are arranged side by side, the container transport path 14 extending in the direction in which the plurality of semiconductor manufacturing apparatuses 2 are arranged side by side (the left-right direction in FIG. 1A) is a concave portion of the plurality of semiconductor manufacturing apparatuses 2. 7 is formed so as to penetrate through 7.

  Further, as shown in FIG. 2, the case 3 is provided with a container transfer means 12 for transferring the wafer transfer container 10 between the three semiconductor manufacturing apparatuses 2 by a Z-axis motor 18. . As shown in FIGS. 6A and 6B, the container transfer means 12 can reciprocate the wafer transfer container 10 between the temporary tray 8 and the container mounting table 9 of the semiconductor manufacturing apparatus 2. As shown in FIGS. 6B and 6C, the wafer transfer container 10 is reciprocally transferred between the container mounting table 9 of the semiconductor manufacturing apparatus 2 and the temporary storage tray 8 of the adjacent semiconductor manufacturing apparatus 2. It is configured to be able to.

  That is, as shown in FIG. 2, the container transport means 12 includes a rack 20 that is horizontally fixed to the housing 3, a pinion 21 that meshes with the rack 20, and the pinion 21 in the X direction (left and right direction in FIG. 2). The X-axis motor (arm drive device) 22 is moved to the X axis, the transfer arm 27 is moved in the X direction synchronously with the pinion 21 by the X-axis motor 22, and is rotated to one end (the right end in FIG. 2) of the transfer arm 27 And a driven pulley 24 that is rotatably attached to the other end (left end in FIG. 2) of the transfer arm 27, and a driven pulley 23 and a driven pulley. The belt 25 spans the side pulley 24 and a container gripping member 26 that is fixed to a part of the belt 25 and sucks and grips the upper portion of the wafer transfer container 10. . Then, by rotating the X-axis motor 22, the pinion 21 rolls in the X direction (left and right direction in FIG. 2) while meshing with the rack 20, and the conveyance arm 27 moves in the X direction in conjunction with the rotation. Since the pulley 23 rolls and the belt 25 rotates, the container gripping member 26 is configured to move in the X direction. Therefore, a speed increasing mechanism is provided between the transfer arm 27 and the container gripping member 26 to increase the movement of the transfer arm 27 in the X direction and transmit it to the container gripping member 26. When moved 25 cm in the X direction, the container gripping member 26 moves 30 cm in the X direction.

  When the container transporting unit 12 is not in use, as shown in FIG. 1, the container conveying unit 12 is also left and right from the rectangular parallelepiped LN of the housing 3 of the semiconductor manufacturing apparatus 2 (to the right in FIG. 1B). It is accommodated in the recess 7 so as not to protrude in the direction (FIG. 1 (a) left-right direction). Further, the container transfer means 12 is in the shape of a rectangular parallelepiped of the semiconductor manufacturing apparatus 2 and the casing 3 of the adjacent semiconductor manufacturing apparatus 2 as shown in FIG. 1 when used (when transferring the wafer transfer container 10). It does not protrude forward from the outline LN (to the right in FIG. 1B).

  The container transfer means 12 incorporates a positioning mechanism 4 for absorbing a slight misalignment that may occur between the three semiconductor manufacturing apparatuses 2 when the production line 1 is constructed. The positioning mechanism 4 includes an X-direction positioning mechanism 4X (see FIG. 3), a Y-direction positioning mechanism 4Y (see FIG. 4), and a Z-direction positioning mechanism 4Z (see FIG. 5).

  As shown in FIG. 3, the X-direction positioning mechanism 4X detects whether or not the wafer transfer container 10 is positioned at a reference position on the temporary tray 8 in the X direction (left and right direction in FIG. 3). And a transmitter (not shown) that transmits a signal to that effect when it is detected by the X direction stop switch 30 that the wafer transfer container 10 has been positioned at the reference position on the temporary storage tray 8 in the X direction. A receiver (not shown) that receives a signal indicating that the wafer transfer container 10 has been positioned at the reference position on the temporary storage tray 8 in the X direction, and the container transfer means 12 based on the signal from the receiver. A stop control device (not shown) for stopping the transfer operation of the wafer transfer container 10 is configured. Here, as shown in FIG. 3B, when the container gripping member 26 of the semiconductor manufacturing apparatus 2 moves from the left side of FIG. 3, the X direction stop switch 30 is centered on the rotation axis CT1. As shown in FIG. 3A, the container gripping of the semiconductor manufacturing apparatus 2 adjacent to the semiconductor manufacturing apparatus 2 is provided. When the member 26 has moved from the right side of FIG. 3, the above-described positioning detection function is exhibited.

  Further, as shown in FIG. 4, the Y-direction positioning mechanism 4Y is configured to move the temporary tray 8 elastically in the Y direction around the reference position on the housing 3 in the Y direction (left and right direction in FIG. 4). When the wafer transfer container 10 is placed on the temporary placement tray 8 by the pair of coil springs (tray swinging means) 40 and the container transfer means 12, the temporary transfer tray 8 is guided in the Y direction to guide the wafer transfer container 10. Is constituted by a pair of front and rear guide members 41 that are positioned at a reference position on the temporary tray 8.

  Further, as shown in FIG. 5, the Z-direction positioning mechanism 4 </ b> Z includes a Z-direction stop switch 50 that detects whether or not the Z-direction positioning switch 4 is positioned at the reference position on the temporary storage tray 8 in the Z direction, and the Z-direction stop switch 50. When it is detected that the wafer transfer container 10 is positioned at the reference position on the temporary storage tray 8 in the Z direction, a transmitter (not shown) that transmits a signal to that effect, and the wafer transfer container 10 in the Z direction A receiver (not shown) that receives a signal indicating that it has been positioned at the reference position on the temporary storage tray 8, and the transfer operation of the wafer transfer container 10 by the container transfer means 12 is stopped based on the signal from the receiver. And a stop control device (not shown).

  Each housing 3 of each semiconductor manufacturing apparatus 2 has a flat bottom plate 11 as shown in FIG. 1, and the housing 3 is positioned at a predetermined position on the floor 16 on the bottom plate 11. Positioning means 13 is provided.

  Since the production line 1 has the above-described configuration, when a series of manufacturing processes are performed on a semiconductor wafer in the production line 1, for example, as described below, the semiconductor manufacturing apparatus 2A on the right side is manufactured from the semiconductor manufacturing apparatus on the right side. A series of wafer transfer containers 10 are transferred to the semiconductor manufacturing apparatus 2C on the left side through the apparatus 2B, and a series of semiconductor wafers accommodated in the wafer transfer container 10 in each of the semiconductor manufacturing apparatuses 2A, 2B, and 2C. Apply the manufacturing process.

  First, in the first processing step, in the semiconductor manufacturing apparatus 2A on the right side, a semiconductor wafer is carried from the container mounting table 9 and transferred to the processing chamber 5 through the front chamber 6 of the apparatus, and predetermined processing is performed in the processing chamber 5. After that, it is returned from the processing chamber 5 to the container mounting table 9 through the front chamber 6 and carried out.

  Next, the process proceeds to the first transfer step, where the container transfer means 12 of the right semiconductor manufacturing apparatus 2A and the container transfer means 12 of the central semiconductor manufacturing apparatus 2B cooperate with each other, and the container of the right semiconductor manufacturing apparatus 2A. After being temporarily placed on the temporary placement tray 8 of the central semiconductor manufacturing apparatus 2B from the mounting table 9, the wafer is transferred from the temporary placement tray 8 of the central semiconductor manufacturing apparatus 2B to the container mounting base 9 of the central semiconductor manufacturing apparatus 2B. The transport container 10 is transported and placed.

  That is, first, in the semiconductor manufacturing apparatus 2A on the right side, as shown in FIG. 6B, the wafer transfer container 10 is mounted on the container mounting table 9, and the container transfer means is disposed above the container mounting table 9. In a state where the 12 container gripping members 26 are positioned, the Z-axis motor 18 is rotationally driven to lower the container transporting means 12, and the wafer gripping container 10 is sucked and gripped by the container gripping member 26, and then the Z-axis The motor 18 is driven to raise the container conveying means 12. Next, as shown in FIG. 6C, the X-axis motor 22 is rotationally driven to position the container gripping member 26 above the temporary storage tray 8 of the central semiconductor manufacturing apparatus 2B. Thereafter, the Z-axis motor 18 is rotationally driven to lower the container transfer means 12, release the suction state of the wafer transfer container 10 by the container gripping member 26, and transfer the wafer to the temporary placement tray 8 of the central semiconductor manufacturing apparatus 2B. The container 10 is placed. Next, the Z-axis motor 18 is driven to raise the container conveying means 12, and the X-axis motor 22 is rotationally driven to return the container gripping member 26 to the right semiconductor manufacturing apparatus 2A.

  Thereafter, in the central semiconductor manufacturing apparatus 2B, as shown in FIG. 6D, the X-axis motor 22 is rotationally driven to position the container gripping member 26 above the temporary tray 8. Next, the Z-axis motor 18 is rotationally driven to lower the container transfer means 12, and the wafer holding container 10 is sucked and held by the container holding member 26, and then the Z-axis motor 18 is driven to move the container transfer means 12. Raise. Next, as shown in FIG. 6 (e), the X-axis motor 22 is rotationally driven to position the container gripping member 26 above the container mounting table 9. Thereafter, the Z-axis motor 18 is rotationally driven to lower the container transfer means 12, release the suction state of the wafer transfer container 10 by the container gripping member 26, and place the wafer transfer container 10 on the container mounting table 9.

  At this time, since the X direction positioning mechanism 4X is incorporated in the central semiconductor manufacturing apparatus 2B, the wafer transfer container 10 is accurately positioned in the X direction. That is, when the container gripping member 26 of the right semiconductor manufacturing apparatus 2A is positioned above the temporary storage tray 8 of the central semiconductor manufacturing apparatus 2B (see FIG. 6C), as shown in FIG. When the X direction stop switch 30 of the X direction positioning mechanism 4X of the central semiconductor manufacturing apparatus 2B detects the positioning of the wafer transfer container 10, the transmitter of the X direction positioning mechanism 4X of the central semiconductor manufacturing apparatus 2B sends a signal to that effect. It transmits wirelessly to the receiver of the X direction positioning mechanism 4X of the semiconductor manufacturing apparatus 2A on the right side. Then, the receiver of the X direction positioning mechanism 4X of the right semiconductor manufacturing apparatus 2A transmits a signal to that effect to the stop control device of the X direction positioning mechanism 4X of the right semiconductor manufacturing apparatus 2A. Then, the stop control device of the X direction positioning mechanism 4X of the right semiconductor manufacturing apparatus 2A stops the transfer operation of the wafer transfer container 10. As a result, the wafer transfer container 10 can be accurately positioned in the X direction.

  Further, since the Y-direction positioning mechanism 4Y is also incorporated in the central semiconductor manufacturing apparatus 2B, the wafer transfer container 10 can be accurately positioned in the Y direction. That is, when the wafer transfer container 10 held by the container holding member 26 of the right semiconductor manufacturing apparatus 2A is placed on the temporary storage tray 8 of the central semiconductor manufacturing apparatus 2B, as shown in FIG. Even if the center CT2 of the container gripping member 26 is displaced in the Y direction (left and right direction in FIG. 4) with respect to the center CT3 of the placing tray 8, as shown in FIG. The temporary storage tray 8 moves in the Y direction (leftward in FIG. 4) against the elasticity of the pair of front and rear coil springs 40, and the center CT3 thereof is matched with the center CT2 of the container gripping member 26. As a result, the wafer transfer container 10 can be accurately positioned in the Y direction. Thereafter, when the container gripping member 26 releases the gripping state of the wafer transport container 10 and retreats, the wafer transport container 10 is raised while remaining on the temporary placement tray 8. At this time, the temporary tray 8 is moved in the Y direction (rightward in FIG. 4) by the elasticity of the pair of front and rear coil springs 40 to the reference position on the housing 3 (the position of the center CT3 in FIG. 4A). Return.

  Further, since the Z-direction positioning mechanism 4Z is also incorporated in the central semiconductor manufacturing apparatus 2B, the wafer transfer container 10 can be accurately positioned in the Z direction. That is, when the wafer transfer container 10 held by the container holding member 26 of the semiconductor manufacturing apparatus 2A on the right side is placed on the temporary storage tray 8 of the central semiconductor manufacturing apparatus 2B, as shown in FIG. When the Z-direction stop switch 50 of the Z-direction positioning mechanism 4Z of the apparatus 2B detects the positioning of the wafer transfer container 10, a signal to that effect is sent from the transmitter of the Z-direction positioning mechanism 4Z of the central semiconductor manufacturing apparatus 2B to the right semiconductor manufacture. It transmits wirelessly to the receiver of the Z-direction positioning mechanism 4Z of the apparatus 2A. Then, the receiver of the Z direction positioning mechanism 4Z of the right semiconductor manufacturing apparatus 2A transmits a signal to that effect to the stop control device of the Z direction positioning mechanism 4Z of the right semiconductor manufacturing apparatus 2A. Then, the stop control device for the Z-direction positioning mechanism 4Z of the semiconductor manufacturing apparatus 2A on the right side stops the transfer operation of the wafer transfer container 10. As a result, the wafer transfer container 10 can be accurately positioned in the Z direction.

  Further, when the wafer transport container 10 is received from the temporary storage tray 8 in the central semiconductor manufacturing apparatus 2B, as described above, as shown in FIG. 3B, the X-direction stop switch 30 of the X-direction positioning mechanism 4X is escaped. Since the function is expressed, the movement of the container gripping member 26 is not hindered. In addition, as described above, since the positional relationship between the container mounting table 9 and the temporary storage tray 8 is determined with high accuracy, the wafer transfer container 10 can be received smoothly without relying on the X-direction positioning mechanism 4X.

  Thereafter, the process proceeds to the second processing step. In the central semiconductor manufacturing apparatus 2B, the semiconductor wafer is carried from the container mounting table 9 and transferred to the processing chamber 5 through the apparatus front chamber 6, and a predetermined processing is performed in the processing chamber 5. Then, the processing chamber 5 is returned to the container mounting table 9 through the apparatus front chamber 6 and carried out.

  Next, the process proceeds to the second transfer step, where the container transfer means 12 of the central semiconductor manufacturing apparatus 2B and the container transfer means 12 of the left semiconductor manufacturing apparatus 2C cooperate with each other to mount the container of the central semiconductor manufacturing apparatus 2B. After being temporarily placed on the temporary placement tray 8 of the left semiconductor manufacturing apparatus 2C from the mounting table 9, the wafer is transferred from the temporary placement tray 8 of the left semiconductor manufacturing apparatus 2C to the container mounting table 9 of the left semiconductor manufacturing apparatus 2C. The container 10 is transported and placed.

  That is, first, in the central semiconductor manufacturing apparatus 2B, as shown in FIG. 6B, the wafer transfer container 10 is mounted on the container mounting table 9, and the container transfer means is disposed above the container mounting table 9. In a state where the 12 container gripping members 26 are positioned, the Z-axis motor 18 is rotationally driven to lower the container transporting means 12, and the wafer gripping container 10 is sucked and gripped by the container gripping member 26, and then the Z-axis The motor 18 is driven to raise the container conveying means 12. Next, as shown in FIG. 6C, the X-axis motor 22 is rotationally driven to position the container gripping member 26 above the temporary storage tray 8 of the semiconductor manufacturing apparatus 2C on the left side. Thereafter, the Z-axis motor 18 is rotationally driven to lower the container transfer means 12, release the suction state of the wafer transfer container 10 by the container gripping member 26, and transfer the wafer to the temporary placement tray 8 of the semiconductor manufacturing apparatus 2 </ b> C on the left side. The container 10 is placed. Next, the Z-axis motor 18 is driven to raise the container conveying means 12, and the X-axis motor 22 is rotationally driven to return the container gripping member 26 to the central semiconductor manufacturing apparatus 2B.

  Thereafter, in the semiconductor manufacturing apparatus 2 </ b> C on the left side, as shown in FIG. 6D, the X-axis motor 22 is rotationally driven to position the container gripping member 26 above the temporary tray 8. Next, the Z-axis motor 18 is rotationally driven to lower the container transfer means 12, and the wafer holding container 10 is sucked and held by the container holding member 26, and then the Z-axis motor 18 is driven to move the container transfer means 12. Raise. Next, as shown in FIG. 6 (e), the X-axis motor 22 is rotationally driven to position the container gripping member 26 above the container mounting table 9. Thereafter, the Z-axis motor 18 is rotationally driven to lower the container transfer means 12, release the suction state of the wafer transfer container 10 by the container gripping member 26, and place the wafer transfer container 10 on the container mounting table 9.

  At this time, since the X direction positioning mechanism 4X is incorporated in the semiconductor manufacturing apparatus 2C on the left side, the wafer transfer container 10 is accurately positioned in the X direction. That is, when positioning the container gripping member 26 of the central semiconductor manufacturing apparatus 2B above the temporary storage tray 8 of the left semiconductor manufacturing apparatus 2C (see FIG. 6C), as shown in FIG. When the X direction stop switch 30 of the X direction positioning mechanism 4X of the left semiconductor manufacturing apparatus 2C detects the positioning of the wafer transfer container 10, the transmitter of the X direction positioning mechanism 4X of the left semiconductor manufacturing apparatus 2C sends a signal to that effect. It transmits by radio to the receiver of the X-direction positioning mechanism 4X of the central semiconductor manufacturing apparatus 2B. Then, the receiver of the X direction positioning mechanism 4X of the central semiconductor manufacturing apparatus 2B transmits a signal to that effect to the stop control device of the X direction positioning mechanism 4X of the central semiconductor manufacturing apparatus 2B. Then, the stop control device for the X direction positioning mechanism 4X of the central semiconductor manufacturing apparatus 2B stops the transfer operation of the wafer transfer container 10. As a result, the wafer transfer container 10 can be accurately positioned in the X direction.

  Further, since the Y-direction positioning mechanism 4Y is also incorporated in the left side semiconductor manufacturing apparatus 2C, the wafer transfer container 10 is positioned with high accuracy in the Y direction. That is, when the wafer transfer container 10 held by the container holding member 26 of the central semiconductor manufacturing apparatus 2B is placed on the temporary storage tray 8 of the left semiconductor manufacturing apparatus 2C, as shown in FIG. Even if the center CT2 of the container gripping member 26 is displaced in the Y direction (left and right direction in FIG. 4) with respect to the center CT3 of the placing tray 8, as shown in FIG. The temporary storage tray 8 moves in the Y direction (leftward in FIG. 4) against the elasticity of the pair of front and rear coil springs 40, and the center CT3 thereof is matched with the center CT2 of the container gripping member 26. As a result, the wafer transfer container 10 can be accurately positioned in the Y direction. Thereafter, when the container gripping member 26 releases the gripping state of the wafer transport container 10 and retreats, the wafer transport container 10 is raised while remaining on the temporary placement tray 8. At this time, the temporary tray 8 is moved in the Y direction (rightward in FIG. 4) by the elasticity of the pair of front and rear coil springs 40 to the reference position on the housing 3 (the position of the center CT3 in FIG. 4A). Return.

  Furthermore, since the Z-direction positioning mechanism 4Z is also incorporated in the left semiconductor manufacturing apparatus 2C, the wafer transfer container 10 can be accurately positioned in the Z direction. That is, when the wafer transfer container 10 held by the container holding member 26 of the central semiconductor manufacturing apparatus 2B is placed on the temporary storage tray 8 of the left semiconductor manufacturing apparatus 2C, as shown in FIG. When the Z-direction stop switch 50 of the Z-direction positioning mechanism 4Z of the apparatus 2C detects the positioning of the wafer transfer container 10, a signal to that effect is sent from the transmitter of the Z-direction positioning mechanism 4Z of the left semiconductor manufacturing apparatus 2C to the central semiconductor manufacture. It transmits wirelessly to the receiver of the Z direction positioning mechanism 4Z of the apparatus 2B. Then, the receiver of the Z direction positioning mechanism 4Z of the central semiconductor manufacturing apparatus 2B transmits a signal to that effect to the stop control device of the Z direction positioning mechanism 4Z of the central semiconductor manufacturing apparatus 2B. Then, the stop control device for the Z-direction positioning mechanism 4Z of the central semiconductor manufacturing apparatus 2B stops the transfer operation of the wafer transfer container 10. As a result, the wafer transfer container 10 can be accurately positioned in the Z direction.

  Further, when the left semiconductor manufacturing apparatus 2C receives the wafer transfer container 10 from the temporary storage tray 8, as described above, as shown in FIG. 3B, the X-direction stop switch 30 of the X-direction positioning mechanism 4X is escaped. Since the function is expressed, the movement of the container gripping member 26 is not hindered. In addition, as described above, since the positional relationship between the container mounting table 9 and the temporary storage tray 8 is determined with high accuracy, the wafer transfer container 10 can be received smoothly without relying on the X-direction positioning mechanism 4X.

  Finally, the process proceeds to the third processing step, and in the semiconductor manufacturing apparatus 2C on the left side, the semiconductor wafer is carried from the container mounting table 9 and transferred to the processing chamber 5 through the front chamber 6 of the apparatus. After the processing, the processing chamber 5 returns to the container mounting table 9 through the front chamber 6 and is carried out.

  Here, a series of manufacturing processes for the semiconductor wafer is completed.

  In the series of manufacturing processes described above, the procedure in the case of performing a series of manufacturing processes on the semiconductor wafer while transporting the wafer transfer container 10 in the forward feed has been described. However, in addition to this forward feed, the wafer transport container in an arbitrary order. It is possible to perform a series of manufacturing processes on the semiconductor wafer while carrying 10.

  For example, in the production line 1, the semiconductor is transported while transporting the wafer transport container 10 by back feeding from the semiconductor manufacturing apparatus 2 C on the left side to the semiconductor manufacturing apparatus 2 A on the right side from the semiconductor manufacturing apparatus 2 B on the left side by the procedure reverse to the above-described forward feeding. The wafer can be subjected to a series of manufacturing processes.

  In the production line 1, it is also possible to perform a series of manufacturing processes on the semiconductor wafer while transporting the wafer transport container 10 in the order of the left semiconductor manufacturing apparatus 2C, the right semiconductor manufacturing apparatus 2A, and the central semiconductor manufacturing apparatus 2B. It is. In this case, when the wafer transfer container 10 is transferred from the left semiconductor manufacturing apparatus 2C to the right semiconductor manufacturing apparatus 2A, the right semiconductor manufacturing apparatus passes from the left semiconductor manufacturing apparatus 2C through the central semiconductor manufacturing apparatus 2B. The wafer transfer container 10 may be transferred to 2A.

  As described above, in a series of manufacturing processes for semiconductor wafers, the container transfer means 12 of the three semiconductor manufacturing apparatuses 2 constituting the production line 1 cooperate with each other, so that the wafers are connected between these semiconductor manufacturing apparatuses 2. The transport container 10 is transported. As a result, the wafer transfer container 10 can be automatically transferred between the three semiconductor manufacturing apparatuses 2, and a series of manufacturing processes for semiconductor wafers can be efficiently advanced.

  In addition, since each semiconductor manufacturing apparatus 2 is provided with a temporary tray 8, when a plurality of semiconductor wafers are continuously processed on the production line 1, the wafer is transported during a series of manufacturing processes for each semiconductor wafer. By temporarily placing the container 10 on the temporary placing tray 8, it is possible to shorten the standby time of the container conveying means 12, and thus the time required for the entire series of manufacturing processes for all semiconductor wafers.

  In addition, each semiconductor manufacturing apparatus 2 includes a container transport unit 12 and a temporary tray 8, and further includes a positioning mechanism 4 for absorbing a positional shift that may occur between the plurality of semiconductor manufacturing apparatuses 2. Even if there is a slight misalignment between the plurality of semiconductor manufacturing apparatuses 2 due to corrugation of the floor surface, the wafer transfer container 10 can be reliably transferred between these semiconductor manufacturing apparatuses 2.

  Further, as described above, the container transporting unit 12 is in the recess 7 in a state in which it does not protrude forward or leftward and rightward from the rectangular outer shape line LN of the housing 3 of the semiconductor manufacturing apparatus 2 when not in use. Since they are housed, when the production line 1 is constructed by arranging the three semiconductor manufacturing apparatuses 2 side by side, the installation and replacement of these semiconductor manufacturing apparatuses 2 can be performed smoothly.

  Further, as described above, the container transport means 12 does not protrude forward from the rectangular parallelepiped LN of the housing 3 of the semiconductor manufacturing apparatus 2 and the adjacent semiconductor manufacturing apparatus 2 when used. When the wafer transfer container 10 is transferred between the semiconductor manufacturing apparatuses 2 using the container transfer means 12, it is possible to avoid a situation where the container transfer means 12 interferes with the operator.

  Further, as described above, the housing 3 of each semiconductor manufacturing apparatus 2 is provided with positioning means 13 for positioning the housing 3 at a predetermined position on the floor surface 16, so that the semiconductor manufacturing apparatus 2 is placed on the floor surface 16. Simultaneously with the installation, the semiconductor manufacturing apparatus 2 can be positioned, and there is no need to separately adjust the position of the semiconductor manufacturing apparatus 2.

  Furthermore, during the transfer of the wafer transfer container 10, the semiconductor wafer is always stored in a sealed state in the wafer transfer container 10, so that fine particles in the air enter the wafer transfer container 10 and adhere to the semiconductor wafer. There is no fear of doing. Therefore, it is not necessary to seal the entire production line 1 and the production line 1 can be constructed at a low cost.

[Other Embodiments of the Invention]
In the first embodiment described above, in the first transfer process, it is detected whether or not the wafer transfer container 10 held by the container holding member 26 of the right semiconductor manufacturing apparatus 2A is positioned at the reference position in the X direction. However, the case where the X direction stop switch 30 and the transmitter of the X direction positioning mechanism 4X of the central semiconductor manufacturing apparatus 2B are used has been described. However, this detection operation may be performed by the right semiconductor manufacturing apparatus 2A itself. In this case, there is an advantage that it is not necessary to exchange signals between the right semiconductor manufacturing apparatus 2A and the central semiconductor manufacturing apparatus 2B. The same applies to the second transport step.

  In the first embodiment described above, in the first transfer step, it is detected whether or not the wafer transfer container 10 held by the container holding member 26 of the right semiconductor manufacturing apparatus 2A is positioned at the reference position in the Z direction. However, the case where the Z direction stop switch 50 of the Z direction positioning mechanism 4Z of the central semiconductor manufacturing apparatus 2B and the transmitter are used has been described. However, this detection operation may be performed by the right semiconductor manufacturing apparatus 2A itself. In this case, there is an advantage that it is not necessary to exchange signals between the right semiconductor manufacturing apparatus 2A and the central semiconductor manufacturing apparatus 2B. The same applies to the second transport step.

  Moreover, in Embodiment 1 mentioned above, you may make it support the container conveyance means 12 so that raising / lowering is possible by a pair of left and right spiral constant load springs (not shown). In this case, since the load becomes substantially constant even when the constant load spring expands and contracts, the lifting and lowering operation of the container transport means 12 can be made smooth.

  In the first embodiment described above, the production line 1 including the three semiconductor manufacturing apparatuses 2 has been described. However, the number of the semiconductor manufacturing apparatuses 2 constituting the production line 1 is not limited to three, and a plurality of semiconductor manufacturing apparatuses 2 may be used. Any number can be used as long as it is (two or more).

  Further, in the above-described first embodiment, the case where the present invention is applied to a small-diameter semiconductor wafer has been described, but the present invention is similarly applied to a large-diameter semiconductor wafer such as 8 inches or 12 inches. Can do.

  Further, in the first embodiment described above, the semiconductor manufacturing apparatus 2 using a semiconductor wafer has been described as an example. However, the present invention is applicable to other types of substrates (for example, an insulating substrate such as a sapphire substrate, an aluminum substrate, etc. The present invention can be similarly applied to a manufacturing apparatus for manufacturing a device from a non-disk-shaped (for example, rectangular) processing substrate.

  The present invention can be widely applied not only to a semiconductor manufacturing apparatus but also to a production line for producing various kinds and small quantities in various fields.

1 ... Production line 2 ... Semiconductor manufacturing equipment (small manufacturing equipment)
3 ... Case 4 ... Positioning mechanism 5 ... Processing chamber 6 ... Front chamber 7 ... Recess 8 ... Temporary tray 9 ... Container mounting table 10 ... Wafer transfer container (substrate transfer container)
DESCRIPTION OF SYMBOLS 11 ... Bottom plate 12 ... Container conveyance means 13 ... Positioning means 14 ... Container conveyance path 22 ... X-axis motor (arm drive device)
26 …… Container gripping member 27 …… Transfer arm 30 …… X direction stop switch 40 …… Coil spring (tray swinging means)
41 …… Guide member 50 …… Z direction stop switch

Claims (7)

The processing chamber and the front chamber of the apparatus are disposed inside the housing,
A recess is formed in the housing,
In this recess, a container mounting table for mounting a substrate transfer container in which a processing substrate is stored is provided,
When processing the processing substrate, the processing substrate is carried from the container mounting table, transferred to the processing chamber through the front chamber of the apparatus, processed in the processing chamber, and then from the processing chamber to the processing chamber. It is a small manufacturing apparatus that is returned to the container mounting table through the front chamber of the apparatus and carried out,
The recess is provided with a temporary tray that temporarily holds the substrate transport container, and a container transport unit that transports the substrate transport container between the temporary tray and the container mounting table.
When the plurality of small manufacturing apparatuses are arranged side by side, the container transporting unit is configured such that the container placing table is disposed between the container mounting table of an arbitrary small manufacturing apparatus and the temporary storage tray of the small manufacturing apparatus adjacent to the small manufacturing apparatus. It is configured to be able to transport the substrate transport container,
A positioning mechanism is incorporated to position the substrate transport container at a reference position on the temporary placement tray when the substrate transport container is placed on the temporary placement tray by the container transport means. Small manufacturing equipment.   The positioning mechanism includes an X-direction stop switch that detects whether or not the substrate transport container is positioned at a reference position on the temporary storage tray in the X direction that is the width direction of the housing, and the X-direction stop switch. When it is detected that the substrate transport container is positioned at a reference position on the temporary placement tray in the X direction, a transmitter that transmits a signal to that effect, and the temporary transport tray in which the substrate transport container is in the X direction X direction comprising a receiver for receiving a signal indicating that it has been positioned at the upper reference position, and a stop control device for stopping the transfer operation of the substrate transfer container by the container transfer means based on the signal from the receiver The small-sized manufacturing apparatus according to claim 1, further comprising a positioning mechanism.   The container transport means is a transport arm attached to the housing so as to be movable in the X direction, an arm driving device for driving the transport arm in the X direction, and movable in the X direction with respect to the transport arm. 3. The small-sized manufacturing apparatus according to claim 1, further comprising: a container gripping member that is attached to the substrate and detachably grips the substrate transport container. The container gripping member is configured to move in the X direction in conjunction with the movement of the transfer arm in the X direction,
The speed increasing mechanism which accelerates | stimulates the movement of the said conveyance arm to the X direction of the said conveyance arm and transmits to the said container holding member between the said conveyance arm and the said container holding member is provided. Small manufacturing apparatus as described   The small-sized manufacturing apparatus according to any one of claims 1 to 4, wherein the container transport unit is supported by the casing so as to be movable up and down via a constant load spring.   The positioning mechanism includes tray swinging means for elastically swinging the temporary tray in the Y direction around a reference position on the casing in the Y direction which is the depth direction of the casing, and the container transporting means. A Y-direction comprising a guide member for guiding the temporary storage tray in the Y direction and positioning the substrate transfer container at a reference position on the temporary storage tray when the substrate transfer container is placed on the temporary storage tray. The small-sized manufacturing apparatus according to claim 1, further comprising a positioning mechanism.   The positioning mechanism includes a Z-direction stop switch that detects whether or not the substrate transport container is positioned at a reference position on the temporary storage tray in the Z direction, which is the height direction of the housing, and the Z-direction stop When the switch detects that the substrate transport container is positioned at the reference position on the temporary placement tray in the Z direction, the transmitter transmits a signal to that effect, and the temporary placement of the substrate transport container in the Z direction. Z comprising: a receiver that receives a signal indicating that it is positioned at a reference position on the tray; and a stop control device that stops the transport operation of the substrate transport container by the container transport means based on the signal from the receiver. The small manufacturing apparatus according to claim 1, further comprising a direction positioning mechanism.

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