KR102106431B1 - Conductive adhesive layer composition for electromagnetic wave shielding film and electromagnetic wave shielding film comprising the same - Google Patents

Abstract

Herein, as the conductive adhesive layer composition for an electromagnetic wave shielding film, a polymer resin; At least one of a triazine-based compound and an imidazole-based compound; And a metal powder, wherein the content of at least one of the triazine-based compound and the imidazole-based compound is 0.1 to 10 parts by weight based on 100 parts by weight of the polymer resin, and a conductive adhesive layer composition for an electromagnetic wave shielding film is disclosed. .

Description

Conductive adhesive layer composition for electromagnetic shielding film and electromagnetic shielding film containing the same {CONDUCTIVE ADHESIVE LAYER COMPOSITION FOR ELECTROMAGNETIC WAVE SHIELDING FILM AND ELECTROMAGNETIC WAVE SHIELDING FILM COMPRISING THE SAME}

The present specification is a conductive adhesive layer composition for an electromagnetic wave shielding film, a polymer resin; At least one of a triazine-based compound and an imidazole-based compound; And a metal powder, wherein the content of at least one of the triazine-based compound and the imidazole-based compound is 0.1 to 10 parts by weight based on 100 parts by weight of the polymer resin, and the conductive adhesive layer composition for an electromagnetic wave shielding film includes the same It relates to an electromagnetic wave shielding film.

Recently, as the directness of the substrate increases due to the development of technology, a conductive adhesive having excellent conductivity is required. In particular, recently, FPCB (FLEXIBLE PRINTED CIRCUITS BOARD) is used in various fields. As electronic products are gradually becoming smaller and lighter, they are developed electronic parts with excellent workability, strong heat resistance, bending resistance, chemical resistance, and strong heat resistance. FPCB is suitable.

Specifically, these FPCBs are key parts of all electronic products, such as cameras, computer and peripheral devices, hand phones, video and audio devices, and CAMCORDER. It is widely used in PRINTER, DVD, TFT LCD, satellite equipment, military equipment, and medical equipment. FPCB is capable of 3D wiring alone, and it is possible to downsize and lighten the device. And, FPCB has high durability against repeated bending, high-density wiring is possible, there is no wiring error, assembly is good, and reliability is high. In addition, FPCB has the advantage that it can be manufactured in a continuous production method.

In the case of FPCB, a conductive adhesive sheet used to electrically connect circuit boards such as flexible printed wiring boards (FPCs) and circuit components such as reinforcement plates, circuit boards, and circuit components are electrically interconnected. There is a need for a conductive adhesive used in circuit boards. As such, the conductive adhesive is used to fill the holes of the substrate and the like, and it is generally used to include conductive particles in the thermosetting resin, and metal powder or the like is used as the conductive particles.

Increasingly, as the directness of the substrate increases with the development of technology, a conductive adhesive having excellent conductivity is required, but it is difficult to manufacture an adhesive having excellent adhesion with a metal while exhibiting conductivity. Particularly, when evaluating the heat resistance of the shielding film, the gas of the conductive adhesive generated by the high temperature may be blocked from flowing to the insulating layer due to the metal layer, and thereby, it may be ejected between the metal layer and the adhesive layer having weak adhesive strength and peeled off from each other. . Therefore, it is necessary to develop a conductive adhesive that is excellent in conductivity and prevents the peeling.

Japanese Registered Patent No. 5525198

The present invention is to provide a conductive adhesive layer composition for an electromagnetic wave shielding film containing one or more of a triazine-based compound and an imidazole-based compound in a specific content, and improving adhesion through coordination with a metal layer.

In exemplary embodiments of the present invention, a conductive adhesive layer composition for an electromagnetic wave shielding film, comprising: a polymer resin; At least one of a triazine-based compound and an imidazole-based compound; And a metal powder, wherein the content of at least one of the triazine-based compound and the imidazole-based compound is 0.1 to 10 parts by weight based on 100 parts by weight of the polymer resin, and provides a conductive adhesive layer composition for an electromagnetic wave shielding film. .

In another exemplary embodiment of the present invention, a conductive adhesive layer comprising the aforementioned conductive adhesive layer composition; A shielding layer comprising a metal; And insulating layer; provides an electromagnetic shielding film comprising a.

According to exemplary embodiments of the present invention, the conductive adhesive layer composition for an electromagnetic wave shielding film includes a specific amount of a triazine-based compound and an imidazole-based compound, and a shielding layer (metal layer) contacting the conductive adhesive layer in the electromagnetic wave shielding film. By coordination with the metal, peeling does not occur with each other.

1 is an electromagnetic wave shielding film according to an embodiment of the present invention.

In the present specification, when a part “includes” a certain component, it means that the component may further include other components, not exclude other components, unless otherwise stated.

Hereinafter, exemplary embodiments of the present invention will be described in detail.

In exemplary embodiments of the present invention, as a conductive adhesive layer composition for an electromagnetic wave shielding film, a polymer resin; At least one of a triazine-based compound and an imidazole-based compound; And a metal powder, wherein the content of at least one of the triazine-based compound and the imidazole-based compound is 0.1 to 10 parts by weight based on 100 parts by weight of the polymer resin, and provides a conductive adhesive layer composition for an electromagnetic wave shielding film. .

In order to improve the adhesion between the metal and the conductive adhesive, the conductive adhesive layer composition for an electromagnetic wave shielding film of the present invention adds one or more of a triazine-based compound and an imidazole-based compound to induce coordination bonding with a metal of the metal layer. More specifically, when evaluating the heat resistance of a general electromagnetic wave shielding film, the gas of the conductive adhesive generated by the high temperature is blocked from flowing to the insulating layer due to the metal layer. Due to this, the gas is often ejected between the weakly adhesive metal layer and the adhesive layer to cause peeling. In the case of the present invention, the adhesion between the conductive adhesive composition and the metal was improved through coordination bonding between at least one of the triazine-based compound and the imidazole-based compound and the metal so that peeling did not occur between the metal layer and the conductive adhesive layer.

In an exemplary embodiment, the chemical formula of the triazine-based compound and the imidazole-based compound may be as follows, specifically, the triazine-based compound may be a product of Shikoku Chemical's VD-5, and the imidazole-based compound of Shikoku Chemical It can be a 2MUSIZ product.

[Triazine-based compound] [Imidazole-based compound]

As the polymer resin, any kind of resin may be used as long as it is a resin having excellent adhesion and heat resistance, and any metal that has excellent electrical conductivity can be used as a metal powder for expressing conductivity. For example, as a polyester resin, among the Toyobo VYLON series It may be 1 or more.

The content of at least one of the triazine-based compound and the imidazole-based compound may be 0.1 to 10 parts by weight based on 100 parts by weight of the polymer resin, for example, 0.5 to 9, 1 to 8, 2 to 7, or 3 to 6 have. If the content is less than 0.1 parts by weight, the adhesive strength may be insignificant, and if it is more than 10 parts by weight, the adhesive force converges and the metal powder is reduced in the total mixing ratio, so that electrical conductivity may be reduced.

In an exemplary embodiment, the content of the metal powder may be 20 to 40 parts by weight of the polymer resin 100 parts by weight, for example, 22 to 38, 24 to 36, or 26 to 34 parts. If the content is less than 20 parts by weight, the electrical conductivity may be lowered, and if it is more than 40 parts by weight, the polymer resin content may be relatively reduced and the adhesive strength may be reduced.

In exemplary embodiments of the present invention, a conductive adhesive layer comprising the aforementioned conductive adhesive layer composition; A shielding layer comprising a metal; And insulating layer; provides an electromagnetic shielding film comprising a.

1 is a cross-sectional view of a conductive adhesive layer composition for an electromagnetic wave shielding film according to an exemplary form of the present invention.

Referring to FIG. 1, the electromagnetic wave shielding film according to the present invention includes a conductive adhesive layer 10 including a conductive adhesive layer composition, a shielding layer 20 including a metal, and an insulating layer 30, and the shielding layer A silver metal layer 21 and a pretreatment layer 22 may be included.

In an exemplary embodiment, the electromagnetic wave shielding film may be for a flexible printed circuit board (FPCB), or may be for high-speed transmission. More specifically, the electromagnetic wave shielding film may be applied to electric and electronic components and antennas for wireless communication.

The electromagnetic wave shielding film of the present invention includes a metal in the electromagnetic wave shielding layer to exhibit a shielding rate of 80 dB (@ 1.5 GHz) or higher, and a triazine compound or imida in the conductive adhesive to solve the weak adhesion between the metal and the conductive adhesive The adhesion was improved by inducing a coordination bond with the metal by adding a sol-based compound.

In an exemplary embodiment, the shielding layer may be used as long as it is a metal having electromagnetic wave shielding properties, and may be copper (Cu). The method of forming the metal layer is not limited to this, as long as it can produce a satisfactory thickness such as plating, vapor deposition, and metal foil. The thickness of the shielding layer may be 2 to 4㎛. When the thickness is less than 2um, shielding rate of 80dB (@ 1.5GHz) or more is difficult to implement, and when it is more than 4um, the flexibility is poor and workability is poor.

In an exemplary embodiment, the insulating layer may be a PI film or a PI varnish, and any insulating material and heat resistance may be used. The thickness of the insulating layer may be 10 to 15㎛, when the thickness is more than 5um, the insulating properties and step followability may be lowered, and when it is more than 15um, the filling property may be lowered.

In an exemplary embodiment, the triazine-based compound or the imidazole-based compound included in the conductive adhesive layer composition may coordinate with the metal contained in the shielding layer. As described above, through coordination bonding between at least one of the triazine-based compound and the imidazole-based compound in the conductive adhesive layer composition and the metal contained in the shielding layer, the adhesion between the conductive adhesive composition and the metal is improved to improve the adhesion between the metal layer and the conductive adhesive layer. No peeling occurred.

In addition, the triazine-based compound or imidazole-based compound included in the conductive adhesive layer composition coordinates with the copper contained in the copper foil laminate (CCL) exposed on the FPCB surface to which the shielding film is attached, as well as the metal contained in the shielding layer. Can be increased. Therefore, the compound included in the conductive adhesive layer can act on both metal layers.

In an exemplary embodiment, the shielding layer may include a metal layer and a pretreatment layer, and the pretreatment layer may be pretreated with Ni / Cr. Due to the pre-treatment, adhesion between the insulating layer and the metal layer can be improved.

Example

Preparation of conductive adhesive layer composition for electromagnetic wave shielding film

With the composition of Table 1, a conductive adhesive layer composition for an electromagnetic wave shielding film was prepared. Specifically, the conductive adhesive layer is mixed at a weight ratio of 100 parts by weight of polyester resin (Toyobo VYLON series), 30 parts by weight of copper powder, and triazine-based compound (VD-5 / Shikoku chemical) 0.05 to 15 (compound content in Table 1) After that, the agitator (Agitator mixer) was used to perform stirring at least 1000 RPM for 1 hour. After stirring, degassing was performed under reduced pressure for 10 minutes to prepare an adhesive layer composition.

Triazine-based compound
(Parts by weight) Polymer resin (polyester resin)
(Parts by weight) Metal powder
(Parts by weight) Example 1 0.1 100 30 Example 2 One 100 30 Example 3 5 100 30 Example 4 10 100 30 Comparative Example 1 0 100 30 Comparative Example 2 0.05 100 30 Comparative Example 3 11 100 30 Comparative Example 4 15 100 30

Electromagnetic shielding film production

A 12.5um PI film was used as the insulating layer, and Ni / Cr was deposited on the PI film to form a pretreatment layer, and Cu plating, a shielding layer, was performed 2-3um.

Using the film prepared according to the above method as a coating film, a coating solution in which a polyester resin / copper powder / triazine or imidazole compound was mixed was subjected to comma coating and dried to form a conductive adhesive layer.

Evaluation of film performance for electromagnetic shielding

With respect to the electromagnetic wave shielding film produced in the above example, it was determined whether or not it was determined by measuring a lead test and an electric resistance value (lead 10s or more and resistance 0.0 or less) as follows. Specifically, the prepared shielding film was attached to a test coupon using a hot press (155 ° C, 45 kg / cm ² , 80 min) to prepare a sample for evaluation. The pressed sample was measured for electrical resistance on the exposed copper surface of the test coupon using an electrical resistance tester. Subsequently, the sample for evaluation was floated in a solder bath set at 288 ° C (floating), and the change in appearance of the shielding film was observed while confirming the time for the shielding film to swell or fall off.

Triazine-based compound
(Parts by weight Lead test
(sec)
(288 ℃) Electrical resistance Judgment
(More than 10 s
Resistance 0.0 or less) Example 1 0.1 25 0.0 pass Example 2 One 40 0.0 pass Example 3 5 41 0.0 pass Example 4 10 42 0.0 pass Comparative Example 1 0 7 0.0 fail Comparative Example 2 0.05 8 0.0 fail Comparative Example 3 11 41 0.1 fail Comparative Example 4 15 40 0.2 fail

Referring to the above table, the electromagnetic wave shielding film prepared by using the conductive adhesive composition containing the triazine-based compound within 0.1 to 10 parts by weight received both passing points in the lead bath test and electrical resistance measurement, but does not include it at all or the content outside the above range In the case of Comparative Examples 1 to 4, including, the lead test result was not good, or the electrical resistance exceeded 0.0, and thus failed.

10: conductive adhesive layer
20: shielding layer
30: insulating layer
21: metal layer
22: pretreatment layer
100: electromagnetic wave shielding film

Claims (9)

As a conductive adhesive layer composition for an electromagnetic wave shielding film,
Polymer resins;
At least one of a triazine-based compound and an imidazole-based compound; And
Metal powder; containing,
The content of at least one of the triazine-based compound and the imidazole-based compound is 0.1 to 10 parts by weight based on 100 parts by weight of the polymer resin,
The content of the metal powder is characterized in that 20 to 40 parts by weight based on 100 parts by weight of the polymer resin, a conductive adhesive layer composition for an electromagnetic wave shielding film. delete A conductive adhesive layer comprising the conductive adhesive layer composition according to claim 1;
A shielding layer comprising a metal; And
Insulation layer; containing electromagnetic shielding film. According to claim 3,
The electromagnetic wave shielding film, characterized in that for the flexible printed circuit board (FPCB), electromagnetic wave shielding film. According to claim 3,
The electromagnetic wave shielding film, characterized in that for high-speed transmission, electromagnetic wave shielding film. According to claim 3,
The thickness of the shielding layer is characterized in that 2 to 4㎛, electromagnetic wave shielding film. According to claim 3,
The thickness of the insulating layer is characterized in that 10 to 15㎛, electromagnetic wave shielding film. According to claim 3,
Triazine-based compound or imidazole-based compound included in the conductive adhesive layer composition is characterized in that it coordinates with the metal contained in the shielding layer, electromagnetic wave shielding film. According to claim 3,
The shielding layer is characterized in that the pre-treatment with Ni / Cr, electromagnetic shielding film.

Images