KR102109972B1 - Heater jacket for semiconductor processing - Google Patents

Abstract

The present invention discloses a heater jacket for semiconductor processing used in semiconductor or display panel manufacturing equipment and the like. The present invention, a tube made of a flexible material excellent in heat resistance, and a plurality of heat conduction balls filled in the tube, and an inner jacket surrounding a pipeline such as a gas line through which process gas is injected or an exhaust line through which process gas is discharged. ; It includes a heater having a heater that generates heat at a predetermined temperature inside, and is made of a flexible material having excellent heat resistance and heat insulation, and surrounding the inner jacket. The thermally conductive balls of the inner jacket are made of aluminum balls having a predetermined diameter. The outer jacket wraps the insulating material having one side in contact with the inner jacket, a heating wire installed to contact the other side of the insulating material, a first insulating material surrounding the exposed surface of the heating element, and a first insulating material. The main body has a second insulating layer and a second insulating layer, and the outer shell wraps around the second insulating layer, thereby establishing reliable heat insulation performance to keep the pipeline temperature stable.
The present invention enables uniform heat transfer to the pipeline, which can significantly increase the heat transfer efficiency, and of course, ensures close contact without regard to the shape even if the gas line is different in size or the valve connection is not constant in shape. Because it can be wrapped as much as possible, it can be used universally regardless of the heating target.

Description

Heater jacket for semiconductor processing

The present invention relates to a heater jacket that maintains a constant temperature of a pipeline that transports process gas or by-product gas in a semiconductor or display panel manufacturing process or the like, and more specifically, greatly improves heat transfer efficiency for the pipeline. It relates to a heater jacket for a semiconductor process that can be augmented, of course, capable of uniform heat transfer, and can be wrapped so that it is tightly adhered to regardless of the shape of the valve, even if the shape is not constant, such as a valve connection part.

In a semiconductor manufacturing process or a display panel manufacturing process, it is common to use process gas for thin film deposition and etching.

For example, the semiconductor manufacturing process is divided into a pre-process and a post-process. The previous process refers to a physical / chemical process of depositing and etching a thin film on a wafer to manufacture a semiconductor chip, and the subsequent process is a lead frame manufactured by cutting the wafer produced in the previous process to a specific standard. Refers to the manufacturing process of a package that is placed on and molded after wire bonding.

In the semiconductor manufacturing process, the entire process is performed by introducing a wafer into a process chamber that provides a space for a process to be performed, and a silane that forms a working atmosphere to deposit and etch a thin film on the wafer. After the process gas such as arsine and boron chloride and hydrogen is injected into the chamber, a chip manufacturing process is performed.

The process gas used for thin film deposition and the like is a liquid source, and liquid sources having a low vapor pressure are vaporized by heating, and then the vaporized gas is moved through the gas line to the process chamber.

At this time, when the temperature of the gas line is low, the vaporized source gas condenses again and accumulates in the gas line, thereby reducing the amount of source gas supplied to the reaction chamber, thereby causing defects in the deposited thin film.

Therefore, it is necessary to accurately control the temperature of the gas line to a desired temperature, and for this purpose, a heater jacket is mounted on the gas line.

Meanwhile, during the entire process, a large amount of toxic gas containing various ignitable gases, corrosive foreign substances, and toxic components is generated inside the process chamber. Accordingly, the semiconductor manufacturing apparatus is equipped with a scrubber for purifying and releasing harmful gases generated during the process.

However, since such a scrubber captures and purifies only the reaction by-products in the gas form, when the reaction by-products proceed to the outside of the process chamber, they are condensed according to the temperature drop to solidify in the form of powders and adhere to the exhaust line.

Then, as the exhaust pressure rises, it is introduced into the vacuum pump to cause a failure of the pump, or to cause serious problems such as polluting the wafer by refluxing harmful gases into the process chamber.

Accordingly, equipment using process gas, such as display panel manufacturing equipment or semiconductor manufacturing equipment, heats the exhaust line to maintain a constant temperature by heating the exhaust line to prevent reaction by-products from being generated inside the exhaust line through which process gas is discharged. The state is equipped with a heater jacket.

An example of such a heater jacket is Korean Patent Publication No. 10-2009-0116339, which is a silicone jacket having an annular silicone jacket with a heating coil installed inside and an annular inside to surround the pipe. It is provided with an aluminum block positioned between the pipe and the pipe to promote uniform heat transfer.

However, such a conventional heater jacket is not versatile because the aluminum block for transferring heat of the heating coil to the pipe is configured in a shape corresponding to the external shape of the pipe, and accordingly, the heater jacket must be provided for each size of the pipe. There is a problem.

In particular, since the aluminum block has no flexibility, for example, there is a problem that it cannot be applied to the valve installation part as it is, and this is accompanied by the complexity of manufacturing the aluminum block to match the valve shape, as well as valves of various sizes and shapes. There is an unreasonable problem in that it is difficult to manufacture and requires a lot of cost because a number of heater jackets must be manufactured in accordance with this.

In addition, in Korean Patent Publication Nos. 10-2012-0029494 and 10-2009-0053997, heater jackets formed in a form corresponding to the valve portion of the process gas line are also presented, but these are also the same problems as the aforementioned prior art. Is holding.

1. Korea Patent Publication 10-2009-0116339 2. Korean Patent Publication No. 10-2009-0053997 3. Korean Patent Publication No. 10-2012-0029494

The present invention was created to solve the above-described conventional problems, and it is possible to uniformly transfer heat to a pipeline such as a gas line through which process gas is injected into a process chamber or an exhaust line through which process gas is discharged from the chamber, thereby allowing heat transfer efficiency. Of course, it can be greatly increased, and even if the pipeline size is different or the external shape is not constant, such as a valve connection part, it can be wrapped so that it can be reliably adhered to regardless of the external shape. The object is to provide a heater jacket for the purpose.

The heater jacket for a semiconductor process according to the present invention for achieving the above object is made of a tube made of a flexible material having excellent heat resistance, and a plurality of heat conduction balls having a predetermined diameter, which can be freely deformed. An inner jacket designed to surround a pipeline such as a gas line through which process gas is injected or an exhaust line through which process gas is discharged by arbitrary molding; An insulating material having one surface in contact with the inner jacket, a heating wire installed to contact the other surface of the insulating material, a first insulating material surrounding the exposed surface of the heated wire, and a second insulating material surrounding the first insulating material It is made of an outer heat insulating material and an outer jacket surrounding the inner jacket by being provided with an outer shell surrounding the second heat insulating material, and being freely deformable.

According to a preferred feature of the present invention, the heat-conducting ball of the inner jacket is made of aluminum balls having a predetermined diameter, thereby guaranteeing excellent heat-transfer performance.

Here, preferably, in the case of an insulating material and an outer sheath, it is composed of polytetrafluoroethylene (PTFE), a strong, tough and smooth non-flammable resin called so-called 'teflon', and the first heat insulating material has excellent heat insulation performance and heat resistance. It may be composed of a glass felt (glass felt) having both the insulation and the second insulating material may be composed of glass fibers having excellent heat insulation, heat resistance and durability.

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According to another preferred feature of the invention, the outer jacket can be made of a silicone rubber heater.

According to the heater jacket for a semiconductor process according to the present invention configured as described above, the inner jacket surrounding the gas line or the exhaust line is filled with a large number of aluminum balls having excellent heat transfer rates in a flexible tube, so that it can be freely deformed and external. Since the jacket also has flexibility, it is possible to cover as much uniform contact as possible over the entire area regardless of the appearance of the pipeline, such as a gas line or an exhaust line, especially a valve.

Accordingly, it is possible to conveniently use a general purpose without having to have different heater jackets according to the size of the pipeline or the shape of the valve as in the prior art, and uniformly heat the entire pipeline by a plurality of aluminum balls having excellent heat transfer rates. It is possible to improve the heat transfer efficiency.

In addition, since the outer jacket is composed of multiple overlapping members with excellent insulation, heat resistance, and insulation, it exerts a warm insulation effect, so that the temperature of the gas line in which semiconductor process gas is injected or the exhaust line through which process gas is discharged is very stable. It can be maintained.

Therefore, the present invention has a very excellent effect that greatly contributes to the reliability and safety of the heater jacket for semiconductor processing, as well as to improve the versatility and manufacturability, as well as to reduce costs.

1 is a partially enlarged cross-sectional view schematically showing a heater jacket for a semiconductor process according to the present invention,
FIG. 2 is a partially enlarged cross-sectional view taken along line II-II of FIG. 1;
Figure 3 is a cross-sectional view showing a state in which the heater jacket according to the present invention is installed on the valve portion of the pipeline.

These specific features and other advantages of the present invention will become more apparent from the description of the preferred embodiment below with reference to the accompanying drawings.

1 to 3, the heater jacket 1 for a semiconductor process according to the present invention includes an inner jacket 10 that wraps in contact with an outer surface of a pipeline such as a gas line through which process gas is injected or an exhaust line through which process gas is discharged. ), And a flexible outer jacket 20 surrounding the outside of the inner jacket 10 by incorporating a heater.

The inner jacket 10 consists of a tube 11 made of a flexible material that can be freely deformed, and a plurality of heat conduction balls 12 filled inside the tube 11. The tube 11 may be made of various materials, taking into account the characteristics of transferring the heat of the heater to the pipes (P) and valves (V) of the pipeline, a material having excellent heat resistance and sufficient rigidity and durability, For example, it may be desirable to be composed of a PTFE sheet or a silicone sheet.

As is well known, PTFE is a non-flammable resin having a strong, tough and smooth surface, and is widely used in the field of mechanical devices, and may be suitable as a tube 11 of the inner jacket 10, which must always be exposed to high heat.

The heat conduction ball 12 may be any material as long as it can efficiently transfer heat of the heater to the pipe P or the like. For example, the heat conduction ball 12 may be made of aluminum ball that is lightweight and has excellent heat transfer rate.

It is preferable that the thermal conductive balls 12 can be uniformly closely adhered to the outer surface of the pipe P or the valve V for uniform and efficient heat transfer while giving shape freedom to be freely deformed to the inner jacket 10. Bar, it is advantageous to be configured with a diameter as small as possible so that the gap between each of the heat-conducting balls 12 is minimized, but it can be determined in consideration of both stiffness and durability sufficient to withstand high heat.

Accordingly, the diameter of the heat-conducting ball 12 may be preferably configured to approximately 2 to 3 mm.

The outer jacket 20 has an insulating material 21 wrapped around one side in contact with the outer surface of the inner jacket 10 and a heating wire 22 installed to contact the other side of the insulating material 21 to generate heat at a predetermined temperature. And, wrap the first insulating material 23 surrounding the exposed surface of the heating wire 22, and the second insulating material 24 surrounding the first insulating material 23 and the second insulating material 24 It is provided with a protective sheath (25).

The insulating material 21 is in direct contact with the heating wire 22 which generates heat at a high temperature by electricity, and thus has good heat resistance, electrical insulation, and sufficient durability. For this purpose, the insulating material 21 is preferably made of PTFE fibers.

The heating wire 22 may be formed of a well-known nickel-crum wire in consideration of excellent heat generation performance and durability. In order to prevent overheating of the hot wire 22 over a predetermined temperature, a temperature control means, for example, a bimetal 30, may be connected to the power supply to interrupt power application.

Since the first heat insulating material 23 shields heat generated by direct contact with the outside of the heating wire 22 from being lost to the outside, excellent heat resistance, electrical insulation, and heat insulating properties are required. To this end, the first heat insulating material 23 may be preferably made of, for example, glass felt having both heat resistance, insulation, and heat insulation as well as appropriate elasticity.

The second heat insulating material 24 is for further improving the heat insulation performance while protecting the first heat insulating material 23, and is preferably made of glass fiber having excellent heat resistance, insulation properties, and durability.

The outer cover 25 performs the final insulation function in contact with the outside air while enclosing the above-described components of the heater jacket 1 as a whole, and it is necessary to have sufficient rigidity and durability as well as thermal insulation. To this end, the sheath 25 is preferably composed of a PTFE sheet.

On the other hand, such an outer jacket of the present invention is not shown separately, it may be made of a known silicone rubber heater (silicone rubber heater). As is well known, the silicone rubber heater has sufficient flexibility, the inner jacket of the present invention Of course, it can be easily applied to pipelines such as gas lines and exhaust lines with (10).

The heater jacket 1 of the present invention is a pipeline of semiconductor or display panel manufacturing equipment, that is, a gas line in which process gas is injected or an exhaust line of the exhaust line through which the process gas is discharged, such as piping (P) or valve (V). After being wound on, it may be fixed by a predetermined binding means 40.

The binding means 40 may be any form as long as the heater jacket 1 can be fixed to the pipeline, and may be formed in various forms, for example, a band clamp, a velcro fastener, or a zipper.

The heater jacket (1) for semiconductor processing according to the present invention having such a structural feature is a flexible tube () that the inner jacket (10) wraps around and covers the outer circumference of the pipeline (P) or valve (V) of the pipeline ( 11) In addition to filling a plurality of heat transfer balls (12) made of aluminum with excellent heat transfer rate, the outer jacket (20) also has flexibility, so it can be freely deformed.

Accordingly, the size of the pipeline P of the pipeline, as well as the shape of the valve V having various shapes, can be uniformly contacted and wrapped as much as possible over the entire position without regard to the shape of the valve V.

Accordingly, it is possible to conveniently use a general purpose anywhere in the process gas line without having to have different heater jackets according to the size of the pipe (P) or the shape of the valve (V), and a large number of aluminum heat transfer balls with excellent heat transfer rate ( By 12), it is possible to uniformly heat the entire gas line and the exhaust line while greatly improving the heat transfer efficiency.

In addition, the outer jacket 20 is composed of a plurality of overlapping members having excellent heat insulation, heat resistance, insulation, and durability, and is simply composed of a silicon jacket. However, it is possible to keep the temperature of the exhaust line very stable.

The present invention as described and illustrated above is for illustrative purposes only, and the present invention is not limited thereto, and it is revealed that the present invention can be modified in various forms without departing from the gist of the present invention.

One ; Heater jacket 10; Inner jacket
11; Tube 12; Heat transfer ball
20; Outer jacket 21; Insulation material
22; Hot wire 23; 1st insulation material
24; 2nd heat insulating material 25; coat
30: bimetal 40: binding means
P; Piping V; valve

Claims (4)

A tube made of a flexible material having excellent heat resistance and a plurality of heat conduction balls having a predetermined diameter are filled in the tube, so that it can be freely deformed so that a gas line or process gas through which process gas is injected by arbitrary molding is discharged. An inner jacket designed to cover a pipeline such as an exhaust line;
An insulating material having one surface in contact with the inner jacket, a heating wire installed to contact the other surface of the insulating material, a first insulating material surrounding the exposed surface of the heated wire, and a second insulating material surrounding the first insulating material A heater jacket for a semiconductor process comprising a heat insulating material and an outer jacket surrounding the inner jacket to be freely deformable and provided with an outer shell surrounding the second heat insulating material.

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