KR102110755B1 - 자동 결함 분류를 위한 알려지지 않은 결함 리젝션의 최적화 - Google Patents
자동 결함 분류를 위한 알려지지 않은 결함 리젝션의 최적화 Download PDFInfo
- Publication number
- KR102110755B1 KR102110755B1 KR1020130043453A KR20130043453A KR102110755B1 KR 102110755 B1 KR102110755 B1 KR 102110755B1 KR 1020130043453 A KR1020130043453 A KR 1020130043453A KR 20130043453 A KR20130043453 A KR 20130043453A KR 102110755 B1 KR102110755 B1 KR 102110755B1
- Authority
- KR
- South Korea
- Prior art keywords
- defect
- defects
- class
- classification
- parameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
- G06F18/2411—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on the proximity to a decision surface, e.g. support vector machines
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/243—Classification techniques relating to the number of classes
- G06F18/2433—Single-class perspective, e.g. one-against-all classification; Novelty detection; Outlier detection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/98—Detection or correction of errors, e.g. by rescanning the pattern or by human intervention; Evaluation of the quality of the acquired patterns
- G06V10/987—Detection or correction of errors, e.g. by rescanning the pattern or by human intervention; Evaluation of the quality of the acquired patterns with the intervention of an operator
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10056—Microscopic image
- G06T2207/10061—Microscopic image from scanning electron microscope
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20076—Probabilistic image processing
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Data Mining & Analysis (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Quality & Reliability (AREA)
- Multimedia (AREA)
- General Engineering & Computer Science (AREA)
- Evolutionary Biology (AREA)
- Bioinformatics & Computational Biology (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Software Systems (AREA)
- Medical Informatics (AREA)
- General Health & Medical Sciences (AREA)
- Databases & Information Systems (AREA)
- Computing Systems (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/451,500 | 2012-04-19 | ||
| US13/451,500 US9715723B2 (en) | 2012-04-19 | 2012-04-19 | Optimization of unknown defect rejection for automatic defect classification |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130118275A KR20130118275A (ko) | 2013-10-29 |
| KR102110755B1 true KR102110755B1 (ko) | 2020-05-15 |
Family
ID=49380168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130043453A Active KR102110755B1 (ko) | 2012-04-19 | 2013-04-19 | 자동 결함 분류를 위한 알려지지 않은 결함 리젝션의 최적화 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9715723B2 (https=) |
| JP (2) | JP2013224942A (https=) |
| KR (1) | KR102110755B1 (https=) |
| TW (1) | TWI585397B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230064416A (ko) * | 2021-11-03 | 2023-05-10 | 한국교통대학교산학협력단 | 전력 기기의 결함 진단 장치 및 방법 |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295024B (zh) * | 2012-02-29 | 2017-03-01 | 佳能株式会社 | 分类与对象检测方法和装置以及图像拍摄和处理设备 |
| US9262726B2 (en) * | 2013-01-17 | 2016-02-16 | Applied Materials, Inc. | Using radial basis function networks and hyper-cubes for excursion classification in semi-conductor processing equipment |
| KR101924487B1 (ko) | 2013-12-17 | 2018-12-03 | 에이에스엠엘 네델란즈 비.브이. | 수율 추산 및 제어 |
| JP6156126B2 (ja) * | 2013-12-19 | 2017-07-05 | 富士通株式会社 | 検索方法、検索プログラムおよび検索装置 |
| US10614373B1 (en) | 2013-12-23 | 2020-04-07 | Groupon, Inc. | Processing dynamic data within an adaptive oracle-trained learning system using curated training data for incremental re-training of a predictive model |
| US11210604B1 (en) | 2013-12-23 | 2021-12-28 | Groupon, Inc. | Processing dynamic data within an adaptive oracle-trained learning system using dynamic data set distribution optimization |
| US10657457B1 (en) | 2013-12-23 | 2020-05-19 | Groupon, Inc. | Automatic selection of high quality training data using an adaptive oracle-trained learning framework |
| US20150332167A1 (en) * | 2014-05-13 | 2015-11-19 | Tokyo Electron Limited | System and method for modeling and/or analyzing manufacturing processes |
| US10650326B1 (en) * | 2014-08-19 | 2020-05-12 | Groupon, Inc. | Dynamically optimizing a data set distribution |
| US9286675B1 (en) * | 2014-10-23 | 2016-03-15 | Applied Materials Israel Ltd. | Iterative defect filtering process |
| US10339468B1 (en) | 2014-10-28 | 2019-07-02 | Groupon, Inc. | Curating training data for incremental re-training of a predictive model |
| US9791929B2 (en) * | 2014-10-31 | 2017-10-17 | Elwha Llc | Tactile control system |
| US10650508B2 (en) | 2014-12-03 | 2020-05-12 | Kla-Tencor Corporation | Automatic defect classification without sampling and feature selection |
| JP6430228B2 (ja) * | 2014-12-15 | 2018-11-28 | 株式会社Screenホールディングス | 画像分類装置および画像分類方法 |
| US20160189055A1 (en) * | 2014-12-31 | 2016-06-30 | Applied Materials Israel Ltd. | Tuning of parameters for automatic classification |
| US9898811B2 (en) * | 2015-05-08 | 2018-02-20 | Kla-Tencor Corporation | Method and system for defect classification |
| US20170039469A1 (en) * | 2015-08-04 | 2017-02-09 | Qualcomm Incorporated | Detection of unknown classes and initialization of classifiers for unknown classes |
| WO2017168630A1 (ja) * | 2016-03-30 | 2017-10-05 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置、欠陥検査方法 |
| CN107450968B (zh) * | 2016-05-31 | 2020-09-08 | 华为技术有限公司 | 负载还原方法、装置和设备 |
| EP3482192A4 (en) * | 2016-07-08 | 2020-08-05 | ATS Automation Tooling Systems Inc. | COMBINED AUTOMATIC AND MANUAL INSPECTION SYSTEM AND PROCESS |
| US11580398B2 (en) * | 2016-10-14 | 2023-02-14 | KLA-Tenor Corp. | Diagnostic systems and methods for deep learning models configured for semiconductor applications |
| KR20180054063A (ko) * | 2016-11-14 | 2018-05-24 | 주식회사 고영테크놀러지 | 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치 |
| US11366068B2 (en) | 2016-11-14 | 2022-06-21 | Koh Young Technology Inc. | Inspection apparatus and operating method thereof |
| TWI608369B (zh) * | 2016-11-23 | 2017-12-11 | 財團法人工業技術研究院 | 分類方法、分類模組及電腦程式產品 |
| US10365617B2 (en) * | 2016-12-12 | 2019-07-30 | Dmo Systems Limited | Auto defect screening using adaptive machine learning in semiconductor device manufacturing flow |
| JP6902396B2 (ja) * | 2017-05-25 | 2021-07-14 | 日東電工株式会社 | 画像分類機能付製造装置 |
| US11032300B2 (en) | 2017-07-24 | 2021-06-08 | Korea University Research And Business Foundation | Intrusion detection system based on electrical CAN signal for in-vehicle CAN network |
| US11037286B2 (en) | 2017-09-28 | 2021-06-15 | Applied Materials Israel Ltd. | Method of classifying defects in a semiconductor specimen and system thereof |
| JP6853968B2 (ja) * | 2017-10-03 | 2021-04-07 | 日本電気株式会社 | パラメータ推定システム、パラメータ推定方法およびパラメータ推定プログラム |
| DE102018109816B3 (de) * | 2018-04-24 | 2019-10-24 | Yxlon International Gmbh | Verfahren zur Gewinnung mindestens eines signifikanten Merkmals in einer Serie von Bauteilen gleichen Typs und Verfahren zur Klassifikation eines Bauteils eienr solchen Serie |
| US10748271B2 (en) * | 2018-04-25 | 2020-08-18 | Applied Materials Israel Ltd. | Method of defect classification and system thereof |
| US10769770B2 (en) * | 2018-05-07 | 2020-09-08 | Cummins Enterprise Llc | Quality monitoring system and quality monitoring method for fuel cell manufacturing line and quality monitoring system for manufacturing line |
| JP2019204232A (ja) * | 2018-05-22 | 2019-11-28 | 株式会社ジェイテクト | 情報処理方法、情報処理装置、及びプログラム |
| CN108776808A (zh) * | 2018-05-25 | 2018-11-09 | 北京百度网讯科技有限公司 | 一种用于检测钢包溶蚀缺陷的方法和装置 |
| US10984521B2 (en) * | 2018-11-20 | 2021-04-20 | Bnsf Railway Company | Systems and methods for determining defects in physical objects |
| US11151706B2 (en) * | 2019-01-16 | 2021-10-19 | Applied Material Israel, Ltd. | Method of classifying defects in a semiconductor specimen and system thereof |
| CN119153378B (zh) * | 2019-09-30 | 2025-11-21 | 深圳中科飞测科技股份有限公司 | 一种检测设备的检测方法以及检测设备 |
| JP7390851B2 (ja) * | 2019-10-18 | 2023-12-04 | 株式会社日立ハイテク | 欠陥分類装置、欠陥分類プログラム |
| CN110910021A (zh) * | 2019-11-26 | 2020-03-24 | 上海华力集成电路制造有限公司 | 一种基于支持向量机监控在线缺陷的方法 |
| EP4081978A1 (en) * | 2019-12-23 | 2022-11-02 | Boon Logic Inc. | Product inspection system and method |
| TW202147250A (zh) * | 2020-04-22 | 2021-12-16 | 美商Pdf對策公司 | 異常晶圓圖像分類 |
| US11430105B2 (en) | 2020-06-15 | 2022-08-30 | Mitutoyo Corporation | Workpiece inspection and defect detection system including monitoring of workpiece images |
| US11150200B1 (en) | 2020-06-15 | 2021-10-19 | Mitutoyo Corporation | Workpiece inspection and defect detection system indicating number of defect images for training |
| DE102020208474B4 (de) | 2020-07-07 | 2022-01-27 | Robert Bosch Gesellschaft mit beschränkter Haftung | Messung der Empfindlichkeit von Klassifikatoren anhand zusammenwirkender Störungen |
| US11404244B1 (en) * | 2021-02-10 | 2022-08-02 | Applied Materials Israel Ltd. | High-resolution x-ray spectroscopy surface material analysis |
| US11501951B1 (en) | 2021-05-14 | 2022-11-15 | Applied Materials Israel Ltd. | X-ray imaging in cross-section using un-cut lamella with background material |
| EP4138032A1 (en) * | 2021-08-17 | 2023-02-22 | Siemens Aktiengesellschaft | Predicting a quality of a printed circuit board assembly from production data |
| US11756186B2 (en) | 2021-09-15 | 2023-09-12 | Mitutoyo Corporation | Workpiece inspection and defect detection system utilizing color channels |
| CN115829902A (zh) * | 2021-09-16 | 2023-03-21 | 鸿海精密工业股份有限公司 | 扣具检测方法、装置及存储介质 |
| CN114119472A (zh) * | 2021-10-21 | 2022-03-01 | 东方晶源微电子科技(北京)有限公司 | 缺陷分类方法和装置、设备及存储介质 |
| CN116091379B (zh) * | 2021-10-29 | 2025-09-16 | 上海芯上微装科技股份有限公司 | 自动缺陷分类系统及其训练和分类的方法 |
| JPWO2023176166A1 (https=) | 2022-03-18 | 2023-09-21 | ||
| CN114998315B (zh) * | 2022-07-18 | 2022-11-01 | 东声(苏州)智能科技有限公司 | 基于深度学习的缺陷检测模型的训练方法和装置 |
| CN119698641A (zh) * | 2022-08-18 | 2025-03-25 | 应用材料公司 | 用于对基板进行缺陷审查测量的方法、用于对基板进行成像的装置和其操作方法 |
| US12574625B2 (en) | 2023-12-29 | 2026-03-10 | Mitutoyo Corporation | System with lighting control including grouped channels |
| WO2025221240A1 (en) * | 2024-04-15 | 2025-10-23 | Bye Uas, Inc. | Airport pavement condition assessment methods and apparatuses |
| CN120404788A (zh) * | 2025-05-23 | 2025-08-01 | 淮安特创科技有限公司 | 基于机器视觉的服务器pcb缺陷检测系统 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050169517A1 (en) * | 2004-01-19 | 2005-08-04 | Konica Minolta Medical & Graphic, Inc. | Medical image processing apparatus |
| US20050216426A1 (en) * | 2001-05-18 | 2005-09-29 | Weston Jason Aaron E | Methods for feature selection in a learning machine |
| US20110026804A1 (en) * | 2009-08-03 | 2011-02-03 | Sina Jahanbin | Detection of Textural Defects Using a One Class Support Vector Machine |
Family Cites Families (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5923430A (en) | 1993-06-17 | 1999-07-13 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
| US8144368B2 (en) | 1998-01-20 | 2012-03-27 | Digimarc Coporation | Automated methods for distinguishing copies from original printed objects |
| US5991699A (en) | 1995-05-04 | 1999-11-23 | Kla Instruments Corporation | Detecting groups of defects in semiconductor feature space |
| US6292582B1 (en) | 1996-05-31 | 2001-09-18 | Lin Youling | Method and system for identifying defects in a semiconductor |
| US6148099A (en) * | 1997-07-03 | 2000-11-14 | Neopath, Inc. | Method and apparatus for incremental concurrent learning in automatic semiconductor wafer and liquid crystal display defect classification |
| US6195458B1 (en) | 1997-07-29 | 2001-02-27 | Eastman Kodak Company | Method for content-based temporal segmentation of video |
| US6996549B2 (en) * | 1998-05-01 | 2006-02-07 | Health Discovery Corporation | Computer-aided image analysis |
| US6256093B1 (en) | 1998-06-25 | 2001-07-03 | Applied Materials, Inc. | On-the-fly automatic defect classification for substrates using signal attributes |
| US6650779B2 (en) * | 1999-03-26 | 2003-11-18 | Georgia Tech Research Corp. | Method and apparatus for analyzing an image to detect and identify patterns |
| US6922482B1 (en) | 1999-06-15 | 2005-07-26 | Applied Materials, Inc. | Hybrid invariant adaptive automatic defect classification |
| US6763130B1 (en) | 1999-07-21 | 2004-07-13 | Applied Materials, Inc. | Real time defect source identification |
| US6577757B1 (en) | 1999-07-28 | 2003-06-10 | Intelligent Reasoning Systems, Inc. | System and method for dynamic image recognition |
| US6999614B1 (en) | 1999-11-29 | 2006-02-14 | Kla-Tencor Corporation | Power assisted automatic supervised classifier creation tool for semiconductor defects |
| JP2001156135A (ja) | 1999-11-29 | 2001-06-08 | Hitachi Ltd | 欠陥画像の分類方法及びその装置並びにそれを用いた半導体デバイスの製造方法 |
| US20020164070A1 (en) | 2001-03-14 | 2002-11-07 | Kuhner Mark B. | Automatic algorithm generation |
| US7127099B2 (en) | 2001-05-11 | 2006-10-24 | Orbotech Ltd. | Image searching defect detector |
| WO2002095553A2 (en) * | 2001-05-18 | 2002-11-28 | Imprivata Inc. | Biometric authentication for remote initiation of actions and services |
| JP3726263B2 (ja) | 2002-03-01 | 2005-12-14 | ヒューレット・パッカード・カンパニー | 文書分類方法及び装置 |
| US20040034612A1 (en) * | 2002-03-22 | 2004-02-19 | Nick Mathewson | Support vector machines for prediction and classification in supply chain management and other applications |
| JP4118703B2 (ja) * | 2002-05-23 | 2008-07-16 | 株式会社日立ハイテクノロジーズ | 欠陥分類装置及び欠陥自動分類方法並びに欠陥検査方法及び処理装置 |
| US7020337B2 (en) * | 2002-07-22 | 2006-03-28 | Mitsubishi Electric Research Laboratories, Inc. | System and method for detecting objects in images |
| US7359544B2 (en) | 2003-02-12 | 2008-04-15 | Kla-Tencor Technologies Corporation | Automatic supervised classifier setup tool for semiconductor defects |
| US7602962B2 (en) * | 2003-02-25 | 2009-10-13 | Hitachi High-Technologies Corporation | Method of classifying defects using multiple inspection machines |
| US7756320B2 (en) | 2003-03-12 | 2010-07-13 | Hitachi High-Technologies Corporation | Defect classification using a logical equation for high stage classification |
| US9002497B2 (en) | 2003-07-03 | 2015-04-07 | Kla-Tencor Technologies Corp. | Methods and systems for inspection of wafers and reticles using designer intent data |
| US7106434B1 (en) | 2003-07-28 | 2006-09-12 | Kla-Tencor Technologies, Inc. | Inspection tool |
| EP1665126A2 (en) * | 2003-08-19 | 2006-06-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method and apparatus for automatic online detection and classification of anomalous objects in a data stream |
| US7490071B2 (en) | 2003-08-29 | 2009-02-10 | Oracle Corporation | Support vector machines processing system |
| JP2005158780A (ja) | 2003-11-20 | 2005-06-16 | Hitachi Ltd | パターン欠陥検査方法及びその装置 |
| US20050175243A1 (en) | 2004-02-05 | 2005-08-11 | Trw Automotive U.S. Llc | Method and apparatus for classifying image data using classifier grid models |
| US7609893B2 (en) | 2004-03-03 | 2009-10-27 | Trw Automotive U.S. Llc | Method and apparatus for producing classifier training images via construction and manipulation of a three-dimensional image model |
| US20060009011A1 (en) | 2004-07-06 | 2006-01-12 | Gary Barrett | Method for recycling/reclaiming a monitor wafer |
| US7188050B2 (en) | 2004-08-25 | 2007-03-06 | Siemens Corporate Research, Inc. | Method and apparatus for detecting out-of-range conditions in power generation equipment operations |
| US7450766B2 (en) | 2004-10-26 | 2008-11-11 | Hewlett-Packard Development Company, L.P. | Classifier performance |
| KR101387785B1 (ko) | 2005-01-21 | 2014-04-25 | 포톤 다이나믹스, 인코포레이티드 | 자동 결함 복구 시스템 |
| JP4654093B2 (ja) | 2005-08-31 | 2011-03-16 | 株式会社日立ハイテクノロジーズ | 回路パターン検査方法及びその装置 |
| JP4776308B2 (ja) | 2005-09-05 | 2011-09-21 | 株式会社東京精密 | 画像欠陥検査装置、画像欠陥検査システム、欠陥分類装置及び画像欠陥検査方法 |
| US7570796B2 (en) | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
| US7570800B2 (en) | 2005-12-14 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for binning defects detected on a specimen |
| JP4644613B2 (ja) | 2006-02-27 | 2011-03-02 | 株式会社日立ハイテクノロジーズ | 欠陥観察方法及びその装置 |
| US7684609B1 (en) | 2006-05-25 | 2010-03-23 | Kla-Tencor Technologies Corporation | Defect review using image segmentation |
| JP4253335B2 (ja) * | 2006-07-13 | 2009-04-08 | 株式会社東芝 | カーネル関数値を用いた、画像の平均値シフトによるフィルタリングとクラスタリングの方法及び装置 |
| JP4992081B2 (ja) * | 2006-09-20 | 2012-08-08 | 国立大学法人山口大学 | 画像処理により対象物の表面状態を検査する方法及びそのための画像処理プログラム |
| JP4908995B2 (ja) * | 2006-09-27 | 2012-04-04 | 株式会社日立ハイテクノロジーズ | 欠陥分類方法及びその装置並びに欠陥検査装置 |
| WO2008077100A2 (en) | 2006-12-19 | 2008-06-26 | Kla-Tencor Corporation | Systems and methods for creating inspection recipes |
| US8194968B2 (en) | 2007-01-05 | 2012-06-05 | Kla-Tencor Corp. | Methods and systems for using electrical information for a device being fabricated on a wafer to perform one or more defect-related functions |
| JP5022174B2 (ja) | 2007-10-22 | 2012-09-12 | 株式会社日立製作所 | 欠陥分類方法及びその装置 |
| JP5081590B2 (ja) | 2007-11-14 | 2012-11-28 | 株式会社日立ハイテクノロジーズ | 欠陥観察分類方法及びその装置 |
| US7949622B2 (en) | 2007-12-13 | 2011-05-24 | Yahoo! Inc. | System and method for generating a classifier model for classifying web content |
| US8583416B2 (en) * | 2007-12-27 | 2013-11-12 | Fluential, Llc | Robust information extraction from utterances |
| US7756658B2 (en) | 2008-05-14 | 2010-07-13 | Kla-Tencor Corp. | Systems and methods for detecting defects on a wafer and generating inspection results for the wafer |
| US20090305423A1 (en) | 2008-06-09 | 2009-12-10 | Ohio State University Research Foundation | Methods for Monitoring Composition and Flavor Quality of Cheese Using a Rapid Spectroscopic Method |
| US8175373B2 (en) | 2009-02-16 | 2012-05-08 | Kla-Tencor Corporation | Use of design information and defect image information in defect classification |
| US8112241B2 (en) | 2009-03-13 | 2012-02-07 | Kla-Tencor Corp. | Methods and systems for generating an inspection process for a wafer |
| JP5168215B2 (ja) * | 2009-04-10 | 2013-03-21 | 株式会社デンソー | 外観検査装置 |
| US8315453B2 (en) * | 2010-07-27 | 2012-11-20 | Applied Materials Israel, Ltd. | Defect classification with optimized purity |
| US9165051B2 (en) | 2010-08-24 | 2015-10-20 | Board Of Trustees Of The University Of Illinois | Systems and methods for detecting a novel data class |
| US8983179B1 (en) * | 2010-11-10 | 2015-03-17 | Google Inc. | System and method for performing supervised object segmentation on images |
| US8502146B2 (en) | 2011-10-03 | 2013-08-06 | Kla-Tencor Corporation | Methods and apparatus for classification of defects using surface height attributes |
| EP2828882B1 (en) | 2012-03-19 | 2019-09-18 | Kla-Tencor Corporation | Method, computer system and apparatus for recipe generation for automated inspection semiconductor devices |
| US10043264B2 (en) | 2012-04-19 | 2018-08-07 | Applied Materials Israel Ltd. | Integration of automatic and manual defect classification |
| US10599944B2 (en) | 2012-05-08 | 2020-03-24 | Kla-Tencor Corporation | Visual feedback for inspection algorithms and filters |
| US10330608B2 (en) | 2012-05-11 | 2019-06-25 | Kla-Tencor Corporation | Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools |
| US8826200B2 (en) | 2012-05-25 | 2014-09-02 | Kla-Tencor Corp. | Alteration for wafer inspection |
| US9053390B2 (en) | 2012-08-14 | 2015-06-09 | Kla-Tencor Corporation | Automated inspection scenario generation |
-
2012
- 2012-04-19 US US13/451,500 patent/US9715723B2/en active Active
-
2013
- 2013-04-18 JP JP2013099681A patent/JP2013224942A/ja active Pending
- 2013-04-19 KR KR1020130043453A patent/KR102110755B1/ko active Active
- 2013-04-19 TW TW102114047A patent/TWI585397B/zh active
-
2018
- 2018-05-17 JP JP2018095319A patent/JP6905954B2/ja active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050216426A1 (en) * | 2001-05-18 | 2005-09-29 | Weston Jason Aaron E | Methods for feature selection in a learning machine |
| US20050169517A1 (en) * | 2004-01-19 | 2005-08-04 | Konica Minolta Medical & Graphic, Inc. | Medical image processing apparatus |
| US20110026804A1 (en) * | 2009-08-03 | 2011-02-03 | Sina Jahanbin | Detection of Textural Defects Using a One Class Support Vector Machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230064416A (ko) * | 2021-11-03 | 2023-05-10 | 한국교통대학교산학협력단 | 전력 기기의 결함 진단 장치 및 방법 |
| KR102724712B1 (ko) * | 2021-11-03 | 2024-11-01 | 국립한국교통대학교산학협력단 | 전력 기기의 결함 진단 장치 및 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6905954B2 (ja) | 2021-07-21 |
| TWI585397B (zh) | 2017-06-01 |
| US20130279795A1 (en) | 2013-10-24 |
| JP2013224942A (ja) | 2013-10-31 |
| JP2018128468A (ja) | 2018-08-16 |
| KR20130118275A (ko) | 2013-10-29 |
| US9715723B2 (en) | 2017-07-25 |
| TW201350836A (zh) | 2013-12-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102110755B1 (ko) | 자동 결함 분류를 위한 알려지지 않은 결함 리젝션의 최적화 | |
| KR102137184B1 (ko) | 자동 및 수동 결함 분류의 통합 | |
| US9607233B2 (en) | Classifier readiness and maintenance in automatic defect classification | |
| KR102224601B1 (ko) | 자동 분류를 위한 파라미터들의 튜닝 | |
| US10885618B2 (en) | Inspection apparatus, data generation apparatus, data generation method, and data generation program | |
| TWI416346B (zh) | 具最佳化純度的瑕疵分級方法 | |
| CN118196555B (zh) | 生成可用于检查半导体样本的训练数据 | |
| JP7286290B2 (ja) | 半導体試料の欠陥を分類する方法およびそのシステム | |
| US20230148321A1 (en) | Method for artificial intelligence (ai) model selection | |
| TWI889675B (zh) | 基於機器學習之半導體樣本中的缺陷分類之方法、系統及非暫態電腦可讀取媒體 | |
| KR102835355B1 (ko) | 인공 지능 모델들을 사용한 자동 검사 | |
| CN112805719B (zh) | 分类半导体样本中的缺陷 | |
| US20260120871A1 (en) | Systems and Methods for Processing Images of Cells to Identify Features of a Nucleus of the Cells | |
| KR102956982B1 (ko) | 반도체 시편에서의 결함들의 기계 학습 기반 분류 | |
| AU2021245268A1 (en) | Method for artificial intelligence (AI) model selection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R15-X000 | Change to inventor requested |
St.27 status event code: A-3-3-R10-R15-oth-X000 |
|
| R16-X000 | Change to inventor recorded |
St.27 status event code: A-3-3-R10-R16-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| R17 | Change to representative recorded |
Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R17-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-5-5-R10-R17-oth-X000 |