KR102131897B1 - 지형적인 속성들을 사용하는 결함 분류 - Google Patents
지형적인 속성들을 사용하는 결함 분류 Download PDFInfo
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- KR102131897B1 KR102131897B1 KR1020130043520A KR20130043520A KR102131897B1 KR 102131897 B1 KR102131897 B1 KR 102131897B1 KR 1020130043520 A KR1020130043520 A KR 1020130043520A KR 20130043520 A KR20130043520 A KR 20130043520A KR 102131897 B1 KR102131897 B1 KR 102131897B1
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
- G06T2207/10061—Microscopic image from scanning electron microscope
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/451,490 | 2012-04-19 | ||
| US13/451,490 US9595091B2 (en) | 2012-04-19 | 2012-04-19 | Defect classification using topographical attributes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130118277A KR20130118277A (ko) | 2013-10-29 |
| KR102131897B1 true KR102131897B1 (ko) | 2020-07-09 |
Family
ID=49380166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130043520A Active KR102131897B1 (ko) | 2012-04-19 | 2013-04-19 | 지형적인 속성들을 사용하는 결함 분류 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9595091B2 (https=) |
| JP (1) | JP6262942B2 (https=) |
| KR (1) | KR102131897B1 (https=) |
| TW (1) | TWI597689B (https=) |
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| US7448012B1 (en) | 2004-04-21 | 2008-11-04 | Qi-De Qian | Methods and system for improving integrated circuit layout |
| US9858658B2 (en) | 2012-04-19 | 2018-01-02 | Applied Materials Israel Ltd | Defect classification using CAD-based context attributes |
| US10330608B2 (en) * | 2012-05-11 | 2019-06-25 | Kla-Tencor Corporation | Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools |
| US9305346B2 (en) * | 2012-05-31 | 2016-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for efficient defect inspection |
| US9752992B2 (en) * | 2014-03-25 | 2017-09-05 | Kla-Tencor Corporation | Variable image field curvature for object inspection |
| DE102014004556A1 (de) * | 2014-03-31 | 2015-10-01 | Heidelberger Druckmaschinen Ag | Verfahren zur Prüfung der Zuverlässigkeit der Fehlererkennung eines Bildinspektionsverfahrens |
| US9715724B2 (en) * | 2014-07-29 | 2017-07-25 | Applied Materials Israel Ltd. | Registration of CAD data with SEM images |
| US9816940B2 (en) * | 2015-01-21 | 2017-11-14 | Kla-Tencor Corporation | Wafer inspection with focus volumetric method |
| US10312161B2 (en) | 2015-03-23 | 2019-06-04 | Applied Materials Israel Ltd. | Process window analysis |
| DE102015119240B3 (de) * | 2015-11-09 | 2017-03-30 | ATENSOR Engineering and Technology Systems GmbH | Automatisches detektieren und robotergestütztes bearbeiten von oberflächendefekten |
| US20170177802A1 (en) * | 2015-12-17 | 2017-06-22 | Allergy Solutions, Inc. | Allergy Service Management Portal |
| US10133854B2 (en) | 2016-05-12 | 2018-11-20 | International Business Machines Corporation | Compositional three-dimensional surface plots |
| HUE059751T2 (hu) * | 2016-06-23 | 2022-12-28 | Ultra Electronics Forensic Tech Inc | Felületi szabálytalanság kimutatása érmékben |
| KR102810067B1 (ko) * | 2017-10-02 | 2025-05-21 | 어플라이드 머티리얼즈 이스라엘 리미티드 | 패턴의 임계 치수 변동의 결정 |
| US20210170690A1 (en) * | 2017-12-15 | 2021-06-10 | New York University | System and method for embedding security identifiers in additive manufactured parts |
| DE102018109816B3 (de) * | 2018-04-24 | 2019-10-24 | Yxlon International Gmbh | Verfahren zur Gewinnung mindestens eines signifikanten Merkmals in einer Serie von Bauteilen gleichen Typs und Verfahren zur Klassifikation eines Bauteils eienr solchen Serie |
| US10684295B2 (en) * | 2018-07-05 | 2020-06-16 | VistaPath Biosystems Inc. | Apparatus and methods for processing and cataloging of samples |
| KR102579007B1 (ko) | 2018-07-10 | 2023-09-15 | 삼성전자주식회사 | 크리스탈 결함 분석 시스템 및 크리스탈 결함 분석 방법 |
| US10832399B2 (en) * | 2018-10-23 | 2020-11-10 | International Business Machines Corporation | Detection for abnormal connectivity on a product |
| KR102563023B1 (ko) | 2018-11-12 | 2023-08-03 | 주식회사 히타치하이테크 | 결함의 발생을 추정하는 시스템, 및 컴퓨터 가독 매체 |
| US11861286B2 (en) * | 2020-06-30 | 2024-01-02 | Synopsys, Inc. | Segregating defects based on computer-aided design (CAD) identifiers associated with the defects |
| US20220293228A1 (en) * | 2021-03-09 | 2022-09-15 | Glenn Loomis | Identification of Allergens in Food Products |
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| JP2006258516A (ja) * | 2005-03-16 | 2006-09-28 | Hitachi High-Technologies Corp | 形状測定装置および形状測定方法 |
| JP2011211035A (ja) * | 2010-03-30 | 2011-10-20 | Lasertec Corp | 検査装置並びに欠陥分類方法及び欠陥検出方法 |
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-
2012
- 2012-04-19 US US13/451,490 patent/US9595091B2/en active Active
-
2013
- 2013-04-18 JP JP2013099680A patent/JP6262942B2/ja active Active
- 2013-04-19 KR KR1020130043520A patent/KR102131897B1/ko active Active
- 2013-04-19 TW TW102114044A patent/TWI597689B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6288782B1 (en) | 1993-06-17 | 2001-09-11 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
| US6373053B1 (en) | 2000-01-31 | 2002-04-16 | Advanced Micro Devices, Inc. | Analysis of CD-SEM signal to detect scummed/closed contact holes and lines |
| JP2006258516A (ja) * | 2005-03-16 | 2006-09-28 | Hitachi High-Technologies Corp | 形状測定装置および形状測定方法 |
| JP2011211035A (ja) * | 2010-03-30 | 2011-10-20 | Lasertec Corp | 検査装置並びに欠陥分類方法及び欠陥検出方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6262942B2 (ja) | 2018-01-17 |
| US9595091B2 (en) | 2017-03-14 |
| TW201351347A (zh) | 2013-12-16 |
| TWI597689B (zh) | 2017-09-01 |
| JP2013236087A (ja) | 2013-11-21 |
| US20130279791A1 (en) | 2013-10-24 |
| KR20130118277A (ko) | 2013-10-29 |
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