KR102096853B1 - Manufacturing method for multi-layer printed circuit board and multi-layer printed circuit board manufactured by the same - Google Patents

Abstract

According to one embodiment of the present invention, a manufacturing method for a multi-layer printed circuit board comprises: a disc cutting step of cutting a disc to form an inner layer board; a circuit forming step of forming a pattern on the surface of the inner layer board; and a lamination step of oxidizing the surface of the inner layer board on which a circuit is formed, laminating on a plurality of inner layer boards, a prepreg and a copper foil, which act as an adhesive and an insulating layer, respectively, and applying heat and pressure thereto, to form a single board. In particular, the lamination step comprises: an oxide step of oxidizing the surface of the pattern; a first lamination step of laminating the prepreg on the inner layer board to form a first laminated structure; a foreign material removal step of removing foreign materials from a copper foil and a SUS plate to be laminated on the first laminated structure; a second lamination step of laminating a plurality of first laminated structures, and laminating the copper foil and the SUS plate, from which foreign materials have been removed, onto the plurality of first laminated structures, to form a second laminated structure; and a compression step of compressing the second laminated structure to form a single multi-layer board.

Description

Manufacturing method of a multilayer printed circuit board and a multilayer printed circuit board manufactured thereby {Manufacturing method for multi-layer printed circuit board and multi-layer printed circuit board manufactured by the same}

The present invention relates to a method for manufacturing a multilayer printed circuit board and a multilayer printed circuit board manufactured thereby.

Recently, with the miniaturization and integration of electronic components, various multilayer printed circuit boards capable of mounting them on a surface have been developed.

Such a multilayer printed circuit board is manufactured through a complicated process, and among the manufacturing processes of the multilayer printed circuit board, a lamination process is essential when manufacturing the substrate.

However, conventionally, there has been a problem in that a dent is generated on a substrate during a lamination process.

Specifically, in the prior art, when laminating parts, foreign matters are formed on the surface of the product formed by dust or foreign substances flowing in between the sustain plate and the copper foil, or when the sustain plate and the copper foil are stacked without removing foreign substances remaining in the suspension plate and the copper foil. There was a problem that the dent due to.

In addition, conventionally, as a plurality of substrates stacked on each other are stacked in the same shape, there is a problem in that pressure is not properly transmitted to a portion where a pattern is not formed during the pressing process, resulting in wrinkles or bubbles in the copper foil.

Accordingly, the multilayer printed circuit board produced has a problem in that short circuit (open), short circuit (short) or defective defect occurs.

The present invention has been devised to solve the above problems, and the object of the present invention is to completely block the inflow of foreign matter between the suspension plate and the copper foil, and the pattern region buffers the non-pattern region during compression, so that the pressure is uniform throughout the entire article. It is to provide a method for manufacturing a multi-layer printed circuit board that can be transferred and a multi-layer printed circuit board manufactured thereby.

The problems of the present invention are not limited to the problems mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

A method of manufacturing a multilayer printed circuit board according to an embodiment of the present invention for solving the above problems includes: a disc cutting step of cutting an original plate to form an inner layer substrate; A circuit forming step of forming a pattern on the surface of the inner layer substrate; And laminating a surface of the inner layer substrate on which the circuit is formed, laminating a semi-prepared resin and copper foil serving as an adhesive and an insulating layer on a plurality of inner layer substrates, and then applying heat and pressure to form a single substrate. Including a step, the laminating step, an oxide step of oxidizing the surface of the pattern; A first lamination step of laminating the semi-cured resin on the inner layer substrate to form a first lamination structure; A foreign substance removal step of removing foreign substances from the copper foil and the suspension plate to be laminated on the first laminated structure; A second stacking step of stacking a plurality of first stacked structures, and stacking the copper foil and the sustain plate from which foreign matter has been removed, on the plurality of first stacked structures to form a second stacked structure; And pressing the second laminated structure to form a single multilayer substrate.

The circuit forming step may include: a front step of surface-treating the inner layer substrate; A laminating step of forming a coating layer on the inner layer substrate; An exposure step of forming a pattern on the coating layer; A developing step of leaving a portion of the photosensitive pattern on the inner layer substrate; An etching step of leaving a pattern on the inner layer substrate; And an inspection step of inspecting the pattern formed on the inner layer substrate.

The first laminating step includes: a semi-cured resin processing step of cutting the semi-cured resin into a predetermined shape and forming rivet holes in the semi-cured resin and the inner layer substrate; A first laminating step of laminating the semi-cured resin on the inner layer substrate and heating the semi-cured resin to bond the semi-cured resin to the inner layer substrate; And a second laminating step of fixing the inner layer substrate and the semi-cured resin laminated on the inner layer substrate through rivets.

The foreign material removing step includes: a charging step of applying power to the stack to charge the microparticles attached to the surface of the stack; And a collecting step of collecting the charged microparticles by arranging a plurality of dust collecting units having polarities opposite to the polarities of the charged microparticles when power is applied to the upper and lower sides of the stack.

The foreign material removing step may include: a scattering step of spraying wind on the surface of the laminate to scatter the charged microparticles and move them toward the dust collecting part; And a guide step of arranging a charged part having the same polarity as the charged fine particles between the plurality of dust collecting parts, and pressing the charged fine particles moved toward the dust collecting part to the dust collecting part side.

The plurality of first stacked structures may be arranged to cross each other on a plane.

The plurality of first stacked structures disposed to intersect each other on a plane may be arranged such that pattern regions and non-pattern regions correspond.

The laminating step may include a first processing step of forming a target hole in the multi-layer substrate; And it may further include a second processing step of forming the multi-layer substrate to a predetermined standard by drilling and trimming.

A multilayer printed circuit board according to an embodiment of the present invention for solving the above problems is manufactured by the above-described method for manufacturing a multilayer printed circuit board.

According to an embodiment of the present invention, the inflow of foreign matter between the suspension plate and the copper foil is completely blocked, thereby preventing product defects and improving product quality to ensure product reliability.

In addition, as a plurality of stacked structures are stacked by crossing each other so that the pattern region and the non-pattern region overlap, the pattern region buffers the non-pattern region during compression, thereby uniformly transmitting pressure to all of the article, thereby causing a short circuit in the circuit. It is possible to prevent defects such as short circuits and defects.

1 to 5 is a flow chart showing a method of manufacturing a multilayer printed circuit board according to an embodiment of the present invention.
6 is a configuration diagram schematically showing a multilayer printed circuit board according to an embodiment of the present invention.

Hereinafter, various embodiments will be described in more detail with reference to the accompanying drawings. The embodiments described herein can be variously modified. Certain embodiments are depicted in the drawings and may be described in detail in the detailed description. However, the specific embodiments disclosed in the accompanying drawings are only for easy understanding of various embodiments. Therefore, the technical spirit is not limited by the specific embodiments disclosed in the accompanying drawings, and should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.

Terms including ordinal numbers such as first and second may be used to describe various components, but these components are not limited by the above-described terms. The above-mentioned terms are used only for the purpose of distinguishing one component from other components.

In this specification, terms such as “comprises” or “have” are intended to indicate that there are features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and one or more other features. It should be understood that the existence or addition possibilities of fields or numbers, steps, operations, components, parts or combinations thereof are not excluded in advance. When an element is said to be "connected" or "connected" to another component, it is understood that other components may be directly connected to or connected to the other component, but other components may exist in the middle. It should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that no other component exists in the middle.

On the other hand, "module" or "unit" for a component used in the present specification performs at least one function or operation. And, the "module" or "unit" may perform a function or operation by hardware, software, or a combination of hardware and software. Also, a plurality of “modules” or a plurality of “parts” may be integrated into at least one module, excluding “modules” or “parts” that must be performed on specific hardware or performed on at least one processor. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In addition, in describing the present invention, when it is determined that detailed descriptions of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof are abbreviated or omitted.

1 to 5 is a flow chart showing a method of manufacturing a multilayer printed circuit board according to an embodiment of the present invention, Figure 6 is a schematic view showing a multi-layer printed circuit board according to an embodiment of the present invention.

1 and 6, a method of manufacturing a multilayer printed circuit board according to an embodiment of the present invention includes a disc cutting step (S110), a circuit forming step (S120), and a stacking step (S130).

In the disc cutting step (S110), the disc is cut to form an inner layer substrate.

Specifically, in the original plate cutting step (S100A), an inner layer substrate is formed by cutting a standardized plate-shaped raw material to have a predetermined size and thickness. For example, the anti-corrosive copper foil layer may be provided on the upper and lower surfaces of the inner layer substrate.

The circuit forming step (S120) forms a pattern on the surface of the inner layer substrate.

Hereinafter, the circuit forming step (S120) will be described in more detail.

3 and 6, the circuit forming step (S120), the front (scrubbing) step (S121), laminating (Laminating) step (S122), exposure (exposure) step (S123), developing (developing) step ( S124), an etching step (S125), and an inspection step (S126).

The front step (S121) may surface-treat the inner layer substrate cut to a predetermined size.

Specifically, in the front step (S121), the top / bottom surface of the cut inner layer substrate may be polished to remove the anti-corrosive treatment film of the copper foil layer provided on the top / bottom surface of the inner layer substrate, and to form unevenness on the top / bottom surface of the inner layer substrate. have. For example, in the frontal step (S121), the surface of the inner layer substrate provided with the copper foil layer is polished with a brush or the like to remove the foreign substances or oil remaining on the surface of the inner layer substrate, and fine on the surface of the inner layer substrate. An uneven structure can be formed. Through this, when the photosensitive coating layer is formed on the surface of the inner layer substrate, adhesion of the photosensitive coating layer may be increased.

In the laminating step (S122), a photosensitive coating layer may be formed on the surface of the surface-treated inner layer substrate.

Specifically, in the laminating step (S122), after applying the photosensitive fluid to the surface of the innerlayer substrate, the photosensitive fluid is adhered to the surface of the innerlayer substrate using a roller, and the photosensitive fluid adhered to the surface of the innerlayer substrate is dried to dry the innerlayer substrate. A photosensitive coating layer may be formed on the surface. For example, a material forming a photosensitive coating layer on the surface of the inner layer substrate may be applied as a liquid photoresist. However, the present invention is not limited thereto, and may be applied as a photosensitive dry film or an ED resist (Electrophoretic Deposition).

In the exposure step (S123), a pattern may be formed by irradiating ultraviolet (UV) light on the coating layer formed on the surface of the inner layer substrate.

Specifically, in the exposure step (S123), after placing a film for exposure on the upper / lower surface of the inner layer substrate having a photosensitive coating layer on the surface, irradiated with ultraviolet (UV) light to photocur the portion exposed to ultraviolet (UV) light. A pattern can be formed in the corresponding part. For example, the inner layer substrate may be seated on the upper surface of the base made of a transparent material. In addition, a first pattern forming film may be disposed between the base and the inner layer substrate, and a second pattern forming film may be disposed on the upper surface of the inner layer substrate. At this time, the first pattern forming film and the second pattern forming film may be composed of a transparent photosensitive film with a printed circuit pattern. In addition, the first pattern forming film and the second pattern forming film are provided with alignment holes that are coupled to a coupling member such as a pin for fixing the inner layer substrate to the base and the first pattern forming film and the second pattern forming film placed at a predetermined position. Can be. Through this, the first pattern forming film and the second pattern forming film are accurately arranged at a set position, thereby significantly reducing the incidence of defects in the pattern.

In the developing step (S124), only the portion of the photosensitive pattern may be left on the inner layer substrate on which the pattern is formed.

Specifically, in the developing step (S124), by dissolving and removing the non-cured portion (non-exposed portion) that is not exposed to ultraviolet light (UV) with a developer solution, only the pattern portion exposed to the inner layer substrate remains, thereby forming a basic circuit on the inner layer substrate. Can form. For example, the developing step (S124) may be performed by exposing the inner layer substrate having a pattern on the surface through an exposure step (S123) to an alkaline developing solution to melt and remove the unexposed photosensitive coating layer. At this time, the developer may be applied with sodium carbonate (Na2CO3).

In the etching step S125, only the pattern may be left on the inner layer substrate by etching and peeling off the inner layer substrate where only the portion of the photosensitive pattern remains.

Specifically, in the etching step (S125), the etching process and the patterned portion to remove the copper foil of the portion where the pattern is not formed by exposing the inner layer substrate having only the patterned portion exposed through the developing step (S124) to the acidic etching solution. Is exposed to an alkaline chemical, thereby leaving only the pattern made of copper foil on the inner layer substrate through a peeling process to remove the photosensitive coating layer remaining on the pattern. For example, the etching solution may be applied with iron chloride or copper chloride.

In the inspection step S126, the possibility of a short circuit of the pattern formed on the inner layer substrate may be inspected.

Specifically, the inspection step (S126) may check whether the pattern formed on the inner layer substrate is properly formed without being shorted (open) or short-circuited using an automatic optical inspection (AOI).

1, 2 and 6, the laminating step (S130) is a semi-cured resin (prepreg) and copper foil that serves to oxidize the surface of the inner layer substrate on which the circuit is formed, and serves as an adhesive and an insulating layer on the plurality of inner layer substrates. After stacking, heat and pressure are applied to form a single substrate.

The semi-cured resin is made of glass fiber (Glass Fabric, Glass Weave) by impregnating resins such as epoxy and polyimide, and cured to B-stage.It acts as a bonding and insulating layer in the lamination process. can do. For reference, the term B-stage may mean an intermediate stage of a thermosetting resin reaction, that is, it is not completely melted, but is softened by receiving heat.

Copper foil may serve as a conductor for transmitting the current of the circuit in the multilayer printed circuit board. In addition, the surface of the copper foil is made of a shiny side (matte side), and in the case of the matte surface, roughness is formed, so that adhesion can be achieved with a semi-cured resin during lamination molding.

Hereinafter, the lamination step (S130) will be described in more detail.

The laminating step (S130) includes an oxide step (S131), a first laminating step (S132), a foreign substance removing step (S133), a second laminating step (S134), and a pressing step (S135).

The oxide step (S131) oxidizes the surface of the pattern formed on the inner layer substrate.

Specifically, the oxide step (S131) may form a fine uneven structured oxide film on the surface of the copper foil of the inner layer substrate forming the pattern. That is, the oxide step (S131) can be oxidized by applying an oxide material to the surface of the copper foil forming a pattern. At this time, the copper foil is oxidized until it becomes brown to form an oxide film on the surface. Through this, the oxide step (S131) may increase the surface area of the copper foil to strengthen the mutual adhesion between the inner layer substrate and the semi-cured resin when the semi-cured resin is bonded to the upper / lower surface of the inner layer substrate.

In the first laminating step (S132), a semi-cured resin is laminated on the upper / lower surface of the inner layer substrate provided with the copper foil pattern to form a first laminated structure.

4 and 6, the first laminating step (S132) may include a semi-cured resin processing step (S132a), a first laminating step (S132b), and a second laminating step (S132c).

In the semi-cured resin processing step S132a, the semi-cured resin may be cut into a predetermined shape, and rivet holes may be formed in the semi-cured resin and the inner layer substrate.

In the first laminating step (S132b), the semi-cured resin is laminated on the inner layer substrate and the semi-cured resin is heated to bond the semi-cured resin to the inner layer substrate.

In the second laminating step (S132c), the inner layer substrate and the semi-cured resin laminated on the inner layer substrate may be fixed through rivets.

In the first laminating step (S132), a first laminated structure may be formed by bonding the inner layer substrate and the semi-cured resin laminated to the inner layer substrate through bonding and riveting.

5 and 6, the foreign material removal step (S133) removes foreign materials from the copper foil and the suspension plate to be stacked on the first laminated structure.

The foreign material removal step (S133) may include a charging step (S133a) and a collecting step (S133b).

In the charging step S133a, power may be applied to the laminate (copper foil and suspension plate) to charge the microparticles attached to the surface of the laminate.

In the collecting step (S133b), when power is applied, a plurality of dust collecting parts having polarities opposite to the polarities of the charged microparticles are disposed on the upper and lower sides of the stack (copper foil and suspension plate) to collect the charged microparticles. You can.

Therefore, when the fine particles attached to the surface of the laminate (copper foil and suspension plate) are charged and separated from the laminate, a plurality of dust collecting members having a polarity opposite to the polarity of the charged microparticles can collect the fine particles. . Through this, it is possible to remove the fine particles remaining in the copper foil.

In addition, the foreign material removal step (S133) may further include a scattering step (S133c) and a guide step (S133d).

In the scattering step (S133c), the charged microparticles are scattered by spraying wind on the surfaces of the laminates (copper foil and suspension plate) to move to the dust collecting side.

In the guide step S133d, a charged part having the same polarity as the charged fine particles is disposed between the plurality of dust collecting parts, and the charged fine particles moved toward the dust collecting part may be pressed toward the dust collecting part.

That is, by spraying wind on the surface of the copper foil, the fine particles remaining near the surface of the copper foil are moved away from the copper foil to the dust collecting member side, and the fine particles moved to the plurality of dust collecting members through a charging member having the same polarity as the fine particles. By guiding the side of the dust collecting member, it is possible to completely block the inflow of foreign material between the suspension plate and the copper foil. Therefore, it is possible to prevent product defects to improve product quality, thereby securing product reliability.

2 and 6, the second stacking step (S134) stacks a plurality of first stacked structures, and deposits a copper foil and a SUS plate from which foreign matter has been removed on a plurality of first stacked structures. 2 Form a laminated structure.

Specifically, in the second laminating step (S134), a plurality of first lamination structures formed by bonding an inner layer substrate and a semi-cured resin through bonding and riveting are provided and laminated. At this time, a semi-cured resin is disposed between the plurality of first stacked structures. In addition, in the second stacking step (S134), copper foils are respectively disposed on the upper / lower surfaces of the stacked first stacked structures to form one stack. Here, the components forming the stack may be changed according to the thickness and characteristics of the product. Then, in the second stacking step (S134), a second stacked structure is formed by placing a suspension plate on the outer surface of the copper foil disposed on the top and bottom surfaces of the first stacked structure, respectively.

When a plurality of stacks are stacked, the suspension plate is disposed on the upper / lower surface of each stack to distinguish the plurality of stacks, and it is possible to prevent a specific shape of one stack from being transferred to the other stack by pressure during compression.

The second stacked structure may be disposed between the carrier plate and the top plate provided in the press device performing the pressing step (S135). In addition, a pressure transmission member may be provided between the suspension plate and the top plate provided on the second stacked structure, and between the suspension plate and the carrier plate provided on the bottom of the second stacked structure. For example, the carrier plate can be placed at the bottom of the stack to prevent direct heat transfer to the stack when pressed. In addition, the top plate is disposed on the upper side of the stack to prevent direct heat transfer to the stack during compression. In addition, the pressure transmission member can uniformly deliver pressure to the product surface during compression, and control the heat transmitted to the stack through quantity control to reduce the temperature deviation between the outer and central parts of the product. For reference, the suspension plate and the pressure transmission member may be changed according to raw materials, product thickness, and product characteristics. In addition, the pressure transmission member may be provided in the form of a pad having a cushion feeling.

Meanwhile, the plurality of first stacked structures stacked in the second stacking step S134 may be arranged to cross each other on a plane. In addition, the plurality of first stacked structures arranged to intersect each other on a plane may be arranged such that pattern regions and non-pattern regions correspond.

That is, as the plurality of first stacked structures are stacked by crossing each other so that the pattern region and the non-pattern region overlap, the pattern region buffers the non-pattern region during compression, so that pressure can be uniformly transmitted to the entire article. Therefore, it is possible to prevent occurrence of defects such as short circuits, short circuits, and short circuits. For example, the plurality of first stacked structures may be arranged in a zigzag form so as to buffer the step between the pattern region and the non-pattern region.

In the pressing step (S135), a second multilayer structure is compressed to form one multi-layer substrate.

Specifically, in the pressing step (S135), the stacked structures arranged in the press device are pressurized to a suitable temperature and pressure in a vacuum state, and then cooled to a predetermined temperature to form a single multi-layer substrate. For example, the press device may perform both a hot press and a cold press method.

On the other hand, when the pressing step (S135) is completed, the multi-layer substrate and various fixtures (carrier plate, pressure transmitting member, suspension plate and top plate, etc.) are separated and separated in the reverse order of the second laminating step (S134).

In addition, the lamination step (S130) may further include a first processing step (S136) and a second processing step (S137).

In the first processing step (S136), a target hole may be formed in the multilayer substrate formed through the pressing step (S135). For example, in the first processing step S136, the rivet inserted in the first stacked structure can be transmitted and recognized through X-Ray to process the target hole.

In the second processing step (S137), the multilayer substrate may be formed into a predetermined standard by drilling and trimming.

Thus, according to the embodiment of the present invention, by completely blocking the inflow of foreign matter between the suspension plate and the copper foil, it is possible to prevent product defects, thereby improving the quality of the product to ensure product reliability.

In addition, as a plurality of stacked structures are stacked by intersecting each other so that the pattern region and the non-pattern region overlap, the pattern region buffers the non-pattern region during compression, so that pressure can be uniformly transmitted to the entire article. Therefore, it is possible to prevent occurrence of defects such as short circuits, short circuits, and short circuits.

In the above, preferred embodiments of the present invention have been illustrated and described, but the present invention is not limited to the specific embodiments described above, and it is usually in the technical field to which the present invention belongs without departing from the gist of the present invention claimed in the claims. It is of course possible to perform various modifications by a person having knowledge of, and these modifications should not be individually understood from the technical idea or prospect of the present invention.

100. Multilayer Printed Circuit Board

Claims (9)

Disc cutting step of cutting the original plate to form an inner layer substrate;
A circuit forming step of forming a pattern on the surface of the inner layer substrate; And
A lamination step of oxidizing the surface of the inner layer substrate on which the circuit is formed, laminating a semi-cured resin (prepreg) and a copper foil serving as an adhesive and an insulating layer on a plurality of inner layer substrates, and applying heat and pressure to form a single substrate Including,
The laminating step,
An oxide step of oxidizing the surface of the pattern;
The first layered layer is formed by laminating the semi-cured resin on the inner layer substrate, bonding and bonding the semi-cured resin to the inner layer substrate, and then riveting and fixing the inner layer substrate and the semi-cured resin to form a first laminated structure. step;
A foreign substance removal step of removing foreign substances from the copper foil and the suspension plate to be laminated on the first laminated structure;
A second stacking step of stacking a plurality of first stacked structures, and stacking the copper foil and the sustain plate from which foreign matter has been removed, on the plurality of first stacked structures to form a second stacked structure; And
The second stacked structure is disposed between the top plate and the carrier plate, and between the top plate and the suspension plate provided on the second stacked structure, and between the carrier plate and the suspension plate provided on the bottom of the second stacked structure. After each pressure transmission member is disposed, pressing the second stacked structure through the top plate and the carrier plate to form a single multi-layer substrate, and a pressing step,
The foreign material removal step,
A charging step of applying power to the laminate to charge microparticles attached to the surface of the laminate;
A collecting step of collecting the charged microparticles by arranging a plurality of dust collecting units having a polarity opposite to the polarity of the charged microparticles when power is applied to the upper and lower sides of the stack;
A scattering step of spraying wind on the surface of the laminate to scatter the charged microparticles to move toward the plurality of dust collecting parts; And
A multi-layer printed circuit board including a guide step of arranging a charged portion having the same polarity as the charged microparticles between the plurality of dust collecting portions, and guiding the scattered charged microparticles by a repulsive force to guide them toward the plurality of dust collecting portions. Method of manufacture. According to claim 1,
The circuit forming step,
A front step of surface-treating the inner layer substrate;
A laminating step of forming a coating layer on the inner layer substrate;
An exposure step of forming a pattern on the coating layer;
A developing step of leaving a portion of the photosensitive pattern on the inner layer substrate;
An etching step of leaving a pattern on the inner layer substrate; And
And inspecting the pattern formed on the inner layer substrate. According to claim 1,
The first stacking step,
A semi-cured resin processing step of cutting the semi-cured resin into a predetermined shape and forming rivet holes in the semi-cured resin and the inner layer substrate;
A first laminating step of laminating the semi-cured resin on the inner layer substrate and heating the semi-cured resin to bond the semi-cured resin to the inner layer substrate; And
And a second laminating step of fixing the inner layer substrate and the semi-cured resin laminated on the inner layer substrate through rivets. delete delete According to claim 1,
The plurality of first laminated structure is a method of manufacturing a multilayer printed circuit board that is disposed to cross each other on a plane. The method of claim 6,
A method of manufacturing a multilayer printed circuit board, wherein the plurality of first stacked structures arranged to intersect each other on a plane are arranged such that pattern regions and non-pattern regions correspond. According to claim 1,
The laminating step,
A first processing step of forming a target hole in the multi-layer substrate; And
Method of manufacturing a multi-layer printed circuit board further comprising a second processing step of forming the drilled and trimmed multi-layer substrate to a predetermined standard. A multilayer printed circuit board manufactured by the method for manufacturing a multilayer printed circuit board according to any one of claims 1 to 3 and 6 to 8.

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