KR102104489B1 - Led housing with excellent thermo-shield functions and led lighting device comprising the same - Google Patents

Abstract

The present invention relates to an LED housing with excellent thermal insulation performance and an LED lighting device including the same. The LED housing comprises: a housing body (310) accommodating a PCB (100) and an LED device (200) mounted on the PCB (100); and a thermal insulation coating layer (320) formed on at least one surface of the housing body (310) and blocking inflow of external heat. According to one embodiment of the present invention, the thermal insulation coating layer (320) comprises: an infrared absorption layer (322) formed on the outer surface of the housing body (310) and absorbing infrared rays; and an infrared reflection layer (321) formed on the infrared absorption layer (322) and reflecting the infrared ray. Accordingly, heat inflow from the outside is blocked by the thermal insulation coating layer (320), thereby providing an effect of preventing performance degradation, lifespan reduction, and the like of the LED device by external heat. Moreover, the thermal insulation coating layer (320) includes the infrared reflection layer (321) and/or the infrared absorption layer (322) having a predetermined composition, thereby effectively improving thermal insulation performance.

Description

LED housing with excellent thermal insulation performance and LED lighting device including the same {LED HOUSING WITH EXCELLENT THERMO-SHIELD FUNCTIONS AND LED LIGHTING DEVICE COMPRISING THE SAME}

The present invention relates to an LED lighting device used in an LED lighting device and an LED lighting device including the same, and according to one embodiment, by forming a heat shield coating layer to block external heat from entering the surface of the LED housing, the exterior It relates to an LED housing having an excellent heat shielding performance and an LED lighting device including the same, which can prevent performance degradation and shortening of the life of the LED device due to heat.

A lighting device using a light emitting diode ("LED") has low power consumption and has advantages such as long life characteristics and eco-friendliness. Accordingly, LED lighting devices using LEDs are widely used not only in general buildings, but also in almost all industrial fields such as automobiles and airplanes, and their demand is increasing.

In general, an LED lighting device includes a printed circuit board (PCB), an LED element mounted on the printed circuit board (PCB), and an LED housing in which the printed circuit board (PCB) and LED elements are housed (built-in). housing) (or casing).

The LED element includes at least an LED chip, which also has a structure in which component elements such as a driver IC, a protection chip and / or a constant current chip are packaged depending on the product. The LED element is electrically connected and mounted (fixed) on a printed circuit board (PCB) through soldering or wire bonding. The printed circuit board (PCB) and the LED element are protected by being housed (built-in) in the LED housing.

In addition, the LED lighting device has a heat dissipation structure. The LED element is vulnerable to heat. In the LED element, for example, performance is reduced (reduction in luminance, etc.) due to heat generated from the LED element itself, and life is shortened, and in some cases, a failure occurs. Accordingly, a heat dissipation structure (or heat sink) for discharging (air cooling) heat generated from the LED elements is formed in the LED lighting device.

Conventionally, most of the heat dissipation structure has a structure in which a heat conductive heat dissipation plate is installed at the bottom of a printed circuit board (PCB), and heat dissipation fins are formed on one surface of the heat dissipation plate to increase the heat dissipation area. In addition, a technique has been proposed in which a through hole through which air passes is formed in the heat sink or heat sink fin. For example, Korean Patent Publication No. 10-2015-0060499, Korean Patent Publication No. 10-2016-0106431, Korean Patent Registration No. 10-1689592, Korean Patent Registration No. 10-1870596 and Korean Patent Registration No. 10- In 1980584, technology related to the above is presented.

In relation to the heat dissipation of the LED lighting device, conventionally, as above, the heat dissipation structure for dissipating (cooling) heat generated by the LED element itself is concentrated. However, in recent years, the temperature in summer has risen both domestically and globally, and in the summer, solar energy in Korea averages 5,900 Kcal / m2 per day, and it is known that the room temperature rises near 40 ° C without a separate cooling device. As described above, when the indoor temperature rises to a high temperature of 40 ° C. due to solar heat in summer, high temperature heat is transmitted to the LED lighting device, so that the temperature of the LED element rises rapidly, deteriorating performance and shortening the service life.

In addition, phenomena such as deterioration of the performance and shortening of the lifespan of an LED device due to external high heat may be caused not only by solar heat in summer, but also by a heat source (heater or mechanical device that emits heat) installed around the LED lighting device. have.

Accordingly, for the performance and long life characteristics of the LED lighting device, it is important not only to quickly release heat generated from the LED element itself, but also to prevent external heat from being transferred to the interior of the LED lighting device.

Korean Patent Publication No. 10-2015-0060499 Korean Patent Publication No. 10-2016-0106431 Korean Registered Patent No. 10-1689592 Korean Registered Patent No. 10-1870596 Korean Registered Patent No. 10-1980584

Accordingly, an object of the present invention is to provide an LED housing having an excellent heat shielding performance and an LED lighting device including the same, which can prevent performance degradation and shortening of the lifespan of the LED device due to external heat.

The present invention to achieve the above object,

A housing body accommodating a printed circuit board and an LED element mounted on the printed circuit board; And

It is formed on at least one surface of the housing body, and provides an LED housing including a heat shield coating layer to block external heat from entering.

According to one embodiment, the heat shield coating layer is an infrared reflecting layer for reflecting infrared rays; And an infrared absorbing layer that absorbs infrared rays. At this time, the infrared absorbing layer is formed on the outer surface of the housing body, and the infrared reflecting layer may be formed on the surface of the infrared absorbing layer.

In addition, the present invention provides an LED lighting device comprising the LED housing according to the present invention.

According to the present invention, at least it has excellent heat shielding performance. Specifically, according to the present invention, the heat inflow to the outside is blocked by the heat shield coating layer, and thus, it has an effect of preventing performance degradation and shortening of life of the LED device due to external heat. Further, according to the present invention, the heat shielding performance is effectively improved by including the infrared reflecting layer and / or the infrared absorbing layer having the specific composition.

1 is a cross-sectional configuration diagram of main parts of an LED lighting device according to a first embodiment of the present invention.
2 is a sectional view of the main parts of the LED housing constituting the LED lighting device according to the second embodiment of the present invention.
3 is a sectional view of the main parts of the LED housing constituting the LED lighting device according to the third embodiment of the present invention.
4 is a sectional view of the essential parts of an LED housing constituting an LED lighting device according to a fourth embodiment of the present invention.

The term "and / or" used in the present invention is used to mean including at least one or more of the components listed before and after. As used herein, the term "one or more" means one or more than two. The terms "first", "second", "one side" and "other side" used in the present invention are used to distinguish one component from another component, and each component is used in the above terms. It is not limited by.

In addition, the terms "formed on the top", "formed on the top (top)", "formed on the bottom (bottom)", "installed on the top", "installed on the top (top)" and "bottom ( "Installation on the lower side" does not mean that the components are directly stacked (installed), and includes the meaning that other components are further formed (installed) between the components. For example, "formed on" and "installed on" means that the first component and the second component are directly formed (installed), as well as the first component and the second component. It includes the meaning that a third component can be further formed (installed) between the elements.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The accompanying drawings illustrate exemplary embodiments of the present invention, which are provided only to aid in understanding of the present invention. In the accompanying drawings, the thickness may be enlarged to express each layer and region clearly, and the scope of the present invention is not limited by the thickness, size, and ratio indicated in the drawings. In addition, in describing embodiments of the present invention, detailed descriptions of related well-known general-purpose functions and / or configurations are omitted.

 The present invention is an LED (300) constituting the LED (LED) lighting device and the LED lighting device comprising the same, heat-resistant property that can prevent the performance degradation and shortening of the life of the LED element 200 due to external heat An LED lighting device including the LED housing 300 and the LED housing 300 is provided.

The LED lighting device (or LED light emitting device) according to the present invention emits LED light (light), and its application fields and uses are not limited. The LED lighting device according to the present invention includes being used (installed) in a general building, as well as a parking lot, a car, and an aircraft. In addition, the LED lighting device according to the present invention includes an LED lighting device using a DC power source and an LED lighting device using a battery as a power source.

1 is a cross-sectional configuration diagram of main parts of an LED lighting device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional configuration diagram of main parts of an LED housing 300 constituting an LED lighting device according to a second embodiment of the present invention. to be. And Figure 3 is a cross-sectional configuration of the main portion of the LED housing 300 constituting the LED lighting apparatus according to the third embodiment of the present invention, Figure 4 is a LED constituting the LED lighting apparatus according to the fourth embodiment of the present invention It is a sectional view of the principal portion of the housing 300. Hereinafter, the LED housing 300 according to the present invention will be described with reference to exemplary embodiments of the LED lighting device according to the present invention.

First, referring to FIG. 1, the LED lighting device according to the present invention includes a printed circuit board (PCB) 100 and at least one LED device mounted (fixed) on the printed circuit board (PCB) 100 ( 200) and the LED housing 300 for storing (built-in) the printed circuit board 100 and the LED element 200.

The printed circuit board 100 and the LED element 200 may be configured as usual, for example, a conductive circuit pattern is formed on one surface of the printed circuit board 100, and the printed circuit board 100 The LED element 200 may be electrically connected to and mounted (fixed) to the circuit pattern of. Further, the LED element 200 may be electrically connected to the circuit pattern of the printed circuit board 100, for example, by soldering, wire bonding, and / or conductive adhesive.

The LED element 200 includes at least an LED chip, which may have a structure in which component elements such as a driver IC, a protection chip and / or a constant current chip are packaged according to a product as usual. The LED chip may emit white light, blue light, green light and / or red light. Further, the LED device 200 may further include a device such as a capacitor, a transistor, and / or a resistor, depending on the case. One or two or more LED devices 200 may be mounted on the printed circuit board 100.

In addition, the LED lighting device according to the present invention may further include a heat dissipation structure in addition to the printed circuit board 100, the LED element 200, and the LED housing 300. The heat dissipation structure is for quickly dissipating (cooling) heat generated from the LED element 200 itself as usual, for example, it is installed under the printed circuit board 100 or the LED elements 200 It can be installed between the liver.

The heat dissipation structure may include, for example, a heat dissipation plate (not shown) installed under the printed circuit board 100; A heat radiation layer (not shown) formed on the printed circuit board 100 and formed in a predetermined pattern between the LED elements 200; And / or through-holes through which air passes. At this time, the heat sink may be formed of a heat sink fin as usual, and the through-hole may be formed in the heat sink or the housing 300.

The LED housing 300 may have a structure or shape capable of accommodating (built-in) the printed circuit board 100 and the LED device 200, which may be a printed circuit board 100 and the LED device 200 depending on the case. ) And may have a structure or shape capable of receiving (built-in) the heat dissipation structure (heat sink, etc.).

Referring to FIG. 1, according to an embodiment of the present invention, the LED housing 300 includes a housing main body 310 accommodating the printed circuit board 100 and the LED element 200 and the housing main body 310. And a heat shield coating layer 320 formed on at least one surface.

The housing body 310 is not particularly limited as long as it has a space to accommodate the printed circuit board 100 and the LED element 200. The housing body 310 may include, for example, a horizontal portion 312 and a vertical portion 314 formed at right angles from the horizontal portion 312. The housing body 310 may form an internal space in which the printed circuit board 100 and the LED element 200 can be accommodated by the horizontal portion 312 and the vertical portion 314 as described above.

In addition, the housing main body 310 may be composed of a metal material, a ceramic material or a synthetic resin material, which may be formed of, for example, a heat-resistant and / or heat-reflective metal material. The housing body 310 is, for example, made of iron (Fe), aluminum (Al), zinc (Zn), nickel (Ni), titanium (Ti), magnesium (Mg), and / or alloys thereof. , It may be composed of an oxide containing the metal element.

According to one embodiment, the housing body 310 is made of iron (Fe), aluminum (Al) or alloys thereof, or aluminum (Al), zinc (Zn) having high heat reflectivity on an iron (Fe) substrate ), Nickel (Ni), titanium (Ti), magnesium (Mg) and / or alloys thereof may be composed of a plated plated steel. According to a specific embodiment, the housing body 310 is a plated iron material, an iron (Fe) substrate based on iron (Fe), and an aluminum (Al) -zinc (Zn) plated on the iron (Fe) substrate. ) -Based alloy layer. At this time, the aluminum (Al) -zinc (Zn) -based alloy layer, the content of aluminum (Al) based on the total weight of the alloy layer is preferably 55% to 65% by weight. As the housing body 310, in the case of using a plated iron material plated with an aluminum (Al) -zinc (Zn) -based alloy as described above, economical efficiency is obtained by using inexpensive iron (Fe) as a base substrate. The Al) -zinc (Zn) -based alloy layer has excellent heat reflectivity and corrosion resistance.

The heat shield coating layer 320 is to block the external heat from entering, which is formed on at least one surface of the housing body (310). Specifically, the heat shield coating layer 320 may be formed on the outer surface and / or the inner surface of the housing body 310. The attached FIG. 1 illustrates a state in which the heat shield coating layer 320 is formed only on the outer surface of the housing body 310.

The thermal barrier coating layer 320 may be formed by coating a thermal barrier coating composition on the surface of the housing body 310. The thermal barrier coating layer 320 may be formed by coating a thermal barrier coating composition by spray coating and / or roll coating, but is not limited by these coating methods. In addition, the heat-resistant coating composition may be dried (cured) by a method such as natural drying, hot air drying, induction heating drying, and / or infrared drying after coating.

In the present invention, the heat shield coating layer 320 is not particularly limited as long as it prevents heat rise inside the LED lighting device by blocking heat that may be introduced from the outside, that is, heat rise of the LED element 200. Does not. The LED lighting device according to the present invention may be installed on, for example, a ceiling in a building interior, and specifically, the housing body 310 may be inserted and fixed in an installation space formed on the ceiling. At this time, when the heat in the room increases in the summer, the heat shield coating layer 320 blocks heat inflow to prevent deterioration in performance (reduction in brightness, etc.) and shortening of life of the LED device 200 due to high heat.

In addition, the form of heat transmitted to the object is mostly infrared. Infrared rays touch the surface of an object to cause vibration of molecules, thereby generating thermal energy. Due to this thermal energy, the temperature of the object increases, and the temperature inside the LED lighting device increases through conduction and convection. Accordingly, according to an embodiment of the present invention, the heat shield coating layer 320 has infrared blocking means that reflects infrared rays or absorbs infrared rays to prevent infrared rays from being transmitted to the interior of the LED lighting device.

Specifically, the heat shield coating layer 320, in accordance with an embodiment of the present invention, an infrared reflecting layer 321 for reflecting infrared rays flowing from the outside; And one or more selected from the infrared absorbing layer 322 absorbing infrared rays flowing from the outside. 2 to 4, the heat shield coating layer 320 may include at least one infrared reflecting layer 321 and / or at least one infrared absorbing layer 322.

According to the first embodiment of the present invention, the heat shield coating layer 320 includes an infrared reflecting layer 321 formed on the outer surface of the housing body 310 and an infrared absorbing layer 322 formed on the infrared reflecting layer 321. Each of these layers 321 and 322 may be at least one layer. Accordingly, the LED housing 300 may have a stacked structure including a housing body 310 / infrared reflecting layer 321 / infrared absorbing layer 322.

According to the second embodiment of the present invention, the heat shield coating layer 320 includes an infrared absorbing layer 322 formed on the outer surface of the housing body 310 and an infrared reflecting layer 321 formed on the infrared absorbing layer 322. Each of these layers 321 and 322 may be at least one layer. Accordingly, the LED housing 300 may have a stacked structure including the housing body 310 / infrared absorbing layer 322 / infrared reflecting layer 321.

According to the third embodiment of the present invention, the heat shield coating layer 320 includes a housing body 310 / infrared absorbing layer 322 / infrared reflecting layer 321 / infrared absorbing layer 322 / infrared reflecting layer 321 As a stacked structure, a plurality of the infrared reflecting layer 321 and the infrared absorbing layer 322 are formed in two or more layers, and these 321 and 322 may be alternately formed.

In addition, the heat shield coating layer 320 may further include a primer layer (not shown). The primer layer is for adhesion between each layer 310, 321 and 322, specifically between the housing body 310 and the infrared absorbing layer 322, and / or the infrared absorbing layer 322 and infrared It may be formed between the reflective layer 321. The primer layer may be one that can improve the adhesion between each layer 310, 321, and 322, which is, for example, a primer based on at least one selected from epoxy resin, urethane resin and / or acrylic resin, etc. It can be formed by applying (primer). The primer layer may have a thickness of, for example, 0.2 μm to 500 μm, or 5 μm to 200 μm.

According to a preferred embodiment of the present invention, the heat shield coating layer 320 includes an infrared absorbing layer 322 formed on the outer surface of the housing body 310 and an infrared reflecting layer 321 formed on the infrared absorbing layer 322 as described above. ) May have a stacked structure, as illustrated in FIGS. 2 to 4. That is, the infrared reflecting layer 321 is positioned at the outermost, and the infrared absorbing layer 322 is positioned between the infrared reflecting layer 321 and the housing body 310. When having such a laminated structure, it may be advantageous for heat shield performance. Specifically, most of the external heat, that is, the infrared rays introduced from the outside, is reflected by the infrared reflecting layer 321 and blocked. In addition, infrared rays that are not reflected from the infrared reflecting layer 321 and are transmitted are absorbed by the infrared absorbing layer 322, and the inflow into the housing 300 is blocked.

Hereinafter, embodiments of the infrared reflecting layer 321 and the infrared absorbing layer 322 will be described.

First, the infrared reflecting layer 321 includes an adhesive resin material and an infrared reflector having infrared reflecting ability. The infrared reflecting layer 321 may be formed by coating the infrared reflecting composition on the surface of the housing body 310 or the infrared absorbing layer 322 with the above resin material and the infrared reflector. The infrared reflective composition may further include a solvent (diluent) for coating properties (viscosity, etc.). The infrared reflective layer 321 may be formed by coating the infrared reflective composition as described above by spray coating, roll coating, and / or dipping.

The resin material is not particularly limited as long as it has adhesive properties, for example, alkyd-based, amino-based, epoxy-based, phenolic, urethane-based, silicone-based, nitrocellulose-based, rubber-based, vinyl- and acrylic-based resins, or the like. Copolymers, and the like, but are not limited thereto.

According to one embodiment, the resin material may include at least a heat-resistant resin. In the present invention, the heat-resistant resin has a higher heat resistance than a general resin, which may be selected from, for example, a polycarbonate-based resin and a hybrid-based resin in which two or more different resin monomers are copolymerized. The hybrid resin as the heat-resistant resin is, for example, epoxy-urethane hybrid, epoxy-urea hybrid, epoxy-acrylic hybrid, epoxy-silicon hybrid, epoxy-urethane-siloxane hybrid, epoxy-urethane-ceramic hybrid, urethane-acrylic Hybrid copolymers selected from hybrids, urethane-silicon hybrids, and / or silicone-acrylic hybrids, and the like can be used. Such a heat-resistant resin is preferred for the present invention because of its excellent heat resistance, durability, and chemical resistance.

According to a preferred embodiment, the resin material includes a first resin and a second resin, the first resin comprises a heat-resistant resin as described above, and the second resin may include a metal-organic copolymer. . Specifically, the resin material constituting the infrared reflecting layer 321 preferably includes at least a heat-resistant resin (first resin) and a metal-organic copolymer (second resin). In this case, the resin material may be composed of 40% to 80% by weight of the heat-resistant resin (first resin) and 20% to 60% by weight of the metal-organic copolymer (second resin) based on the total weight of the resin material.

In the present invention, the second resin is a metal-organic copolymer, which uses a metal-vinyl acetate-acrylate in which at least one metal selected from Ca (calcium) and Ba (barium) is bonded to the vinyl acetate-acrylate polymer. It is desirable to do. Such a metal-organic copolymer has good adhesive strength, and in particular, it is possible to increase the activity of the infrared reflector without inhibiting the reflectivity of the infrared reflector, so as to have a high reflectivity.

The metal-organic copolymer, specifically, a metal-vinyl acetate-acrylate copolymer in which one or more metal ions selected from Ca and Ba are reacted with a vinyl acetate-acrylate copolymer and a metal compound (a compound of Ca and Ba) As a result, the metal ions (Ca and Ba) may be bound to vinyl acetate, acrylate, or both. The metal ions (Ca and Ba) may be coordinated with oxygen (O) contained in vinyl acetate and / or acrylate. At this time, the metal compound (the compound of Ca and Ba), for example, Ca (NO ₃ ) ₂ and Ca compounds selected from CaCO ₃ and the like; And / or Ba (NO ₃ ) ₂ and BaCO ₃ , and the like.

The metal-vinyl acetate-acrylate copolymer, more specifically, the metal compound (a compound of Ca and Ba) in a copolymerizable solution containing a vinyl acetate monomer (or polyvinyl acetate), an acrylic monomer, a polymerization initiator and a solvent. After the addition, one obtained by solution polymerization can be used.

In this case, the acrylic monomer may be, for example, 2-ethylhexyl acrylate, ethyl acrylate, butyl acrylate, hydroxyethyl acrylate and / or acrylic acid, and the like, and the polymerization initiator may be benzoyl peroxide, la And uryl peroxide and / or azobisisobutyronitrile. And the solvent, for example, methyl ethyl ketone, isopropanol, toluene, ethyl acetate and / or butyl acetate, and the like. In addition, a commercially available product can be used for the metal-vinyl acetate-acrylate copolymer.

The infrared reflector is to prevent the conversion to thermal energy by reflecting infrared rays that have reached the surface of the infrared reflecting layer 321, which is not particularly limited as long as it has infrared reflecting ability. The infrared reflector is, for example, from a metal oxide containing one or more metal elements selected from titanium (Ti), magnesium (Mg), aluminum (Al), silicon (Si), scandium (Sc) and yttrium (Y), etc. Can be selected.

According to one embodiment, the infrared reflector is an oxide such as titanium (Ti) and / or silicon (Si), and includes at least one selected from, for example, titanium dioxide (TiO ₂ ) and silicon dioxide (SiO ₂ ). It is good to do. The titanium dioxide (TiO ₂ ) and silicon dioxide (SiO ₂ ) are preferred for infrared reflectivity by improving whiteness with high infrared blocking properties. The infrared reflector may be used as a powder, for example, fine particles having an average particle size of 0.01 μm to 20 μm, or 0.05 μm to 5 μm.

In addition, the infrared reflector may be used in 30 to 150 parts by weight based on 100 parts by weight of the resin material. At this time, when the content of the infrared reflector is less than 30 parts by weight, the infrared reflectivity may be insignificant, and when it exceeds 150 parts by weight, the content of the resin material may be relatively low and the adhesion may be deteriorated. Considering this, the infrared reflector is preferably used in 50 to 120 parts by weight based on 100 parts by weight of the resin material.

According to a preferred embodiment, the infrared reflective layer 321 includes at least a resin material and an infrared reflector, and in addition, it is preferable to include a dispersant. The dispersing agent is selected from those capable of dispersing the resin material and / or the infrared reflector to achieve uniform mixing and dispersion of the resin material and the infrared reflector. According to the embodiment of the present invention, at least the uniform dispersibility of the resin material and the infrared reflector is promoted by the dispersing agent to improve the infrared reflectivity, and at the same time, it has a uniform reflectivity over the entire area of the infrared reflecting layer 321. .

The dispersant may be selected from surfactants. According to a preferred embodiment of the present invention, the dispersant is preferably selected from amphoteric surfactants and cationic surfactants among surfactants. According to the embodiment of the present invention, when using a zwitterionic surfactant and a cationic surfactant as the dispersing agent, it is advantageous for dispersion than when using an anionic surfactant or a nonionic surfactant, which is particularly effective in reflecting infrared reflectivity. Improved and preferred for the present invention.

In this case, the zwitterionic surfactant may include at least one betaine system selected from lauryldimethylaminoacetic acid betaine and 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolium betaine. Further, it is preferable that the cationic surfactant includes at least one alkyltrimethylammonium chloride selected from methyltrimethylammonium chloride and ethyltrimethylammonium chloride. According to the embodiment of the present invention, when using a cationic surfactant and / or a cationic surfactant as the dispersing agent, when using the components as exemplified above, uniform dispersibility of the resin material and the infrared reflector and Of course, it is effective in improving the reflectivity, especially when using the metal-organic copolymer (ie, a metal-vinyl acetate-acrylate copolymer in which one or more metal ions selected from Ca and Ba are combined) as a resin material. It is very effective in improving dispersibility and reflectivity.

The dispersant may be used 0.2 to 12 parts by weight based on 100 parts by weight of the resin material. At this time, when the content of the dispersant is less than 0.2 parts by weight, the effect of improving the uniform dispersibility and reflectivity according to the use thereof may be negligible, and when it exceeds 12 parts by weight, the adhesive strength may be lowered. In view of this, the dispersant is preferably used in 0.5 to 10 parts by weight based on 100 parts by weight of the resin material.

In addition, according to an embodiment of the present invention, the infrared reflective layer 321 may further include a discoloration preventing agent. The discoloration inhibitor is not particularly limited as long as it can prevent discoloration such as yellowing. Specifically, the discoloration-preventing agent may be one that can prevent discoloration such as thermal discoloration or photodiscoloration even when the infrared reflective layer 321 is exposed to the external environment for a long time. By the discoloration preventing agent, discoloration can be prevented and the reflection ability and whiteness of the infrared reflecting layer 321 can be prevented from deteriorating. The discoloration preventing agent may be used, for example, 0.1 to 8 parts by weight, or 0.5 to 5 parts by weight based on 100 parts by weight of the resin material.

The discoloration inhibitor may use a triazole derivative. According to a preferred embodiment, the anti-discoloration agent may use a carbazole derivative. The discoloration preventing agent is a carbazole derivative, for example, 1-bromo-4- (N-carbazolyl-di-methyl) benzene (1-bromo-4- (N-carbazolyl-di-methyl) benzene) Etc., but in addition, it is better to use a mixture of cetrimonium methosulfate. At this time, the carbazole derivative effectively prevents yellowing and the like, and the setrimonium metosulfate is effective in preventing discoloration by improving the miscibility of the carbazole derivative and the resin material. That is, when the anti-discoloration agent includes a carbazole derivative (1-bromo-4- (N-carbazoryl-di-methyl) benzene) and cetrimonium methosulfate, triazoles such as benzotriazole It is more effective in preventing discoloration such as yellowing than using a derivative.

In addition, the discoloration preventing agent may be added to and mixed with the resin material after being mixed in a solvent. At this time, the solvent may be selected from dimethylformamide (DMF) and tetrahydrofuran (THF). According to a specific embodiment, the discoloration-preventing agent is 30 to 60 parts by weight of 1-bromo-4- (N-carbazoryl-di-methyl) benzene and 5 to 5 parts of setrimonium methosulfate based on 100 parts by weight of the solvent. A liquid containing 40 parts by weight is used, but 0.1 to 8 parts by weight or 0.5 to 5 parts by weight of the liquid discoloration inhibitor may be added and mixed with respect to 100 parts by weight of the resin material.

Additionally, the infrared reflecting composition for forming the infrared reflecting layer 321 includes a resin material, an infrared reflecting agent, a dispersing agent, and / or a discoloration preventing agent, as well as a solvent (diluent) for viscosity adjustment or dilution of the composition. And / or additives for separate functionality.

The solvent (diluent) may be selected from water and / or organic solvents. The organic solvent is a hydrocarbon-based compound, for example, methyl alcohol, ethyl alcohol, methyl ethyl ketone, toluene, xylene, ethyl benzene, isophorone, epoxy propane nonyl ether, polyglycidyl ether, butyl glycidyl ether, cre Silglycidyl ether, 2-ethylhexylglycidyl ether, triethylene glycol and / or benzyl alcohol, and the like. Such a solvent (diluent) can be determined by the type and content of the resin material according to the type and coating method. Although not particularly limited, the solvent (diluent) may be used in an amount of 5 to 150 parts by weight, or 20 to 120 parts by weight based on 100 parts by weight of the resin material.

The additive may use one or more selected from curing agents, antifoaming agents, leveling agents, heat stabilizers, flame retardants, antioxidants and color pigments. The additive may be used in the range of 0.001 to 10 parts by weight, or 0.01 to 5 parts by weight, respectively, depending on the type of the additive with respect to 100 parts by weight of the resin material. These additives can be selected from inorganic, organic and organic-free composites and the like. For example, the curing agent may be selected from amine-based, amide-based, amideamine-based, imidazole-based, isocyanate-based and / or derivatives thereof, depending on the type of resin material.

In addition, the infrared reflective layer 321, for example, may have a thickness of 0.05㎛ or more. The infrared reflecting layer 321 may have a thickness of, for example, 0.05 μm to 2 mm, 0.1 μm to 1 mm, 2 μm to 1 mm, 5 μm to 800 μm, or 10 μm to 500 μm, but is not limited thereto. no.

Meanwhile, the infrared absorbing layer 322 includes a resin material having adhesive properties and an infrared absorbing material for infrared absorbing ability. The infrared absorbing layer 322 may be formed by coating an infrared absorbing composition comprising the above resin material and an infrared absorbing body on the surface of the housing body 310 or the surface of the infrared reflecting layer 321. The infrared absorbing composition may further include a solvent (diluent) for coating properties (viscosity, etc.). The infrared absorbing layer 322 may be formed by coating the infrared absorbing composition as described above by spray coating, roll coating, and / or dipping.

The resin material constituting the infrared absorbing layer 322 is not particularly limited as long as it has adhesive properties, and the resin material exemplified in the infrared reflecting layer 321 may be used. According to one embodiment, the resin material constituting the infrared absorbing layer 322 may include a heat-resistant resin (first resin) and a metal-organic copolymer (second resin), and the heat-resistant resin (first resin) And the specific type and amount of the metal-organic copolymer (second resin) are as described for the infrared reflective layer 321. Since the resin material and the content constituting the infrared absorbing layer 322 may be configured in the same way as the resin material of the infrared reflecting layer 321, detailed description thereof will be omitted.

The infrared absorber is not particularly limited as long as it has infrared absorbing power. The infrared absorber may be selected from inorganic, organic and / or organic-free composites, and the like.

The infrared absorber is an inorganic material, for example, Sn, Ti, Si, Zn, Zr, Fe, Al, Cr, Co, Ce, In, Ni, Ag, Cu, Pt, Mn, Ta, W, V, Mo, etc. One or more metal elements selected from oxides, nitrides, carbides, oxynitrides, sulfides and / or salts can be used. The infrared absorber is preferably ITO (indium-tin oxide), Al ₂ O ₃ , ZrO ₂ , TiN, SnO ₂ , TiO ₂ , SiO ₂ , ZrO ₂ , ZnO, Fe ₂ O ₃ , Al ₂ O ₃ , FeO, Cr ₂ O ₃ , Co ₂ O ₃ , CeO ₂ , In ₂ O ₃ , NiO, MnO, CuO and / or Na ₂ O · xSiO ₂ (Na ₂ SiO ₃ , water glass, etc.), and the like, More preferably, it can be selected from ITO (indium-tin oxide), Al ₂ O ₃ (alumina), ZrO ₂ (zirconia) and / or Na ₂ O · xSiO ₂ (Na ₂ SiO ₃ , water glass, etc.). As the inorganic material, for example, fine particles having an average particle size of 0.01 μm to 20 μm or 0.05 μm to 5 μm may be used.

In addition, the infrared absorber is an organic substance, for example, thiol nickel complex compounds, triallylmethane, naphthoquinone, phthalocyanine, naphthalocyanine, anthraquinone, cyanine compound, N, N, N ', N'- Tetrakis (p-di-n-butylaminophenyl) -p-phenylenedinium perchlorate, phenylenedinium chlorate, phenylenediaminium hexafluoro antimonate, phenylenediaminium fluoroborate, phenylenedia Ammonium fluorate and / or phenylenedianium perchlorate, and the like.

The infrared absorber may be used in 30 to 150 parts by weight based on 100 parts by weight of the resin material. At this time, when the content of the infrared absorber is less than 30 parts by weight, the infrared absorbing ability may be insignificant, and when it exceeds 150 parts by weight, the content of the resin material may be relatively low and the adhesiveness may be deteriorated. Considering this, the infrared absorber is preferably used in 50 to 120 parts by weight based on 100 parts by weight of the resin material.

According to a preferred embodiment of the present invention, the infrared absorber includes the above-described infrared absorbing material, it is preferable to further include an infrared absorbing ability improving agent. Specifically, the infrared absorber preferably includes at least one infrared absorbing material selected from inorganic and / or organic materials as listed above, and an infrared absorbing agent improving agent for improving the infrared absorbing ability of the infrared absorbing material. At this time, the infrared absorbing agent may be used in an amount of 20 to 80 parts by weight based on 100 parts by weight of the infrared absorbing material. In addition, it is preferable that the infrared absorbing ability improving agent includes cobalt aluminate (Co (AlO ₂ ) ₂ ) according to an embodiment of the present invention. According to an embodiment of the present invention, the cobalt aluminate (Co (AlO ₂ ) ₂ ) is mixed with infrared absorbing materials such as ITO (indium-tin oxide), Al ₂ O ₃ (alumina), and ZrO ₂ (zirconia). At the time, the infrared absorbing ability of the infrared absorbing material is effectively improved to have excellent infrared blocking ability.

In addition, the infrared absorbing layer 322 may further include a dispersing agent and / or a discoloration preventing agent. Since the dispersant and the discoloration inhibitor may be the same as those described in the infrared reflective layer 321, detailed description thereof will be omitted.

According to one embodiment, the dispersing agent constituting the infrared absorbing layer 322 uses one or more selected from zwitterionic surfactants and cationic surfactants, wherein the zwitterionic surfactant is lauryldimethylaminoacetic acid betaine And at least one betaine system selected from 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolium betaine, wherein the cationic surfactant is at least one alkyl chloride selected from methyltrimethylammonium chloride and ethyltrimethylammonium chloride. It is preferred to include trimethylammonium. The dispersant is preferably used in an amount of 0.2 to 12 parts by weight, preferably 0.5 to 10 parts by weight based on 100 parts by weight of the resin material.

In addition, the discoloration preventing agent constituting the infrared absorbing layer 322 includes a carbazole derivative (1-bromo-4- (N-carbazoryl-di-methyl) benzene) and setrimonium methosulfate. desirable. The discoloration preventing agent may be used in an amount of 0.1 to 8 parts by weight, or 0.5 to 5 parts by weight based on 100 parts by weight of the resin material.

Additionally, the infrared absorbing composition for forming the infrared absorbing layer 322 includes the above resin material, infrared absorbing material (infrared absorbing material, infrared absorbing ability improving agent), dispersing agent, and / or discoloration preventing agent, in addition to the viscosity of the composition It may further include a solvent (diluent) for adjustment or dilution and / or an additive for separate functionality. Since the type or content of the solvent (diluent) and the additive may be configured in the same way as that used for the infrared reflective layer 321, a detailed description thereof will be omitted.

In addition, the infrared absorbing layer 322 may have a thickness of 0.05 μm or more, for example. The infrared absorbing layer 322 may have a thickness of, for example, 0.05 μm to 3 mm, 0.1 μm to 2 mm, 2 μm to 1 mm, 5 μm to 800 μm, or 10 μm to 500 μm, but is not limited thereto. no.

Meanwhile, according to another embodiment of the present invention, the infrared absorbing layer 322 may include a gel-like solid body. The gel-like solid body may be formed by gelling an infrared absorbing material as described above with a gelling agent.

In addition, the infrared absorbing layer 322 may include pores (325). Specifically, as shown in FIGS. 3 and 4, the infrared absorbing layer 322 may have a plurality of pores 325 formed therein. The pore 325 may be empty, or may be formed of an air bubble filled with air. The pores 325 do not accumulate and release heat introduced from the outside, thereby improving thermal insulation, and accordingly, improving thermal insulation performance.

The pore 325 may be formed by physical and / or chemical methods. The pore 325 is formed by, for example, a physical method of forming by injecting and stirring air into the infrared absorbing composition, or after adding a chemical blowing agent (gas such as pentane and CO ₂ ) to the infrared absorbing composition, It can be formed by a chemical method of foaming by heating. In addition, as shown in FIG. 4, the pore 325 may be formed by adding, for example, a pore forming body 326 such as hollow silica microspheres and hollow polymer capsules to the infrared absorbing composition. . The pore 325 may be irregularly formed in the infrared absorbing layer 322.

Meanwhile, the LED lighting device according to the present invention may further include an optical lens for distributing light emitted from the LED element 200 or a protective cover for protecting the LED element 200 depending on the case. The optical lens is installed on the top of the LED element 200, which may be made of, for example, a transparent glass material. In addition, the protective cover may be installed on the top of the LED housing 300, which is transparent or translucent, for example, may be composed of a plastic material mainly composed of polycarbonate (PC) -based resin or the like.

According to the present invention described above, the heat inflow to the outside is blocked by the heat shield coating layer 320. Accordingly, heat rise of the LED element 200 due to external heat is prevented, and thus performance degradation and shortening of life of the LED element 200 can be prevented. In addition, according to the present invention, the heat shield coating layer 320 includes an infrared reflecting layer 321 and / or an infrared absorbing layer 322, and at least blocks infrared rays to have excellent heat shielding performance.

Hereinafter, examples and comparative examples of the present invention will be illustrated. The following examples are provided by way of example only to help understanding of the present invention, and the technical scope of the present invention is not limited thereby. In addition, the following comparative example does not mean the prior art, which is a comparative example provided for comparison with the examples.

[Examples 1 to 5]

The water-washed and dried iron plate was prepared. Then, the infrared reflecting composition was roll-coated to a thickness of about 150 μm on the iron plate, and then dried (cured) to prepare a coated specimen having an infrared reflecting layer formed on one side of the iron plate. The infrared reflecting layer was coated by using an infrared reflecting composition that was sufficiently mixed and stirred by adding a solvent to the resin material to obtain a mixed and stirred resin solution, and then adding an infrared reflector, a dispersing agent and an additive (antifoaming agent, leveling agent). .

At this time, the resin material was different from the type of resin (hybrid copolymer) according to each embodiment, and the solvent was selected from 2-ethylhexylglycidyl ether, triethylene glycol, and aqueous solution of isopropyl alcohol, but the resin of each embodiment was Different types were used. As the infrared reflector, TiO ₂ powder having an average particle size of about 2.7 μm was used. The dispersing agent is a zwitterionic surfactant or a cationic surfactant, but the components (type) and content of the dispersing agent are different according to each embodiment. Further, a curing agent selected from an amine-based (epoxy-modified alicyclic amine having an amine value of 250) and isocyanate was further added according to the type of resin used in each example.

Table 1 below shows the main components (types) and contents of the infrared reflecting layer according to each example (1 to 5). The contents of each component shown in Table 1 below are based on 100 parts by weight of the resin material.

[Comparative Examples 1 to 3]

Compared to Example 1, the dispersant was not used, or an anionic surfactant or a nonionic surfactant was used as the dispersant, and the same procedure as in Example 1 was carried out, according to Comparative Examples 1 to 3 A coated specimen was prepared. Table 1 below shows the main components (kind) and content of the infrared reflecting layer according to each comparative example (1 to 3).

The heat shielding performance of the coated specimens according to each of the Examples (1 to 5) and Comparative Examples (1 to 3) was measured, and the results are shown in Table 1 below. At this time, the heat shielding performance was evaluated as follows as infrared blocking ability and heat shielding ability.

<Infrared blocking ability test>

For each coated specimen, an infrared transmittance of a wavelength range of 1,600 nm to 2,000 nm was measured using a spectrophotometer, and the infrared cutoff rate was evaluated by Equation 1 below.

[Equation 1]

Infrared blocking rate (%) = 100-IT _ave

In Equation 1 above, IT _ave is the average transmittance of infrared rays (Averge Transmissivity of Infrared ray), which is a value obtained by averaging the infrared transmittance between wavelengths of 1600 nm to 2,000 nm.

<Heat shielding ability test>

Infrared rays were irradiated on one side of each coated specimen, and the temperature difference (ΔT) between the side irradiated with the infrared ray and the opposite side thereof was evaluated according to Equation 2 below. At this time, the infrared irradiation intensity and time for each coated specimen were all the same.

[Equation 2]

ΔT (℃) = T1 (℃)-T2 (℃)

In Equation 2 above, T1 is the temperature of the surface irradiated with infrared light, and T2 is the temperature of the opposite surface.

              <Results of evaluation of composition and thermal insulation performance of infrared reflective layer> Remark Example Comparative example One 2 3 4 5 One 2 3 Infrared reflective layer
Furtherance Resin EU ⁽¹⁾ 100 - 60 60 100 100 100 100 UA ⁽²⁾ - 100 - - - - - - Ca-A ⁽³⁾ - - 40 - - - - - Ba-A ⁽⁴⁾ - - - 40 - - - - infrared ray
reflector TiO ₂ 65 65 65 65 65 65 65 65 Dispersant D1 ⁽⁵⁾ 4.5 - 4.5 4.5 0.2 - - - D2 ⁽⁶⁾ - 4.5 - - - - - - D3 ⁽⁷⁾ - - - - - - 4.5 2.5 D4 ⁽⁸⁾ - - - - - - - 4.5  additive AF ⁽⁹⁾ 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 LB ⁽¹⁰⁾ 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Difference
Performance Infrared blocking rate [%] 81.4 80.1 84.8 84.2 78.2 74.1 78.6 79.1 Heat shielding capacity (ΔT) [℃] 10.3 10.4 12.6 12.1 7.9 6.8 8.9 8.7 (1) EU: Epoxy-urethane hybrid copolymer
(2) UA: Urethane-acrylic hybrid copolymer
(3) Ca-A: Ca-organic copolymer in which Ca is coordinated to vinyl acetate-acrylate
(4) Ba-A: Ba-organic copolymer in which Ba is coordinated to vinyl acetate-acrylate
(5) D1: lauryldimethylaminoacetic acid betaine (cationic surfactant)
(6) D2: methyltrimethylammonium chloride (cationic surfactant)
(7) D3: sodium dodecyl sulfate (anionic surfactant)
(8) D4: Sorbitan monooleate (nonionic surfactant)
(9) AF: Product BYK-320 (foaming agent)
(10) LB: Product BYK-103 (leveling agent)

As shown in [Table 1], it was found that the heat shielding performance (infrared blocking ability and heat shielding ability) was higher when the dispersant was used compared to Comparative Example 1 without dispersant.

Particularly, in contrast to Examples 1 to 4 and Comparative Examples 2 to 3, in the type of dispersant, when an anionic surfactant (D1) or a cationic surfactant (D2) was used (Examples 1 to 4) It is found that when the anionic surfactant (D3) or the nonionic surfactant (D4) is used (Comparative Examples 2 to 3), it has an excellent heat shielding performance of about 80% or more of an infrared blocking rate and a heat shielding capacity (ΔT) of about 10 ° C or higher. Could.

Further, in contrast to Examples 1 and 3 to 4, in the type of the resin material, the metal-organic copolymer (Ca-A, Ba in which Ca or Ba is coordinated to vinyl acetate-acrylate under all the same conditions) It was found that the case of adding and mixing -A) further (Examples 3 to 4) had higher heat shielding performance than the case of Example 1).

Additionally, as compared with Example 1 and Example 5, it was found that in all the same conditions, when the content of the dispersant was too low (Example 5: 0.2 parts by weight), the heat shielding performance was evaluated to be somewhat low.

[Examples 6 to 8]

In the same manner as in Example 1, an infrared reflecting layer was formed by further adding a discoloration inhibitor to the infrared reflecting composition. At this time, the components and contents of the discoloration-preventing agent were changed according to each example (6 to 8), as shown in Table 2 below. The following [Table 2] shows the components and contents of the discoloration inhibitor according to each Example (6 to 8), and the rest of the components are the same as in Example 1. In [Table 2], the content of the discoloration inhibitor is based on 100 parts by weight of the resin material.

In addition, whether or not discoloration was evaluated for the coated specimens according to each of the Examples (6 to 8), and the results are shown in Table 2 below. The discoloration was evaluated by irradiating ultraviolet rays (UV) to each coated specimen with high intensity, and visually observing the discoloration until the point (date) when discoloration (yellowing, etc.) was confirmed. In addition, the coating specimen according to Example 1 was evaluated for discoloration, and the results are shown in Table 2 below.

            <Results of evaluation of composition and discoloration of infrared reflective layer> Remark Example 6 Example 7 Example 8 Example 1 Discoloration inhibitor
(Ingredient and content) Benzotriazole 4.2 - - - BCB - 4.2 4.2 - CMS - - 1.8 - Discoloration
(After UV irradiation) Day 16
discoloration Day 25
discoloration No discoloration over 30 days Day 5 discoloration * BCB: 1-bromo-4- (N-carbazolyl-di-methyl) benzene (1-bromo-4- (N-carbazolyl-di-methyl) benzene)
* CMS: Cetrimonium methosulfate

As shown in [Table 2], when a discoloration inhibitor was added, it was found that discoloration such as yellowing was prevented. In particular, in contrast to Example 6 and Example 7, in the case of using 1-bromo-4- (N-carbazolyl-di-methyl) benzene (BCM) as a carbazole derivative (Example 7), try It was found that when the sol derivative (benzotriazole) was used (Example 6), discoloration prevention performance was superior. In addition, as in Example 8, it was found that when setrimonium methosulfate (CMS) was further added, it was very effective in preventing discoloration.

[Examples 9 to 11]

An infrared absorbing composition was roll-coated to a thickness of about 150 μm on the water- and dried-treated iron plate, and then dried (cured) to prepare a coated specimen in which an infrared absorbing layer was formed on one side of the iron plate. The infrared absorbing layer is mixed with a solvent by adding a solvent to a resin material to obtain a stirred resin solution, and then an infrared absorber (infrared absorbing material and infrared absorbing ability improving agent), a dispersing agent, a curing agent and an additive (antifoaming agent, leveling agent) are thoroughly mixed. , Coating using a stirred infrared absorbent composition.

At this time, the resin material was different from the type of resin according to each example, and the solvent was selected from 2-ethylhexyl glycidyl ether and isopropyl alcohol aqueous solution, but used differently according to the resin of each example. For the infrared absorber, an infrared absorber selected from ITO (indium-tin oxide) and ZrO ₂ (zirconia) powder having an average particle size of about 1.4 μm and an infrared absorbent improving agent for cobalt aluminate (Co (AlO ₂ ) ₂ ) are used. Different components were used according to the examples. In addition, the dispersing agent was a zwitterionic surfactant, and the curing agent was an amine-based (an epoxy-modified alicyclic amine having an amine value of 250).

The following Table 3 shows the main components (kind) and content of the infrared absorbing layer according to each Example (9 to 11). The content of each component shown in Table 3 below is based on 100 parts by weight of the resin material.

[Comparative Examples 4 to 5]

Compared to Example 9, except that anionic surfactant or nonionic surfactant was used as a dispersing agent, coating specimens according to Comparative Examples (4 to 5) were prepared in the same manner as in Example 9. Table 3 below shows the main components (type) and content of the infrared absorbing layer according to each of the comparative examples (4 to 5).

The heat shielding performance of the coated specimens according to each of the Examples (9 to 11) and Comparative Examples (4 to 5) was measured, and the results are shown in Table 1 below. At this time, the heat shielding performance was infrared blocking ability (infrared blocking rate,%) and heat shielding ability (ΔT, ℃), which were evaluated in the same manner as in Example 1.

              <Results of evaluation of composition and heat shielding performance of infrared absorbing layer> Remark Example 9 Example 10 Example 11 Comparative Example 4 Comparative Example 5 Infrared absorbing layer
Furtherance Resin E-U 100 60 60 100 100 Ca-A - 40 40 - - infrared ray
Absorber ITO 30 30 30 30 30 ZrO ₂ 15 15 15 15 15 Co-Al - - 20 - - Dispersant D1 4.5 4.5 4.5 - - D3 - - - 4.5 - D4 - - - - 4.5  additive AF 0.3 0.3 0.3 0.3 0.3 LB 0.5 0.5 0.5 0.5 0.5 Difference
Performance Infrared blocking rate [%] 64.4 66.1 68.7 61.2 60.3 Heat shielding capacity (ΔT) [℃] 5.4 5.7 5.9 5.0 4.8 * EU: Epoxy-urethane hybrid copolymer
* Ca-A: Ca-organic copolymer in which Ca is coordinated to vinyl acetate-acrylate
* Co-Al: Cobalt aluminate (Co (AlO ₂ ) ₂ )
* D1: lauryldimethylaminoacetic acid betaine (cationic surfactant)
* D3: sodium dodecyl sulfate (anionic surfactant)
* D4: Sorbitan monooleate (nonionic surfactant)
* AF: Product BYK-320 (foaming agent)
* LB: Product BYK-103 (leveling agent)

As shown in [Table 3], in contrast to Example 9 and Comparative Examples 4 to 5, in the case of the infrared absorbing layer, the case where a zwitterionic surfactant (D1) was used as a dispersant (Example 9) is anionic It was found that when the surfactant (D3) or the nonionic surfactant (D4) was used (Comparative Examples 4 to 5), it had better heat shielding performance (infrared blocking ability and heat shielding ability).

Further, with reference to Examples 9 and 10 to 11, a metal-organic copolymer (Ca-A, Ba-A) having a Ca or Ba coordination bond is further added to vinyl acetate-acrylate as a resin material and mixed. , It was found that the used cases (Examples 10 to 11) had higher heat shielding performance (infrared cut-off ability and heat shielding ability) than those not used (Example 9).

In addition, in contrast to Example 10 and Example 11, when cobalt aluminate (Co (AlO ₂ ) ₂ ) was further added as an infrared absorbent improving agent under all the same conditions (Example 11) was not added (implementation) It was found that the heat shielding performance (infrared blocking ability and heat shielding ability) was higher than in Example 10).

[Example 12]

 On the iron plate subjected to water washing and drying, the infrared absorbing composition was first roll coated to a thickness of about 150 μm, and then dried (cured) to form an infrared absorbing layer on one side of the iron plate. Thereafter, an infrared reflecting composition was roll coated on the infrared absorbing layer to a thickness of about 150 μm, and then dried (cured) to form an infrared reflecting layer. Through this process, a coated specimen according to this embodiment having a layer structure of an iron plate (Fe) / infrared absorbing layer / infrared reflecting layer was prepared. In this case, the infrared absorbing layer used the infrared absorbing composition having the same composition as in Example 9, and the infrared reflecting layer used the infrared reflecting composition having the same composition as in Example 1.

[Example 13]

 It was carried out in the same manner as in Example 12, but the material of the iron plate was changed. Specifically, instead of the iron plate, an Al-Zn plated iron plate having an Al-Zn alloy layer plated on the surface of the iron substrate was used. The Al-Zn plated iron plate has an Al content of about 57% by weight of the Al-Zn-based alloy layer, which was purchased and used commercially.

For the coated specimens of the multilayer structure according to each of the Examples (12 to 13), the heat shielding capacity (ΔT) was evaluated in the same manner as in Example 1, and the results are shown in Table 4 below. In addition, Table 4 below shows the heat shielding capacity (ΔT) of Example 1 and Example 9 together.

               <Results of evaluation of thermal insulation performance according to floor structure> Remark Example 12 Example 13 Example 1 Example 9 Layer structure iron plate/
Infrared absorption layer /
Infrared reflective layer Al-Zn plated iron plate /
Infrared absorption layer /
Infrared reflective layer iron plate/
Infrared reflective layer iron plate/
Infrared absorbing layer Heat shielding ability
(ΔT) [℃] 14.2 14.4 10.3 5.4

As shown in [Table 4], it was found that the heat shielding performance was better than the case where the multilayer structure including both the infrared absorbing layer and the infrared reflecting layer (Examples 12 and 13) did not (Examples 1 and 9). Could. In addition, it was found that the case where an Al-Zn plated iron plate was used (Example 13) rather than the case where an iron plate was used as the substrate (Example 12) was found to be somewhat advantageous for heat shielding performance. This is considered to be because Al-Zn plating has high heat reflectivity.

Through the above experimental examples (examples and comparative examples), it can be seen that in forming the heat shielding paint layer 320, both the infrared reflecting layer 321 and the infrared absorbing layer 322 have high heat shielding performance. there was. In particular, in constructing the infrared reflecting layer 321 or the infrared absorbing layer 322, a dispersing agent is added to each coating composition, and as the dispersing agent, a zwitterionic surfactant (D1) or a cationic surfactant (D2) is used. In addition, it was found that, as the resin material, a metal-organic copolymer in which Ca or Ba is coordinated to vinyl acetate-acrylate is further added to the heat-resistant resin to have excellent heat shielding performance.

Additionally, when a heat-resistant resin and a metal-organic copolymer are used as the resin material, the discoloration-preventing agent is a carbazole derivative (1-bromo-4- (N-carbazolyl-di-methyl) benzene rather than a triazole derivative) ) Is effective, and the infrared absorber was found to be effective in heat shielding performance (infrared blocking ability) when cobalt aluminate (Co (AlO ₂ ) ₂ ) was further added to the infrared absorbing material. In addition, it was found that Al-Zn plated iron plate is advantageous as the material of the housing body 310.

100: Printed circuit board 200: LED element
300: LED housing 310: housing body
320: heat-resistant paint layer 321: infrared reflective layer
322: infrared absorption layer 325: pore

Claims (8)

A housing body 310 accommodating the printed circuit board 100 and the LED element 200 mounted on the printed circuit board 100; And
In the LED housing 300 is formed on at least one surface of the housing body 310, and includes a heat shield coating layer 320 to block external heat from entering,
The heat shield coating layer 320,
An infrared absorbing layer 322 formed on an outer surface of the housing body 310 and absorbing infrared rays;
An infrared reflecting layer 321 formed on the infrared absorbing layer 322 and reflecting infrared light; And
It includes a primer layer formed between the housing body 310 and the infrared absorbing layer 322,
The infrared reflecting layer 321 includes a resin material, an infrared reflector, a dispersing agent, and a discoloration preventing agent, but 50 to 120 parts by weight of an infrared reflector, 0.5 to 10 parts by weight of a dispersing agent, and 0.1 to 8 parts by weight of a discoloration preventing agent based on 100 parts by weight of the resin material Includes,
The resin material,
Heat-resistant resin; And
A metal-organic copolymer in which at least one selected from Ca and Ba is bonded to the vinyl acetate-acrylate copolymer,
The dispersant is at least one selected from zwitterionic surfactants and cationic surfactants,
The zwitterionic surfactant comprises at least one betaine system selected from lauryldimethylaminoacetic acid betaine and 2-alkyl-N-carboxymethyl-N-hydroxyethylimidazolium betaine,
The cationic surfactant comprises at least one alkyltrimethylammonium chloride selected from methyltrimethylammonium chloride and ethyltrimethylammonium chloride,
The discoloration inhibitor,
1-bromo-4- (N-carbazoryl-di-methyl) benzene; And
LED housing 300, characterized in that it comprises a set limonium methosulfate.
According to claim 1,
The infrared absorption layer 322 includes a resin material and an infrared absorber,
The infrared absorber includes an infrared absorber and an infrared absorber improving agent,
The infrared absorbing material includes at least one selected from ITO (indium-tin oxide), Al ₂ O ₃ and ZrO ₂ ,
The infrared absorbent improving agent includes cobalt aluminate (Co (AlO ₂ ) ₂ ),
The heat-resistant resin constituting the resin material of the infrared reflecting layer 321 is at least one hybrid-based resin selected from epoxy-urethane hybrid, epoxy-urea hybrid, epoxy-acrylic hybrid, epoxy-silicon hybrid and epoxy-urethane-siloxane hybrid ,
The metal-organic copolymer constituting the resin material of the infrared reflective layer 321 is Ca-organic produced by reacting at least one Ca compound selected from Ca (NO ₃ ) ₂ and CaCO _{3 with a} vinyl acetate-acrylate copolymer. Copolymer,
The infrared absorption layer 322, the LED housing 300, characterized in that a pore 325 is formed.
LED lighting device comprising the LED housing 300 according to claim 1 or claim 2.
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